Electronic device heat dissipation device

Abstract

The present application discloses an electronic device heat dissipation device, belonging to the technical field of heat dissipation. The electronic device heat dissipation device includes: an air inlet member, a gas excitation pulsation component, and a heat conducting member; the heat conducting member has an air inlet, an air outlet, and a gas passage, both ends of the gas passage are respectively communicated with the air inlet and the air outlet, the air inlet member has an air delivery end, the air delivery end is communicated with the air inlet, the air inlet member is used for inputting cooling gas into the air inlet, so that the cooling gas flows into the gas passage and flows out from the air outlet; the gas excitation pulsation component has a transmitting end, the transmitting end faces the air inlet, and the transmitting end of the gas excitation pulsation component is used for transmitting an excitation signal, so that the excitation signal enters the gas passage, and the cooling gas in the gas passage pulsates according to the excitation signal; wherein, the heat conducting member is used for contacting with the electronic device, the heat of the electronic device is transferred to the heat conducting member, and the cooling gas in the gas passage is used for dissipating heat from the electronic device.

Description

Technical Field

[0001] This application belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation device for electronic devices. Background Art

[0002] With the development of technology, electronic devices are increasingly widely used. For example, if the electronic device is a chip, the chip has been widely used in various electronic devices. However, during the operation of electronic devices, a large amount of heat is generated, which affects the operation of the electronic devices, so heat dissipation of the electronic devices is required.

[0003] In related technologies, a heat dissipation device is usually used to dissipate heat from electronic devices, that is, the heat dissipation device is attached to or in contact with the electronic device, so that the heat of the electronic device is transferred to the heat dissipation device, and the heat dissipation device dissipates the heat in time, so as to dissipate heat from the electronic device. However, in related technologies, the heat dissipation efficiency of the heat dissipation device is low. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide a heat dissipation device for electronic devices, which can solve the problem of low heat dissipation efficiency of the heat dissipation device.

[0005] The embodiments of this application provide a heat dissipation device for electronic devices, which includes: an air inlet member, a gas excitation pulsation component, and a heat conduction member;

[0006] The heat conduction member has an air inlet, an air outlet, and a gas channel. The two ends of the gas channel are respectively communicated with the air inlet and the air outlet. The air inlet member has an air delivery end, and the air delivery end is communicated with the air inlet. The air inlet member is used to input cooling gas into the air inlet, so that the cooling gas flows into the gas channel and flows out from the air outlet;

[0007] The gas excitation pulsation component has a transmitting end, and the transmitting end faces the air inlet. The transmitting end of the gas excitation pulsation component is used to transmit an excitation signal, so that the excitation signal enters the gas channel and makes the cooling gas in the gas channel pulsate according to the excitation signal;

[0008] Wherein, the heat conduction member is used to be in contact with the electronic device, the heat of the electronic device is transferred to the heat conduction member, and the cooling gas in the gas channel is used to dissipate heat from the electronic device.

[0009] Optionally, the gas excitation pulsation component includes a function generator and an acoustic wave generator;

[0010] The function generator is electrically connected to the acoustic wave generator. The function generator is configured to send a waveform signal to the acoustic wave generator. The acoustic wave generator has the emission end, and the acoustic wave generator is configured to emit an acoustic wave signal matching the waveform signal from the emission end based on the waveform signal. The acoustic wave signal forms the excitation signal, so that the cooling gas in the gas channel pulsates according to the waveform corresponding to the acoustic wave signal.

[0011] Optionally, the gas excitation pulsation assembly further includes an oscilloscope;

[0012] The oscilloscope is electrically connected to the function generator and the acoustic wave generator respectively. The oscilloscope is configured to display the waveform signal sent by the function generator and transmit the waveform signal sent by the function generator to the acoustic wave generator.

[0013] Optionally, the electronic device heat dissipation device further includes a first ventilation pipe;

[0014] The first ventilation pipe is bent to form a first air intake portion and a second air intake portion. One end of the first air intake portion is connected to the air delivery end, one end of the second air intake portion is connected to the air inlet, and the central axis of the second air intake portion is parallel to the central axis of the gas channel;

[0015] The emission end of the gas excitation pulsation assembly faces the second air intake portion and the air inlet, so that the excitation signal emitted by the emission end excites the cooling gas flowing from the second air intake portion to the air inlet.

[0016] Optionally, the electronic device heat dissipation device further includes a second ventilation pipe;

[0017] The second ventilation pipe includes a main pipe, a first branch pipe and a second branch pipe. One end of the main pipe is connected to the air inlet, the first ends of the first branch pipe and the second branch pipe are both connected to the other end of the main pipe, the second end of the first branch pipe is connected to the air delivery end, and the second end of the second branch pipe is connected to the emission end of the gas excitation pulsation assembly.

[0018] Optionally, the electronic device heat dissipation device further includes a filter. The filter is connected between the heat conducting member and the air intake member, and both ends of the filter are communicated with the air inlet and the air delivery end respectively. The filter is configured to filter the cooling gas to flow to the air inlet.

