Processing Equipment and Processing Method for Edge Skin Silicon Blocks

Abstract

An embodiment of the present application provides a processing device and a processing method for edge silicon blocks. The processing device includes a base, and the base is provided with a fixing device, a centering device, and a grinding device. The centering device and the grinding device are arranged at intervals along a first direction; the fixing device is slidably arranged between the centering device and the grinding device along the first direction, and is used for fixing the edge silicon block and driving the edge silicon block to rotate; when the edge silicon block moves to between two clamping members along with the fixing device, the two clamping members move towards each other so that the center of the edge silicon block coincides with the center of the support table; the grinding device includes at least one grinding part; when the edge silicon block moves to one side of the grinding part along a second direction along with the fixing device, the grinding part grinds the edge silicon block. The processing device and the processing method for edge silicon blocks provided by the present application have the advantages of improving production efficiency and processing accuracy.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of crystalline silicon processing, and particularly to a processing device and a processing method for edge silicon blocks. Background Art

[0002] Silicon wafers are important materials used in solar photovoltaic power generation. The manufacturing process of silicon wafers used to make solar panels includes several steps: crystal pulling, truncating, squaring, grinding and chamfering, etc. Crystal pulling is to generate a cylindrical silicon rod with a maximum length of 6 meters through chemical deposition in a crystal pulling furnace; truncating means cutting the pulled silicon rod into small segments with different lengths (100 - 700 mm); squaring means cutting the silicon rods with different lengths after truncating into cuboid shapes; grinding and chamfering means grinding and polishing the four surfaces of the cuboid single-crystal silicon rod after squaring, and chamfering the four edges.

[0003] To maximize the utilization of silicon rods, refer to Figure 1a and Figure 1b , after the squaring process of the silicon rod, four edge pieces with arc surfaces will be generated. Refer to Figure 1c , the edge pieces can be truncated to form edge silicon strips. Refer to Figure 1d , the edge silicon strips are truncated into multiple edge silicon blocks. Refer to Figure 1e , the four side surfaces of the edge silicon blocks are ground and polished, and the four side edges of the edge silicon blocks are chamfered.

[0004] However, the grinding and chamfering processes of the above-mentioned edge silicon blocks require manual participation, which affects the production efficiency. Summary of the Invention

[0005] The embodiments of the present application provide a processing device and a processing method for edge silicon blocks to solve the problem that the grinding and chamfering processes of edge silicon blocks require manual participation, which affects the production efficiency.

[0006] To achieve the above object, the present application provides the following technical solutions:

[0007] One aspect of the embodiments of the present application provides a processing device for edge silicon blocks, including a base. The base is provided with a fixing device, a centering device, and a grinding device. The centering device and the grinding device are arranged at intervals along a first direction; the fixing device is slidably arranged on the base along the first direction, and the fixing device fixes the edge silicon block and drives the edge silicon block to rotate; the centering device includes two clamping members arranged at intervals along a second direction; when the edge silicon block moves between the two clamping members along with the fixing device, the two clamping members move towards each other so that the center of the edge silicon block coincides with the center of the support table; the grinding device includes at least one grinding part; when the edge silicon block moves to one side of the grinding part along the second direction along with the fixing device, the grinding part grinds the edge silicon block, and the second direction intersects the first direction.

[0008] The processing device for edge silicon blocks provided by the present application, by setting a fixing device, the fixing device fixes the edge silicon block and drives the edge silicon block to rotate; and by setting a centering device, when the edge silicon block moves between the two clamping members along with the fixing device, the two clamping members move towards each other to center the edge silicon block; and by setting a grinding device, when the edge silicon block moves to one side of the grinding part along the second direction along with the fixing device, the grinding part grinds the edge silicon block. In this way, during the grinding process of the edge silicon block, manual centering is not required, and manual moving of the edge silicon block is not required, so as to improve production efficiency and processing accuracy.

[0009] In one possible implementation manner, the fixing device includes a frame body. The frame body is slidably arranged on the base. The frame body is provided with a support table and a pressing table arranged at intervals along a third direction. The support table is rotatably arranged on the frame body and is used for placing the edge silicon block. The pressing table is slidably arranged on the frame body along the third direction and presses the edge silicon block between the pressing table and the support table, and both the edge silicon block and the pressing table rotate along with the rotation of the support table; the third direction, the second direction, and the first direction intersect pairwise.

[0010] Through the above solution, the edge silicon block is fixed to the fixing device, and the pressing table of the fixing device is moved along the third direction to press the edge silicon block between the pressing table and the supporting table, and both the pressing table and the edge silicon block can rotate with the rotation of the supporting table. The pressed edge silicon block moves with the frame body between the two clamping members of the centering device, and by making the two clamping members move towards each other, the center of the edge silicon block coincides with the center of the supporting table; the centered edge silicon block moves with the frame body to one side of the grinding part of the grinding device along the second direction, and the side surface of the edge silicon block is ground by the grinding part. After the grinding part has ground one side surface or side edge of the edge silicon block, the edge silicon block can rotate with the supporting table to turn the side surface or side edge of the edge silicon block that has not been processed by the grinding part towards the grinding part. After the grinding device has completed the grinding work, the pressing table is moved away from the edge silicon block, and the edge silicon block is removed from the supporting table.

