A self-positioning mounting device for surface mount package enclosures

Abstract

The present application relates to the technical field of electronic component packaging auxiliary tool, and particularly relates to a self-positioning rack device for surface mounting package shell, which comprises a bottom plate, a positioning plate and a top plate; the bottom plate is horizontally placed; the positioning plate comprises a lower positioning module for positioning an open box body and an upper positioning module for positioning a shell, and the lower positioning module and the upper positioning module are both rotationally installed on the upper end face of the bottom plate; the top plate is installed above the positioning plate, and the top plate presses the shell in the upper positioning module and the opening at the top of the open box body; when the open box body and the shell are sequentially loaded, the upper positioning module is rotated and removed from above the lower positioning module; after the open box body is placed in the lower positioning groove on the lower positioning module, the lower positioning module is reset, and the shell is placed in the upper positioning groove of the upper positioning module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic component packaging auxiliary tooling, and particularly relates to a self-positioning rack device for surface mounting packaging shells. BACKGROUND

[0002] The preparation process of the surface-mounted and ceramic metal shell electronic device is roughly as follows: first, a ceramic metal shell is prepared by sintering, at this time, the ceramic metal shell is essentially a box with an open top but other faces are closed, plus a shell used to cover the open top box, then the chip is brazed and arranged in the open top box, then the chip is connected with the pin by bonding wire, then the shell is covered, the open top of the open top box is covered, usually by brazing connection, thus completing the packaging of the electronic device.

[0003] However, the existing packaging has the following two problems: 1) the existing packaging mold cannot maintain the symmetry of the shell and the open top box during the sintering process in the nitrogen-hydrogen sintering furnace, the shell is not at the center of the top surface of the open top box, but is prone to deviation; 2) at the same time, the solder ring on the shell has the same metal composition ratio as the solder sheet used for chip sintering, so the melting temperature of the solder ring is the same as that of the solder sheet, and during the sintering process of the open top box and the shell, the metal weight of the auxiliary weight plate is pressed on the bottom surface of the open top box, and since the metal weight conducts heat quickly, the bottom of the open top box is heated quickly, thereby causing the brazing layer between the chip and the open top box to re-melt during the sintering process of the open top box and the shell, which causes poor welding between the chip and the inner bottom surface of the open top box, resulting in poor conduction, affecting the packaging yield of the diode and the reliability of long-term use.

[0004] In the Chinese patent with the patent application number CN202010235816.8, a packaging mold for a surface-mounted and ceramic metal shell electronic device is disclosed, which forms an upper segment rectangular through hole for embedding and positioning the shell and a lower segment rectangular through hole for embedding and positioning the open top box on the positioning plate, reasonably controls the shape, size and positional relationship between the upper segment rectangular through hole and the lower segment rectangular through hole, and ensures the symmetry of the shell and the open top box during the sintering process; the bottom end of the ejector pin is pressed on the shell, the heat of the ejector pin is conducted to the shell, the heat is conducted to the bottom of the open top box at a slow speed, the solder ring on the shell is completely melted by controlling the packaging time, and the solder for welding the chip is not melted, which ensures complete and good brazing packaging of the open top box and the shell, and firm welding between the chip and the open top box.

[0005] Although the technical solution disclosed in the above patent document can solve the technical problem of the symmetry of the shell and the open top box, the structure of the technical solution is too complex and is not convenient to assemble. SUMMARY

[0006] In order to solve the above problems, the self-positioning rack device for surface mount packaging shell is provided, which comprises a bottom plate, a positioning plate and a top plate.

[0007] In order to achieve the above purpose, the self-positioning rack device for surface mount packaging shell is provided.

[0008] The self-positioning rack device for surface mount packaging shell comprises a bottom plate, a positioning plate and a top plate.

[0009] The bottom plate is horizontally placed.

[0010] The positioning plate comprises a lower positioning module for positioning the open box and an upper positioning module for positioning the shell, and the lower positioning module and the upper positioning module are rotatably installed on the upper end surface of the bottom plate.

