Display substrate, manufacturing method of display substrate, and display device

Abstract

The present disclosure provides a display substrate, a manufacturing method of the display substrate and a display device, and belongs to the technical field of display, comprising a hole region, a display region located at least one side of the hole region, and a transition region between the hole region and the display region; the display substrate comprises a light-emitting substrate and a first structure layer located at the light-emitting side of the light-emitting substrate, wherein the first structure layer located in the transition region and the first structure layer located in the display region have different structures and at least one same material.

Description

[0001] The present disclosure relates to the technical field of display, and in particular, to a display substrate, a manufacturing method of the display substrate, and a display device. BACKGROUND

[0002] With the development of display technology, there are active matrix organic light-emitting displays (hereinafter referred to as "OLEDs"), liquid crystal displays (hereinafter referred to as "LCDs"), and the like. With the rise of micro display devices, such as mobile phones, tablets, and the like, it is generally necessary to form some openings on the display panel to place small devices (such as cameras). SUMMARY

[0003] The present disclosure provides a display substrate, comprising: an aperture region, a display region located at least one side of the aperture region, and a transition region between the aperture region and the display region.

[0004] The display substrate comprises: a light-emitting substrate, and a first structure layer located on the light-emitting side of the light-emitting substrate, wherein the first structure layer located in the transition region has a different structure from the first structure layer located in the display region, and has at least one same material.

[0005] Optionally, the first structure layer located in the transition region has a stripe.

[0006] Optionally, the fluctuation amplitude of the part of the stripe close to the aperture region is greater than the fluctuation amplitude of the part away from the aperture region.

[0007] Optionally, the stripe comprises at least one of a transverse stripe, a wavy stripe, and a longitudinal stripe.

[0008] Optionally, the longitudinal stripe is close to the aperture region, the wavy stripe is distributed at one end of the longitudinal stripe away from the aperture region, and the transverse stripe is distributed at one end of the wavy stripe away from the aperture region.

[0009] Optionally, the stripe is distributed in a range greater than or equal to 2 nm and less than or equal to 3 nm from the side wall of the aperture region.

[0010] Optionally, the stripe is periodically arranged in the thickness direction of the first structure layer located in the transition region.

[0011] Optionally, the thickness of the first structure layer located in the transition region is different from the thickness of the first structure layer located in the display region.

[0012] Optionally, the thickness of the first structure layer located in the transition region is less than the thickness of the first structure layer located in the display region.

[0013] Optionally, a ratio of a thickness of the first structure layer located in the transition area to a thickness of the first structure layer located in the display area is less than or equal to 0.8.

[0014] Optionally, the first structure layer is configured to transmit light of a target waveband and to transmit or reflect circularly polarized light after converting linearly polarized light incident thereon into the circularly polarized light.

[0015] Optionally, the target waveband includes at least one of a red light waveband, a blue light waveband, and a green light waveband.

[0016] Optionally, the display substrate further includes a second structure layer located on a side of the first structure layer away from the base; the aperture area exposes side walls of the first structure layer and the second structure layer, and the exposed side walls are flush.

[0017] Optionally, the second structure layer is configured to reduce reflectivity of light entering the display substrate.

[0018] Optionally, the first structure layer is an organic composite film including a low-melting-point material.

[0019] Optionally, the transition area includes an isolation area and a peripheral area, wherein the peripheral area is disposed close to the aperture area, and the isolation area is disposed close to the display area.

[0020] The isolation area includes the base and at least one isolation column located above the base, the at least one isolation column surrounds part or all of the peripheral area to surround the aperture area.

[0021] Optionally, a normal projection of the first structure layer located in the transition area on the light-emitting substrate covers a normal projection of the isolation column on the light-emitting substrate.

[0022] Optionally, the light-emitting substrate located in the display area includes:

[0023] a base;

[0024] a pixel circuit layer disposed on a side of the base;

[0025] a planar layer disposed on a side of the pixel circuit layer away from the base;

[0026] an organic light-emitting layer disposed on a side of the planar layer away from the base;

[0027] an encapsulation layer disposed on a side of the organic light-emitting layer away from the base; and

[0028] a light-blocking layer disposed on a side of the encapsulation layer away from the base, and a normal projection of the light-blocking layer on the base is located in a non-pixel area of the organic light-emitting layer.

[0029] The first structure layer is located on a side of the light-shielding layer away from the substrate.

[0030] Optionally, in a normal direction of the light-emitting substrate, the hole region completely penetrates the display substrate or partially penetrates the display substrate.

[0031] The present disclosure also provides a preparation method of a display substrate, the method comprising:

[0032] providing a light-emitting substrate;

[0033] forming a first structure layer on a light-emitting side of the light-emitting substrate to obtain an initial substrate;

[0034] forming a hole region, a display region, and a transition region between the hole region and the display region by perforating the initial substrate to obtain a display substrate; wherein the first structure layer in the transition region and the first structure layer in the display region have different structures and at least one same material.

[0035] The present disclosure also provides a display device comprising the display substrate.

[0036] The display substrate comprises a hole region, a display region on at least one side of the hole region, and a transition region between the hole region and the display region; wherein the display substrate comprises a light-emitting substrate and a first structure layer on a light-emitting side of the light-emitting substrate; wherein the first structure layer in the transition region and the first structure layer in the display region have different structures and at least one same material.

[0037] Since the display substrate comprises a hole region and a transition region, the hole region can be used to place small devices, so that the display substrate can be applied to display devices that need to place small devices. In addition, since the first structure layer in the transition region and the first structure layer in the display region can have different structures, the first structure layer in the transition region can be more suitable for the hole region, that is, to meet the needs of perforation, and the first structure layer in the display region can be more suitable for the display region, thereby ensuring the display quality of the display region. In addition, since the first structure layer in the transition region and the second structure layer in the display region have at least one same material, the first structure layer can be formed in one process, thereby improving the production efficiency.

[0038] The above description is only a summary of the technical solutions of the present disclosure, in order to more clearly understand the technical means of the present disclosure, the specific embodiments of the present disclosure can be implemented according to the content of the specification, and in order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the following specific embodiments of the present disclosure are described. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the related art, the drawings needed to be used in the embodiments or the related art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor. It should be noted that the size and shape of the figures in the drawings do not reflect the true proportion, and the purpose is only to illustrate the content of the present application. The same or similar reference numerals in the drawings represent the same or similar elements or elements with the same or similar functions.

