Chip Card Holder Automatic Packaging Machine

Abstract

The present invention provides an automatic packaging machine for wafer clips, which relates to the field of wafer clip production equipment. The machine comprises a frame, an operating table provided within the frame, a packaging bag lifting and loading device, a packaging bag transverse conveying device, a packaging bag opening device, a vacuuming and hot pressing device, a labeling and pressing device, a workstation clamping and transferring module, and a blanking module, all of which are mounted on the operating table. The packaging bag transverse conveying device is used to transfer the packaging bag pushed by the packaging bag lifting and loading device to the opening operation position of the packaging bag opening device. The vacuuming and hot pressing device is used to vacuum and seal the wafer clip that has been bagged at the opening operation position. The labeling and pressing device is used to label the sealed wafer clip. The workstation clamping and transferring module is used to switch the workstation of the wafer clip between the packaging bag opening device, the vacuuming and hot pressing device, and the labeling and pressing device. The blanking module is used to move the labeled wafer clip out of the labeling and pressing device. The packaged finished product has good consistency and reduces contamination.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer clamp production equipment, and in particular to an automatic wafer clamp packaging machine. Background Art

[0002] Industrial production is placing increasing demands on wafer clip packaging. Currently, manual packaging of wafer clips is time-consuming and inefficient. Furthermore, the manual packaging process can easily trap dirt, such as hair, in the packaging bag, affecting packaging quality. Summary of the Invention

[0003] The present invention provides an automatic wafer clamp packaging machine, which is used to solve the defects of low efficiency and easy introduction of dirt in manual wafer clamp packaging in the prior art.

[0004] The present invention provides a wafer clamp automatic packaging machine, comprising a frame, a packaging bag lifting and loading device, a packaging bag lateral conveying device, a packaging bag opening device, a vacuum hot pressing device, a labeling and pressing device, a station clamping and transferring module and a blanking module, wherein an operating table is provided in the frame, the packaging bag lifting and loading device, the packaging bag lateral conveying device, the packaging bag opening device, the vacuum hot pressing device, the labeling and pressing device, the station clamping and transferring module and the blanking module are all installed on the operating table, wherein the packaging bag lateral conveying device is used to The packaging bag pushed by the packaging bag lifting and loading device is transferred to the opening operation position of the packaging bag opening device, the vacuuming and hot pressing device is used to vacuum the chip clamp that has completed bagging at the opening operation position and seal the bag opening, the labeling and pressing device is used to label the chip clamp after sealing, the work station clamping and loading module is used to switch the work station of the chip clamp between the packaging bag opening device, the vacuuming and hot pressing device and the labeling and pressing device, and the unloading module is used to move the labeled chip clamp out of the labeling and pressing device.

[0005] Compared with the prior art, the present invention has the following beneficial effects:

[0006] The wafer clamp automatic packaging machine provided by the present invention adopts a parallel conveying mode. The operating stations do not affect each other and can work synchronously, thereby improving packaging efficiency. The wafer clamps are packaged with the help of automated equipment, the packaged products have good consistency, and the problem of dirt easily generated during manual packaging can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0008] Figure 1 This is a schematic structural diagram of the wafer clamp automatic packaging machine provided by the present invention;

[0009] Figure 2 This is a partial structural diagram of the wafer clamp automatic packaging machine provided by the present invention;

[0010] Figure 3 It is a structural schematic diagram of the packaging bag lifting and loading device provided by the present invention;

[0011] Figure 4 It is a structural schematic diagram of the packaging bag transverse transport device provided by the present invention;

[0012] Figure 5 It is a structural schematic diagram of the packaging bag opening device provided by the present invention;

[0013] Figure 6 This is a schematic diagram of the structure of the vacuum hot pressing device provided by the present invention

[0014] Figure 7 It is a structural schematic diagram of the workstation clamping and transferring module provided by the present invention;

[0015] Figure 8 It is a structural schematic diagram of the labeling and pressing device provided by the present invention;

[0016] Figure 9 It is a structural schematic diagram of the blanking module provided by the present invention;

[0017] Figure 10 It is a blanking schematic diagram of the blanking module provided by the present invention.

[0018] Reference numerals:

[0019] 100, rack; 101, operating table; 102, casters; 103, feet; 104, hood; 105, air filter; 106, warning light; 107, touch screen assembly;

[0020] 110, ejector support plate; 1101, mounting through hole; 111, bag lifting plate; 112, bag in place detection element; 113, bag side limit plate; 114, ejector linear bearing; 115, ejector guide rod;

[0021] 120. Carrying support frame; 121. Slide seat; 122. Suction cup mounting base; 123. Suction cup; 124. Carrying rodless cylinder; 125. Carrying lifting cylinder; 126. Suction cup extension plate; 127. Suction cup extension rod;

[0022] 130. Open support frame; 131. Lower suction cup; 132. Upper suction cup; 133. Support plate; 1341. Servo motor; 1342. Screw slide; 1351. Lifting connecting plate; 1352. Nozzle mounting plate; 1361. Open linear bearing; 1362. Open transmission rod; 137. Lower clamping mechanism; 138. Upper clamping mechanism; 139. Upper suction cup offset cylinder;

[0023] 140. Heat-sealing bracket; 141. Packaging table; 142. Suture bridge; 143. Heat-sealing knife; 144. Turning connecting shaft; 1441. Turning motor; 1442. Turning timing belt; 1443. Turning timing pulley; 145. Vacuum nozzle; 146. Side support claws; 1461. Support claw press seat; 147. Pressing cylinder; 1471. Hot-pressing linear bearing; 1472. Hot-pressing linear guide rod; 148. Lifting cylinder; 149. Angle claws; 1491. Double-stroke cylinder; 1492. Pre-folding slide; 1493. Gripping cylinder; 1494. Angle claw seat;

[0024] 150. Transfer support frame; 151. Transfer base; 1511. Transfer slide rail; 1512. Transfer rodless cylinder; 152. Transfer gripper; 153. Transfer lift cylinder; 1541. Transfer rotary drive mounting plate; 1542. Transfer rotary cylinder; 156. Transfer tank chain; 1571. Transfer linear bearing; 1572. Transfer guide rod; 158. Series plate;

[0025] 160. Labeling support platform; 161. Fixed clamping claw; 1611. Fixed clamping cylinder; 1621. Label stripping motor; 1622. Label stripping active shaft; 1623. Label stripping driven shaft; 1624. Label stripping plate; 163. Labeling pressing bracket; 1641. Labeling cylinder; 1642. Labeling linear bearing; 1643. Labeling guide rod; 1644. Giving cylinder fixing plate; 1645. Giving cylinder; 165. Angle-folding auxiliary clamping claw; 1651. Angle-folding auxiliary cylinder; 1661. Rotating support platform; 1662. Reversing rotary cylinder; 1671. Label pressing cylinder fixing seat; 1672. Label pressing cylinder; 1673. Pressing plate; 1674. Label pressing linear bearing; 1675. Label pressing guide rod;

[0026] 170. Unloading support frame; 171. First mounting seat; 172. Second mounting seat; 173. Gripper; 1741. X-axis slide rail; 1742. X-axis motor; 1743. X-axis power synchronous belt; 1744. X-axis power synchronous pulley; 1745. X-axis power transmission shaft; 1751. X-axis synchronous belt; 1752. X-axis synchronous pulley; 1761. Y-axis slide rail; 1762. Y-axis motor; 1763. Y-axis synchronous pulley; 1764. Y-axis synchronous belt; 1771. X-axis tank chain; 1772. Y-axis tank chain; 1781. Unloading lift cylinder; 1782. Unloading guide rod; 179. Rotary drive mechanism;

[0027] 200. Packaging bag; 210. Wafer holder; 230. Label paper; 240. Material tray. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0030] The following combination Figures 1-10 The wafer holder automatic packaging machine of the present invention is described.

