Full-automatic uv glue coating equipment for ceramic integrated circuit board production

Abstract

The present application relates to UV glue coating technical field, specifically to full-automatic UV glue coating equipment for ceramic integrated circuit board production, including two-way adjustable glue spraying assembly, glue coating platform, material conveying mechanism for conveying circuit board and excess material collecting assembly, glue spraying assembly is installed on glue coating platform, is used for full-coverage type glue coating operation to circuit board, glue spraying assembly includes multiple automatic glue spraying heads arranged side by side, cleaning assembly for quickly cleaning multiple automatic glue spraying heads is also provided on glue spraying assembly, material conveying mechanism is installed on glue coating platform, when the present application is used for UV glue coating to circuit board on production line, not only can the excess glue generated during coating be collected to prevent the free-falling of atomized glue, but also the nozzle of automatic glue spraying head can be cleaned to ensure the quality of automatic glue spraying head during glue spraying, greatly improving the coating quality of circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of UV glue coating, in particular to a full-automatic UV glue coating equipment for ceramic integrated circuit board production. BACKGROUND

[0002] The ceramic integrated circuit board, also known as a circuit board, is an important electronic component and a carrier for electrical interconnection of electronic components, and is currently widely used in the production and manufacturing of electronic products.

[0003] During the use of the ceramic integrated circuit board, moisture is the most common and destructive factor, excessive moisture can greatly reduce the insulation resistance between conductors, accelerate high-speed decomposition, reduce Q value, and corrode the conductor. We often see that the metal part of the circuit board has been patina, which is caused by the chemical reaction of metal copper and water vapor, oxygen. In order to improve the service life of the circuit board, a layer of UV glue conformal coating is usually sprayed on the circuit board during production. The UV glue conformal coating, also known as UV three-proof glue, has the "three-proof" performance of waterproof, moisture-proof and dust-proof, and can be used to protect electronic components from exposure to the environment and environmental factors.

[0004] When a large number of ceramic integrated circuit boards are fully covered and UV glue is sprayed, automatic spraying is usually used. Automatic spraying not only has good consistency, but also has high production efficiency and is easy to realize online automatic production. However, during the spraying process of the circuit board on the production line, part of the glue is easily sprayed on the production line. Since the UV glue has a fast curing speed, it is difficult to quickly clean the glue sprayed on the production line. In addition, in the existing technology, the UV glue spraying equipment is not convenient for timely cleaning of the glue remaining on the spray gun head during the spraying process. When the glue is cured on the spray gun head, it not only affects the coating effect of the glue, but also makes it difficult to quickly cure the glue that is not uniformly coated on the circuit board. Therefore, we propose a full-automatic UV glue coating equipment for ceramic integrated circuit board production. SUMMARY

[0005] (I) Technical problems solved

[0006] In view of the deficiencies of the prior art, the present application provides a full-automatic UV glue coating equipment for ceramic integrated circuit board production, which solves the problem that part of the glue sprayed on the production line is difficult to clean and the UV glue spray gun head is not convenient to clean quickly when a large number of ceramic integrated circuit boards are fully covered and UV glue is sprayed by automatic spraying in the prior art.

[0007] (II) Technical solutions

[0008] In order to achieve the above object, the present application provides the following technical scheme: the full-automatic UV glue coating equipment for ceramic integrated circuit board production, comprising a two-way adjustable glue spraying assembly, a glue coating platform, a material conveying mechanism for conveying the circuit board and a surplus material collecting assembly;

[0009] The glue spraying assembly is installed on the glue coating platform and is used for full-coverage glue coating operation of the circuit board.

[0010] The material conveying mechanism is installed on the glue coating platform, and comprises a feeding frame, a feeding assembly, a discharging assembly and a spraying material conveying assembly.

[0011] The surplus material collecting assembly is installed on the glue coating platform, and part of the spraying material conveying assembly is located inside the surplus material collecting assembly.

[0012] As a preferred technical scheme of the present application, the feeding frame and the glue coating platform are further provided with a quick glue curing assembly.

[0013] On the basis of the foregoing scheme, the glue spraying assembly further comprises a glue spraying frame, a horizontal adjusting electric cylinder, a vertical adjusting electric cylinder, a glue spraying sliding plate and a nozzle seat.

[0014] The glue spraying frame is fixedly installed on the glue coating platform, and a glue spraying through hole is formed in the glue spraying frame.

[0015] On the basis of the foregoing scheme, the cleaning assembly comprises a cleaning plate, a cotton changing plate, a cleaning sponge and a plurality of cleaning springs.

[0016] The cleaning plate is fixedly installed on the glue spraying frame, one end of each of the plurality of cleaning springs is fixedly installed on the cleaning plate, and the other end is fixedly installed on the cotton changing plate.

[0017] On the basis of the foregoing scheme, the feeding assembly and the discharging assembly are structurally identical, wherein the feeding assembly comprises a feeding motor, two feeding rotating rods, and at least two feeding parts, each of which is mounted on the two feeding rotating rods;

[0018] The two feeding rotating rods are rotationally mounted on the feeding frame, the feeding motor is mounted on one side of the feeding frame, and the output end of the feeding motor is fixedly mounted on one side of one of the feeding rotating rods.

[0019] One of the feeding parts comprises two feeding rollers and a feeding belt, the two feeding rollers are fixedly mounted on the two feeding rotating rods, and the feeding belt is drivingly mounted between the two feeding rollers.

[0020] On the basis of the foregoing scheme, the spraying material conveying assembly comprises a spraying motor, a spraying gearbox, a linkage rod, and two material conveying parts, the two material conveying parts are mirror-symmetrically mounted on the feeding frame, and the linkage rod is mounted between the two material conveying parts.

