Crystal bonding equipment and crystal bonding method

Abstract

The present invention discloses a die bonding device and a die bonding method, comprising: a lead frame conveyor device, on which a lead frame is conveyed along the x-direction; a loading device, located at one end of the lead frame conveyor device; a glue dispensing device, located above the lead frame conveyor device; a chip supply device, located to the side of the lead frame conveyor device; a placement device, movable between the lead frame conveyor device and the chip supply device to grab and place chips on the lead frame; and a blanking device, located at the other end of the lead frame conveyor device. The present invention has a compact structure, and the lead frame is conveyed along the x-direction on the lead frame conveyor device while the glue dispensing and placement processes are completed. The entire process maintains the lead frame in a stable state, avoids glue dispensing and placement errors, and improves the die bonding effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip bonding, and in particular relates to a bonding device and a bonding method. Background Art

[0002] The die bonding equipment uses a suction nozzle to pick up the die from the wafer feed station, then moves it to the die bonding station on the lead frame, precisely placing the die on the lead frame to bond the die. The wafer is mounted in a wafer ring, and the die removal mechanism ejects the die. The suction nozzle then picks up and moves the die. The lead frame is then transported to the placement station via a conveyor mechanism. After die bonding, the lead frame is pushed into a cassette for unloading.

[0003] Chinese patent CN111370350A discloses a die bonding machine comprising a stand, a dispensing device, a dispensing shift mechanism, a feeding mechanism, a die bonding swing arm device, a die supply platform, a die bonding shift mechanism, and a material receiving mechanism. The die bonding swing arm device comprises a rotating stand, multiple die bonding swing arms, a lifter, and a die bonding motor, each die bonding swing arm being equipped with a suction nozzle. The dispensing device comprises multiple dispensing modules. However, due to the use of the die bonding swing arm device, the entire die supply platform and die bonding swing arm device are complex in structure, the entire device occupies a large space, and the bracket to be mounted undergoes reversing and docking operations between the dispensing and mounting processes, which can easily lead to poor subsequent mounting accuracy. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0005] To this end, the present invention proposes a die bonding device and a die bonding method. The die bonding device has a compact structure and can complete the dispensing and mounting processes of the lead frame during unidirectional transportation, thereby improving the dispensing and mounting accuracy.

[0006] According to an embodiment of the present invention, the crystal bonding equipment includes: a lead frame conveying device, on which a lead frame is conveyed along the x-direction; a loading device, located at one end of the lead frame conveying device, and used to connect the lead frame to the lead frame conveying device; a glue dispensing device, located above the lead frame conveying device, and used to dispense glue on the lead frame; a chip supply device, located on a side of the lead frame conveying device, and used to convey and expand wafers and lift chips on wafers; a mounting device, which moves between the lead frame conveying device and the chip supply device to grab and mount chips on the lead frame; and an unloading device, located at the other end of the lead frame conveying device, and used to connect the lead frame out of the lead frame conveying device.

[0007] The beneficial effects of the present invention are that the present invention has a compact structure, a loading device and an unloading device are respectively arranged at both ends of the lead frame conveying device, a chip supply device is arranged on the side of the lead frame conveying device, and a dispensing device and a mounting device are arranged in the upper space. The entire crystal bonding equipment presents a rectangular structure, the space is reasonably utilized, and the compactness is good; the lead frame is transported along the x-direction on the lead frame conveying device while completing the dispensing process and the mounting process. The whole process keeps the lead frame in a stable state. Only the chip position and angle need to be adjusted, which avoids the occurrence of dispensing and mounting errors and improves the crystal bonding effect.

[0008] According to one embodiment of the present invention, the lead frame conveying device includes: a first base, which is installed on a platform; a conveying track, which is installed on the base, and the conveying track is provided with a dispensing area, a mounting area and a discharge area, the dispensing area is provided with a first adsorption component, the mounting area is provided with a second adsorption component and a heating component, and the lead frame moves out of the discharge area from the conveying track; a driving component, which is installed on the conveying track; a clamping jaw assembly, which is installed on one side of the conveying track, and the clamping jaw assembly clamps the lead frame, and the clamping jaw assembly is connected to the driving assembly for driving the clamping jaw assembly to move along the direction of the conveying track through the driving assembly.

[0009] According to one embodiment of the present invention, the loading device includes: a cabinet; a first Y-direction moving mechanism, which is installed in the cabinet; a Z-direction moving mechanism, which is installed on the first Y-direction moving mechanism, and the first Y-direction moving mechanism can drive the Z-direction moving mechanism to move along the Y direction; the loading device has two loading modes, namely a first loading mode and a second loading mode, the first loading mode is used when the lead frames are stacked in the material box, and the second loading mode is used when there is a release layer between the stacked and upper and lower adjacent lead frames; in the first loading mode, the Z-direction moving mechanism is installed on the Z-direction moving mechanism There is a clamping assembly, and the Z-direction moving mechanism drives the clamping assembly to move along the Z-direction, and the clamping assembly clamps the material box, and a pushing assembly is provided on one side of the clamping assembly, and the pushing assembly pushes the lead frame in the material box; in the second loading mode, a suction assembly is installed on the Z-direction moving mechanism, and the Z-direction moving mechanism drives the suction assembly to move along the Z-direction, and a material basket bottom plate is installed in the cabinet, and the material basket bottom plate is located below the suction assembly, and one side of the material basket bottom plate is fixedly connected to a waste box, and the other side is fixedly connected to a conveying bottom plate, and the material basket bottom plate, waste box and conveying bottom plate are detachably connected to the cabinet.

[0010] According to one embodiment of the present invention, the dispensing device includes: a dispensing bracket, which is installed on a platform; a visual component, which is installed on one side of the dispensing bracket, and the visual component identifies the working position on the lead frame; two dispensing components, two of which are arranged on the dispensing bracket, and the two dispensing components are located on both sides of the visual component. After the visual component identifies the position of the lead frame, the dispensing component dispenses glue on the lead frame, and the two dispensing components dispense glue on different working areas respectively, and the two dispensing components dispense glue at the same time.

[0011] According to one embodiment of the present invention, the chip supply device includes: a wafer loading and unloading mechanism, which is used to grab wafers from a wafer box; a wafer position adjustment mechanism, which is used to drive the wafer to adjust its position along the y-direction, x-direction and circumferential direction; a crystal expansion mechanism, which is installed on the wafer position adjustment mechanism, and is used to stretch the wafer film on the wafer to increase the distance between adjacent chips; a chip ejection device, which is located below the crystal expansion mechanism, and is used to eject the chip from the wafer film.

[0012] According to one embodiment of the present invention, the wafer loading and unloading mechanism includes: a lifting mechanism, the lifting mechanism is located on one side of the crystal expansion mechanism, the wafer box is installed on the lifting mechanism, a plurality of wafers are stacked in the wafer box, and the lifting mechanism drives the wafer box to perform lifting and lowering movements; a pick-and-place mechanism, the pick-and-place mechanism is located on one side of the crystal expansion mechanism, and the pick-and-place mechanism is used to grab the wafer and move between the wafer box and the crystal expansion mechanism.

[0013] According to one embodiment of the present invention, the wafer position adjustment mechanism includes: a second y-direction moving mechanism; an x-direction moving mechanism, the x-direction moving mechanism is installed on the second y-direction moving mechanism, and the second y-direction moving mechanism drives the x-direction moving mechanism to move along the y-direction; a circumferential rotation mechanism, the circumferential rotation mechanism is installed on the x-direction moving mechanism, and the x-direction moving mechanism drives the circumferential rotation mechanism to move along the x-direction, and a crystal expansion mechanism is installed on the circumferential rotation mechanism, and the circumferential rotation mechanism drives the crystal expansion mechanism to rotate in the circumferential direction.

[0014] According to one embodiment of the present invention, when processing wafers of different sizes, a crystal expansion mechanism of corresponding size is replaced, and the crystal expansion mechanism includes: a lifting ring, which is detachably connected to the circumferential rotation mechanism; a wafer mounting mechanism, which is arranged on the lifting ring, and a wafer is mounted in the wafer mounting mechanism, and the size of the wafer mounting mechanism is adapted to wafers of different sizes; an active unit, which is located on the side of the wafer mounting mechanism, and the active unit can approach or move away from the wafer mounting mechanism, and the active unit is used to drive the wafer mounting mechanism to approach or move away from the lifting ring; an annular protrusion is provided on the upper surface of the lifting ring, and the wafer mounting mechanism is located on the outside of the annular protrusion. When the wafer mounting mechanism approaches the lifting ring, the wafer film on the wafer is lifted by the annular protrusion.

[0015] According to one embodiment of the present invention, the chip ejection device includes: a lifting mount; a lifting assembly, the lifting assembly is arranged on the lifting mount; an ejection assembly, the ejection assembly is installed on the lifting assembly, the lifting assembly drives the ejection assembly to perform lifting movements to approach or move away from the wafer film, the ejection assembly has a cover assembly and an ejector pin arranged in the cover assembly, the cover assembly has a negative pressure to suck the wafer film downward, the ejector pin can move upward and protrude from the cover assembly to eject the chip upward.

[0016] According to one embodiment of the present invention, the placement device includes: a placement head, which is installed on a placement head moving mechanism, and the placement head moving mechanism drives the placement head to move in the xyz direction. The placement head can adsorb the chip and drive the chip to rotate to adjust the angle of the chip on the xy plane; a visual inspection component, which is located on the side of the conveying track facing the wafer.

[0017] According to one embodiment of the present invention, the visual detection component includes: a second base; a visual detector, which is installed on the second base; a reflective mirror, which is arranged opposite to the lens of the visual detector and is tilted upward; and a moving mechanism, which is installed on a conveying track and is connected to the reflective mirror to drive the reflective mirror to move toward the lens of the visual detector.

[0018] According to one embodiment of the present invention, the placement head moving mechanism includes: a composite base; an x-direction motion component, wherein the x-direction motion component is mounted on the composite base; a y-direction motion component, wherein the y-direction motion component is connected to the x-direction motion component, and the x-direction motion component drives the y-direction motion component to move along the x-direction; a z-direction motion component, wherein the placement head is mounted on the z-direction motion component, a portion of the z-direction motion component is mounted on the x-direction motion component, and another portion of the z-direction motion component is mounted on the y-direction motion component, the y-direction motion component drives the placement head to move along the y-direction, and the z-direction motion component drives the placement head to move along the z-direction; the shock absorbing device is mounted on the composite base, and the movement direction of the shock absorbing device is opposite to that of the y-direction motion component.