[0031] The present invention provides a wafer clamp automatic packaging machine, such as Figure 1 and Figure 2 As shown, the wafer clamp automatic packaging machine includes a frame 100, a packaging bag lifting and loading device, a packaging bag horizontal conveying device, a packaging bag opening device, a vacuum hot pressing device, a labeling and pressing device, a station clamping and transferring module, and a blanking module. Figure 2As shown, an operating table 101 is provided in the frame 100, on which are mounted a bag lifting and loading device, a bag transverse transport device, a bag opening device, a vacuuming and hot-pressing device, a labeling and pressing device, a station clamping and transferring module, and a material unloading module. The bag transverse transport device is used to transfer the bag pushed by the bag lifting and loading device to the opening operation position of the bag opening device; the vacuuming and hot-pressing device is used to vacuum and seal the bag opening of the wafer clamp that has been bagged at the opening operation position; the labeling and pressing device is used to label the sealed wafer clamp; the station clamping and transferring module is used to switch the position of the wafer clamp between the three operating stations of the bag opening device, the vacuuming and hot-pressing device, and the labeling and pressing device; and the material unloading module is used to move the labeled wafer clamp out of the labeling and pressing device to wait for unloading.

[0032] The operating table 101 is fixed to the frame 100 with screws, and the machine cover 104, labeling and pressing device, material receiving box assembly, unloading module, vacuum hot pressing device, workstation clamping and transferring module, packaging bag opening device, packaging bag horizontal conveying device, and packaging bag lifting and loading device are fixed to the operating table 101 with screws.

[0033] like Figure 1 and Figure 2 As shown, casters 102 and / or feet 103 are provided at the bottom of the rack 100 .

[0034] The height of the feet 103 is adjustable. When the rack 100 is moved to the target location, the feet 103 extend to support and secure the rack 100 on the ground. When the rack 100 needs to be moved, the feet 103 retract, and the rack 100 is moved with the aid of casters 102. Preferably, casters 102 with feet are provided at the bottom of the rack 100.

[0035] The wafer clamp automatic packaging machine provided in the embodiment of the present invention can conveniently move the position of the frame 100 when adjusting the production line by providing casters 102, and can be positioned after being moved into place by providing feet 103.

[0036] A hood 104 is provided outside the frame 100, and an air filter 105 is installed on the top of the hood 104. The hood 104 and the air filter 105 prevent external dust from entering, optimize the packaging environment inside the hood 104, and prevent the wafer clamp automatic packaging machine from causing harm to people, thereby playing a protective role.

[0037] A warning light 106 is also installed on the top of the hood 104. Figure 1 As shown, a warning light 106 is provided at a corner of the top of the rack 100. When a component in the rack 100 fails or there is a problem with loading or unloading, the warning light 106 will sound an alarm, facilitating timely maintenance by workers.

[0038] The housing 104 also houses an electrical control cabinet and a touch screen assembly 107. The electrical control cabinet serves as the control center for the entire wafer clamp automatic packaging machine and can be located at the bottom or front of the housing 100. The touch screen assembly 107 is located at the front of the housing 100 for easy operation. It allows operators to set control parameters for the wafer clamp automatic packaging machine and view its operating status.

[0039] During use, the start button in the touch screen assembly 107 is manually pressed, and the packaging bag lifting and loading device pushes the packaging bag to the loading position. The packaging bag transverse transport device transports the packaging bag at the loading position to the packaging bag opening device. The packaging bag opening device opens the bag opening of the packaging bag, and the external chip clamp loader loads the chip clamp into the opened packaging bag. After the chip clamp is loaded into the packaging bag, the station clamping and transferring module clamps the chip clamp 210 to the vacuum hot pressing device, performs vacuum sealing operation, and completes the sealing of the packaging bag. After sealing, the chip clamp 210 is clamped to the labeling and pressing device with the help of the same station clamping and transferring module or another station clamping and transferring module, and a label is affixed to the side of the packaging bag. Then, the unloading module clamps the chip clamp 210 to the material tray to wait for unloading.

[0040] The wafer clamp automatic packaging machine provided in the embodiment of the present invention adopts a parallel conveying mode. The operating stations do not affect each other and can work synchronously, thereby improving packaging efficiency. The wafer clamps are packaged with the help of automated equipment, the packaged products have good consistency, and the problem of dirt easily generated during manual packaging can be reduced.

[0041] like Figure 3 As shown, the bag lifting and loading device includes a lifting support plate 110, a bag lifting plate 111, and a bag in-place detection element 112. The lifting support plate 110 is fixed to the operating table 101, and the bag lifting plate 111 is installed on the lifting support plate 110 in a liftable manner. The bag in-place detection element 112 is used to generate a trigger signal when the bag 200 placed on the bag lifting plate 111 is lifted to the loading position. The bag in-place detection element 112 is in communication with the bag transverse transport device.

[0042] The lifting material support plate 110 is provided with a plurality of bag side limiting plates 113, which are arranged in a square shape around the circumference of the bag lifting plate 111. Figure 3As shown, three packaging bag side limiting plates 113 are provided along the length direction of the packaging bag lifting plate 111, and two packaging bag side limiting plates 113 are provided along the width direction of the packaging bag lifting plate 111. The packaging bag lifting plate 111 is provided with notches corresponding to the packaging bag side limiting plates 113, so that the packaging bag lifting plate 111 can move up and down along the packaging bag side limiting plates 113. In this way, the packaging bag lifting plate 111 can be guided to move up and down by means of the packaging bag side limiting plates 113, and at the same time, the packaging bag placed on the packaging bag lifting plate 111 can be limited by multiple packaging bag side limiting plates 113. The packaging bag in place detection element 112 is provided on the top of one of the packaging bag side limiting plates 113. Of course, the limitation of the packaging bag can also be achieved by means of other structures such as a trough body, and the present invention does not make specific limitations on this.

[0043] Optionally, the packaging bag lifting plate 111 can be lifted and installed on the lifting support plate 110 through a screw assembly. Specifically, the screw assembly includes a stepper screw motor, a screw and a screw nut. The stepper screw motor is fixed to the lifting support plate 110 and is connected to the screw transmission. The screw is arranged parallel to the column, and the screw nut is fixedly connected to the bottom of the packaging bag lifting plate 111. It should be noted that the screw is located on the outside of the packaging bag lifting plate 111 or corresponds to the avoidance opening of the packaging bag lifting plate 111 to avoid hindering the lifting and lowering of the packaging bag lifting plate 111. Driven by the stepper screw motor, the screw nut drives the packaging bag lifting plate 111 to move in the vertical direction. Optionally, as Figure 3 As shown, a mounting hole 1101 is provided in the middle of the material support plate 110. A driving cylinder is mounted on the side of the material support plate 110 facing away from the bag lifting plate 111. The driving end of the driving cylinder passes through the mounting hole 1101 and is fixedly connected to the bag lifting plate 111. Driven by the driving cylinder, the bag lifting plate 111 moves toward or away from the material support plate 110 to move the bag to the bag removal position. Of course, the bag lifting plate 111 can also be raised and lowered relative to the material support plate 110 using an electric push rod or other linear motion mechanism, but this is not described in detail in this invention.

[0044] In order to make the linear motion more stable, the packaging bag lifting and loading device also includes a lifting guide rod 115 and a lifting linear bearing 114. The lifting linear bearing 114 is fixed to the lifting support plate 110, and the lifting guide rod 115 is inserted into the lifting linear bearing 114. The top end of the lifting guide rod 115 is fixedly connected to the packaging bag lifting plate 111. Figure 3 As shown, a material lifting guide rod 115 is respectively provided at the four corners of the packaging bag lifting plate 111.

[0045] The wafer clamp automatic packaging machine provided in the embodiment of the present invention lifts the packaging bag to the loading position by raising and lowering the packaging bag lifting plate, continuously feeding the subsequent workstations, has a simple structure and a high degree of automation.

