A fully automatic high-efficiency film arranging machine and a film arranging method thereof

Abstract

The application discloses a kind of full-automatic high-efficiency piece arranging machine and its piece arranging method, including workbench, feeding mechanism, feed tank, piece arranging mechanism and discharge mechanism, feeding mechanism and feed tank are all connected on support plate, support plate is connected workbench by first support, piece arranging mechanism is located on workbench, discharge mechanism is fixed on workbench, first photoelectric sensing mechanism and second photoelectric sensing mechanism are arranged on the side of piece arranging mechanism on workbench.The method includes: workbench processing, feeding mechanism and feed tank installation, piece arranging mechanism installation, discharge mechanism installation and piece arranging processing.The wafer can be continuously transported by feeding mechanism and feed tank, so that the wafer is individually transported along the feed tank, and then the wafer is transported by piece arranging mechanism and discharge mechanism, realizing the continuous piece arranging of the wafer.The piece arranging method is simple, which can not only realize the individual continuous piece arranging of the wafer, but also reduce the damage to the wafer and reduce the rate of defective products.

Description

Technical Field

[0001] This invention relates to a fully automatic and efficient film sorting machine and its sorting method. Background Technology

[0002] Traditionally, quartz wafer arrangement is done manually, typically using tweezers to pick up the wafers one by one and place them on a photomask. However, due to the small size, thinness, and transparency of the wafers, arrangement requires many people working simultaneously, resulting in high labor costs, low efficiency, and the wafers are easily damaged during the arrangement process, leading to significant wafer loss. Furthermore, using tweezers for arrangement can cause wafer contamination, affecting wafer quality. Summary of the Invention

[0003] The purpose of this invention is to provide a fully automatic and efficient wafer stacking machine and its stacking method to address the shortcomings of existing technologies. The machine uses a feeding mechanism and a feeding box to stably and continuously transport wafers, allowing them to be transported individually along the feeding box. Then, the stacking mechanism and the unloading mechanism stack and transport the wafers, achieving continuous wafer stacking. This stacking method has simple steps, not only enabling continuous stacking and transport of individual wafers, but also reducing damage to the wafers and lowering the defect rate.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] A fully automatic wafer stacking machine is characterized by comprising a worktable, a feeding mechanism, a feeding box, a stacking mechanism, and a discharging mechanism. The feeding mechanism and the feeding box are both connected to a support plate. The support plate is fixedly connected to the worktable via a first bracket. The stacking mechanism is located on the worktable, and the discharging mechanism is fixed to the worktable and located on one side of the stacking mechanism. A first photoelectric sensing mechanism and a second photoelectric sensing mechanism are arranged on the worktable on one side of the stacking mechanism. The feeding mechanism and the feeding box can stably and continuously transport wafers, allowing wafers to be transported individually along the feeding box. The stacking mechanism and the discharging mechanism then stack and transport the wafers, achieving continuous wafer stacking processing. The first bracket and the support plate improve the stability and reliability of the feeding mechanism and the feeding box installation. The first and second photoelectric sensing mechanisms can detect wafers during stacking, improving the accuracy of wafer transport and increasing stacking efficiency.

[0006] Furthermore, the feeding mechanism includes a feeding motor, a feeding barrel, and a feeding hopper. The feeding motor is fixed to the worktable via a second bracket. The feeding barrel is connected to the output shaft of the feeding motor. The feeding hopper is connected to the second bracket via a horizontal plate. The feeding hopper is located below the feeding barrel. By driving the feeding barrel to rotate via the feeding motor, the wafers in the feeding barrel can fall downwards along the feeding hopper into the feeding box, improving the continuity of wafer feeding. The second bracket and the horizontal plate improve the stability and reliability of the installation of the conveying motor and the feeding hopper.

[0007] Furthermore, the feed box is equipped with a cavity and a discharge port. The top of the cavity has an opening, and the cavity is connected to the bottom of the feed box through the discharge port. The wafer enters the cavity through the opening and is then output through the discharge port along the cavity, realizing continuous wafer transport.