[0021] Each of the material conveying parts comprises a plurality of material conveying wheels, a plurality of material conveying rotating rods, and a plurality of material conveying gears, the plurality of material conveying rotating rods are rotationally mounted on the feeding frame at equal distances, one end of each of the plurality of material conveying rotating rods is fixedly mounted with one of the plurality of material conveying wheels, and the other end thereof is fixedly mounted with one of the plurality of material conveying gears, adjacent two of the material conveying gears are engaged with a linkage gear, the plurality of linkage gears are rotationally mounted on the feeding frame through a linkage rotating rod, and the plurality of material conveying wheels are flush with the feeding belt.

[0022] The spraying motor and the spraying gearbox are mounted on the gluing platform through a machine base, the output end of the spraying motor is fixedly mounted with the input end of the spraying gearbox, the output end of the spraying gearbox is fixedly mounted with one of the material conveying gears, and the linkage rod is fixedly mounted between the two material conveying wheels corresponding to one side of the spraying motor.

[0023] On the basis of the foregoing scheme, the excess material collecting assembly comprises a glue blocking cover, a concave glue collecting plate, an excess material collecting box, a glue mist absorbing part, two glue blocking plates, two gluing opening and closing parts, and two material scraping parts, the two gluing opening and closing parts are respectively arranged on the two sides of the two glue blocking plates, and the two material scraping parts are respectively arranged on the two sides of the concave glue collecting plate.

[0024] Two said glue blocking plates are fixedly installed on the glue coating platform, the concave glue collecting plate is fixedly installed between the two said glue blocking plates, the glue blocking cover is detachably fixedly installed on the two said glue blocking plates, the glue blocking cover, the concave glue collecting plate and the two said glue blocking plates form a coating cavity, a plurality of coating through holes are formed in the glue blocking cover, a rubber protection ring is arranged in each of the plurality of coating through holes, the plurality of coating through holes correspond to the plurality of automatic glue spraying heads respectively, the plurality of conveying wheels partially pass through the concave glue collecting plate to the inside of the coating cavity, and the plurality of conveying wheels are in contact with the concave glue collecting plate, a glue collecting through hole is formed in the convex glue collecting plate, and the excess glue collecting box is detachably fixedly installed on the U-shaped glue collecting plate and communicates with the glue collecting through hole.

[0025] One of the glue coating opening and closing parts includes an opening and closing plate and an opening and closing electric cylinder, the opening and closing plate is longitudinally slidably installed on one side of the two said glue blocking plates, the opening and closing plate is in sliding contact with the concave glue collecting plate, the opening and closing electric cylinder is installed on the glue coating platform, and the output end of the opening and closing electric cylinder is fixedly installed with the opening and closing plate.

[0026] One of the glue scraping parts includes a glue scraping plate and a glue scraping electric cylinder, a glue scraping groove is formed in the concave glue collecting plate, part of the glue scraping plate is located in the inside of the glue scraping groove, the glue scraping electric cylinder is installed on one side of the feeding frame, the output end of the glue scraping electric cylinder extends to the inside of the glue scraping groove and is fixedly installed with the glue scraping plate, and the glue scraping plate is in sliding contact with the inner bottom wall of the concave glue collecting plate.

[0027] The glue mist absorbing part includes a glue removing box, a glue removing fan, a glue removing frame, a filter screen and a plurality of glue removing pipes, the glue removing box is fixedly installed on the glue coating platform, the glue removing box is located below the concave glue collecting plate, the plurality of glue removing pipes are communicated between the concave glue collecting plate and the glue removing box, the glue removing fan is installed in the inside of the glue removing box, the glue removing frame is detachably fixedly installed on the glue removing box, the glue removing frame is located between the glue removing fan and the plurality of glue removing pipes, and the filter screen is installed on the glue removing frame.

[0028] In order to facilitate the scraping and loosening of the cured glue on the glue scraping plate and the excess glue collecting box, a manual cleaning rod is slidably installed on one side of the opening and closing plate of the feeding assembly, a cleaning plate is fixedly installed on one side of the manual cleaning rod, part of the cleaning plate is located in the inside of the excess glue collecting box, and the cleaning plate corresponds to the two said glue scraping plates.

[0029] Further based on the foregoing scheme, the rapid glue curing assembly includes a purple light curing box, a curing electric cylinder, a curing frame, a curing motor and a curing turntable.

[0030] The ultraviolet light curing box is installed on the feeding frame, is located above the discharging assembly, the curing electric cylinder is installed on the glue coating platform, the output end of the curing electric cylinder is fixedly installed with the curing frame, the curing motor is installed on the curing frame, the output end of the curing motor is fixedly installed with the curing turntable, and the curing turntable is located below the ultraviolet light curing box.

[0031] In order to facilitate the stable conveying of the circuit board, two limiting assemblies are installed on the feeding frame in a mirror image;

[0032] One of the limiting assemblies comprises a limiting frame and a plurality of limiting rollers, the plurality of limiting rollers are rotatably installed on the limiting frame at equal distances, and the limiting rollers located at the glue blocking plate partially extend into the inside of the coating cavity.

[0033] At least three position detection sensors are installed on the limiting frame on one side, the at least three position detection sensors correspond to the feeding assembly, the glue spraying assembly and the rapid glue curing assembly respectively, and are used for detecting the position of the circuit board.

[0034] In order to facilitate the protection of the feeding gear and the linkage gear, gear protection boxes are installed on both sides of the feeding frame.