[0011] The top plate is installed above the positioning plate, which presses the shell in the upper positioning module and the open top of the open box.

[0012] When the open box and the shell are sequentially loaded, the upper positioning module is rotated and removed from above the lower positioning module, the open box is placed in the lower positioning groove on the lower positioning module, the lower positioning module is reset, and the shell is placed in the upper positioning groove of the upper positioning module.

[0013] As an improvement, the lower positioning module is provided with a lower centering unit for centering the open box.

[0014] The upper positioning module is provided with an upper centering unit for centering the shell.

[0015] The lower centering unit and the upper centering unit cooperate to center the open box and the shell.

[0016] As an improvement, the lower centering unit comprises a plurality of lower positioning tongues arranged around the lower positioning groove and arranged in an extension mode, and when the upper positioning module coincides with the lower positioning module, the lower positioning tongues are extended to center the open box.

[0017] As an improvement, the lower centering unit comprises a plurality of lower positioning tongues arranged around the lower positioning groove and arranged in an extension mode, and when the upper positioning module coincides with the lower positioning module, the lower positioning tongues are extended to center the open box.

[0018] As an improvement, the lower positioning module is provided with a lower pressing block that corresponds one-to-one with the lower positioning tongue. The lower pressing block presses the lower positioning tongue vertically, causing the lower positioning tongue to extend. The lower positioning tongue is provided with a lower spring that drives it to reset and retract.

[0019] As an improvement, the lower positioning tongue and the lower extrusion block are configured to cooperate by inclined extrusion, and the upper end of the lower extrusion block protrudes from the upper end face of the lower positioning module and is set as a ball head. The upper end of the lower extrusion block cooperates with the rotation extrusion of the upper positioning module, so that the lower extrusion block descends.

[0020] As an improvement, the upper centering unit includes several upper positioning tongues arranged around the upper positioning groove and telescopically disposed thereon. When the top plate presses down on the outer shell, the upper positioning tongues extend to center and position the outer shell.

[0021] As an improvement, the upper positioning module is provided with an upper pressing block that corresponds one-to-one with the upper positioning tongue. The upper pressing block presses the upper positioning tongue vertically, causing the upper positioning tongue to extend. The upper positioning tongue is provided with an upper spring that drives it to reset and retract.

[0022] As an improvement, the upper positioning tongue and the upper extrusion block are configured to cooperate by inclined extrusion, and the upper extrusion block protrudes from the upper end of the upper positioning module in the form of a ball head. The upper end of the upper extrusion block cooperates with the downward pressure of the top plate to make the upper extrusion block descend.

[0023] As an improvement, a ejector pin is installed on the top plate facing the outer shell, and the ejector pin is elastically telescopic. When the top plate presses down on the upper positioning module, the ejector pin presses against the outer shell.

[0024] As an improvement, the upper end of the ejector pin protrudes from the top plate, and an elastic adjustment member is provided between the ejector pin and the top plate for abutment engagement. The ejector pin is hollow inside and has an exhaust channel, and the bottom of the ejector pin has an exhaust hole communicating with the exhaust channel.

[0025] The beneficial effects of this invention are as follows:

[0026] (1) The present invention uses a positioning plate for positioning the open box and the outer shell to form a lower positioning module and an upper positioning module. By rotating and switching the lower positioning module and the upper positioning module, the lower positioning module and the upper positioning module are staggered, and the open box and the outer shell are loaded in sequence. The open box is placed first, and the open box is used as a support carrier for the outer shell, which makes it more convenient to install the open box and the outer shell. After the sealing is completed, the positioning plate only needs to be rotated to detach from the bottom plate, and the open box and the outer shell will fall off automatically.

[0027] (2) By using the upper centering unit and the lower centering unit, the open box body and the outer shell are centered before brazing, ensuring that the center lines of the two are aligned and there will be no misalignment. The assembly accuracy is higher, and the dimensional tolerance range of the lower positioning groove and the upper positioning groove can be larger, without the need to tightly fasten the open box body and the outer shell.

