A method and system for infrared thermal wave detection using monocular three-dimensional imaging

Abstract

This invention relates to the field of infrared thermal imaging detection technology, and particularly to a monocular three-dimensional imaging infrared thermal detection method and system. The method includes: adjusting the angle of the reflector and the focal length of the infrared thermal imager, and setting experimental parameters; acquiring an initial state infrared thermal image of the device under test using the infrared thermal imager, and simultaneously triggering a circular photothermal excitation source to fully scan and heat the device under test; at the end of the heating time, triggering the infrared thermal imager to acquire information on the surface temperature change of the device under test during the cooling process and the infrared beam reflected back by the reflector, until the infrared acquisition time is reached, thereby using an industrial control computer to perform three-dimensional imaging and obtain three-dimensional imaging detection data. The infrared thermal detection device designed in this invention can realize three-dimensional imaging detection of the device under test, which not only improves detection efficiency but also reduces hardware detection costs. It is suitable for various application scenarios and can meet the three-dimensional imaging detection needs of complex structural equipment under actual working conditions.

Description

Technical Field

[0001] This invention relates to the field of infrared thermal imaging detection technology, and in particular to an infrared thermal detection method and system using monocular three-dimensional imaging. Background Technology

[0002] Infrared thermal wave detection technology is an emerging non-destructive testing technology. The principle of this technology is to use an external thermal excitation source to heat the equipment under test. If there are defects inside the equipment, it will disturb the internal heat conduction, resulting in abnormal temperature distribution on the surface of the equipment. By recording the video of the surface temperature change, internal defects can be effectively identified. Infrared thermal wave detection technology has the advantages of fast detection speed, large detection range, and quantitative characterization, and has been widely used in aerospace, archaeology, medical and other fields.

[0003] Currently, infrared thermal imaging technology typically extracts effective information from temperature field change videos for two-dimensional imaging. Abnormal temperature areas in the two-dimensional image are then used to identify internal defects in the equipment. However, actual industrial equipment often has complex structures, and simple two-dimensional imaging is insufficient to meet the needs of industrial inspection. Multiple scanning angles are required to complete comprehensive imaging inspection of the equipment's three-dimensional structure. This process is difficult and time-consuming. For example, in the power industry, composite crossarms commonly used in composite equipment may have defects at the interface between the silicone rubber sheath and the epoxy core rod, requiring timely inspection. However, their cylindrical structure with umbrella skirts makes it difficult to complete the inspection in a single two-dimensional scan, requiring 2 to 4 inspection operations to achieve comprehensive inspection of the composite crossarm. This method is difficult to operate in actual working conditions. Therefore, to address the three-dimensional imaging inspection of complex industrial equipment, there is an urgent need to develop convenient and rapid infrared thermal imaging three-dimensional imaging technology.

[0004] However, infrared thermal three-dimensional imaging detection is still in its early stages, and there are not many existing technical methods, which can be roughly divided into the following four types:

[0005] 1) 3D camera-assisted three-dimensional imaging: For single-sided inspection of defects in curved equipment, a 3D camera can be added to assist in shooting. The data acquired by the 3D camera and the data acquired by the thermal imager are feature matched and fused to achieve three-dimensional imaging of the equipment. However, this method only has good detection effect for single-sided imaging inspection of equipment.

[0006] 2) Model-based 3D reconstruction calculation: a corresponding mathematical model is constructed for objects of specific shapes, the angle of the thermal imager is adjusted to ensure that the collected data conforms to the model construction, and the 3D reconstruction of the equipment is realized through theoretical calculation. However, this method only has good 3D imaging and detection effect in single-sided inspection of curved equipment.

[0007] 3) Single thermal imager can perform multi-angle inspections. For cylindrical or polyhedral structures, the angle can be adjusted multiple times to inspect different surfaces of the equipment. Feature point matching is performed in post-processing of the data so that images from different angles can be stitched together to form a complete three-dimensional structure of the equipment.

[0008] 4) Multi-angle, multi-device thermal imaging: Based on the characteristics of different equipment shapes and structures, multiple thermal imagers are deployed at multiple angles to inspect the equipment. The data collected by multiple thermal imagers are stitched together to achieve three-dimensional imaging of the equipment.

[0009] In summary, due to the limited detection depth of infrared thermal wave detection methods, defects may exist in different locations on cylindrical or polyhedral structures. When using infrared thermal wave detection, it is necessary to ensure that multiple surfaces have been effectively inspected. Traditional infrared thermal wave detection methods, when dealing with cylindrical or polyhedral structures, either require multiple thermal imagers or multiple measurements with a single thermal imager. These methods have limitations such as limited application scenarios, high detection costs, cumbersome and time-consuming operation, complex algorithms, and low efficiency. This restricts the three-dimensional imaging and detection of complex structural equipment and makes it difficult to meet the three-dimensional imaging and detection needs under actual working conditions. Summary of the Invention

[0010] This invention provides a method and system for infrared thermal wave detection using monocular three-dimensional imaging. The technical problem it solves is that traditional infrared thermal wave detection methods require the use of multiple thermal imagers or multiple measurements by a single thermal imager, which is difficult to meet the three-dimensional imaging detection requirements of complex structural equipment under actual working conditions.

