A power module and an energy storage converter

Abstract

The present invention provides a power module and an energy storage converter, relating to the technical field of energy storage converters. The power module includes: a liquid cooling plate having first, second, third, and fourth sides; a power semiconductor module disposed on the third side of the liquid cooling plate and having a heat dissipation substrate connected to the liquid cooling plate; a drive board disposed on the third side of the liquid cooling plate and connected to the power semiconductor module; a first copper busbar having one end connected to the power semiconductor module and the other end formed with an AC side interface, and the AC side interface is disposed on the first side of the liquid cooling plate; a stacked busbar including: a first section disposed on the third side of the liquid cooling plate and having one end connected to the power semiconductor module; a second section disposed on the second side of the liquid cooling plate and having one end connected to the other end of the first section; a third section disposed on the fourth side of the liquid cooling plate and having one end connected to the other end of the second section, and the other end of the third section is formed with a DC side interface, and the DC side interface is disposed on the first side of the liquid cooling plate; and a capacitor bank disposed on the fourth side of the liquid cooling plate and connected to the third section.

Description

Technical Field

[0001] The present invention relates to the technical field of energy storage converters, and in particular to a power module and an energy storage converter. Background Art

[0002] At present, the power density of mainstream rack-mounted energy storage inverters on the market is not very high, and their power modules are mostly designed in large sizes. With the widespread application of integrated energy storage systems, the space provided for energy storage inverters is getting smaller and smaller, and higher requirements are placed on unit energy density. For energy storage inverters, the size of the power module is large, and the space may be further compressed. It is urgent to develop a power module with a compact structure and high power density. Summary of the invention

[0003] In order to solve or improve the technical problem that the traditional power module structure is not compact enough and the power density is not high, an object of the present invention is to provide a power module.

[0004] Another object of the present invention is to provide an energy storage converter having the above power module.

[0005] To achieve the above-mentioned purpose, the first aspect of the present invention provides a power module, comprising: a liquid cooling plate, the liquid cooling plate having a first side and a second side arranged oppositely along a first direction, the liquid cooling plate having a third side and a fourth side arranged oppositely along a second direction, the second direction being perpendicular to the first direction, the liquid cooling plate having a liquid cooling interface, the liquid cooling interface being arranged on the first side of the liquid cooling plate; a power semiconductor module being arranged on the third side of the liquid cooling plate, the power semiconductor module being connected to the liquid cooling plate; a driving plate being arranged on the third side of the liquid cooling plate, the side of the power semiconductor module close to the liquid cooling plate having a heat dissipation substrate, the heat dissipation substrate being connected to the liquid cooling plate; a driving plate being arranged on the third side of the liquid cooling plate, the driving plate and the power semiconductor module being away from the heat dissipation substrate The first copper bar is connected to one side of the plate; a first copper bar, one end of the first copper bar is connected to the power semiconductor module, the other end of the first copper bar is formed with an AC side interface, and the AC side interface is arranged on the first side of the liquid cooling plate; a laminated busbar, comprising: a first section, which is arranged on the third side of the liquid cooling plate, one end of the first section is connected to the power semiconductor module; a second section, which is arranged on the second side of the liquid cooling plate, one end of the second section is connected to the other end of the first section; a third section, which is arranged on the fourth side of the liquid cooling plate, one end of the third section is connected to the other end of the second section, the other end of the third section is formed with a DC side interface, and the DC side interface is arranged on the first side of the liquid cooling plate; a capacitor group, which is arranged on the fourth side of the liquid cooling plate, and the capacitor group is connected to the third section of the laminated busbar.

[0006] According to the technical solution of the power module provided by the present invention, by arranging the power semiconductor module on the third side of the liquid cooling plate, the capacitor group on the fourth side of the liquid cooling plate, the AC side interface and the DC side interface on the first side of the liquid cooling plate, and the laminated busbars are sequentially wound around the third side, the second side and the fourth side of the liquid cooling plate, on the one hand, the spatial layout of the power module can be optimized, and the various structures and the various components are more compact, which is beneficial to reducing the overall volume of the power module and improving the power density per unit volume; on the other hand, the heat exchange capacity of the liquid cooling plate can be fully utilized to ensure that the various structures or various components of the power module operate at an appropriate temperature, which is beneficial to extending the service life.