[0035] (Three) beneficial effects

[0036] Compared with the known prior art, the present application provides a full-automatic UV glue coating equipment for ceramic integrated circuit board production, which has the following beneficial effects:

[0037] When the circuit board on the production line is coated with UV glue in a full coverage mode, the feeding assembly and the spraying feeding assembly are used to convey the circuit board on the production line into the inside of the excess material collecting assembly, the position of the glue spraying assembly is adjusted, the plurality of automatic glue spraying heads are partially inserted into the inside of the excess material collecting assembly, then the spraying feeding assembly drives the circuit board to reciprocate in the inside of the excess material collecting assembly, the plurality of automatic glue spraying heads uniformly coat the UV glue on the circuit board, in the automatic glue spraying head spraying process, the excess waste material sprayed from the inside of the automatic glue spraying head is collected by the excess material collecting assembly, the misted glue material is prevented from falling freely, the hygiene of the glue coating environment is greatly ensured, and after the automatic glue spraying head sprays glue, the position of the automatic glue spraying head is adjusted, the nozzle of the automatic glue spraying head is cleaned by the cleaning assembly, and the quality of the automatic glue spraying head during glue spraying is ensured.

[0038] Therefore, this fully automatic UV adhesive coating equipment for ceramic integrated circuit board production not only facilitates the collection of excess adhesive generated during the UV adhesive coating process on the circuit boards on the production line, preventing the atomized adhesive from falling indiscriminately, but also cleans the nozzles of the automatic spray head, ensuring the quality of the automatic spray head during adhesive spraying, and greatly improving the coating quality of the circuit boards. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0040] Figure 1 This is a three-dimensional structural schematic diagram showing a partial cross-section of the present invention;

[0041] Figure 2 This is a partial cross-sectional three-dimensional structural schematic diagram of the entire invention;

[0042] Figure 3 This is a three-dimensional structural diagram of the entire invention from another angle;

[0043] Figure 4 This is a three-dimensional structural diagram showing the disassembled spraying feeding assembly and the waste material receiving assembly of the present invention;

[0044] Figure 5 For the present invention Figure 1 A magnified schematic diagram of the partial structure at point A in the middle;

[0045] Figure 6 For the present invention Figure 1 A magnified schematic diagram of the local structure at point B;

[0046] Figure 7 For the present invention Figure 1 A magnified schematic diagram of the structure at point C in the middle;

[0047] Figure 8 For the present invention Figure 4 A magnified schematic diagram of the structure at point D.

[0048] The labels in the diagram represent: 001, glue spraying assembly; 002, cleaning assembly; 003, feeding assembly; 004, discharging assembly; 005, spraying material conveying assembly; 006, surplus material collection assembly; 007, rapid glue curing assembly.

[0049] 1, glue platform; 2, automatic glue spraying head; 3, feeding frame; 4, glue spraying frame; 5, horizontal adjustment electric cylinder; 6, vertical adjustment electric cylinder; 7, glue spraying slide plate; 8, spraying head seat; 9, cleaning plate; 10, cotton changing plate; 11, cleaning sponge; 12, cleaning spring; 13, feeding motor; 14, feeding rotating rod; 15, feeding roller; 16, feeding belt; 17, spraying motor; 18, spraying gearbox; 19, linkage rod; 20, material conveying wheel; 21, material conveying rotating rod; 22, material conveying gear; 23, linkage gear; 24, glue blocking cover; 25, concave glue collecting plate; 26, excess glue collecting box; 27, glue blocking plate; 28, rubber protection ring; 29, opening and closing plate; 30, opening and closing electric cylinder; 31, material scraping plate; 32, material scraping electric cylinder; 33, glue removing box; 34, glue removing fan; 35, glue removing frame; 36, filter screen; 37, glue removing pipe; 38, manual cleaning rod; 39, cleaning plate; 40, ultraviolet curing box; 41, curing electric cylinder; 42, curing frame; 43, curing motor; 44, curing turntable; 45, limiting frame; 46, limiting roller; 47, position detection sensor. DETAILED DESCRIPTION

[0050] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0051] Embodiment 1

[0052] Please refer to Figures 1 to 8 , the full-automatic UV glue coating equipment for ceramic integrated circuit board production, comprising a bidirectional adjustable glue spraying assembly 001, a glue platform 1, a material conveying mechanism for conveying the circuit board, and an excess glue collecting assembly 006;

[0053] The above-mentioned glue spraying assembly 001 is installed on the glue platform 1 and is used for full-coverage glue coating operation of the circuit board. The glue spraying assembly 001 comprises a plurality of automatic glue spraying heads 2 arranged side by side. The glue spraying assembly 001 is further provided with a cleaning assembly 002 for quick cleaning of the plurality of automatic glue spraying heads 2. During installation, the plurality of automatic glue spraying heads 2 need to be connected with an external UV glue supply system. UV glue can be sprayed out through the automatic glue spraying heads 2;

[0054] The glue spraying assembly 001 further comprises a glue spraying frame 4, a horizontal adjusting electric cylinder 5, a vertical adjusting electric cylinder 6, a glue spraying sliding plate 7 and a nozzle seat 8. The glue spraying frame 4 is fixedly installed on the glue coating platform 1, and a glue spraying through hole is formed in the glue spraying frame 4. The glue spraying sliding plate 7 is slidingly installed in the glue spraying through hole. The horizontal adjusting electric cylinder 5 is installed on one side of the glue spraying frame 4, and the output end of the horizontal adjusting electric cylinder 5 is fixedly installed at one end of the glue spraying sliding plate 7. The vertical adjusting electric cylinder 6 is installed on the glue spraying sliding plate 7, and the output end of the vertical adjusting electric cylinder 6 is fixedly installed on the nozzle seat 8 downward through the glue spraying sliding plate 7. A plurality of automatic glue spraying heads are equidistantly arranged and installed on the nozzle seat 8. Specifically, the horizontal adjusting electric cylinder 5 is started, the output end of the horizontal adjusting electric cylinder 5 drives the glue spraying sliding plate 7 to move, and the plurality of automatic glue spraying heads 2 are driven by the glue spraying sliding plate 7 to move horizontally. The vertical adjusting electric cylinder 6 is started, the output end of the vertical adjusting electric cylinder 6 drives the nozzle seat 8 to move, and the plurality of automatic glue spraying heads 2 are driven by the nozzle seat 8 to move in the vertical position.