[0011] To address the above technical problems, this invention provides a method and system for infrared thermal wave detection using monocular three-dimensional imaging.

[0012] In a first aspect, the present invention provides a method for detecting infrared thermal waves using monocular three-dimensional imaging, applied to an infrared thermal wave detection device. The infrared thermal wave detection device includes an auxiliary reflection imaging module, a photothermal excitation module, an infrared thermal imager, and an industrial control computer. The auxiliary reflection imaging module includes several reflectors and a rotating shaft for fixing the connections of each reflector. The photothermal excitation module includes a fixed stage, a circular photothermal excitation source, and a lifting device. The method includes the following steps:

[0013] The device to be tested is placed on the fixed platform, and the angles of each of the reflectors and the focal length of the infrared thermal imager are adjusted by the rotating axis.

[0014] Test parameters for the infrared thermal imager and the annular photothermal excitation source are set respectively; wherein, the test parameters for the thermal imager include the infrared acquisition frequency and the infrared acquisition time; the test parameters for the photothermal excitation source include the heating time and the full scan cycle of the excitation source;

[0015] The infrared thermal imager acquires an initial state infrared thermal image of the device under test, and simultaneously triggers the annular photothermal excitation source to fully scan and heat the device under test.

[0016] At the end of the heating time, the infrared thermal imager is triggered to collect information on the surface temperature change of the device under test during the cooling process and the infrared beam reflected back by the reflector, so as to obtain the corresponding infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, until the infrared acquisition time is reached.

[0017] The industrial control computer is used to perform three-dimensional imaging on the initial state infrared thermal image, the infrared thermal image of the equipment's own temperature change, and the infrared thermal image of the equipment's reflected temperature change, to obtain three-dimensional imaging detection data.

[0018] In a further implementation, the step of using the industrial control computer to perform three-dimensional imaging of the initial state infrared thermal image, the infrared thermal image of the equipment's own temperature change, and the infrared thermal image of the equipment's reflected temperature change, to obtain three-dimensional imaging detection data includes:

[0019] Subtract the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change from the infrared thermal image of the initial state, respectively, and extract the regions of interest of the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, respectively, to obtain the corresponding region of interest map of the device's own temperature change and the region of interest map of the device's reflected temperature change.

[0020] Super-resolution processing is performed on the region of interest map of the device reflection to obtain a super-resolution region of interest map of reflection, such that the data size of the super-resolution region of interest map of reflection is the same as that of the region of interest map of the device itself.

[0021] Dimensionality reduction processing is performed on the super-resolution reflection region of interest map and the device's own region of interest map to obtain the corresponding super-resolution reflection dimension reduction map and device's own dimension reduction map.

[0022] By selecting the super-resolution reflection dimension reduction map and the device's own dimension reduction map respectively, the corresponding super-resolution reflection feature heat map and device's own feature heat map are obtained;

[0023] The super-resolution reflection feature heatmap and the device's own feature heatmap are corrected according to the pre-selected correction model. Then, the corrected super-resolution reflection feature heatmap and the corrected device's own feature heatmap are used for three-dimensional imaging to obtain the three-dimensional imaging detection data of the device to be tested.

[0024] In a further implementation, the dimensionality reduction process includes a blind source separation algorithm.

[0025] In a further embodiment, the fixing platform includes an upper fixing platform and a lower fixing platform, as well as a plurality of support columns disposed between the upper fixing platform and the lower fixing platform;

[0026] The upper fixed platform is used to fix the annular photothermal excitation source through the lifting device; wherein, the annular photothermal excitation source has a built-in annular halogen lamp tube, and the annular photothermal excitation source is used to heat the device under test; the lifting device is used to control the lifting of the annular photothermal excitation source so that the annular photothermal excitation source can perform full scanning heating of the device under test;

[0027] The lower fixed platform is used to place the device to be tested.

[0028] In a further embodiment, the infrared thermal imager is equipped with several lenses of different focal lengths.

[0029] In a further embodiment, the industrial control computer is also used to control the triggering and loading of the annular photothermal excitation source, as well as the triggering and image acquisition of the infrared thermal imager.

[0030] Secondly, the present invention provides a monocular three-dimensional imaging infrared thermal wave detection system, applied to an infrared thermal wave detection device. The infrared thermal wave detection device includes an auxiliary reflection imaging module, a photothermal excitation module, an infrared thermal imager, and an industrial control computer. The auxiliary reflection imaging module includes several reflectors and a rotating shaft for fixing the connections of each reflector. The photothermal excitation module includes a fixed stage, a circular photothermal excitation source, and a lifting device. The system includes:

[0031] The device setting module is used to place the device to be tested on the fixed platform and adjust the angle of each of the reflectors and the focal length of the infrared thermal imager through the rotating axis.

