A pre-alignment device for multi-specification flat edge wafers

Abstract

The application provides a pre-alignment device for multi-specification flat edge wafers, which comprises a suction disc and an alignment device. One side of the suction disc is a suction surface, and the suction surface is provided with concentric first and second suction grooves. The alignment device is fixedly installed on the other side of the suction disc. The alignment device comprises a support plate, a rocker plate, an upper plate and a lower plate. The support plate and the rocker plate are respectively hinged at two ends of the upper plate and the lower plate and form a four-bar linkage structure between the upper plate and the lower plate. A compression spring is arranged between the lower plate and the support plate. An adjusting jackscrew is arranged on the support plate. The adjusting jackscrew penetrates through the support plate and abuts against the lower plate. At least two long hat shafts are rotatably connected to the support plate. At least two short hat shafts are rotatably connected to the rocker plate. The at least two long hat shafts and the at least two short hat shafts are at the same horizontal height. The top of the short hat shaft is lower than the suction surface. The top of the long hat shaft is higher than the suction surface. The application can realize the pre-alignment of notch wafers with different sizes and specifications, thereby saving time and economic cost.

Description

Technical Field

[0001] The invention relates to the field of wafer processing, in particular to a pre-alignment device for flat-edge wafers of multiple specifications. Background Art

[0002] Pre-alignment is a function used in lithography and other semiconductor equipment. Flat-edge wafer pre-alignment devices must be efficient, reliable, and precise. Existing devices can only pre-align flat-edge wafers of a single size. Due to user needs in scientific research experiments, which often require frequent replacement of flat-edge wafers of varying sizes for product research, most current lithography equipment only performs pre-alignment for a single flat-edge wafer, failing to meet the need for a single machine for multiple uses. Due to the high cost of lithography machines, replacing them requires significant capital and time, significantly increasing production and operating costs. Therefore, solving these technical problems has become a research topic for those skilled in the art. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a pre-alignment device for flat-edge wafers of various specifications to solve the technical problems raised in the above background technology.

[0004] The object of the present invention is achieved through the following technical solutions:

[0005] The lifting mechanism is a set of one or more camshafts, each of which is connected to the support frame by a movable frame, and the movable frame is connected to the support frame by a movable frame.

[0006] In the above invention, further, an abutment portion is provided at one end of the lower plate, and the adjusting screw passes through the support plate and abuts against the surface of the abutment portion.

[0007] In the above invention, further, the support plate is provided with a mounting portion, the long cap shaft is installed on the mounting portion, the mounting portion is also provided with a first mounting hole, the lower plate is provided with a second mounting hole, the compression spring is sleeved between the lower plate and the support plate through the first mounting hole and the second mounting hole, and the upper plate is provided with a groove that cooperates with the mounting portion.

[0008] In the above invention, further, the mounting portion is provided with two long cap shafts, and the two long cap shafts are symmetrically arranged on the mounting portion; the seesaw is provided with two short cap shafts, and the two short cap shafts are symmetrically arranged on the seesaw.

[0009] In the above invention, further, the support plate and the seesaw are both provided with bearings, the long cap shaft and the short cap shaft are both provided in the bearings, the long cap shaft and the short cap shaft are respectively rotatably connected to the support plate and the seesaw through the bearings, and a fastening nut is also provided at the end of the long cap shaft and the short cap shaft away from the adsorption surface.

[0010] In the above invention, further, the two ends of the upper plate are respectively provided with a first hinge part, and the two ends of the lower plate are respectively provided with a second hinge part, and the support plate and the rocker are hinged at the two ends of the upper plate and the lower plate through the first hinge part, the second hinge part and the pin.

[0011] In the above invention, further, the suction cup is provided with a mounting groove, the alignment device is installed in the mounting groove, the mounting groove is also provided with a first through hole and a second through hole, the short cap shaft is placed in the first through hole, and the long cap shaft is placed in the second through hole.

[0012] In the above invention, further, the surfaces of the first adsorption tank and the second adsorption tank are both provided with convex particles.

[0013] In the above invention, further, the suction cup is provided with a fixing hole for installing the suction cup.