[0019] According to one embodiment of the present invention, the placement head includes: a second placement mounting seat, on which a rotation drive assembly is provided; a third placement mounting seat, which is slidably connected to the second placement mounting seat in a vertical direction; a placement head assembly, which is vertically arranged and rotatably mounted on the third placement mounting seat, the placement head assembly is transmission-connected to the rotation drive assembly, and the placement head assembly can move along its axial and circumferential directions; the second placement mounting seat is installed on the first placement mounting seat, and the relative position between the second placement mounting seat and the first placement mounting seat can be fine-tuned, and the first placement mounting seat is installed on the placement head moving mechanism, and the relative position between the first placement mounting seat and the placement head moving mechanism can be fine-tuned.

[0020] According to one embodiment of the present invention, the unloading device includes: a shell; a material box guiding mechanism, the material box guiding mechanism is installed in the shell, the material box guiding mechanism has a vertical channel, the vertical channel is used to guide and convey the material box equipped with a lead frame; a unloading mechanism, the unloading mechanism is located in the shell, the unloading mechanism includes a material box lifting unit, a material box receiving unit and a pushing unit, the material box lifting unit receives the material box in the vertical channel, the material box receiving unit and the pushing unit are respectively located on both sides of the material box guiding mechanism, the pushing unit is used to push the received material box into the material box receiving unit, and during the process of the material box being pushed in, the material box receiving unit continuously supports and guides the material box.

[0021] According to one embodiment of the present invention, a die bonding method is provided, which uses the above-mentioned die bonding equipment to perform die bonding, and includes the following steps: S1, a loading device continuously supplies a lead frame to a lead frame conveying device, and the lead frame conveying device conveys the lead frame toward the direction of a unloading device, while a chip supply device continuously supplies chips to a mounting device; S2, a glue dispensing device dispenses glue to the mounting position on the lead frame; S3, a mounting device grabs the chip and mounts the chip on the mounting position of the lead frame; S4, a unloading device connects the mounted lead frame.

[0022] According to one embodiment of the present invention, the specific process of the chip supply device in S1 continuously supplying chips to the mounting device is as follows: S11, the chip supply device performs a wafer expansion operation on the wafer to increase the distance between adjacent chips; S12, the chip supply device adjusts the position and angle of the wafer to align the chip with the mounting position; S13, the chip supply device lifts the chip upward to facilitate the mounting device to grab it.

[0023] According to one embodiment of the present invention, the specific process of S2 dispensing is: S21, partition the lead frame, and divide the mounting positions on the lead frame into an upper area and a lower area; S22, the visual component performs visual inspection of the mounting positions, and then two dispensing components dispense glue on the mounting positions on the lead frame; S23, the two dispensing components are the first dispensing component and the second dispensing component, the upper area is dispensed by the first dispensing component, and the lower area is dispensed by the second dispensing component, and the mounting positions in the middle row or two rows on the lead frame are dispensed jointly by the first dispensing component and the second dispensing component.

[0024] According to one embodiment of the present invention, in S3, after the mounting device grabs the chip, the visual inspection component detects the angle of the chip. If the chip angle deviates, the mounting device calibrates the chip angle and then mounts the chip on the mounting position of the lead frame.

[0025] Other features and advantages of the present invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the present invention.

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments thereof, in which:

[0028] Figure 1 It is a structural schematic diagram of the present invention;

[0029] Figure 2 2 is a schematic structural diagram of the feeding device of the present invention in the first feeding mode;

[0030] Figure 3 2 is a schematic structural diagram of the feeding device of the present invention in the second feeding mode;

[0031] Figure 4 This is a schematic diagram of the feeding state of the feeding device of the present invention in the first feeding mode. Figure 1 ;

[0032] Figure 5 This is a schematic diagram of the feeding state of the feeding device of the present invention in the first feeding mode. Figure 2 ;

[0033] Figure 6 This is a schematic diagram of the feeding state of the feeding device of the present invention in the first feeding mode. Figure 3 ;

[0034] Figure 7 This is a schematic diagram of the feeding state of the feeding device of the present invention in the first feeding mode. Figure 4 ;

[0035] Figure 8 1 is a schematic diagram of the loading state of the loading device of the present invention in the second loading mode;

[0036] Figure 9 This is a schematic diagram of the structure of the lead frame conveying device of the present invention. Figure 1 ;

[0037] Figure 10 is a top view of the lead frame conveying device of the present invention;

[0038] Figure 11 This is a schematic diagram of the structure of the lead frame conveying device of the present invention. Figure 2 ;

[0039] Figure 12 It is a structural schematic diagram of the dispensing device of the present invention;

[0040] Figure 13 It is a schematic structural diagram of the first Y-direction moving mechanism, the X-direction moving mechanism and the Z-direction moving mechanism of the present invention;

[0041] Figure 14 It is a structural schematic diagram of the first Y-direction moving mechanism of the present invention;

[0042] Figure 15 It is a structural schematic diagram of the Z-direction moving mechanism of the present invention;

[0043] Figure 16 is a schematic diagram of a chip supply device and a mounting device of the present invention;

[0044] Figure 17 is a schematic diagram of a chip supply device of the present invention;

[0045] Figure 18 is a schematic diagram of a wafer position adjustment mechanism of the present invention;

[0046] Figure 19 Schematic diagram of the crystal expansion mechanism of the present invention;

[0047] Figure 20 It is a schematic diagram of the installation position of the chip ejection device of the present invention;

[0048] Figure 21 It is a structural schematic diagram of the chip ejection device of the present invention;

[0049] Figure 22 It is a schematic diagram of the internal cross-sectional structure of the cover assembly of the present invention;

[0050] Figure 23 is a schematic diagram of a mounting device of the present invention;

[0051] Figure 24 It is a structural schematic diagram of the placement head moving mechanism of the present invention;

[0052] Figure 25 1 is a schematic diagram of the structure of the placement head of the present invention when viewed from above;

[0053] Figure 26 1 is a schematic diagram of the top view of the placement head of the present invention;

[0054] Figure 27 It is a schematic cross-sectional structural diagram of the placement head of the present invention;

[0055] Figure 28 is a schematic diagram of the position of the visual detection component of the present invention;

[0056] Figure 29 is a front view of the visual detection assembly of the present invention;

[0057] Figure 30 Schematic diagram of the three-dimensional structure of the visual detection component of the present invention;

[0058] Figure 31 Schematic diagram of the wafer film of the present invention being stretched and ejected;

[0059] Figure 32 It is a schematic diagram of the blanking device of the present invention;

[0060] Figure 33 It is an internal schematic diagram of the blanking device of the present invention;

[0061] Figure 34 It is a schematic diagram of the working principle of the blanking device of the present invention;

[0062] Figure 35 Schematic diagram of the lead frame partition in an embodiment of the present invention Figure 1 ;

[0063] Figure 36 Schematic diagram of the lead frame partition in an embodiment of the present invention Figure 2 ;

[0064] Figure 37 Schematic diagram of the lead frame partition in an embodiment of the present invention Figure 3 . DETAILED DESCRIPTION

[0065] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0066] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0067] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0068] The die bonding equipment according to the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0069] like Figure 1-Figure 37As shown, the crystal bonding equipment according to an embodiment of the present invention includes: a lead frame conveying device 50, a loading device 10, a glue dispensing device 01, a chip supply device 30, a mounting device 70 and a discharge device 20, wherein the lead frame is conveyed along the x direction on the lead frame conveying device 50; the loading device 10 is located at one end of the lead frame conveying device 50, and the loading device 10 is used to connect the lead frame to the lead frame conveying device 50; the glue dispensing device 01 is located above the lead frame conveying device 50, and is used to dispense glue on the lead frame; the chip supply device 30 is located on the side of the lead frame conveying device 50, and the chip supply device 30 is used to convey and expand the wafer and lift the chip on the wafer; the mounting device 70 moves between the lead frame conveying device 50 and the chip supply device 30 to grab and mount the chip on the lead frame; the discharge device 20 is located at the other end of the lead frame conveying device 50, and the discharge device 20 is used to connect the lead frame out of the lead frame conveying device 50.

[0070] The beneficial effect of the present invention is that the present invention has a compact structure, a loading device 10 and a unloading device 20 are respectively arranged at both ends of the lead frame conveying device 50, a chip supply device 30 is arranged on the side of the lead frame conveying device 50, and a dispensing device 01 and a mounting device 70 are arranged in the upper space. The entire crystal bonding equipment presents a rectangular structure, the space is reasonably utilized, and the compactness is good; the lead frame is transported along the x-direction on the lead frame conveying device 50 while completing the dispensing process and the mounting process. The whole process keeps the lead frame in a stable state. Only the chip position and angle need to be adjusted, which avoids the occurrence of dispensing and mounting errors and improves the crystal bonding effect.

[0071] like Figures 2 to 8 As shown, the present invention provides a loading device 10, including a cabinet, a first Y-direction moving mechanism 11 and a Z-direction moving mechanism 12, the first Y-direction moving mechanism 11 is installed in the cabinet; the Z-direction moving mechanism 12 is installed on the first Y-direction moving mechanism 11, and the first Y-direction moving mechanism 11 can drive the Z-direction moving mechanism 12 to move along the Y-direction; the loading device 10 has two loading modes, namely a first loading mode and a second loading mode. The first loading mode is used when the lead frames are stacked in the material box, and the second loading mode is used when there is a release layer between the stacked and upper and lower adjacent lead frames. The release layer is an independent individual such as release paper, film, release membrane or thin paper that facilitates separation between upper and lower objects.

[0072] In the first loading mode, a clamping assembly 13 is installed on the Z-direction moving mechanism 12, and the Z-direction moving mechanism 12 drives the clamping assembly 13 to move along the Z-direction. The clamping assembly 13 clamps the material box, and a pushing assembly 14 is provided on one side of the clamping assembly 13. The pushing assembly 14 pushes the lead frame in the material box.

[0073] In the second loading mode, a suction component 15 is installed on the Z-direction moving mechanism 12, and the Z-direction moving mechanism 12 drives the suction component 15 to move along the Z-direction. A material basket bottom plate 16 is installed in the cabinet, and the material basket bottom plate 16 is located below the suction component 15. One side of the material basket bottom plate 16 is fixedly connected to a waste box 17, and the other side is fixedly connected to a conveying bottom plate 18. The material basket bottom plate 16, the waste box 17 and the conveying bottom plate 18 are detachably connected to the cabinet.

[0074] The loading device 10 of the present invention uses a first loading mode when the lead frames are stacked in the material box, and uses a second loading mode when there is a release layer between the stacked lead frames. In the two loading modes, the first Y-axis moving mechanism 11 and the Z-axis moving mechanism 12 are shared, and there is no need to set up two sets of the first Y-axis moving mechanism 11 and the Z-axis moving mechanism 12, which reduces the occupied space, simplifies the structure, and improves the utilization rate of parts. When switching between the two modes, it is only necessary to install or disassemble the material basket bottom plate 16, the waste box 17 and the conveying bottom plate 18. The installation and replacement method is simple, and it is easy to install and maintain.