[0040] Figure 1 A top view of a display substrate in the related art is schematically shown;

[0041] Figure 2 A cross-sectional structure of the display substrate is schematically shown Figure 1

[0042] Figure 3 A cross-sectional structure of the display substrate in the related art is schematically shown;

[0043] Figure 4a A schematic view of the stripes in the first structure layer when viewing the transition area from the top is schematically shown;

[0044] Figure 4b A schematic view of the stripes in the first structure layer when viewing the transition area from the side is schematically shown;

[0045] Figure 5 A game picture of the first structure layer of the transition area in the side view direction is shown;

[0046] Figure 6 A flow chart of the steps of the manufacturing method of the display substrate of the present disclosure is schematically shown;

[0047] Explanation of reference numerals:

[0048] ​10 - substrate, 101 - display area, 102 - transition area, 1021 - isolation area, 1022 - peripheral area, 103 - hole area, 20 - pixel circuit layer, 21 - extension layer, 30 - planarization layer, 40 - organic light emitting layer, 50 - encapsulation layer, 601 - light shielding layer, 602 - optical bonding layer, 70 - connection layer, 80 - first structure layer, 90 - second structure layer, 401 - first electrode, 402 - pixel definition layer, 403 - organic material layer, 404 - second electrode, x10 - isolation column, x101 - first barrier, x102 - second barrier, x103 - first isolation column, x104 - second isolation column, x1031 - first composite layer, x1032 - first film layer, x1033 - second film layer, x1041 - second composite layer, x1042 - passivation layer, x1043 - boundary layer. DETAILED DESCRIPTION

[0049] To make the objects, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present disclosure.

[0050] With the application of display panels in various electronic devices, it is necessary to design a hole in the display panel to place a small device, such as a hole in the display screen of a mobile phone to place a front camera.

[0051] Therefore, the present application provides a display substrate, which can include a light emitting substrate, a first structure layer is formed on the light emitting side of the light emitting substrate, in order to realize the hole design without affecting the device of the display area when the hole is punched, the light emitting substrate can include a display area, a transition area and a hole area, and the first structure layer can include a structure layer located in the display area and a structure layer located in the transition area, so that the display substrate can place a small device, and the first structure layer located in the transition area forms a transition protection from the hole area to the display area.

[0052] Embodiment one

[0053] Referring to Figure 1 , Figure 2 and Figure 3 , Figure 1 shows a top view schematic diagram of the display substrate of the present application, Figure 2 shows a cross-sectional structure schematic diagram of the display substrate of the present application, Figure 3 shows a cross-sectional schematic diagram of the isolation column in the isolation area in the display substrate of the present application.

[0054] AsFigure 1 and Figure 2 As shown in FIG. 1, the display substrate of the present application comprises a hole region 103, a display region 101 located at at least one side of the hole region 103, and a transition region 102 located between the hole region 103 and the display region 101.

[0055] The display substrate comprises a light-emitting substrate and a first structure layer 8 located at the light-emitting side of the light-emitting substrate, wherein the first structure layer 80 located at the transition region 102 and the first structure layer 80 located at the display region 101 have different structures and at least one same material.

[0056] In the embodiment, the hole region 103 can refer to a region in which a hole has been formed for placing a small device, and the cross-sectional shape of the hole region 103 can be circular, square, rectangular, oval, etc., which is not limited herein; from the hole region 103 outward, the transition region 102 and the display region 101 can be sequentially arranged; as shown in FIG. 1, the display region 101 surrounds the transition region 102, and the transition region 102 surrounds part or all of the hole region 103, specifically, the transition region 102 is formed at at least one side of the periphery of the hole region 103, that is, the transition region 102 can partially surround the hole region 103 or completely surround the hole region 103. Figure 1 As shown in FIG. 1, the transition region 102 completely surrounds the hole region 103, while in other cases, the transition region 102 can surround part of the outer edge of the hole region 103; next, the display region 101 surrounds part or all of the transition region 102, as shown in FIG. 2, in the case that the transition region 102 completely surrounds the hole region 103, the display region 101 surrounds all of the transition region 102, of course, in other embodiments, in the case that the transition region 102 completely surrounds the hole region 103, the display region 101 can also surround part of the transition region 102, thus, as a whole, the display region 101 is located at at least one side of the hole region 103, that is, the display region 101 surrounds part or all of the hole region 103. Figure 1 Figure 1 The light-emitting substrate can be an OLED substrate, specifically, the structures of the light-emitting substrate in the hole region 103, the display region 101 and the transition region 102 can be different, that is, the structures of the light-emitting substrate located at the hole region 103, the light-emitting substrate located at the display region 101 and the light-emitting substrate located at the transition region 102 can be partially different, so as to fully adapt to the requirement of the display substrate to arrange the hole region 103.

[0057] The light-emitting substrate can be an OLED substrate, specifically, the structures of the light-emitting substrate in the hole region 103, the display region 101 and the transition region 102 can be different, that is, the structures of the light-emitting substrate located at the hole region 103, the light-emitting substrate located at the display region 101 and the light-emitting substrate located at the transition region 102 can be partially different, so as to fully adapt to the requirement of the display substrate to arrange the hole region 103.

[0058] ​Generally, the light-emitting substrate in the display area 101 needs to have a light-emitting device including pixel units required by the display panel, while the light-emitting substrate in the transition area 102 can not have a light-emitting device, but has structures required from the display area 101 to the hole area 103, such as the first structure layer 80 and the second structure layer 90 in the following embodiments, and in some embodiments, the light-emitting substrate in the transition area 102 can further include a spacer column x10 located in the transition area 102, which can act as a barrier wall between the hole area 103 and the display area 101 to protect the light-emitting device in the display area 101; and the light-emitting substrate in the hole area 103 can only include a substrate, or the light-emitting substrate in the hole area 103 is penetrated by the hole area 103 to form a hole.