[0055] The cleaning assembly 002 comprises a cleaning plate 9, a cotton changing plate 10, a cleaning sponge 11 and a plurality of cleaning springs 12. The cleaning plate 9 is fixedly installed on the glue spraying frame 4. One end of each of the plurality of cleaning springs 12 is fixedly installed on the cleaning plate 9, and the other end is fixedly installed on the cotton changing plate 10. The cleaning sponge 11 is detachably installed on the cotton changing plate. When the plurality of automatic glue spraying heads 2 are cleaned by the cleaning assembly, the plurality of automatic glue spraying heads 2 are moved to the cleaning sponge 11 by the horizontal adjusting electric cylinder 5 and the vertical adjusting electric cylinder 6, so that the automatic glue spraying heads 2 and the cleaning sponge 11 are in sliding contact. The residual glue on the automatic glue spraying heads 2 can be cleaned. When the cleaning sponge 11 is saturated with glue, the cleaning sponge 11 can be replaced.

[0056] The above-described feeding mechanism is installed on the glue coating platform 1. The feeding mechanism comprises a feeding frame 3, a feeding assembly 003, a discharging assembly 004 and a spraying feeding assembly 005. The feeding assembly 003, the discharging assembly 004 and the spraying feeding assembly 005 are all installed on the feeding frame 3. The feeding assembly 003 and the discharging assembly 004 are respectively located on the two sides of the spraying feeding assembly 005. The spraying feeding assembly 005 is located below the glue spraying assembly 001.

[0057] The feeding assembly 003 and the discharging assembly 004 are the same in structure, wherein the feeding assembly 003 comprises a feeding motor 13, two feeding rotating rods 14 and at least two feeding parts, each feeding part is installed on the two feeding rotating rods 14, the two feeding rotating rods 14 are rotatably installed on the feeding frame 3, the feeding motor 13 is installed on one side of the feeding frame 3, the output end of the feeding motor 13 is fixedly installed on one side of one of the feeding rotating rods 14, one of the feeding parts comprises two feeding rollers 15 and a feeding belt 16, the two feeding rollers 15 are fixedly installed on the two feeding rotating rods 14 respectively, the feeding belt 16 is drivingly installed between the two feeding rollers 15, specifically, when the feeding assembly 003 and the discharging assembly 004 are used to convey the circuit board on the production line, the two feeding belts 16 on the feeding assembly 003 are connected with the production line conveying the circuit board, the feeding motor 13 is started, the output end of the feeding motor 13 drives the feeding rotating rod 14 to rotate, the feeding rotating rod 14 drives the feeding roller 15 to rotate, the feeding roller 15 drives the feeding belt 16 to drive, and the circuit board on the production line can be conveyed by the movement of the feeding belt 16.

[0058] The spraying material conveying assembly 005 comprises a spraying motor 17, a spraying gearbox 18, a linkage rod 19 and two material conveying parts, the two material conveying parts are installed in mirror image on the feeding frame 3, the linkage rod 19 is installed between the two material conveying parts, each material conveying part comprises a plurality of material conveying wheels 20, a plurality of material conveying rotating rods 21 and a plurality of material conveying gears 22, the plurality of material conveying rotating rods 21 are rotatably installed on the feeding frame 3 at equal distances, one end of the plurality of material conveying rotating rods 21 is fixedly installed with the plurality of material conveying wheels 20 respectively, the other end is fixedly installed with the plurality of material conveying gears 22 respectively, adjacent two material conveying gears 22 are engaged with a linkage gear 23, the plurality of linkage gears 23 are rotatably installed on the feeding frame 3 through a linkage rotating rod, the plurality of material conveying wheels 20 are flush with the feeding belt 16, the spraying motor 17 and the spraying gearbox 18 are installed on the gluing platform 1 through a machine base, the output end of the spraying motor 17 is fixedly installed with the input end of the spraying gearbox 18, the output end of the spraying gearbox 18 is fixedly installed with one of the material conveying gears 22, the linkage rod 19 is fixedly installed between the two material conveying wheels 20 corresponding to one side of the spraying motor 17, specifically, when the feeding assembly 003 drives the circuit board to be conveyed to the spraying material conveying assembly 005, the spraying motor 17 is started, the output end of the spraying motor 17 drives the input end of the spraying gearbox 18 to rotate, the output end of the spraying gearbox 18 drives the material conveying gear 22 connected thereto to rotate through the speed reduction and torque increase of the spraying gearbox 18, the material conveying gear 22 drives the linkage gear 23 engaged therewith to rotate, and the plurality of material conveying gears 22 are synchronously and unidirectionally rotated through the cooperation of the linkage rod 19, the material conveying gear 22 drives the material conveying rotating rod 21 to rotate, the plurality of material conveying wheels 20 are synchronously and unidirectionally rotated through the material conveying rotating rod 21, and the circuit board can be moved through the rotation of the material conveying wheel 20.