[0046] like Figure 4 As shown, the packaging bag transverse transport device includes a transport support frame 120, a slide 121, a suction cup mounting seat 122 and a suction cup 123. The transport support frame 120 is fixed to the frame 100. The slide 121 can be slidably mounted on the transport support frame 120 in a horizontal direction through the packaging bag transverse driving mechanism. The suction cup mounting seat 122 can be lifted and lowered on the slide 121 through the lifting driving mechanism. The suction cup 123 is fixed to the bottom of the suction cup mounting seat 122.

[0047] like Figure 4 As shown, the transport support frame 120 is a gantry frame and is fixed to the operating table 101 via screws and other fixings. Optionally, the packaging bag transverse drive mechanism includes a transport rodless cylinder 124, and the slide 121 is fixedly connected to the movable member of the transport rodless cylinder 124. Driven by the transport rodless cylinder 124, the slide 121 moves horizontally.

[0048] Optionally, the lifting drive mechanism includes a transport lifting cylinder 125, which is fixed to the slide 121, and the driving end of the transport lifting cylinder 125 is fixedly connected to the suction cup mounting seat 122. The size of the suction cup mounting seat 122 is comparable to that of the packaging bag 200, and suction cups 123 are respectively provided at the four corners of the suction cup mounting seat 122, so that the four suction cups 123 can absorb the four corners of the packaging bag 200, so that the packaging bag 200 can be moved from the packaging bag lifting and loading device to the packaging bag opening device. Figure 4 As shown, the driving end of the transport and lift cylinder 125 is directly fixedly connected to the suction cup extension plate 126. The suction cup extension plate 126 and the suction cup mounting base 122 are fixedly connected via a suction cup extension rod 127. The vertical position of the suction cup mounting base 122 is adjusted by means of the suction cup extension rod 127. Of course, the transport and lift cylinder 125 can also be directly fixedly connected to the suction cup mounting base 122, as long as it can drive the suction cup mounting base 122 to achieve the target lifting at both the bag removal position and the bag opening operation position.

[0049] During use, when the bag arrival detection element 112 is triggered, the transport rodless cylinder 124 drives the suction cup 123 to the bag removal position and then stops driving. The transport lifting cylinder 125 drives the suction cup mounting seat 122 downward so that the suction cup 123 can absorb the packaging bag 200 located at the top. After the suction cup 123 firmly absorbs the packaging bag 200, the transport lifting cylinder 125 drives the suction cup mounting seat 122 upward. Then, driven by the transport rodless cylinder 124, the packaging bag 200 is moved horizontally to the packaging bag opening device. When the packaging bag 200 reaches the opening operation position, the transport rodless cylinder 124 stops driving, and the transport lifting cylinder 125 drives the suction cup mounting seat 122 to move the packaging bag 200 downward, placing the packaging bag 200 in the opening operation position of the packaging bag opening device so that the packaging bag 200 can be opened.

[0050] like Figure 5 As shown, the packaging bag opening device includes an opening support frame 130, a lower suction cup 131, and an upper suction cup 132. The opening support frame 130 has a support plate 133 for placing the packaging bag 200. The lower suction cup 131 is disposed below the support plate 133. The upper suction cup 132 is mounted on the opening support frame 130 via a lifting mechanism and is located above the support plate 133. The lower suction cup 131 is used to absorb the bottom of the packaging bag 200, and the upper suction cup 132 is used to absorb the top of the packaging bag 200.

[0051] The opening support frame 130 is fixed to the operating table 101 by screws. The lifting mechanism is a linear motion structure such as a screw module, a synchronous belt linear module, etc. Figure 5 As shown, the lifting mechanism includes a servo motor 1341 and a screw slide 1342. The servo motor 1341 is fixed to the top of the open support frame 130, and the drive end of the servo motor 1341 is drivingly connected to the screw in the screw slide 1342. The screw slide 1342 extends along the height of the open support frame 130, and the upper suction cup 132 is fixedly connected to the slide of the screw slide 1342. Thus, driven by the servo motor 1341, the upper suction cup 132 can move up and down, toward or away from the packaging bag 200.

[0052] Specifically, a lifting connecting plate 1351 extending laterally along the opening support frame 130 is provided on the slide of the screw slide 1342. The upper suction cup 132 includes a plurality of suction nozzles, which are linearly spaced and arranged on the suction nozzle mounting plate 1352. The lifting connecting plate 1351 is fixedly connected to the suction nozzle mounting plate 1352. Figure 5 As shown, the lower suction cup 131 has a similar structure to the upper suction cup 132 and also includes a plurality of suction nozzles, which are arranged linearly and spaced apart.

[0053] In order to make the upper suction cup 132 more stable in the vertical direction, the packaging bag opening device further includes an opening linear bearing 1361 and an opening transmission rod 1362. The opening linear bearing 1361 is fixed to the opening support frame 130, and the opening transmission rod 1362 is inserted into the opening linear bearing 1361. Figure 5 As shown, one end of the open transmission rod 1362 is fixedly connected to the lifting connecting plate 1351, and the other end passes through the open linear bearing 1361 and is fixedly connected to the nozzle mounting plate 1352. Specifically, two open transmission rods 1362 are provided, and the two open transmission rods 1362 are arranged at opposite ends of the lifting connecting plate 1351.

[0054] Based on the above embodiment, the packaging bag opening device further includes a lower clamping mechanism 137 and an upper clamping mechanism 138. The lower clamping mechanism 137 is used to clamp the bottom of the packaging bag 200, and the upper clamping mechanism 138 is used to clamp the top of the packaging bag 200. The upper clamping mechanism 138 and the upper suction cup 132 are mounted on the opening support frame 130 via the same lifting mechanism.

[0055] Specifically, the lower clamping mechanism 137 includes a lower clamping clip and a lower clamping drive unit. The lower clamping drive unit is fixedly mounted on the support plate 133, and the drive end of the lower clamping drive unit is in transmission connection with the lower clamping clip. When the bottom of the packaging bag 200 needs to be clamped, the lower clamping drive unit drives the lower clamping clip downward to press the bottom of the packaging bag 200 against the support plate 133. Two lower clamping mechanisms 137 are provided, respectively clamping the packaging bag 200 from both sides in the width direction. Alternatively, only one lower clamping mechanism 137 can be provided, comprising two lower clamping clips and a lower clamping drive unit. The lower clamping clips are driven synchronously by the same lower clamping drive unit, thereby reducing the number of drives and lowering energy consumption. Similarly, two upper clamping mechanisms 138 are provided, each of which includes two upper clamping claws that can move closer or farther away from each other to achieve clamping and release. Alternatively, only one upper clamping mechanism 138 is provided, which includes two upper clamping clamps and an upper clamping drive unit. The two upper clamping clamps are synchronously driven by the same upper clamping drive unit to press the packaging bag 200 onto the suction nozzle mounting plate 1352.

[0056] To avoid interference between the upper clamping mechanism 138 and the upper suction cup 132, Figure 5As shown, the packaging bag opening device also includes an upper suction cup offset cylinder 139. Specifically, the lower clamping mechanism 137 is mounted on the clamping mechanism mounting plate, and the upper suction cup offset cylinder 139 is fixed to the upper surface of the nozzle mounting plate 1352. The driving end of the upper suction cup offset cylinder 139 is connected to the clamping mechanism mounting plate, thereby driving the lower clamping mechanism 137 forward or backward with the help of the upper suction cup offset cylinder 139. Specifically, when the upper suction cup 132 moves downward to absorb the top of the packaging bag 200, the upper suction cup offset cylinder 139 drives the lower clamping mechanism 137 backward. When the upper suction cup 132 moves upward to open the bag opening of the packaging bag 200, the upper suction cup offset cylinder 139 drives the lower clamping mechanism 137 forward to clamp the top of the packaging bag 200.