[0075] A hopper assembly 19 is provided on one side of the Y-direction moving assembly. The hopper assembly 19 includes a material box conveying mechanism 191 and a material box support plate 192. The material box support plate 192 is located above the material box conveying mechanism 191. The material box conveying mechanism 191 is installed in the cabinet. The material box conveying mechanism 191 includes two material box conveying tracks. The distance between the two material box conveying tracks can be adjusted to accommodate material boxes of different lengths or widths. The material box support plate 192 is used to place empty material boxes. When the lead frame in the material box is completely pushed out by the pushing assembly 14, the clamping assembly 13 places the empty material box on the material box support plate 192.

[0076] When the above-mentioned feeding device 10 is used for feeding, the following steps are included:

[0077] S1, judging which loading mode to use according to the state of the lead frame;

[0078] S2, if the lead frame is stacked in the material box, the first loading mode is adopted, the clamping component 13 clamps the material box, and the pushing component 14 pushes the lead frame in the material box, refer to Figures 13 to 16In the first loading mode, the material box with the lead frame is placed on the material box conveying mechanism 191, and is conveyed by the material box conveying mechanism 191 to one side of the first Y-direction moving mechanism 11. The material box is clamped by the clamping component 13, and the first Y-direction moving mechanism 11 and the Z-direction moving mechanism 12 drive the clamping component 13 to move the material box, and move the material box to one side of the pushing component 14. The pushing component 14 pushes the lead frame in the material box. When all the lead frames in the material box are pushed out, the first Y-direction moving mechanism 11 and the Z-direction moving mechanism 12 are driven by the clamping component 13 to move the material box. The moving mechanism 11 and the Z-direction moving mechanism 12 drive the gripping assembly 13 to place the empty material box on the material box support plate 192, and then the gripping assembly 13 releases the empty material box. The first Y-direction moving mechanism 11 and the Z-direction moving mechanism 12 drive the gripping assembly 13 to move to one side of the material box conveying mechanism 191 to grip the material box with the lead frame. The above loading process is repeated. When the empty material box is placed on the material box support plate 192, the empty material box placed later pushes the material box placed in front in turn, and multiple empty material boxes are arranged side by side on the material box support plate 192;

[0079] S3, if there is a release layer between the lead frames stacked on the basket bottom plate 16 and the upper and lower adjacent lead frames, the second loading mode is adopted, the suction component 15 sucks the release layer on the lead frame and transports it to the waste box 17, the suction component 15 then sucks the lead frame and transports it to the conveying bottom plate 18, and the conveying mechanism transports the lead frame for loading; refer to Figure 17 Step S3 specifically includes: S31, the suction component 15 is driven to move by the first Y-axis moving mechanism 11 and the Z-axis moving mechanism 12, the suction component 15 moves to above the basket bottom plate 16, the suction component 15 moves downward and sucks the release layer on the lead frame; S32, the suction component 15 moves upward and moves to above the waste box 17, and then places the release layer in the waste box 17; S33, the suction component 15 moves to above the basket bottom plate 16, the suction component 15 moves downward to suck the lead frame, and moves the lead frame to above the conveying bottom plate 18, and then the suction component 15 places the lead frame on the conveying bottom plate 18; S34, the pushing component 14 pushes the lead frame to load the lead frame.

[0080] The present invention integrates two functions: material box loading and workpiece stacking loading, and the two loading modes share a part of the structure, that is, they share the same first Y-direction moving mechanism 11 and Z-direction moving mechanism 12. There is no need to set up two sets of first Y-direction moving mechanisms 11 and Z-direction moving mechanisms 12, which reduces the occupied space, simplifies the structure, improves the utilization rate of parts, saves costs, and facilitates installation and maintenance.

[0081] like Figures 9 to 11As shown, the present invention provides a lead frame conveying device 50, comprising a first base 501, a conveying track 502, a drive assembly 53, and a gripper assembly 54. The conveying track 502 is mounted on the first base 501 and is provided with a dispensing area 510, a placement area 520, and a discharge area 550. The dispensing area 510 is provided with a first suction assembly 51, and the placement area 520 is provided with a second suction assembly 52 and a heating assembly. The lead frame is removed from the conveying track 502 from the discharge area 550. The drive assembly 53 is mounted on the conveying track 502. The gripper assembly 54 is mounted on one side of the conveying track 502 and grips the lead frame. The gripper assembly 54 is in transmission connection with the drive assembly 53, so that the drive assembly 53 drives the gripper assembly 54 to move along the conveying track 502. In this embodiment, the drive assembly 53 is a synchronous belt mechanism.

[0082] Compared with the prior art, the present invention has the following beneficial effects: the lead frame conveying device 50 of the present invention, when using a lead frame pre-coated with liquid glue, adsorbs the tooling through the tooling adsorption component, then dispenses glue on the tooling, and then performs chip mounting; when using a cutting tape with an adhesive layer, the cutting tape lead frame is heated by the tooling heating component to melt the adhesive layer and make it sticky, and then performs chip mounting. There is no need to replace the equipment according to the two lead frames, the compatibility is good, the time for replacing equipment is saved, and the production efficiency is improved.

[0083] The first adsorption assembly 51 includes a first tooling adsorption plate 511, which is provided with a plurality of first adsorption holes, all of which are connected to the first vacuum generator. The second adsorption assembly 52 includes a second tooling adsorption plate 521, and the heating assembly includes a first heating plate 522, a second heating plate 523, a first heating element, a second heating element, and a third heating element. The first heating plate 522 and the second heating plate 523 are arranged on the left and right sides of the second tooling adsorption plate 521, the first heating element is connected to the first heating plate 522, the second heating element is connected to the second heating plate 523, and the third heating element is connected to the second tooling adsorption plate 521. The second tooling adsorption plate 521 is provided with a plurality of second adsorption holes, all of which are connected to the second vacuum generator. When the lead frame being conveyed is a cutting tape with an adhesive layer, it is first conveyed to the first heating plate 522 for preheating so that the adhesive layer melts and has a certain viscosity, and then conveyed to the second tooling adsorption plate 521 for adsorption positioning for chip mounting, and then conveyed to the second heating plate 523 for further heating so that the chip and the adhesive layer are further bonded, and then the lead frame is conveyed to the pushing assembly 55 to push the lead frame with the chip out of the conveying track 502.

[0084] The lead frame conveying device 50 further includes a side pushing assembly 56 , which can push the lead frame in a direction close to the conveying track 502 so that the lead frame abuts against the conveying track 502 .

[0085] A base plate is mounted on the conveyor track 502, on which a support assembly is mounted. The support assembly supports the lead frame and is movably connected to the base plate. The support assembly can be adjusted along the width of the conveyor track. Specifically, the support assembly includes a support rod 5021 and a support connection block 5022. The support connection block 5022 is a magnet. An adjustment slot 5023 is provided on the base plate to cooperate with the support connection block 5022 to adjust the support connection block 5022 along the width of the conveyor track. The support connection block 5022 is slidably connected to the adjustment slot 5023, and the support rod 5021 and the support connection block 5022 are connected by magnetic attraction. When the clamp assembly conveys the lead frame, the support rod 5021 supports the lead frame. The position of the support rod 5021 can be adjusted by adjusting the position of the support connection block 5022.

[0086] The lead frame conveying device 50 further includes a pushing assembly 55 , which is located in the discharge area 550 . After chip mounting is completed, the pushing assembly 55 pushes the lead frame with the chip mounted thereon out of the conveying track 502 .

[0087] The lead frame conveying device 50 of the present invention has the following beneficial effects:

[0088] It is compatible with chip mounting using two types of lead frames: lead frames with pre-coated liquid glue and dicing tape (DAF tape) with an adhesive layer. There is no need to change equipment according to the two lead frames. It has good compatibility, saves time in changing equipment, and improves production efficiency.

[0089] The lead frame is clamped by the clamping claw assembly 54 and driven to move in the direction of the conveying track 502. The lead frame is conveyed with high precision. In the process of conveying the lead frame, the lead frame position is not easily offset due to external force, and the lead frame conveying is more stable.

[0090] A side push assembly 56 is provided to push the lead frame sideways when the lead frame enters the conveying track 502 so that the lead frame abuts against the side of the conveying track 502, making it easier for the clamping jaw assembly 54 to clamp the lead frame, effectively preventing the clamping jaw assembly 54 from clamping empty space, and enabling the lead frame to enter the track in the correct position to prevent the lead frame from tilting.

[0091] like Figures 12 to 15As shown, a dispensing device 01 according to an embodiment of the present invention includes a dispensing bracket 1, a visual component 2 and two dispensing components 3. The visual component 2 is installed on one side of the dispensing bracket 1, and the visual component 2 identifies the working position on the lead frame; the two dispensing components 3 are arranged on the dispensing bracket 1, and the two dispensing components 3 are located on both sides of the visual component 2. After the visual component 2 identifies the position of the lead frame, the dispensing component 3 dispenses glue on the lead frame, and the two dispensing components 3 share one visual component 2.

[0092] The dispensing device 01 of the present invention has two dispensing components 3 sharing one visual component 2, and the visual component 2 alternately performs visual inspection on the working areas of the target positions of the two dispensing components 3, effectively reducing the time the visual inspection component waits for the dispensing component 3 to dispense glue, thereby improving the utilization rate of the visual component 2. The two dispensing components 3 can dispense glue at the same time, thereby improving the dispensing efficiency. Moreover, the two dispensing components 3 sharing one visual component 2 can save costs and shorten the dispensing cycle.

[0093] According to an embodiment of the present invention, the dispensing assembly 3 includes: a dispensing mounting frame 31, a Y-direction moving mechanism 32, a Z-direction moving mechanism 33 and an X-direction moving mechanism 34, wherein the Y-direction moving mechanism 32 is mounted on the dispensing mounting frame 31; the Z-direction moving mechanism 33 is mounted on the dispensing mounting frame 31; the X-direction moving mechanism 34 is connected to the Y-direction moving mechanism 32 to drive the X-direction moving mechanism 34 to move along the Y direction, the X-direction moving mechanism 34 is connected to the Z-direction moving mechanism 33 to drive the X-direction moving mechanism 34 to move along the Z direction, and the X-direction moving mechanism 34 can move along the Y direction relative to the Z-direction moving mechanism 33, and a dispensing mechanism 37 is mounted on the X-direction moving mechanism 34.