[0019] Optionally, the electronic device heat dissipation device further includes a control valve. The control valve is connected between the heat conducting member and the air intake member, and both ends of the control valve are communicated with the air inlet and the air delivery end respectively.

[0020] Optionally, the electronic device heat dissipation device further includes a flow meter connected to the air inlet, and the flow meter is configured to detect the flow rate of the cooling gas flowing into the air inlet.

[0021] Optionally, a plurality of air-blocking ribs are provided in the gas channel, and the plurality of air-blocking ribs are spaced apart along the extending direction of the gas channel. The air-blocking ribs are configured to block the flow of the cooling gas in the gas channel to increase the heat exchange area of the gas channel.

[0022] Optionally, the electronic device heat dissipation device further includes a controller, and both the air inlet member and the gas excitation pulsation assembly are electrically connected to the controller. The controller is configured to control the air inlet member and the gas excitation pulsation assembly.

[0023] In the embodiment of the present application, since the heat conducting member has an air inlet, an air outlet, and a gas channel, and both ends of the gas channel are communicated with the air inlet and the air outlet respectively, cooling gas can be input into the gas channel through the air inlet. Thus, the cooling gas flows through the gas channel and flows out from the air outlet. After the heat conducting member is in contact with the electronic device, the heat of the electronic device is conducted to the gas channel, and then the heat in the gas channel can be taken out by the cooling gas from the air outlet. Since the air inlet member has an air delivery end which is communicated with the air inlet, cooling gas can be input into the air inlet through the air inlet member, so that the cooling gas flows into the gas channel. Thus, the flow of the cooling gas takes away the heat in the gas channel, and the cooling gas flows out from the air outlet, so that the heat is taken out from the gas channel along with the flow of the cooling gas. Since the gas excitation pulsation assembly has a transmitting end facing the air inlet, when the cooling gas flows to the air inlet, the gas excitation pulsation assembly can emit an excitation signal, and the excitation signal will enter the gas channel, so that the cooling gas in the gas channel pulsates according to the excitation signal, thereby avoiding the problem that a large thermal boundary is easily formed in the gas channel, which affects the dissipation of the heat in the gas channel. That is, in the embodiment of the present application, by providing the air inlet member and the heat conducting member, the air inlet member introduces the cooling gas into the gas channel of the heat conducting member. After the heat conducting member is in contact with the electronic device, the cooling gas can take out the heat in the gas channel, and by providing the gas excitation pulsation assembly, the cooling gas in the gas channel is excited to pulsate, thereby avoiding the problem that a large thermal boundary is formed in the gas channel, which affects the dissipation of the heat in the gas channel. That is, the heat in the gas channel can be quickly dissipated, and thus the heat dissipation efficiency of the electronic device is improved. Description of the Drawings

[0024] Figure 1 One of the schematic diagrams showing an electronic device heat dissipation device provided by an embodiment of the present application;

[0025] Figure 2 Schematic diagram II of a heat dissipation device for electronic devices provided by an embodiment of the present application;

[0026] Figure 3 Schematic diagram III of a heat dissipation device for electronic devices provided by an embodiment of the present application;

[0027] Figure 4 Schematic diagram of a heat conducting member provided by an embodiment of the present application;

[0028] Figure 5 Top view I of a heat conducting member provided by an embodiment of the present application;

[0029] Figure 6 Top view II of a heat conducting member provided by an embodiment of the present application;

[0030] Figure 7 Top view III of a heat conducting member provided by an embodiment of the present application;

[0031] Figure 8 Schematic diagram of a heat conducting member in which cooling gas is not excited to form a recirculation vortex provided by an embodiment of the present application;

[0032] Figure 9 Schematic diagram of a heat conducting member in which cooling gas is excited to form a recirculation vortex provided by an embodiment of the present application.

[0033] Reference numerals:

[0034] 001: Electronic device; 10: Air inlet member; 20: Gas excitation pulsation assembly; 201: Function generator; 202: Acoustic wave generator; 203: Oscilloscope; 30: Heat conducting member; 31: Air inlet; 32: Air outlet; 33: Gas channel; 331: Gas blocking rib; 40: First ventilation pipe; 41: First air inlet part; 42: Second air inlet part; 50: Second ventilation pipe; 51: Main air pipe; 52: First branch air pipe; 53: Second branch air pipe; 60: Filter; 70: Control valve; 80: Flowmeter; 90: Controller. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0036] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, the "in one embodiment" or "in an embodiment" that appears throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner.

[0037] Referring to Figure 1 , one of the schematic diagrams showing a heat dissipation device for an electronic device provided by an embodiment of the present application is shown; referring to Figure 2 , another schematic diagram showing a heat dissipation device for an electronic device provided by an embodiment of the present application is shown; referring to Figure 3 , yet another schematic diagram showing a heat dissipation device for an electronic device provided by an embodiment of the present application is shown; referring to Figure 4 , a schematic diagram showing a heat conducting member provided by an embodiment of the present application is shown; referring to Figure 5 , a first top view of a heat conducting member provided by an embodiment of the present application is shown; referring to Figure 6 , a second top view of a heat conducting member provided by an embodiment of the present application is shown; referring to Figure 7 , a third top view of a heat conducting member provided by an embodiment of the present application is shown. As Figures 1 to 7 shown, the heat dissipation device for the electronic device includes: an air inlet member 10, a gas excitation pulsation assembly 20, and a heat conducting member 30.