[0032] The test parameter determination module is used to set the test parameters of the infrared thermal imager and the test parameters of the annular photothermal excitation source, respectively; wherein, the test parameters of the thermal imager include the infrared acquisition frequency and the infrared acquisition time; the test parameters of the photothermal excitation source include the heating time and the full scanning cycle of the excitation source;

[0033] The heating trigger module is used to acquire an initial state infrared thermal image of the device under test through the infrared thermal imager, and simultaneously trigger the annular photothermal excitation source to fully scan and heat the device under test;

[0034] The infrared thermal image acquisition module is used to trigger the infrared thermal imager to acquire information on the surface temperature change of the device under test during the cooling process and the infrared beam reflected back by the reflector when the heating time ends, so as to obtain the corresponding infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, until the infrared acquisition time is reached.

[0035] The three-dimensional imaging module is used to perform three-dimensional imaging on the initial state infrared thermal image, the infrared thermal image of the device's own temperature change, and the infrared thermal image of the device's reflected temperature change using the industrial control computer, thereby obtaining three-dimensional imaging detection data.

[0036] In a further implementation, the three-dimensional imaging module includes a region of interest extraction unit, a data processing unit, a dimensionality reduction processing unit, a feature heatmap selection unit, and a three-dimensional construction module;

[0037] The region of interest extraction unit is used to subtract the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change from the infrared thermal image of the initial state, and extract the regions of interest of the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, respectively, to obtain the corresponding region of interest map of the device's own temperature change and the region of interest map of the device's reflected temperature change.

[0038] The data processing unit is used to perform super-resolution processing on the reflection region of interest map of the device to obtain a super-resolution reflection region of interest map, such that the data size of the super-resolution reflection region of interest map is consistent with that of the device's own region of interest map.

[0039] The dimension reduction processing unit is used to perform dimension reduction processing on the super-resolution reflection region of interest map and the device's own region of interest map respectively, to obtain the corresponding super-resolution reflection dimension reduction map and the device's own dimension reduction map.

[0040] The feature heatmap selection unit is used to select the super-resolution reflectance dimensionality reduction map and the device's own dimensionality reduction map respectively to obtain the corresponding super-resolution reflectance feature heatmap and device's own feature heatmap.

[0041] The 3D construction module is used to perform data correction on the super-resolution reflection feature heatmap and the device's own feature heatmap according to the pre-selected correction model, and to perform 3D imaging on the corrected super-resolution reflection feature heatmap and the corrected device's own feature heatmap to obtain the 3D imaging detection data of the device to be detected.

[0042] In addition, in a third aspect, the present invention also provides a computer device, including a processor and a memory, the processor being connected to the memory, the memory being used to store a computer program, and the processor being used to execute the computer program stored in the memory, so that the computer device performs the steps of implementing the above-described method.

[0043] Fourthly, the present invention also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps of the above-described method.

[0044] This invention provides a method and system for monocular 3D imaging infrared thermal wave detection. The method employs a moving-scanning annular photothermal excitation source, and simultaneously constructs a reflective mirror that reflects the surface temperature of an object from multiple angles as an auxiliary imaging module. Combined with a 2D-3D conversion theoretical model of cylindrical or polyhedral structures, the data acquired by the infrared thermal imager is normalized and stitched together to achieve monocular thermal image 3D imaging detection of cylindrical or polyhedral structures. Compared to existing technologies, the method proposed in this invention uses only one thermal imager and requires only a single detection operation to achieve 3D imaging detection of the device under test. Furthermore, the infrared thermal wave detection device has a simple structure, low cost, and wide applicability. Attached Figure Description

[0045] Figure 1 This is a schematic flowchart of the infrared thermal wave detection method for monocular three-dimensional imaging provided in this embodiment of the invention;

[0046] Figure 2 This is a schematic diagram of the infrared thermal wave detection device provided in an embodiment of the present invention;

[0047] Figure 3 This is a schematic diagram of the data before correction provided in an embodiment of the present invention;

[0048] Figure 4 This is a schematic diagram of the data after correction provided in an embodiment of the present invention;

[0049] Figure 5 This is a side view schematic diagram of a double-sided circular arc sample imaging provided in an embodiment of the present invention;

[0050] Figure 6 This is a frontal view of a double-sided circular arc sample imaging provided in an embodiment of the present invention;

[0051] Figure 7 This is a block diagram of an infrared thermal wave detection system for monocular three-dimensional imaging provided in an embodiment of the present invention;

[0052] Figure 8 This is a schematic diagram of the structure of a computer device provided in an embodiment of the present invention. Detailed Implementation

[0053] The embodiments of the present invention are described in detail below with reference to the accompanying drawings. The embodiments are given for illustrative purposes only and should not be construed as limiting the present invention. The accompanying drawings are for reference and illustration only and do not constitute a limitation on the scope of patent protection of the present invention, because many changes can be made to the present invention without departing from the spirit and scope of the present invention.