[0057] When the packaging bag 200 is placed on the pallet 133 by the transverse bag handling device, the open end of the packaging bag 200 is positioned relative to the lower suction cup 131, which secures the bottom of the packaging bag 200 with suction. Then, under the action of the lifting mechanism, the upper suction cup 132 moves downward to secure the top of the packaging bag 200. Once the upper suction cup 132 secures the packaging bag 200, the lifting mechanism drives the upper suction cup 132 upward to open the opening of the packaging bag 200. To prevent overlapping of the opening of the packaging bag 200 when the wafer holder 210 is inserted into the packaging bag 200, after the opening of the packaging bag 200 is opened, the upper clamping mechanism 138 clamps the top of the packaging bag 200, while the lower clamping mechanism 137 clamps the bottom of the packaging bag 200. Thus, the two upper and two lower clamping clips prop the opening of the packaging bag 200 into a square shape, facilitating the insertion of the wafer holder 210 into the packaging bag 200. After the chip clamp 210 is placed in the packaging bag 200, the upper clamping mechanism 138 and the lower clamping mechanism 137 are released, the upper suction cup 132 and the lower suction cup 131 stop adsorption, and the packaging bag 200 containing the chip clamp 210 is moved to the hot pressing station with the help of the station clamping and transferring module.

[0058] like Figure 6 As shown, the vacuum hot pressing device includes a heat sealing support 140, a packaging platform 141, a stitching bridge 142, a heat sealing knife 143, a flip connecting shaft 144, a vacuum suction nozzle 145, and side support claws 146. The packaging platform 141 is fixed to the heat sealing support 140 and is used to support the wafer clamp 210 to be hot pressed. The stitching bridge 142 is mounted on the packaging platform 141 via a lifting mechanism, and the heat sealing knife 143 is mounted on the heat sealing support 140 via a pressing drive mechanism. The flip connecting shaft 144 is rotatably mounted on the heat sealing support 140 via a flip drive mechanism. The vacuum suction nozzle 145 and side support claws 146 are both retractably mounted on the flip connecting shaft 144. The two side support claws 146 are located on opposite sides of the vacuum suction nozzle 145 and can slide along the flip connecting shaft 144.

[0059] The flip drive mechanism includes a flip motor 1441, a flip timing belt 1442, and a flip timing pulley 1443. The flip motor 1441 is fixed to the heat sealing bracket 140. The drive shaft of the flip motor 1441 is in driving connection with the driving pulley of the flip timing pulley 1443. The flip timing belt 1442 is sleeved around the flip timing pulley 1443. The flip connecting shaft 144 is fixedly connected to the driven pulley of the flip timing pulley 1443. When the flip motor 1441 drives the driven pulley of the flip timing pulley 1443 to rotate, the flip connecting shaft 144 rotates, thereby adjusting the position of the vacuum nozzle 145 and the side support claws 146. Specifically, when placing the wafer clamp 210 into the hot pressing position, the flip motor 1441 keeps the vacuum nozzle 145 and the side support claws 146 in a vertical position to prevent interference with the placement of the wafer clamp 210. When the wafer clamp 210 is placed in place, the flip motor 1441 drives the vacuum nozzle 145 and the side support claws 146 to flip to a horizontal state, facing the opening of the packaging bag 200.

[0060] The pressing drive mechanism includes a pressing cylinder 147, which is fixed to the top of the heat sealing bracket 140. The driving end of the pressing cylinder 147 is in transmission connection with the heat sealing knife 143. Under the action of the pressing cylinder 147, the heat sealing knife 143 moves closer to or away from the wafer clamp 210 to be hot pressed. The heat sealing knife 143 includes a pressing plate and connecting plates arranged at opposite ends of the pressing plate. The connecting plates are located on the same side of the pressing plate, so that the heat sealing knife 143 is in the shape of an open square frame. Figure 6 As shown, the driving end of the pressing cylinder 147 is connected to the middle of the pressing plate to provide a balanced force for the lifting and lowering of the heat sealing knife 143.

[0061] In order to make the lifting and lowering movement of the heat sealing knife 143 more stable, the vacuum hot pressing device also includes a hot pressing linear bearing 1471 and a hot pressing linear guide rod 1472. Among them, the hot pressing linear bearing 1471 is fixed to the top of the heat sealing bracket 140, and the hot pressing linear guide rod 1472 passes through the hot pressing linear bearing 1471 and is fixedly connected to the connecting plate of the heat sealing knife 143. Under the drive of the pressing cylinder 147, the hot pressing linear guide rod 1472 moves up and down linearly in the hot pressing linear bearing 1471. Figure 6 As shown, there are four hot pressing linear guide rods 1472 , and two hot pressing linear guide rods 1472 are respectively provided on the opposite sides of the pressing cylinder 147 .

[0062] Specifically, the vacuum hot pressing device also includes a claw pressing seat 1461 fixed to the heat sealing knife 143. The claw pressing seat 1461 is used to push the side claws 146 to move to the sides along the flip connection shaft 144. Specifically, the claw pressing seat 1461 has two guiding slopes. As the heat sealing knife 143 moves downward, the guiding slopes push the side claws 146 outward. In order to enable the side claws 146 to automatically reset, an elastic member ( Figure 6 (not shown). When the two side claws 146 are expanded outwards under the action of the claw pressing seat 1461, the elastic member is compressed and stored; when the heat sealing knife 143 moves up and resets, the elastic member pushes the side claws 146 to reset. Figure 6 As shown, the claw pressing seat 1461 includes two right-angled triangular plates, the hypotenuses of which are guide slopes, and the two right-angled triangular plates are spaced apart to form an escape space for the vacuum suction nozzle 145 .

[0063] The vacuum nozzle 145 is retractably mounted on the flip connecting shaft 144 via a nozzle cylinder. The side support claws 146 are also retractably mounted on the flip connecting shaft 144 via the side support cylinder. When the vacuum nozzle 145 and the side support claws 146 are flipped to a horizontal position, the nozzle cylinder drives the vacuum nozzle 145 into the opened packaging bag 200, while the side support cylinder drives the side support claws 146 into the opened packaging bag 200. This allows the vacuum nozzle 145 to apply vacuum to the packaging bag 200. The claw pressure seat 1461 pushes the two side support claws 146 to move to the sides, flattening the opening of the packaging bag 200.

[0064] The lifting mechanism includes a lifting cylinder 148, which is located below the packaging platform 141 and is used to move the stitching bridge 142 upward. When sealing is required, the lifting cylinder 148 pushes the stitching bridge 142 upward, so that the stitching bridge 142 and the heat-sealing knife 143 clamp the bag opening of the packaging bag 200. Then, by energizing the heating wire in the stitching bridge 142, the bag opening of the packaging bag 200 is heat-sealed.

[0065] The vacuum hot pressing device also includes a pre-folding drive unit, a folding claw drive unit and a folding claw 149. The pre-folding drive unit is used to drive the folding claw 149 to approach or move away from the chip clamp 210 to be folded. The driving end of the folding claw drive unit is transmission-connected to the folding claw 149 to clamp the chip clamp 210, thereby pre-bending the two corners at the opposite ends of the packaging bag seal.

[0066] like Figure 6As shown, the pre-folding drive unit includes a two-stroke cylinder 1491 and a pre-folding slide 1492, and the corner folding claw 149 is slidably mounted on the pre-folding slide 1492 via the two-stroke cylinder 1491. The corner folding claw drive unit includes a clamping cylinder 1493 and a corner folding claw seat 1494. Specifically, the pre-folding slide 1492 is fixed to the packaging table 141 or the operating table 101, and the driving end of the two-stroke cylinder 1491 is fixedly connected to the corner folding claw seat 1494. The clamping cylinder 1493 is mounted on the corner folding claw seat 1494, and the driving end of the clamping cylinder 1493 is connected to the corner folding claw 1499. Among them, the pre-folding slide 1492 is provided with a pre-folding slide rail, and the corner folding claw seat 1494 is provided with a pre-folding slide groove, and the pre-folding slide groove is adapted to the pre-folding slide rail. When folding the corners, the double-stroke cylinder 1491 drives the folding claws 149 to approach the chip clamp 210 to be folded, and then the clamping cylinder 1493 drives the two folding claws 149 to close to clamp the chip clamp 210, thereby folding and pre-pressing the corners of the heat-sealed package.