[0038] The heat conducting member 30 has an air inlet 31, an air outlet 32, and a gas channel 33. The two ends of the gas channel 33 are respectively communicated with the air inlet 31 and the air outlet 32. The air inlet member 10 has an air delivery end, and the air delivery end is communicated with the air inlet 31. The air inlet member 10 is used to input cooling gas into the air inlet 31, so that the cooling gas flows into the gas channel 33 and flows out from the air outlet 32. The gas excitation pulsation assembly 20 has a transmitting end, and the transmitting end faces the air inlet 31. The transmitting end of the gas excitation pulsation assembly 20 is used to transmit an excitation signal, so that the excitation signal enters the gas channel 33, and the cooling gas in the gas channel 33 pulsates according to the excitation signal. Wherein, the heat conducting member 30 is used to contact the electronic device 001, the heat of the electronic device 001 is transferred to the heat conducting member 30, and the cooling gas in the gas channel 33 is used to dissipate heat from the electronic device 001.

[0039] In the embodiment of the present application, since the heat conducting member 30 has an air inlet 31, an air outlet 32, and a gas channel 33, and both ends of the gas channel 33 are respectively communicated with the air inlet 31 and the air outlet 32, cooling gas can be input into the gas channel 33 through the air inlet 31. Thus, the cooling gas flows through the gas channel 33 and flows out from the air outlet 32. After the heat conducting member 30 is in contact with the electronic device 001, the heat of the electronic device 001 is conducted to the gas channel 33, and then the heat in the gas channel 33 can be taken out by the cooling gas from the air outlet 32. Since the air inlet member 10 has an air delivery end, and the air delivery end is communicated with the air inlet 31, cooling gas can be input into the air inlet 31 through the air inlet member 10, so that the cooling gas flows into the gas channel 33. Thus, the flow of the cooling gas takes away the heat in the gas channel 33, and the cooling gas flows out from the air outlet 32, so that the heat is taken out from the gas channel 33 along with the flow of the cooling gas. Since the gas excitation pulsation assembly 20 has a transmitting end, and the transmitting end faces the air inlet 31, when the cooling gas flows to the air inlet 31, the gas excitation pulsation assembly 20 can emit an excitation signal, and the excitation signal will enter the gas channel 33, so that the cooling gas in the gas channel 33 pulsates according to the excitation signal, thereby avoiding the problem that a large thermal boundary is easily formed in the gas channel 33 by the cooling gas, which affects the dissipation of the heat in the gas channel 33. That is to say, in the embodiment of the present application, by providing the air inlet member 10 and the heat conducting member 30, the air inlet member 10 introduces the cooling gas into the gas channel 33 of the heat conducting member 30. After the heat conducting member 30 is in contact with the electronic device 001, the cooling gas can take out the heat in the gas channel 33, and by providing the gas excitation pulsation assembly 20, the cooling gas in the gas channel 33 is excited and thus pulsates, avoiding the problem that a large thermal boundary is formed in the gas channel 33 by the cooling gas, which affects the dissipation of the heat in the gas channel 33. That is, the heat in the gas channel 33 can be quickly dissipated, and thus the heat dissipation efficiency of the electronic device 001 is improved.

[0040] It should be noted that in the embodiment of the present application, the electronic device 001 can be a component with a small volume but a high heat flux density. For example, the electronic device 001 is a chip, or for another example, the electronic device 001 is a radar seeker. The specific type of the electronic device 001 is not limited in the embodiment of the present application.

[0041] In addition, in the embodiment of the present application, the heat conducting member 30 can be made of a metal with a high thermal conductivity. For example, the heat conducting member 30 is made of copper, or for another example, the heat conducting member 30 is made of silver. Of course, the heat conducting member 30 can also be made of a non-metal with a high thermal conductivity. In this regard, the embodiment of the present application does not make a limitation here.

[0042] In addition, in the embodiments of the present application, the intake member 10 may be an air compressor pump. Of course, the intake member 10 may also be other devices with power and capable of guiding air. The specific type of the intake member 10 is not limited in the embodiments of the present application.

[0043] In addition, in the embodiments of the present application, as Figure 4 , Figure 5 , Figure 6 and Figure 7 shown, a plurality of air-blocking ribs 331 may be provided in the gas passage 33. The plurality of air-blocking ribs 331 are spaced apart along the extending direction of the gas passage 33. The air-blocking ribs 331 are used to block the flow of the cooling gas in the gas passage 33 to increase the heat exchange area of the gas passage 33.