[0008] Furthermore, a vibrating plate is inclinedly provided on the inner side of the cavity, and a vibrator is provided below the vibrating plate. The vibrator drives the vibrating plate to vibrate, so that the wafers in the cavity can stably enter the discharge hole, which facilitates the continuous stacking and conveying of wafers.

[0009] Furthermore, the wafer stacking mechanism includes a cylinder, a piston rod, a stacking plate, and a connecting rod. The cylinder is located on the bottom surface of the worktable and is connected to the connecting rod via the piston rod. The piston rod passes through a fixed plate, which is located on the worktable. The connecting rod is fixedly connected to the stacking plate, which is movably connected to a fixed block on the worktable. The cylinder can drive the connecting rod to move horizontally back and forth via the piston rod, thereby driving the stacking plate to move back and forth horizontally to achieve wafer stacking. The fixed plate improves the stability of the piston rod's movement, preventing tilting and noise, while the fixed block improves the stability of the stacking plate's movement.

[0010] Furthermore, a switch assembly is provided between the wafer sorting plate and the worktable. The switch assembly includes a contact block, a positioning block, and a limit switch. The contact block is fixed to the worktable by the positioning block. The limit switch is located on the bottom surface of the wafer sorting plate. During the movement of the wafer sorting plate, the limit switch can be moved. When the limit switch collides with the contact block, a signal is triggered, which, in conjunction with the first photoelectric sensing mechanism, stops the cylinder from working, ensuring that the wafer sorting plate is accurately moved to the position where the wafer falls. After the wafer falls and is positioned, the cylinder works, causing the limit switch to lose its signal, and at the same time, the first photoelectric sensing switch stops working.

[0011] Furthermore, the wafer rack is equipped with a limiting groove and a through groove, both located on the same side of the rack. The limiting groove connects to the through groove, facilitating the limiting and support of the wafer, while the through groove allows the pusher block to push the wafer upwards onto the conveyor belt. Baffles are symmetrically positioned on both sides of the rack on the worktable, limiting the movement of the rack and improving its stability and reliability.

[0012] Furthermore, the unloading mechanism includes a conveyor box, a conveyor motor, and a conveyor belt. The conveyor box is fixed to the workbench by a reinforcing rod. The conveyor motor and the conveyor belt are both located on the conveyor box. The conveyor motor drives the conveyor belt to rotate through a rotating roller to transport the wafers. Pushing blocks are evenly arranged on the conveyor belt. Each pushing block includes a block body with a pushing part and an arc-shaped guide part. The conveyor motor drives the rotating roller to rotate, which in turn drives the conveyor belt to rotate along the conveyor box, thus achieving continuous transport of the wafers. The pushing part on the pushing block is made of rubber, which can reduce the loss of wafers during the pushing process. After pushing, the wafers slide down onto the conveyor belt along the arc-shaped guide part.

[0013] Furthermore, both the first and second photoelectric sensing mechanisms include a third bracket, a mounting plate, and a photoelectric switch. The photoelectric switch is mounted on the mounting plate, and the mounting plate is connected to the worktable via the third bracket.

[0014] The above-described fully automatic film stacking method is characterized by including the following steps:

[0015] 1) Workbench processing

[0016] a. First, process the corresponding workbench according to the design requirements, and install support legs symmetrically along the bottom surface of the workbench to improve the stability of the workbench;

[0017] b. Then select a support plate and a first bracket of appropriate size, and fix the support plate on the workbench through the first bracket to facilitate the installation of the feeding mechanism and the feeding box, and ensure that the distance between the feeding box and the wafer stack is less than the thickness of the wafer.

[0018] c. Next, select two photoelectric switches, fix the photoelectric switches on the mounting plate, and fix the mounting plate to the set position on the worktable through the third bracket, and place them on the same side. The photoelectric switches generate electrical signals, which can control the cylinder and improve the accuracy of the plate-laying plate movement.

[0019] 2) Installation of feeding mechanism and feeding box

[0020] a. First, select the feeding motor according to the design requirements, fix the feeding motor on the support plate through the second bracket, and horizontally install the horizontal plate along one side of the second support frame, and open the through hole for installing the feeding hopper along the horizontal plate.

