Centering and positioning mechanism of trimmed wafer transmission device and trimmed wafer transmission device

Abstract

The present invention relates to a centering and positioning mechanism for a trimmed wafer transmission device and a trimmed wafer transmission device, comprising two groups of baffle rod assemblies, wherein the baffle rod assemblies include two baffle rods and the spacing between the two baffle rods is greater than the side length of the trimmed edge of the trimmed wafer; the four baffle rods of the two groups of baffle rod assemblies are located at the four corner points of a rectangle; a driving assembly includes two driving ends, which are respectively connected to the two groups of baffle rod assemblies; wherein the driving assembly is used to drive the two groups of baffle rod assemblies to perform linear motion in opposite directions at the same speed, and when the baffle rods reach the positioning position, the driving assembly stops driving, and at least three baffle rods are against the circumferential edge of the trimmed wafer to center and position the trimmed wafer. By setting the two groups of baffle rod assemblies and limiting the spacing between the two baffle rods of the baffle rod assemblies to be greater than the side length of the trimmed edge of the trimmed wafer, centering and positioning can be achieved by the linear motion of the two groups of baffle rod assemblies in opposite directions at the same speed, and the overall structure is simple and easy to operate.

Description

Technical Field

[0001] The present invention relates to the field of wafer transmission equipment, and in particular to a centering and positioning mechanism of a trimmed wafer transmission device and the trimmed wafer transmission device. Background Art

[0002] In the wafer manufacturing process, wafers are usually transported by means of a wafer transfer device. In order to ensure that the wafer is positioned in the middle of the transfer track during the transfer process, a centering positioning mechanism is usually required to perform centering processing on the wafer.

[0003] Wafer trimming involves removing a portion of the wafer edge with a specific depth and width. Due to the irregularities of the trimmed wafer edge, the trimmed portion's position relative to the centering mechanism varies depending on the wafer's position on the transport track. This makes centering difficult, leading to a complex centering mechanism and a complex process. Summary of the Invention

[0004] In view of the above-mentioned defects in the prior art, an object of the present invention is to provide a centering and positioning mechanism for a trimmed wafer transmission device, which has a simple structure and is easy to operate.

[0005] To this end, the present invention provides the following technical solutions.

[0006] The first object of the present invention is to provide a centering and positioning mechanism for a trimmed wafer transmission device, comprising:

[0007] Two groups of barrier rod assemblies, each comprising two barrier rods, wherein the distance between the two barrier rods is greater than the side length of the trimmed edge of the trimmed wafer; the four barrier rods of the two groups of barrier rod assemblies are located at four corner points of a rectangle;

[0008] A driving assembly comprising two driving ends for connecting to the two sets of the blocking rod assemblies respectively;

[0009] In which, the driving assembly is used to drive the two groups of the baffle rod assemblies to move linearly in opposite directions at the same speed in the transmission direction of the vertical transmission device. When the baffle rod reaches the positioning position, the driving assembly stops driving, and at least three of the baffle rods rest on the circumferential edge of the trimmed wafer to center the trimmed wafer.

[0010] Preferably, the blocking rod is arranged vertically.

[0011] Preferably, the blocking rod includes a rigid column and a flexible column, and the flexible column is provided at the top end of the rigid column; the flexible column is used to abut against the circumferential edge of the trimmed wafer.

[0012] Preferably, the rigid column and the flexible column are detachably connected.

[0013] Preferably, each group of the baffle rod assemblies includes a connecting piece, and the baffle rod is arranged on the connecting piece; the baffle rod is connected to the driving end through the connecting piece.

[0014] Preferably, the driving assembly includes a motor, a driving wheel, a driven wheel and a synchronous belt; the two parts of the synchronous belt that move toward each other constitute the two driving ends.

[0015] Preferably, the driving assembly further comprises two guide rails arranged in parallel, and each group of the blocking rod assemblies is slidably connected to the two guide rails.

[0016] Preferably, it further comprises a position detection component, which is triggered when the blocking rod reaches the positioning position.

[0017] A second object of the present invention is to provide a trimmed wafer transfer device, comprising:

[0018] A transport track comprising a transport portion for transporting trimmed wafers;

[0019] The centering and positioning mechanism of the trimmed wafer transfer device as described above;

[0020] The driving assembly is located below the transmission part, and the two groups of blocking rod assemblies are respectively located on both sides of the transmission part.

[0021] Preferably, the transfer track includes two track side walls, which are respectively located on both sides of the transfer part; the track side walls are provided with yielding parts corresponding to four baffles one by one, and the baffles extend from the bottom of the track side walls through the yielding parts to the top of the track side walls.

