Spring structure for PCB board patch process

Abstract

The present invention relates to the technical field of spring component manufacturing, and in particular to a spring structure for use in a PCB board patch process, comprising a patch component and a conductive component; the conductive component being electrically conductive; the conductive component comprising a spring portion and an integral patch portion, the patch portion being electrically connected to and fixed relative to the spring portion; the patch portion comprising a mounting section and a pin section fixedly connected to the mounting section, the pin section being used for soldering to a circuit board; the patch component comprising a mounting portion and an adsorbed portion connected to the mounting portion; the mounting portion being fixedly connected to the mounting section; the axis of the spring portion being parallel to the adsorbed portion, the pin section being substantially perpendicular to the adsorbed portion and facing away from the adsorbed portion. The present invention can achieve direct electrical connection between the circuit board and the spring portion, ensure the reliability of the electrical connection, increase the design freedom of the patch component, and facilitate production efficiency; it can also ensure adsorption stability and facilitate patching.

Description

Technical Field

[0001] The present invention relates to the technical field of spring component manufacturing, and in particular to a spring structure used in a PCB board patch process. Background Art

[0002] CN216671973U discloses a battery spring, which includes a spring terminal and a mounting carrier, wherein the spring terminal is connected to the mounting carrier; wherein the mounting carrier has a carrier matching portion, and the carrier matching portion is used for being adsorbed or clamped by an automatic removal device.

[0003] After the carrier base of the mounting carrier is soldered to the PCB5 circuit board, etc., the spring terminals and the PCB circuit board are made conductive. In other words, the conductive path is a path formed in sequence by the PCB circuit board, etc., the mounting carrier, and the spring terminals.

[0004] In summary, the existing technology has at least the following technical problems:

[0005] First, because the mounting carrier must be conductive, the materials used are greatly restricted. For example, the mounting carrier cannot be made of insulating materials such as plastic.

[0006] Second, there is the risk of poor contact between the mounting element and the spring terminal, affecting electrical conductivity. Although this risk can be reduced to some extent by increasing the holding force between the spring terminal and the mounting element through processes such as riveting, which will be described later, riveting and other processes still carry the risk of poor contact.

[0007] Third, during production, one mounting carrier needs to be matched with one spring terminal and then riveted and processed, which results in low production efficiency. Summary of the Invention

[0008] One purpose of the present invention is to solve or alleviate the above-mentioned first technical problem.

[0009] The means adopted by the present invention is a spring structure for PCB board patch process, which includes a patch process part and a conductive part; the conductive part has conductivity; the conductive part includes a spring part and an integrated patch part, the patch part is electrically connected to the spring part and fixed relative to the spring part; the patch part includes a mounting section and a pin section fixedly connected to the mounting section, the pin section is used for welding to the circuit board; the patch process part includes a mounting part and an adsorbed part connected to the mounting part; the mounting part is fixedly connected to the mounting section; the axis of the spring part is parallel to the adsorbed part, and the pin section is approximately perpendicular to the adsorbed part and faces away from the adsorbed part.

[0010] The effects achieved by the present invention are that it can realize direct electrical connection between the circuit board and the spring part, ensure the reliability of the electrical connection, improve the design freedom of the patch process parts, and be conducive to improving production efficiency; it can also ensure the stability of adsorption and facilitate patching.

[0011] A further technical solution also includes a circuit board with mounting holes, wherein the pin segment is U-shaped as a whole, and the U-shape includes a pin transverse segment and a pin vertical segment respectively located at both ends of the pin transverse segment, and the pin transverse segment is used for welding to the circuit board.

[0012] According to a further technical solution, the transverse section of the pin protrudes from the circuit board and is welded to the circuit board.

[0013] It can provide a solder creep path to ensure soldering effect.

[0014] According to a further technical solution, the vertical sections of the pins are elastic and respectively abut against the side walls of the positioning grooves.

[0015] It can ensure that the pin segments are firmly embedded in the mounting holes, and can ensure the welding quality.

[0016] According to a further technical solution, the patch component further includes a connecting portion, which is fixedly connected to the mounting portion and the adsorbed portion to form a clamping gap, and the mounting portion and the adsorbed portion clamp the mounting section.

