Packaging structure manufacturing method

Abstract

The application discloses a packaging structure manufacturing method, wherein the packaging structure manufacturing method is used for arranging a hydrogenated amorphous silicon layer and a soluble adhesive layer on a bearing substrate; after a packaging step is completed, the hydrogenated amorphous silicon layer is irradiated by using a laser, so that the Si-H bond with weak bond energy in the hydrogenated amorphous silicon layer absorbs energy and breaks, a large amount of free hydrogen overflows, a hydrogen explosion phenomenon is generated, a large number of gaps are formed between the hydrogenated amorphous silicon layer and the soluble adhesive layer, then a stripping liquid is used for soaking the packaging unit, the stripping liquid can enter the gaps between the hydrogenated amorphous silicon layer and the soluble adhesive layer, the contact area of the stripping liquid and the soluble adhesive layer is large, therefore, the soluble adhesive layer can be dissolved in the stripping liquid more quickly, the packaging structure and the bearing substrate can be separated more quickly, and therefore, the production efficiency can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a method for manufacturing a packaging structure. Background Technology

[0002] In fan-out panel-level packaging, the packaging process needs to be completed on a carrier substrate, and then the package structure is peeled off from the carrier substrate. In related technologies, an adhesive layer formed by a soluble material can be covered on the carrier substrate. After the packaging process is completed, the assembly of the package structure, adhesive layer and carrier substrate is immersed in a release solution used to dissolve the adhesive layer. However, this method has a slow dissolution rate and low production efficiency. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a method for manufacturing an encapsulation structure, which combines hydrogenated amorphous silicon with a soluble material. The hydrogenated amorphous silicon layer can generate gaps under laser irradiation, increasing the contact area between the release liquid and the soluble adhesive layer, thereby improving the dissolution rate of the soluble material and thus increasing production efficiency.

[0004] The present invention also proposes a packaging structure manufactured by the above-described packaging structure manufacturing method.

[0005] The packaging structure manufacturing method provided in the first aspect of the present invention includes the following steps:

[0006] Prepare the substrate;

[0007] A hydrogenated amorphous silicon layer is coated on one side surface of the carrier substrate;

[0008] A soluble adhesive layer is applied to the side of the hydrogenated amorphous silicon layer away from the carrier substrate.

[0009] An encapsulation step is performed on the side of the soluble adhesive layer away from the hydrogenated amorphous silicon layer to form multiple interconnected encapsulation structures on the side of the soluble adhesive layer away from the hydrogenated amorphous silicon layer.

[0010] The side of the carrier substrate away from the hydrogenated amorphous silicon layer is irradiated with a laser to create a gap between the hydrogenated amorphous silicon layer and the soluble adhesive layer.

[0011] The assembly of multiple interconnected packaging structures with the carrier substrate, the hydrogenated amorphous silicon layer, and the soluble adhesive layer is divided to form multiple separate packaging units, each of which includes one of the packaging structures.

[0012] The encapsulation unit is placed in a release solution, which dissolves the soluble adhesive layer in the release solution, thereby allowing the encapsulation structure to detach from the carrier substrate.

[0013] The packaging structure manufacturing method provided by the first aspect of the present invention has at least the following beneficial effects: a hydrogenated amorphous silicon layer and a soluble adhesive layer are disposed on a carrier substrate. After the packaging step is completed, the hydrogenated amorphous silicon layer is first irradiated with a laser, causing the weak Si-H bonds in the hydrogenated amorphous silicon layer to absorb energy and break, resulting in a large amount of free hydrogen overflowing and generating a hydrogen explosion phenomenon, thereby forming a large number of voids in the hydrogenated amorphous silicon layer. Then, the packaging unit is immersed in a stripping solution. The stripping solution can enter the voids in the hydrogenated amorphous silicon layer, and the contact area between the stripping solution and the soluble adhesive layer increases. Therefore, the soluble adhesive layer can dissolve in the stripping solution more quickly, allowing the packaging structure to separate from the carrier substrate more quickly, thereby improving production efficiency.

[0014] In some embodiments of the present invention, the step of covering one side surface of the carrier substrate with a hydrogenated amorphous silicon layer includes the following steps:

[0015] The hydrogenated amorphous silicon layer is deposited on one side surface of the carrier substrate by vapor deposition.

[0016] In some embodiments of the present invention, the deposition of the hydrogenated amorphous silicon layer on one side surface of the carrier substrate by vapor deposition includes the following steps:

[0017] The hydrogenated amorphous silicon layer is deposited on one side surface of the carrier substrate by the reaction of silane with hydrogen.

[0018] In some embodiments of the present invention, the hydrogen content of the hydrogenated amorphous silicon layer is 5% to 20%.

[0019] In some embodiments of the present invention, the thickness of the hydrogenated amorphous silicon layer is 2 nm to 10 nm.