[0059] For the light-emitting substrate, as shown in Figure 3 , the light-emitting substrate can include a substrate 20, a light-emitting device layer located on one side of the substrate, the substrate 20 covers the display area 101, the transition area 102 and the hole area 103, and the light-emitting device layer is located in the display area 101, that is, the projection of the light-emitting device layer on the substrate is located in the display area 101; wherein the first structure layer 80 is located on the side of the light-emitting device layer away from the substrate, and the first structure layer 80 includes a part located in the transition area 102 and a part located in the display area 101. As shown in Figure 3 , the light-emitting device can be an OLED device, which has the advantages of fast response speed, high luminous efficiency, high brightness and wide viewing angle. In some embodiments, the light-emitting device layer includes, from bottom to top, a pixel circuit layer 20, a planar layer 30 and an organic light-emitting layer 40; wherein the organic light-emitting layer 40 includes a series of functional layers, which can refer to the structure of the OLED device in related technologies.

[0060] The first structure layer 80 in the embodiment can be an organic structure layer, for example, a composite film using organic material. The material of the first structure layer 80 located in the display area 101 and the material of the first structure layer 80 located in the transition area 102 can be all the same, so that they can be formed in one process. Alternatively, the material of the first structure layer 80 located in the display area 101 and the material of the first structure layer 80 located in the transition area 102 can be partially the same, so that the functions of the first structure layer 80 in the display area 101 and in the transition area 102 are partially different, for example, the material of the first structure layer 80 located in the display area 101 can realize higher transmittance projection of light out of the display area 101, while the material of the first structure layer 80 located in the transition area 102 can reduce damage to the display area 101 when forming the hole area 103.

[0061] The first structure layer 80 in the transition area 102 can be different from the first structure layer 80 in the display area 101 in thickness or in topography or in both. The topography can be understood as the appearance or microstructure of the first structure layer 80. The microstructure can be observed by a microscope or a magnifying glass. In particular, when the first structure layer 80 in the transition area 102 is different from the first structure layer 80 in the display area 101 in structure, the first structure layer 80 in the transition area 102 can protect the first structure layer 80 in the display area 101 from being damaged when the hole area 103 is punched in the display substrate, thereby affecting the display quality of the display area 101.

[0062] The display substrate used in the present application has the hole area 103 and the transition area 102. Thus, the hole area 103 can be used to place small devices, so that the display substrate can be applied to display devices that need to place small devices. In addition, since the first structure layer 80 in the transition area 102 can be different from the first structure layer 80 in the display area 101 in structure, the first structure layer 80 in the transition area 102 can be more suitable for the hole area 103, that is, for the punching requirement, and the first structure layer 80 in the display area 101 can be more suitable for the display area 101, thereby ensuring the display quality of the display area 101. In addition, since the first structure layer 80 in the transition area 102 and the first structure layer 80 in the display area 101 have at least one same material, the first structure layer 80 can be formed in one process, thereby improving the production efficiency.

[0063] In some embodiments, the hole area 103 completely penetrates the display substrate or partially penetrates the display substrate in the normal direction of the display substrate. In particular, whether the hole area 103 is completely penetrated or not can be determined according to the small devices to be placed in the hole area 103. In particular, the hole area 103 completely penetrating the display substrate can mean that the hole area 103 penetrates the base layer of the display substrate, so that the hole area 103 is through from top to bottom. The hole area 103 partially penetrating the display substrate can mean that the hole area 103 does not penetrate the base layer of the display substrate, so that the hole area 103 is only open on the side of the first structure layer 80, and the bottom of the hole area 103 is formed on the side of the base. In this case, small devices such as cameras can be placed.

[0064] Regarding the material of the first structural layer 80, the material of the first structural layer 80 can be a low-melting-point material, such as an organic composite film comprising a low-melting-point material. In this case, the first structural layer 80 located in the transition region 102 and the first structural layer 80 located in the display region 101 can both be made of the same material, i.e., both are organic composite films of low-melting-point materials. Of course, in some examples, the first structural layer 80 located in the transition region 102 and the first structural layer 80 located in the display region 101 can both comprise organic composite films of low-melting-point materials, while the first structural layer 80 in the transition region 102 can also contain other materials, or the first structural layer 80 in the display region 101 can also contain other materials, such as materials that can enhance the transmittance of light emitted by the light-emitting substrate.

[0065] Specifically, the first structural layer 80 located in the transition region 102 and the first structural layer 80 located in the display region 101 may have different morphologies. In one example, the first structural layer 80 located in the transition region 102 has stripes, while the first structural layer 80 located in the display region 101 does not have stripes.

[0066] In some cases, the stripes can be distributed within the plane of the transition region 102 of the first structural layer 80, that is, when viewed from the plane direction of the transition region 102, stripes extending in the plane direction are formed in the transition region 102. There can be multiple stripes distributed along the plane direction, or multiple stripes can be distributed at intervals along the normal direction of the transition region 102, that is, the thickness direction of the first structural layer 80.

[0067] The size of the transition region 102 in the planar direction can be larger than the extension size of the stripes in the planar direction.

[0068] Reference Figure 4a As shown, a schematic diagram of the stripes in the first structural layer 80 when viewed from above in the transition zone 102 is presented. (Refer to...) Figure 4b As shown, a schematic diagram of the stripes in the first structural layer 80 when viewed from the side transition region 102 is presented.

[0069] like Figure 4a As shown, taking the circular hole region 103 as an example, the stripes extend in the planar direction in the first structural layer 80. The direction of extension can be radial, extending from the hole region 103 to the edge of the transition region 102. There can be multiple stripes extending in the planar direction in the first structural layer 80. The shape of each stripe can be roughly the same, or there may be some stripes with significantly different shapes.

[0070] like Figure 4bAs shown, the normal direction in the first structure layer 80, i.e. the thickness direction of the first structure layer 80, can be periodically distributed with a plurality of stripes, wherein the topography of each stripe can be substantially the same, or there can be some stripes with significantly different topography. The interval distance between the stripes can also be substantially the same.

[0071] Wherein the first structure layer 80 located in the transition area 102 can have more deformation space due to the presence of the stripes, thereby protecting the device from being damaged or interfered by excessive device placement force when placing a small device into the hole area 103.

[0072] In some examples, the distribution range of the stripes can be in a range greater than or equal to 2nm and less than or equal to 3nm from the sidewall of the hole area 103. For example, in the case of a circular hole area 103, the stripes in the transition area 102 can be distributed in a circular ring around the hole area 103, in which case the extension length of the stripes in the planar direction of the first structure layer 80 can also be considered to be in the range of 2nm to 3nm.