[0007] Specifically, the power module includes a liquid cooling plate, a power semiconductor module, a driving plate, a first copper busbar, a laminated busbar and a capacitor group. Among them, the liquid cooling plate has a first side and a second side arranged oppositely along a first direction. The liquid cooling plate has a third side and a fourth side arranged oppositely along a second direction. The second direction is perpendicular to the first direction. Optionally, the first direction of the liquid cooling plate is the length direction or the width direction of the liquid cooling plate. Optionally, the second direction of the liquid cooling plate is the thickness direction of the liquid cooling plate. The liquid cooling plate has a liquid cooling interface. The liquid cooling interface is arranged on the first side of the liquid cooling plate. Optionally, the number of liquid cooling interfaces is two, one of which is an inlet side interface and the other is an outlet side interface. By setting the liquid cooling interface, the coolant can enter the liquid cooling plate from the inlet side interface under the drive of the external cooling system, absorb the heat conducted from the power semiconductor module or other components on the liquid cooling plate, and then flow out from the outlet side interface. The liquid cooling plate is mainly used to cool the power semiconductor module and to cool other surrounding components.

[0008] Further, the power semiconductor module is arranged on a third side of the liquid cooling plate. Optionally, the power semiconductor module is arranged on one side in the thickness direction of the liquid cooling plate. A heat dissipation substrate is provided on the side of the power semiconductor module close to the liquid cooling plate. The heat dissipation substrate is connected to the liquid cooling plate. The heat dissipated by the power semiconductor module is heat exchanged with the liquid cooling plate through the heat dissipation substrate at the bottom. Optionally, the heat dissipation substrate of the power semiconductor module is in contact with the liquid cooling plate using a thermally conductive material.

[0009] Further, the driving board is arranged on the third side of the liquid cooling plate. The driving board is connected to the side of the power semiconductor module away from the heat dissipation substrate. Optionally, the driving board is connected to the pins on the top of the power semiconductor module.

[0010] Furthermore, one end of the first copper bar is connected to the power semiconductor module. The other end of the first copper bar is formed with an AC side interface. The AC side interface is arranged on the first side of the liquid cooling plate.

[0011] Further, the stacked busbar includes a first section, a second section, and a third section. Specifically, the first section is disposed on the third side of the liquid cooling plate. One end of the first section is connected to the power semiconductor module. The second section is disposed on the second side of the liquid cooling plate. One end of the second section is connected to the other end of the first section, that is, one end of the second section is connected to the end of the first section far from the power semiconductor module. The third section is disposed on the fourth side of the liquid cooling plate. One end of the third section is connected to the other end of the second section, that is, one end of the third section is connected to the end of the second section far from the first section. The other end of the third section (the end of the third section far from the second section) is formed with a DC side interface. The DC side interface is disposed on the first side of the liquid cooling plate. The stacked busbar is wound around the second side, the third side, and the fourth side of the liquid cooling plate, and the heat generated by the stacked busbar can be exchanged with the liquid cooling plate through natural convection of air to ensure the working performance of the stacked busbar. The stacked busbar is also called a composite busbar, a laminated busbar, a laminated busbar row, or a composite copper row, and is a connecting row with a multi-layer composite structure.

[0012] Further, the capacitor bank is disposed on the fourth side of the liquid cooling plate. The capacitor bank is connected to the third section. The heat generated by the capacitor bank can be exchanged with the liquid cooling plate through natural convection of air to ensure the working performance of the capacitor bank. By setting the capacitor bank, the DC voltage can be stabilized and the voltage fluctuation on the DC side can be reduced. In addition, since both the AC side interface and the DC side interface are disposed on the first side of the liquid cooling plate, the liquid cooling plate can also cool the AC side interface and the DC side interface. Usually, sufficient space needs to be reserved for assembly operations for various interfaces. Therefore, in order to reduce the operation space of the cabinet, the AC side interface, the DC side interface of the power module, and the liquid cooling interface of the liquid cooling plate are all disposed on the first side of the liquid cooling plate, and this design method can maximize the utilization of the space of the cabinet.