[0021] b. Then select a suitable feed hopper and feed barrel. First, install the feed barrel through the through hole on the horizontal plate. Then, install the feed barrel on the output shaft of the feed motor so that the feed barrel is suspended on the feed hopper.

[0022] c. Next, process the corresponding feed box, open a cavity and a discharge hole along the inside of the feed box, the cavity and the discharge hole are connected to each other, and install the vibrating plate and vibrator at an angle along the inner wall of the cavity.

[0023] d. Finally, fix the processed feed box onto the support plate, and position it below the feeding mechanism;

[0024] 3) Installation of the film scheduling mechanism

[0025] a. First, select a suitable cylinder according to the design requirements, fix the cylinder on the bottom surface of the workbench, and connect the piston rod to the cylinder. The piston rod passes through the fixed plate set on the workbench.

[0026] b. Then, according to the design requirements, process a chip tray of appropriate size, and open a limiting groove and a through groove along the chip exit side of the chip tray. The limiting groove and the through groove are connected to each other. Move the chip tray to the fixed block installed on the workbench. The limiting groove can support and limit the falling wafer, and the through groove makes it easy for the push block to push the wafer out and fall onto the conveyor belt.

[0027] c. Next, install limit switches on the bottom surface of the tray and install contact blocks on the worktable via positioning blocks to facilitate the triggering signals of the limit switches and control the accuracy of the tray movement.

[0028] d. Finally, the piston rod is fixedly connected to the wafer rack via the connecting rod. After the feed box is installed, the distance between the bottom surface of the feed box and the top surface of the wafer rack is less than the thickness of the wafer.

[0029] 4) Installation of the discharge mechanism

[0030] a. First, process a suitable conveyor box according to the design requirements, and install the conveyor motor along one side of the conveyor box;

[0031] b. Then install two rotating rollers inside the conveyor box. One of the rotating rollers is connected to the conveyor motor, and the conveyor belt is installed between the two rotating rollers.

[0032] c. Next, install the push blocks at equal intervals along the conveyor belt;

[0033] 5) Film scheduling

[0034] a. First, place the wafers to be stacked into the feeding hopper. Drive the feeding hopper to rotate at a constant speed through the feeding motor, so that the wafers fall into the feeding box through the feeding hopper. The wafers are then vibrated by the vibrator in the feeding box, so that they fall into the discharge hole under the action of the vibrating plate.

[0035] b. Then start the cylinder, which drives the wafer racking plate to move horizontally through the piston rod. When the first photoelectric sensor generates an electrical signal and the limit switch is triggered, the cylinder stops working. At this time, a wafer in the discharge hole falls into the limit groove. Start the cylinder again to make the piston rod move in the opposite direction, which makes the wafer racking plate move the wafer towards the discharge mechanism. When the second photoelectric sensor generates an electrical signal and the limit switch loses the signal, the cylinder stops working. At this time, the conveyor motor works and the conveyor belt drives the push block to move. As the push block moves with the conveyor belt, it passes through the through groove on the wafer racking plate and pushes the wafer out of the wafer racking plate. The wafer is then slid into the conveyor belt along the arc-shaped guide of the push block.

[0036] c. Then the cylinder moves, driving the wafer stacking plate to move, and the next wafer is stacked. This process is repeated to achieve continuous wafer stacking.

[0037] This wafer arrangement method is simple in steps, and can not only realize the continuous arrangement and delivery of individual wafers, but also reduce damage to the wafers and reduce the defect rate.

[0038] The present invention, by adopting the above-described technical solution, has the following beneficial effects:

[0039] 1. The wafers can be stably and continuously conveyed through the feeding mechanism and feeding box, so that the wafers are conveyed one by one along the feeding box, and then the wafer stacking mechanism and the unloading mechanism are used to stack and convey the wafers, so as to realize the continuous stacking process of wafers.