[0017] A further technical solution is that the installation section includes an installation transverse section and an installation longitudinal section connected to the end of the installation transverse section, and the installation longitudinal section is fixedly connected to the pin section; the installation part, the connecting part, and the adsorbed part are fixedly connected in sequence, so that the cross-section of the installation part, the connecting part, and the adsorbed part is U-shaped as a whole.

[0018] The mounting section can be inserted into the clamping gap from the side opening of the patch component, making it easy to mount the patch component on the mounting section.

[0019] According to a further technical solution, one of the mounting portion and the adsorbed portion extends toward the other to form an anti-slip portion, the mounting transverse section abuts against the inner wall of the connecting portion, and the pin section abuts against the anti-slip portion.

[0020] It can prevent the patch workpiece from shaking back and forth relative to the installation section.

[0021] According to a further technical solution, a side portion of the mounting portion and / or a side portion of the adsorbed portion is provided with an elastic locking body, which abuts against the mounting longitudinal section so that the mounting portion and the adsorbed portion tend to approach each other.

[0022] It can ensure that the patch workpiece is firmly connected to the mounting section.

[0023] According to a further technical solution, elastic locking bodies are provided on both sides of the mounting portion and / or the adsorbed portion, both ends of the mounting transverse section are connected to the mounting longitudinal section, and the locking bodies respectively abut against the mounting longitudinal sections at both ends of the mounting transverse section.

[0024] It can ensure that both sides of the patch workpiece are locked and ensure that the adsorbed part will not be skewed.

[0025] According to a further technical solution, the patch component is made of a rectangular sheet, and the connecting portion and / or the anti-slip portion is fixedly provided with a positioning foot parallel to the vertical section of the pin, and the positioning foot is used to be inserted into the positioning groove of the circuit board.

[0026] It can ensure a stable connection between the patch parts and the circuit board; it can also simplify the process and reduce costs.

[0027] In summary, the present invention can achieve the following technical effects:

[0028] 1} It can realize direct electrical connection between the circuit board and the spring part, ensure the reliability of the electrical connection, improve the design freedom of the patch process parts, and help improve production efficiency; it can also ensure the stability of adsorption and facilitate patching.

[0029] 2} The mounting section can be inserted into the clamping gap from the side opening of the patch component, making it easy to install the patch component on the mounting section.

[0030] 3} It can ensure that the patch process parts are firmly connected to the installation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a three-dimensional schematic diagram of the spring structure used in the PCB board patch process according to the first embodiment.

[0032] Figure 2 It is another three-dimensional schematic diagram of the spring structure used in the PCB board patch process of the first embodiment.

[0033] Figure 3 It is a three-dimensional exploded schematic diagram of the spring structure used in the PCB board patch process of the first embodiment.

[0034] Figure 4 1 is a top view of a spring structure used in a PCB board patch process according to the first embodiment.

[0035] Figure 5 It is a schematic diagram of a cross-section SEC1; the locking body 213 is in a locked state against the mounting longitudinal section 131.

[0036] Figure 6 1 is a schematic diagram of section 2 SEC2; the figure shows the circuit board 9 and the solder 8.

[0037] Figure 7 1 is a front view of the flattened patch component 2 of the first embodiment; the dotted line LINE1 represents a rough bending line; the two-dotted line LINE2 represents an imaginary boundary of the rectangular sheet 3.

[0038] Figure 8 FIG. 1 is a front view schematic diagram of a conductive member 1 according to the second embodiment.

[0039] Figure 9 FIG. 1 is a schematic side view of the conductive member 1 of the second embodiment.

[0040] Figure 10 FIG. 1 is a schematic diagram of a conductive member 1 according to a third embodiment.