[0013] In the technical solution defined by the present invention, by disposing the power semiconductor module on the third side of the liquid cooling plate, the capacitor bank on the fourth side of the liquid cooling plate, the AC side interface and the DC side interface on the first side of the liquid cooling plate, and the stacked busbar is sequentially wound around the third side, the second side, and the fourth side of the liquid cooling plate. On the one hand, the space layout of the power module can be optimized, and the structures and components are more compact, which is beneficial to reducing the overall volume of the power module and increasing the power density per unit volume. On the other hand, the heat exchange capacity of the liquid cooling plate can be fully utilized to ensure that each structure or component of the power module works at an appropriate temperature, which is beneficial to extending the service life.

[0014] In addition, the above technical solution provided by the present invention may also have the following additional technical features:

[0015] In the above technical solution, it further includes: a heat conduction layer disposed between the heat dissipation substrate of the power semiconductor module and the liquid cooling plate.

[0016] In this technical solution, the power module further includes a heat-conducting layer. Specifically, the heat-conducting layer is disposed between the heat dissipation substrate of the power semiconductor module and the liquid-cooling plate. By providing the heat-conducting layer, the minute gap between the heat dissipation substrate of the power semiconductor module and the liquid-cooling plate can be filled, further improving the heat exchange efficiency. Optionally, the heat-conducting layer is made of materials such as silicone grease for filling the gap between the heat dissipation substrate and the liquid-cooling plate.

[0017] In the above technical solution, it further includes: a current sensor, and the first copper bar passes through the current sensor.

[0018] In this technical solution, the power module further includes a current sensor. Specifically, the first copper bar passes through the current sensor. The current sensor is used to obtain the current value of the AC side interface.

[0019] In the above technical solution, it further includes: an absorption capacitor, which is connected to the first section, and the absorption capacitor is connected to the power semiconductor module.

[0020] In this technical solution, the power module further includes an absorption capacitor. Specifically, the absorption capacitor is connected to the first section of the laminated busbar. The absorption capacitor is connected to the power semiconductor module. The absorption capacitor functions like a low-pass filter in the circuit and can absorb the spike voltage.

[0021] In the above technical solution, the absorption capacitor is disposed on the third side of the liquid-cooling plate. The maximum distance between the laminated busbar and the liquid-cooling plate in the second direction is the first distance, and the maximum distance between the absorption capacitor and the liquid-cooling plate in the second direction is the second distance. The first distance is not greater than the second distance.

[0022] In this technical solution, by disposing the absorption capacitor on the third side of the liquid-cooling plate, the heat generated by the absorption capacitor can be exchanged with the liquid-cooling plate through the natural convection of air to ensure the working performance of the absorption capacitor. Optionally, the absorption capacitor is disposed at a position on the third side of the liquid-cooling plate close to the second side.

[0023] In this technical solution, by disposing the absorption capacitor on the third side of the liquid-cooling plate, the heat generated by the absorption capacitor

[0024] can be heat-exchanged with the liquid-cooling plate through the natural convection of air to ensure the working performance of the absorption capacitor. Optionally, the absorption capacitor is disposed at a position on the third side of the liquid-cooling plate close to the second side.

[0025] In addition, the maximum distance between the laminated busbar and the liquid-cooling plate in the second direction is not greater than the maximum distance between the absorption capacitor and the liquid-cooling plate in the second direction, which is the second distance, ensuring that the rear side (one side in the second direction) of the power module can maintain the minimum distance from the cabinet, and the structures and components are

[0026] more compact, which is beneficial to reducing the overall volume of the power module and improving the power density per unit volume. In the above technical solution, the heat dissipation substrate and the liquid-cooling plate are connected by a first connecting member.