[0028] (3) By setting a top plate, the top pins on the top plate press the outer shell, so that the brazing quality between the outer shell and the open box is packaged during the brazing process. In addition, the heat of the top pin is conducted to the outer shell, and the heat is conducted to the bottom of the top open box slowly. By controlling the packaging time, the solder ring on the outer shell is completely melted, while the solder of the chip does not melt. This ensures that the brazing packaging between the top open box and the outer shell is complete and good, and also ensures that the welding between the chip and the top open box is strong. It avoids the problem that the sintering brazing process between the top open box and the outer shell will cause the brazing layer between the chip and the top open box to remelt, resulting in poor welding between the chip and the inner bottom surface of the top open box and poor conductivity.

[0029] (4) The present invention sets the interior of the ejector pin as a hollow exhaust channel and sets an exhaust hole at the bottom of the ejector pin. The exhaust channel and exhaust hole are used to conduct the heat generated between the outer shell and the open box during the brazing process, so as to avoid all the heat being transmitted downward and further ensure the strong welding between the chip and the top open box.

[0030] In summary, the present invention has the advantages of convenient loading and unloading, accurate positioning, and stable brazing, and is particularly suitable for the field of auxiliary tooling technology for electronic component packaging. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the open box body and outer shell structure of the present invention;

[0032] Figure 2 This is a schematic diagram of the three-dimensional structure of the open box body of the present invention;

[0033] Figure 3 This is a three-dimensional structural diagram of the present invention;

[0034] Figure 4 This is a schematic diagram of the three-dimensional structure of the base plate of the present invention;

[0035] Figure 5 This is a schematic diagram of the positioning plate flipping structure of the present invention;

[0036] Figure 6 This is a schematic diagram of the three-dimensional structure of the positioning module of the present invention;

[0037] Figure 7 for Figure 6 Enlarged schematic diagram of the structure at point A in the middle;

[0038] Figure 8 This is a schematic diagram of the three-dimensional structure of the upper and lower positioning module of the present invention;

[0039] Figure 9 for Figure 8 Enlarged schematic diagram of the structure at point B;

[0040] Figure 10 This is a schematic diagram of the cross-sectional structure of the centering unit in this invention;

[0041] Figure 11 This is a schematic diagram of a partial structure of the centering unit in this invention;

[0042] Figure 12 This is a schematic diagram of the three-dimensional structure of the positioning tongue in this invention;

[0043] Figure 13 This is a schematic diagram of the cross-sectional structure of the centering unit in this invention;

[0044] Figure 14 This is a schematic diagram of a partial structure of the centering unit in this invention;

[0045] Figure 15 This is a schematic diagram of the three-dimensional structure of the positioning tongue in this invention;

[0046] Figure 16 This is a schematic diagram of the top plate structure of the present invention;

[0047] Figure 17 This is a schematic cross-sectional view of the ejector pin structure of the present invention. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0049] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0051] Example 1:

[0052] like Figures 1 to 15 As shown, a self-positioning mounting device for surface mount package housings includes:

[0053] Base plate 1, positioning plate 2, and top plate 3;

[0054] The base plate 1 is placed horizontally;

[0055] The positioning plate 2 includes a lower positioning module 21 for positioning the open box body 100 and an upper positioning module 22 for positioning the outer shell 101, and both the lower positioning module 21 and the upper positioning module 22 are rotatably mounted on the upper end surface of the base plate 1.

[0056] The top plate 3 is installed above the positioning plate 2, and the top plate 3 presses the outer shell 101 inside the upper positioning module 22 against the opening at the top of the open box 100.

[0057] When the open box 100 and the outer shell 101 are sequentially installed, the upper positioning module 22 is rotated and removed from above the lower positioning module 21. After the open box 100 is placed in the lower positioning groove 211 on the lower positioning module 21, the lower positioning module 21 is reset, and the outer shell 101 is placed in the upper positioning groove 221 of the upper positioning module 22.