[0041] Section 1 SEC1; Section 2 SEC2; Line 1 LINE1; Line 2 LINE2; Conductive part 1; SMD part 11; Pin section 12; Pin transverse section 121; Pin vertical section 122; Pin extension section 123; Mounting section 13; Mounting longitudinal section 131; Mounting transverse section 132; Spring extension section 18; Spring part 19; SMD component 2; Mounting part 21; Clamping gap 211; Pin groove 212; Locking body 213; Pin groove side wall 214; Connecting part 22; Connecting part forming groove 221; Adsorbed part 23; Anti-slip part 24; Positioning foot 29; Rectangular sheet 3; Solder 8; Circuit board 9; Mounting hole 91; Pad 92; Positioning groove 99. DETAILED DESCRIPTION

[0042] The specific embodiments of the present invention will be described below with reference to the accompanying drawings.

[0043] The spring structure for PCB board patch process in the first embodiment includes a patch process component 2 and a conductive component 1.

[0044] The conductive part 1 is conductive; the conductive part 1 includes a spring portion 19 and an integral patch portion 11, and the patch portion 11 is electrically connected to the spring portion 19 and fixed relative to the spring portion 19. For example, the patch portion 11 is made of bent metal wire, so that the patch portion 11 is integrated. The spring portion 19 is elastic, such as a spiral spring, or a spring composed of multiple rings. Usually, the spring portion 19 is used to offset the motor of the No. 5 battery (not shown in the drawings) in the remote control to achieve electrical connection with the negative pole of the No. 5 battery in the remote control. The patch portion 11 includes a mounting section 13 and a pin section 12 fixedly connected to the mounting section 13, and the pin section 12 is used to be welded to the circuit board 9. For example, the patch portion 11 is made of bent metal wire and is conductive.

[0045] It's easy to understand that the lead segment 12 is electrically connected to the spring portion 19 and fixed relative to the spring portion 19. For example, the conductive member 1 also includes a conductive spring extension segment 18, the ends of which are integrally connected to the spring portion 19 and the lead segment 12, respectively. This secures the lead segment 12 relative to the spring portion 19 and electrically connects the two. Typically, when viewed along the axis of the spring portion 19, the patch portion 11 and the spring portion 19 are completely offset and have no overlapping portions.

[0046] The patch component 2 includes a mounting portion 21 and an adsorbed portion 23 connected to the mounting portion 21 .

[0047] The mounting portion 21 is fixedly connected to the mounting section 13. For example, the mounting portion 21 is a buckle structure, and the mounting portion 21 is snap-fitted to the mounting section 13 to achieve a fixed connection between the two.

[0048] The axis of the spring portion 19 is parallel to the adsorbed portion 23, and the pin segment 12 is substantially perpendicular to the adsorbed portion 23 and faces away from the adsorbed portion 23. Figure 4 As shown, the lead segment 12 is substantially perpendicular to the paper surface, the adsorbed portion 23 is substantially parallel to the paper surface, and the lead segment 12 is substantially perpendicular to the adsorbed portion 23 and faces away from the adsorbed portion 23 .

[0049] The working principle is that before use, the conductive part 1 and the patch process part 2 are placed in the material belt to achieve positioning and continuous feeding.

[0050] like Figure 6 As shown; when in use, the suction cup and other adsorption devices are driven to move by a moving device such as a three-axis manipulator, so that the suction cup and other adsorption devices are in contact with the adsorbed part 23 and adsorb the adsorbed part 23. After the conductive part 1 and the patch process part 2 are sucked up by the adsorbed part 23, the moving device such as the three-axis manipulator is moved until the pin segment 12 is facing the mounting hole 91 of the circuit board 9, and the pin segment 12 is inserted into the mounting hole 91 of the circuit board 9, and the pin segment 12 and the circuit board 9 are soldered by solder 8 to achieve a fixed connection and electrical connection between the circuit board 9 and the pin segment 12.

[0051] As can be seen from the above, a direct electrical connection between the circuit board 9 and the spring portion 19 can be achieved, ensuring the reliability of the electrical connection. Furthermore, the patch component 2 does not need to be conductive and can be made of an insulating material such as plastic, which increases the design freedom of the patch component 2. Furthermore, the patch components 2 can be mass-produced and mounted on the conductive component 1 in batches, eliminating the need to align each patch component 2 with each conductive component 1 and then perform other processes such as riveting, which helps improve production efficiency.

