Detection device and test socket therefor

Abstract

A testing device and a testing socket thereof are disclosed. The testing socket includes a metal block, an assembly block, an analog ground probe and a digital ground probe. The metal block has a recess for connecting an independent ground. The assembly block is electrically isolated from the metal block and is detachably embedded in the recess, so that the metal block and the assembly block together form a probe base. The probe base is used for testing a wafer under test. The digital ground probe is inserted into the metal block and electrically connected to the metal block and the independent ground through the metal block. The digital ground probe is used for connecting the wafer under test and the independent ground. The analog ground probe is inserted into the assembly block. The analog ground probe is used for connecting the wafer under test and another independent ground. In this way, the testing socket can reduce signal interference and electromagnetic interference caused by high-resolution analog signals of semiconductor package elements.

Description

TECHNICAL FIELD

[0001] The present invention relates to a testing device and a testing socket thereof, and more particularly to a testing device and a testing socket thereof for semiconductor package components. BACKGROUND

[0002] Generally, when a semiconductor package component is completed, the semiconductor package component is put into a testing socket, so that probes in the testing socket respectively contact conductive contacts of the semiconductor package component, to perform electrical testing on the semiconductor package component.

[0003] However, during the electrical testing, since the analog ground and the digital ground in the testing socket are connected to each other, the semiconductor package component on the testing socket is easily coupled to the analog circuit thereof, thereby interfering with high-resolution analog signals of the semiconductor package component.

[0004] Therefore, the above-mentioned technology still has inconvenience and defects, and needs to be further improved. Thus, how to effectively solve the above-mentioned inconvenience and defects is one of the important research and development subjects, and also becomes the target to be improved in the current related field. SUMMARY

[0005] An object of the present invention is to provide a testing device and a testing socket thereof to solve the above-mentioned difficulties in the prior art.

[0006] An embodiment of the present invention provides a testing socket. The testing socket includes a metal block, an assembly block, an analog ground probe and a digital ground probe. The metal block has a recess for connecting an independent ground. The assembly block is electrically isolated from the metal block and is detachably embedded in the recess, so that the metal block and the assembly block together form a probe seat. The probe seat is used to test a wafer under test. The digital ground probe is inserted into the metal block and electrically contacts the metal block and connects the independent ground through the metal block. The digital ground probe is used to connect the wafer under test and the independent ground. The analog ground probe is inserted into the assembly block, and the analog ground probe is used to connect the wafer under test and another independent ground.

[0007] According to one or more embodiments of the present application, the test socket further comprises a power probe, a digital signal probe, an analog signal probe, a first insulating portion, a second insulating portion, and a third insulating portion. The power probe is inserted into the metal block for connecting the wafer under test. The first insulating portion surrounds the power probe and is located between the power probe and the metal block so as to electrically insulate the power probe from the metal block. The digital signal probe is inserted into the metal block for connecting the wafer under test. The second insulating portion surrounds the digital signal probe and is located between the digital signal probe and the metal block so as to electrically insulate the digital signal probe from the metal block. The analog signal probe is inserted into the assembly block for connecting the wafer under test. The third insulating portion surrounds the analog signal probe and is located between the analog signal probe and the assembly block so as to electrically insulate the analog signal probe from the assembly block.

[0008] According to one or more embodiments of the present application, in the test socket, the front surface of the probe base has a wafer slot. The wafer slot is used to accommodate the wafer under test. The digital ground probe, the analog ground probe, the power probe, the digital signal probe, and the analog signal probe are all exposed in the wafer slot.

[0009] According to one or more embodiments of the present application, in the test socket, all the outer surfaces of the assembly block are completely covered by an anodization layer.

[0010] According to one or more embodiments of the present application, in the test socket, the probe base further comprises at least one first fixing pin and at least one second fixing pin. The metal block has at least one first fixing hole and at least one second fixing hole, the axis of the first fixing hole and the axis of the second fixing hole intersect each other. The assembly block has at least one third fixing hole and at least one fourth fixing hole, the axis of the third fixing hole and the axis of the fourth fixing hole intersect each other. When the assembly block and the metal block jointly constitute the probe base, the first fixing hole and the third fixing hole are coaxial with each other, the second fixing hole and the fourth fixing hole are coaxial with each other, and the first fixing pin passes through the first fixing hole and the third fixing hole, and the second fixing pin passes through the second fixing hole and the fourth fixing hole.

[0011] According to one or more embodiments of the present application, in the test socket, the first fixing pin and the second fixing pin respectively comprise polyether ether ketone material.