[0011] In one possible implementation, the supporting table includes a fixing part and a floating part arranged in sequence along the third direction. The floating part faces the pressing table and has a gap with the fixing part. An elastic part and a rotating shaft are provided between the floating part and the fixing part. The rotating shaft is fixed to the fixing part, and the floating part deflects relative to the fixing part through the rotating shaft.

[0012] Through the above solution, the edge silicon block can be placed on the upper surface of the floating part, and the floating part can achieve the angular deflection between it and the fixing part through the rotating shaft to adapt to the uneven end face of the edge silicon block.

[0013] In one possible implementation, the rotating shaft is spherical.

[0014] Through the above solution, multi-directional deflection of the floating part relative to the fixing part can be achieved to facilitate adapting to the defects of the end face of the edge silicon block in different orientations.

[0015] In one possible implementation, the clamping member has a clamping surface for contacting and clamping the edge silicon block; the clamping surface is configured to be parallel to the side surface of the edge silicon block.

[0016] Through the above solution, the two clamping members move towards each other to clamp the edge silicon block. Among them, the two clamping members move towards each other, and the two clamping members approach one pair of side surfaces of the edge silicon block respectively. When the clamping surface of each clamping member abuts against one surface of one pair of side surfaces of the edge silicon block, the two clamping members move away from each other to move away from the edge silicon block. Then, the edge silicon block is rotated 90° by the support platform. The two clamping members move towards each other again, and the two clamping members approach the other pair of side surfaces of the edge silicon block respectively. When the clamping surface of each clamping member abuts against one surface of the other pair of side surfaces of the edge silicon block, the center of the edge silicon block coincides with the centers of the two clamping members, and further the center of the edge silicon block coincides with the center of the support platform. The two clamping members move towards each other again and move away from the edge silicon block.

[0017] In one possible implementation, the clamping member has a clamping surface for contacting the edge silicon block and clamping the edge silicon block; the clamping surface is configured to be parallel to the side surface of the edge silicon block.

[0018] Through the above solution, the support platform can first drive the edge silicon block to rotate a certain angle. At this angle, the diagonal of the edge silicon block is perpendicular to the intersection line of the first surface and the second surface of the clamping member. The two clamping members move towards each other until the two clamping members abut against the two diagonals of the edge silicon block respectively, so that the centers in the length direction and the width direction of the edge silicon block both coincide with the center of the clamping member, and further the center of the edge silicon block coincides with the center of the support platform. The two clamping members move towards each other again and move away from the edge silicon block. By selecting this solution, the centering work of the edge silicon block can be completed by one movement of the clamping member, which has the advantages of shortening the centering operation time and simplifying the centering steps.

[0019] In one possible implementation, the clamping member is provided with grooves that are horizontally and vertically staggered, and the grooves have notches facing the opposite side.

[0020] Through the above solution, when there is water on the edge silicon block, the grooves can play a role in draining the water, and at the same time avoid the edge silicon block being deflected when the two clamping members release the edge silicon block because the clamping surface of the clamping member fits too tightly with the side surface of the edge silicon block.

[0021] In one possible implementation, it further includes a first transportation device and a first handling device; the first transportation device transports the edge silicon block along a first direction; the first handling device is arranged at one end of the first transportation device along the first direction, and transports the edge silicon block at the end of the first transportation device to the support platform.

[0022] Through the above solution, it is avoided that the user places a single edge silicon block on the support table at one time. Multiple edge silicon blocks can be placed on the first transportation device, and the edge silicon block at the end can be placed on the support table by the first handling device, so as to further improve the processing efficiency.

[0023] In one possible implementation manner, the first handling device includes a moving mechanism and a suction cup; the moving mechanism is arranged on the base and is used to drive the suction cup to move along the first direction, the second direction and the third direction; the suction cup adsorbs the edge silicon block at the end of the first transportation device.

[0024] Through the above solution, the edge silicon block is adsorbed by the suction cup to avoid damaging the edge silicon block by using a clamping method.

[0025] In one possible implementation manner, the suction cup includes a box body, a first adsorbing member and a second adsorbing member; the box body is rotatably arranged on the moving mechanism, and the box body has a first end and a second end arranged oppositely along the second direction; the first adsorbing member is arranged at the first end of the box body and is used to adsorb the edge silicon block that has not been ground; the second adsorbing member is arranged at the second end of the box body and is used to adsorb the edge silicon block that has completed the grinding process.

[0026] Through the above solution, the first transportation device transports towards the first handling device, that is, the first transportation device transports forward, and then transports the edge silicon block to be processed to the end of the first transportation device. First, the moving mechanism moves the adsorbing member above the edge silicon block at the end of the first transportation device, and the adsorbing member adsorbs the edge silicon block. Then, the moving mechanism moves the adsorbing member above the support table, and the adsorbing member releases the edge silicon block and places the edge silicon block on the support table.