[0073] In yet other examples, the stripes are periodically arranged in the thickness direction of the first structure layer 80 located in the transition area 102. Referring to Figure 5 As shown, the first structure layer 80 of the transition area 102 is shown in the side view, as Figure 5 As shown, a plurality of stripes are distributed in the thickness direction of the first structure layer 80, and the distance between the stripes can be substantially the same, so it can be considered that they are periodically distributed in the thickness direction of the first structure layer 80.

[0074] The following describes several shapes of the stripes:

[0075] In some examples, based on the formation process of the hole area 103, the shape of the stripes can be that the fluctuation amplitude of the part close to the hole area 103 is greater than the fluctuation amplitude of the part away from the hole area 103. As Figure 5 As shown, Figure 5 As shown on the left side of the hole area 103, it can be seen that the fluctuation amplitude of the stripes near the hole area 103 is greater, and the fluctuation amplitude of the stripes away from the hole area 103 is smaller, and the farther away from the hole area 103, the stripes present a horizontal stripe topography. In this case, the stripes can generally be formed in the laser thermal cutting hole forming process, and the closer to the hole area 103, the higher the temperature, so the fluctuation amplitude of the stripes formed is greater.

[0076] In yet some examples, the stripes can include at least one of horizontal stripes, wavy stripes and vertical stripes. Among them, based on the forming process of the hole region 103, the stripes can also include only horizontal stripes, or only wavy stripes, or only vertical stripes; or include any two of horizontal stripes, wavy stripes and vertical stripes, or include all of horizontal stripes, wavy stripes and vertical stripes. As shown in FIG. 8, it is the case of including horizontal stripes, wavy stripes and vertical stripes. Figure 5

[0077] In other examples, in the case that the stripes include horizontal stripes, wavy stripes and vertical stripes, the vertical stripes are close to the hole region 103, the wavy stripes are distributed at one end of the vertical stripes away from the hole region 103, and the horizontal stripes are distributed at one end of the wavy stripes away from the hole region 103. That is, for a continuous stripe, the section away from the hole region 103 is horizontal, forming a horizontal stripe, the section close to the hole region 103 is vertical, forming a vertical stripe, and the section between the horizontal stripe and the vertical stripe is a wavy stripe.

[0078] Among them, for the structure of the first structure layer 80, in one example, the first structure layer 80 located at the transition region 102 has a different thickness from the first structure layer 80 located at the display region 101. When the thickness of the first structure layer 80 located at the transition region 102 is different from the thickness of the first structure layer 80 located at the display region 101, the opening requirement of the transition region 102 can be fully met.

[0079] In some examples, the thickness of the first structure layer 80 located at the transition region 102 can be less than the thickness of the first structure layer 80 located at the display region 101. Of course, in a more specific example, the ratio of the thickness of the first structure layer 80 located at the transition region 102 to the thickness of the first structure layer 80 located at the display region 101 is less than or equal to 0.8, and preferably can be 0.8.

[0080] Among them, when the thickness of the first structure layer 80 located at the transition region 102 is less than the thickness of the first structure layer 80 located at the display region 101, it can avoid the first structure layer from generating a larger excessive deformation when the hole region 103 is formed.

[0081] Next, the function of the first structure layer 80 is described.

[0082] In the present embodiment, the first structure layer 80 can be an optical adjustment layer, that is, used for optical gain of light emitted by the light-emitting substrate, for example, to improve the transmittance of light, thereby enhancing the light-emitting brightness of the display substrate and reducing power consumption.

[0083] ​In some embodiments, the first structure layer 80 can be configured to transmit light in a target waveband, and transmit or reflect linearly polarized light after being converted into circularly polarized light. The target waveband includes at least one of a red waveband, a green waveband, and a blue waveband.

[0084] Specifically, the first structure layer 80 can cover a red waveband of 590 nm to 650 nm, a green waveband of 500 nm to 570 nm, and a blue waveband of 420 nm to 480 nm. For the above wavebands, the first structure layer 80 can convert linearly polarized incident light into circularly polarized light, and convert incident circularly polarized light into linearly polarized light. For example, when light emitted by the light-emitting substrate reaches the first structure layer 80, about 50% of light in the target waveband is transmitted through the first structure layer 80 due to the difference in polarization state, and is converted into circularly polarized light. The remaining 50% of light is reflected and converted into circularly polarized light at the same time. The circularly polarized light transmitted through the first structure layer 80 and the circularly polarized light reflected by the first structure layer 80 have opposite polarization directions. The reflected circularly polarized light reaches the electrode layer in the light-emitting substrate, is reflected again, and is converted into light having the same polarization direction as the circularly polarized light transmitted through the first structure layer 80. The light can also be transmitted out of the light-emitting substrate, thereby achieving a light gain effect and improving display brightness. The power consumption of the display device can be reduced.

[0085] In some embodiments, as shown in FIG. 6, the display substrate can further include an anti-reflection layer configured to prevent reflection of light entering the display substrate, i.e., to reduce the reflectivity of light entering the display substrate. In this way, when external light shines on the display substrate, the display substrate can avoid being reflected and causing glare, which can affect the user's viewing of the display content of the display substrate. Figure 3

[0086] Specifically, the display substrate can further include a second structure layer 90 located on the side of the first structure layer 80 away from the substrate. The hole region 103 exposes the sidewalls of the first structure layer 80 and the second structure layer 90, and the exposed sidewalls are flush. The second structure layer 90 can also be referred to as an anti-reflection layer. In some examples, the second structure layer 90 can be implemented by a polarizing sheet.

[0087] In some examples, the orthographic projection of the first structure layer 80 on the light-emitting substrate can coincide with the orthographic projection of the second structure layer 90 on the light-emitting substrate, or the orthographic projection of the first structure layer 80 on the light-emitting substrate can be covered by the orthographic projection of the second structure layer 90 on the light-emitting substrate. Alternatively, the orthographic projection of the first structure layer 80 on the light-emitting substrate can cover the orthographic projection of the second structure layer 90 on the light-emitting substrate.

[0088] ​The structure of the first structure layer 80 can be different from the structure of the second structure layer 90, and the structure of the second structure layer 90 in the transition area 102 can also be different from the structure of the second structure layer 90 in the display area 101.