[0012] According to one or more embodiments of the present application, in the test socket, the assembly block comprises at least one first guide rail and at least one second guide rail. The first guide rail and the second guide rail are respectively protruded on two adjacent surfaces of the assembly block. The metal block comprises at least one first rail groove and at least one second rail groove. The first rail groove and the second rail groove are respectively recessed on two adjacent inner walls of the recessed portion. When the assembly block and the metal block jointly constitute the probe base, the first guide rail is slidably located in the first rail groove, and the second guide rail is slidably located in the second rail groove.

[0013] According to one or more embodiments of the present application, in the test socket described above, the first rail groove has different widths at two opposite ends, and the second rail groove has different widths at two opposite ends, so that the first rail is stopped in the first rail groove and the second rail is stopped in the second rail groove.

[0014] According to one or more embodiments of the present application, in the test socket described above, when the assembly block and the metal block jointly form the probe base, the outer surface of the assembly block is part of an outer side surface of the probe base, or when the assembly block and the metal block jointly form the probe base, all outer side surfaces of the probe base jointly surround the assembly block.

[0015] One embodiment of the present application provides a test socket. The test socket includes a probe base, a wafer slot, a power supply probe, a digital signal probe, an analog signal probe, an analog ground probe, and a digital ground probe. The probe base is made of metal and has a top surface and a bottom surface opposite to each other. The bottom surface is used to electrically connect an independent ground. The wafer slot is recessed in the top surface of the probe base and is used to accommodate a wafer under test. The wafer slot is divided into a first region and a second region adjacent to each other. The power supply probe is inserted into the probe base and located in the first region, electrically insulated from the probe base, and used to connect the wafer under test. The digital signal probe is inserted into the probe base and located in the first region, electrically insulated from the probe base, and used to connect the wafer under test. The digital ground probe is inserted into the probe base and located in the first region, electrically connected to the probe base, and used to electrically connect the wafer under test and the independent ground. The analog ground probe is inserted into the probe base and located in the second region, electrically isolated from the digital ground probe, and used to electrically connect the wafer under test and another independent ground.

[0016] According to one or more embodiments of the present application, in the test socket described above, the first region and the second region are physically separable.

[0017] One embodiment of the present application provides a detection device. The detection device includes a circuit carrier and a test socket. The circuit carrier has a first ground and a second ground electrically isolated from each other. The test socket includes a metal block, an assembly block, an analog ground probe, and a digital ground probe. The metal block is electrically connected to the first ground, and the metal block has a recess. The assembly block is electrically isolated from the metal block and is detachably embedded in the recess, so that the metal block and the assembly block jointly form a probe base used to test a wafer under test. The digital ground probe is inserted into the metal block, electrically connected to the metal block and the first ground through the metal block, and used to connect the wafer under test and the first ground. The analog ground probe is inserted into the assembly block and used to connect the wafer under test and the second ground.

[0018] According to one or more embodiments of the present application, in the testing device as described above, the test socket further comprises a power probe, a digital signal probe, an analog signal probe, a first insulating portion, a second insulating portion, and a third insulating portion. The power probe is inserted into the metal block for connecting the wafer under test. The first insulating portion surrounds the power probe and is located between the power probe and the metal block so as to electrically insulate the power probe from the metal block. The digital signal probe is inserted into the metal block for connecting the wafer under test. The second insulating portion surrounds the digital signal probe and is located between the digital signal probe and the metal block so as to electrically insulate the digital signal probe from the metal block. The analog signal probe is inserted into the assembly block for connecting the wafer under test. The third insulating portion surrounds the analog signal probe and is located between the analog signal probe and the assembly block so as to electrically insulate the analog signal probe from the assembly block.

[0019] According to one or more embodiments of the present application, in the testing device as described above, the front surface of the probe socket has a wafer slot. The wafer slot is used to accommodate the wafer under test. The digital ground probe, the analog ground probe, the power probe, the digital signal probe, and the analog signal probe are all exposed within the wafer slot.

[0020] According to one or more embodiments of the present application, in the testing device as described above, all the outer surfaces of the assembly block are completely covered by an anodization layer.

[0021] According to one or more embodiments of the present application, in the testing device as described above, the probe socket further comprises at least one first fixing pin and at least one second fixing pin. The metal block has at least one first fixing hole and at least one second fixing hole, the axis of the first fixing hole and the axis of the second fixing hole intersect each other. The assembly block has at least one third fixing hole and at least one fourth fixing hole, the axis of the third fixing hole and the axis of the fourth fixing hole intersect each other. When the assembly block and the metal block jointly constitute the probe socket, the first fixing hole and the third fixing hole are coaxial with each other, the second fixing hole and the fourth fixing hole are coaxial with each other, and the first fixing pin passes through the first fixing hole and the third fixing hole, and the second fixing pin passes through the second fixing hole and the fourth fixing hole.