[0044] When a plurality of air-blocking ribs 331 are provided in the gas passage 33 and the plurality of air-blocking ribs 331 are spaced apart along the extending direction of the gas passage 33, at this time, once the cooling gas enters the gas passage 33, the cooling gas flows along the extending direction of the gas passage 33. During the flow of the cooling gas, the air-blocking ribs 331 will block the flow of the cooling gas, causing the flow rate of the cooling gas in the gas passage 33 to decrease, so that the heat in the gas passage 33 can be better heat-exchanged with the cooling gas. In addition, due to the presence of the air-blocking ribs 331, the heat-conducting member 30 can also conduct heat to the air-blocking ribs 331. Thus, after the surface of the air-blocking ribs 331 comes into contact with the cooling gas, the air-blocking ribs 331 will also conduct heat exchange with the cooling gas, which is equivalent to the air-blocking ribs 331 increasing the heat exchange area of the gas passage 33. That is, by providing a plurality of air-blocking ribs 331 in the gas passage 33, on the one hand, the flow rate of the cooling gas in the gas passage 33 can be decreased, so that the residence time of the cooling gas in the gas passage 33 becomes longer, which is beneficial to the heat exchange between the cooling gas and the heat in the gas passage 33. On the other hand, the air-blocking ribs 331 increase the heat exchange area of the gas passage 33, which is beneficial to the heat exchange of the gas passage 33.

[0045] It should be noted that the plurality of air-blocking ribs 331 can be spaced apart according to an arrangement rule in the gas passage 33. For example, as Figure 5 shown, the arrangement rule can be: two air-blocking ribs 331 are in the same position, and then one air-blocking rib 331 is spaced apart from these two air-blocking ribs 331. Among them, the arrangement rule can be set according to actual needs, and in this regard, the embodiments of the present application do not make any limitations here.

[0046] In addition, in the embodiments of the present application, the shape of the air-blocking rib 331 can be set according to actual needs. For example, the resistor is a triangular body. For another example, the air-blocking rib 331 is a cylinder. For another example, the air-blocking rib 331 is a cube. The specific shape of the air-blocking rib 331 is not limited in the embodiments of the present application.

[0047] In addition, referring to Figure 8 , a schematic diagram showing that the cooling gas in the heat conducting member 30 is not excited to form a recirculation vortex is shown. Referring to Figure 9 , a schematic diagram showing that the cooling gas in the heat conducting member 30 is excited to form a recirculation vortex is shown. As Figure 8 shown, after the intake member 10 introduces the cooling gas into the intake port 31, the cooling gas enters the gas passage 33. At this time, the gas excitation pulsation assembly 20 does not emit an excitation signal to the intake port 31. The cooling gas forms a large recirculation vortex at the gas blocking rib 331, and the thermal boundary of the recirculation vortex is large, so that the heat in the gas passage 33 is transferred to the outside with low efficiency, affecting the heat dissipation efficiency for the electronic device 001. As Figure 9 shown, after the intake member 10 introduces the cooling gas into the intake port 31, the cooling gas enters the gas passage 33. At this time, the gas excitation pulsation assembly 20 emits an excitation signal to the intake port 31. The cooling gas pulsates in the gas passage 33 according to the excitation signal, thereby destroying the thermal boundary and the recirculation vortex, enhancing the mixing of the cold and hot fluids, and even if a recirculation vortex is formed, the recirculation vortex will be reduced, so that the heat dissipation efficiency for the electronic device 001 can be improved.

[0048] In addition, in some embodiments, as Figure 1 shown, the gas excitation pulsation assembly 20 may include a function generator 201 and a sound wave generator 202. The function generator 201 is electrically connected to the sound wave generator 202. The function generator 201 is used to send a waveform signal to the sound wave generator 202. The sound wave generator 202 has a transmitting end. The sound wave generator 202 is used to emit a sound wave signal matching the waveform signal from the transmitting end based on the waveform signal. The sound wave signal forms an excitation signal, so that the cooling gas in the gas passage 33 pulsates according to the waveform corresponding to the sound wave signal.

[0049] Since the function generator 201 is connected to the sound wave generator 202 by wire, the function generator 201 can send a waveform signal to the sound wave generator 202. After the sound wave generator 202 receives the waveform signal, the sound wave generator 202 can emit a sound wave signal matching the waveform signal from the transmitting end based on the received waveform signal. At this time, the sound wave signal forms an excitation signal. Once the sound wave signal enters the gas passage 33, the cooling gas in the gas passage 33 will pulsate along with the sound wave signal due to the action of the sound wave signal. That is, by setting the gas excitation pulsation assembly 20 to include the function generator 201 and the sound wave generator 202, it is convenient to form an excitation signal.

[0050] Among them, in the embodiments of the present application, the function generator 201 can emit signals of any waveform. For example, the function generator 201 can emit sine wave signals, square wave signals, triangular wave signals, etc. For another example, after the function generator 201 emits a sine wave signal to the sound wave generator 202, after the sound wave generator 202 receives the sine wave signal, it can emit a sound wave of a sine waveform through the transmitting end. After the sound wave of the sine waveform enters the gas passage 33, the cooling gas in the gas passage 33 pulsates along with the sine waveform sound wave.