[0067] Specifically, the folding claws 149 are L-shaped. When the clamping cylinder 1493 drives the two folding claws 149 to close, the vertical plates of the two folding claws 149 clamp on opposite sides of the wafer clamp 210, and the horizontal plates of the two folding claws 149 abut against the opposite sealed ends of the wafer clamp 210, thereby pre-pressing the two corners of the packaging bag at the opposite ends of the sealed end.

[0068] The vacuum hot pressing device provided in the embodiment of the present invention, the heat sealing knife 143, the sewing bridge 142 and the vacuum suction nozzle 145 cooperate with each other to quickly heat seal after vacuuming, thereby achieving a heat sealing effect with a higher vacuum degree. In addition, a folding claw 149 is provided, which can simulate the folding action of a human hand to meet customer requirements, achieve more beautiful folding corners, and have high folding corner consistency, so that the chip clamp 210 is more square after packaging, reducing storage space and facilitating storage and transportation.

[0069] like Figure 7 As shown, the station gripping and transferring module includes a transfer support frame 150, a transfer base 151, and a transfer clamp 152. The transfer base 151 is horizontally movable on the transfer support frame via a transfer linear drive mechanism. The transfer clamp 152 is vertically movable on the transfer base via a transfer lifting drive mechanism.

[0070] The transfer support frame 150 is fixed to the operating table 101. Figure 7 As shown, a transfer rail 1511 is provided on the transfer support frame, and a transfer slot is provided on the side of the transfer base 151 facing the transfer support frame, and the transfer slot is adapted to the transfer rail 1511. The transfer linear drive mechanism is a linear motion structure such as a screw module. Figure 7As shown, the transfer linear drive mechanism includes a transfer rodless cylinder 1512, and the transfer base 151 is fixed to the movable seat of the transfer rodless cylinder 1512. Driven by the transfer rodless cylinder 1512, the transfer base 151 drives the transfer clamp 152 to move horizontally to perform a clamping and transfer operation between two adjacent workstations.

[0071] The transfer lifting drive mechanism includes a transfer lifting cylinder 153, which is fixed to the transfer base. The driving end of the transfer lifting cylinder 153 is fixedly connected to the clamping claw seat of the transfer clamp 152, thereby driving the transfer clamp 152 to move up and down in the vertical direction.

[0072] The transfer clamp 152 includes a fixed clamp and a movable clamp. The fixed clamp is fixed to the clamp base of the transfer clamp 152, and the movable clamp is movable to the clamp base of the transfer clamp 152 via a driving member such as a clamp cylinder. Of course, both clamps of the transfer clamp 152 can also be movable clamps, which will not be described in detail in this embodiment of the present invention.

[0073] In a specific embodiment of the present invention, since the placement orientation of the wafer clamp 210 at different workstations is different, the workstation clamping and transferring module further includes a transfer and rotating driving mechanism. Figure 7 As shown, the driving end of the transfer and lifting drive mechanism is connected to the transfer rotation drive mounting plate 1541, the transfer and lifting drive mechanism is fixed to the transfer rotation drive mounting plate 1541, and the driving end of the transfer and lifting drive mechanism is fixedly connected to the clamping claw seat of the transfer clamping claw 152.

[0074] Specifically, the transfer rotation drive mechanism is a rotation drive structure such as a rotary motor. Optionally, the transfer rotation drive mechanism includes a transfer rotation cylinder 1542, which is fixed to a transfer rotation drive mounting plate 1541. The transfer rotation drive mounting plate 1541 is fixedly connected to the driving end of the transfer lifting drive mechanism, and the driving end of the transfer rotation cylinder 1542 is fixedly connected to the clamping claw seat of the transfer clamping claw 152. Figure 7 As shown, the loading side of the wafer clamp 210 in the bag opening device is perpendicular to the sealing side of the bag 200 in the vacuum hot pressing device. The transfer rotary cylinder 1542 drives the transfer clamp 152 to rotate 90 degrees. Of course, the loading side of the wafer clamp 210 in the bag opening device and the sealing side of the bag 200 in the vacuum hot pressing device can also be located on the same side. In this case, there is no need for a transfer rotary drive mechanism. The specific layout can be flexibly adjusted according to the space available in the production workshop.

[0075] like Figure 7As shown, the workstation clamping and transferring module also includes a transfer tank chain 156, which is horizontally arranged on the side of the transfer support frame 150 away from the transfer clamp 152, so as to lay wires and air circuits for the electrical and gas-requiring components of the workstation clamping and transferring module.

[0076] In order to make the transfer clamp 152 rise and fall more smoothly, the station clamping and transfer module also includes a transfer linear bearing 1571 and a transfer guide rod 1572. Figure 7 As shown, the transfer linear bearing 1571 is fixed to the transfer base, the transfer guide rod 1572 is inserted into the transfer linear bearing 1571, and the bottom of the transfer guide rod 1572 is fixedly connected to the transfer rotation drive mounting plate 1541. Figure 7 As shown, there are two transfer guide rods 1572 , which are respectively arranged on opposite sides of the transfer lifting cylinder 153 .

[0077] In one specific embodiment, to reduce the number of workstation clamping and transfer modules, the opening operation position of the packaging bag opening device, the hot pressing position of the vacuum hot pressing device, and the labeling position of the labeling and laminating device are linearly and evenly spaced on the frame 100. The workstation clamping and transfer module includes two transfer clamps 152, which are connected by a series plate 158, and the series plate 158 is fixed to the transfer base 151. One of the transfer clamps 152 clamps the wafer clamp 210 at the opening operation position, while the other transfer clamp 152 clamps the wafer clamp 210 at the hot pressing position. Driven by the transfer rodless cylinder 1512, the wafer clamp 210 at the opening operation position is moved to the hot pressing position, and the wafer clamp 210 at the hot pressing position is moved to the labeling position.

[0078] like Figure 8 As shown, the labeling and laminating device includes a labeling support platform 160, a fixed clamping claw 161, a label peeling mechanism, and a labeling mechanism. The labeling support platform 160 is used to support the wafer holder 210 to be labeled, and the fixed clamping claw 161 is used to clamp the opposite sides of the wafer holder 210 to be labeled. The label peeling mechanism is used to peel the label from the label paper 230, and the labeling mechanism is used to apply the peeled label to the packaging bag 200 of the wafer holder 210.

[0079] Specifically, the label stripping mechanism includes a label stripping motor 1621, a label stripping active shaft 1622, a label stripping driven shaft 1623, and a label stripping plate 1624. The label stripping motor 1621 is in transmission connection with the label stripping active shaft 1622. The label stripping active shaft 1622 is sleeved with the base paper roll of the label paper 230, and the label stripping driven shaft 1623 is sleeved with the label paper roll. The label stripping plate 1624 is fixed to the label pressing bracket 163 and is parallel to the labeling surface of the wafer clamp 210. The label paper 230 is pulled out from the label stripping driven shaft 1623 and connected to the label stripping active shaft 1622 after passing through the label stripping plate 1624. Figure 8As shown, the top of the label peeling plate 1624 is an inclined surface to assist the label on the label paper 230 to fall off.