[0027] During the grinding process of the edge silicon block, the moving mechanism can move the suction cup above the edge silicon block at the end of the first transportation device, and the first adsorbing member located at the first end of the box body adsorbs the edge silicon block that has not been ground. Rotate the box body 180 degrees so that the second adsorbing member (the adsorbing member on the side that has not adsorbed the edge silicon block) located at the second end of the box body rotates to the front. After the edge silicon block on the support table completes the grinding process, the moving mechanism moves the second adsorbing member located at the second end of the box body above the support table, and the second adsorbing member located at the second end of the box body adsorbs the edge silicon block that has completed the grinding process. Rotate the box body 180 degrees so that the first adsorbing member (adsorbing the edge silicon block that has not been ground) located at the first end of the box body rotates to the front, and release the edge silicon block that has not been ground onto the support table to achieve feeding.

[0028] Then, the suction cup is moved to above the first transport device by the moving mechanism. The box body is rotated so that the second suction attachment at the second end of the box body faces forward. The second suction attachment at the second end of the box body releases the edge skin silicon block that has completed the grinding process to the first transport device. At this time, the first transport device transports away from the first handling device, that is, the first transport device transports in the reverse direction.

[0029] In one possible implementation, the first transport device includes a first conveyor belt; the processing device for the edge skin silicon block further includes a storage device, the storage device includes two sets of transmission groups, the two sets of transmission groups are respectively arranged on both sides of the first conveyor belt along the second direction, and each set of the transmission groups includes a first rotating member, a second rotating member, an annular transmission member, and a plurality of support frames. The annular transmission member is sleeved outside the first rotating member and the second rotating member, and the first rotating member drives the second rotating member to rotate through the annular transmission member; the plurality of support frames are connected to the annular transmission member, and there is a distance between the end surface of the support frame away from the annular transmission member and the first conveyor belt; the two ends of the edge skin silicon block along the second direction extend beyond the first conveyor belt.

[0030] The plurality of support frames in the two sets of transmission groups are arranged in one-to-one correspondence, and each pair of oppositely arranged support frames forms a receiving space for placing the edge skin silicon block; the support frame includes a mounting plate and a plurality of protruding parts, the mounting plate extends along the second direction, each protruding part extends along the third direction, and the plurality of protruding parts are sequentially connected to the mounting plate along the second direction, and the heights of the plurality of protruding parts in the third direction gradually decrease along the direction away from the annular transmission member.

[0031] Through the above solution, when one of the first rotating member rotates or the second rotating member rotates, the annular transmission member can be rotated, and then the support frames on the annular transmission member can rise or fall along the third direction. During feeding, the support frame descends. After the edge skin silicon block on the support frame contacts the first transport device, the support frame continues to descend so that the support frame is separated from the edge skin silicon block, and the edge skin silicon block can be transported by the first transport device. Similarly, during discharging, the support frame rises. After the support frame contacts the edge skin silicon block on the first transport device, the support frame continues to rise so that the edge skin silicon block is separated from the first transport device and rises with the rise of the support frame to complete discharging. In this way, the storage device is used to store the redundant edge skin silicon blocks, so as to further reduce manual labor and realize automated processing. In addition, the setting of the mounting plate and the protruding parts can facilitate adapting to edge skin silicon blocks of different sizes.

[0032] Another aspect of the embodiments of the present application provides a processing method for edge silicon blocks, which is applied to the processing equipment as described above. The processing method includes: placing the edge silicon block on the support table of the fixing device of the processing equipment, and moving the pressing table of the fixing device along the third direction to press the edge silicon block between the pressing table and the support table, and enabling both the pressing table and the edge silicon block to rotate with the rotation of the support table; moving the frame of the fixing device to move the edge silicon block to between two clamping members of the centering device of the processing equipment, and making the two clamping members move towards each other so that the center of the edge silicon block coincides with the center of the support table; moving the frame to move the edge silicon block to one side of the grinding part of the grinding device of the processing equipment along the second direction, and grinding and polishing the side surface of the edge silicon block through the grinding part; rotating the support table to rotate the edge silicon block by a preset angle with the support table, and chamfering the edge silicon block through the grinding part.

[0033] The processing method for edge silicon blocks provided by the embodiments of the present application has the advantages that no manual centering is required during the grinding process of the edge silicon blocks, and no manual moving of the edge silicon blocks is required, which is convenient for improving production efficiency and processing accuracy.

[0034] In addition to the technical problems solved by the embodiments of the present application described above, the technical features constituting the technical solutions, and the beneficial effects brought by these technical features of the technical solutions, other technical problems that can be solved by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought by these technical features will be further described in detail in the specific implementation manner. Description of the Drawings

[0035] The drawings here are incorporated into the description and form a part of this description, showing the embodiments consistent with the present application, and are used together with the description to explain the principles of the present application.

[0036] Figures 1a - 1e Schematic diagram of the processing steps for edge silicon blocks;

[0037] Figure 2 Schematic diagram of a processing equipment for edge silicon blocks provided by the embodiments of the present application;

[0038] Figure 3 For Figure 2 Top view of the base of the processing equipment shown;

[0039] Figure 4 For Figure 2 Schematic diagram of the fixing device of the processing equipment shown;

[0040] Figure 5 ForFigure 4 Cross-sectional view of the support platform of the shown fixing device;

[0041] Figures 6a - 6d Schematic diagrams showing the edge skin silicon block at 0°, 90°, 45°, and 135° in the fixing device;

[0042] Figure 7 For Figure 2 Schematic diagram of an alignment device of the shown processing equipment;

[0043] Figures 8a - 8d For Figure 7 Step diagram of aligning the shown alignment device;