[0022] According to one or more embodiments of the present application, in the testing device as described above, the first fixing pin and the second fixing pin are respectively made of polyether ether ketone material.

[0023] According to one or more embodiments of the present application, in the testing device as described above, the assembly block comprises at least one first guide rail and at least one second guide rail. The first guide rail and the second guide rail are respectively protruded on two adjacent surfaces of the assembly block. The metal block comprises at least one first rail groove and at least one second rail groove. The first rail groove and the second rail groove are respectively recessed on two adjacent inner walls of the recessed portion. When the assembly block and the metal block jointly constitute the probe socket, the first guide rail is slidably located in the first rail groove, and the second guide rail is slidably located in the second rail groove.

[0024] According to one or more embodiments of the present application, in the detection device described above, the width of the two opposite ends of the first rail groove is not consistent, and the width of the two opposite ends of the second rail groove is not consistent, so that the first guide rail is stopped in the first rail groove and the second guide rail is stopped in the second rail groove.

[0025] According to one or more embodiments of the present application, in the detection device described above, when the assembly block and the metal block jointly constitute the probe base, the outer surface of the assembly block is part of an outer side surface of the probe base, or when the assembly block and the metal block jointly constitute the probe base, all outer side surfaces of the probe base jointly surround the assembly block.

[0026] In this way, through the above-mentioned architecture of each embodiment, the signal interference and electromagnetic interference generated by the high-resolution analog signal of the semiconductor packaging element are reduced by isolating the analog and digital grounds.

[0027] The above merely describes the problems to be solved by the present application, the technical means for solving the problems, and the effects thereof, and the specific details of the present application will be described in detail in the embodiments and related drawings below. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to make the above and other objects, features, advantages and embodiments of the present application more apparent, the following describes the accompanying drawings:

[0029] Figure 1 A schematic diagram of a detection device according to an embodiment of the present application;

[0030] Figure 2 A schematic diagram of a test socket according to an embodiment of the present application; Figure 1 A schematic diagram of a test socket according to an embodiment of the present application;

[0031] Figure 3 A schematic diagram of a test socket according to an embodiment of the present application; Figure 2 A partial cross-sectional view along the line segment AA;

[0032] Figure 4 A partial cross-sectional view along the line segment AA; Figure 2 A partial cross-sectional view along the line segment AA;

[0033] Figure 5 A comparison diagram of insertion loss performance of test sockets with different designs;

[0034] Figure 6 A partial cross-sectional view along the line segment AA;

[0035] Figure 7 A partial cross-sectional view along the line segment AA; and

[0036] Figure 8 A partial cross-sectional view along the line segment AA.

[0037]