[0094] In this embodiment, the dispensing mechanism 37 is installed on the X-axis moving mechanism 34. The X-axis moving mechanism 34 can drive the dispensing mechanism 37 to move along the X-axis. The X-axis moving mechanism 34 as a whole can move along the Y-axis with the Y-axis moving mechanism 32, and the X-axis moving mechanism 34 can move along the Z-axis. Therefore, the dispensing mechanism 37 can realize movement in the X, Y and Z directions, and the Z-axis moving mechanism 33 is installed on the dispensing mounting frame 31. When the dispensing mechanism 37 moves, the entire Y-axis moving mechanism 32 and the Z-axis moving mechanism 33 will not move with the dispensing mechanism 37. Compared with the existing three-axis dispensing mechanism 37, two of the three motion mechanisms of X, Y and Z need to move with the dispensing mechanism 37 to realize movement in three directions. In this embodiment, when the dispensing mechanism 37 moves, only the X-axis moving mechanism 34 needs to move with the dispensing mechanism 37, and the entire Y-axis moving mechanism 32 and the Z-axis moving mechanism 33 will not move with the dispensing mechanism 37, which effectively reduces the weight of the mechanism during movement and improves the movement speed and accuracy.

[0095] According to one embodiment of the present invention, the Y-direction moving mechanism 32 includes a Y-direction bracket 321 fixedly mounted on the dispensing mounting frame 31, and a Y-direction driving member 322 and a Y-direction slide rail assembly 323 are installed on the Y-direction bracket 321. The Y-direction driving member 322 is fixedly mounted on the Y-direction bracket 321, and a Y-direction motion plate is installed at the power output end of the Y-direction driving member 322. The Y-direction motion plate is connected to the slider in the Y-direction slide rail assembly 323 to move along the Y direction, and the X-direction motion mechanism is installed on the Y-direction motion plate.

[0096] According to one embodiment of the present invention, the Z-direction moving mechanism 33 includes a Z-direction mounting plate 331, a Z-direction driving member 332 and a Z-direction slide rail assembly 333. The Z-direction mounting plate 331 is fixedly mounted on one side of the dispensing mounting frame 31. The Z-direction driving member 332 is mounted on the Z-direction mounting plate 331. The power output end of the Z-direction driving member 332 is installed with a Z-direction motion plate 336, and the Z-direction motion plate 336 is connected to the Z-direction slide rail assembly 333.

[0097] According to one embodiment of the present invention, the X-direction moving mechanism 34 and the Z-direction moving mechanism 33 are connected through a Y-direction connecting assembly, and the Y-direction connecting assembly includes a Y-direction guide 35, which is installed on the Z-direction moving mechanism 33, and the X-direction moving mechanism 34 is slidably connected to the Y-direction guide 35.

[0098] Specifically, the X-axis moving mechanism 34 is connected to the Y-axis guide 35 via two rolling members 36. The two rolling members 36 are mounted on the X-axis moving mechanism 34 and are located on the upper and lower sides of the Y-axis guide 35, respectively. The two rolling members 36 roll along the Y-axis guide 35 in the Y direction. In this embodiment, the Z-axis driving member 332 drives the Z-axis motion plate 336 to slide up and down along the Z-axis slide rail assembly 333. The Y-axis guide 35 is fixedly connected to the Z-axis motion plate 336. Therefore, the Z-axis motion plate 336 drives the Y-axis guide 35 to move up and down. The Y-axis guide 35 is located between the upper and lower positions of the two rolling members 36. The up and down movement of the Y-axis guide 35 drives the two rolling members 36 to move up and down. The two rolling members 36 are connected to the X-axis moving mechanism 34, and thus the two rolling members 36 drive the X-axis moving mechanism 34 to move up and down.

[0099] In this embodiment, the X-direction moving mechanism 34 and the Z-direction moving mechanism 33 are connected by a Y-direction connecting assembly, so that the Z-direction moving mechanism 33 can drive the X-direction moving mechanism 34 along the Z-direction, and the X-direction moving mechanism 34 is slidably connected to the Y-direction guide 35 through two rolling members 36. That is, the two rolling members 36 can roll relative to the Y-direction guide 35 along the Y-direction, and the two rolling members 36 are respectively located on the upper and lower sides of the Y-direction guide 35. During assembly, it is only necessary to pass the Y-direction guide 35 through the position between the two rolling members 36. The installation and disassembly methods are simple, and the equipment maintenance is convenient. The X-direction moving mechanism 34 can move relative to the Z-direction moving mechanism 33 along the Y-direction. Therefore, when the dispensing mechanism 37 moves, the Z-direction moving mechanism 33 and the Y-direction moving mechanism 32 as a whole do not need to move with the dispensing mechanism 37, which effectively reduces the weight of the mechanism during movement and improves the movement speed and accuracy.

[0100] Furthermore, an elastic member 334 is provided on the Z-direction mounting plate 331. The elastic member 334 is provided at the left and right ends of the Z-direction mounting plate 331. The elastic member 334 is provided along the Z-direction. A spring mover 335 is installed on the elastic member 334. The elastic member 334 provides elastic force to the spring mover 335. The spring mover 335 is connected to the Z-direction motion plate 336.

[0101] In this embodiment, the elastic member 334 is a constant force spring. The power is installed on the constant force spring and moves up and down with the compression and extension of the constant force spring. The constant force spring provides an upward support force to the spring mover 335 and the Z-direction motion plate 336. When the equipment suddenly loses power, the two constant force springs support the Z-direction mounting plate 331 to prevent the Z-direction motion plate 336 and other components installed thereon from falling directly, effectively preventing the Z-direction motion plate 336 and other components installed thereon from falling and being damaged. In addition, the supporting force of the two constant force springs on the Z-direction motion plate 336 balances the load of the Z-direction motion plate 336 on the Z-direction drive component, making the operation of the Z-direction drive component more stable.

[0102] The beneficial effects of the dispensing device 01 of the present invention are:

[0103] By sharing one visual component 2 with two dispensing components 3, the detection speed of the visual component 2 is greater than the dispensing speed. The visual detection component can alternately perform visual inspection on the working areas at the target positions of the two dispensing components 3. The two dispensing components 3 can dispense glue at the same time, thereby improving the dispensing efficiency.

[0104] By sharing one visual component 2 with two dispensing components 3, the number of visual components 2 to be set up is reduced compared to the existing situation where one dispensing component 3 is equipped with one visual detection, which effectively reduces the cost, reduces the occupied space, reduces the assembly difficulty of the dispensing device 01, and improves the installation efficiency.

[0105] Through the setting of the Y-direction connecting component, the Z-direction moving mechanism 33 can drive the X-direction moving mechanism 34 to move along the Z-direction, and the X-direction moving mechanism 34 can move along the Y-direction relative to the Z-direction moving mechanism 33. When the dispensing mechanism 37 moves along the Y-direction, the Z-direction moving mechanism 33 does not move with the dispensing mechanism 37, thereby reducing the weight of the movement and improving the movement speed and accuracy.

[0106] like Figures 16 to 22 As shown, the chip supply device 30 according to an embodiment of the present invention includes: a platform 40, a wafer position adjustment mechanism, a crystal expansion mechanism 48, a chip ejection device 47 and a wafer loading and unloading mechanism. The wafer position adjustment mechanism is arranged on the platform 40, and the wafer position adjustment mechanism is used to drive the wafer to adjust its position along the y-direction, x-direction and circumferential direction; the crystal expansion mechanism 48 is installed on the wafer position adjustment mechanism, and the crystal expansion mechanism 48 is used to stretch the wafer film on the wafer to expand the distance between adjacent chips; the chip ejection device 47 is installed on the platform 40, and the chip ejection device 47 is located below the crystal expansion mechanism 48, and the chip ejection device 47 is used to eject the chip from the wafer film; the wafer loading and unloading mechanism is installed on the platform 40, and the wafer loading and unloading mechanism is used to grab the wafer with the chip from the wafer box 401 to the crystal expansion mechanism 48, or grab the wafer without the chip from the crystal expansion mechanism 48 to the wafer box 401.

[0107] That is to say, the wafer loading and unloading mechanism mainly supplies and unloads the entire wafer, takes the wafer with the chip out of the wafer box 401, and returns the wafer to the wafer box 401 after the chip on the wafer is mounted. This process is repeated until all the wafers in the wafer box 401 are mounted. After replacing the new wafer box 401, the cycle can be realized. Wafers are placed on the crystal expansion mechanism 48. The crystal expansion mechanism 48 expands the chip spacing on the wafer film by stretching the wafer film, which makes it easier for the chip ejection device 47 to lift the chip. The wafer position adjustment mechanism is mainly used to adjust the position of the crystal expansion mechanism 48 and the wafer on the crystal expansion mechanism 48, so as to facilitate the alignment of the chip with the chip ejection device 47, and at the same time facilitate the alignment of the chip on the wafer with the mounting position of the chip on the lead frame, thereby facilitating the chip ejection device 47 to eject the chip.

[0108] The wafer position adjustment mechanism includes: a second y-direction moving mechanism 44, an x-direction moving mechanism 45 and a circumferential rotation mechanism 46. The second y-direction moving mechanism 44 is installed on the platform 40; the x-direction moving mechanism 45 is installed on the second y-direction moving mechanism 44, and the second y-direction moving mechanism 44 drives the x-direction moving mechanism 45 to move along the y-direction; the circumferential rotation mechanism 46 is installed on the x-direction moving mechanism 45, and the x-direction moving mechanism 45 drives the circumferential rotation mechanism 46 to move along the x-direction, and a crystal expansion mechanism 48 is installed on the circumferential rotation mechanism 46, and the circumferential rotation mechanism 46 drives the crystal expansion mechanism 48 to rotate in the circumferential direction.

[0109] In other words, the second y-direction moving mechanism 44 and the x-direction moving mechanism 45 in the wafer position adjustment mechanism are mainly used to adjust the position of the chip on the horizontal plane. When a chip above the chip ejection device 47 is grabbed and mounted, the other chip needs to be moved to the top of the chip ejection device 47 through the joint action of the second y-direction moving mechanism 44 and the x-direction moving mechanism 45, and the circumferential rotation mechanism 46 is used to control the rotation angle of the chip. The chip is usually square, and the chip and the lead frame need to maintain a corresponding angle to complete the mounting. The angle of the chip can be adjusted through the circumferential rotation mechanism 46.