[0027] In this technical solution, by providing a first connecting member, a detachable connection between the heat dissipation substrate of the power semiconductor module and the liquid cooling plate can be achieved, facilitating the disassembly and assembly of the power semiconductor module by the staff. Optionally, the first connecting member is a screw.

[0028] In the above technical solution, the number of power semiconductor modules is at least one.

[0029] In this technical solution, by setting the number of power semiconductor modules to be at least one, that is, the power semiconductor module can be one, two, or more. Considering factors such as occupied space size, cost, and other factors, the power semiconductor module can be flexibly set according to actual needs. Optionally, when the number of power semiconductor modules is two or more, the power semiconductor modules are connected in parallel.

[0030] In the above technical solution, the angle between the second segment and the first segment is 85 degrees to 95 degrees.

[0031] In this technical solution, by setting the angle between the second segment and the first segment to 85 degrees to 95 degrees, the bending and commutation of the laminated busbar can be achieved, which is beneficial to reducing the occupied space size of the laminated busbar and facilitating the connection of different components. Optionally, the angle between the first segment and the second segment is 90 degrees, that is, the first segment and the second segment are perpendicular to each other.

[0032] In the above technical solution, the angle between the third segment and the second segment is 85 degrees to 95 degrees.

[0033] In this technical solution, by setting the angle between the third segment and the second segment to 85 degrees to 95 degrees, the bending and commutation of the laminated busbar can be achieved, which is beneficial to reducing the occupied space size of the laminated busbar and facilitating the connection of different components. Optionally, the angle between the second segment and the third segment is 90 degrees, that is, the second segment and the third segment are perpendicular to each other.

[0034] The second aspect of the present invention provides a power conversion system for energy storage, including: a cabinet; the power module in any of the above technical solutions, which is arranged in the cabinet and connected to the cabinet.

[0035] According to the technical solution of the power conversion system for energy storage of the present invention, the power conversion system for energy storage includes a cabinet and the power module in any of the above technical solutions. The power module is arranged in the cabinet and connected to the cabinet. Compared with the traditional structure, the power conversion system for energy storage defined by the present invention has a more compact structure, a smaller volume, and a higher power density per unit volume.

[0036] Among them, since the power conversion system for energy storage includes any one of the power modules in the first aspect, it has the beneficial effects of any of the above technical solutions, which will not be elaborated here.

[0037] Additional aspects and advantages of the technical solution of the present invention will become apparent in the following description section or be learned through the practice of the present invention. Brief Description of the Drawings

[0038] Figure 1 The first schematic diagram of a power module according to an embodiment of the present invention is shown;

[0039] Figure 2 The second schematic diagram of a power module according to an embodiment of the present invention is shown;

[0040] Figure 3 The third schematic diagram of a power module according to an embodiment of the present invention is shown;

[0041] Figure 4 The fourth schematic diagram of a power module according to an embodiment of the present invention is shown;

[0042] Figure 5 The fifth schematic diagram of a power module according to an embodiment of the present invention is shown;

[0043] Figure 6 The sixth schematic diagram of a power module according to an embodiment of the present invention is shown;

[0044] Figure 7 The schematic diagram of a battery energy storage converter according to an embodiment of the present invention is shown.

[0045] Wherein, Figures 1 to 7 The corresponding relationship between the reference numerals in the drawings and the component names is as follows:

[0046] 100: Power module; 110: Liquid cooling plate; 111: First side; 112: Second side; 113: Third side; 114: Fourth side; 115: Liquid cooling interface; 120: Power semiconductor module; 124: Heat dissipation substrate; 130: Laminated busbar; 131: First section; 132: Second section; 133: Third section; 134: DC side interface; 140: Capacitor bank; 150: Snubber capacitor; 160: Current sensor; 171: First connecting member; 180: First copper bar; 181: AC side interface; 190: Driver board; 200: Battery energy storage converter; 210: Cabinet. Detailed Description of the Embodiments

[0047] In order to be able to more clearly understand the above-mentioned objects, features and advantages of the embodiments of the present invention, the embodiments of the present invention will be further described in detail below with reference to the drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0048] In the following description, many specific details are set forth in order to provide a thorough understanding of the present invention. However, embodiments of the present invention may be practiced in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the limitations of the specific embodiments disclosed below.