SYMBOL DESCRIPTION

[0038] 10: detection device

[0039] 100: circuit carrier

[0040] 101: upper surface

[0041] 110: power supply contact

[0042] 120: digital signal contact

[0043] 130: analog signal contact

[0044] 140: first ground

[0045] 150: second ground

[0046] 200: test socket

[0047] 300, 301, 302, 303, 304: probe head

[0048] 310: top surface

[0049] 320: back surface

[0050] 330: lateral surface

[0051] 340: wafer slot

[0052] 341: bottom surface

[0053] 342: through-hole

[0054] 350: front frame

[0055] 351: opening

[0056] 360: metal plate body

[0057] 361: column hole region

[0058] 362: surrounding region

[0059] 370: support base plate

[0060] 410: power supply probe

[0061] 411: first insulating portion

[0062] 420: digital signal probe

[0063] 421: second insulating portion

[0064] 430: analog signal probe

[0065] 431: third insulating portion

[0066] 440: digital ground probe

[0067] 441: First conductor section

[0068] 450: Simulated grounding probe

[0069] 451: Second conductor section

[0070] 500: Socket Cover

[0071] 600: Metal block

[0072] 610, 612: Depression

[0073] 611: Inner wall

[0074] 620: First fixing hole

[0075] 621: Axis

[0076] 630: Second fixing hole

[0077] 631: Axis

[0078] 640: First rail groove

[0079] 641: First end

[0080] 642: Second end

[0081] 650: Second rail groove

[0082] 700: Assembly Block

[0083] 710: Outer surface

[0084] 720: Anodized layer

[0085] 730: Third fixing hole

[0086] 731: Axis

[0087] 740: Fourth fixing hole

[0088] 741: Axis

[0089] 751: First fixing pin

[0090] 752: Second fixing pin

[0091] 760: First guide rail

[0092] 770: Second guide rail

[0093] 801: First Test Socket

[0094] 802: Second Test Socket

[0095] 803: Third Test Socket

[0096] AA: line segment

[0097] C: Chip under test

[0098] T: Foot position

[0099] W1, W2: Width

[0100] Z1: First Area

[0101] Z2: Second Region Detailed Implementation

[0102] Several embodiments of the present invention will be disclosed below with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details are not intended to limit the invention. That is, these practical details are not essential in the various embodiments of the invention. Furthermore, for the sake of simplicity, some known and conventional structures and elements will be illustrated in the drawings in a simple schematic manner.

[0103] Figure 1 This is a schematic diagram of a detection device 10 according to an embodiment of the present invention. Figure 2 for Figure 1 Exploded view of test socket 200. Figure 3 for Figure 2 A partial sectional view along line segment AA. (e.g.) Figures 1 to 3 As shown, the testing device 10 includes a circuit board 100, a test socket 200, and a socket cover 500. The upper surface 101 of the circuit board 100 has at least one power contact 110, at least one digital signal contact 120, at least one analog signal contact 130, at least one first ground 140, and at least one second ground 150. The first ground 140 and the second ground 150 are independently configured and electrically isolated from each other.

[0104] The test socket 200 includes a probe base 300. The probe base 300 has a top surface 310 and a back surface 320 opposite to each other. The probe base 300 is fixed on the circuit carrier 100, and the probe base 300 is connected to the circuit carrier 100 through the back surface 320 and electrically connected to the first ground 140. The probe base 300 is mainly made of metal material (such as copper) or conductive non-metal material (such as graphite). The probe base 300 is used to test a wafer C (such as a semiconductor package element). More specifically, the top surface 310 of the probe base 300 is recessed with a wafer slot 340 for accommodating the above-mentioned wafer C, and the bottom surface 341 of the wafer slot 340 is divided into a first region Z1 and a second region Z2. The first region Z1 and the second region Z2 are adjacent to each other, and the first region Z1 and the second region Z2 are physically separable. For example, the area of the first region Z1 is greater than that of the second region Z2, and the second region Z2 is closer to the edge of the wafer slot 340 than the first region Z1.

[0105] The test socket 200 further includes a plurality of power supply probes 410, a plurality of digital signal probes 420, a plurality of analog signal probes 430, a plurality of digital ground probes 440, and a plurality of analog ground probes 450. These power supply probes 410 are respectively and side by side inserted into the probe base 300, and all located in the first region Z1. These digital signal probes 420 are respectively and side by side inserted into the probe base 300, and all located in the first region Z1. The digital ground probes 440 are respectively and side by side inserted into the probe base 300, and all located in the first region Z1, and the digital ground probes 440 are electrically connected to the probe base 300. These analog signal probes 430 are respectively and side by side inserted into the probe base 300, and all located in the second region Z2. These analog ground probes 450 are respectively and side by side inserted into the probe base 300, and all located in the second region Z2.

[0106] These power supply probes 410, digital signal probes 420, analog signal probes 430, digital ground probes 440, and analog ground probes 450 collectively upwardly contact corresponding pins T of the wafer C in the wafer slot 340. These power supply probes 410 collectively downwardly contact the power supply contacts 110 of the circuit carrier 100. The digital signal probes 420 collectively downwardly contact the digital signal contacts 120 of the circuit carrier 100. The analog signal probes 430 collectively downwardly contact the analog signal contacts 130 of the circuit carrier 100. These digital ground probes 440 collectively electrically connect to the first ground 140 of the circuit carrier 100 through the conduction of the probe base 300, and collectively downwardly contact the first ground 140 of the circuit carrier 100. These analog ground probes 450 are electrically isolated from the digital ground probes 440, and collectively downwardly contact the second ground 150 of the circuit carrier 100.

[0107] More specifically, the bottom surface 341 of the wafer slot 340 has a plurality of through holes 342, which are distributed on the bottom surface 341 of the wafer slot 340 and are spaced apart from each other, and which are distributed in the first region Z1 and the second region Z2. A coaxial pogo pin is inserted into each through hole 342. The coaxial pogo pin is the power supply probe 410, the digital signal probe 420, the analog signal probe 430, the analog ground probe 450, and the digital ground probe 440.