[0080] During operation, driven by the label stripping motor 1621, the label stripping active shaft 1622 rotates to wrap around the backing paper of the label paper 230, thereby pulling and driving the label stripping driven shaft 1623 to release the label paper 230. As the label paper 230 moves, the label is peeled off at the label stripping plate 1624. The label stripping motor 1621 stops driving and waits for the labeling mechanism to apply the label. After the current label is applied, the label stripping motor 1621 starts again to peel the next label.

[0081] Optionally, the label stripping mechanism further includes a label position sensor, which is provided at the top of the label stripping plate 1624. After the label is stripped, the label position sensor generates a trigger signal, and the labeling mechanism starts the labeling operation based on the trigger signal of the label position sensor.

[0082] Specifically, the labeling mechanism includes a labeling pressing bracket 163, a labeling cylinder 1641 and a labeling nozzle ( Figure 8 (The middle view is not shown.) The labeling cylinder 1641 is fixed to the top of the labeling and pressing bracket 163. The driving end of the labeling cylinder 1641 is connected to the base of the labeling nozzle. When a label is peeled off, the labeling cylinder 1641 receives a trigger signal from the label position sensor and drives the labeling nozzle to absorb the peeled label. After absorption, the labeling cylinder 1641 continues to drive the labeling nozzle forward until the label is attached to the packaging bag 200 in the wafer holder 210.

[0083] In order to improve the running stability of the labeling nozzle, the labeling mechanism also includes a labeling linear bearing 1642 and a labeling guide rod 1643. The labeling linear bearing 1642 is fixed to the labeling pressing bracket 163, and the labeling guide rod 1643 is inserted into the labeling linear bearing 1642. In the case that the labeling mechanism also includes a clearance cylinder 1645, the bottom end of the labeling guide rod 1643 is fixedly connected to the clearance cylinder fixing plate 1644. In the case that the labeling mechanism does not include the clearance cylinder 1645, the bottom end of the labeling guide rod 1643 is fixedly connected to the base of the labeling nozzle. Figure 8 As shown, two labeling guide rods 1643 are provided, and the two labeling guide rods 1643 are respectively arranged on opposite sides of the labeling cylinder 1641.

[0084] In an optional embodiment, if Figure 8 As shown, the labeling mechanism also includes a clearance cylinder fixing plate 1644 and a clearance cylinder 1645. The driving end of the labeling cylinder 1641 is fixedly connected to the clearance cylinder fixing plate 1644. The clearance cylinder 1645 is fixedly mounted on the clearance cylinder fixing plate 1644. The driving end of the clearance cylinder 1645 is fixedly connected to the base of the labeling nozzle. The clearance cylinder 1645 is used to drive the labeling nozzle to move up and down.

[0085] Since the peeled label is only partially separated from the backing paper, if the labeling nozzle moves forward directly after sucking the label, the peeling plate will hinder the label's forward movement, resulting in defects such as creases and scratches on the label. To this end, a clearance cylinder 1645 is added to adjust the height of the labeling nozzle to avoid the peeling plate.

[0086] During labeling, the labeling cylinder 1641 drives the labeling nozzle forward to absorb the label. After absorption, the yield cylinder 1645 drives the labeling nozzle upward to avoid the stripper plate. After reaching the target height, the labeling cylinder 1641 continues to drive the labeling nozzle forward to align the adhesive surface of the label with the packaging bag 200 of the wafer holder 210. The labeling nozzle is then released, and the labeling cylinder 1641 reverses to reset the labeling nozzle. After reset, the yield cylinder 1645 drives the labeling nozzle downward to achieve height reset. It is understood that the labeling height of the wafer holder 210 on the labeling support table 160 is consistent with the height of the labeling nozzle after the yield cylinder 1645 drives the labeling nozzle upward. If the two heights are inconsistent, the height of the labeling nozzle is adjusted after avoiding the stripper plate with the aid of the yield cylinder 1645. This embodiment of the present invention does not specifically limit the control process of the labeling cylinder 1641 and the yield cylinder 1645.

[0087] Specifically, the fixed clamping claws 161 can be opened and closed on both sides of the labeling support platform 160 through the fixed clamp cylinder 1611. Figure 8 As shown, the labeling support platform 160 has a groove on its side parallel to the driving direction of the labeling cylinder 1641. The fixed jaws include a horizontal clamping portion and a vertical connecting portion, which are connected to form a T-shape. The connecting portion is connected to the driving end of the fixed clamp cylinder 1611, and is clamped into the groove under the drive of the fixed clamp cylinder 1611. The clamping portion is a square frame structure. When the two fixed jaws approach each other under the drive of the fixed clamp cylinder 1611, the two clamping portions abut against opposite sides of the wafer clamp 210, and the square-shaped clamping portion compresses the corners of the packaging bag of the wafer clamp 210, thereby completely clamping the wafer. In addition, one of the two fixed jaws 161 is fixed to the side of the labeling support platform 160 as a positioning reference, while the other fixed jaw 161 is retractably mounted to the side of the support plate via a linear drive unit. Under the action of the linear drive unit, the two fixed jaws 161 move closer or farther to achieve clamping and release.

[0088] Optionally, the labeling and pressing device further includes an auxiliary corner clamping claw 165 and an auxiliary corner cylinder 1651. The auxiliary corner cylinder 1651 is fixed to the top of the fixed clamping claw 161, and the driving end of the auxiliary corner cylinder 1651 is connected to the auxiliary corner clamping claw 165. The clamping direction of the auxiliary corner clamping claw 165 is perpendicular to the clamping direction of the fixed clamping claw 161. Figure 8As shown, the top of the fixed clamping claw 161 is lower than the top of the wafer clamp 210. When the fixed clamping claw 161 clamps the wafer clamp 210 to fold the corner of the packaging bag, the part of the packaging bag that is higher than the fixed clamping claw 161 is in a loose state. The auxiliary folding claw 165 set on the top of the fixed clamping claw 161 is used to assist in clamping, preventing the folding corner from loosening after the fixed clamping claw 161 is released, thereby improving the folding effect. It should be noted that a set of auxiliary folding claws 165 and an auxiliary folding cylinder 1651 are provided on the top of at least one fixed clamping claw 161. Figure 8 Only the structure of a set of folding auxiliary clamping jaws 165 and a folding auxiliary cylinder 1651 is shown schematically on the top of one of the fixed clamping jaws 161.

[0089] In a specific embodiment, the labeling and pressing device also includes a label pressing mechanism and a rotating mechanism. The rotating mechanism is used to drive the labeling support platform 160 to rotate to adjust the orientation of the labeling surface of the chip clamp 210. The label pressing mechanism is used to press the label after the labeling surface of the chip clamp 210 is changed to improve the firmness of the adhesion.

[0090] Specifically, the rotating mechanism includes a rotating support platform 1661 and a reversing rotating cylinder 1662. The reversing rotating cylinder 1662 is fixed to the labeling pressing bracket 163. The driving end of the reversing rotating cylinder 1662 is fixedly connected to the rotating support platform 1661. The labeling support platform 160 is arranged above the rotating support platform 1661 through four pillars. Figure 8 As shown, the fixed clamp cylinder 1611 is located between the labeling support platform 160 and the rotating support platform 1661 and is fixedly installed on the rotating support platform 1661.

[0091] The marking mechanism includes a marking cylinder fixing base 1671, a marking cylinder 1672 and a pressing plate 1673. The marking cylinder 1672 is fixed to the marking cylinder fixing base 1671, and the marking cylinder fixing base 1671 is fixed to the operating table 101. The driving end of the marking cylinder 1672 is connected to the pressing plate 1673.

[0092] Optionally, the pressing plate 1673 is a silicone plate with a certain degree of flexibility to avoid leaving scratches on the label. When the rotating mechanism reverses the wafer clamp 210, the label pressing cylinder 1672 pushes the pressing plate 1673 against the labeling surface of the wafer clamp 210, thereby firmly sticking the label to the packaging bag of the wafer clamp 210, and preventing the label from falling off due to the labeling mechanism not being firmly attached. During pressing, for the same wafer clamp 210, the label pressing cylinder 1672 can reciprocate, allowing the pressing plate 1673 to repeatedly press the label multiple times; or, the pressing plate 1673 can be pressed on the label for a preset time and then moved away, thereby improving the firmness of the label adhesion through the preset time.