[0089] Specifically, the thickness of the second structure layer 90 in the transition area 102 can be different from the thickness of the second structure layer 90 in the display area 101. In this case, the thickness of the second structure layer 90 in the transition area 102 can be greater than the thickness of the second structure layer 90 in the display area 101. In this way, the display area 101 can be protected from the formation of the hole area 103 and the damage of the device placed in the hole area 103 to the display area 101.

[0090] Of course, the appearance of the second structure layer 90 in the transition area 102 can also be different from the appearance of the second structure layer 90 in the display area 101. In this case, the second structure layer 90 in the transition area 102 has a melting and carbonization appearance, and the second structure layer 90 in the display area 101 does not have a melting and carbonization appearance. This appearance feature can be formed during the formation of the hole area 103.

[0091] Specifically, as shown in FIG. 1B, the second structure layer 90 in the transition area 102 has a melting and carbonization appearance compared to the first structure layer 80. In this way, the second structure layer 90 can make the exposed film layer more flat, thereby facilitating the packaging of the packaging layer above the second structure layer 90. Figure 5

[0092] In some embodiments, to fully protect the display area 101 from the hole area 103, the transition area 102 can be provided with two areas, and the two areas together form two layers of protection from the hole area 103 to the display area 101, to form a gradient transition from the hole area 103 to the display area 101, to increase the protection effect on the display area 101.

[0093] Specifically, the transition area 102 can include an isolation area 1021 and a peripheral area 1022, wherein the peripheral area 1022 is arranged close to the hole area 103, and the isolation area 1021 is arranged close to the display area 101. In this way, the peripheral area 1022 can form the first layer of protection, and the isolation area 1021 can form the second layer of protection. The peripheral area 1022 can be located on at least one side of the hole area 103, and the isolation area 1021 can surround the peripheral area 1022, that is, the peripheral area 1022 is located between the isolation area 1021 and the hole area 103. In some examples, the peripheral area 1022 can surround the hole area 103, and the isolation area 1021 can surround the peripheral area 1022.

[0094] ​The structure of the isolation region 1021 can include a substrate, an isolation column x10 located above the substrate, the isolation column x10 surrounding part or all of the peripheral region 1022 to surround the hole region 103; wherein the orthographic projection of the first structure layer 80 located in the transition region 102 on the light-emitting substrate covers the orthographic projection of the isolation column x10 on the light-emitting substrate.

[0095] As shown in Figure 3 , the isolation column x10 is located in the isolation region 1021 and is spaced in the middle of the isolation region 1021 to surround the edge of the hole region 103 facing the display region 101, specifically, a plurality of isolation columns x10 can be formed, that is, a plurality of isolation columns x10 form a plurality of rings in the isolation region 1021, as shown in Figure 3 , there are a plurality of isolation columns x10 in the planar extension direction of the isolation region 1021, so that in the path from the hole region 103 to the display region 101, a plurality of isolation columns x10 will be passed through, and thus the plurality of isolation columns x10 can be passed through.

[0096] The isolation column x10 close to the display region 101 can be used to cut off the organic light-emitting material in the display region 101 to form a retaining wall to resist external water and oxygen, thereby improving the water and oxygen barrier performance of the display substrate; the isolation column x10 close to the peripheral region 1022 can be used to form protection from the hole region 103 to the display region 101 to protect the device in the display region 101.

[0097] The thickness of the isolation column x10 close to the display region 101 can be higher than the thickness of the isolation column x10 close to the peripheral region 1022. As shown in Figure 3 , that is, the distance from the surface of the isolation column x10 close to the display region 101 away from the substrate to the substrate is greater than the distance from the surface of the isolation column x10 close to the isolation region 1021 away from the substrate to the substrate.

[0098] For example, from close to the display region 101 to close to the peripheral region 1022, a plurality of rings of isolation columns x10 are formed, wherein for the two rings of isolation columns x10 close to the display region 101 (hereinafter referred to as retaining walls), the thickness of the first retaining wall closest to the display region 101 can be slightly smaller than the thickness of the other second retaining wall, and the remaining isolation columns x10 close to the peripheral region 1022 (hereinafter referred to as spacer columns), as shown in Figure 3 shows 3 rings of isolation columns x10, the thickness of which can be the same and smaller than the thickness of the retaining wall close to the display region 101.

[0099] The structures of the barrier walls (the first barrier wall and the second barrier wall) and the structures of the spacers can be different. In some examples, the spacers can include first spacers x103 and second spacers x104, and the structures of the first spacers x103 and the second spacers x104 can be different. The spacer closest to the peripheral area 1022 is the second spacer x104, and the remaining spacers are the first spacers x103.

[0100] The first spacers x103 can include a first composite layer x1031 formed on one side of the substrate, a first film layer x1032 located on the side of the first composite layer away from the substrate, and a second film layer x1033 located on the side of the first film layer away from the substrate. The two film layers of the second spacer x104 close to the substrate are made of the same material as the first composite layer and the first film layer of the first spacer x103 close to the substrate. The second spacer x104 can include a second composite layer x1041 and a passivation layer x1042 located on the side of the second composite layer x1041 away from the substrate.

[0101] As shown in FIG. 1, a boundary layer x1043 is further provided in the peripheral area 1022, and the boundary layer x1043 can be part of the second spacer x104 together with the passivation layer x1042. Figure 3

[0102] The materials of the first barrier wall and the second barrier wall can be the same as the material of the pixel definition layer 402 in the display area 101, so that the first barrier wall and the second barrier wall can be formed in one patterning process.

[0103] In the planar extension direction of the substrate, the distance between two adjacent spacers x103 can range from 8 μm to 10 μm. In an example, the distance between the first spacer x103 and the second spacer x104 is 9.2 μm.

[0104] The number of spacers x103 is not limited in the embodiments of the present application.

[0105] The first structure layer 80 is formed on the side of the spacer x103 away from the substrate, and the first structure layer 80 can cover the spacer x103 and the peripheral area 1022 in the orthographic projection of the substrate. In the case where the first structure layer 80 in the transition area 102 has a stripe, the stripe can cross the peripheral area 1022 to reach the isolation area 1021, or can be located only in the peripheral area 1022. In the display substrate, the structure of the peripheral area 1022 can include the substrate, the first structure layer 80, and the second structure layer 90.