[0020] In some embodiments of the present invention, the material of the soluble adhesive layer is an acrylic resin or a phenolic resin, and the stripping liquid is an organic alkaline solution.

[0021] In some embodiments of the present invention, the packaging step includes the following steps:

[0022] An adhesive layer is applied to the side of the soluble adhesive layer away from the carrier substrate, and the adhesive layer is not easily soluble in the release solution;

[0023] A wafer is attached to the side of the adhesive layer away from the soluble adhesive layer;

[0024] A redistribution layer is formed on the side of the adhesive layer away from the soluble adhesive layer, so that the redistribution layer is electrically connected to the wafer;

[0025] A molding layer is applied to the side of the redistribution layer away from the adhesive layer;

[0026] Solder bumps are formed on the side of the molding layer away from the redistribution layer, so that the solder bumps are electrically connected to the redistribution layer.

[0027] In some embodiments of the present invention, the adhesive layer is made of epoxy resin or polyethylene terephthalate.

[0028] In some embodiments of the present invention, the laser is an ultraviolet laser.

[0029] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0031] Figure 1 A flowchart illustrating a method for manufacturing a packaging structure according to a first aspect embodiment of the present invention;

[0032] Figure 2 for Figure 1 The flowchart of the packaging steps in step S400 is shown;

[0033] Figure 3 for Figure 1 A schematic diagram showing the completion of steps S200 in the middle section;

[0034] Figure 4 for Figure 1 A schematic diagram showing the completion of the S300 steps;

[0035] Figure 5 for Figure 1 A schematic diagram showing the completion of the S400 steps;

[0036] Figure 6 for Figure 1 A schematic diagram illustrating the implementation process of S500;

[0037] Figure 7 for Figure 1 A schematic diagram illustrating the implementation process of S600 in China;

[0038] Figure 8 for Figure 1 A schematic diagram illustrating the implementation process of S700 in China;

[0039] Figure 9 for Figure 1 Another schematic diagram illustrating the implementation process of the S700 procedure;

[0040] Figure 10 for Figure 1 A schematic diagram showing the completion of the S700 steps.

[0041] Figure label:

[0042] The substrate is 100, the hydrogenated amorphous silicon layer is 200, the void is 210, the soluble adhesive layer is 300, the packaging structure is 400, the adhesive layer is 410, the wafer is 420, the redistribution layer is 430, the molding layer is 440, the solder bump is 450, the packaging unit is 500, and the stripping fluid is 600. Detailed Implementation

[0043] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0044] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0045] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0046] In the description of this invention, references to terms such as "one embodiment," "some embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0047] In fan-out panel-level packaging, the packaging process needs to be completed on the carrier substrate 100, and then the packaging structure is peeled off from the carrier substrate 100. In related technologies, an adhesive layer formed of a soluble material can be covered on the carrier substrate 100. After the packaging process is completed, the assembly of the packaging structure, adhesive layer and carrier substrate 100 is immersed in a release solution used to dissolve the adhesive layer. However, in this method, the contact area between the release solution and the adhesive layer is limited, and the release solution needs to gradually dissolve the adhesive layer from the edge to the inside, resulting in a slow dissolution rate and low production efficiency.

[0048] Based on this, refer to Figure 1 , Figures 3 to 10The packaging structure manufacturing method provided in the first aspect of the present invention includes the following steps:

[0049] S100, prepare to support substrate 100;

[0050] S200, refer to Figure 3 A hydrogenated amorphous silicon layer 200 is covered on one side surface of the substrate 100.

[0051] S300, refer to Figure 4 A soluble adhesive layer 300 is covered on the side of the hydrogenated amorphous silicon layer 200 away from the carrier substrate 100.

[0052] S400, refer to Figure 5 An encapsulation step is performed on the side of the soluble adhesive layer 300 away from the hydrogenated amorphous silicon layer 200 to form a plurality of interconnected encapsulation structures 400 on the side of the soluble adhesive layer 300 away from the hydrogenated amorphous silicon layer 200.

[0053] S500, refer to Figure 6 A laser is used to irradiate the side of the substrate 100 away from the hydrogenated amorphous silicon layer 200 in the direction of the arrow, so as to create a gap 210 between the hydrogenated amorphous silicon layer 200 and the soluble adhesive layer 300. Specifically, an ultraviolet laser can be used as the laser.

[0054] S600, refer to Figure 7 The assembly of multiple interconnected packaging structures 400 with the carrier substrate 100, hydrogenated amorphous silicon layer 200 and soluble adhesive layer 300 is divided to form multiple mutually separated packaging units 500, each packaging unit 500 including a packaging structure 400.