[0093] To ensure smoother linear motion of the pressing plate 1673, the pressing mechanism also includes a pressing linear bearing 1674 and a pressing guide rod 1675. The pressing linear bearing 1674 is fixed to the pressing cylinder mounting 1671, and the pressing guide rod 1675 is inserted into the pressing linear bearing 1674. One end of the pressing guide rod 1675 is fixedly connected to the pressing plate 1673. Optionally, one or two pressing guide rods 1675 may be provided, depending on the specific needs, and the number of pressing guide rods 1675 is not limited.

[0094] In an optional embodiment, the labeling mechanism and the label pressing mechanism are arranged relative to each other. During operation, after the labeling mechanism affixes the label to the labeling surface of the wafer clamp 210, the reversing rotary cylinder 1662 drives the rotating support platform 1661 to rotate 180°, so that the label pressing mechanism can compact the label from the opposite side of the labeling mechanism. In another optional embodiment, the labeling mechanism and the label pressing mechanism are arranged perpendicularly. During operation, the reversing rotary cylinder 1662 drives the rotating support platform 1661 to rotate 90°, so that the label pressing mechanism can compact the label after the labeling mechanism has applied the label. This embodiment of the present invention does not specifically limit the relative positions of the labeling mechanism and the label pressing mechanism.

[0095] It should be noted that a station gripping and transfer module with a single transfer jaw 152 can be installed between the bag opening device and the vacuum and hot-pressing device, and between the vacuum and hot-pressing device and the labeling and laminating device, respectively, to move the wafer holder 210 to the next station. Alternatively, the operating areas of the bag opening device, vacuum and hot-pressing device, and labeling and laminating device can be located on the same straight line, and a station gripping and transfer module with two transfer jaws 152 can be installed to facilitate the switching of the wafer holder 210 between different stations.

[0096] The labeling and pressing device provided by the embodiment of the present invention has a label stripping motor 1621 that drives the base paper roll on the label stripping active shaft 1622 to rotate, peels the label off the label on the label stripping plate 1624, and the labeling cylinder 1641 drives the labeling nozzle to absorb the label and stick it on the packaging bag of the chip clamp 210. The reversing rotation cylinder 1662 drives the chip clamp 210 to rotate 180°, and the label pressing cylinder 1672 drives the pressing plate 1673 to press, thereby increasing the adhesion of the label and reducing the possibility of the label falling off, so that the label stripping, suction, lamination and pressing can be completed in one workstation, and the finished product can be directly provided to the blanking module.

[0097] like Figure 9 As shown, the blanking module includes a blanking support frame 170, a first mounting seat 171, a second mounting seat 172 and a clamping jaw 173. The blanking support frame 170 is fixedly mounted on the operating table 101, the first mounting seat 171 can be movably mounted on the blanking support frame 170 through an X-axis driving mechanism, the second mounting seat 172 can be movably mounted on the first mounting seat 171 through a Y-axis driving mechanism, and the clamping jaw 173 can be lifted and mounted on the second mounting seat 172 through a lifting driving mechanism.

[0098] The blanking support frame 170 includes two gantry structures arranged opposite to each other, and the opposite ends of the first mounting seat 171 are respectively slidably connected to the crossbars of the corresponding side gantry structures. Figure 9 As shown, the first mounting seat 171 extends along the Y direction, an X-direction slide rail 1741 is provided on the crossbar of the gantry structure, and X-direction slide grooves are respectively provided at opposite ends of the first mounting seat 171, and the X-direction slide rail 1741 is adapted to the X-direction slide groove.

[0099] The clamping jaw 173 includes a clamping jaw seat and two clamping jaws, and at least one of the two clamping jaws is installed on the clamping jaw seat through a clamping jaw cylinder.

[0100] The first mounting base 171 is movably mounted on the blanking support frame 170 via an X-axis drive mechanism. Under the action of the X-axis drive mechanism, the first mounting base 171 slides along the X-axis slide rail 1741, thereby enabling the clamping claw 173 to reciprocate between the operating position of the labeling and pressing device and the material tray 240 of the wafer clamp 210. Specifically, the X-axis drive mechanism is any linear drive mechanism such as a synchronous belt linear drive mechanism, a sprocket linear drive mechanism, a lead screw module, etc. Figure 9 As shown, the X-direction drive mechanism includes an X-direction motor 1742, an X-direction power synchronous belt 1743, and an X-direction power synchronous pulley 1744. The X-direction motor 1742 is fixed to the blanking support frame 170, and the driving end of the X-direction motor 1742 is connected to the driving pulley of the X-direction power synchronous pulley 1744. The first mounting seat 171 is connected to the X-direction power synchronous belt 1743. Driven by the X-direction motor 1742, the first mounting seat 171 moves synchronously with the X-direction power synchronous belt 1743. Preferably, a set of X-direction power synchronous belts 1743 and X-direction power synchronous pulleys 1744 are respectively arranged on the two gantry structures. In order to reduce the layout of the motors, the driving pulleys of the X-direction power synchronous pulleys 1744 in the two gantry structures are connected by an X-direction power transmission shaft 1745.

[0101] Optionally, X-direction motor 1742 is connected to the driving pulley of X-direction power synchronous pulley 1744 via a belt drive to facilitate adjustment of the placement of X-direction motor 1742. Specifically, the drive end of X-direction motor 1742 is directly connected to the driving pulley of X-direction synchronous pulley 1752, and the driven pulley of X-direction synchronous pulley 1752 is coaxially arranged with the driving pulley of X-direction power synchronous pulley 1744. X-direction synchronous belt 1751 is sleeved around X-direction synchronous pulley 1752. When X-direction motor 1742 drives X-direction synchronous belt 1751, the driven pulley of X-direction synchronous pulley 1752 rotates X-direction power synchronous pulley 1744, thereby driving X-direction power synchronous belt 1743.

[0102] The first mounting seat 171 is provided with a Y-direction slide rail 1761, and the second mounting seat 172 is provided with a Y-direction slide groove, and the Y-direction slide rail 1761 is adapted to the Y-direction slide groove. The second mounting seat 172 is connected to the first mounting seat 171 through a Y-direction drive mechanism. The Y-direction drive mechanism is a linear motion mechanism such as a belt drive, a chain drive, or a lead screw. Specifically, Figure 9 As shown, the Y-direction drive mechanism includes a Y-direction motor 1762, a Y-direction synchronous wheel 1763, and a Y-direction synchronous belt 1764. The Y-direction motor 1762 is fixed to the first mounting base 171, the driving end of the Y-direction motor 1762 is connected to the driving wheel of the Y-direction synchronous wheel 1763, the Y-direction synchronous belt 1764 is sleeved on the Y-direction synchronous wheel 1763, and the clamping jaw 173 is connected to the Y-direction synchronous belt 1764. Figure 10 As shown, driven by the Y-direction motor 1762 , the clamping claw 173 moves along the Y-direction so that the material tray 240 can store a plurality of wafer clamps 210 along the Y-direction.

[0103] like Figure 9 As shown, in order to facilitate the laying of wires and air pipes, the blanking module also includes an X-direction tank chain 1771 and a Y-direction tank chain 1772. The X-direction tank chain 1771 is arranged on the outside of the blanking support frame 170 along the X direction, and the Y-direction tank chain 1772 is arranged on one side of the first mounting seat 171 along the Y direction.

[0104] In a specific embodiment, Figure 9 As shown, the lifting drive mechanism includes a blanking lifting cylinder 1781, which is fixed to the second mounting base 172, and the driving end of the blanking lifting cylinder 1781 is fixedly connected to the clamping claw seat of the clamping claw 173.