[0106] The light-emitting substrate in the embodiments of the present application will be described below. As described above, the light-emitting substrate can be an OLED light-emitting substrate, and the light-emitting device can be an OLED device. As shown in FIG. 1, the light-emitting substrate can include a substrate 100, a first structure layer 80, a second structure layer 90, a pixel definition layer 402, a first barrier wall 401, a second barrier wall 402, and a plurality of spacers x103. Figure 3 ​As shown, the light-emitting substrate located in the display area 101 can include a substrate, a pixel circuit layer 20, a planar layer 30, an organic light-emitting layer 40, an encapsulation layer 50, and a light-shielding layer 601.

[0107] The pixel circuit layer 20 is arranged on one side of the substrate; the planar layer 30 is arranged on the side of the pixel circuit layer 20 away from the substrate; the organic light-emitting layer 40 is arranged on the side of the planar layer 30 away from the substrate, the encapsulation layer 50 is arranged on the side of the organic light-emitting layer 40 away from the substrate; the light-shielding layer 601 is arranged on the side of the encapsulation layer 50 away from the substrate, and the orthographic projection of the light-shielding layer 601 on the substrate is located in the non-pixel area of the organic light-emitting layer 40.

[0108] The first structure layer 80 is located on the side of the light-shielding layer 601 away from the substrate, and covers the display area 101 and the transition area 102.

[0109] The substrate can be an integrated structure covering the display area 101 and the transition area 102, that is, the substrate includes a portion located in the display area 101 and a portion located in the transition area 102, and both portions are integrated structures; the encapsulation layer 50 can be located only in the display area 101, that is, the orthographic projection of the encapsulation layer 50 on the substrate covers the display area 101; or the encapsulation layer 50 can also be located in the display area 101 and the portion of the transition area 102 adjacent to the display area 101, that is, the orthographic projection of the encapsulation layer 50 on the substrate covers the display area 101 and part of the transition area 102. Of course, the encapsulation layer 50 can also be located in the display area 101 and the transition area 102, that is, the orthographic projection of the encapsulation layer 50 on the substrate covers the display area 101 and the transition area 102.

[0110] The orthographic projection of the pixel circuit layer 20 on the substrate is located in the display area 101, in which case the side of the substrate in the transition area 102 can include an extension layer 21 of the pixel circuit layer 20, the material of the extension layer 21 being the same as part of the material of the pixel circuit layer 20, the orthographic projection of the planar layer 30 on the substrate is also located in the display area 101, and the pixel circuit layer 20 can include a plurality of data lines arranged in rows, a plurality of scan lines arranged in columns, a driving transistor, and a scan transistor. The intersection of the data lines and the scan lines defines a plurality of pixel areas; the driving transistor controls the amount of current provided to the organic light-emitting layer 40 according to the voltage at the gate; the scan transistor provides a data voltage to the gate of the driving transistor in response to a scan signal of the scan line, and the data voltage is applied to the organic light-emitting layer 40, thereby realizing the light emission of the organic light-emitting layer 40.

[0111] The normal projection of the organic light-emitting layer 40 on the substrate is located in the display area 101, and the organic light-emitting layer 40 comprises, from the side close to the substrate to the side away from the substrate, a first electrode 401, a pixel definition layer 402, an organic material layer 403, and a second electrode 404; the pixel definition layer 402 comprises an opening area and a non-opening area, the normal projection of the first electrode 401 on the substrate is located in the non-opening area, and the normal projection of the second electrode 404 on the substrate can cover the first electrode 401; the area where the opening area is located is the pixel area, and the area where the non-opening area is located is the non-pixel area; the first electrode 401 can be an anode, and the second electrode 404 can be a cathode.

[0112] The organic material layer 403 can comprise a hole injection layer HIL, a hole transport layer HTL, an emission layer EML, an electron transport layer ETL, and an electron injection layer EIL. When the voltage of the driving transistor in the pixel circuit layer 20 is applied to the anode and the cathode, the holes passing through the HTL and the electrons passing through the ETL are transmitted to the EML to form an exciton, so that the emission layer EML can emit visible light.

[0113] The normal projection of the light shielding layer 601 on the substrate can cover the normal projection of the non-opening area on the substrate, i.e., can cover the normal projection of the non-pixel area on the substrate, or can only coincide with the normal projection of the non-opening area on the substrate, so as to achieve a higher pixel aperture ratio. In some embodiments, a connecting layer 70 can be further arranged between the light shielding layer 601 and the first structural layer 80, and the normal projection of the connecting layer 70 on the substrate can cover the display area 101 or can cover the display area 101 and the transition area 102; the connecting layer 70 can also serve as the optical bonding layer 602.

[0114] In some examples, the light shielding layer 601 can be a black matrix.

[0115] In one specific embodiment, a display substrate A is provided as follows:

[0116] As shown in Figure 3 The display substrate A comprises a hole area 103, a peripheral area 1022 surrounding the hole area 103, an isolation area 1021 surrounding the peripheral area 1022, and a display area 101 surrounding the isolation area 1021; the isolation area 1021 and the peripheral area 1022 form a transition area 102 between the hole area 103 and the display area 101.

[0117] In the display area 101, there are a substrate, a pixel circuit layer 20, a planar layer 30, an organic light-emitting layer 40, an encapsulation layer 50, a light shielding layer 601, a connecting layer 70, a first structural layer 80, and a second structural layer 90;

[0118] The pixel circuit layer 20 is arranged on one side of the substrate, and includes a plurality of data lines arranged in rows, a plurality of scan lines arranged in columns, a driving transistor and a scan transistor. Each group of the driving transistor and the scan transistor is configured to provide a data voltage to a pixel region in the organic light-emitting layer 40.

[0119] The flat layer 30 is arranged on the side of the pixel circuit layer 20 away from the substrate, and the orthographic projection of the flat layer 30 on the substrate is located in the display area 101.

[0120] The organic light-emitting layer 40 is arranged on the substrate, and the orthographic projection of the organic light-emitting layer 40 on the substrate is located in the display area 101. The organic light-emitting layer 40 includes a first electrode 401, a pixel definition layer 402, an organic material layer 403 and a second electrode 404. The first electrode 401 can be an anode, and the second electrode 404 can be a cathode.

[0121] The encapsulation layer 50 is arranged on the side of the organic light-emitting layer 40 away from the substrate, and the orthographic projection of the encapsulation layer 50 on the substrate is located in the display area 101.