[0059] As shown in Figure 1 and Figure 4 The above-mentioned excess material collecting assembly 006 is installed on the gluing platform 1, and part of the spraying material conveying assembly 005 is located inside the excess material collecting assembly 006, which is used to collect the excess glue sprayed inside the plurality of automatic glue spraying heads 2, so as to prevent the atomized glue from falling randomly;

[0060] The excess material collecting assembly 006 comprises a glue blocking cover 24, a concave glue collecting plate 25, an excess material collecting box 26, a glue mist absorbing part, two glue blocking plates 27, two glue applying opening and closing parts, and two material scraping parts. The two glue applying opening and closing parts are respectively arranged on the two sides of the two glue blocking plates 27. The two material scraping parts are respectively arranged on the two sides of the concave glue collecting plate 25. The two glue blocking plates 27 are fixedly installed on the glue applying platform 1. The concave glue collecting plate 25 is fixedly installed between the two glue blocking plates 27. The glue blocking cover 24 is detachably fixedly installed on the two glue blocking plates 27. The glue blocking cover 24, the concave glue collecting plate 25 and the two glue blocking plates 27 form a coating cavity. A plurality of coating through holes are formed in the glue blocking cover 24. A rubber protection ring 28 is arranged in each of the plurality of coating through holes. The plurality of coating through holes correspond to the plurality of automatic glue spraying heads 2 respectively. The plurality of material conveying wheels 20 partially pass through the concave glue collecting plate 25 to the inside of the coating cavity, and the plurality of material conveying wheels 20 are in contact with the concave glue collecting plate 25. A glue collecting through hole is formed in the convex glue collecting plate. The excess material collecting box 26 is detachably fixedly installed on the U-shaped glue collecting plate. The excess material collecting box 26 is in communication with the glue collecting through hole. One of the glue applying opening and closing parts comprises an opening and closing plate 29 and an opening and closing electric cylinder 30. The opening and closing plate 29 is installed in sliding mode on one side of the two glue blocking plates 27. The opening and closing plate 29 is in sliding contact with the concave glue collecting plate 25. The opening and closing electric cylinder 30 is installed on the glue applying platform 1. The output end of the opening and closing electric cylinder 30 is fixedly installed with the opening and closing plate 29. One of the material scraping parts comprises a material scraping plate 31 and a material scraping electric cylinder 32. A material scraping groove is formed in the concave glue collecting plate 25. Part of the material scraping plate 31 is located in the inside of the material scraping groove. The material scraping electric cylinder 32 is installed on one side of the material feeding frame 3. The output end of the material scraping electric cylinder 32 extends to the inside of the material scraping groove and is fixedly installed with the material scraping plate 31. The material scraping plate 31 is in sliding contact with the inner bottom wall of the concave glue collecting plate 25. The glue mist absorbing part comprises a glue removing box 33, a glue removing fan 34, a glue removing frame 35, a filter screen 36 and a plurality of glue removing pipes 37. The glue removing box 33 is fixedly installed on the glue applying platform 1. The glue removing box 33 is located below the concave glue collecting plate 25. The plurality of glue removing pipes 37 are in communication between the concave glue collecting plate 25 and the glue removing box 33. The glue removing fan 34 is installed in the inside of the glue removing box 33. The glue removing frame 35 is detachably fixedly installed on the glue removing box 33. The glue removing frame 35 is located between the glue removing fan 34 and the plurality of glue removing pipes 37. The filter screen 36 is installed on the glue removing frame 35. A manual cleaning rod 38 is installed in sliding mode on the opening and closing plate 29 on one side of the material feeding assembly 003. A cleaning plate 39 is fixedly installed on one side of the manual cleaning rod 38. Part of the cleaning plate 39 is located in the inside of the excess material collecting box 26. The cleaning plate 39 corresponds to the two material scraping plates 31.

[0061] Specifically, when the circuit board is fully covered with UV glue in the inside of the coating cavity, the circuit board is transported into the inside of the coating cavity by the spraying material conveying assembly 005, then the opening and closing electric cylinder 30 is started, the output end of the opening and closing electric cylinder 30 drives the opening and closing plate 29 to move, the coating cavity is closed through the movement of the two opening and closing plates 29, and the horizontal adjusting electric cylinder 5 and the vertical adjusting electric cylinder 6 are started, so that parts of the plurality of automatic glue spraying heads 2 are respectively moved to the inside of the corresponding coating through hole, the rubber protection ring 28 on the coating through hole can effectively prevent the automatic glue spraying head 2 from colliding with the glue blocking cover 24, and the sealing between the automatic glue spraying head 2 and the glue blocking cover 24 is increased, after the plurality of automatic glue spraying heads 2 enter the inside of the coating cavity and coat one end of the circuit board, the automatic glue spraying head 2 sprays UV glue, in order to ensure the spraying effect of the UV glue, the UV glue is sprayed in the form of a fan, which is the best, when the automatic glue spraying head 2 sprays UV glue, the spraying motor 17 is started synchronously, the plurality of conveying wheels drive the circuit board to move at a constant speed, and the upper surface of the circuit board is fully coated, in the spraying process, the circuit board can be quickly reciprocated in the coating cavity through the forward and reverse movement of the spraying motor 17, the upper surface of the circuit board is sprayed at least twice, the coating of the connection between each component and the circuit board can be better, the coating effect is more uniform, and when the circuit board is reciprocated, the UV glue coated on the circuit board can be shaken and impacted by colliding with the opening and closing plate 29, so that the thickness of the UV glue coated on the circuit board is more uniform, after the UV glue is uniformly coated on the circuit board, the opening and closing electric cylinder 30 drives the opening and closing plate 29 to descend, and the coated circuit board is conveyed to the discharging assembly 004 by the spraying material conveying assembly 005;