[0058] In order to improve the processing accuracy during the brazing process, the lower positioning module 21 is provided with a lower centering unit 23 for centering and positioning the open box body 100.

[0059] The upper positioning module 22 is provided with an upper centering unit 24 for centering and positioning the outer shell 101;

[0060] The lower centering unit 23 and the upper centering unit 24 cooperate to center the open box 100 with the outer shell 101.

[0061] Furthermore, the lower centering unit 23 includes a plurality of lower positioning tongues 231 arranged and telescopically disposed around the lower positioning groove 211. When the upper positioning module 22 coincides with the lower positioning module 21, the lower positioning tongues 231 extend to center and position the open box body 100.

[0062] Furthermore, in order to enable the lower positioning tongue 231 to extend and retract automatically, the lower positioning module 21 is provided with a lower pressing block 232 corresponding to the lower positioning tongue 231. The lower pressing block 232 presses the lower positioning tongue 231 vertically, causing the lower positioning tongue 231 to extend. The lower positioning tongue 231 is provided with a lower spring member 233 to drive it to reset and retract.

[0063] The lower positioning tongue 231 and the lower extrusion block 232 are configured to cooperate by inclined extrusion, and the upper end of the lower extrusion block 232 protrudes from the upper end face of the lower positioning module 21 and is set as a ball head. The upper end of the lower extrusion block 232 cooperates with the rotation extrusion of the upper positioning module 22, so that the lower extrusion block 232 descends.

[0064] Preferably, the upper centering unit 24 includes a plurality of upper positioning tongues 241 arranged around the upper positioning groove 221 and telescopically disposed thereon. When the top plate 3 presses down on the outer shell 101, the upper positioning tongues 241 extend to center and position the outer shell 101.

[0065] In order to enable the upper positioning tongue 241 to extend and retract automatically, the upper positioning module 22 is provided with an upper pressing block 242 corresponding to the upper positioning tongue 241. The upper pressing block 242 presses the upper positioning tongue 241 vertically, causing the upper positioning tongue 241 to extend. The upper positioning tongue 241 is provided with an upper spring member 243 to drive it to reset and retract.

[0066] Furthermore, the upper positioning tongue 241 and the upper pressing block 242 are configured to cooperate by inclined surface pressing, and the upper end of the upper pressing block 242 protrudes from the upper end face of the upper positioning module 22 and is set as a ball head. The upper end of the upper pressing block 242 cooperates with the downward pressing of the top plate 3, so that the upper pressing block 242 descends.

[0067] It should be noted that the base plate 1 has two sets of guide posts 11 on one side and two sets of positioning holes 12 on the other side. The positioning plate 2 has corresponding through holes 20 relative to the guide posts 11 and positioning holes 12. The positioning plate 2 is sleeved on the guide posts 11 through the through holes 20. Since the positioning plate 2 only has one guide post 11 sleeved on it, the positioning plate 2 can rotate. The positioning plate 2 includes a lower positioning module 21 and an upper positioning module 22. This allows the upper positioning module 22 to be mounted on the lower positioning module 21 when the open box 100 and the outer shell 101 are installed in sequence. After rotating and removing the open box 100, place it in the lower positioning groove 211, then reset the lower positioning module 21, and place the outer shell 101 in the upper positioning groove 221 of the upper positioning module 22. The open box 100 supports the outer shell 101. After loading, press the top plate 3 onto the positioning plate 2 to press down on the outer shell 101 for packaging and positioning. The top plate 3 has guide posts and positioning holes that are in the opposite direction to the bottom plate 1. Therefore, during assembly, the guide posts on the top plate 3 pass through the through holes 20 on the positioning plate 2 and insert into the positioning holes on the bottom plate 1, while the bottom plate 1 is exactly the opposite.