[0110] The crystal expansion mechanism 48 is installed on the circumferential rotation mechanism 46. The crystal expansion mechanism 48 includes: a lifting ring 482, a wafer mounting mechanism and an active unit 489. The lifting ring 482 is detachably connected to the circumferential rotation mechanism 46; the wafer mounting mechanism is arranged on the lifting ring 482, and a wafer is mounted in the wafer mounting mechanism. The size of the wafer mounting mechanism is adapted to wafers of different sizes. When processing wafers of different sizes, the wafer mounting mechanism of the corresponding size is replaced; the active unit 489 is located on the side of the wafer mounting mechanism. The active unit 489 can approach or move away from the wafer mounting mechanism. The active unit 489 is used to drive the wafer mounting mechanism to approach or move away from the lifting ring 482. The active unit 489 and the wafer mounting mechanism are on the same horizontal plane. The active unit 489 can approach or move away from the wafer mounting mechanism along the direction of the center of the circle pointing to the wafer mounting mechanism. In this embodiment, the movement direction of the active unit 489 is the y direction.

[0111] In other words, the crystal expansion mechanism 48 is detachably arranged on the circumferential rotation mechanism 46, and the size of the wafer mounting mechanism on the crystal expansion mechanism 48 corresponds to the size of the wafer. When the size of the processed wafer changes, the corresponding lifting ring 482 and the wafer mounting mechanism can be directly replaced. The active unit 489 can disconnect the transmission relationship with the wafer mounting mechanism, thereby facilitating the replacement of the lifting ring 482 and the wafer mounting mechanism. Since the active unit 489 does not need to be replaced, the active unit 489 that provides power does not need to be replaced and rewired. Since the electrical components have not been replaced, there is no need to reset the electrical components and compensate for errors. The wafer mounting mechanism can be put into use immediately after replacement.

[0112] The chip ejection device 47 includes: a lifting mount 471, a lifting assembly 472 and an ejection assembly 473. The lifting mount 471 is installed on the platform 40. There is a wafer film above the platform 40, and a number of chips are placed on the wafer film; the lifting assembly 472 is arranged on the lifting mount 471; the ejection assembly 473 is installed on the lifting assembly 472, and the lifting assembly 472 drives the ejection assembly 473 to move up and down to approach or move away from the wafer film. The ejection assembly 473 has a cover assembly 47314 and an ejector pin 47313 arranged in the cover assembly 47314. There is negative pressure in the cover assembly 47314 to suck the wafer film downward. The ejector pin 47313 can move upward and protrude from the cover assembly 47314 to eject the chip upward.

[0113] The wafer loading and unloading mechanism includes: a lifting mechanism 41, a wafer box 401 and a pick-and-place mechanism 42. The lifting mechanism 41 is installed on the platform 40 and is located on one side of the crystal expansion mechanism 48; the wafer box 401 is installed on the lifting mechanism 41, and multiple wafers are stacked in the wafer box 401. The lifting mechanism 41 drives the wafer box 401 to perform lifting and lowering movements; the pick-and-place mechanism 42 is installed on the platform 40 and is located on one side of the crystal expansion mechanism 48. The pick-and-place mechanism 42 is used to grab the wafers and move between the wafer box 401 and the crystal expansion mechanism 48.

[0114] That is, the lifting mechanism 41 can drive the wafer box 401 to move up and down. After the first wafer is taken away by the pick-and-place mechanism 42 and processed, the pick-and-place mechanism 42 puts the first wafer back into the wafer box 401, and then the lifting mechanism 41 drives the wafer box 401 to rise, so that the pick-and-place mechanism 42 can take away the second wafer, and this process repeats until all wafers in the wafer box 401 are processed.

[0115] like Figures 28 to 30 As shown, the visual inspection component 58 includes: a second base 521, a visual detector 522, a reflective mirror 523 and a first moving mechanism 524, the second base 521 is arranged on the conveying track 502, and the lead frame is conveyed on the conveying track 502; the visual detector 522 is installed on the second base 521; the reflective mirror 523 is arranged opposite to the lens of the visual detector 522, and the reflective mirror 523 is arranged to be tilted upward; the first moving mechanism 524 is installed on the conveying track 502, and the first moving mechanism 524 is connected to the reflective mirror 523 to drive the reflective mirror 523 to move toward the lens of the visual detector 522, wherein the visual detector 522 is a visual camera.

[0116] The image of the chip sucked by the chip suction nozzle 722 is reflected by the reflecting mirror 523, and the visual detector 522 captures the image in the reflecting mirror 523 for visual inspection to detect whether the position and angle of the chip sucked by the suction nozzle 722 are qualified, thereby improving the position accuracy of the chip mounted on the lead frame, and the reflecting mirror 523 is driven by the first moving mechanism 524 to move close to or away from the visual detector 522, and the position of the reflecting mirror 523 is adjusted according to the accuracy requirements of different products. The adjustment method is simple and reliable, and there is no need to move the position of the visual detector 522, so the detection accuracy of the visual detector 522 will not be affected.

[0117] The first moving mechanism 524 includes a mounting base 525, a guide rail 526, and a locking member 527. The guide rail 526 is mounted on the mounting base 525, and a slider is connected to the guide rail 526. The reflective mirror 523 is mounted on the slider. The locking member 527 is connected to the mounting base 525 and is connected to or in contact with the slider to lock the slider in position. The mounting base 525 is provided with two photoelectric switches 5218 arranged along the guide rail 526. A light shield is fixedly connected to the slider to cooperate with the photoelectric switches 5218. The slider includes a light source mounting plate 528, which is connected to the guide rail 526 to guide the movement of the light source mounting plate 528. The reflective mirror 523 is mounted on the light source mounting plate 528. A support member 529 is provided below the light source mounting plate 528 to support the light source mounting plate 528. The support member 529 is fixedly connected to the mounting base 525.

[0118] The locking member 527 includes a bolt 5210, a nut 5211, a locking block 5212, and a limiting block 5213. The bolt 5210 is arranged parallel to the guide rail 526 and is threadedly connected to the mounting seat 525. The nut 5211 is disposed at one end of the bolt 5210. The limiting block 5213 is fixedly connected to the sliding member. The locking block 5212 is sleeved on the bolt 5210 and slidably engages with the bolt 5210 to allow the locking block 5212 to slide along the bolt 5210. The locking block 5212 can abut against the limiting block 5213 to limit the movement of the limiting block 5213 and the sliding member. A waist-shaped hole is provided on the end face of the locking block 5212 away from the nut 5211. The waist-shaped hole passes through the end face of the locking block 5212 near the nut 5211. The locking member 527 includes a first locking portion 5215 and a second locking portion 5216, which are fixedly connected or integrally formed. The first locking portion 5215 is cylindrical in shape, with waist-shaped holes provided on both the first and second locking portions 5215, 5216. The diameter of the first locking portion 5215 is greater than the width of the second locking portion 5216. The limiting block 5213 is provided with a groove 5217, and the locking block 5212 slidably engages with the groove 5217.

[0119] The second base 521 is provided with a lens clamping block 5220. This block has a central hole for the camera lens to pass through, and a notch at one end that connects to the central hole. A screw is provided on the block for adjusting the width of the notch. The lens clamping block 5220 has a strip-shaped hole, and a screw is mounted on the second base 521 to secure the lens alarm block. The screw can move within the strip-shaped hole to adjust the position of the lens clamping block 5220.

[0120] In order to facilitate the shooting in S4, a mounting plate 59 is further provided on the conveying track 502. Two light sources 591 are provided on the mounting plate, and the irradiation position of the light source 591 is adjustable to ensure that it can irradiate the chip to ensure the shooting effect.

[0121] A visual inspection component 58 is set on one side of the conveying track 502 to perform visual inspection when the chip is mounted, so that the chip mounting accuracy is higher. By setting a visual detector 581 and a position-adjustable reflective mirror 582, the distance between the reflector and the visual detector 581 can be adjusted according to the accuracy requirements of different products. There is no need to adjust the position of the visual detector 581. It is easy to use and the adjustment method is simple and reliable. The visual detector 581 and the reflective mirror 582 are both set on the side of the conveying track 502, which can save space, facilitate installation, and avoid interference between the visual detector 581 and other components.

[0122] like Figure 23-Figure 27 As shown, the chip mounting mechanism according to an embodiment of the present invention includes: a mounting head moving mechanism 73 and a mounting head 71. The mounting head moving mechanism 73 is provided with a shock absorbing device 77. The shock absorbing device 77 can reciprocate along the y direction to offset the vibration generated when the mounting head moving mechanism 73 is working; the mounting head 71 is installed on the mounting head moving mechanism 73. The mounting head moving mechanism 73 drives the mounting head 71 to move in the xyz direction. The mounting head 71 can adsorb the chip and drive the chip to rotate to adjust the angle of the chip on the xy plane.

[0123] The present invention utilizes the placement head 71 to absorb the chip, and then the placement head 71 drives the chip to rotate so that the chip is aligned with the lead frame, thereby avoiding placement deviation. The placement head moving mechanism 73 controls the placement head 71 to perform reciprocating placement movement, and the shock absorbing device 77 offsets the vibration generated by the movement, thereby increasing the service life and avoiding the adverse effects of vibration on the placement process, thereby improving the placement accuracy and placement effect.

[0124] According to an embodiment of the present invention, the placement head moving mechanism 73 includes: a composite base 78, an x-direction motion component 74, a y-direction motion component 75, a z-direction motion component 76 and a shock absorbing device 77, wherein the x-direction motion component 74 is mounted on the composite base 78; the y-direction motion component 75 is connected to the x-direction motion component 74, and the x-direction motion component 74 drives the y-direction motion component 75 to move in the x-direction; the z-direction motion component 76 is mounted on the placement head, a part of the z-direction motion component 76 is mounted on the x-direction motion component 74, and the other part of the z-direction motion component 76 is mounted on the y-direction motion component 75, the y-direction motion component 75 drives the placement head to move in the y-direction, and the z-direction motion component 76 drives the placement head to move in the z-direction; the shock absorbing device 77 is mounted on the composite base 78, and the movement direction of the shock absorbing device 77 is opposite to that of the y-direction motion component 75.

[0125] That is, the z-motion assembly 76 in this embodiment is simultaneously mounted on the x-motion assembly 74 and the y-motion assembly 75. The y-motion assembly 75 and the z-motion assembly 76 simultaneously drive the placement head, achieving a decoupling function. Furthermore, in this embodiment, the y-motion assembly 75 needs to grab the chip from the waiting area and place it on the lead frame, requiring a longer y-directional movement distance. The x-motion assembly 74 is used to fine-tune the chip's x-directional placement position, resulting in a shorter x-directional movement distance. Furthermore, the z-motion is unlikely to cause chip displacement in the xy plane. Therefore, the damping device 77 moves in the opposite direction to the y-motion assembly 75, primarily to offset vibrations generated by the y-motion assembly 75.