[0108] Furthermore, the probe card 300 further comprises a first insulating portion 411, a second insulating portion 421, a third insulating portion 431, a first conductor portion 441, and a second conductor portion 451. Each first insulating portion 411 is located in one through hole 342 in the first region Z1, surrounds one power supply probe 410, and is clamped between the power supply probe 410 and the probe card 300, so that the power supply probe 410 and the probe card 300 are electrically insulated. Each second insulating portion 421 is located in one through hole 342 in the first region Z1, surrounds one digital signal probe 420, and is clamped between the digital signal probe 420 and the probe card 300, so that the digital signal probe 420 and the probe card 300 are electrically insulated. Each third insulating portion 431 is located in one through hole 342 in the second region Z2, surrounds one analog signal probe 430, and is clamped between the analog signal probe 430 and the probe card 300, so that the analog signal probe 430 and the probe card 300 are electrically insulated. The first conductor portion 441 is located in one through hole 342 in the first region Z1, surrounds one digital ground probe 440, and is clamped between the digital ground probe 440 and the probe card 300, so that the digital ground probe 440 is electrically connected to the probe card 300 through the first conductor portion 441. However, the present application is not limited thereto, and in other embodiments, the digital ground probe 440 can also directly contact the inner wall of the through hole 342 of the probe card 300. The second conductor portion 451 is located in one through hole 342 in the second region Z2, surrounds one analog ground probe 450, and is clamped between the analog ground probe 450 and the probe card 300, so that the analog ground probe 450 is electrically connected to the probe card 300 through the second conductor portion 451. However, the present application is not limited thereto, and in other embodiments, the analog ground probe 450 can also directly contact the inner wall of the through hole 342 of the probe card 300.

[0109] In the present embodiment, the probe socket 300 comprises a front frame 350, a metal plate body 360, and a support bottom plate 370. The metal plate body 360 is directly clamped between the front frame 350 and the support bottom plate 370. The front frame 350 has an opening 351, and the opening 351 of the front frame 350 and the metal plate body 360 jointly define the wafer slot 340. Each of the through holes 342 is formed on the metal plate body 360 and the support bottom plate 370, and the first region Z1 and the second region Z2 are located on the metal plate body 360. Further, the metal plate body 360 has an array hole region 361 and a surrounding region 362, the surrounding region 362 completely surrounds the array hole region 361, and the through holes 342 are arranged in the array hole region 361 but not in the surrounding region 362. The second region Z2 is located on both the array hole region 361 and the surrounding region 362, and the first region Z1 is the remaining region of the array hole region 361 except the second region Z2.

[0110] The socket cover 500 covers the wafer slot 340 of the probe socket 300 and the wafer C to be tested in the wafer slot 340, so as to ensure that the corresponding pins T of the wafer C to be tested can be pressed against the corresponding probes.

[0111] Figure 4 For Figure 2 the partial exploded view of the probe socket 301. As shown in Figure 4 , more specifically, in the present embodiment, the probe socket 301 further comprises a metal block 600 and an assembly block 700. The metal block 600 is electrically connected to the first ground 140, and the metal block 600 has a recess 610. The assembly block 700 is detachably embedded in the recess 610, so that the metal block 600 and the assembly block 700 jointly restore a part (such as the metal plate body 360) of the probe socket 301, and all the outer sides 330 of the probe socket 301 jointly surround the assembly block 700.

[0112] It should be understood that, as shown in Figure 3 and Figure 4 , the power supply probe 410, the digital signal probe 420, and the digital ground probe 440 are located in the metal block 600, and the analog signal probe 430 and the analog ground probe 450 are located in the assembly block 700.

[0113] Furthermore, the assembly block 700 is electrically isolated from the metal block 600 and the circuit carrier 100, such that the digital ground probes 440 are not electrically connected to the analog ground probes 450, nor are they connected to the same ground. More specifically, all of the outer surfaces 710 of the assembly block 700 include an anodized layer 720. The anodized layer 720 refers to an oxide film that is generated on all of the outer surfaces 710 of the assembly block 700, and the anodized layer 720 has the ability to be highly hard, corrosion resistant, oxidation resistant, wear resistant, and electrically insulating. For example, the assembly block 700 is made of a metal material (such as copper) or a conductive non-metal material (such as graphite). The assembly block 700 is pre-anodized so that all of the exposed surfaces of the assembly block 700 are subjected to an electric current in an electrolyte, thereby forming the anodized layer 720.

[0114] Furthermore, more specifically, the assembly block 700 is sized to match the size of the recessed portion 610, such that the assembly block 700 completely fills the recessed portion 610 and completely hides the recessed portion 610, that is, the inner walls 611 of the recessed portion 610 directly contact the anodized layer 720 of the assembly block 700.