[0044] Figure 9 Schematic diagram of another alignment device provided by an embodiment of the present application;

[0045] Figure 10a And Figure 10b For Figure 9 Step diagram of aligning the shown alignment device;

[0046] Figure 11 For Figure 2 Schematic diagram of the grinding device of the shown processing equipment;

[0047] Figures 12a - 12d For Figure 2 Handling step diagram of the first handling device and the second handling device shown;

[0048] Figure 13 Schematic diagram of another processing equipment provided by an embodiment of the present application;

[0049] Figure 14 For Figure 13 Schematic diagram of the first handling device shown;

[0050] Figure 15 For Figure 2 Schematic diagram of the storage device of the shown processing equipment;

[0051] Figure 16 For Figure 15 Partial front view of the shown storage device;

[0052] Figure 17 Schematic diagram of yet another processing equipment provided by an embodiment of the present application;

[0053] Figure 18 Step diagram of a processing method for edge skin silicon block provided by an embodiment of the present application.

[0054] Explanation of reference numerals:

[0055] 100 - Base;

[0056] 200 - Fixing device; 210 - Frame; 220 - Support table; 221 - Fixing part; 222 - Floating part; 223 - Elastic part; 224 - Rotating shaft; 230 - Pressing table;

[0057] 300 - Centering device; 310 - Clamping part; 311 - Clamping surface; 312 - First surface; 313 - Second surface;

[0058] 400 - Grinding device; 410 - Grinding part;

[0059] 510 - First transportation device; 511 - First conveyor belt; 520 - Second transportation device; 521 - Second conveyor belt;

[0060] 610 - First handling device; 611 - Moving mechanism; 612 - Suction cup; 6121 - Box body; 6122 - Suction accessory; 6123 - First suction accessory; 6124 - Second suction accessory; 620 - Second handling device;

[0061] 700 - Storage device; 711 - First rotating part; 712 - Second rotating part; 713 - Ring-shaped transmission part; 714 - Support frame;

[0062] 800 - Edge silicon block.

[0063] Through the above-mentioned drawings, specific embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed embodiments

[0064] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Apparently, the described embodiments are some, but not all, of the embodiments of the present application.

[0065] All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0066] Figure 2 Schematic diagram of a processing device for edge silicon blocks provided for the embodiments of the present application, refer to Figure 2, the processing equipment provided by the embodiments of the present application may include a base 100. The base 100 may be provided with a fixing device 200, a centering device 300, and a grinding device 400. Among them, the centering device 300 and the grinding device 400 may be arranged at intervals along the first direction X, and the centers of the centering device 300, the fixing device 200, and the grinding device 400 may be collinear.

[0067] Figure 3 For Figure 2 The top view of the base of the shown processing equipment. Refer to Figure 3 , the base 100 is provided with a slide rail. Figure 4 Figure 2 The schematic diagram of the fixing device of the shown processing equipment. Refer to Figures 2 - 4 , the fixing device 200 may be slidably arranged on the slide rail. The fixing device 200 may include a frame body 210. The frame body 210 may be slidably arranged on the base 100 between the centering device 300 and the grinding device 400 along the first direction X. The frame body 210 is provided with a support table 220 and a pressing table 230 arranged at intervals along the third direction Z. The support table 220 may be rotatably arranged on the frame body 210 and is used for placing the edge skin silicon block 800. The pressing table 230 may be slidably arranged on the frame body 210 along the third direction Z, and presses the edge skin silicon block 800 between the pressing table 230 and the support table 220. Both the edge skin silicon block 800 and the pressing table 230 rotate with the rotation of the support table 220. Exemplarily, Figure 6a The schematic diagram when the edge skin silicon block is at 0° in the fixing device is shown, Figure 6b The schematic diagram when the edge skin silicon block is at 90° in the fixing device is shown, Figure 6c The schematic diagram when the edge skin silicon block is at 45° in the fixing device is shown, Figure 6d The schematic diagram when the edge skin silicon block is at 135° in the fixing device is shown.

[0068] Figure 5 For Figure 4 The cross-sectional view of the support table of the shown fixing device is shown. Refer to Figure 4 And Figure 5 , optionally, the support table 220 may include a fixed part 221 and a floating part 222 arranged in sequence along the third direction Z. The floating part 222 faces the pressing table 230 and has a gap with the fixed part 221. An elastic part 223 and a rotating shaft 224 are arranged between the floating part 222 and the fixed part 221. The rotating shaft 224 is fixed to the fixed part 221, and the floating part 222 deflects relative to the fixed part 221 through the rotating shaft 224.

[0069] Specifically, the edge skin silicon block 800 may be placed on the upper surface of the floating part 222. The floating part 222 may realize the angular deflection between it and the fixed part 221 through the rotating shaft 224 to adapt to the uneven end face of the edge skin silicon block 800.

[0070] In addition, the rotating shaft 224 can be spherical to enable multi-directional deflection of the floating portion 222 relative to the fixed portion 221, facilitating adaptation to defects on the end faces of the edge skin silicon blocks 800 in different directions.

[0071] Figure 7 For Figure 2 a schematic diagram of an alignment device of the shown processing equipment. Refer to Figure 7 , the alignment device 300 includes two clamping members 310 spaced apart along the second direction Y; when the edge skin silicon block 800 moves with the frame body 210 to between the two clamping members 310, the two clamping members 310 move towards each other so that the center of the edge skin silicon block 800 coincides with the center of the support table 220.