[0055] S700, see reference Figures 8 to 10 The packaging unit 500 is placed in the release liquid 600, so that the soluble adhesive layer 300 dissolves in the release liquid 600, thereby allowing the packaging structure 400 to detach from the carrier substrate 100.

[0056] A hydrogenated amorphous silicon layer 200 and a soluble adhesive layer 300 are disposed on a carrier substrate 100. The hydrogenated amorphous silicon layer 200 contains a large number of weak Si-H bonds. After the encapsulation step, the hydrogenated amorphous silicon layer 200 is first irradiated with a laser, causing the weak Si-H bonds in the hydrogenated amorphous silicon layer 200 to absorb energy and break, resulting in a large amount of free hydrogen escaping and producing a hydrogen explosion. This creates a large number of voids 210 between the hydrogenated amorphous silicon layer 200 and the soluble adhesive layer 300. Then, a release solution 600 is used. In the immersion encapsulation unit 500, the release liquid 600 can enter the gap 210 between the hydrogenated amorphous silicon layer 200 and the soluble adhesive layer 300. The release liquid 600 and the soluble adhesive layer 300 can contact each other at the outer edge of the soluble adhesive layer 300 and inside the soluble adhesive layer 300. The contact area is increased, so the soluble adhesive layer 300 can dissolve in the release liquid 600 more quickly, so that the encapsulation structure 400 can be separated from the carrier substrate 100 more quickly, thereby improving production efficiency.

[0057] Understandably, in step S500, a laser is used to irradiate the side of the carrier substrate 100 away from the hydrogenated amorphous silicon layer 200 in the direction of the arrow, so that a gap 210 is created between the hydrogenated amorphous silicon layer 200 and the soluble adhesive layer 300. In order to ensure that the laser can penetrate the carrier substrate 100, the carrier substrate 100 needs to be made of a light-transmitting material. Specifically, the material of the carrier substrate 100 is glass.

[0058] It should be noted that, for the purpose of facilitating the demonstration of the structure, Figures 3 to 10 The diagram only shows the manufacturing process of two adjacent encapsulation structures 400. In actual production, a larger carrier substrate 100 can be used, and more encapsulation structures 400 can be manufactured on it to improve production efficiency. For example, the carrier substrate 100 can be a square plate with a side length greater than 300 mm.

[0059] It should be noted that the packaging structure manufacturing method provided in the first aspect of the present invention can be applied to advanced packaging at the fan-out panel level, advanced packaging at the fan-out wafer level, semiconductor packaging, etc.

[0060] Furthermore, S200 includes the following steps:

[0061] A hydrogenated amorphous silicon layer 200 is deposited on one side surface of the substrate 100 by vapor deposition.

[0062] Specifically, plasma-enhanced chemical vapor deposition (PECVD) can be used to deposit hydrogenated amorphous silicon layer 200. PECVD has a low base temperature, fast deposition rate, and good film quality, which helps to reduce production costs and improve production quality.

[0063] Specifically, in S200, a hydrogenated amorphous silicon layer 200 is deposited on one side surface of the substrate 100 through the reaction of silane and hydrogen, with the deposition conditions being SiH4+H2→a-Si:H.

[0064] The parameters of the hydrogenated amorphous silicon layer 200 can be set according to actual needs. For example, the hydrogen content of the hydrogenated amorphous silicon layer 200 affects the amount of free hydrogen generated by the hydrogenated amorphous silicon layer 200 under laser irradiation, thereby affecting the number of voids 210 generated inside the hydrogenated amorphous silicon layer 200. If the number of voids 210 is too small, the effect of increasing the contact area between the stripping liquid 600 and the soluble adhesive layer 300 may be poor. The hydrogen content of the hydrogenated amorphous silicon layer 200 can be set to 5% to 20% to ensure that the hydrogenated amorphous silicon layer 200 can generate enough free hydrogen under laser irradiation in step S500, thereby generating enough voids 210; refer to Figure 3 If the thickness h of the hydrogenated amorphous silicon layer 200 is too large, the voids 210 generated by the hydrogen explosion phenomenon may not be able to penetrate the hydrogenated amorphous silicon layer 200, thus resulting in poor effect on increasing the contact area between the stripping liquid 600 and the soluble adhesive layer 300. The thickness h of the hydrogenated amorphous silicon layer 200 can be set to 2nm to 10nm to ensure that the voids 210 generated by the hydrogen explosion phenomenon can penetrate the hydrogenated amorphous silicon layer 200, so that the soluble adhesive layer 300 can be exposed at the voids 210, thereby increasing the contact area between the stripping liquid 600 and the soluble adhesive layer 300.

[0065] The material of the soluble adhesive layer 300 should be selected to be able to bond to the hydrogenated amorphous silicon layer 200 and be soluble in a certain solvent. The release liquid 600 should be selected to be a liquid that can dissolve the soluble adhesive layer 300. Specifically, the material of the soluble adhesive layer 300 is an acrylic resin or a phenolic resin, and the release liquid 600 is an organic alkaline solution.