[0122] The light-blocking layer 601 is arranged on the side of the encapsulation layer 50 away from the substrate, and the orthographic projection of the light-blocking layer 601 on the substrate is located in the non-opening area defined by the pixel definition layer 402.

[0123] The connection layer 70 is arranged on the side of the light-blocking layer 601 away from the substrate, and the orthographic projection of the connection layer 70 on the substrate covers the display area 101, the isolation area 1021 and the peripheral area 1022.

[0124] The first structure layer 80 is arranged on the side of the connection layer 70 away from the substrate, and the orthographic projection of the first structure layer 80 on the substrate covers the display area 101, the isolation area 1021 and the peripheral area 1022.

[0125] The second structure layer 90 is arranged on the side of the first structure layer 80 away from the substrate, and the orthographic projection of the second structure layer 90 on the substrate covers the display area 101, the isolation area 1021 and the peripheral area 1022.

[0126] In the structure of the peripheral area 1022, the substrate, the extension layer 21 arranged on one side of the substrate, the first structure layer 80 and the second structure layer 90 arranged on one side of the extension layer 21.

[0127] The structure of the isolation region 1021 includes a substrate, an extension layer 21 located on one side of the substrate, a plurality of isolation columns x10 located on the side of the extension layer 21 away from the substrate, and a first structure layer 80 and a second structure layer 90 located on the side of the isolation columns x10 away from the substrate. The isolation columns x10 form a plurality of rings. The two rings of isolation columns x10 (the aforementioned retaining walls) near the display region 101 are higher, the three rings of isolation columns x10 (the aforementioned isolation columns x10) near the peripheral region 1022 are lower, and the isolation columns x10 of the two rings of isolation columns x10 closest to the display region 101 are smaller in height than the isolation columns x10 farther from the display region 101.

[0128] The material of the extension layer is the same as part of the material of the pixel circuit layer 2020.

[0129] The thickness of the first structure layer 80 in the peripheral region 1022 and part of the isolation region 1021 is smaller than the thickness of the first structure layer 80 in the display region 101. The material of the first structure layer 80 in the peripheral region 1022 and part of the isolation region 1021 is the same as the material of the first structure layer 80 in the display region 101. The first structure layer 80 in the peripheral region 1022 and part of the isolation region 1021 has stripes, and the first structure layer 80 in the display region 101 does not have stripes. The stripes present a transition from horizontal stripes to wavy stripes and then to vertical stripes from the display region 101 to the hole region 103.

[0130] Embodiment Two

[0131] Based on the same inventive concept, the present disclosure also provides a manufacturing method of a display substrate. Referring to Figure 6 , a step flowchart of the manufacturing method of the display substrate is shown, as Figure 6 , which can specifically include the following steps:

[0132] Step S601: providing a light-emitting substrate;

[0133] Step S602: forming a first structure layer 80 on the light-emitting side of the light-emitting substrate to obtain an initial substrate;

[0134] Step S603: performing hole formation on the initial substrate to form a hole region 103, a display region 101, and a transition region 102 between the hole region 103 and the display region 101, thereby obtaining the display substrate described in the above embodiments; wherein the first structure layer 80 in the transition region 102 and the first structure layer 80 in the display region 101 have different structures and at least one same material.

[0135] In this embodiment, when the initial substrate is subjected to hole formation to form the hole region 103, the initial substrate can be subjected to laser thermal cutting, thereby forming the hole region 103.

[0136] In some embodiments, taking the display substrate A as an example, the structure of the light-emitting substrate provided can include a substrate, a pixel definition layer 402, a light-emitting device, an encapsulation layer 50, a light-shielding layer 601, and a connecting layer 70.

[0137] The substrate can be divided into a display area 101, a transition area 102, and an opening area, the opening area is used to form a subsequent hole area 103, the display area 101 surrounds the transition area 102, and the transition area 102 surrounds the opening area 1; the opening is performed in the opening area.

[0138] The structure of the display area 101 includes a substrate, a pixel circuit layer 20, a planarization layer 30, an organic light-emitting layer 40, an encapsulation layer 50, a light-shielding layer 601, and a connecting layer 70; the structures of the substrate, the pixel circuit layer 20, the planarization layer 30, the organic light-emitting layer 40, the encapsulation layer 50, the light-shielding layer 601, and the connecting layer 70 can be seen in detail from Figure 3 , which will not be described here again.

[0139] The structure of the opening area includes a substrate;

[0140] After the first structure layer 80 is formed on the light-emitting side of the light-emitting substrate, the first structure layer 80 covers the display area 101, the transition area 102, and the opening area on the substrate in the orthographic projection, and the second structure layer 90 can also be formed on the side of the first structure layer 80 away from the substrate, and the second structure layer 90 covers the display area 101, the transition area 102, and the opening area on the substrate in the orthographic projection.

[0141] The opening process is as follows:

[0142] Laser thermal cutting is performed in the opening area to open a hole, and when thermal cutting is performed, the first structure layer 80 and the second structure layer 90 are deformed, and the second structure layer 90 is dissolved or carbonized during the opening process, so that the second structure layer 90 has a dissolved or carbonized morphology on the side wall of the hole area 103, but it does not affect the morphology of the remaining area, and it is still a flat structure layer.

[0143] When thermal cutting is performed, the first structure layer 80 will form a stripe in the planar direction, and the formed stripe is located in a ring-shaped range of 2-3 nm from the boundary of the hole area 103, of course, the actual formed stripe is affected by cutting energy, cutting speed, cutting direction, and other issues. For example Figure 5 , it is mainly a transverse stripe, and the closer it is to the cutting heat source, the greater the change in the stripe, and the more waves and even longitudinal downward stripes appear.

[0144] After cutting, the hole region 103 formed can expose the sidewalls of the first structure layer 80 and the second structure layer 90, and the exposed sidewalls are flush, i.e., the exposed sidewalls of the first structure layer 80 and the second structure layer 90 are flush with each other, to facilitate placement of small devices.

[0145] The display device using the embodiment of the present application can place small devices in the hole region. Since the first structure layer in the transition region and the first structure layer in the display region can have different structures, the first structure layer in the transition region can adapt to the punching requirement, and the first structure layer in the display region can be more suitable for the display region, thereby ensuring the display quality of the display region.

[0146] Based on the same inventive concept, the present disclosure also provides a display device, and the display substrate described above.