[0040] 2. The first bracket and support plate improve the stability and reliability of the feeding mechanism and feeding box installation. The first photoelectric sensing mechanism and the second photoelectric sensing mechanism can detect the wafers during the wafer stacking mechanism, thereby improving the accuracy of wafer delivery and the efficiency of wafer stacking.

[0041] 3. This wafer arrangement method has simple steps, which can not only realize the continuous arrangement and delivery of individual wafers, but also reduce damage to the wafers and reduce the defect rate. Attached Figure Description

[0042] The present invention will be further described below with reference to the accompanying drawings:

[0043] Figure 1 This is a diagram illustrating the effect of the film sorting machine in the fully automatic high-efficiency film sorting machine and its sorting method of the present invention.

[0044] Figure 2 This is a schematic diagram of the feeding mechanism in this invention;

[0045] Figure 3 This is a schematic diagram of the feed box structure in this invention;

[0046] Figure 4 This is a schematic diagram of the stacking mechanism in this invention;

[0047] Figure 5 This is a schematic diagram of the structure of the push block in this invention.

[0048] In the diagram: 1-Workbench; 2-Support leg; 3-First bracket; 4-Support plate; 5-Feeding mechanism; 6-Feeding box; 7-First photoelectric sensing mechanism; 8-Second photoelectric sensing mechanism; 9-Cylinder; 10-Baffle; 11-Sheet stacking plate; 12-Conveyor box; 13-Conveyor motor; 14-Conveyor belt; 15-Push block; 16-Wafer; 17-Second bracket; 18-Horizontal plate; 19-Feeding motor; 20-Feeding... 21-Bucket; 22-Hopper; 23-Cavity; 24-Discharge hole; 25-Vibrating plate; 26-Vibrator; 27-Fixing plate; 28-Connecting rod; 29-Limiting groove; 30-Through groove; 31-Fixing block; 32-Limit switch; 33-Positioning block; 34-Touch block; 35-Third bracket; 36-Mounting plate; 37-Photoelectric switch; 38-Block; 39-Pushing part; 40-Arc-shaped guide part. Detailed Implementation

[0049] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0050] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0051] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0052] like Figures 1 to 5As shown, this invention provides a fully automatic wafer sorting machine, comprising a worktable 1, a feeding mechanism 5, a feeding box 6, a wafer sorting mechanism, and a discharging mechanism. The feeding mechanism 5 and the feeding box 6 are both connected to a support plate 4. The support plate 4 is fixedly connected to the worktable 1 via a first bracket 3. The feeding mechanism 5 includes a feeding motor 19, a feeding barrel 20, and a feeding hopper 21. The feeding motor 19 is fixed to the worktable 1 via a second bracket 17. The feeding barrel 20 is connected to the output shaft of the feeding motor 19. The feeding hopper 21 is connected to the second bracket 17 via a horizontal plate 18. The feeding hopper 21 is located below the feeding barrel 20. By driving the feeding barrel 20 to rotate via the feeding motor 19, the wafers 16 in the feeding barrel 20 can fall downwards along the feeding hopper 21 into the feeding box 6, improving the continuity of wafer 16 feeding. The second bracket 17 and the horizontal plate 18 improve the stability and reliability of the installation of the conveyor motor 13 and the feeding hopper 21.

[0053] The feed box 6 has a cavity 22 and a discharge port 23. The top of the cavity 22 has an opening, and the cavity 22 is connected to the bottom of the feed box 6 through the discharge port 23. The wafer 16 enters the cavity 22 through the opening and then exits through the discharge port 23 along the cavity 22, realizing the continuous conveying of the wafer 16. A vibrating plate 24 is inclined on the inner side of the cavity 22, and a vibrator 25 is located below the vibrating plate 24. The vibrator 25 drives the vibrating plate 24 to vibrate, so that the wafer 16 in the cavity 22 can stably enter the discharge port 23, which facilitates the continuous stacking and conveying of the wafer 16.