[0014] The beneficial effects of the present invention are:

[0015] The present invention can realize the pre-alignment of flat-edge wafers of different sizes and specifications, saves time and economic costs, and realizes the function of "one machine for multiple uses". BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention;

[0017] Figure 2 Another structural diagram of the present invention;

[0018] Figure 3 Schematic diagram of the connection between the suction cup and the alignment device of the present invention;

[0019] Figure 4 This is a schematic structural diagram of the alignment device of the present invention;

[0020] Figure 5 This is an exploded schematic diagram of the alignment device of the present invention;

[0021] Figure 6 Another exploded schematic diagram of the alignment device of the present invention;

[0022] Figure 7 A diagram showing the alignment device of the present invention in use;

[0023] Figure 8 This is a schematic diagram of the present invention and the small chip installation structure;

[0024] Figure 9 FIG. 2 is another diagram of the alignment device of the present invention in another state of use;

[0025] Figure 10 This is a schematic diagram of the present invention and the large wafer installation structure.

[0026] In the figure, 1-suction cup, 1.1-first adsorption groove, 1.2-second adsorption groove, 1.3-mounting groove, 1.4-first through hole, 1.5-second through hole, 1.6-convex particles, 1.7-fixing hole, 2-alignment device, 2.1-support plate, 2.11-mounting part, 2.12-first mounting hole, 2.2-rocker, 2.3-upper plate, 2.31-groove, 2.32-first hinge part, 2.4-lower plate, 2.41-abutment part, 2.42-second mounting hole, 2.43-second hinge part, 2.5-compression spring, 2.6-adjusting top screw, 2.7-short cap shaft, 2.8-long cap shaft, 2.9-pin, 3-bearing, 4-fastening nut, 5-small chip, 6-large chip. DETAILED DESCRIPTION

[0027] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0028] It should be noted that the illustrations provided in the following embodiments are merely schematic illustrations of the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0029] Example:

[0030] A pre-alignment device for multi-specification flat edge wafers, see the attached Figure 1 -Attached Figure 3As shown, it includes a suction cup 1 and an alignment device 2. The suction cup 1 is provided with a mounting groove 1.3 and a fixing hole 1.7 for mounting the suction cup 1. The alignment device 2 is installed in the mounting groove 1.3. One side of the suction cup 1 is an adsorption surface, and the adsorption surface is provided with a concentric first adsorption groove 1.1 and a second adsorption groove 1.2. The surfaces of the first adsorption groove 1.1 and the second adsorption groove 1.2 are both provided with convex particles 1.6. The alignment device 2 is fixedly installed on the other side of the suction cup 1. Figure 4 -Attached Figure 6 As shown, the alignment device 2 includes a support plate 2.1, a rocker plate 2.2, an upper plate 2.3 and a lower plate 2.4. The support plate 2.1 and the rocker plate 2.2 are hinged at the two ends of the upper plate 2.3 and the lower plate 2.4 respectively and form a four-bar structure between the upper plate 2.3 and the lower plate 2.4. Specifically, the two ends of the upper plate 2.3 are respectively provided with a first hinge part 2.32, and the two ends of the lower plate 2.4 are provided with a second hinge part 2.42. The support plate 2.1 and the rocker plate 2.2 are hinged at the two ends of the upper plate 2.3 and the lower plate 2.4 through the first hinge part 2.32, the second hinge part 2.42 and the pin 2.9.

[0031] A compression spring 2.5 is provided between the lower plate 2.4 and the support plate 2.1, and a first mounting hole 2.12 is further provided on the mounting portion 2.11, and a second mounting hole 2.43 is provided on the lower plate 2.4. The compression spring 2.5 is sleeved between the lower plate 2.4 and the support plate 2.1 through the first mounting hole 2.12 and the second mounting hole 2.43. An adjusting top screw 2.6 is provided on the support plate 2.1, and an abutting portion 2.41 is provided at one end of the lower plate 2.4. The adjusting top screw 2.6 passes through the support plate 2.1 and abuts against the surface of the abutting portion 2.41 of the lower plate 2.4. The lower plate 2.4 rotates around the hinge of the support plate 2.1 and the rocker plate 2.2 by screwing the adjusting top screw 2.6.