[0068] To further explain, during the process of attaching the open box body 100 and the outer shell 101, as the upper positioning module 22 rotates and resets, it squeezes the ball head at the upper end of the lower pressing block 232, causing the lower pressing block 232 to press down on the lower positioning tongue 231. Through the inclined surface pressing action, the lower positioning tongue 231 extends outward. Since the lower positioning tongue 231 is distributed on the four sides of the lower positioning groove 211, the lower positioning tongue 231 extends outward a certain distance to position and center the open box body 100. Correspondingly, after the outer shell 101 is attached, the top plate... 3. When pressing down to position the outer shell 101, the top plate 3 will press the ball head at the upper end of the upper pressing block 242, causing the upper pressing block 242 to press down on the upper positioning tongue 241. Through the inclined surface pressing cooperation, the upper positioning tongue 241 extends outward. Since the upper positioning tongue 241 is distributed on the four sides of the upper positioning groove 221, the upper positioning tongue 241 extends outward a certain distance to position and center the outer shell 101, so that the open box body 100 and the outer shell 101 are aligned, ensuring the brazing accuracy of the open box body 100 and the outer shell 101.

[0069] To further explain, an upper spring 243 is provided on the upper positioning tongue 241 and a lower spring 233 is provided on the lower positioning tongue 231, so that the upper positioning tongue 241 and the lower positioning tongue 231 will quickly retract and release the limiting centering after the compression restriction is removed.

[0070] Example 2:

[0071] Figure 16 This is a schematic diagram of a second embodiment of the self-positioning bracket device for surface mount packaging housings according to the present invention; as shown.Figure 16 As shown, components that are the same as or corresponding to those in Embodiment 1 are referred to using the same reference numerals as in Embodiment 1. For simplicity, only the differences from Embodiment 1 will be described below. This Embodiment 2 and... Figure 1 The difference in the first embodiment shown is that:

[0072] like Figure 16 and Figure 17 As shown, a pin 31 is installed on the top plate 3 facing the outer shell 101, and the pin 31 is elastically telescopic. When the top plate 3 presses down on the upper positioning module 22, the pin 31 presses against the outer shell 101.

[0073] Furthermore, the upper end of the ejector pin 31 protrudes from the top plate 3, and an elastic adjusting member 32 is provided between the ejector pin 31 and the top plate 3 for abutting cooperation. The ejector pin 31 is hollow inside and has an exhaust channel 311. The bottom of the ejector pin 31 is provided with an exhaust hole 312 that communicates with the exhaust channel 311.

[0074] It should be noted that during the brazing process between the outer shell 101 and the open box 100, the ejector pin 31 rests on the outer shell 101 and is elastically adjusted by the elastic adjustment member 32 to ensure the stability of the outer shell 101. The heat from the ejector pin 31 is conducted to the outer shell 101, but the heat is conducted to the bottom of the top open box slowly. By controlling the encapsulation time, the solder ring on the outer shell 101 is completely melted, while the solder of the chip is not melted. This ensures that the brazing encapsulation between the top open box 100 and the outer shell 101 is complete and good, and also ensures that the solder between the chip 102 and the top open box 101 is strong. This avoids the problem of poor soldering and poor conductivity caused by the sintering brazing process between the top open box and the outer shell, which would result in the solder layer between the chip and the inner bottom surface of the top open box being remelted.

[0075] Furthermore, the ejector pin 31 is provided with an exhaust channel 311 and an exhaust hole 312. During the process of solder ring melting, a large amount of heat and fumes will be generated, which are discharged to the outside through the exhaust channel 311 and the exhaust hole 312. On the one hand, the heat is released, preventing the heat from being conducted downward to the chip. On the other hand, the fumes are discharged, preventing contamination when opening later.