[0054] The wafer arrangement mechanism is located on the worktable 1. The wafer arrangement mechanism includes a cylinder 9, a piston rod 27, a wafer arrangement plate 11, and a connecting rod 28. The cylinder 9 is located on the bottom surface of the worktable 1. The cylinder 9 is connected to the connecting rod 28 through the piston rod 27. The piston rod 27 passes through a fixed plate 26, which is located on the worktable 1. The connecting rod 28 is fixedly connected to the wafer arrangement plate 11. The wafer arrangement plate 11 is movably connected to a fixed block 31, which is located on the worktable 1. The cylinder 9 can drive the connecting rod 28 to move back and forth horizontally via the piston rod 27, thereby driving the wafer arrangement plate 11 to move back and forth horizontally, realizing the wafer arrangement process of the wafers 16. The fixed plate 26 improves the stability of the piston rod 27's movement and avoids tilting and noise. The fixed block 31 improves the stability of the wafer arrangement plate 11's movement.

[0055] A switch assembly is provided between the wafer tray 11 and the worktable 1. The switch assembly includes a contact block 34, a positioning block 33, and a limit switch 32. The contact block 34 is fixed to the worktable 1 by the positioning block 33. The limit switch 32 is located on the bottom surface of the wafer tray 11. During the movement of the wafer tray 11, the limit switch 32 can be moved. When the limit switch 32 collides with the contact block 34, a signal is triggered, which, together with the first photoelectric sensing mechanism 7, causes the cylinder 9 to stop working, ensuring that the wafer tray 11 is accurately moved to the position where the wafer 16 falls. After the wafer 16 falls and is positioned, the cylinder 9 works, causing the limit switch 32 to lose its signal, and at the same time, the first photoelectric sensing switch stops working.

[0056] The wafer rack 11 is provided with a limiting groove 29 and a through groove 30, which are located on the same side of the wafer rack 11. The limiting groove 29 connects to the through groove 30. The limiting groove 29 facilitates the limiting support of the wafer 16, while the through groove 30 facilitates the pusher block 15 to push the wafer 16 upward onto the conveyor belt 14. The worktable 1 is provided with a baffle 10, which is symmetrically arranged on both sides of the wafer rack 11. The baffle 10 can limit the movement of the wafer rack 11, thereby improving the stability and reliability of the wafer rack 11's movement.

[0057] The unloading mechanism is fixed on the workbench 1 and located on one side of the wafer stacking mechanism. The unloading mechanism includes a conveyor box 12, a conveyor motor 13, and a conveyor belt 14. The conveyor box 12 is fixed on the workbench 1 by a reinforcing rod. The conveyor motor 13 and the conveyor belt 14 are both located on the conveyor box 12. The conveyor motor 13 drives the conveyor belt 14 to rotate through a rotating roller to realize the conveying of the wafers 16. Pushing blocks 15 are evenly arranged on the conveyor belt 14. The pushing block 15 includes a block 38. The block 38 is provided with a pushing part 39 and an arc-shaped guide part 40. The conveyor motor 13 drives the rotating roller to rotate, which in turn drives the conveyor belt 14 to rotate along the conveyor box 12 to realize the continuous conveying of the wafers 16. The pushing part 39 on the pushing block 15 is made of rubber, which can reduce the loss of the wafers 16 during the pushing process. After pushing, the wafers 16 slide down onto the conveyor belt 14 along the arc-shaped guide part 40.

[0058] On the workbench 1, a first photoelectric sensing mechanism 7 and a second photoelectric sensing mechanism 8 are arranged on one side of the wafer stacking mechanism. Both the first photoelectric sensing mechanism 7 and the second photoelectric sensing mechanism 8 include a third bracket 35, a mounting plate 36, and a photoelectric switch 37. The photoelectric switch 37 is mounted on the mounting plate 36, which is connected to the workbench 1 via the third bracket 35. The wafers 16 can be stably and continuously conveyed via the feeding mechanism 5 and the feeding box 6, allowing them to be conveyed individually along the feeding box 6. The wafer stacking mechanism and the unloading mechanism then stack and convey the wafers 16, achieving continuous wafer stacking processing. The first bracket 3 and the support plate 4 improve the stability and reliability of the feeding mechanism 5 and the feeding box 6. The first photoelectric sensing mechanism 7 and the second photoelectric sensing mechanism 8 can detect the wafers 16 during stacking, improving the accuracy of wafer stacking and increasing stacking efficiency.