[0054] refer to Figure 1 This invention provides a method for infrared thermal wave detection using monocular three-dimensional imaging, applicable to infrared thermal wave detection devices. Figure 2 This is a schematic diagram of the infrared thermal wave detection device provided in an embodiment of the present invention. The infrared thermal wave detection device includes a photothermal excitation module, an auxiliary reflection imaging module, an industrial control computer 6, and an infrared thermal imager 7. In this embodiment, the photothermal excitation module includes a fixed platform 1, a circular photothermal excitation source 2, and a lifting device 3. The fixed platform 1 includes an upper fixed platform 11 and a lower fixed platform 12, and a plurality of support columns disposed between the upper fixed platform 11 and the lower fixed platform 12. The support columns are used to support the fixed platform, and the height of the support columns can be adjusted according to the device to be detected. The lower fixed platform 12 is used to place the device to be detected 8, and the upper fixed platform 11 is used for the lifting device to pass through. 3. Fix the annular photothermal excitation source 2; wherein, the annular photothermal excitation source 2 has a built-in annular halogen lamp tube, and the annular photothermal excitation source 2 is used to heat the device under test, and the heating duration should be on the order of minutes; the lifting device 3 is used to control the lifting and lowering of the annular photothermal excitation source 2 so that the annular photothermal excitation source 2 can perform a full scan heating of the device under test. The lifting speed, period, function form, etc. of the lifting device 3 are all adjustable. In this embodiment, the annular photothermal excitation source can achieve uniform scanning heating of the device under test through the lifting device. Compared with the traditional heating model, the annular photothermal excitation source is close to the surface of the device, which can effectively improve the heating power.

[0055] The auxiliary reflection imaging module includes several reflectors 4 arranged along the fixed platform and a rotating shaft 5 for fixing the connection of each reflector. In this embodiment, the reflectors include 2-5 reflectors (generally 3 reflectors can complete most of the detection tasks) so that each reflector can reflect the infrared light emitted by the device under test without distortion. Those skilled in the art can adjust the number of reflectors according to the specific implementation and are not limited to the embodiment of the present invention. The rotating shaft is located at the connection of each reflector and is used to fix the connection of each reflector. It can also adjust the angle of the reflectors to ensure that the infrared thermal imager can acquire the surface temperature data of each side of the device under test and achieve the best measurement effect.

[0056] The industrial control computer 6 is electrically connected to the infrared thermal imager 7 and the photothermal excitation module. The industrial control computer is used to control the triggering and loading of the annular photothermal excitation source 2 and the triggering and acquisition of the infrared thermal imager 7. At the same time, the industrial control computer 6 is equipped with corresponding equipment models and data processing software. The model can realize the three-dimensional model of the equipment, and the data processing software can extract effective defect information from the acquired video data.

[0057] The infrared thermal imager 7 is used to collect video data of temperature changes on the surface of the device under test 8. The infrared thermal imager is equipped with several lenses with different focal lengths. In this embodiment, the acquisition frequency and acquisition time of the infrared thermal imager 7 can be controlled. In this embodiment, by adjusting the reflector, the infrared thermal imager can acquire video data of all surfaces of the device under test.

[0058] The infrared thermal wave detection device provided in this embodiment can be applied to the infrared thermal wave three-dimensional imaging detection of all cylindrical or polyhedral devices. The infrared thermal wave detection device adjusts the auxiliary reflection imaging module so that the infrared thermal imager can acquire images of the device under test from various angles. After the photothermal excitation module heats the device under test, the infrared thermal imager acquires the temperature change video of the surface of the device under test. The industrial control computer processes the data to obtain a complete three-dimensional image of the device. The entire system is controlled by the industrial control computer. Compared with existing detection devices, this embodiment uses reflectors and other equipment to replace the expensive equipment (multiple thermal imagers, 3D scanners, etc.) in the existing solutions, which greatly reduces the hardware cost of three-dimensional imaging.

[0059] like Figure 1 As shown in the figure, an infrared thermal wave detection method for monocular three-dimensional imaging provided by an embodiment of the present invention includes the following steps:

[0060] S1. Place the device to be tested on the fixed platform, and adjust the angle of each of the reflectors and the focal length of the infrared thermal imager through the rotating axis.

[0061] In this embodiment, the device to be inspected is placed on a fixed platform, and the angle of the reflector and the focal length of the infrared thermal imager are adjusted by rotating the axis. This allows a complete and clear view of the device to be inspected to be observed using a single infrared thermal imager. This method has the advantages of being convenient and intuitive to operate. At the same time, combined with the device model built into the industrial control computer, it also provides space for integration with digital twin technology in the future.

[0062] S2. Set the thermal imager test parameters and the photothermal excitation source test parameters for the infrared thermal imager and the circular photothermal excitation source, respectively; wherein, the thermal imager test parameters include the infrared acquisition frequency and the infrared acquisition time; the photothermal excitation source test parameters include the heating time and the full scanning cycle of the excitation source.

[0063] S3. Acquire an initial state infrared thermal image of the device under test using the infrared thermal imager, and simultaneously trigger the annular photothermal excitation source to fully scan and heat the device under test.