[0051] It should be noted that in the embodiments of the present application, the gas excitation pulsation component 20 can also be other devices that can emit waveform signals. In this regard, the embodiments of the present application do not make any limitations here.

[0052] In addition, in the embodiments of the present application, the sound wave generator 202 can be a speaker.

[0053] In addition, in some embodiments, the gas excitation pulsation component 20 can also include an oscilloscope 203. The oscilloscope 203 is electrically connected to the function generator 201 and the sound wave generator 202 respectively. The oscilloscope 203 is used to display the waveform signal emitted by the function generator 201 and transmit the waveform signal emitted by the function generator 201 to the sound wave generator 202.

[0054] When the oscilloscope 203 is electrically connected to the function generator 201, at this time, after the sound wave signal emitted by the function generator 201 is transmitted to the oscilloscope 203, the oscilloscope 203 can display the waveform signal, so that the waveform signal can be intuitively seen by the user. And the oscilloscope 203 can also transmit the waveform signal to the sound wave generator 202, so that the sound wave generator 202 emits a sound wave according to the waveform signal.

[0055] In addition, in the embodiments of the present application, once the excitation signal enters the gas passage 33, the excitation signal will also cause the flow rate of the cooling gas in the gas passage 33 to change accordingly, so that the cooling gas is excited. For example, the flow rate of the cooling gas in the gas passage 33 can be as follows:

[0056] U = U0(1 + asin(2πft))

[0057] Wherein, U represents the flow rate of the cooling gas in the gas passage 33, U0 represents the flow rate of the gas transmitted from the intake part 10 to the intake port 31, a represents the amplitude of the waveform displayed by the oscilloscope 203, f represents the frequency of the waveform displayed by the oscilloscope 203, and t represents the period of the waveform displayed by the oscilloscope 203.

[0058] In addition, in some embodiments, such as Figure 2As shown, the electronic device heat dissipation device may further include a first ventilation pipe 40. The first ventilation pipe 40 is bent to form a first air intake portion 41 and a second air intake portion 42. One end of the first air intake portion 41 is connected to the air delivery end, one end of the second air intake portion 42 is connected to the air inlet 31, and the central axis of the second air intake portion 42 is parallel to the central axis of the gas passage 33. The emitting end of the gas excitation pulsation assembly 20 faces the second air intake portion 42 and also faces the air inlet 31, so that the excitation signal emitted by the emitting end can excite the cooling gas flowing from the second air intake portion 42 to the air inlet 31.

[0059] Since one end of the first air intake portion 41 is connected to the air delivery end and one end of the second air intake portion 42 is connected to the air inlet 31, the cooling gas delivered by the air intake member 10 from the air delivery end can enter the first air intake portion 41, flow into the second air intake portion 42 through the first air intake portion 41, flow from the second air intake portion 42 to the air inlet 31, and finally flow into the gas passage 33. Since the central axis of the second air intake portion 42 is parallel to the central axis of the gas passage 33, the emitting end of the gas excitation pulsation assembly 20 faces the second air intake portion 42 and also faces the air inlet 31, so that the excitation signal emitted by the emitting end of the gas excitation pulsation assembly 20 can directly affect the gas in the second air intake portion 42, causing the cooling gas in the second air intake portion 42 to pulsate, so that the cooling gas flowing to the air inlet 31 is in a pulsating state, and further causing the cooling gas to pulsate once it enters the gas passage 33. That is, by setting the central axis of the second air intake portion 42 to be parallel to the central axis of the gas passage 33, the emitting end of the gas excitation pulsation assembly 20 facing the second air intake portion 42 and also facing the air inlet 31, it is beneficial for the cooling gas in the gas passage 33 to be excited to pulsate.

[0060] It should be noted that one end of the second air intake portion 42 is hermetically connected to the air inlet 31, which can avoid the problem of gas leakage from this place.

[0061] In addition, in some embodiments, as Figure 3 shown, the electronic device heat dissipation device may further include a second ventilation pipe 50. The second ventilation pipe 50 includes a main pipe 51, a first branch pipe 52, and a second branch pipe 53. One end of the main pipe 51 is connected to the air inlet 31, the first ends of the first branch pipe 52 and the second branch pipe 53 are both connected to the other end of the main pipe 51, the second end of the first branch pipe 52 is connected to the air delivery end, and the second end of the second branch pipe 53 is connected to the emitting end of the gas excitation pulsation assembly 20.

[0062] Since one end of the main air pipe 51 is connected to the air inlet 31, the first ends of the first branch air pipe 52 and the second branch air pipe 53 are both connected to the other end of the main air pipe 51, the second end of the first branch air pipe 52 is connected to the air delivery end, and the second end of the second branch air pipe 53 is connected to the emission end of the gas excitation pulsation component 20. Therefore, the air delivery end of the air inlet component 10 can deliver the cooling gas into the first branch air pipe 52, and the cooling gas flows through the first branch air pipe 52 into the main air pipe 51, and then flows from the main air pipe 51 into the air inlet 31 and enters the gas channel 33. Moreover, the excitation signal emitted by the emission end of the gas excitation pulsation component 20 can enter the second branch air pipe 53 and enter the main air pipe 51 from the second branch air pipe 53, so that the cooling gas in the main air pipe 51 is excited, and thus the cooling gas pulsates.