[0062] In the circuit board coating process, the glue removal fan 34 is started, the glue removal fan 34 extracts the atomized glue generated inside the coating cavity to the inside of the glue removal tank 33 through the glue removal pipe 37, and the atomized glue is adsorbed and removed through the filter screen 36 arranged inside the glue removal tank 33. When the glue on the filter screen 36 is saturated, the filter screen 36 can be replaced by removing the glue removal frame 35. When the residual glue sprayed inside the coating cavity is too much and needs to be cleaned regularly, the material scraping electric cylinder 32 is started, the material scraping electric cylinder 32 drives the material scraping plate 31 to move, and the solid or liquid glue attached to the concave glue collecting plate 25 is scraped to the inside of the excess glue collecting box 26 through the material scraping plate 31. Then, the opening and closing electric cylinder 30 provided with the manual cleaning rod 38 is started, the opening and closing electric cylinder 30 drives the opening and closing plate 29 to move, the opening and closing plate 29 drives the manual cleaning rod 38 and the cleaning plate 39 to move, and the cleaning plate 39 is moved to be flush with and in contact with the material scraping plate 31. After that, the residual glue attached to the material scraping plate 31 is scraped to the inside of the excess glue collecting box 26 by manually pulling the manual cleaning rod 38. Then, part of the cleaning plate 39 is moved to the inside of the excess glue collecting box 26 through the movement of the opening and closing plate 29. The solidified glue attached to the inside of the excess glue collecting box 26 is loosened by pulling the manual cleaning rod 38 again through the cleaning plate 39. Then, the glue collected in the excess glue collecting box 26 is treated by disassembling the excess glue collecting box 26.

[0063] Example 2

[0064] The embodiment 2 of the present application is further described based on the embodiment 1.

[0065] The quick glue curing assembly 007 is further arranged on the feeding frame 3 and the glue coating platform 1, and is located at the discharging assembly 004, and is used for quickly curing the coated circuit board.

[0066] The rapid glue curing assembly 007 comprises a purple light curing box 40, a curing electric cylinder 41, a curing frame 42, a curing motor 43 and a curing turntable 44. The purple light curing box 40 is installed on the feeding frame 3 and located above the discharging assembly 004. The curing electric cylinder 41 is installed on the glue coating platform 1 and fixedly connected with the curing frame 42. The curing motor 43 is installed on the curing frame 42 and fixedly connected with the curing turntable 44. The curing turntable 44 is located below the purple light curing box 40. When the circuit board on the discharging assembly 004 moves to the rapid glue curing assembly 007, the coating time of the circuit board is utilized, the curing electric cylinder 41 is started, the output end of the curing electric cylinder 41 drives the curing frame 42 to move, the curing frame 42 drives the curing motor 43 and the curing turntable 44 to move, the circuit board coated on the discharging assembly 004 is moved to the inside of the purple light curing box 40 through the curing turntable 44, and the circuit board is irradiated comprehensively by the purple light curing box 40, so that the UV glue is rapidly cured. During the curing of the UV glue, the curing electric cylinder 41 is started, the curing electric cylinder 41 drives the curing turntable 44 to rotate, the circuit board rotates in the purple light curing box 40, the glue between each electronic component on the circuit board and the circuit board can be irradiated by the purple light, the curing effect is ensured, and a non-slip pad can be installed on the curing turntable 44 to ensure the direct friction force between the curing turntable 44 and the circuit board.

[0067] In order to ensure the stability of the circuit board during conveying, two limiting assemblies are installed on the feeding frame 3 in a mirror image, one of the limiting assemblies comprises a limiting frame 45 and a plurality of limiting rollers 46, the plurality of limiting rollers 46 are installed on the limiting frame 45 at equal distances and rotate, the plurality of limiting rollers 46 located at the glue blocking plate 27 extend partially into the coating cavity, the position of the circuit board can be effectively offset by the limiting rollers 46 during movement of the circuit board, the friction force between the limiting rollers 46 and the circuit board is reduced by rotation of the limiting rollers 46, and stable conveying of the circuit board is ensured.

[0068] Meanwhile, at least three position detection sensors 47 are installed on the limiting frame 45 on one side, the at least three position detection sensors 47 correspond to the feeding assembly 003, the glue spraying assembly 001 and the rapid glue curing assembly 007 respectively, and are used for detecting the position of the circuit board.

[0069] The position detection sensor 47 corresponding to the feeding assembly 003 is mainly used for detecting the circuit board on the feeding assembly 003. When the circuit board in the coating cavity is coated, the feeding assembly 003 stops moving after sensing the circuit board. After the circuit board in the coating cavity is coated and moves to the discharging assembly 004, the feeding assembly 003 is started again to convey the circuit board on the feeding assembly to the inside of the coating cavity.

[0070] The position detection sensor 47 corresponding to the glue spraying assembly 001 is mainly used for position detection and control of the circuit board on the spraying and feeding assembly 005, so as to ensure that the position of the circuit board on the spraying and feeding assembly 005 is at the spraying position where the automatic glue spraying head 2 starts.

[0071] The position detection sensor 47 corresponding to the fast glue fixing assembly 007 is mainly used for position detection of the circuit board on the discharging assembly 004, so as to ensure that the circuit board is just above the fixing turntable 44 when the circuit board stays on the discharging assembly 004.

[0072] In order to protect the feeding gear 22 and the linkage gear 23, gear protection boxes are installed on both sides of the feeding frame 3.