[0066] Reference Figure 2 The packaging steps in the S400 process include the following steps:

[0067] S410, an adhesive layer 410 is covered on the side of the soluble adhesive layer 300 away from the carrier substrate 100, and the adhesive layer 410 is not easily soluble in the release liquid 600.

[0068] S420, the chip 420 is attached to the side of the adhesive layer 410 away from the soluble adhesive layer 300;

[0069] S430, a redistribution layer 430 is formed on the side of the adhesive layer 410 away from the soluble adhesive layer 300, so that the redistribution layer 430 is electrically connected to the chip 420.

[0070] S440, covering the side of the redistribution layer 430 away from the adhesive layer 410 with a molding compound 440;

[0071] S450, a solder bump 450 is made on the side of the molding compound 440 away from the redistribution layer 430, so that the solder bump 450 is electrically connected to the redistribution layer 430.

[0072] Reference Figure 5 The above steps can form multiple interconnected packaging structures 400 at once, resulting in high production efficiency.

[0073] To prevent the adhesive layer 410 from dissolving in step S700, the material of the adhesive layer 410 must be selected to be insoluble in the stripping solution 600. Specifically, the material of the adhesive layer 410 is epoxy resin or polyethylene terephthalate.

[0074] The packaging structure 400 provided in the second aspect embodiment of the present invention is manufactured by the packaging structure manufacturing method provided in any embodiment of the first aspect of the present invention. The packaging structure 400 manufactured by the packaging structure manufacturing method provided in any embodiment of the first aspect of the present invention has high production efficiency, which helps to reduce production costs.

[0075] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A method for manufacturing a packaging structure, characterized in that, Including the following steps: Prepare the substrate; A hydrogenated amorphous silicon layer is coated on one side surface of the carrier substrate; A soluble adhesive layer is applied to the side of the hydrogenated amorphous silicon layer away from the carrier substrate. An encapsulation step is performed on the side of the soluble adhesive layer away from the hydrogenated amorphous silicon layer to form multiple interconnected encapsulation structures on the side of the soluble adhesive layer away from the hydrogenated amorphous silicon layer. The side of the carrier substrate away from the hydrogenated amorphous silicon layer is irradiated with a laser to create a gap between the hydrogenated amorphous silicon layer and the soluble adhesive layer. The assembly of multiple interconnected packaging structures with the carrier substrate, the hydrogenated amorphous silicon layer, and the soluble adhesive layer is divided to form multiple separate packaging units, each of which includes one of the packaging structures. The encapsulation unit is placed in a release solution, which dissolves the soluble adhesive layer in the release solution, thereby allowing the encapsulation structure to detach from the carrier substrate.

2. The packaging structure manufacturing method according to claim 1, characterized in that, The step of covering one side surface of the carrier substrate with a hydrogenated amorphous silicon layer includes the following steps: The hydrogenated amorphous silicon layer is deposited on one side surface of the carrier substrate by vapor deposition.

3. The packaging structure manufacturing method according to claim 2, characterized in that, The deposition of the hydrogenated amorphous silicon layer on one side surface of the carrier substrate by vapor deposition includes the following steps: The hydrogenated amorphous silicon layer is deposited on one side surface of the carrier substrate by the reaction of silane with hydrogen.

4. The packaging structure manufacturing method according to claim 1, characterized in that, The hydrogen content of the hydrogenated amorphous silicon layer is 5% to 20%.

5. The packaging structure manufacturing method according to claim 1, characterized in that, The thickness of the hydrogenated amorphous silicon layer is 2 nm to 10 nm.

6. The method for manufacturing the packaging structure according to claim 1, characterized in that, The soluble adhesive layer is made of acrylic resin or phenolic resin, and the release solution is an organic alkaline solution.

7. The method for manufacturing the packaging structure according to claim 1, characterized in that, The packaging step includes the following steps: An adhesive layer is applied to the side of the soluble adhesive layer away from the carrier substrate, and the adhesive layer is not easily soluble in the release solution; A wafer is attached to the side of the adhesive layer away from the soluble adhesive layer; A redistribution layer is formed on the side of the adhesive layer away from the soluble adhesive layer, so that the redistribution layer is electrically connected to the wafer; A molding layer is applied to the side of the redistribution layer away from the adhesive layer; Solder bumps are formed on the side of the molding layer away from the redistribution layer, so that the solder bumps are electrically connected to the redistribution layer.

8. The method for manufacturing the packaging structure according to claim 7, characterized in that, The adhesive layer is made of epoxy resin or polyethylene terephthalate.

9. The method for manufacturing the packaging structure according to claim 1, characterized in that, The laser is an ultraviolet laser.

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