[0105] In order to make the lifting movement of the clamping jaw 173 more stable, the blanking module also includes a blanking guide rod 1782 and a blanking linear bearing. Figure 9 As shown, the blanking linear bearing is fixed to the second mounting seat 172, the blanking guide rod 1782 is inserted into the blanking linear bearing, and the bottom of the blanking guide rod 1782 is fixedly connected to the clamping claw seat of the clamping claw 173. Figure 9 and Figure 10 As shown, there are two unloading guide rods 1782, and the two unloading guide rods 1782 are arranged on opposite sides of the unloading lifting cylinder 1781.

[0106] In an optional embodiment of the present invention, the blanking module further includes a rotary drive mechanism 179 , which is fixedly mounted on the second mounting seat 172 , and a driving end of the rotary drive mechanism 179 is fixedly connected to a clamping jaw seat of the clamping jaw 173 .

[0107] For example, the rotation drive mechanism 179 is a rotary cylinder. Driven by the rotary cylinder, the clamping jaws 173 rotate, thereby adjusting the orientation of the wafer clamp 210 clamped by the clamping jaws 173.

[0108] It should be noted that, when both the rotation drive mechanism 179 and the lifting drive mechanism are provided, one of the rotation drive mechanism 179 and the lifting drive mechanism is directly fixed on the second mounting base 172, and the other is indirectly provided on the second mounting base 172. Figure 9 As shown, the lifting drive mechanism is fixed to the second mounting base 172, and its driving end is connected to a mounting plate; the rotation drive mechanism 179 is fixed to the mounting plate, and its driving end is connected to the clamping claw seat of the clamping claw 173. For another example, the rotation drive mechanism 179 is mounted on the second mounting base 172, and its driving end is connected to a vertical plate; the lifting drive mechanism is mounted on the vertical plate, and its driving end is fixedly connected to the clamping claw seat of the clamping claw 173.

[0109] When using the wafer clamp automatic packaging machine provided by the present invention, an automatic wafer clamp loader is installed at the packaging bag opening device to feed the wafer clamps 210 into the opened packaging bag. An automatic wafer clamp unloader is installed at the discharge end of the unloading module to stack trays 240 filled with packaged wafer clamps 210 on the unloading cart and provide empty trays 240 to the unloading module. This allows for long-term unmanned automatic packaging, reducing the possibility of human contamination during the packaging process. During production, rapid switching between different products can be achieved by simply switching programs.

[0110] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A wafer clamp automatic packaging machine, characterized in that: The machine comprises a frame, a packaging bag lifting and loading device, a packaging bag lateral conveying device, a packaging bag opening device, a vacuum hot pressing device, a labeling and pressing device, a station clamping and transferring module and a blanking module. An operating table is provided in the frame, and the packaging bag lifting and loading device, the packaging bag lateral conveying device, the packaging bag opening device, the vacuum hot pressing device, the labeling and pressing device, the station clamping and transferring module and the blanking module are all installed on the operating table. The packaging bag lateral conveying device is used to lift the packaging bag The packaging bag pushed by the loading device is transferred to the opening operation position of the packaging bag opening device, the vacuuming and hot pressing device is used to vacuum the wafer clamp that has completed bagging at the opening operation position and seal the bag opening, the labeling and pressing device is used to label the sealed wafer clamp, the station clamping and loading module is used to switch the station of the wafer clamp between the packaging bag opening device, the vacuuming and hot pressing device and the labeling and pressing device, and the unloading module is used to move the labeled wafer clamp out of the labeling and pressing device; The packaging bag lifting and loading device includes a lifting support plate, a packaging bag lifting plate and a packaging bag in-place detection element, wherein the lifting support plate is fixed to the operating table, the packaging bag lifting plate can be lifted and lowered on the lifting support plate, and the packaging bag in-place detection element is used to generate a trigger signal when the packaging bag placed on the packaging bag lifting plate is lifted to the loading position, and the packaging bag transverse conveying device is communicatively connected to the packaging bag in-place detection element; The labeling and pressing device includes a labeling support platform, a fixed clamping claw, a label stripping mechanism, and a labeling mechanism. The labeling support platform is used to support the wafer clamp to be labeled, the fixed clamping claw is used to clamp the opposite sides of the wafer clamp to be labeled, the label stripping mechanism is used to peel off the label from the label paper, and the labeling mechanism is used to stick the peeled label on the packaging bag of the wafer clamp; The labeling and pressing device also includes an auxiliary corner clamping jaw and an auxiliary corner cylinder. The auxiliary corner cylinder is fixed to the top of the fixed clamping jaw, and the driving end of the auxiliary corner cylinder is connected to the auxiliary corner clamping jaw. The clamping direction of the auxiliary corner clamping jaw is perpendicular to the clamping direction of the fixed clamping jaw.

2. The wafer clip automatic packaging machine according to claim 1, characterized in that: The packaging bag opening device includes an opening support frame, a lower suction cup and an upper suction cup. The opening support frame is fixed to the operating table. The opening support frame has a support plate for placing the packaging bag. The lower suction cup is arranged below the support plate. The upper suction cup can be lifted and installed on the opening support frame through a lifting mechanism and is located above the support plate. The lower suction cup is used to adsorb the bottom of the packaging bag, and the upper suction cup is used to adsorb the top of the packaging bag.

3. The wafer clip automatic packaging machine according to claim 2, characterized in that: The packaging bag opening device also includes a lower clamping mechanism and an upper clamping mechanism. The lower clamping mechanism is used to press the bottom of the packaging bag onto the support plate, and the upper clamping mechanism is used to clamp the top of the packaging bag after the bag opening is opened.

4. The wafer clip automatic packaging machine according to claim 1, characterized in that: The vacuum hot pressing device includes a heat sealing bracket, a packaging table, a suture bridge, a heat sealing knife, a flip connecting shaft, a vacuum suction nozzle and side support claws. The packaging table is fixed to the heat sealing bracket and is used to support the wafer clamp to be hot pressed; the suture bridge can be lifted and lowered on the packaging bracket through a jacking mechanism, the heat sealing knife can be lifted and lowered on the heat sealing bracket through a pressing drive mechanism, the flip connecting shaft can be rotatably mounted on the heat sealing bracket through a flip driving mechanism, the vacuum suction nozzle and the side support claws can be telescopically mounted on the flip connecting shaft, wherein the two side support claws are located on opposite sides of the vacuum suction nozzle and can slide along the flip connecting shaft.

5. The wafer clamp automatic packaging machine according to claim 4, characterized in that: The vacuum hot pressing device also includes a pre-folding drive unit, a folding claw drive unit and a folding claw. The pre-folding drive unit is used to drive the folding claw to approach or move away from the chip clamp to be folded. The driving end of the folding claw drive unit is transmission-connected to the folding claw to clamp the chip clamp to pre-bend the two corners at the opposite ends of the packaging bag seal.

6. The wafer clip automatic packaging machine according to claim 1, characterized in that: The workstation clamping and transferring module includes a transfer support frame, a transfer base and two transfer clamps. The transfer support frame is fixed to the operating table. The transfer base is movably installed on the transfer support frame in the horizontal direction through a transfer linear drive mechanism. Each of the transfer clamps is liftable on the transfer base in the vertical direction through a transfer lifting drive mechanism. One of the transfer clamps clamps the chip clamp at the opening operation position, and at the same time, the other transfer clamp clamps the chip clamp at the hot pressing position.

7. The wafer clip automatic packaging machine according to claim 1, characterized in that: The labeling and pressing device also includes a label pressing mechanism and a rotating mechanism. The rotating mechanism is used to drive the labeling support platform to rotate to adjust the direction of the labeling surface of the wafer clamp. The label pressing mechanism is used to press the label after the labeling surface of the wafer clamp is changed to improve the firmness of the adhesion.

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