[0064] In this embodiment, before the annular photothermal excitation source fully scans and heats the device under test, an infrared thermal image of the device under test in its initial state is acquired by an infrared thermal imager. Then, the device under test is heated by the annular photothermal excitation source using a lifting and lowering scanning method. This avoids the thermal excitation source from obscuring the image of the device under test while effectively achieving full heating of the device under test. The annular photothermal excitation source used in this embodiment can be close to the device for heating, resulting in a more obvious heating effect on the device under test under the same heat power. It can effectively save heating time, making the heating process more flexible and controllable, and also has better heating uniformity and higher heating efficiency. It should be noted that those skilled in the art can set corresponding thermal imager test parameters and photothermal excitation source test parameters for different materials and types of devices according to the specific implementation situation.

[0065] S4. At the end of the heating time, the infrared thermal imager is triggered to collect information on the surface temperature change of the device under test during the cooling process and the infrared beam reflected back by the reflector, so as to obtain the corresponding infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, until the infrared acquisition time is reached.

[0066] S5. Using the industrial control computer, perform three-dimensional imaging of the initial state infrared thermal image, the infrared thermal image of the equipment's own temperature change, and the infrared thermal image of the equipment's reflected temperature change to obtain three-dimensional imaging detection data.

[0067] In one embodiment, the step of using the industrial control computer to perform three-dimensional imaging of the initial state infrared thermal image, the infrared thermal image of the device's own temperature change, and the infrared thermal image of the device's reflected temperature change, to obtain three-dimensional imaging detection data includes:

[0068] Subtract the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change from the infrared thermal image of the initial state, respectively, and extract the regions of interest of the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, respectively, to obtain the corresponding region of interest map of the device's own temperature change and the region of interest map of the device's reflected temperature change.

[0069] Super-resolution processing is performed on the region of interest map of the device reflection to obtain a super-resolution region of interest map of reflection, such that the data size of the super-resolution region of interest map of reflection is the same as that of the region of interest map of the device itself.

[0070] Dimensionality reduction processing is performed on the super-resolution reflection region of interest map and the device's own region of interest map to obtain the corresponding super-resolution reflection dimension reduction map and device's own dimension reduction map.

[0071] By selecting the super-resolution reflection dimension reduction map and the device's own dimension reduction map respectively, the corresponding super-resolution reflection feature heat map and device's own feature heat map are obtained;

[0072] The super-resolution reflection feature heatmap and the device's own feature heatmap are corrected according to the pre-selected correction model. Then, the corrected super-resolution reflection feature heatmap and the corrected device's own feature heatmap are used for three-dimensional imaging to obtain the three-dimensional imaging detection data of the device to be tested.

[0073] Specifically, in this embodiment, the data collected by the infrared thermal imager is divided into two types: one is the surface temperature change information of the device under test during the cooling process, directly collected by the infrared thermal imager, i.e., the infrared thermal image of the device's own temperature change (data directly collected by the infrared thermal imager); the other is the infrared beam emitted by the device under test during the cooling process and reflected back by the reflector, collected by the infrared thermal imager through the reflector, i.e., the infrared thermal image of the device's reflected temperature change (data collected by the infrared thermal imager through the reflector). Then, in order to reduce the influence of the background, this embodiment subtracts the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change from the initial state infrared thermal image, respectively, and selects the data of the device portion as the region of interest (hereinafter referred to as ROI) for processing to obtain the corresponding device's own region of interest map and device reflected region of interest map. Regarding the domain map, it should be noted that due to the distance extension caused by the mirror, the ROI size in the reflection data is often smaller than that in the direct data. Therefore, super-resolution processing should be performed on the device reflection region of interest map to ensure that the ROI size of the device reflection region of interest map is consistent with that of the device's own region of interest map. Next, algorithms such as blind source separation are used to reduce the dimensionality of the super-resolution reflection region of interest map and the device's own region of interest map, resulting in corresponding super-resolution reflection dimensionality-reduced maps and device dimensionality-reduced maps. Feature heatmaps of the super-resolution reflection dimensionality-reduced maps and device dimensionality-reduced maps are selected by calculating parameters such as signal-to-noise ratio (SNR) and image entropy. For example, the image with the highest SNR or image entropy after dimensionality reduction is selected as the feature image, or feature heatmaps are manually selected from the dimensionality-reduced images depending on the specific implementation. Finally, as... Figure 3 , Figure 4 As shown, a calibration model of the device to be inspected is selected on the industrial control computer. The feature heatmap data is then calibrated using the calibration model, and three-dimensional imaging is performed on the three-dimensional coordinate axes, thereby achieving three-dimensional imaging inspection. Specifically, as follows... Figure 5 , Figure 6 As shown.