[0073] The longitudinal adjusting electric cylinder 6, the transverse adjusting electric cylinder 5, the automatic glue spraying head 2, the feeding motor 13, the spraying motor 17, the spraying gearbox 18, the opening and closing electric cylinder 30, the material scraping electric cylinder 32, the glue removing fan 34, the curing electric cylinder 41, the ultraviolet curing box 40, the curing motor 43 and the position detection sensor 47 are all conventional devices known to those skilled in the art, which can be selected or customized according to actual needs, and the setting mode, the installation mode and the electrical connection mode can be programmed according to the movement track or the opening and closing interval, and the control switch matched with the devices can be provided, and the installation position of the control switch can be selected according to actual use requirements, so that the operator can operate and control, and the devices will not be described in detail.

[0074] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A full-automatic UV glue coating equipment for ceramic integrated circuit board production, characterized in that, The utility model relates to a full-coverage type line board gluing device, including: Bidirectional adjustable glue spraying assembly (001) and glue coating platform (1), the glue spraying assembly (001) is installed on the glue coating platform (1), is used to carry out full-coverage type gluing operation to line board, the glue spraying assembly (001) includes multiple automatic glue spraying head (2) of multiple side -by -side arrangement, the glue spraying assembly (001) still is provided with the cleaning assembly (002) for multiple automatic glue spraying head (2) carries out quick cleaning, Material conveying mechanism for conveying line board, the material conveying mechanism is installed on the glue coating platform (1), the material conveying mechanism includes feeding frame (3), feeding assembly (003), discharging assembly (004) and spraying material conveying assembly (005), feeding assembly (003), discharging assembly (004) and spraying material conveying assembly (005) are all installed on the feeding frame (3), feeding assembly (003) and discharging assembly (004) are located at two sides of spraying material conveying assembly (005) respectively, and spraying material conveying assembly (005) is located below the glue spraying assembly (001), Excess material collecting assembly (006), the excess material collecting assembly (006) is installed on the glue coating platform (1), part of spraying material conveying assembly (005) is located inside excess material collecting assembly (006), is used to collect the excess glue material that multiple automatic glue spraying head (2) inside sprays to prevent atomized glue material from drifting wildly, The excess material collecting assembly (006) includes glue blocking cover (24), concave glue collecting plate (25), excess material collecting box (26), glue mist absorbing part, two glue blocking plates (27), two glue coating opening and closing parts and two material scraping parts, two glue coating opening and closing parts are arranged at two sides of two glue blocking plates (27) respectively, and two material scraping parts are arranged at two sides of concave glue collecting plate (25) respectively, Two glue blocking plates (27) are fixedly installed on the glue coating platform (1), concave glue collecting plate (25) is fixedly installed between two glue blocking plates (27), glue blocking cover (24) is detachably fixedly installed on two glue blocking plates (27), glue blocking cover (24), concave glue collecting plate (25) and two glue blocking plates (27) form coating cavity, a plurality of coating through holes are formed in glue blocking cover (24), a plurality of rubber protection rings (28) are arranged in a plurality of coating through holes, a plurality of coating through holes correspond to a plurality of automatic glue spraying heads (2) respectively, a plurality of material conveying wheels (20) partially pass through concave glue collecting plate (25) to the inside of coating cavity, and a plurality of material conveying wheels (20) are in contact with concave glue collecting plate (25), glue collecting through hole is formed in concave glue collecting plate (25), and excess material collecting box (26) is detachably fixedly installed on concave glue collecting plate (25), and excess material collecting box (26) is in communication with glue collecting through hole. One of the glue coating opening and closing parts includes an opening and closing plate (29) and an opening and closing electric cylinder (30). The opening and closing plate (29) is longitudinally slidingly installed on one side of the two glue blocking plates (27). The opening and closing plate (29) is in sliding contact with the concave glue collecting plate (25). The opening and closing electric cylinder (30) is installed on the glue coating platform (1). The output end of the opening and closing electric cylinder (30) is fixedly installed with the opening and closing plate (29). One of the glue coating opening and closing parts includes an opening and closing plate (29) and an opening and closing electric cylinder (30). The opening and closing plate (29) is longitudally slidingly installed on one side of the two glue blocking plates (27). The opening and closing plate (29) is in sliding contact with the concave glue collecting plate (25). The opening and closing electric cylinder (30) is installed on the glue coating platform (1). The output end of the opening and closing electric cylinder (30) is fixedly installed with the opening and closing plate (29). The glue mist absorbing part includes a glue removing box (33), a glue removing fan (34), a glue removing frame (35), a filter screen (36) and a plurality of glue removing pipes (37). The glue removing box (33) is fixedly installed on the glue coating platform (1). The glue removing box (33) is located below the concave glue collecting plate (25). The plurality of glue removing pipes (37) are all communicated between the concave glue collecting plate (25) and the glue removing box (33). The glue removing fan (34) is installed in the glue removing box (33). The glue removing frame (35) is detachably fixedly installed on the glue removing box (33). The glue removing frame (35) is located between the glue removing fan (34) and the plurality of glue removing pipes (37). The filter screen (36) is installed on the glue removing frame (35).

2. The full-automatic UV glue coating apparatus for ceramic integrated circuit board production according to claim 1, characterized in that, The glue coating platform (1) and the glue coating platform (1) are also provided with a quick glue fixing assembly (007). The quick glue fixing assembly (007) is located at the discharging assembly (004) and is used for quickly fixing the circuit board after glue coating.