[0063] In addition, in some embodiments, as Figure 1 shown, the electronic device heat dissipation device may further include a filter 60. The filter 60 is connected between the heat conducting component 30 and the air inlet component 10, and both ends of the filter 60 are respectively communicated with the air inlet 31 and the air delivery end. The filter 60 is used to filter the cooling gas to be flowed to the air inlet 31.

[0064] Since the filter 60 is connected between the heat conducting component 30 and the air inlet component 10, and both ends of the filter 60 are respectively communicated with the air inlet 31 and the air delivery end. Therefore, the cooling gas delivered by the air delivery end of the air inlet component 10 can flow into the filter 60, then flow out of the filter 60, and then flow to the air inlet 31. Once the cooling gas flows into the filter 60, the filter 60 can filter the impurities in the cooling gas to avoid the problem that the impurities enter the gas channel 33 and affect the heat exchange efficiency in the gas channel 33.

[0065] It should be noted that when the electronic device heat dissipation device includes the first air pipe 40 and the first air pipe 40 is bent to form the first air inlet part 41 and the second air inlet part 42, at this time, the filter 60 can be connected to the first air inlet part 41. Of course, the filter 60 can also be connected to the second air inlet part 42. When the electronic device heat dissipation device includes the second air pipe 50 and the second air pipe 50 includes the main air pipe 51, the first branch air pipe 52 and the second branch air pipe 53, the filter 60 can be connected to the first branch air pipe 52.

[0066] In addition, in some embodiments, as Figure 1 shown, the electronic device heat dissipation device may further include a control valve 70. The control valve 70 is connected between the heat conducting component 30 and the air inlet component 10, and both ends of the control valve 70 are respectively communicated with the air inlet 31 and the air delivery end.

[0067] Since the control valve 70 is connected between the heat conducting member 30 and the air inlet member 10, and both ends of the control valve 70 are communicated with the air inlet 31 and the gas delivery end respectively, therefore, the cooling gas delivered by the gas delivery end can flow to the air inlet 31 by opening the control valve 70, and the delivery of the cooling gas to the air inlet 31 can also be aborted by closing the control valve 70. That is to say, by providing the control valve 70, it is convenient to control the cooling gas flowing into the gas passage 33.

[0068] It should be noted that when the electronic device heat dissipation device includes the first ventilation pipe 40 and the first ventilation pipe 40 is bent to form the first air inlet portion 41 and the second air inlet portion 42, at this time, the control valve 70 can be connected to the first air inlet portion 41. Of course, the control valve 70 can also be connected to the second air inlet portion 42. When the electronic device heat dissipation device includes the second ventilation pipe 50 and the second ventilation pipe 50 includes the main air pipe 51, the first branch air pipe 52 and the second branch air pipe 53, the control valve 70 can be connected to the first branch air pipe 52.

[0069] In addition, in the embodiment of the present application, the flow rate of the cooling gas flowing into the gas passage 33 can also be controlled by controlling the opening degree of the control valve 70.

[0070] In addition, in the embodiment of the present application, the control valve 70 can be an electronic valve. Of course, it can also be a mechanical valve. In this regard, the embodiment of the present application does not make a limitation here.

[0071] In addition, in some embodiments, as Figure 1 shown, the electronic device heat dissipation device can also include a flow meter 80. The flow meter 80 is connected to the air inlet 31, and the flow meter 80 is used to detect the flow rate of the cooling gas flowing into the air inlet 31.

[0072] Since the flow meter 80 is connected to the air inlet 31, the flow rate of the cooling gas flowing into the air inlet 31 can be detected by the flow meter 80, so as to facilitate knowing the flow rate of the gas flowing into the gas passage 33, and then determining whether the flow rate is appropriate. That is to say, by providing the flow meter 80, it is convenient to detect the flow rate of the cooling gas flowing into the air inlet 31.

[0073] It should be noted that when the electronic device heat dissipation device includes the first ventilation pipe 40 and the first ventilation pipe 40 is bent to form the first air inlet portion 41 and the second air inlet portion 42, at this time, the flow meter 80 can be connected to the second air inlet portion 42. When the electronic device heat dissipation device includes the second ventilation pipe 50 and the second ventilation pipe 50 includes the main air pipe 51, the first branch air pipe 52 and the second branch air pipe 53, the flow meter 80 can be connected to the main air pipe 51.

[0074] In addition, in some embodiments, as Figure 1As shown, the heat dissipation device of the electronic device may further include a controller 90. The air inlet member 10 and the gas excitation pulsation assembly 20 are both electrically connected to the controller 90, and the controller 90 is used to control the air inlet member 10 and the gas excitation pulsation assembly 20.

[0075] Since the air inlet member 10 and the gas excitation pulsation assembly 20 are both electrically connected to the controller 90, the air inlet member 10 and the gas excitation pulsation assembly 20 can be controlled by the controller 90, so that the heat dissipation of the electronic device 001 can be automated.