[0115] Figure 5 A performance comparison chart of insertion loss of test sockets of different designs. The inventor tested the insertion loss performance of three test sockets of different designs (hereinafter referred to as first to third test sockets 801-803). In the first test socket 801, all of the ground probes are electrically connected to the probe seats. In the second test socket 802, all of the ground probes are electrically isolated from the probe seats. In the third test socket 803, some of the ground probes (such as the digital ground probes 440 in the above embodiment, Figure 3 ) are electrically connected to the probe seats, and some of the ground probes (such as the analog ground probes 450 in the above embodiment, Figure 3 ) are electrically isolated from the probe seats 300.

[0116] Thus, as shown in Figure 5 , in the range of 30 to 40 gigahertz (GHz), the insertion loss of the first test socket 801 gradually increases, the insertion loss of the second test socket 802 is next, and the insertion loss of the third test socket 803 is the lowest. Thus, from Figure 5 , it can be seen that the test socket 200 of the above embodiment can obtain less insertion loss during testing.

[0117] Figure 6 A partial view of the probe seat 302 of an embodiment of the present application. As shown in Figure 6As shown, the metal block 600 has a plurality of first fixing holes 620 and a plurality of second fixing holes 630. The first fixing holes 620 are linearly arranged on one outer surface 330 of the metal block 600, and the second fixing holes 630 are linearly arranged on the other outer surface 330 of the metal block 600. The axis 621 of each first fixing hole 620 and the axis 631 of each second fixing hole 630 intersect each other (e.g., orthogonal), and the first fixing holes 620 and second fixing holes 630 are not coplanar.

[0118] Assembly block 700 has a plurality of third fixing holes 730 and a plurality of fourth fixing holes 740. The third fixing holes 730 are linearly arranged on one surface of assembly block 700, and the fourth fixing holes 740 are linearly arranged on the other surface of assembly block 700. The axis 731 of each third fixing hole 730 and the axis 741 of each fourth fixing hole 740 intersect each other (e.g., orthogonal), and the third fixing holes 730 and fourth fixing holes 740 are not coplanar. It should be understood that the first fixing holes 620 to the fourth fixing holes 740 are all located within the aforementioned surrounding area 362 of probe holder 302 and do not extend into the row of holes 361.

[0119] Thus, when the assembly block 700 is inserted into the recess 610 and together with the metal block 600 forms part of the probe holder 302 (such as the metal plate 360), the first fixing hole 620 and the third fixing hole 730 are coaxial with each other, and the second fixing hole 630 and the fourth fixing hole 740 are coaxial with each other. Then, a first fixing pin 751 passes through the coaxial first fixing hole 620 and the third fixing hole 730, and a second fixing pin 752 passes through the coaxial second fixing hole 630 and the fourth fixing hole 740, so that the assembly block 700 can be fixed to the metal block 600. For example, the first fixing pin 751 and the second fixing pin 752 are respectively made of polyetheretherketone (PEEK) or other similar materials. PEEK is a semi-crystalline high-performance engineering thermoplastic. However, the present invention is not limited to the material of the first fixing pin 751 and the second fixing pin 752.

[0120] Figure 7 This is a partially exploded view of a probe holder 303 according to an embodiment of the present invention. Figure 7As shown, the probe holder 303 of this embodiment is substantially the same as the probe holder 300 described above, except that the assembly block 700 includes at least one (e.g., two) first guide rails 760 and at least one (e.g., two) second guide rails 770. The first guide rail 760 and the second guide rail 770 are respectively protruding from two adjacent outer surfaces 710 of the assembly block 700. The metal block 600 includes at least one (e.g., two) first groove 640 and at least one (e.g., two) second groove 650. The first groove 640 and the second groove 650 are respectively recessed into two adjacent inner walls 611 of the recessed portion 610. Thus, when the assembly block 700 is inserted into the recessed portion 610 and forms part of the probe holder 303 (such as the metal plate 360) with the metal block 600, the first guide rail 760 can slide into the corresponding first groove 640, and the second guide rail 770 can slide into the corresponding second groove 650.

[0121] Furthermore, the inconsistent widths of each first rail groove 640 and each second rail groove 650 cause the first guide rail 760 to be stopped within the first rail groove 640 and the second guide rail 770 to be stopped within the second rail groove 650, allowing the assembly block 700 to be fixed to the metal block 600. In other words, the width W1 of the first end 641 of the first rail groove 640 is smaller than the width W2 of its second end 642, causing the first guide rail 760 to be stopped by the first end 641 of the first rail groove 640 and unable to continue sliding along the first rail groove 640; similarly, the second guide rail 770 is also stopped by the second rail groove 650 and cannot continue sliding.