[0126] The placement head moving mechanism 73 has a simple and compact structure. The x-axis motion component 74, the y-axis motion component 75 and the z-axis motion component 76 work together to drive the placement head to move in the xyz three-dimensional directions, so that the chip can be placed in the three-dimensional space with automatic and precise movement. By setting a shock-absorbing device 77 and designing the movement direction of the shock-absorbing device 77 to be opposite to the movement direction of the y-axis motion component 75, the shock-absorbing device 77 can offset the vibration, thereby improving the stability of the chip conveying process and the placement process.

[0127] According to an embodiment of the present invention, the placement head 71 includes: a second placement mounting seat 712, a third placement mounting seat 715 and a placement head assembly, and a rotation drive assembly is provided on the second placement mounting seat 712; the third placement mounting seat 715 is connected to the second placement mounting seat 712 in a sliding manner along the vertical direction; the placement head assembly is vertically arranged, and the placement head assembly is rotatably mounted on the third placement mounting seat 715. The placement head assembly is transmission-connected to the rotation drive assembly, and the placement head assembly can move along its axial and circumferential directions.

[0128] That is to say, through the sliding connection relationship between the third mounting seat 715 and the second mounting seat 712 in the vertical direction, the mounting head assembly on the third mounting seat 715 can perform linear motion in the vertical direction, which can avoid hard contact during mounting and at the same time drive the chip to move up and down slightly to achieve precise control of the mounting pressure. On the other hand, the rotation drive assembly is used to drive the mounting head assembly to rotate, and the mounting head assembly drives the chip to rotate, ensuring that the chip can be aligned with the lead frame before mounting, thereby improving the mounting accuracy and mounting effect.

[0129] According to one embodiment of the present invention, the second mounting seat 712 is installed on the first mounting seat 711, and the relative position between the second mounting seat 712 and the first mounting seat 711 can be fine-tuned. The first mounting seat 711 is installed on the z-axis bracket 761 of the mounting head moving mechanism 73, and the relative position between the first mounting seat 711 and the mounting head moving mechanism 73 can be fine-tuned.

[0130] According to one embodiment of the present invention, the placement head assembly includes: a rotating shaft 720, a nozzle rod 721, a nozzle 722 and a micro joint 723. The rotating shaft 720 is rotatably arranged in the third placement mounting seat 715, and the rotating shaft 720 is a hollow part; one end of the nozzle rod 721 is connected to one end of the rotating shaft 720; the nozzle 722 is installed at the other end of the nozzle rod 721; and the micro joint 723 is installed at the other end of the rotating shaft 720.

[0131] In other words, one end of the micro joint 723 is connected to a negative pressure device, and the rotating shaft 720, the nozzle rod 721 and the nozzle 722 are all hollow structures. Negative pressure is connected through the micro joint 723, so that the nozzle 722 can adsorb the chip.

[0132] Furthermore, the rotation drive assembly includes: a servo motor 713 and a synchronous belt mechanism 714, the servo motor 713 is mounted on the second mounting seat 712; one end of the synchronous belt mechanism 714 is connected to the output end of the servo motor 713, and the other end of the synchronous belt mechanism 714 is connected to the rotating shaft 720.

[0133] Furthermore, an angular contact ball bearing 726 is disposed between the rotating shaft 720 and the third mounting base 715. This angular contact ball bearing 726 can withstand both radial and axial loads. Furthermore, the position of the servo motor 713 on the second mounting base 712 can be adjusted, thereby tensioning the synchronous belt mechanism 714.

[0134] That is, the rotating shaft 720 is rotationally connected to the third mounting seat 715 , and the servo motor 713 drives the rotating shaft 720 to rotate through the synchronous belt mechanism 714 , thereby achieving the purpose of adjusting the chip angle.

[0135] According to one embodiment of the present invention, a resistance-free cylinder 719 is installed on the second mounting seat 712, and the output end of the resistance-free cylinder 719 is connected to the third mounting seat 715. The resistance-free cylinder 719 drives the third mounting seat 715 to move in the vertical direction.

[0136] Among them, in this embodiment, the third mounting seat 715 can be fine-tuned in the vertical direction under the drive of the resistance-free cylinder 719, so that it can press down to provide stable mounting pressure. The range of movement of the third mounting seat 715 in the vertical direction is small and will not affect the transmission of the synchronous belt mechanism 714.

[0137] On this basis, the lower end of the third mounting base 715 is provided with a receiving cavity, within which is disposed a constant force spring 718. The upper end of the constant force spring 718 abuts against the third mounting base 715, and the lower end of the constant force spring 718 is mounted on the second mounting base 712. The constant force spring 718 effectively supports the third mounting base 715, preventing it from falling and causing collisions in the event of a power outage. A limit plate 727 is also provided on the second mounting base 712 to limit the lower limit of the movement of the third mounting base 715.

[0138] According to one embodiment of the present invention, a voice coil motor stator 716 is mounted on the second mounting base 712, a voice coil motor mover 717 is mounted on the third mounting base 715, and a cooling cover 725 is mounted above the voice coil motor stator 716. The voice coil motor stator 716 and the voice coil motor mover 717 cooperate to form a voice coil motor. A brass sheet is provided between the voice coil motor stator 716 and the cooling cover 725. The cooling cover 725 has an air inlet for gas to enter the voice coil motor.

[0139] The gas enters the voice coil motor stator 716 and the voice coil motor mover 717 through the cooling cover 725 to directly cool the voice coil motor. The voice coil motor is used to drive the third mounting seat 715 to move downward. In this application, the stroke of the voice coil motor is 1 mm, which can accurately control the chip during mounting and avoid hard contact between the chip and the lead frame, which may cause product damage.

[0140] According to one embodiment of the present invention, the third mounting seat 715 is slidably connected to the second mounting seat 712 via a roller guide rail 724. An oil baffle 728 is installed below the second mounting seat 712 and is located directly below the roller guide rail 724. The oil baffle 728 can prevent lubricating oil from dripping from the roller guide rail 724, thereby ensuring mounting quality.

[0141] During operation, the suction nozzle 722 first absorbs the chip, and the servo motor 713 starts working according to the position of the lead frame, adjusting the rotation angle of the chip to align the chip with the lead frame. Then the placement head moving mechanism 73 moves the chip to 1mm above the lead frame, and the voice coil motor drives the chip to move down 1mm and complete the bonding with the lead frame. Then the resistance-free cylinder 719 presses down to provide a stable bonding pressure, and finally completes the bonding.

[0142] like Figures 24 to 32 As shown, the mounted lead frame is placed in the material box for unloading. According to an embodiment of the present invention, the unloading device 20 includes: a shell, a material box guiding mechanism 21 and a unloading mechanism 22. The material box guiding mechanism 21 is installed on a base 221 in the shell. The material box guiding mechanism 21 has a vertical channel, and the vertical channel is used to guide and transport the material box; the unloading mechanism 22 is located in the shell, and the unloading mechanism 22 includes a material box lifting unit 222, a material box receiving unit 224 and a pushing unit 223. The material box lifting unit 222 receives the material box in the vertical channel, the material box receiving unit 224 and the pushing unit 223 are respectively located on both sides of the material box guiding mechanism 21, and the pushing unit 223 is used to push the received material box into the material box receiving unit 224. During the process of the material box being pushed in, the material box receiving unit 224 continuously supports and guides the material box.

[0143] The structure of the present invention is reliable and compact. The vertically falling material boxes are guided by the vertical channel in the material box guiding mechanism 21. During vertical transportation, the falling position of the material box remains unchanged. At the same time, the material box is guided by the vertical channel on all sides during the top-down transportation process, so that the material box maintains a stable state during the transportation process; the pushing unit 223 pushes the material boxes in the vertical channel into the material box receiving unit 224 one by one, and the vertical channel caches the material boxes to avoid stacking during unloading.

[0144] The above-mentioned blanking device 20 is used for blanking, which includes the following steps:

[0145] Step 1: Adjust the material box guide mechanism 21 and the material discharge mechanism 22 according to the size of the material box;

[0146] Step 2: Multiple material boxes sequentially enter the vertical channel on the material box guide mechanism 21, and the vertical channel guides and transports the material boxes from top to bottom;

[0147] Step 3: When the magazine lifting unit 222 carries the lowest magazine, the magazine guide mechanism 21 fixes the magazine above the lowest magazine;

[0148] Step 4: The pushing unit 223 pushes the bottom box into the box receiving unit 224 and then resets;

[0149] Step 5: Repeat steps 3 and 4 to push the cartridges into the cartridge receiving unit 224 one by one.

[0150] like Figure 14 As shown, the movement process of the material box is shown. The first material box is first in the first position A, then moves to the second position B, and then is pushed into the third position C. When the second material box enters position C, the first material box enters the fourth position D. When the third material box enters position C, the second material box enters the fourth position D, and the first material box enters the fifth position E. Finally, it can be taken out by a worker or a machine.

[0151] The present invention can be adjusted according to the size of the material box and the falling position, so as to adapt to material boxes of different sizes and improve applicability. The pushing unit 223 pushes the material boxes one by one into the material box receiving unit 224, and at the same time the material box guide mechanism 21 fixes the remaining material boxes for caching to ensure orderly unloading.

[0152] The present invention also provides a die bonding method, which uses the above-mentioned die bonding equipment to bond the die, comprising the following steps:

[0153] S1, the loading device 10 continuously supplies lead frames to the lead frame conveying device 50, the lead frame conveying device 50 conveys the lead frames toward the direction of the unloading device 20, and the chip supply device 30 continuously supplies chips to the mounting device 70;

[0154] S2, dispensing device 01 dispenses glue to the mounting position on the lead frame;

[0155] S3, the mounting device 70 grabs the chip and mounts the chip on the mounting position of the lead frame;

[0156] S4. The unloading device 20 connects the mounted lead frame.

[0157] On this basis, the specific process of the chip supply device 30 continuously supplying chips to the mounting device 70 in S1 is as follows:

[0158] S11, the chip supply device 30 performs a wafer expansion operation on the wafer to increase the distance between adjacent chips;

[0159] S12, the chip supply device 30 adjusts the position and angle of the wafer to align the chip with the mounting position;

[0160] S13 , the chip supply device 30 lifts the chip upwards to facilitate the placement device 70 to grab the chip.