[0052] At the same time, since the axis of the spring portion 19 is parallel to the adsorbed portion 23, the pin segment 12 is approximately perpendicular to the adsorbed portion 23 and faces away from the adsorbed portion 23; when an adsorption device such as a suction cup approaches the adsorbed portion 23 and adsorbs the adsorbed portion 23, the spring portion 19 will not be compressed, which can prevent the adsorbed portion 23 from tilting after being compressed and making it difficult to be adsorbed by the suction cup, etc., thereby ensuring the stability of adsorption; at the same time, a moving device such as a three-axis manipulator moves until the pin segment 12 is facing the mounting hole 91 of the circuit board 9, as shown in FIG. Figure 5 As shown, the three-axis manipulator or other mobile device moves downward to ensure that the lead segment 12 is accurately inserted into the mounting hole 91 of the circuit board 9, facilitating patch placement. Of course, the angle between the lead segment 12 and the adsorbed portion 23 can also be set to a non-90-degree angle, which will weaken the adsorption stability and the effect of facilitating patch placement.

[0053] As one of the specific embodiments, it also includes a circuit board 9 provided with a mounting hole 91, and the pin segment 12 is U-shaped as a whole, and the U-shape includes a pin transverse segment 121 and a pin vertical segment 122 respectively located at both ends of the pin transverse segment 121. The pin transverse segment 121 is used for welding to the circuit board 9. The pin transverse segment 121 protrudes from the circuit board 9 and is welded to the circuit board 9. The protrusion can provide a solder climbing path to ensure the welding effect. Figure 5 As shown, the thick solid line represents the solder pad 92 of the circuit board 9 , and the pin transverse section 121 can be conveniently fixedly connected to the solder pad 92 through the solder 8 .

[0054] As one of the specific implementations, the pin vertical sections 122 are elastic and respectively abut against the side walls of the positioning grooves 99. Figure 5 As shown, the two vertical pin segments 122 respectively have side walls on the left and right sides of the positioning groove 99 and undergo elastic deformation, which can ensure that the pin segment 12 is firmly embedded in the mounting hole 91 and ensure that the pin segment 12 is fixed relative to the circuit board 9 during welding, thereby ensuring the welding quality.

[0055] As one of the specific embodiments, the patch component 2 also includes a connecting portion 22, which is fixedly connected to the mounting portion 21 and the adsorbed portion 23 to form a clamping gap 211. The mounting portion 21 and the adsorbed portion 23 clamp the mounting section 13, so that the patch component 2 is fixedly connected to the mounting section 13.

[0056] As one specific embodiment, the mounting portion 21 is provided with a pin groove 212, through which the pin segment 12 passes, thereby limiting or eliminating the left-right shaking of the SMD component 2 relative to the pin segment 12 (left-right shaking refers to moving back and forth along the pin transverse segment 121).

[0057] As one specific embodiment, the mounting section 13 includes a mounting transverse section 132 and a mounting longitudinal section 131 connected to the end of the mounting transverse section 132. The mounting longitudinal section 131 is fixedly connected to the pin section 12. The mounting portion 21, the connecting portion 22, and the adsorbed portion 23 are fixedly connected in sequence, so that the cross-section of the mounting portion 21, the connecting portion 22, and the adsorbed portion 23 is U-shaped as a whole. It is easy to understand that of the four sides of the patch component 2, except for the side where the connecting portion 22 is located, the other three sides are exposed. The mounting section 13 can be inserted into the clamping gap 211 from the side opening of the patch component 2, making it easy to install the patch component 2 on the mounting section 13.

[0058] As one specific embodiment, one of the mounting portion 21 and the adsorbed portion 23 extends toward the other to form a retaining portion 24. The mounting transverse section 132 abuts against the inner wall of the connecting portion 22, and the lead section 12 abuts against the retaining portion 24. This prevents the SMD component 2 from rocking back and forth relative to the mounting section 13 (rocking back and forth refers to moving back and forth along the mounting longitudinal section 131). It is easy to understand that slightly tilting the mounting portion 21 during assembly allows the mounting section 13 to enter the clamping gap 211.