[0022] The present invention has the following technical effects:

[0023] The present invention provides a centering and positioning mechanism for a trimmed wafer transport device. By providing two sets of barrier rod assemblies and limiting the spacing between the two barrier rods of the barrier rod assemblies to be greater than the length of the trimmed edge of the trimmed wafer, a positioning structure with at least three limits is formed during centering and positioning to limit the left-right position and the front-back position of the trimmed wafer on the transport unit, thereby achieving centering and positioning. The centering and positioning mechanism has a simple overall structure, and can achieve centering and positioning through the linear motion of the two barrier rod assemblies in opposite directions at the same speed, making it easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the three-dimensional structure of the centering and positioning mechanism of the present invention Figure 1 ;

[0025] Figure 2 Schematic diagram of the three-dimensional structure of the centering and positioning mechanism of the present invention Figure 2 ;

[0026] Figure 3 It is a schematic diagram of a partial three-dimensional structure of the transmission device of the present invention;

[0027] Figure 4 It is a schematic diagram of the assembly relationship between the centering and positioning mechanism and the lifting mechanism of the present invention.

[0028] Description of Reference Numerals

[0029] 100. Transmission device;

[0030] 1. Centering and positioning mechanism; 11. Stop rod assembly; 111. Stop rod; 1111. Rigid column; 1112. Flexible column; 112. Connector; 12. Drive assembly; 121. Motor; 122. Driving pulley; 123. Driven pulley; 124. Synchronous belt; 125. Guide rail; 126. Slider; 127. Synchronous belt splint; 13. Position detection assembly; 131. Optocoupler; 132. Stopper;

[0031] 2. Transmission track; 21. Track side wall; 211. Yield portion; 3. Lifting mechanism; 31. Lifting cylinder; 32. Support member; 33. Support column;

[0032] 200. Cut-edge wafer. DETAILED DESCRIPTION

[0033] To make the technical solutions and beneficial effects of the present invention more clearly understood, the following is a detailed description by listing specific embodiments. Unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application belongs.

[0034] In the description of the present invention, unless otherwise expressly defined, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of simplifying the description of the present invention, and do not indicate that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and should not be understood as a limitation to the present invention.

[0035] In this disclosure, the terms "first" and "second" are used solely for descriptive clarity and should not be construed as indicating the relative importance of the features indicated or the quantity of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly include at least one such feature. In the description of this disclosure, "plurality" means at least two, and "several" means at least one, unless expressly specified otherwise.

[0036] In the present invention, unless otherwise expressly defined, the terms "installed," "connected," "connect," "fixed," and "disposed" should be understood broadly. For example, "connection" can mean fixed connection, removable connection, or integral molding; it can be mechanical or electrical; it can be direct or indirect through an intermediary; it can also refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0037] In the present invention, unless otherwise clearly defined, when a first feature is “on,” “above,” “above,” “above,” “below,” “below,” or “below” a second feature, the first feature and the second feature may be in direct contact, or the first feature and the second feature may be in indirect contact via an intermediate medium. Moreover, when a first feature is “on,” “above,” or “above” a second feature, it may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. When a first feature is “below,” “below,” or “below” a second feature, it may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0038] The terms "front", "back", "left" and "right" mentioned in this invention are all in the Figure 3 The markings in the table shall prevail.

[0039] The following is based on Figures 1 to 4 The trimmed wafer transfer device of the present invention is described in detail.

[0040] In this embodiment, if Figure 1 and Figure 3 As shown, the transmission device 100 includes a centering positioning mechanism 1 and a transmission track 2. The transmission track 2 includes a transmission part for transmitting the trimmed wafer 200. The trimmed wafer 200 is placed on the transmission part. The transmission part supports the trimmed wafer 200 and drives the trimmed wafer 200 forward.

[0041] In this embodiment, if Figure 1 and Figure 2As shown, the centering and positioning mechanism 1 includes two groups of baffle rod assemblies 11, each of which includes two baffle rods 111, and the spacing between the two baffle rods 111 is greater than the side length of the trimmed wafer 200; the four baffle rods 111 of the two groups of baffle rod assemblies 11 are located at the four corner points of a rectangle. The centering and positioning mechanism 1 also includes a drive assembly 12, and the drive assembly 12 includes two drive ends, and the two drive ends are respectively connected to the two groups of baffle rod assemblies 11 in a one-to-one correspondence. The drive assembly 12 is used to drive the two groups of baffle rod assemblies 11 to perform linear motion in opposite directions at the same speed in the transmission direction of the vertical transmission device 100. When the baffle rod 111 reaches the positioning position, the drive assembly 12 stops driving, and at least three baffle rods 111 are against the circumferential edge of the trimmed wafer 200 to center and position the trimmed wafer 200.