[0161] Combine Figure 31 As shown, when the chip supply device 30 of the present invention is used to supply chips, the following steps are included:

[0162] Step 1: Determine the size of the wafers to be supplied, and place the corresponding wafer box 401 on the lifting mechanism 41 in the wafer loading and unloading mechanism according to the size of the wafers;

[0163] Step 2: Install the corresponding wafer mounting mechanism on the wafer expansion mechanism 48 onto the wafer position adjustment mechanism according to the size of the wafer;

[0164] Step 3: The pick-and-place mechanism 42 in the wafer loading and unloading mechanism grabs the wafer in the wafer box 401 and places it on the wafer expansion mechanism 48 , that is, between the pressure plate base 484 and the pressure plate 485 on the wafer expansion mechanism 48 ;

[0165] Step 4: The wafer expansion mechanism 48 stretches the wafer film to increase the spacing between the chips on the wafer film; that is, the active unit 489 approaches the wafer mounting mechanism and completes the transmission connection with the wafer mounting mechanism. Then, the wafer film on the wafer is heated by blowing air to soften the wafer film. Then, the active unit 489 drives the wafer on the wafer mounting mechanism downward to approach the lifting ring 482. The wafer film on the wafer is simultaneously blocked by the annular protrusion 4821 of the lifting ring 482 and stretched downward by the wafer ring, causing the wafer film to stretch from the inside to the outside, thereby increasing the spacing between two adjacent wafers on the wafer film.

[0166] Step 5: The wafer position adjustment mechanism moves the chip to the top of the chip ejection device 47 and adjusts the angle of the chip. The chip ejection device 47 sucks the wafer film downward and lifts the chip upward to facilitate chip removal. This step is repeated until all chips on the wafer are removed.

[0167] Step 6: The wafer position adjustment mechanism is reset, and the wafer loading and unloading mechanism grabs the wafer back into the wafer box 401;

[0168] Step 7: The lifting mechanism 41 rises, and another wafer rises to the position of the previous wafer, and then steps 3 to 6 are repeated until all wafers in the wafer box 401 are supplied.

[0169] On this basis, the specific process of S2 dispensing is as follows:

[0170] S21, partitioning the lead frame, dividing the mounting position on the lead frame into an upper area and a lower area;

[0171] S22, the visual component 2 performs visual inspection on the mounting position, and then the two dispensing components 3 dispense glue on the mounting position on the lead frame;

[0172] S23. The two dispensing components 3 are respectively the first dispensing component and the second dispensing component. The upper area is dispensed by the first dispensing component, and the lower area is dispensed by the second dispensing component. The first dispensing component and the second dispensing component jointly complete the dispensing of the mounting positions in the middle row or two rows on the lead frame.

[0173] Preferably, when the visual component 2 performs visual inspection on the working area, it performs visual inspection on the working areas of the upper area and the lower area alternately. After the visual component 2 performs visual inspection on the working area of ​​the upper area, the first dispensing component 3 dispenses glue on the working area of ​​the upper area, and at the same time, the visual component 2 performs visual inspection on the working area of ​​the lower area. After the inspection is completed, the second dispensing component 3 dispenses glue on the working area of ​​the lower area, and the dispensing is completed in a cycle.

[0174] Preferably, assuming the number of columns of the working area on the lead frame is m, when the lead frame is divided into a left area and a right area, when m is an even number, the number of columns of the left and right areas is equal, and when m is an odd number, the left area has one more column than the right area. assuming the number of rows of the working area on the lead frame is n, when the lead frame is divided into areas, when n is an odd number, in the upper area of ​​the left area, the number of working areas in each column is n+1 / 2, in the lower area of ​​the left area, the number of working areas in each column is n-1 / 2, in the upper area of ​​the right area, the number of working areas in each column is n-1 / 2, and in the lower area of ​​the right area, the number of working areas in each column is n+1 / 2. When n is an even number, the number of working areas in the upper area of ​​each column is the same as the number of working areas in the lower area.

[0175] Preferably, when the visual component 2 performs visual inspection on the working area, the visual component 2 starts from the middle position of each column, and then performs visual inspection on the working areas of the upper area and the lower area alternately.

[0176] In this embodiment, the order in which the visual component 2 performs photographic detection is: when performing photographic detection on the left area, when performing photographic detection on each column, when the number of rows n is an odd number, first take a picture from the middle working area; when the number of rows n is an even number, first take a picture from the bottom working area in the upper area of ​​the column, then take a picture from the bottom working area in the lower area of ​​the column, then take a picture from the first working area above the bottom in the upper area of ​​the column, then take a picture from the first working area above the bottom in the lower area of ​​the column, then take a picture from the second working area above the bottom in the upper area of ​​the column, then take a picture from the second working area above the bottom in the lower area of ​​the column, and perform alternating photographic detection of the upper and lower areas in sequence.

[0177] When photographing and detecting the right area, when photographing and detecting each column, when n is an odd number, take a picture from the middle working area first; when n is an even number, take a picture from the uppermost working area in the lower area of ​​the column first, then take a picture of the uppermost working area in the upper area of ​​the column, then take a picture of the first working area below the uppermost in the lower area of ​​the column, then take a picture of the first working area below the uppermost in the upper area of ​​the column, then take a picture of the second working area below the uppermost in the lower area of ​​the column, and then take a picture of the second working area below the uppermost in the upper area of ​​the column, and perform alternating photographic detection of the upper and lower areas in sequence.

[0178] Reference Figure 35 When the number of rows and columns of the working area on the lead frame is 6, the number of rows and the number of columns are both even numbers, the area above the straight line p is the upper area, the area below the straight line p is the lower area, the area to the left of the straight line q is the left area, and the area to the right of the straight line q is the right area.

[0179] Reference Figure 36 As shown, when the number of rows of the working area on the lead frame is 3 rows and the number of columns is 10 columns, the part to the left of the straight line s is the left area, and the right side is the right area. In the left area, the area above the straight line L is the upper area, and the area below the straight line L is the lower area. In the right area, the area above the straight line p is the upper area, and the area below the straight line p is the lower area.

[0180] Reference Figure 37 When the number of rows and columns of the working area on the lead frame is 5, the part to the left of straight line k is the left area, and the part to the right is the right area. In the left area, the part above straight line i is the upper area, and the part below straight line i is the lower area. In the right area, the part above straight line j is the upper area, and the part below straight line j is the lower area.

[0181] After the visual component 2 takes a photo to inspect the working area, the glue dispensing component 3 dispenses glue on the working area. The two glue dispensing components 3 dispense glue in the upper area and the lower area respectively, and the two glue dispensing components 3 dispense glue at the same time to improve the glue dispensing efficiency. After the visual component 2 takes a photo of a working area, the glue dispensing component 3 dispenses glue on the working area. At the same time, the visual component 2 will take a photo to inspect the next working area while the glue dispensing component 3 is dispensing glue, saving time and effectively shortening the glue dispensing cycle.

[0182] In this embodiment, the upper area is glued by the right-side glue dispensing component 3, and the lower area is glued by the left-side glue dispensing component 3, and the two glue dispensing components 3 dispense glue at the same time. When dispensing, the two glue dispensing components 3 dispense glue to the upper area and the lower area of ​​each column at the same time. After the dispensing is completed, the next column is dispensed.

[0183] On this basis, in S3, after the mounting device 70 grabs the chip, the visual inspection component 58 detects the chip angle. If the chip angle deviates, the mounting device 70 drives the chip to rotate, and after the chip angle is calibrated, the chip is mounted on the mounting position of the lead frame.

[0184] Specifically, lift the good chip on the wafer and grab the chip from the wafer; lift the chip upward while sucking the wafer membrane downward. The chip is grabbed by negative pressure adsorption. The chip is lifted while sucking the wafer membrane to separate the chip from the wafer membrane as much as possible. The chip is adsorbed by the suction nozzle 722. Negative pressure adsorption will not damage the chip and can also reduce the offset of the chip at this time. Visual calibration and compensation are performed on the angle of the chip; the picked chip is photographed from bottom to top, and the angle difference between the edge contour of the chip and the contour of the chip mounting position on the lead frame is calculated. The angle difference is compensated by adjusting the angle of the chip. Due to the small size of the chip, the chip cannot be photographed from above after being adsorbed. By shooting from the bottom of the chip, the offset chip can be compensated. Move the chip to the lead frame for chip mounting.

[0185] The present invention has a compact structure and can realize the full-process automated die bonding operation of the lead frame and the chip. The die bonding method can re-position and calibrate the chip before mounting, effectively improving the die bonding efficiency and die bonding accuracy.

[0186] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0187] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A die bonding device, characterized in that: include: A lead frame conveying device (50), wherein the lead frame is conveyed along an x-direction on the lead frame conveying device (50); A loading device (10), the loading device (10) being located at one end of the lead frame conveying device (50), the loading device (10) being used to connect the lead frame to the lead frame conveying device (50); A glue dispensing device (01), the glue dispensing device (01) being located above the lead frame conveying device (50) and being used for dispensing glue on the lead frame; A chip supply device (30), the chip supply device (30) being located on a side of the lead frame conveying device (50), the chip supply device (30) being used to convey and expand the wafer, and to eject the chip from the wafer film via a chip ejection device (47); The chip supply device (30) comprises: A wafer position adjustment mechanism, the wafer position adjustment mechanism is used to drive the wafer to adjust its position along the y direction, the x direction and the circumferential direction; the wafer position adjustment mechanism includes a circumferential rotation mechanism (46); A crystal expansion mechanism (48), the crystal expansion mechanism (48) being mounted on the wafer position adjustment mechanism, and the crystal expansion mechanism (48) being used to stretch the wafer film on the wafer to expand the distance between adjacent chips; When processing wafers of different sizes, a crystal expansion mechanism (48) of corresponding size is replaced, and the crystal expansion mechanism (48) includes: A lifting ring (482), wherein the lifting ring (482) is detachably connected to the circumferential rotation mechanism (46); a wafer mounting mechanism, the wafer mounting mechanism being arranged on the lifting ring (482), a wafer being mounted in the wafer mounting mechanism, and the size of the wafer mounting mechanism being adapted to wafers of different sizes; An active unit (489), the active unit (489) being located on a side of the wafer mounting mechanism, the active unit (489) being capable of moving closer to or farther from the wafer mounting mechanism, and the active unit (489) being used to drive the wafer mounting mechanism closer to or farther from the lifting ring (482); An annular protrusion (4821) is provided on the upper surface of the lifting ring (482), and the wafer mounting mechanism is located outside the annular protrusion (4821). When the wafer mounting mechanism is close to the lifting ring (482), the wafer film on the wafer is lifted by the annular protrusion (4821); a mounting device (70), the mounting device (70) being movable between the lead frame conveying device (50) and the chip supply device (30) to grab and mount the chip on the lead frame; A blanking device (20), the blanking device (20) is located at the other end of the lead frame conveying device (50), and the blanking device (20) is used to connect the lead frame out of the lead frame conveying device (50).