[0049] Reference will be made below Figures 1 to 7 to describe the power module 100 and the energy storage converter 200 provided according to some embodiments of the present invention.

[0050] In one embodiment according to the present invention, as Figure 1 、 Figure 2 、 Figure 3 and Figure 4 shown, the power module 100 includes a liquid cooling plate 110, a power semiconductor module 120, a drive board 190, a first copper bar 180, a stacked busbar 130, and a capacitor bank 140. Among them, the liquid cooling plate 110 has a first side 111 and a second side 112 that are oppositely arranged along a first direction. The liquid cooling plate 110 has a third side 113 and a fourth side 114 that are oppositely arranged along a second direction. The second direction is perpendicular to the first direction. Optionally, the first direction of the liquid cooling plate 110 is the length direction or the width direction of the liquid cooling plate 110. Optionally, the second direction of the liquid cooling plate 110 is the thickness direction of the liquid cooling plate 110. The liquid cooling plate 110 has a liquid cooling interface 115. The liquid cooling interface 115 is provided on the first side 111 of the liquid cooling plate 110. Optionally, the number of the liquid cooling interfaces 115 is two, one of the liquid cooling interfaces 115 is an inlet side interface, and the other liquid cooling interface 115 is an outlet side interface. By providing the liquid cooling interface 115, the coolant can enter the liquid cooling plate 110 from the inlet side interface under the drive of an external cooling system, absorb the heat conducted from the power semiconductor module 120 or other components on the liquid cooling plate 110, and then flow out from the outlet side interface. The liquid cooling plate 110 is mainly used to cool down the power semiconductor module and to cool down other surrounding components.

[0051] Further, as Figure 1 、 Figure 3 and Figure 4 shown, the power semiconductor module 120 is provided on the third side 113 of the liquid cooling plate 110. Optionally, the power semiconductor module 120 is provided on one side in the thickness direction of the liquid cooling plate 110. The side of the power semiconductor module 120 close to the liquid cooling plate 110 has a heat dissipation substrate 124. The heat dissipation substrate 124 is connected to the liquid cooling plate 110. The heat dissipated by the power semiconductor module 120 exchanges heat with the liquid cooling plate 110 through the heat dissipation substrate 124 at the bottom. Optionally, the heat dissipation substrate 124 of the power semiconductor module 120 is in contact with the liquid cooling plate 110 using a heat-conducting material.

[0052] Further, as Figure 1 、Figure 3 and Figure 4 As shown in Figure 4 , the drive board 190 is disposed on the third side 113 of the liquid cooling plate 110. The drive board 190 is connected to the side of the power semiconductor module 120 facing away from the heat dissipation substrate 124. Optionally, the drive board 190 is connected to the pins on the top of the power semiconductor module 120.

[0053] Further, as Figure 1 , Figure 5 and Figure 6 shown, one end of the first copper busbar 180 is connected to the power semiconductor module 120. An AC side interface 181 is formed at one end of the first copper busbar 180. The AC side interface 181 is disposed on the first side 111 of the liquid cooling plate 110.