[0042] In this embodiment, the trimmed wafer 200 is positioned at the target position by two sets of baffle rod assemblies 11. The starting position and the positioning position of the baffle rod 111 serve as two stop points during one movement of the baffle rod 111. The baffle rod 111 stops moving when it moves to the positioning position. At this time, the position defined between the two sets of baffle rod assemblies 11 is the target position for the centering and positioning of the trimmed wafer 200. After completing the current centering and positioning work, the two sets of baffle rod assemblies 11 return to the corresponding starting positions to wait for the next centering and positioning work.

[0043] Since the outer contour of the trimmed wafer 200 is composed of a circular contour and a cut plane, and the trim is relatively small, the outer contour of the trimmed wafer 200 is primarily a circular contour. The two groups of baffle rod assemblies 11 provide four baffle rods 111 located at the four corner points of a rectangle. When the two groups of baffle rod assemblies 11 move linearly toward each other at the same speed to corresponding positioning positions, the four baffle rods 111 form four stop points at the boundaries of the target position for centering. By limiting the spacing between the two baffle rods 111 in the baffle rod assemblies 11 to be greater than the length of the trimmed edge of the trimmed wafer 200, it is possible to avoid a situation where one group of baffle rod assemblies 11 has not yet contacted the edge of the trimmed wafer 200 when the baffle rods 111 reach the positioning position. If only one group of baffle rod assemblies 11 rests on the outer contour of the trimmed wafer 200, it will not be able to perform the positioning function.

[0044] By providing two sets of baffle rod assemblies 11, a positioning structure with at least three limits is formed to restrict the left and right position and the front and back position of the trimmed wafer 200 on the transport unit, thereby achieving centering and positioning. Furthermore, the overall structure of the centering and positioning mechanism 1 is simple, and centering and positioning can be achieved by the linear motion of the two sets of baffle rod assemblies 11 in opposite directions at the same speed, making operation simple. Furthermore, the centering and positioning mechanism 1 in this embodiment is suitable for trimmed wafers of any size with equal trimming lengths. Centering and positioning can be achieved by simply adjusting the positioning positions of the two sets of baffle rod assemblies 11, resulting in a wide range of applications and ease of use.

[0045] It should be understood that before the centering and positioning operation, since the front and rear positions of the trimmed wafer 200 located on the transmission part in the transmission direction are random within a certain range, the upper limit value of the distance between the two baffles 111 of the baffle assembly 11 can be limited to avoid the situation where centering and positioning cannot be performed due to the difference in the front and rear positions of the trimmed wafer 200 in the transmission direction, so as to ensure that at least three baffles 111 can rest on the circumferential edge of the trimmed wafer 200 when the baffles 111 reach the positioning position.

[0046] In one embodiment, if Figure 1 and Figure 2 As shown, the baffle 111 is vertically arranged, and the side of the baffle 111 abuts against the trimmed wafer 200, and the two abut stably. In addition, in order to facilitate the arrangement of the drive assembly 12 below the transmission part, the two groups of baffle assemblies 11 are respectively located on the left and right sides of the transmission part, and the transmission track 2 includes two track side walls 21, which are respectively located on the left and right sides of the transmission part; the track side walls 21 are provided with a clearance portion 211 corresponding to the four baffles 111, and the baffles 111 extend from the bottom of the track side walls 21 through the clearance portion 211 to the top of the track side walls 21; the transmission part includes at least two aisles, the extension direction of the aisles is perpendicular to the transmission direction of the transmission device 100, and the two aisles are used to make way for the two groups of baffle assemblies 11 to move linearly in opposite directions at the same speed. The assembly structure of the centering positioning mechanism 1 and the transmission track 2 is simple, and the space below the transmission part is effectively utilized, which is conducive to the miniaturization design of the transmission device 100.

[0047] Furthermore, the blocking rod 111 is arranged perpendicular to the horizontal plane so as to stably abut against the circumferential edge of the trimmed wafer 200 .

[0048] In one embodiment, if Figure 1 As shown, the barrier bar 111 includes a rigid post 1111 and a flexible post 1112. The flexible post 1112 is disposed at the top of the rigid post 1111; the flexible post 1112 is used to abut against the circumferential edge of the trimmed wafer 200. The rigid post 1111 improves the stability of the overall structure of the barrier bar 111, while the flexible post 1112 allows the barrier bar 111 to flexibly abut against the trimmed wafer 200, thereby preventing the barrier bar 111 from damaging the trimmed wafer 200.