[0074] This embodiment combines "direct data" and "reflection data" of different sizes with super-resolution algorithms, data dimensionality reduction, and model-based data correction through a constructed correction model and data processing method to achieve three-dimensional imaging detection. This effectively expands the application scope, improves the detection effectiveness of the method, and is low-cost and applicable to a wide range of scenarios. It should be noted that after dimensionality reduction and other processing, the values ​​in normal areas tend to be consistent, while the values ​​in defective areas will be abnormal. If the x and y axes represent the number of data points on the horizontal and vertical axes, and the z axis represents the data value, it is similar to the appearance of several abnormal areas on a flat plate. If this data is used directly for imaging, only the abnormal values ​​on the flat plate structure can be presented. Since the tested samples often have a certain shape, such as an arc, an equation for the arc shape can be constructed. Multiplying the acquired data by this shape equation will display the corresponding shape on the three-dimensional coordinate axis. Therefore, this embodiment adds data correction processing.

[0075] This invention provides a monocular 3D imaging infrared thermal wave detection method. The method involves acquiring an initial state infrared thermal image of the device under test using an infrared thermal imager, and simultaneously triggering a circular photothermal excitation source to fully scan and heat the device. At the end of the heating time, the infrared thermal imager acquires information on the surface temperature change of the device during the cooling process, along with the infrared beam reflected back by the reflector, resulting in corresponding infrared thermal images of the device's own temperature change and the device's reflected temperature change. This process continues until the infrared acquisition time is reached. An industrial control computer then performs 3D imaging on the initial state infrared thermal image, the device's own temperature change infrared thermal image, and the device's reflected temperature change infrared thermal image to obtain 3D imaging detection data. Compared with existing technologies, the method provided by this invention uses an infrared thermal wave detection device composed of a reflector array and a circular photothermal excitation source to achieve a monocular 3D imaging detection method based on infrared thermal wave technology. This not only reduces hardware detection costs and has a wide range of applications, but also simplifies operation, saves detection time, and improves detection efficiency.

[0076] It should be noted that the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0077] In one embodiment, such as Figure 7As shown, this embodiment of the invention provides a monocular three-dimensional imaging infrared thermal wave detection system, applied to an infrared thermal wave detection device. The infrared thermal wave detection device includes an auxiliary reflection imaging module, a photothermal excitation module, an infrared thermal imager, and an industrial control computer. The auxiliary reflection imaging module includes several reflectors and a rotating shaft for fixing the connections of each reflector. The photothermal excitation module includes a fixed stage, a circular photothermal excitation source, and a lifting device. The system includes:

[0078] The device setting module 101 is used to place the device to be tested on the fixed platform and adjust the angle of each of the reflectors and the focal length of the infrared thermal imager through the rotating axis.

[0079] The test parameter determination module 102 is used to set the test parameters of the infrared thermal imager and the test parameters of the annular photothermal excitation source, respectively; wherein, the test parameters of the thermal imager include the infrared acquisition frequency and the infrared acquisition time; the test parameters of the photothermal excitation source include the heating time and the full scanning cycle of the excitation source;

[0080] The heating trigger module 103 is used to acquire the initial state infrared thermal image of the device under test through the infrared thermal imager, and simultaneously trigger the annular photothermal excitation source to fully scan and heat the device under test.

[0081] The infrared thermal image acquisition module 104 is used to trigger the infrared thermal imager to acquire information on the surface temperature change of the device under test during the cooling process and the infrared beam reflected back by the reflector when the heating time ends, so as to obtain the corresponding infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, until the infrared acquisition time is reached.

[0082] The three-dimensional imaging module 105 is used to perform three-dimensional imaging on the initial state infrared thermal image, the infrared thermal image of the device's own temperature change, and the infrared thermal image of the device's reflected temperature change using the industrial control computer, so as to obtain three-dimensional imaging detection data.

[0083] In one embodiment, the three-dimensional imaging module 105 includes a region of interest extraction unit, a data processing unit, a dimensionality reduction processing unit, a feature heatmap selection unit, and a three-dimensional construction module;

[0084] The region of interest extraction unit is used to subtract the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change from the infrared thermal image of the initial state, and extract the regions of interest of the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, respectively, to obtain the corresponding region of interest map of the device's own temperature change and the region of interest map of the device's reflected temperature change.

[0085] The data processing unit is used to perform super-resolution processing on the reflection region of interest map of the device to obtain a super-resolution reflection region of interest map, such that the data size of the super-resolution reflection region of interest map is consistent with that of the device's own region of interest map.

[0086] The dimension reduction processing unit is used to perform dimension reduction processing on the super-resolution reflection region of interest map and the device's own region of interest map respectively, to obtain the corresponding super-resolution reflection dimension reduction map and the device's own dimension reduction map.

[0087] The feature heatmap selection unit is used to select the super-resolution reflectance dimensionality reduction map and the device's own dimensionality reduction map respectively to obtain the corresponding super-resolution reflectance feature heatmap and device's own feature heatmap.

[0088] The 3D construction module is used to perform data correction on the super-resolution reflection feature heatmap and the device's own feature heatmap according to the pre-selected correction model, and to perform 3D imaging on the corrected super-resolution reflection feature heatmap and the corrected device's own feature heatmap to obtain the 3D imaging detection data of the device to be detected.