[0054] Further, as Figure 3 and Figure 4 shown, the laminated busbar 130 includes a first section 131, a second section 132, and a third section 133. Specifically, the first section 131 is disposed on the third side 113 of the liquid cooling plate 110. One end of the first section 131 is connected to the power semiconductor module 120. The second section 132 is disposed on the second side 112 of the liquid cooling plate 110. One end of the second section 132 is connected to the other end of the first section 131, that is, one end of the second section 132 is connected to the end of the first section 131 away from the power semiconductor module 120. The third section 133 is disposed on the fourth side 114 of the liquid cooling plate 110. One end of the third section 133 is connected to the other end of the second section 132, that is, one end of the third section 133 is connected to the end of the second section 132 away from the first section 131. The other end of the third section 133 (the end of the third section 133 away from the second section 132) forms a DC side interface 134. The DC side interface 134 is disposed on the first side 111 of the liquid cooling plate 110. The laminated busbar 130 is wound around the second side 112, the third side 113, and the fourth side 114 of the liquid cooling plate 110. The heat generated by the laminated busbar 130 can be exchanged with the liquid cooling plate 110 through natural convection of air to ensure the working performance of the laminated busbar 130. The laminated busbar 130 is also called a composite busbar, a stacked busbar, a stacked busbar row, or a composite copper busbar, and is a connecting busbar with a multi-layer composite structure.

[0055] Further, the capacitor bank 140 is disposed on the fourth side 114 of the liquid cooling plate 110. The capacitor bank 140 is connected to the third section 133. The heat generated by the capacitor bank 140 can exchange heat with the liquid cooling plate 110 through natural convection of air to ensure the working performance of the capacitor bank 140. By arranging the capacitor bank 140, the DC voltage can be stabilized and the voltage fluctuation on the DC side can be reduced. In addition, since both the AC side interface 181 and the DC side interface 134 are disposed on the first side 111 of the liquid cooling plate 110, the liquid cooling plate 110 can also cool down the AC side interface 181 and the DC side interface 134. Usually, sufficient space needs to be reserved for the assembly operation of various interfaces. Therefore, in order to reduce the operation space of the cabinet 210, the AC side interface 181, the DC side interface 134 of the power module 100 and the liquid cooling interface 115 of the liquid cooling plate 110 are all disposed on the first side 111 of the liquid cooling plate 110. This design method can maximize the utilization of the space of the cabinet 210.

[0056] In the technical solution defined by the present invention, by disposing the power semiconductor module 120 on the third side 113 of the liquid cooling plate 110, the capacitor bank 140 on the fourth side 114 of the liquid cooling plate 110, the AC side interface 181 and the DC side interface 134 on the first side 111 of the liquid cooling plate 110, and the laminated busbar 130 is sequentially wound around the third side 113, the second side 112 and the fourth side 114 of the liquid cooling plate 110. On the one hand, the space layout of the power module 100 can be optimized, and the structures and components are more compact, which is beneficial to reducing the overall volume of the power module 100 and increasing the power density per unit volume. On the other hand, the heat exchange capacity of the liquid cooling plate 110 can be fully utilized to ensure that each structure or component of the power module 100 works at an appropriate temperature, which is beneficial to extending the service life.

[0057] In an embodiment according to the present invention, the power module 100 further includes a heat conducting layer. Specifically, the heat conducting layer is disposed between the heat dissipation substrate 124 of the power semiconductor module 120 and the liquid cooling plate 110. By arranging the heat conducting layer, the tiny gap between the heat dissipation substrate 124 of the power semiconductor module 120 and the liquid cooling plate 110 can be filled, and the heat exchange efficiency can be further improved. Optionally, the heat conducting layer is made of materials such as silicone grease for filling the gap between the heat dissipation substrate 124 and the liquid cooling plate 110.

[0058] Further, as Figure 3 and Figure 4 shown, the heat dissipation substrate 124 of the power semiconductor module 120 is connected to the liquid cooling plate 110 through a first connecting member 171. By arranging the first connecting member 171, the detachable connection between the heat dissipation substrate 124 of the power semiconductor module 120 and the liquid cooling plate 110 can be realized, which is convenient for the staff to disassemble and assemble the power semiconductor module 120. Optionally, the first connecting member 171 is a screw.