[0049] It should be understood that the flexible column 1112 has a certain degree of flexibility, but it is not easy to deform so as not to affect the positioning function.

[0050] Furthermore, the rigid column 1111 and the flexible column 1112 are detachably connected to facilitate replacement of the flexible column 1112 , thereby avoiding inaccurate centering and positioning when the flexible column 1112 is deformed.

[0051] In one embodiment, if Figure 1As shown, each baffle rod assembly 11 includes a connecting piece 112 , and the baffle rod 111 is arranged on the connecting piece 112 ; the baffle rod 111 is connected to the driving end through the connecting piece 112 to facilitate the assembly of the baffle rod assembly 11 and the driving assembly 12 .

[0052] In one embodiment, if Figure 1 As shown, the drive assembly 12 includes a motor 121, a driving wheel 122, a driven wheel 123 and a synchronous belt 124; the two parts of the synchronous belt 124 that move toward each other constitute two driving ends. The drive assembly 12 has a simple structure and simple control, and can drive two groups of gear lever assemblies 11 to move in opposite directions at the same speed.

[0053] Furthermore, the driving assembly 12 further includes two guide rails 125 arranged in parallel, and each set of blocking rod assemblies 11 is slidably connected to the two guide rails 125 to improve driving stability.

[0054] Furthermore, the driving assembly 12 further includes four sliders 126 , and each group of the blocking rod assemblies 11 is slidably connected to the two guide rails 125 via two sliders 126 .

[0055] Furthermore, the drive assembly 12 further includes two synchronous belt clamps 127 . Each synchronous belt clamp 127 is provided corresponding to a connecting member 112 . The synchronous belt clamp 127 is fixed to the connecting member 112 and forms a clamping force for clamping the synchronous belt.

[0056] Furthermore, the motor 121 can be a servo motor. By limiting the torque of the servo motor, during the centering and positioning process, when the blocking rod 111 and the contour of the trimmed wafer 200 are in contact until the reverse force exerted by the trimmed wafer 200 on the blocking rod 111 reaches a preset threshold range, the servo motor stops running to prevent the trimmed wafer 200 from being crushed.

[0057] It should be understood that the drive assembly 12 is not limited to the belt drive assembly, but also includes other components that can realize linear drive, such as the screw-nut drive assembly or the gear rack drive assembly. The screw-nut drive assembly or the gear rack drive assembly needs to set two sets of components to realize the driving of the two sets of baffle rod assemblies 11 in opposite directions and at the same speed.

[0058] In one embodiment, if Figure 1 As shown, the centering and positioning mechanism 1 further includes a position detection component 13. When the blocking rod 111 reaches the positioning position, the position detection component 13 is triggered to cooperate with the control of the blocking rod component 11 to move to the positioning position and then stop moving.

[0059] Further, in one embodiment, if Figure 1As shown, there are two position detection components 13, which are respectively arranged at the starting position and the positioning position of the blocking rod 111 to cooperate with the stop position of the blocking rod component 11, and are suitable for the centering and positioning of a size of trimmed wafers.

[0060] In another embodiment, the number of the position detection components 13 is more than two (not shown in the figure), which is suitable for centering and positioning of trimmed wafers of any size with equal trimmed side lengths.

[0061] Further, if Figure 1 As shown, the position detection assembly 13 includes an optical coupler 131 and a baffle 132 , and the optical coupler 131 and the baffle 132 cooperate to realize position detection of the corresponding baffle rod.

[0062] It should be understood that the position detection component 13 is not limited to the position detection structure formed by the optical coupler 131 and the baffle 132 , but also includes other trigger-type structures such as micro switches that can be used to detect positions.

[0063] In one embodiment, a centering and positioning mechanism 1 is provided in each of the loading and unloading areas of the transport track 2. The loading area is located at the rear end of the transport track 2, while the unloading area is located at the front end of the transport track 2. During loading, the centering and positioning mechanism in the loading area centers the trimmed wafer 200 to prevent the trimmed wafer 200 from scraping against the sidewall 21 of the transport track due to positional deviation during transport. During unloading, the centering and positioning mechanism in the unloading area centers the trimmed wafer 200 to facilitate gripping and transfer of the trimmed wafer 200 by a robotic arm.

[0064] Further, if Figure 4 As shown, the transport device 100 includes a lifting mechanism 3 for lifting the trimmed wafer 200 located in the unloading area upwards so that the trimmed wafer 200 is out of contact with the transport part to prevent the moving transport part from affecting the unloading of the trimmed wafer 200.