3. The full-automatic UV glue coating apparatus for ceramic integrated circuit board production according to claim 2, characterized in that, The glue coating assembly (001) further comprises a glue coating frame (4), a horizontal adjusting electric cylinder (5), a vertical adjusting electric cylinder (6), a glue coating sliding plate (7) and a nozzle seat (8). The glue coating frame (4) is fixedly installed on the glue coating platform (1). The glue coating frame (4) is provided with a glue coating through hole. The glue coating sliding plate (7) is slidingly installed in the glue coating through hole. The horizontal adjusting electric cylinder (5) is installed on one side of the glue coating frame (4). The output end of the horizontal adjusting electric cylinder (5) is fixedly installed with one end of the glue coating sliding plate (7). The vertical adjusting electric cylinder (6) is installed on the glue coating sliding plate (7). The output end of the vertical adjusting electric cylinder (6) is fixedly installed with the nozzle seat (8) by penetrating the glue coating sliding plate (7) downward. A plurality of automatic glue coating heads (2) are equidistantly arranged and installed on the nozzle seat (8).

4. The full-automatic UV glue coating apparatus for ceramic integrated circuit board production according to claim 3, characterized in that, The cleaning assembly (002) comprises a cleaning plate (9), a cotton replacing plate (10), a cleaning sponge (11) and a plurality of cleaning springs (12). The cleaning plate (9) is fixedly installed on the glue spraying frame (4), one end of each of the plurality of cleaning springs (12) is fixedly installed on the cleaning plate (9), and the other end is fixedly installed on the cotton changing plate (10), and the cleaning sponge (11) is detachably installed on the cotton changing plate (10).

5. The full-automatic UV glue coating apparatus for ceramic integrated circuit board production according to claim 4, characterized in that, The feeding assembly (003) and the discharging assembly (004) are the same in structure, wherein the feeding assembly (003) comprises a feeding motor (13), two feeding rotating rods (14) and at least two feeding parts, each of the feeding parts is installed on the two feeding rotating rods (14); Both of the two feeding rotating rods (14) are rotatably installed on the feeding frame (3), the feeding motor (13) is installed on one side of the feeding frame (3), and the output end of the feeding motor (13) is fixedly installed on one side of one of the feeding rotating rods (14). One of the feeding parts comprises two feeding rollers (15) and a feeding belt (16), the two feeding rollers (15) are fixedly installed on the two feeding rotating rods (14) respectively, and the feeding belt (16) is drivingly installed between the two feeding rollers (15).

6. The full-automatic UV glue coating apparatus for ceramic integrated circuit board production according to claim 5, characterized in that, The spraying material conveying assembly (005) comprises a spraying motor (17), a spraying gearbox (18), a linkage rod (19) and two material conveying parts, the two material conveying parts are mirror-symmetrically installed on the feeding frame (3), and the linkage rod (19) is installed between the two material conveying parts; Each of the material conveying parts comprises a plurality of material conveying wheels (20), a plurality of material conveying rotating rods (21) and a plurality of material conveying gears (22), the plurality of material conveying rotating rods (21) are rotatably installed on the feeding frame (3) at equal distances, one end of each of the plurality of material conveying rotating rods (21) is fixedly installed on the plurality of material conveying wheels (20) respectively, the other end is fixedly installed on the plurality of material conveying gears (22) respectively, the adjacent two material conveying gears (22) are engaged with a linkage gear (23), the plurality of linkage gears (23) are rotatably installed on the feeding frame (3) through a linkage rotating rod, and the plurality of material conveying wheels (20) are flush with the feeding belt (16); The spraying motor (17) and the spraying gearbox (18) are installed on the glue coating platform (1) through a machine base, the output end of the spraying motor (17) is fixedly installed on the input end of the spraying gearbox (18), the output end of the spraying gearbox (18) is fixedly installed on one of the material conveying gears (22), and the linkage rod (19) is fixedly installed between the corresponding two material conveying wheels (20) on one side of the spraying motor (17).

7. The full-automatic UV glue coating apparatus for ceramic integrated circuit board production according to claim 6, characterized in that, The manual cleaning rod (38) is slidably installed on the opening and closing plate (29) on one side of the feeding assembly (003), one side of the manual cleaning rod (38) is fixedly installed with a cleaning plate (39), part of the cleaning plate (39) is located inside the excess material collecting box (26), the cleaning plate (39) corresponds to the two material scraping plates (31), and the cleaning plate (39) is used for scraping off the solidified glue on the material scraping plate (31) and the excess material collecting box (26).

8. The full-automatic UV glue coating apparatus for ceramic integrated circuit board production according to claim 7, characterized in that, The rapid glue curing assembly (007) comprises a purple light curing box (40), a curing electric cylinder (41), a curing frame (42), a curing motor (43) and a curing turntable (44). The purple light curing box (40) is installed on the feeding frame (3), the purple light curing box (40) is located above the discharging assembly (004), the curing electric cylinder (41) is installed on the glue coating platform (1), the output end of the curing electric cylinder (41) is fixedly installed with the curing frame (42), the curing motor (43) is installed on the curing frame (42), the output end of the curing motor (43) is fixedly installed with the curing turntable (44), and the curing turntable (44) is located below the purple light curing box (40).

9. The full-automatic UV glue coating apparatus for ceramic integrated circuit board production according to claim 8, characterized in that, The feeding frame (3) is mirror-imaged installed with two limiting assemblies, and the position of the circuit board is limited in the circuit board conveying process. One of the limiting assemblies comprises a limiting frame (45) and a plurality of limiting rollers (46), the plurality of limiting rollers (46) are rotatably installed on the limiting frame (45) at equal distances, and the plurality of limiting rollers (46) located at the glue blocking plate (27) partially extend into the coating cavity. At least three position detection sensors (47) are installed on the limiting frame (45) on one side, the at least three position detection sensors (47) correspond to the feeding assembly (003), the glue spraying assembly (001) and the rapid glue curing assembly (007) respectively, and the position of the circuit board is detected.

Images