[0072] Figures 8a - 8d For Figure 7 a step diagram of alignment by the shown alignment device. Refer to Figures 8a - 8d , exemplarily, the clamping member 310 has a clamping surface 311 for contacting and clamping the edge skin silicon block 800; the clamping surface 311 is configured to be parallel to the side surface of the edge skin silicon block 800.

[0073] Specifically, the two clamping members 310 move towards each other to clamp the edge skin silicon block 800, wherein the two clamping members 310 move towards each other and the two clamping members 310 respectively approach one pair of side surfaces of the edge skin silicon block 800. When the clamping surface 311 of each clamping member 310 abuts against one surface of one pair of side surfaces of the edge skin silicon block 800, the two clamping members 310 move away from each other to be away from the edge skin silicon block 800. Then, the edge skin silicon block 800 is rotated 90° by the support table 220, the two clamping members 310 move towards each other again, and the two clamping members 310 respectively approach the other pair of side surfaces of the edge skin silicon block 800. When the clamping surface 311 of each clamping member 310 abuts against one surface of the other pair of side surfaces of the edge skin silicon block 800, the center of the edge skin silicon block 800 coincides with the center of the two clamping members 310, and further the center of the edge skin silicon block 800 can coincide with the center of the support table 220. The two clamping members 310 move towards each other again and away from the edge skin silicon block 800.

[0074] Figure 9 A schematic diagram of another alignment device provided by an embodiment of the present application, Figure 10a And Figure 10b For Figure 9 a step diagram of alignment by the shown alignment device. Another exemplarily, the clamping member 310 has a clamping surface 311 for contacting and clamping the edge skin silicon block 800; the clamping surface 311 is configured to be parallel to the side surface of the edge skin silicon block 800.

[0075] Specifically, the support platform 220 can first drive the edge silicon block 800 to rotate by a certain angle. At this angle, the diagonal of the edge silicon block 800 is perpendicular to the intersection line of the first surface 312 and the second surface 313 of the clamping member 310. The two clamping members 310 move towards each other until the two clamping members 310 respectively abut against two diagonals of the edge silicon block 800, so that the centers in the length direction and the width direction of the edge silicon block 800 coincide with the center of the clamping member 310, and further the center of the edge silicon block 800 coincides with the center of the support platform 220. The two clamping members 310 move towards each other again and away from the edge silicon block 800. By selecting this solution, the centering operation of the edge silicon block 800 can be completed by one movement of the clamping member 310, which has the advantages of shortening the centering operation time and simplifying the centering steps.

[0076] Optionally, the clamping member 310 is provided with transverse and longitudinal grooves, and the grooves have openings facing the opposite side.

[0077] Specifically, when there is water on the edge silicon block 800, the grooves can play a role in draining the water, and at the same time avoid the edge silicon block 800 being deflected when the two clamping members 310 release the edge silicon block 800 because the clamping surface 311 of the clamping member 310 fits too tightly with the side surface of the edge silicon block 800.

[0078] Figure 11 For Figure 2 the schematic diagram of the grinding device of the shown processing equipment. Refer to Figure 11 , the grinding device 400 includes at least one grinding part 410. When the edge silicon block 800 moves with the frame 210 to one side of the grinding part 410 along the second direction Y, the grinding part 410 grinds the edge silicon block 800; the first direction X, the second direction Y and the third direction Z are perpendicular to each other in pairs. It should be noted that the grinding part 410 of the grinding device 400 can be one or, as Figure 2 shown, two. Grinding the edge silicon block 800 by the grinding device 400 is known to those skilled in the art and will not be elaborated here.

[0079] In summary, for the processing equipment for the edge silicon block 800 provided in this application, the edge silicon block 800 is placed on the support table 220 of the fixing device 200, and the pressing table 230 of the fixing device 200 is moved along the third direction Z to press the edge silicon block 800 between the pressing table 230 and the support table 220, and both the pressing table 230 and the edge silicon block 800 can rotate with the rotation of the support table 220; the pressed edge silicon block 800 moves with the frame 210 to between the two clamping members 310 of the centering device 300, and by making the two clamping members 310 move towards each other, the center of the edge silicon block 800 coincides with the center of the support table 220; the centered edge silicon block 800 moves with the frame 210 to one side of the grinding part 410 of the grinding device 400 along the second direction Y, and the side surface of the edge silicon block 800 is ground by the grinding part 410. After the grinding part 410 grinds one side surface or side edge of the edge silicon block 800, the edge silicon block 800 can rotate with the support table 220 to turn the side surface or side edge of the edge silicon block 800 that has not been processed by the grinding part 410 towards the grinding part 410. After the grinding device 400 finishes the grinding work, the pressing table 230 is moved away from the edge silicon block 800, and the edge silicon block 800 is removed from the support table 220. In this way, during the grinding process of the edge silicon block 800, manual centering is not required, nor is it necessary to manually move the edge silicon block 800, so as to improve production efficiency and processing accuracy.