[0147] Finally, it should be noted that, unless otherwise defined, the terms "first", "second", and similar terms used herein do not denote any order, quantity, or importance, but are merely used to distinguish different components. Moreover, the terms "comprise", "contain", or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device including a list of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent in such a process, method, article, or device. Without more limitations, the element defined by the phrase "comprising a" does not exclude the presence of additional identical elements in the process, method, article, or device including the element. The terms "connected" or "connected" and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0148] The above describes in detail the display substrate, the manufacturing method of the display substrate, and the display device provided by the present disclosure. The principles and implementation manners of the present disclosure are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the present disclosure and its core idea; meanwhile, for those skilled in the art, according to the idea of the present disclosure, the specific implementation manner and application range can be changed; in summary, the content of the present description should not be understood as a limitation of the present disclosure.

[0149] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0150] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

[0151] The terms "an embodiment," "embodiment," or "one or more embodiments" as used herein mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this disclosure. Furthermore, please note that the examples of the phrase "in one embodiment" do not necessarily all refer to the same embodiment.

[0152] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this disclosure may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0153] In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. This disclosure can be implemented by means of hardware comprising a plurality of different elements and by means of a suitably programmed computer. In a unit claim enumerating a plurality of means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

[0154] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A display substrate, characterized by, The display substrate comprises: a hole region, a display region located at least one side of the hole region, and a transition region between the hole region and the display region; the display substrate comprises: a light-emitting substrate, and a first structure layer located at the light-emitting substrate light-emitting side, wherein the first structure layer located at the transition region and the first structure layer located at the display region have different structures and at least one same material; the transition region comprises an isolation region and a peripheral region, wherein the peripheral region is located at least one side of the hole region, and the isolation region surrounds the peripheral region; the isolation region and the peripheral region together form a two-layer protection from the hole region to the display region to form a gradient transition from the hole region to the display region to increase the protection of the display region; the first structure layer located at the transition region has a stripe; the stripe comprises at least one of a horizontal stripe, a wave stripe and a vertical stripe; in the case that the stripe comprises at least one of a horizontal stripe, a wave stripe and a vertical stripe, the vertical stripe is close to the hole region, the wave stripe is distributed at one end of the vertical stripe away from the hole region, and the horizontal stripe is distributed at one end of the wave stripe away from the hole region.

2. The display substrate of claim 1, wherein, The fluctuation amplitude of the stripe close to the hole region is greater than the fluctuation amplitude away from the hole region.

3. The display substrate of claim 1, wherein, The stripe is distributed in a range of greater than or equal to 2 nm and less than or equal to 3 nm from the side wall of the hole region.

4. The display substrate of claim 1, wherein, The stripe is periodically arranged in the thickness direction of the first structure layer located at the transition region.

5. The display substrate of claim 1, wherein, The thickness of the first structure layer located at the transition region is different from the thickness of the first structure layer located at the display region. 6.The display substrate of claim 5, wherein, The thickness of the first structure layer located at the transition region is less than the thickness of the first structure layer located at the display region. 7.The display substrate of claim 5, wherein, The ratio of the thickness of the first structure layer located at the transition region to the thickness of the first structure layer located at the display region is less than or equal to 0.

8. 8.The display substrate of claim 1, wherein, The first structure layer is configured to transmit light of a target waveband and to transmit or reflect circularly polarized light after converting incident linearly polarized light into circularly polarized light; wherein the target waveband comprises at least one of a red waveband, a blue waveband and a green waveband. 9.The display substrate of claim 1, wherein, The display substrate further comprises a second structure layer located at the side of the first structure layer away from the substrate; the hole region exposes the side walls of the first structure layer and the second structure layer, and the exposed side walls are flush. 10.The display substrate of claim 9, wherein, The second structure layer is configured to reduce the reflectivity of light entering the display substrate. 11.The display substrate of claim 1, wherein, The first structure layer is an organic composite film comprising a low-melting-point material. 12.The display substrate of claim 1, wherein, The transition region comprises an isolation region and a peripheral region, wherein the peripheral region is arranged close to the hole region, and the isolation region is arranged close to the display region; The isolation region comprises a substrate, at least one isolation column located above the substrate, and the at least one isolation column surrounds part or all of the peripheral region to surround the hole region; wherein the orthographic projection of the first structure layer located at the transition region on the light-emitting substrate covers the orthographic projection of the isolation column on the light-emitting substrate. 13.The display substrate of claim 1, wherein, The light-emitting substrate located at the display region comprises: a substrate; a pixel circuit layer arranged at one side of the substrate; a planar layer arranged at the side of the pixel circuit layer away from the substrate; an organic light-emitting layer disposed on a side of the planar layer facing away from the substrate; an encapsulation layer disposed on a side of the organic light-emitting layer facing away from the substrate; and a light-blocking layer disposed on a side of the encapsulation layer facing away from the substrate, and a direct projection of the light-blocking layer on the substrate is located in a non-pixel region of the organic light-emitting layer; wherein the first structure layer is disposed on a side of the light-blocking layer facing away from the substrate. 14.The display substrate of claim 1, wherein, In a normal direction of the light-emitting substrate, the hole region completely penetrates the display substrate or partially penetrates the display substrate.

15. A method for preparing a display substrate, characterized in that, The method comprises: providing a light-emitting substrate; forming a first structure layer on a light-emitting side of the light-emitting substrate to obtain an initial substrate; forming a hole region, a display region, and a transition region between the hole region and the display region by opening the initial substrate to obtain a display substrate; wherein the first structure layer in the transition region and the first structure layer in the display region have different structures and at least one same material; the transition region comprises an isolation region and a peripheral region, wherein the peripheral region is located on at least one side of the hole region, and the isolation region surrounds the peripheral region; the isolation region and the peripheral region together form a two-layer protection from the hole region to the display region to form a gradient transition from the hole region to the display region to increase protection of the display region; the first structure layer in the transition region has a stripe; the stripe comprises at least one of a horizontal stripe, a wave stripe, and a vertical stripe; in the case where the stripe comprises the horizontal stripe, the wave stripe, and the vertical stripe, the vertical stripe is close to the hole region, the wave stripe is distributed at one end of the vertical stripe away from the hole region, and the horizontal stripe is distributed at one end of the wave stripe away from the hole region.

16. A display device comprising: The display substrate of any one of claims 1-14.

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