[0059] The film arrangement method of a fully automatic film arranger, as described above, includes the following steps:

[0060] 1) Processing on workbench 1

[0061] a. First, process the corresponding workbench 1 according to the design requirements, and install the support legs 2 symmetrically along the bottom surface of the workbench 1 to improve the stability of the workbench 1.

[0062] b. Then select a support plate 4 and a first bracket 3 of appropriate size, and fix the support plate 4 on the workbench 1 through the first bracket 3 to facilitate the installation of the feeding mechanism 5 and the feeding box 6, and ensure that the distance between the feeding box 6 and the wafer tray 11 is less than the thickness of the wafer 16.

[0063] c. Next, select two photoelectric switches 37, fix the photoelectric switches 37 on the mounting plate 36, and fix the mounting plate 36 to the set position of the workbench 1 through the third bracket 35, and place them on the same side. The photoelectric switches 37 generate electrical signals, which can control the cylinder 9 and improve the accuracy of the movement of the plate 11.

[0064] 2) Installation of feeding mechanism 5 and feeding box 6

[0065] a. First, select the feeding motor 19 according to the design requirements, fix the feeding motor 19 on the support plate 4 through the second bracket 17, and horizontally install the horizontal plate 18 along one side of the second support frame, and open the through hole for installing the feeding hopper 21 on the horizontal plate 18.

[0066] b. Then select appropriate feed barrel 20 and feed hopper 21. First, install the feed barrel 20 through the through hole on the horizontal plate 18. Then install the feed barrel 20 on the output shaft of the feed motor 19 so that the feed barrel 20 is suspended on the feed hopper 21.

[0067] c. Next, process the corresponding feed box 6. Open a cavity 22 and a discharge hole 23 inside the feed box 6. The cavity 22 and the discharge hole 23 are connected to each other. Install the vibrating plate 24 and the vibrator 25 at an angle along the inner wall of the cavity 22.

[0068] d. Finally, the processed feed box 6 is fixedly installed on the support plate 4 and located below the feeding mechanism 5;

[0069] 3) Installation of the film scheduling mechanism

[0070] a. First, select a suitable cylinder 9 according to the design requirements, fix the cylinder 9 on the bottom surface of the workbench 1, and connect the piston rod 27 to the cylinder 9. The piston rod 27 passes through the fixed plate 26 set on the workbench 1.

[0071] b. Then, according to the design requirements, process a suitable size of the wafer tray 11. A limiting groove 29 and a through groove 30 are opened along the wafer exit side of the wafer tray 11. The limiting groove 29 and the through groove 30 are connected to each other. The wafer tray 11 is moved and connected to the fixed block 31 installed on the worktable 1. The limiting groove 29 can support and limit the falling wafer 16. The through groove 30 facilitates the push block 15 to push the wafer 16 out and fall onto the conveyor belt 14.

[0072] c. Next, install a limit switch 32 on the bottom surface of the tray plate 11, and install a contact block 34 on the worktable 1 through the positioning block 33, so that the limit switch 32 can trigger the signal and control the accuracy of the movement of the tray plate 11.

[0073] d. Finally, the piston rod 27 is fixedly connected to the wafer plate 11 via the connecting rod 28. After the feed box 6 is installed, the distance between the bottom surface of the feed box 6 and the top surface of the wafer plate 11 is less than the thickness of the wafer 16.

[0074] 4) Installation of the discharge mechanism

[0075] a. First, process a suitable conveyor box 12 according to the design requirements, and install the conveyor motor 13 along one side of the conveyor box 12;

[0076] b. Then, two rotating rollers are installed inside the conveyor box 12. One rotating roller is connected to the conveyor motor 13, and a conveyor belt 14 is installed between the two rotating rollers.