2. The die bonding equipment according to claim 1, characterized in that: The lead frame conveying device (50) comprises: A first base (501), the first base (501) being mounted on the platform (40); A conveying track (502), the conveying track (502) being mounted on the first base (501), the conveying track (502) being provided with a dispensing area (510), a mounting area (520) and a discharge area (550), the dispensing area (510) being provided with a first adsorption component (51), the mounting area (520) being provided with a second adsorption component (52) and a heating component, and the lead frame being moved out of the conveying track (502) from the discharge area (550); a drive assembly (53), the drive assembly (53) being mounted on the conveying track (502); A clamping jaw assembly (54) is installed on one side of the conveying track (502), and the clamping jaw assembly (54) clamps the lead frame. The clamping jaw assembly (54) is in transmission connection with the driving assembly (53) so as to drive the clamping jaw assembly (54) to move along the direction of the conveying track (502) through the driving assembly (53).

3. The die bonding equipment according to claim 2, characterized in that: The feeding device (10) comprises: Cabinet; A first Y-direction moving mechanism (11), wherein the first Y-direction moving mechanism (11) is installed in the cabinet; A Z-direction moving mechanism (12), wherein the Z-direction moving mechanism (12) is mounted on the first Y-direction moving mechanism (11), and the first Y-direction moving mechanism (11) is capable of driving the Z-direction moving mechanism (12) to move along the Y direction; The loading device (10) has two loading modes, namely a first loading mode and a second loading mode. The first loading mode is used when the lead frames are stacked in a material box, and the second loading mode is used when there is a release layer between the stacked lead frames adjacent to each other. In the first loading mode, a clamping assembly (13) is installed on the Z-direction moving mechanism (12), and the Z-direction moving mechanism (12) drives the clamping assembly (13) to move along the Z direction, and the clamping assembly (13) clamps the material box. A pushing assembly (14) is provided on one side of the clamping assembly (13), and the pushing assembly (14) pushes the lead frame in the material box; In the second loading mode, a suction assembly (15) is installed on the Z-direction moving mechanism (12), and the Z-direction moving mechanism (12) drives the suction assembly (15) to move along the Z direction. A material basket bottom plate (16) is installed in the cabinet, and the material basket bottom plate (16) is located below the suction assembly (15). One side of the material basket bottom plate (16) is fixedly connected to a waste box (17), and the other side is fixedly connected to a conveying bottom plate (18). The material basket bottom plate (16), the waste box (17) and the conveying bottom plate (18) are detachably connected to the cabinet.

4. The die bonding equipment according to claim 2, characterized in that: The dispensing device (01) comprises: A dispensing bracket (1), wherein the dispensing bracket (1) is mounted on a platform (40); A visual component (2), the visual component (2) being mounted on one side of the dispensing bracket (1), and the visual component (2) identifying a working position on the lead frame; Two dispensing components (3), the two dispensing components (3) are arranged on a dispensing bracket (1), the two dispensing components (3) are located on both sides of a visual component (2), after the visual component (2) performs position recognition on the lead frame, the dispensing components (3) dispense glue on the lead frame, the two dispensing components (3) dispense glue on different working areas respectively, and the two dispensing components (3) dispense glue at the same time.

5. The die bonding equipment according to claim 1, characterized in that: The chip supply device (30) further includes: A wafer loading and unloading mechanism, the wafer loading and unloading mechanism being used to grab wafers from a wafer box (401); The chip ejection device (47) is located below the crystal expansion mechanism (48).

6. The die bonding equipment according to claim 5, characterized in that: The wafer loading and unloading mechanism includes: a lifting mechanism (41), the lifting mechanism (41) being located on one side of the crystal expansion mechanism (48), the wafer box (401) being mounted on the lifting mechanism (41), a plurality of wafers being stacked in the wafer box (401), and the lifting mechanism (41) driving the wafer box (401) to perform lifting motion; A pick-and-place mechanism (42) is located on one side of the crystal expansion mechanism (48), and the pick-and-place mechanism (42) is used to grab the wafer and move between the wafer box (401) and the crystal expansion mechanism (48).

7. The die bonding equipment according to claim 1, characterized in that: The wafer position adjustment mechanism includes: A second y-direction moving mechanism (44); an x-direction moving mechanism (45), wherein the x-direction moving mechanism (45) is mounted on the second y-direction moving mechanism (44), and the second y-direction moving mechanism (44) drives the x-direction moving mechanism (45) to move along the y-direction; The circumferential rotation mechanism (46) is installed on the x-direction moving mechanism (45), and the x-direction moving mechanism (45) drives the circumferential rotation mechanism (46) to move along the x-direction. A crystal expansion mechanism (48) is installed on the circumferential rotation mechanism (46), and the circumferential rotation mechanism (46) drives the crystal expansion mechanism (48) to rotate in the circumferential direction.

8. The die bonding equipment according to claim 5, characterized in that: The chip ejection device (47) comprises: lift mount (471); A lifting assembly (472), the lifting assembly (472) being arranged on the lifting mounting seat (471); An ejection assembly (473) is installed on the lifting assembly (472), and the lifting assembly (472) drives the ejection assembly (473) to perform lifting movements to move closer to or away from the wafer film. The ejection assembly (473) has a cover assembly (47314) and an ejector pin (47313) arranged in the cover assembly (47314). The cover assembly (47314) has a negative pressure to absorb the wafer film downward. The ejector pin (47313) can move upward and protrude from the cover assembly (47314) to eject the chip upward.

9. The die bonding equipment according to claim 2, characterized in that: The mounting device (70) comprises: A mounting head (71), the mounting head (71) being mounted on a mounting head moving mechanism (73), the mounting head moving mechanism (73) driving the mounting head (71) to move in the xyz direction, the mounting head (71) being capable of adsorbing a chip and driving the chip to rotate so as to adjust the angle of the chip on the xy plane; A visual inspection component (58) is located on a side of the conveying track (502) facing the wafer.

10. The die bonding equipment according to claim 9, characterized in that: The visual detection component (58) includes: Second base (521); a visual detector (522), the visual detector (522) being mounted on the second base (521); A reflecting mirror (523), the reflecting mirror (523) being arranged opposite to the lens of the visual detector (522), and the reflecting mirror (523) being arranged to be tilted upward; A first moving mechanism (524) is installed on the conveying track (502), and the first moving mechanism (524) is connected to the reflecting mirror (523) to drive the reflecting mirror (523) to move toward the lens of the visual detector (522).

11. The die bonding equipment according to claim 9, characterized in that: The mounting head moving mechanism (73) comprises: Composite base (78); an x-direction motion assembly (74), the x-direction motion assembly (74) being mounted on the composite base (78); A y-direction motion component (75), wherein the y-direction motion component (75) is connected to the x-direction motion component (74), and the x-direction motion component (74) drives the y-direction motion component (75) to move along the x-direction; a z-direction motion component (76), a placement head is mounted on the z-direction motion component (76), a portion of the z-direction motion component (76) is mounted on the x-direction motion component (74), and another portion of the z-direction motion component (76) is mounted on the y-direction motion component (75), the y-direction motion component (75) drives the placement head to move in the y-direction, and the z-direction motion component (76) drives the placement head to move in the z-direction; The shock absorbing device (77) is mounted on the composite base (78), and the movement direction of the shock absorbing device (77) is opposite to that of the Y-direction motion component (75).

12. The die bonding equipment according to claim 9, characterized in that: The placement head (71) comprises: a second mounting seat (712), wherein a rotation drive assembly is provided on the second mounting seat (712); a third mounting seat (715), the third mounting seat (715) being slidably connected to the second mounting seat (712) in a vertical direction; A mounting head assembly, the mounting head assembly is vertically arranged, the mounting head assembly is rotatably mounted on the third mounting seat (715), the mounting head assembly is in transmission connection with the rotary drive assembly, and the mounting head assembly is capable of moving in its axial and circumferential directions; The second mounting seat (712) is mounted on the first mounting seat (711), and the relative position between the second mounting seat (712) and the first mounting seat (711) can be fine-tuned. The first mounting seat (711) is mounted on the mounting head moving mechanism (73), and the relative position between the first mounting seat (711) and the mounting head moving mechanism (73) can be fine-tuned.

13. The die bonding equipment according to claim 1, characterized in that: The blanking device (20) comprises: case; A material box guide mechanism (21), the material box guide mechanism (21) is installed in the housing, and a vertical channel is provided in the material box guide mechanism (21), and the vertical channel is used to guide and transport the material box equipped with the lead frame; A material unloading mechanism (22), the material unloading mechanism (22) is located in the shell, the material unloading mechanism (22) comprises a material box lifting unit (222), a material box receiving unit (224) and a material pushing unit (223), the material box lifting unit (222) receives the material box in the vertical channel, the material box receiving unit (224) and the material pushing unit (223) are respectively located on both sides of the material box guiding mechanism (21), the material pushing unit (223) is used to push the received material box into the material box receiving unit (224), and during the process of the material box being pushed in, the material box receiving unit (224) continuously supports and guides the material box.

14. A die bonding method, characterized in that the die bonding is performed using the die bonding apparatus according to any one of claims 1 to 13, comprising the following steps: S1, the loading device (10) continuously supplies lead frames to the lead frame conveying device (50), the lead frame conveying device (50) conveys the lead frames in the direction of the unloading device (20), and at the same time, the chip supply device (30) continuously supplies chips to the mounting device (70); S2, the glue dispensing device (01) dispenses glue to the mounting position on the lead frame; S3, the mounting device (70) grabs the chip and mounts the chip on the mounting position of the lead frame; S4, the blanking device (20) connects the mounted lead frame.

15. The die bonding method according to claim 14, wherein: The specific process of the chip supply device (30) continuously supplying chips to the mounting device (70) in S1 is as follows: S11, the chip supply device (30) performs a wafer expansion operation on the wafer to increase the distance between adjacent chips; S12, the chip supply device (30) adjusts the position and angle of the wafer so that the chip is aligned with the mounting position; S13, the chip supply device (30) lifts the chip upwards to facilitate the placement device (70) to grab it.

16. The die bonding method according to claim 14, wherein: The specific process of S2 dispensing is as follows: S21, partitioning the lead frame, dividing the mounting position on the lead frame into an upper area and a lower area; S22, the visual component (2) performs visual inspection on the mounting position, and then two dispensing components dispense glue on the mounting position on the lead frame; S23. The two dispensing components are the first dispensing component and the second dispensing component respectively. The upper area is dispensed by the first dispensing component, and the lower area is dispensed by the second dispensing component. The first dispensing component and the second dispensing component jointly dispense the mounting positions of the middle row or two rows on the lead frame.

17. The die bonding method according to claim 14, wherein: In S3, after the mounting device (70) grabs the chip, the visual inspection component (58) detects the angle of the chip. If the chip angle deviates, the mounting device (70) calibrates the chip angle and then mounts the chip on the mounting position of the lead frame.

Images