[0089] For specific limitations regarding a monocular 3D imaging infrared thermal wave detection system, please refer to the above-described limitations regarding a monocular 3D imaging infrared thermal wave detection method, which will not be repeated here. Those skilled in the art will recognize that the various modules and steps described in conjunction with the embodiments disclosed in this application can be implemented in hardware, software, or a combination of both. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0090] This invention provides a monocular three-dimensional imaging infrared thermal wave detection system. The system employs a motion-scanning circular photothermal excitation source and uses a reflective mirror capable of reflecting the surface temperature of an object from multiple angles as an auxiliary reflective imaging device. This system acquires data on the temperature changes of the device under test and the infrared light data reflected by the mirror. An industrial control computer processes the acquired data to achieve three-dimensional imaging detection of the device. Compared with existing technologies, this application uses only one thermal imager and requires only a single inspection operation to achieve three-dimensional imaging detection of the device, significantly reducing the cost of the detection device. Furthermore, it offers fast detection speed, strong practicality, and broad application prospects.

[0091] Figure 8This invention provides a computer device including a memory, a processor, and a transceiver, which are connected to each other via a bus. The memory is used to store a set of computer program instructions and data, and can transmit the stored data to the processor. The processor can execute the program instructions stored in the memory to perform the steps of the above method.

[0092] The memory may include volatile memory or non-volatile memory, or both; the processor may be a central processing unit, a microprocessor, an application-specific integrated circuit, a programmable logic device, or a combination thereof. By way of example, but not limitation, the programmable logic device described above may be a complex programmable logic device, a field-programmable gate array, a general-purpose array logic, or any combination thereof.

[0093] In addition, memory can be a physically independent unit or integrated with the processor.

[0094] Those skilled in the art will understand that Figure 8 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have the same component arrangement.

[0095] In one embodiment, the present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the above-described method.

[0096] This invention provides a monocular three-dimensional imaging infrared thermal wave detection method and system. The monocular three-dimensional imaging infrared thermal wave detection method, through a designed infrared thermal wave detection device, enables rapid detection, identification, and three-dimensional imaging of internal defects in cylindrical or polyhedral structures, effectively improving the reliability of equipment operation.

[0097] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., SSD), etc.

[0098] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when the computer program is executed, it can include the processes of the embodiments of the above methods.

[0099] The embodiments described above are merely preferred embodiments of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various improvements and substitutions without departing from the technical principles of this invention, and these improvements and substitutions should also be considered within the scope of protection of this application. Therefore, the scope of protection of this patent application should be determined by the scope of the claims.

Claims

1. A method for infrared thermal wave detection using monocular three-dimensional imaging, characterized in that, An infrared thermal wave detection device is applied, comprising an auxiliary reflection imaging module, a photothermal excitation module, an infrared thermal imager, and an industrial control computer. The auxiliary reflection imaging module includes several reflectors and a rotating shaft for fixing the connections of each reflector. The photothermal excitation module includes a fixed stage, a circular photothermal excitation source, and a lifting device. The method includes the following steps: The device to be tested is placed on the fixed platform, and the angles of each of the reflectors and the focal length of the infrared thermal imager are adjusted by the rotating axis. Test parameters for the infrared thermal imager and the annular photothermal excitation source are set respectively; wherein, the test parameters for the thermal imager include the infrared acquisition frequency and the infrared acquisition time; the test parameters for the photothermal excitation source include the heating time and the full scan cycle of the excitation source; The infrared thermal imager acquires an initial state infrared thermal image of the device under test, and simultaneously triggers the annular photothermal excitation source to fully scan and heat the device under test. At the end of the heating time, the infrared thermal imager is triggered to collect information on the surface temperature change of the device under test during the cooling process and the infrared beam reflected back by the reflector, so as to obtain the corresponding infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, until the infrared acquisition time is reached. The industrial control computer is used to perform three-dimensional imaging of the initial state infrared thermal image, the infrared thermal image of the equipment's own temperature change, and the infrared thermal image of the equipment's reflected temperature change, to obtain three-dimensional imaging detection data. The step of using the industrial control computer to perform three-dimensional imaging of the initial state infrared thermal image, the infrared thermal image of the equipment's own temperature change, and the infrared thermal image of the equipment's reflected temperature change, to obtain three-dimensional imaging detection data includes: Subtract the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change from the infrared thermal image of the initial state, respectively, and extract the regions of interest of the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, respectively, to obtain the corresponding region of interest map of the device's own temperature change and the region of interest map of the device's reflected temperature change. Super-resolution processing is performed on the region of interest map of the device reflection to obtain a super-resolution region of interest map of reflection, such that the data size of the super-resolution region of interest map of reflection is the same as that of the region of interest map of the device itself. Dimensionality reduction processing is performed on the super-resolution reflection region of interest map and the device's own region of interest map to obtain the corresponding super-resolution reflection dimension reduction map and device's own dimension reduction map. By selecting the super-resolution reflection dimension reduction map and the device's own dimension reduction map respectively, the corresponding super-resolution reflection feature heat map and device's own feature heat map are obtained; The super-resolution reflection feature heatmap and the device's own feature heatmap are corrected according to the pre-selected correction model. Then, the corrected super-resolution reflection feature heatmap and the corrected device's own feature heatmap are used for three-dimensional imaging to obtain the three-dimensional imaging detection data of the device to be tested.