[0122] Figure 8 This is a partially exploded view of a probe holder 304 according to an embodiment of the present invention. Figure 8 As shown, the probe holder 304 of this embodiment is largely the same as the probe holder 300 described above, except that the recessed portion 612 of the metal block 600 is directly connected to the outer surface 330 of the probe holder 304, and is not located on the complete outline of the probe holder 300. Thus, when the assembly block 700 and the metal block 600 together form part of the probe holder 304 (such as the metal plate 360), the outer surface 710 of the assembly block 700 is part of the outer surface 330 of the probe holder 304.

[0123] Thus, through the architecture described in the above embodiments, signal interference and electromagnetic interference caused by high-resolution analog signals to semiconductor packaged components are reduced by isolating analog and digital grounds.

[0124] Finally, the embodiments disclosed above are not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit and scope of the present invention are protected under this invention. Therefore, the scope of protection of this invention shall be determined by the scope defined in the appended claims.

Claims

1. A test socket, characterized in that, Include: A metal block having a recessed portion for connecting to an independent grounding point; An assembly block, electrically isolated from the metal block, is detachably embedded in the recess, such that the metal block and the assembly block together form a probe holder, which is used to test a chip under test. A digital grounding probe is inserted into the metal block, electrically connected to the metal block and electrically connected to the independent ground through the metal block. The digital grounding probe is used to connect the chip under test and the independent ground. as well as A simulated grounding probe is inserted into the assembly block. The simulated grounding probe is used to connect the chip under test to another independent ground.

2. The test socket according to claim 1, characterized in that, Also includes: A power probe is inserted into the metal block to connect to the chip under test; A first insulating portion surrounds the power probe and is located between the power probe and the metal block, thereby electrically insulating the power probe from the metal block; A digital signal probe is inserted into the metal block to connect to the chip under test; A second insulating portion surrounds the digital signal probe and is located between the digital signal probe and the metal block, thereby electrically insulating the digital signal probe from the metal block; An analog signal probe is inserted into the assembly block to connect to the chip under test; as well as A third insulating portion surrounds the analog signal probe and is located between the analog signal probe and the assembly block, thereby electrically insulating the analog signal probe from the assembly block.

3. The test socket according to claim 2, characterized in that, The probe holder has a wafer slot on its front side to accommodate the wafer under test, wherein the digital ground probe, the analog ground probe, the power probe, the digital signal probe and the analog signal probe are all exposed in the wafer slot.

4. The test socket according to claim 1, characterized in that, All outer surfaces of the assembly block are completely covered by an anodized layer.

5. The test socket according to claim 1, characterized in that, The probe holder also includes at least one first retaining pin and at least one second retaining pin; The metal block has at least one first fixing hole and at least one second fixing hole, the axes of the first fixing hole and the second fixing hole intersecting each other; and The assembly block has at least one third fixing hole and at least one fourth fixing hole, the axes of the third fixing hole and the fourth fixing hole intersecting each other. When the assembly block and the metal block together form the probe holder, the first fixing hole and the third fixing hole are coaxial with each other, the second fixing hole and the fourth fixing hole are coaxial with each other, and the first fixing pin passes through the first fixing hole and the third fixing hole, and the second fixing pin passes through the second fixing hole and the fourth fixing hole.

6. The test socket according to claim 5, characterized in that, The first fixing pin and the second fixing pin are respectively made of polyetheretherketone material.

7. The test socket according to claim 1, characterized in that, The assembly block includes at least one first guide rail and at least one second guide rail, the first guide rail and the second guide rail respectively protruding from two adjacent surfaces of the assembly block; and The metal block includes at least one first track groove and at least one second track groove, the first track groove and the second track groove being recessed into two adjacent inner walls of the recess. When the assembly block and the metal block together form the probe holder, the first guide rail is slidably located in the first rail groove and the second guide rail is slidably located in the second rail groove.

8. The test socket according to claim 7, characterized in that, The widths of the two opposite ends of the first rail groove are inconsistent, and the widths of the two opposite ends of the second rail groove are inconsistent, so that the first guide rail is stopped in the first rail groove and the second guide rail is stopped in the second rail groove.

9. The test socket according to claim 1, characterized in that, When the assembly block and the metal block together form the probe holder, the outer surface of the assembly block is part of an outer side surface of the probe holder; or When the assembly block and the metal block together form the probe holder, all the outer surfaces of the probe holder together surround the assembly block.