[0076] Among them, when the gas excitation pulsation assembly 20 includes a function generator 201 and a sound wave generator 202, at this time, the function generator 201 and the sound wave generator 202 are both electrically connected to the controller 90. When the gas excitation pulsation assembly 20 further includes an oscilloscope 203, at this time, the oscilloscope 203 can also be electrically connected to the controller 90. In addition, in the embodiment of the present application, when the control valve 70 is an electronic valve, at this time, the control valve 70 can also be electrically connected to the controller 90. In addition, in the embodiment of the present application, the flowmeter 80 can also be electrically connected to the controller 90.

[0077] In addition, when the control valve 70, the air inlet member 10, the flowmeter 80, the function generator 201, the sound wave generator 202, and the oscilloscope 203 are all electrically connected to the controller 90, at this time, once it is necessary to transport gas in the gas passage 33, the controller 90 can control the operation of the air inlet member 10 and open the control valve 70. Thus, the gas delivery end of the air inlet member 10 delivers the cooling gas to the air inlet 31, and then the cooling gas enters the gas passage 33. At the same time, the controller 90 also controls the operation of the function generator 201, the oscilloscope 203, and the sound wave generator 202. Thus, the sound wave generator 202 emits a sound wave signal, and the oscilloscope 203 can display the waveform signal emitted by the function generator 201 and detect the waveform signal. The controller 90 can also obtain the waveform signal and determine whether the waveform signal meets the requirements. Once the waveform signal does not meet the requirements, the controller 90 controls the function generator 201 to adjust the emitted waveform signal until the waveform signal meets the requirements. In addition, when the cooling gas flows into the gas passage 33, the flowmeter 80 detects the flow value in real time and sends the flow value to the controller 90. The controller 90 determines whether the flow value reaches the preset flow value. Once the flow value does not reach the preset flow value, the controller 90 controls the power of the air inlet member 10 to increase, or controls the opening degree of the control valve 70 until the flow value reaches the preset flow value.

[0078] In the embodiment of the present application, since the heat conducting member 30 has an air inlet 31, an air outlet 32, and a gas channel 33, and the two ends of the gas channel 33 are respectively communicated with the air inlet 31 and the air outlet 32, therefore, cooling gas can be input into the gas channel 33 through the air inlet 31, so that the cooling gas flows through the gas channel 33 and flows out from the air outlet 32. Thus, after the heat conducting member 30 is in contact with the electronic device 001, after the heat of the electronic device 001 is conducted to the gas channel 33, the heat in the gas channel 33 can be carried out of the air outlet 32 by the cooling gas. Since the air inlet member 10 has an air delivery end, and the air delivery end is communicated with the air inlet 31, therefore, cooling gas can be input into the air inlet 31 through the air inlet member 10, so that the cooling gas flows into the gas channel 33. Thus, the flow of the cooling gas causes the heat in the gas channel 33 to be carried away, and the cooling gas flows out from the air outlet 32, so that the heat is carried out of the gas channel 33 along with the flow of the cooling gas. Since the gas excitation pulsation assembly 20 has a transmitting end, and the transmitting end faces the air inlet 31, therefore, when the cooling gas flows to the air inlet 31, the gas excitation pulsation assembly 20 can be caused to emit an excitation signal, and the excitation signal will enter the gas channel 33, so that the cooling gas in the gas channel 33 pulsates according to the excitation signal, thereby avoiding the problem that a large thermal boundary is easily formed in the gas channel 33 by the cooling gas, which affects the dissipation of the heat in the gas channel 33. That is to say, in the embodiment of the present application, by providing the air inlet member 10 and the heat conducting member 30, the air inlet member 10 introduces cooling gas into the gas channel 33 of the heat conducting member 30. Thus, after the heat conducting member 30 is in contact with the electronic device 001, the cooling gas can carry out the heat in the gas channel 33, and by providing the gas excitation pulsation assembly 20, the cooling gas in the gas channel 33 is excited to pulsate, thereby avoiding the problem that a large thermal boundary is formed in the gas channel 33 by the cooling gas, which affects the dissipation of the heat in the gas channel 33, that is, the heat in the gas channel 33 can be quickly dissipated, and further the heat dissipation efficiency of the electronic device 001 is improved.

[0079] It should be noted that the embodiments in this specification are all described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0080] Although the optional embodiments of the embodiments of the present application have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be interpreted to include the optional embodiments and all changes and modifications falling within the scope of the embodiments of the present application.

[0081] Finally, it should also be noted that in this text, relational terms such as first and second are only used to distinguish one entity from another, and do not necessarily require or imply any actual relationship or order between these entities. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that an article or terminal device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such article or terminal device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the article or terminal device comprising the element.

[0082] The technical solutions provided in this application have been introduced in detail above. Specific examples are used in this text to elaborate on the principles and implementation manners of this application. At the same time, for those of ordinary skill in the art, according to the principles and implementation manners of this application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to this application.