[0080] Continuing to refer to Figure 2 , the processing equipment provided in the embodiment of this application may further include a first transportation device 510 and a first handling device 610. The first transportation device 510 transports the edge silicon block 800 along the first direction X; the first handling device 610 is arranged at one end of the first transportation device 510 along the first direction X, and transports the edge silicon block 800 at the end of the first transportation device 510 to the support table 220. In this way, it is avoided that the user places one edge silicon block 800 on the support table 220 at a time. Multiple edge silicon blocks 800 can be placed on the first transportation device 510, and the edge silicon block 800 at the end is placed on the support table 220 by the first handling device 610, so as to further improve the processing efficiency.

[0081] Figures 12a - 12d For Figure 2 the handling step diagrams of the first handling device and the second handling device shown. Refer to Figures 12a - 12d , the first handling device 610 includes a moving mechanism 611 and a suction cup 612; the moving mechanism 611 is arranged on the base 100 and is used to drive the suction cup 612 to move along the first direction X, the second direction Y, and the third direction Z; the suction cup 612 adsorbs the edge silicon block 800 at the end of the first transportation device 510. In this way, the edge silicon block 800 can be adsorbed by the suction cup 612 to avoid damaging the edge silicon block 800 by using a clamping method.

[0082] Exemplarily, the suction cup 612 may be as Figures 12a - 12d shown and include a box body 6121 and a suction attachment 6122. The suction attachment 6122 may be located on one side of the box body 6121 in the second direction Y, and the suction attachment 6122 may be fixedly connected to the box body 6121.

[0083] When the first transport device 510 transports towards the first handling device 610, that is, the first transport device 510 transports forward, and then conveys the edge skin silicon block 800 to be processed to the end of the first transport device 510. First, the moving mechanism 611 moves the suction attachment 6122 above the edge skin silicon block 800 located at the end of the first transport device 510, and the suction attachment 6122 adsorbs the edge skin silicon block 800. Then, the moving mechanism 611 moves the suction attachment 6122 above the support table 220, and the suction attachment 6122 releases the edge skin silicon block 800, and places the edge skin silicon block 800 on the support table 220.

[0084] Refer to Figure 2 and Figure 12d , the processing equipment provided by the embodiment of the present application may further include a second handling device 620 and a second transport device 520. After the edge skin silicon block 800 finishes grinding processing, the suction cup of the second handling device 620 can adsorb the processed edge skin silicon block 800, and the moving mechanism of the second handling device 620 can move the processed edge skin silicon block 800 above the second transport device 520, and the suction attachment of the suction cup can release the processed edge skin silicon block 800, so that the processed edge skin silicon block 800 falls onto the second conveyor belt 521 of the second transport device 520. The second conveyor belt 521 can convey the processed edge skin silicon block 800 in a direction away from the grinding device 400.

[0085] Figure 13 is a schematic diagram of another processing equipment provided by the embodiment of the present application, Figure 14 is Figure 13 a schematic diagram of the first handling device shown. Refer to Figure 13 and Figure 14 , another exemplarily, the suction cup 612 may include a box body 6121, a first suction attachment 6123 and a second suction attachment 6124. The box body 6121 is rotatably arranged on the moving mechanism 611, and the box body 6121 has a first end and a second end oppositely arranged along the second direction Y; the first suction attachment 6123 is arranged at the first end of the box body 6121 and is used for adsorbing the edge skin silicon block 800 that has not been ground; the second suction attachment 6124 is arranged at the second end of the box body 6121 and is used for adsorbing the edge skin silicon block 800 that has completed grinding.

[0086] When the first transport device 510 transports towards the first handling device 610, that is, the first transport device 510 transports forward, and then conveys the edge silicon block 800 to be processed to the end of the first transport device 510. First, the moving mechanism 611 moves the first adsorbing member 6123 (or the second adsorbing member 6124) above the edge silicon block 800 located at the end of the first transport device 510, and the first adsorbing member 6123 (or the second adsorbing member 6124) adsorbs the edge silicon block 800. Then, the moving mechanism 611 moves the first adsorbing member 6123 (or the second adsorbing member 6124) above the support table 220, and the first adsorbing member 6123 (or the second adsorbing member 6124) releases the edge silicon block 800 and places the edge silicon block 800 on the support table 220.

[0087] During the grinding process of the edge silicon block 800, the moving mechanism 611 can move the suction cup 612 above the edge silicon block 800 located at the end of the first transport device 510, and the first adsorbing member 6123 located at the first end of the box body 6121 adsorbs the edge silicon block 800 that has not been ground. Rotate the box body 6121 so that the second adsorbing member 6124 (the adsorbing member 6122 on the side that has not adsorbed the edge silicon block 800) located at the second end of the box body 6121 rotates to the front. After the edge silicon block 800 on the support table 220 is ground, the moving mechanism 611 moves the second adsorbing member 6124 located at the second end of the box body 6121 above the support table 220, and the second adsorbing member 6124 located at the second end of the box body 6121 adsorbs the ground edge silicon block 800. Rotate the box body 6121 by 180 degrees so that the first adsorbing member 6123 (adsorbing the unground edge silicon block 800) located at the first end of the box body 6121 rotates to the front and releases the unground edge silicon block 800 onto the support table 220 to achieve feeding.