[0059] In one embodiment according to the present invention, as Figure 1 , Figure 3 and Figure 4 shown, the power module 100 further includes an absorption capacitor 150. Specifically, the absorption capacitor 150 is connected to the first section 131 of the laminated busbar 130. The absorption capacitor 150 is connected to the power semiconductor module 120. The absorption capacitor 150 functions as a low-pass filter in the circuit and can absorb the spike voltage.

[0060] Furthermore, the absorption capacitor 150 is disposed on the third side 113 of the liquid cooling plate 110. By disposing the absorption capacitor 150 on the third side 113 of the liquid cooling plate 110, the heat generated by the absorption capacitor 150 can exchange heat with the liquid cooling plate 110 through natural convection of air to ensure the working performance of the absorption capacitor 150. Optionally, the absorption capacitor 150 is disposed at a position on the third side 113 of the liquid cooling plate 110 close to the second side 112.

[0061] Furthermore, the maximum distance between the laminated busbar 130 and the liquid cooling plate 110 in the second direction is a first distance. The maximum distance between the absorption capacitor 150 and the liquid cooling plate 110 in the second direction is a second distance. The first distance is not greater than the second distance, and the maximum distance between the laminated busbar 130 and the liquid cooling plate 110 in the second direction is not greater than the maximum distance between the absorption capacitor 150 and the liquid cooling plate 110 in the second direction, which ensures that the rear side (one side in the second direction) of the power module 100 can maintain the minimum distance from the cabinet 210, and the structures and components are more compact, which is beneficial to reducing the overall volume of the power module 100 and increasing the power density per unit volume.

[0062] In one embodiment according to the present invention, as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 shown, the power module 100 further includes a current sensor 160. Specifically, the first copper bar 180 passes through the current sensor 160. The current sensor 160 is used to obtain the current value of the AC side interface 181.

[0063] In one embodiment according to the present invention, the number of the power semiconductor modules 120 is at least one. By setting the number of the power semiconductor modules 120 to be at least one, that is, the power semiconductor modules 120 can be one, two or more, considering the occupied space size, cost and other factors, the power semiconductor modules 120 can be flexibly set according to actual needs. Optionally, when the number of the power semiconductor modules 120 is two or more, the power semiconductor modules 120 are connected in parallel.

[0064] In an embodiment according to the present invention, the included angle between the second segment 132 and the first segment 131 is 85 degrees to 95 degrees. By setting the included angle between the second segment 132 and the first segment 131 to 85 degrees to 95 degrees, the bending and commutation of the stacked busbar 130 can be achieved, which is beneficial to reducing the occupied space of the stacked busbar 130 and facilitating the connection of different components. Optionally, the included angle between the first segment 131 and the second segment 132 is 90 degrees, that is, the first segment 131 and the second segment 132 are perpendicular to each other.

[0065] Furthermore, the included angle between the third segment 133 and the second segment 132 is 85 degrees to 95 degrees. By setting the included angle between the third segment 133 and the second segment 132 to 85 degrees to 95 degrees, the bending and commutation of the stacked busbar 130 can be achieved, which is beneficial to reducing the occupied space of the stacked busbar 130 and facilitating the connection of different components. Optionally, the included angle between the second segment 132 and the third segment 133 is 90 degrees, that is, the second segment 132 and the third segment 133 are perpendicular to each other.

[0066] In an embodiment according to the present invention, as Figure 7 shown, the energy storage converter 200 includes a cabinet 210 and the power module 100 in any of the above embodiments. The power module 100 is disposed in the cabinet 210. The power module 100 is connected to the cabinet 210. Compared with the traditional structure, the energy storage converter 200 defined by the present invention has a more compact structure, a smaller volume and a higher power density per unit volume.

[0067] According to the embodiments of the power module and the energy storage converter of the present invention, by disposing the power semiconductor module on the third side of the liquid cooling plate, the capacitor bank on the fourth side of the liquid cooling plate, the AC side interface and the DC side interface on the first side of the liquid cooling plate, and winding the stacked busbar around the second side, the third side and the fourth side of the liquid cooling plate, on the one hand, the spatial layout of the power module can be optimized, and the various structures and components are more compact, which is beneficial to reducing the overall volume of the power module and increasing the power density per unit volume; on the other hand, the heat exchange capacity of the liquid cooling plate can be fully utilized to ensure that the various structures or components of the power module work at an appropriate temperature, which is beneficial to extending the service life.