[0077] c. Next, install the push blocks 15 at equal intervals along the conveyor belt 14;

[0078] 5) Film scheduling

[0079] a. First, place the wafer 16 to be stacked into the feed hopper 20. Drive the feed hopper 20 to rotate at a constant speed through the feed motor 19, so that the wafer 16 falls into the feed box 6 through the feed hopper 21. Vibration of the vibrator 25 in the feed box 6 causes the wafer 16 to fall into the discharge hole 23 under the action of the vibrating plate 24.

[0080] b. Then start the cylinder 9, which drives the stacking plate 11 to move horizontally through the piston rod 27. When the first photoelectric sensor 7 generates an electrical signal, the limit switch 32 is triggered and the cylinder 9 stops working. At this time, a wafer 16 in the discharge hole 23 falls into the limiting groove 29. Start the cylinder 9 again, which causes the piston rod 27 to move in the opposite direction, causing the stacking plate 11 to move the wafer 16 toward the discharge mechanism. When the second photoelectric sensor 8 generates an electrical signal, the limit switch 32 loses the signal and the cylinder 9 stops working. At this time, the conveyor motor 13 works and the conveyor belt 14 drives the push block 15 to move. As the push block 15 moves with the conveyor belt 14, it passes through the through groove 30 on the stacking plate 11 and pushes the wafer 16 out of the stacking plate 11. The wafer 16 is then slid into the conveyor belt 14 along the arc-shaped guide part 40 of the push block 15.

[0081] c. Then the cylinder 9 moves, driving the wafer tray 11 to move, and the next wafer 16 is wafered. This process is repeated to achieve continuous wafer 16 wafering.

[0082] This wafer arrangement method is simple in steps, and can not only realize the continuous arrangement and delivery of individual wafers 16, but also reduce damage to wafers 16 and reduce the defect rate.

[0083] The above are merely specific embodiments of the present invention, but the technical features of the present invention are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on the present invention to achieve substantially the same technical effect are all covered within the protection scope of the present invention.

Claims

1. A fully automatic film advance mechanism characterized by: The utility model provides a wafer conveying device, including workbench, feeding mechanism, feed tank, piece arranging mechanism and discharge mechanism, the feeding mechanism and the feed tank all are connected on the support plate, the support plate is fixedly connected workbench through first support, the piece arranging mechanism is located workbench, the discharge mechanism is fixed on workbench and is located piece arranging mechanism one side, workbench is located piece arranging mechanism one side and is provided with first photoelectric response mechanism and second photoelectric response mechanism, the feed tank is equipped with cavity and discharge hole in, the top of cavity is equipped with opening, the cavity is communicated the bottom of feed tank through discharge hole, the inside of cavity is obliquely equipped with vibrating piece, the vibrating piece below is equipped with vibrator, the piece arranging mechanism includes cylinder, piston rod, piece arranging plate and link bar, the cylinder is located workbench bottom surface, the cylinder is connected link bar through piston rod, the piston rod penetrates fixed plate, the fixed plate is located workbench, the link bar is fixedly connected piece arranging plate, piece arranging plate is movably connected in fixed block, the fixed block is located workbench, the discharge mechanism includes conveying box, conveying motor and conveying belt, the conveying box is fixed on workbench through reinforcing rod, conveying motor and conveying belt all are located conveying box, conveying motor drives conveying belt rotation through rotating roller, realizes the conveying to wafer, the conveying belt is evenly provided with push block, the push block includes block, the block is provided with push part and arc guide part.

2. The fully automatic film loader according to claim 1, characterized in that: The feeding mechanism includes a feeding motor, a feeding barrel and a feeding hopper, the feeding motor is fixed on the workbench through a second support, the feeding barrel is connected to the output shaft of the feeding motor, and the feeding hopper is connected to the second support through a horizontal plate, and the feeding hopper is located below the feeding barrel.

3. The fully automatic filmstrip player as claimed in claim 2, characterized in that: A switch assembly is arranged between the piece arranging plate and the workbench, the switch assembly includes a touch block, a positioning block and a travel switch, the touch block is fixed to the workbench through the positioning block, and the travel switch is arranged on the bottom surface of the piece arranging plate.