Claims

1. A heat dissipation device for an electronic device, characterized in that, The electronic device heat dissipation device includes: an air inlet member (10), a gas excitation pulsation component (20), and a heat conduction member (30); The heat conduction member (30) has an air inlet (31), an air outlet (32), and a gas channel (33). Both ends of the gas channel (33) are respectively communicated with the air inlet (31) and the air outlet (32). The air inlet member (10) has an air delivery end, and the air delivery end is communicated with the air inlet (31). The air inlet member (10) is used to input cooling gas into the air inlet (31), so that the cooling gas flows into the gas channel (33) and flows out from the air outlet (32); The gas excitation pulsation component (20) has a transmitting end, and the transmitting end faces the air inlet (31). The transmitting end of the gas excitation pulsation component (20) is used to transmit an excitation signal, so that the excitation signal enters the gas channel (33) and makes the cooling gas in the gas channel (33) pulsate according to the excitation signal; Wherein, the heat conduction member (30) is used to contact an electronic device (001). The heat of the electronic device (001) is transferred to the heat conduction member (30), and the cooling gas in the gas channel (33) is used to dissipate heat from the electronic device (001); Wherein, the electronic device heat dissipation device further includes a filter (60). The filter (60) is connected between the heat conduction member (30) and the air inlet member (10), and both ends of the filter (60) are respectively communicated with the air inlet (31) and the air delivery end. The filter (60) is used to filter the cooling gas to be flowed to the air inlet (31).

2. The heat dissipation device for an electronic device according to claim 1, wherein, The gas excitation pulsation component (20) includes a function generator (201) and an acoustic wave generator (202); The function generator (201) is electrically connected to the acoustic wave generator (202). The function generator (201) is used to send a waveform signal to the acoustic wave generator (202). The acoustic wave generator (202) has the transmitting end. The acoustic wave generator (202) is used to emit an acoustic wave signal matching the waveform signal from the transmitting end based on the waveform signal. The acoustic wave signal forms the excitation signal, so that the cooling gas in the gas channel (33) pulsates according to the waveform corresponding to the acoustic wave signal.

3. The electronic device heat dissipation device according to claim 2, wherein The gas excitation pulsation component (20) further includes an oscilloscope (203); The oscilloscope (203) is respectively electrically connected to the function generator (201) and the acoustic wave generator (202). The oscilloscope (203) is used to display the waveform signal sent by the function generator (201) and transmit the waveform signal sent by the function generator (201) to the acoustic wave generator (202).

4. The electronic device heat dissipation device according to claim 1, characterized in that, The electronic device heat dissipation device further includes a first ventilation pipe (40); The first ventilation pipe (40) is bent to form a first air inlet portion (41) and a second air inlet portion (42). One end of the first air inlet portion (41) is connected to the air delivery end, one end of the second air inlet portion (42) is connected to the air inlet (31), and the central axis of the second air inlet portion (42) is parallel to the central axis of the gas passage (33). The emitting end of the gas excitation pulsation component (20) faces the second air inlet portion (42), and the emitting end faces the air inlet (31), so that the excitation signal emitted by the emitting end excites the cooling gas flowing from the second air inlet portion (42) to the air inlet (31).

5. The heat dissipation device for an electronic device according to claim 1, characterized in that, The electronic device heat dissipation device further includes a second ventilation pipe (50). The second ventilation pipe (50) includes a main air pipe (51), a first branch air pipe (52), and a second branch air pipe (53). One end of the main air pipe (51) is connected to the air inlet (31), the first ends of the first branch air pipe (52) and the second branch air pipe (53) are both connected to the other end of the main air pipe (51), the second end of the first branch air pipe (52) is connected to the air delivery end, and the second end of the second branch air pipe (53) is connected to the emitting end of the gas excitation pulsation component (20).

6. The electronic device heat dissipation device according to claim 1, characterized in that, The electronic device heat dissipation device further includes a control valve (70). The control valve (70) is connected between the heat conducting member (30) and the air inlet member (10), and both ends of the control valve (70) are communicated with the air inlet (31) and the air delivery end respectively.

7. The heat dissipation device for an electronic device according to claim 1, wherein The electronic device heat dissipation device further includes a flow meter (80). The flow meter (80) is connected to the air inlet (31), and the flow meter (80) is used to detect the flow rate of the cooling gas flowing into the air inlet (31).

8. The electronic device heat dissipation device according to any one of claims 1-7, characterized in that, A plurality of air blocking ribs (331) are arranged in the gas passage (33). The plurality of air blocking ribs (331) are spaced apart along the extending direction of the gas passage (33). The air blocking ribs (331) are used to block the flow of the cooling gas in the gas passage (33) to increase the heat exchange area of the gas passage (33).

9. The electronic device heat dissipation device according to any one of claims 1-7, characterized in that, The electronic device heat dissipation device further includes a controller (90). The air inlet member (10) and the gas excitation pulsation component (20) are both electrically connected to the controller (90), and the controller (90) is used to control the air inlet member (10) and the gas excitation pulsation component (20).

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