2. The method for infrared thermal wave detection in monocular three-dimensional imaging as described in claim 1, characterized in that: The dimensionality reduction process includes a blind source separation algorithm.

3. The method for infrared thermal wave detection in monocular three-dimensional imaging as described in claim 1, characterized in that: The fixed platform includes an upper fixed platform and a lower fixed platform, as well as a plurality of support columns disposed between the upper fixed platform and the lower fixed platform; The upper fixed platform is used to fix the annular photothermal excitation source through the lifting device; wherein, the annular photothermal excitation source has a built-in annular halogen lamp tube, and the annular photothermal excitation source is used to heat the device under test; the lifting device is used to control the lifting of the annular photothermal excitation source so that the annular photothermal excitation source can perform full scanning heating of the device under test; The lower fixed platform is used to place the device to be tested.

4. The method for infrared thermal wave detection in monocular three-dimensional imaging as described in claim 1, characterized in that: The infrared thermal imager is equipped with several lenses of different focal lengths.

5. The method for infrared thermal wave detection in monocular three-dimensional imaging as described in claim 1, characterized in that: The industrial control computer is also used to control the triggering and loading of the annular photothermal excitation source, as well as the triggering and image acquisition of the infrared thermal imager.

6. A monocular three-dimensional imaging infrared thermal wave detection system, characterized in that, An infrared thermal wave detection device is applied to an infrared thermal wave detection apparatus, which includes an auxiliary reflection imaging module, a photothermal excitation module, an infrared thermal imager, and an industrial control computer. The auxiliary reflection imaging module includes several reflectors and a rotating shaft for fixing the connections of each reflector. The photothermal excitation module includes a fixed stage, a ring-shaped photothermal excitation source, and a lifting device. The system includes: The device setting module is used to place the device to be tested on the fixed platform and adjust the angle of each of the reflectors and the focal length of the infrared thermal imager through the rotating axis. The test parameter determination module is used to set the test parameters of the infrared thermal imager and the test parameters of the annular photothermal excitation source, respectively; wherein, the test parameters of the thermal imager include the infrared acquisition frequency and the infrared acquisition time; the test parameters of the photothermal excitation source include the heating time and the full scanning cycle of the excitation source; The heating trigger module is used to acquire an initial state infrared thermal image of the device under test through the infrared thermal imager, and simultaneously trigger the annular photothermal excitation source to fully scan and heat the device under test; The infrared thermal image acquisition module is used to trigger the infrared thermal imager to acquire information on the surface temperature change of the device under test during the cooling process and the infrared beam reflected back by the reflector when the heating time ends, so as to obtain the corresponding infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, until the infrared acquisition time is reached. The three-dimensional imaging module is used to perform three-dimensional imaging on the initial state infrared thermal image, the infrared thermal image of the equipment's own temperature change, and the infrared thermal image of the equipment's reflected temperature change using the industrial control computer, so as to obtain three-dimensional imaging detection data. The three-dimensional imaging module includes a region of interest extraction unit, a data processing unit, a dimensionality reduction processing unit, a feature heatmap selection unit, and a three-dimensional construction module; The region of interest extraction unit is used to subtract the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change from the infrared thermal image of the initial state, and extract the regions of interest of the infrared thermal image of the device's own temperature change and the infrared thermal image of the device's reflected temperature change, respectively, to obtain the corresponding region of interest map of the device's own temperature change and the region of interest map of the device's reflected temperature change. The data processing unit is used to perform super-resolution processing on the reflection region of interest map of the device to obtain a super-resolution reflection region of interest map, such that the data size of the super-resolution reflection region of interest map is consistent with that of the device's own region of interest map. The dimension reduction processing unit is used to perform dimension reduction processing on the super-resolution reflection region of interest map and the device's own region of interest map respectively, to obtain the corresponding super-resolution reflection dimension reduction map and the device's own dimension reduction map. The feature heatmap selection unit is used to select the super-resolution reflectance dimensionality reduction map and the device's own dimensionality reduction map respectively to obtain the corresponding super-resolution reflectance feature heatmap and device's own feature heatmap. The 3D construction module is used to perform data correction on the super-resolution reflection feature heatmap and the device's own feature heatmap according to the pre-selected correction model, and to perform 3D imaging on the corrected super-resolution reflection feature heatmap and the corrected device's own feature heatmap to obtain the 3D imaging detection data of the device to be detected.

7. A computer device, characterized in that: The device includes a processor and a memory, the processor being connected to the memory for storing computer programs, and the processor for executing the computer programs stored in the memory to cause the computer device to perform the method as described in any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program that, when executed, implements the method as described in any one of claims 1 to 5.

Images