[0059] As one specific embodiment, elastic locking bodies 213 are provided on the sides of the mounting portion 21 and / or the sides of the adsorbed portion 23. The locking bodies 213 abut against the mounting longitudinal section 131, causing the mounting portion 21 and the adsorbed portion 23 to move closer to each other, thereby ensuring a secure connection between the patch component 2 and the mounting section 13.

[0060] As one specific embodiment, elastic locking bodies 213 are provided on both sides of the mounting portion 21 and / or the adsorbed portion 23. The mounting transverse section 132 is connected to the mounting longitudinal section 131 at both ends, and the locking bodies 213 respectively abut against the mounting longitudinal sections 131 at both ends of the mounting transverse section 132. This ensures that both sides of the patch component 2 are locked and that the adsorbed portion 23 does not tilt (tilt refers to the non-parallelism between the plane of the adsorbed portion 23 and the plane of the mounting section 13).

[0061] As one of the specific embodiments, the bottom end of the pin vertical section 122 extends horizontally to form a pin extension section 123, and the pin extension section 123 is embedded in the clamping gap 211. It is easy to understand that the horizontal extension can be in a direction parallel to the pin transverse section 121, or in a direction perpendicular to the pin transverse section 121 or in other directions located in the horizontal plane. It can ensure that both sides of the patch process part 2 are locked and that the adsorbed portion 23 will not be skewed. For example, the bottom ends of the pin vertical section 122 extend in a direction away from and parallel to the pin transverse section 121 to form the pin extension section 123. The pin transverse section 121 and the pin vertical sections 122 at both ends are U-shaped as a whole and are located in the same plane as the pin extension section 123. Therefore, the pin extension section 123, the pin vertical section 122, and the pin transverse section 121 are a straight line when straightened. It is easy to understand that the pin transverse section 121 and the pin vertical sections 122 at both ends can be formed by one stamping, which can simplify the production process and reduce costs.

[0062] As one specific embodiment, the patch component 2 is made of a rectangular sheet 3. The connecting portion 22 and / or the anti-slip portion 24 are fixedly provided with positioning pins 29 parallel to the vertical pin segments 122. The positioning pins 29 are designed to be inserted into the positioning slots 99 of the circuit board 9. This ensures a secure connection between the patch component 2 and the circuit board 9. Furthermore, compared to positioning pins 29 provided on the mounting portion 21 or the adsorbed portion 23, the positioning pins 29 are formed simultaneously when the connecting portion 22 and / or the anti-slip portion 24 are bent, simplifying the process and reducing costs.

[0063] As one of the specific implementation methods, Figure 7 As shown, when the patch component 2 is unfolded, it is located in the same plane and has at least two sides that overlap with the two sides of the rectangle, so that the patch component 2 can be made of a rectangular sheet 3. For example, when the mounting portion 21, the connecting portion 22, the adsorbed portion 23, and the anti-slip portion 24 that are connected in sequence are unfolded, the two side edges of the adsorbed portion 23, the portion of the positioning foot 29 of the connecting portion 22, and the portion of the positioning foot 29 of the anti-slip portion 24 respectively overlap with the four sides of the rectangular sheet 3. Of course, only the two side edges of the adsorbed portion 23 can also overlap with the four sides of the rectangular sheet 3. The patch component 2 can be made of a continuous rectangular sheet 3 (in other words, the continuous rectangular sheet 3 is in the shape of a strip, such as a continuous rectangular sheet 3 is a metal strip) that is punched and sheared (for example, the portion corresponding to the connecting portion forming groove 221 is removed after punching) and bent, which facilitates mass production of the patch component 2.

[0064] Second embodiment and third embodiment.

[0065] The second and third embodiments differ from the first embodiment in spring portion 19. The second embodiment has a smaller pitch of spring portion 19, for example, the pitch of spring portion 19 is less than or equal to the diameter of the circular cross-section of spring portion 19. The third embodiment has a larger pitch of spring portion 19, for example, the pitch of spring portion 19 is greater than the diameter of the circular cross-section of spring portion 19. It will be readily understood that the shape of spring portion 19 can be modified as needed, as long as it provides elasticity and electrical conductivity.

[0066] The terms "first", "second", etc. used in the present invention do not indicate any order, quantity or importance, but are only used for distinction.