[0065] Furthermore, the lifting mechanism 3 includes a lifting cylinder 31, a support member 32, and multiple support columns 33. The bottom end of the support member 32 is connected to the driving end of the lifting cylinder 31, and the multiple support columns 33 are arranged at the top end of the support member 32. The lifting mechanism 3 is located at the center of the positioning area of ​​the centering and positioning mechanism in the unloading area. After the centering and positioning mechanism completes the centering and positioning of the trimmed wafer 200 in the unloading area, the lifting cylinder 31 drives the support member 32 to move the multiple support columns 33 upward until the multiple support columns 33 support the trimmed wafer 200. By providing multiple support columns 33 to form point-to-surface contact with the lower surface of the trimmed wafer 200, the trimmed wafer 200 can be stably supported.

[0066] Furthermore, the lifting cylinder 31 is located below the two guide rails 125 of the drive assembly 12 of the centering and positioning mechanism in the unloading area. The support member 32 passes through the middle of the two guide rails 125, and multiple support columns 33 are located above the two guide rails 125. The assembly position relationship between the lifting mechanism 3 and the drive assembly 12 is conducive to saving space and facilitating the miniaturization of the transmission device 100.

[0067] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations of the claims. Various modifications and variations may be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form additional embodiments of the present invention that may not be explicitly described. Therefore, the above embodiments merely illustrate several implementations of the present invention and do not limit the scope of protection of the patent of this invention.

Claims

1. A centering and positioning mechanism for a trimmed wafer transmission device, characterized in that: include: Two groups of blocking rod assemblies (11), the blocking rod assemblies (11) comprising two blocking rods (111), and the spacing between the two blocking rods (111) is greater than the side length of the trimmed edge of the trimmed wafer (200); the four blocking rods (111) of the two groups of blocking rod assemblies (11) are located at four corner points of a rectangle; A driving assembly (12) comprising two driving ends for respectively connecting to the two groups of the blocking rod assemblies (11); The driving assembly (12) is used to drive two groups of the baffle rod assemblies (11) to move linearly in opposite directions at the same speed in the transmission direction of the vertical transmission device. When the baffle rods (111) reach the positioning position, the driving assembly (12) stops driving, and at least three of the baffle rods (111) are pressed against the circumferential edge of the trimmed wafer (200) to center the trimmed wafer (200).

2. The centering and positioning mechanism of the trimmed wafer transmission device according to claim 1, characterized in that: The blocking rod (111) is arranged vertically.

3. The centering and positioning mechanism of the trimmed wafer transmission device according to claim 1, characterized in that: The blocking rod (111) comprises a rigid column (1111) and a flexible column (1112), wherein the flexible column (1112) is arranged at the top end of the rigid column (1111); the flexible column (1112) is used to abut against the circumferential edge of the trimmed wafer (200).

4. The centering and positioning mechanism of the trimmed wafer transmission device according to claim 3, characterized in that: The rigid column (1111) and the flexible column (1112) are detachably connected.

5. The centering and positioning mechanism of the trimmed wafer transmission device according to claim 1, characterized in that: Each group of the blocking rod assembly (11) comprises a connecting piece (112), and the blocking rod (111) is arranged on the connecting piece (112); the blocking rod (111) is connected to the driving end via the connecting piece (112).

6. The centering and positioning mechanism of the trimmed wafer transmission device according to any one of claims 1 to 5, characterized in that: The driving assembly (12) comprises a motor (121), a driving wheel (122), a driven wheel (123) and a synchronous belt (124); two parts of the synchronous belt (124) that move toward each other constitute the two driving ends.

7. The centering and positioning mechanism of the trimmed wafer transmission device according to claim 6, characterized in that: The driving assembly (12) further comprises two guide rails (125) arranged in parallel, and each group of the blocking rod assemblies (11) is slidably connected to the two guide rails.

8. The centering and positioning mechanism of the trimmed wafer transmission device according to any one of claims 1 to 5, characterized in that: It also includes a position detection component (13), which is triggered when the blocking rod (111) reaches the positioning position.

9. A trimmed wafer transmission device, characterized in that: include: A transport track (2), comprising a transport portion for transporting a trimmed wafer (200); The centering and positioning mechanism of the trimmed wafer transmission device according to any one of claims 1 to 8; The driving assembly (12) is located below the transmission portion, and the two groups of blocking rod assemblies (11) are respectively located on both sides of the transmission portion.

10. The trimmed wafer transfer device according to claim 9, wherein: The transmission track (2) comprises two track side walls (21), which are respectively located on both sides of the transmission part; the track side walls (21) are provided with a yielding portion (211) corresponding to four blocking rods (111) one by one, and the blocking rods (111) pass through the yielding portion (211) from the bottom of the track side walls (21) and extend to the top of the track side walls (21).

Images