10. A test socket, characterized in that, Include: A probe holder, made of metal, has a top surface and a bottom surface facing each other, the bottom surface being used for electrical connection to an independent ground; A wafer slot is recessed on the top surface of the probe holder to accommodate a wafer to be tested, wherein the wafer slot is divided into a first region and a second region that are adjacent to each other. A power probe is inserted into the probe holder, located in the first region, and electrically insulated from the probe holder, for connecting to the chip under test; A digital signal probe is inserted into the probe holder, located in the first region, and electrically insulated from the probe holder, for connecting to the chip under test; A digital grounding probe is inserted into the probe holder, located in the first region, and electrically connected to the probe holder to electrically connect to the independent ground through the probe holder. The digital grounding probe is used to connect the chip under test and the independent ground. An analog signal probe is inserted into the probe holder, located in the second region, for connecting to the chip under test; and An analog grounding probe is inserted into the probe holder, located in the second area, and is electrically isolated from the digital grounding probe. The analog grounding probe is used to electrically connect the chip under test and another independent ground.

11. The test socket according to claim 10, characterized in that, The first region and the second region are physically separable.

12. A detection device, characterized in that, Include: A circuit board having a first ground and a second ground that are electrically isolated from each other; and A test socket, comprising: A metal block electrically connected to the first ground, and the metal block having a recessed portion; An assembly block, electrically isolated from the metal block, is detachably embedded in the recess, such that the metal block and the assembly block together form a probe holder, which is used to test a chip under test. A digital grounding probe is inserted into the metal block, electrically connected to the metal block and electrically connected to the first ground through the metal block. The digital grounding probe is connected to the chip under test and the first ground respectively. as well as A simulated grounding probe is inserted into the assembly block, and the simulated grounding probe is connected to the chip under test and the second grounding.

13. The detection device according to claim 12, characterized in that, The test socket also includes: A power probe is inserted into the metal block to connect to the chip under test; A first insulating portion surrounds the power probe and is located between the power probe and the metal block, thereby electrically insulating the power probe from the metal block; A digital signal probe is inserted into the metal block to connect to the chip under test; A second insulating portion surrounds the digital signal probe and is located between the digital signal probe and the metal block, thereby electrically insulating the digital signal probe from the metal block; An analog signal probe is inserted into the assembly block to connect to the chip under test; as well as A third insulating portion surrounds the analog signal probe and is located between the analog signal probe and the assembly block, thereby electrically insulating the analog signal probe from the assembly block.

14. The detection device according to claim 13, characterized in that, The probe holder has a wafer slot on its front side to accommodate the wafer under test, wherein the digital ground probe, the analog ground probe, the power probe, the digital signal probe and the analog signal probe are all exposed in the wafer slot.

15. The detection device according to claim 12, characterized in that, All outer surfaces of the assembly block are completely covered by an anodized layer.

16. The detection device according to claim 12, characterized in that, The probe holder also includes at least one first retaining pin and at least one second retaining pin; The metal block has at least one first fixing hole and at least one second fixing hole, the axes of the first fixing hole and the second fixing hole intersecting each other; and The assembly block has at least one third fixing hole and at least one fourth fixing hole, the axes of the third fixing hole and the fourth fixing hole intersecting each other. When the assembly block and the metal block together form the probe holder, the first fixing hole and the third fixing hole are coaxial with each other, the second fixing hole and the fourth fixing hole are coaxial with each other, and the first fixing pin passes through the first fixing hole and the third fixing hole, and the second fixing pin passes through the second fixing hole and the fourth fixing hole.

17. The detection device according to claim 16, characterized in that, The first fixing pin and the second fixing pin are respectively made of polyetheretherketone material.

18. The detection device according to claim 12, characterized in that, The assembly block includes at least one first guide rail and at least one second guide rail, the first guide rail and the second guide rail respectively protruding from two adjacent surfaces of the assembly block; and The metal block includes at least one first track groove and at least one second track groove, the first track groove and the second track groove being recessed into two adjacent inner walls of the recess. When the assembly block and the metal block together form the probe holder, the first guide rail is slidably located in the first rail groove and the second guide rail is slidably located in the second rail groove.

19. The detection device according to claim 18, characterized in that, The widths of the two opposite ends of the first rail groove are inconsistent, and the widths of the two opposite ends of the second rail groove are inconsistent, so that the first guide rail is stopped in the first rail groove and the second guide rail is stopped in the second rail groove.

20. The detection device according to claim 12, characterized in that, When the assembly block and the metal block together form the probe holder, the outer surface of the assembly block is part of an outer side surface of the probe holder; or When the assembly block and the metal block together form the probe holder, all the outer surfaces of the probe holder together surround the assembly block.

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