[0068] In the present invention, the terms "first", "second", "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "plural" means two or more, unless otherwise specifically defined. The terms "installed", "connected", "joined", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "joined" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0069] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0070] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0071] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A power module, characterized in that, include: A liquid cooling plate (110), the liquid cooling plate (110) having a first side (111) and a second side (112) arranged opposite to each other along a first direction, the liquid cooling plate (110) having a third side (113) and a fourth side (114) arranged opposite to each other along a second direction, the second direction being perpendicular to the first direction, the liquid cooling plate (110) having a liquid cooling interface (115), the liquid cooling interface (115) being arranged on the first side (111) of the liquid cooling plate (110); A power semiconductor module (120) is arranged on the third side (113) of the liquid cooling plate (110); a side of the power semiconductor module (120) close to the liquid cooling plate (110) has a heat dissipation substrate (124); the heat dissipation substrate (124) is connected to the liquid cooling plate (110); A driving plate (190) is provided on the third side (113) of the liquid cooling plate (110), the driving plate (190) being connected to a side of the power semiconductor module (120) facing away from the heat dissipation substrate (124); A first copper bar (180), one end of the first copper bar (180) being connected to the power semiconductor module (120), the other end of the first copper bar (180) being formed with an AC side interface (181), the AC side interface (181) being provided on the first side (111) of the liquid cooling plate (110); The laminated busbar (130) comprises: A first section (131) is provided on the third side (113) of the liquid cooling plate (110), and one end of the first section (131) is connected to the power semiconductor module (120); a second section (132) disposed on the second side (112) of the liquid cooling plate (110), one end of the second section (132) being connected to the other end of the first section (131); A third section (133) is arranged on the fourth side (114) of the liquid cooling plate (110), one end of the third section (133) is connected to the other end of the second section (132), a DC side interface (134) is formed at the other end of the third section (133), and the DC side interface (134) is arranged on the first side (111) of the liquid cooling plate (110); A capacitor group (140) is disposed on the fourth side (114) of the liquid cooling plate (110), and the capacitor group (140) is connected to the third section (133); The power module also includes: An absorption capacitor (150) connected to the first section (131), the absorption capacitor (150) being connected to the power semiconductor module (120); The absorption capacitor (150) is arranged on the third side (113) of the liquid cooling plate (110), the maximum distance between the laminated busbar (130) and the liquid cooling plate (110) in the second direction is a first distance, the maximum distance between the absorption capacitor (150) and the liquid cooling plate (110) in the second direction is a second distance, and the first distance is not greater than the second distance.

2. The power module according to claim 1, wherein Also includes: The heat conduction layer is disposed between the heat dissipation substrate (124) of the power semiconductor module (120) and the liquid cooling plate (110).

3. The power module according to claim 1, wherein It further includes: A current sensor (160), and the first copper busbar (180) passes through the current sensor (160).

4. The power module according to any one of claims 1 to 3, characterized in that, The power semiconductor module (120) and the liquid cooling plate (110) are connected by a first connecting member (171).

5. The power module according to any one of claims 1 to 3, characterized in that, The number of the power semiconductor modules (120) is at least one.

6. The power module according to any one of claims 1 to 3, characterized in that, The included angle between the second section (132) and the first section (131) is 85 degrees to 95 degrees.

7. The power module according to any one of claims 1 to 3, characterized in that The included angle between the third section (133) and the second section (132) is 85 degrees to 95 degrees.

8. A energy storage converter, characterized in that, It includes: A cabinet (210); The power module according to any one of claims 1 to 7, which is disposed in the cabinet (210), and the power module is connected to the cabinet (210).

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