[0088] Then, the moving mechanism 611 moves the suction cup 612 above the first transport device 510. Rotate the box body 6121 so that the second adsorbing member 6124 located at the second end of the box body 6121 faces the front side. The second adsorbing member 6124 located at the second end of the box body 6121 releases the ground edge silicon block 800 to the first transport device 510. At this time, the first transport device 510 transports away from the first handling device 610, that is, the first transport device 510 transports in the reverse direction.

[0089] Optionally, the first transport device 510 includes a first conveyor belt 511. The processing equipment provided in the embodiments of the present application may further include a storage device 700. Figure 15 For Figure 2 a schematic diagram of the storage device of the shown processing equipment Figure 16 For Figure 15Partial front view of the shown storage device. Reference 15 and Figure 16 , the storage device 700 includes two sets of transmission groups. The two sets of transmission groups can be respectively arranged on both sides of the first conveyor belt 511 along the second direction Y. Each set of transmission groups can include a first rotating member 711, a second rotating member 712, an annular transmission member 713, and a plurality of support frames 714. The annular transmission member 713 is sleeved outside the first rotating member 711 and the second rotating member 712, and the first rotating member 711 drives the second rotating member 712 to rotate through the annular transmission member 713. A plurality of support frames 714 are connected to the annular transmission member 713, and there is a spacing between the end face of the support frame 714 away from the annular transmission member 713 and the first conveyor belt 511. The two ends of the edge skin silicon block 800 along the second direction Y extend beyond the first conveyor belt 511.

[0090] The plurality of support frames 714 in the two sets of transmission groups can be arranged in one-to-one correspondence, and each pair of oppositely arranged support frames 714 forms a receiving space for placing the edge skin silicon block 800. The support frame 714 includes a mounting plate and a plurality of protrusions. The mounting plate extends along the second direction Y, each protrusion extends along the third direction Z, and the plurality of protrusions are sequentially connected to the mounting plate along the second direction Y. The heights of the plurality of protrusions in the third direction Z gradually decrease along the direction away from the annular transmission member 713.

[0091] Through the above solution, when the first rotating member 711 rotates or one of the second rotating members 712 rotates, the annular transmission member 713 can be rotated, and then the support frame 714 on the annular transmission member 713 rises or falls along the third direction Z. During feeding, the support frame 714 descends. After the edge skin silicon block 800 on the support frame 714 contacts the first transportation device 510, the support frame 714 continues to descend so that the support frame 714 is separated from the edge skin silicon block 800, and the edge skin silicon block 800 can be transported by the first transportation device 510. Similarly, during discharging, the support frame 714 rises. After the support frame 714 contacts the edge skin silicon block 800 on the first transportation device 510, the support frame 714 continues to rise so that the edge skin silicon block 800 is separated from the first transportation device 510 and rises with the rise of the support frame 714 to complete discharging. In this way, the storage device 700 is used to store the excess edge skin silicon blocks 800, so as to further reduce manual labor and realize automated processing.

[0092] Figure 17 Schematic diagram of another processing device provided by an embodiment of the present application. Reference Figure 17 , optionally, there can be two storage devices 700, one of which can be used for feeding and the other can be used for discharging. These two storage devices 700 can be located on the same side of the device along the first direction X as shown in Figure 17 . Of course, these two storage devices 700 can also be located on both sides of the device along the first direction X.

[0093] Figure 18 This is a step diagram of a processing method for edge silicon blocks provided by an embodiment of the present application. For reference Figure 18 , an embodiment of the present application also provides a processing method for edge silicon blocks. This processing method can be applied to the above-mentioned processing equipment. The processing method may include: placing the edge silicon block 800 on the support table 220 of the fixing device 200 of the processing equipment, and moving the pressing table 230 of the fixing device 200 along the third direction Z to press the edge silicon block 800 between the pressing table 230 and the support table 220, and enabling both the pressing table 230 and the edge silicon block 800 to rotate with the rotation of the support table 220; by moving the frame body 210 of the fixing device 200, moving the edge silicon block 800 with the frame body 210 between the two clamping members 310 of the centering device 300 of the processing equipment, and by making the two clamping members 310 move towards each other, so that the center of the edge silicon block 800 coincides with the center of the support table 220; by moving the frame body 210, moving the edge silicon block 800 with the frame body 210 to one side of the grinding portion 410 of the grinding device 400 of the processing equipment along the second direction Y, and polishing the side surface of the edge silicon block 800 through the grinding portion 410; by rotating the support table 220, rotating the edge silicon block 800 with the support table 220 by a preset angle, and chamfering the edge silicon block 800 through the grinding portion 410.

[0094] The processing method for the edge silicon block 800 provided by the embodiment of the present application has the advantages that during the grinding process of the edge silicon block 800, no manual centering is required, and no manual moving of the edge silicon block 800 is needed, which is convenient for improving production efficiency and processing accuracy.

[0095] Among them, terms such as "upper" and "lower" are used to describe the relative positional relationship of each structure in the drawings. It is only for the sake of clarity in narration and not to limit the scope of implementation of the present application. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope of implementation of the present application.

[0096] It should be noted that in the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may be that the first feature is directly above or obliquely above the second feature, or simply means that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower horizontal height than the second feature.