4. The fully automatic film loader according to claim 3, characterized in that: A limiting groove and a through groove are arranged on the piece arranging plate, the limiting groove and the through groove are located on the same side of the piece arranging plate, and the limiting groove is communicated with the through groove.

5. The fully automatic filmstrip player as claimed in claim 4, characterized in that: The first photoelectric response mechanism and the second photoelectric response mechanism each include a third support, a mounting plate and a photoelectric switch, the photoelectric switch is arranged on the mounting plate, and the mounting plate is connected to the workbench through the third support.

6. The method of claim 5, wherein the step of feeding the sheets is performed by a full-automatic sheet feeder. The utility model provides a wafer conveying device, including the following steps: 1) workbench processing a. First, according to the design requirements, process the corresponding workbench, install the support feet symmetrically along the bottom surface of the workbench; b. Then select the appropriate size of the support plate and the first support, and fix the support plate on the workbench through the first support; c. Then select two photoelectric switches, fix the photoelectric switches on the mounting plate, and fix the mounting plate on the workbench at the specified position through the third support, and they are located on the same side; 2) feeding mechanism and feed tank installation a、First according to the design requirements selected feed motor, feed motor through the second support fixed installation on the support plate, and along the second support along the side of the horizontal plate, along the horizontal plate opening for the installation of feed hopper hole; b、Then select the appropriate feed bucket and feed hopper, first feed all the way through the hole installed on the horizontal plate, and then install the feed bucket on the output shaft of the feed motor, so that the feed bucket hanging in the feed hopper; c、Next to the corresponding feed tank processing, along the inside of the feed tank cavity and discharge hole, the cavity and discharge hole are communicated, along the inner wall of the cavity tilt installation vibration piece and vibrator; d、Finally, the feed tank fixed installation on the support plate, and located below the feed mechanism; 3) piece mechanism installation a、First according to the design requirements selected appropriate cylinder, cylinder fixed installation on the bottom surface of the workbench, and in the cylinder connecting piston rod, piston rod through the workbench on the fixed plate; b、Then according to the design requirements processing appropriate size of the piece plate, along the piece plate out piece side opening limit slot and through slot, limit slot and through slot are communicated, and the piece plate mobile connection in the workbench installed on the fixed block; c、Next to the bottom surface of the piece plate installation travel switch, in the workbench through the positioning block installation touch block; d、Finally, the piston rod through the link rod and piece plate fixed connection, feed tank installation, the distance between the feed tank bottom surface and the top surface of the piece plate is less than the thickness of the wafer; 4) discharge mechanism installation a、First according to the design requirements processing appropriate conveying box, along the side of the conveying box installation conveying motor; b、Then along the inside of the conveying box installation two rotating roller, one side of the rotating roller connecting conveying motor, between the two rotating roller installation conveying belt; c、Next along the equal interval installation push block on the conveying belt; 5) piece processing a、First, the wafer to be arranged in the feed bucket, through the feed motor driven feed bucket uniform rotation, so that the wafer through the feed hopper into the feed tank, through the vibrator in the feed tank, so that the wafer under the action of the vibration piece into the discharge hole; b、Then start the cylinder, through the piston rod driven piece plate horizontal movement, when the first photoelectric sensing mechanism produces electrical signal, at the same time, the travel switch is triggered, the cylinder stops working, at this time, a wafer in the discharge hole falls into the limit slot, start the cylinder again, the piston rod moves in the opposite direction, so that the piece plate driven wafer to the discharge mechanism side, when the second photoelectric sensing mechanism produces electrical signal, at the same time, the travel switch loses signal, the cylinder stops working, at this time, the conveying motor works, the conveying belt driven push block moves, the push block in the process of following the conveying belt moves through the through slot on the piece plate, the wafer is pushed out of the piece plate, so that the wafer along the arc guide part of the push block into the conveying belt; c、Next, the cylinder moves, driven piece plate movement, for the next wafer piece, so that the wafer continuous piece.

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