[0067] As used herein, the terms a, an, etc. do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item.

[0068] Terms indicating orientation or position used in the present invention, such as top, bottom, side, longitudinal, lateral, middle, center, outside, inside, horizontal, vertical, left, right, above, below, etc., are intended to reflect relative positions rather than absolute positions.

[0069] As used herein, terms such as "substantially," "entirely," "approximately," and "closely" are qualifiers intended to indicate that a characteristic exists but a certain degree of deviation is permitted. The amount of such deviation may vary depending on the specific context; for example, the specific context of dimensional deviation may include, but is not limited to, national standards for dimensional tolerances.

Claims

1. A spring structure for a PCB board patch process, comprising a patch process part (2) and a conductive part (1); the conductive part (1) is conductive; the conductive part (1) comprises a spring part (19) and an integrated patch part (11), the patch part (11) is electrically connected to the spring part (19) and is fixed relative to the spring part (19); and the spring structure is characterized in that: patch The part (11) includes a mounting section (13) and a pin section (12) fixedly connected to the mounting section (13), and the pin section (12) is used for welding with a circuit board (9); the patch process part (2) includes a mounting part (21) and an adsorbed part (23) connected to the mounting part (21); the mounting part (21) is fixedly connected to the mounting section (13); the axis of the spring part (19) is parallel to the adsorbed part (23), and the pin section (12) is substantially perpendicular to the adsorbed part (23) and faces away from the adsorbed part (23); and the circuit board (9) is also provided with a mounting hole (91), and the pin section (12) is U-shaped as a whole, and the U-shaped part includes The pin transverse section (121) comprises a pin transverse section (121) and a pin vertical section (122) respectively located at both ends of the pin transverse section (121), wherein the pin transverse section (121) is used for welding with a circuit board (9); the pin transverse section (121) protrudes from the circuit board (9) and is welded with the circuit board (9); the pin vertical section (122) is elastic and respectively abuts against the side walls of the positioning groove (99); the patch process part (2) also comprises a connecting portion (22), wherein the connecting portion (22) is respectively fixedly connected with the mounting portion (21) and the adsorbed portion (23) to form a clamping gap (211), and the mounting portion (21) and the adsorbed portion (23) clamp the mounting section (13).

2. The spring structure for PCB board patch process according to claim 1 is characterized in that: The mounting section (13) comprises a mounting transverse section (132) and a mounting longitudinal section (131) connected to an end of the mounting transverse section (132); the mounting longitudinal section (131) is fixedly connected to the pin section (12); the mounting portion (21), the connecting portion (22), and the adsorbed portion (23) are fixedly connected in sequence, so that the cross-section of the mounting portion (21), the connecting portion (22), and the adsorbed portion (23) is U-shaped as a whole.

3. The spring structure for PCB board patch process according to claim 2 is characterized in that: One of the mounting portion (21) and the adsorbed portion (23) extends toward the other to form an anti-slip portion (24); the mounting transverse section (132) abuts against the inner wall of the connecting portion (22); and the pin section (12) abuts against the anti-slip portion (24).

4. The spring structure for PCB board patch process according to claim 1 is characterized in that: The side of the mounting portion (21) and / or the side of the adsorbed portion (23) is provided with an elastic locking body (213), and the locking body (213) abuts against the mounting longitudinal section (131) so that the mounting portion (21) and the adsorbed portion (23) tend to approach each other.

5. The spring structure for PCB board patch process according to claim 4 is characterized in that: Elastic locking bodies (213) are provided on both sides of the mounting portion (21) and / or on both sides of the adsorbed portion (23); both ends of the mounting transverse section (132) are connected to the mounting longitudinal section (131); and the locking bodies (213) respectively abut against the mounting longitudinal sections (131) at both ends of the mounting transverse section (132).

6. The spring structure for PCB board patch process according to claim 2, characterized in that: The patch component (2) is made of a rectangular sheet (3); the connection portion (22) and / or the anti-slip portion (24) are fixedly provided with a positioning foot (29) parallel to the vertical section (122) of the pin; the positioning foot (29) is used to be inserted into a positioning groove (99) of a circuit board (9).

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