[0076] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A self-positioning mounting device for surface mount packaging housings, characterized in that, include: Base plate (1), positioning plate (2) and top plate (3); The base plate (1) is placed horizontally; The positioning plate (2) includes a lower positioning module (21) for positioning the open box body (100) and a positioning outer shell. The upper positioning module (22) of (101) is rotatably mounted, and both the lower positioning module (21) and the upper positioning module (22) are rotatably mounted. On the upper end surface of the base plate (1); The top plate (3) is installed above the positioning plate (2), and the top plate (3) holds the upper positioning module (22). The inner outer shell (101) is pressed against the opening at the top of the open box body (100); When the open box body (100) and the outer shell (101) are installed sequentially, the upper positioning module (22) is removed from the... The lower positioning module (21) is rotated and removed, and the open box (100) is placed on the lower positioning module (21). After being placed in the lower positioning groove (211) on the upper part, the lower positioning module (21) is reset, and the outer shell (101) is placed on the upper part. Inside the upper positioning slot (221) of the positioning module (22); The lower positioning module (21) is provided with a lower centering device for centering and positioning the open box (100). Unit (23); The upper positioning module (22) is provided with an upper centering unit (24) for centering and positioning the outer shell (101). The lower centering unit (23) cooperates with the upper centering unit (24) to make the open box (100) and the upper centering unit (24) fit together. The outer casing (101) is aligned; The lower centering unit (23) includes several lower positioning units arranged and telescopically disposed around the lower positioning slot (211). When the upper positioning module (22) and the lower positioning module (21) overlap, the lower positioning tongue (231) Extend the open box body (100) to center and position it.

2. The self-positioning mounting device for surface mount packaging housings according to claim 1, characterized in that: The lower positioning module (21) is provided with a lower pressing block (232) that corresponds one-to-one with the lower positioning tongue (231). The lower pressing block (232) presses the lower positioning tongue (231) vertically, causing the lower positioning tongue (231) to... Extend, and the lower positioning tongue (231) is provided with a lower spring (233) for driving its reset and retraction.

3. The self-positioning mounting device for surface mount packaging housings according to claim 2, characterized in that: The lower positioning tongue (231) and the lower extrusion block (232) are configured to engage via inclined extrusion, and the lower extrusion... The upper end of the block (232) protruding from the upper surface of the lower positioning module (21) is spherically shaped, and the lower extrusion block (232) has... The upper end cooperates with the rotation and extrusion of the upper positioning module (22) to cause the lower extrusion block (232) to descend.

4. The self-positioning mounting device for surface mount packaging housings according to claim 1, characterized in that: The upper centering unit (24) includes several upper positioning units arranged and telescopically disposed around the upper positioning slot (221). When the top plate (3) presses down on the outer shell (101), the upper positioning tongue (241) extends out to the outer shell. The shell (101) is centered and positioned.

5. The self-positioning mounting device for surface mount packaging housings according to claim 4, characterized in that: The upper positioning module (22) is provided with an upper pressing block (242) that corresponds one-to-one with the upper positioning tongue (241). The upper pressing block (242) presses the upper positioning tongue (241) vertically, causing the upper positioning tongue (241) to... Extend, and an upper spring (243) is provided on the upper positioning tongue (241) to drive it to reset and retract.

6. The self-positioning mounting device for surface mount packaging housings according to claim 5, characterized in that: The upper positioning tongue (241) and the upper pressing block (242) are configured to engage via inclined surface pressing, and the upper pressing block... The upper end of the block (242) protruding from the upper end face of the upper positioning module (22) is spherically shaped, and the upper pressing block (242) has... The upper end, in conjunction with the downward pressure of the top plate (3), causes the upper extrusion block (242) to descend.

7. The self-positioning mounting device for surface mount packaging housings according to claim 1, characterized in that: A ejector pin (31) is mounted on the top plate (3) facing the outer shell (101), and the ejector pin (31) is elastically extended. When the top plate (3) presses down on the upper positioning module (22), the ejector pin (31) presses against the outer shell (101).

8. The self-positioning mounting device for surface mount packaging housings according to claim 7, characterized in that: The upper end of the ejector pin (31) protrudes from the top plate (3), and the ejector pin (31) and the top plate (3) are... The center is provided with an elastic adjustment member (32) that engages with the pin, and the center of the pin (31) is hollow and has an exhaust channel (311). The bottom of the ejector pin (31) is provided with an exhaust hole (312) that communicates with the exhaust channel (311).

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