[0097] In addition, in this application, unless otherwise clearly specified and defined, terms such as "installed", "connected", "linked", "fixed", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0098] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, not to limit them; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A processing device for edge silicon blocks, characterized in that, It includes a base, and the base is provided with a fixing device, a centering device and a grinding device. The centering device and the grinding device are arranged at intervals along a first direction; The fixing device is slidably arranged on the base along the first direction, and the fixing device fixes the edge skin silicon block and drives the edge skin silicon block to rotate; The centering device includes two clamping members arranged at intervals along a second direction; when the edge skin silicon block moves between the two clamping members along with the fixing device, the two clamping members move towards each other to center the edge skin silicon block; The grinding device includes at least one grinding part; when the edge skin silicon block moves to one side of the grinding part along the second direction along with the fixing device, the grinding part grinds the edge skin silicon block, and the second direction intersects the first direction; The fixing device includes a frame body, the frame body is slidably arranged on the base, the frame body is provided with a support platform and a pressing platform arranged at intervals along a third direction, the support platform is rotatably arranged on the frame body and is used for placing the edge skin silicon block, the pressing platform is slidably arranged on the frame body along the third direction, and presses the edge skin silicon block between the pressing platform and the support platform, and both the edge skin silicon block and the pressing platform rotate along with the rotation of the support platform; the third direction, the second direction and the first direction intersect pairwise; The support platform includes a fixed part and a floating part arranged in sequence along the third direction, the floating part faces the pressing platform and has a gap with the fixed part, an elastic part and a rotating shaft are arranged between the floating part and the fixed part, the rotating shaft is fixed to the fixed part, and the floating part deflects relative to the fixed part through the rotating shaft; The centers of the centering device, the fixing device and the grinding device are collinear; the clamping member has a clamping surface for contacting and clamping the edge skin silicon block; The clamping surface includes an intersecting first surface and a second surface, and the first surface and the second surface are configured to be respectively parallel to two adjacent and intersecting side surfaces of the edge skin silicon block; It further includes a first transportation device and a first handling device.

2. The processing equipment according to claim 1, characterized in that, The clamping member is provided with horizontally and vertically staggered grooves, and the grooves have notches facing the opposite side.

3. The processing equipment according to claim 1, wherein The first transportation device transports the edge skin silicon block along the first direction; The first handling device is arranged at one end of the first transportation device along the first direction, and transports the edge skin silicon block at the end of the first transportation device to the support platform.

4. The processing equipment according to claim 3, characterized in that, The first handling device includes a moving mechanism and a suction cup; The moving mechanism is arranged on the base and is used for driving the suction cup to move along the first direction, the second direction and the third direction; The suction cup adsorbs the edge skin silicon block at the end of the first transportation device.

5. The processing equipment according to claim 4, characterized in that, The suction cup includes a box body, a first adsorbing part and a second adsorbing part; The box body is rotatably arranged on the moving mechanism, and the box body has a first end and a second end arranged oppositely along the second direction; The first adsorbent is arranged at the first end of the box body and is used for adsorbing the unprocessed edge skin silicon blocks; the second adsorbent is arranged at the second end of the box body and is used for adsorbing the edge skin silicon blocks that have completed the grinding process.

6. The processing equipment according to claim 4 or 5, characterized in that The first conveying device includes a first conveyor belt; the processing equipment for the edge skin silicon blocks further includes a storage device, the storage device includes two sets of transmission groups, the two sets of transmission groups are respectively arranged on both sides of the first conveyor belt along the second direction, each set of the transmission groups includes a first rotating member, a second rotating member, an annular transmission member and a plurality of support frames, the annular transmission member is sleeved outside the first rotating member and the second rotating member, and the first rotating member drives the second rotating member to rotate through the annular transmission member; the plurality of support frames are connected to the annular transmission member, and there is a spacing between the end face of the support frame away from the annular transmission member and the first conveyor belt; the two ends of the edge skin silicon block along the second direction extend beyond the first conveyor belt. The plurality of support frames in the two sets of transmission groups are arranged in one-to-one correspondence, and each pair of oppositely arranged support frames forms a receiving space for placing the edge skin silicon blocks; the support frame includes a mounting plate and a plurality of protruding parts, the mounting plate extends along the second direction, each protruding part extends along the third direction, and the plurality of protruding parts are sequentially connected to the mounting plate along the second direction, and the height of the plurality of protruding parts in the third direction gradually decreases along the direction away from the annular transmission member.

7. A processing method for edge skin silicon blocks, characterized in that, Applied to the processing equipment according to any one of claims 1-6, the processing method includes: Placing the edge skin silicon block on the support table of the fixing device of the processing equipment, and moving the pressing table of the fixing device along the third direction to press the edge skin silicon block between the pressing table and the support table, and enabling both the pressing table and the edge skin silicon block to rotate with the rotation of the support table. By moving the frame of the fixing device, the edge skin silicon block is moved with the frame to between the two clamping members of the centering device of the processing equipment, and by making the two clamping members move towards each other, the center of the edge skin silicon block coincides with the center of the support table. By moving the frame, the edge skin silicon block is moved with the frame to one side of the grinding part of the grinding device of the processing equipment along the second direction, and the side surface of the edge skin silicon block is ground and polished by the grinding part. By rotating the support table, the edge skin silicon block is rotated by a preset angle with the support table, and the edge of the edge skin silicon block is chamfered by the grinding part.

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