[0032] At least two long cap shafts 2.8 are rotatably connected to the support plate 2.1, and at least two short cap shafts 2.7 are rotatably connected to the rocker plate 2.2. The at least two long cap shafts 2.8 and the at least two short cap shafts 2.7 are respectively at the same horizontal height. The mounting groove 1.3 is further provided with a first through hole 1.4 and a second through hole 1.5. The short cap shaft 2.7 is positioned in the first through hole 1.4, and the long cap shaft 2.8 is positioned in the second through hole 1.5. The top of the short cap shaft 2.7 is lower than the adsorption surface, and the top of the long cap shaft 2.8 is higher than the adsorption surface. Preferably, the support plate 2.1 is provided with a mounting portion 2.11, and the upper plate 2.3 is provided with a groove 2.31 that cooperates with the mounting portion 2.11. The mounting portion 2.11 is provided with two long cap shafts 2.8, and the two long cap shafts 2.8 are symmetrically arranged on the mounting portion 2.11. The rocker plate 2.2 is provided with two short cap shafts 2.7, and the two short cap shafts 2.7 are symmetrically arranged on the rocker plate 2.2.

[0033] In the above embodiment, as a preference, bearings 3 are provided on both the support plate 2.1 and the rocker plate 2.2, and the long cap shaft 2.8 and the short cap shaft 2.7 are both sleeved in the bearings 3. The long cap shaft 2.8 and the short cap shaft 2.7 are rotatably connected to the support plate 2.1 and the rocker plate 2.2 respectively through the bearings 3. A fastening nut 4 is also provided at the end of the long cap shaft 2.8 and the short cap shaft 2.7 away from the adsorption surface to prevent the long cap shaft 2.8 and the short cap shaft 2.7 from falling off from the bearing 3.

[0034] The present invention is specifically used in the process, please refer to the attached Figure 7 -Attached Figure 8 As shown, when the small chip 5 is pre-aligned, the adjusting screw 2.6 is rotated inwardly with a tool, and the adjusting screw 2.6 moves downward on the support plate 2.1, and its end applies force to the abutment portion 2.41 of the lower plate 2.4, so that the lower plate 2.4 rotates around the hinge. During the rotation of the lower plate 2.4, the upper plate 2.3 and the rocker plate 2.2 are driven to rotate together, and at the same time, the compression spring 2.5 is squeezed, so that the compression spring 2.5 is in a compressed state, and the short cap shaft 2.7 moves along the first through hole 1.4 toward the adsorption surface of the suction cup 1, and finally the top of the short cap shaft 2.7 is higher than the adsorption surface of the suction cup 1. At this time, the structure of the alignment device 2 is as shown in the attached figure. Figure 7 As shown, finally, the small chip 5 can be placed on the first adsorption surface 1.1, and one side of the flat edge of the small chip 5 is abutted against the short cap shaft 2.7. Since the two short cap shafts 2.7 are at the same level in this embodiment, the flat edge of the small chip 5 can be in a horizontal position, thereby completing the pre-alignment of the small chip 5 (as shown in the attached figure). Figure 8 shown).

[0035] When it is necessary to pre-align the large wafer 6, use a tool to rotate the adjusting screw 2.6 outward. During the process of rotating the adjusting screw 2.6, the compression spring 2.5 releases its elastic force, so that the tilting block 2.2, the upper plate 2.3 and the lower plate 2.4 in the four-bar structure return to their initial positions. The short cap shaft 2.7 installed on the tilting block 2.2 retracts into the first through hole 1.4 of the suction cup 1, and the top of the short cap shaft 2.7 is again lower than the adsorption surface of the suction cup 1. At this time, the mechanism of the alignment device 2 is as shown in the attached figure. Figure 9 As shown, finally, the large wafer 6 can be placed on the second adsorption tank 1.2, and one side of the flat edge of the large wafer 6 is abutted against the long cap shaft 2.8. Similarly, the two long cap shafts 2.8 are at the same level, so that the flat edge of the large wafer 6 can be in a horizontal position, thereby completing the pre-alignment of the large wafer 6 (as shown in the attached figure). Figure 10 shown).

[0036] The above-described embodiments merely represent specific implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, and all such variations and improvements fall within the scope of protection of the present invention.

Claims

1. A pre-alignment device for multi-specification flat-edge wafers, characterized in that: The lifting mechanism comprises a lifting mechanism, and the lifting mechanism comprises a lifting mechanism, and the lifting mechanism comprises a lifting mechanism, and the lifting mechanism comprises a bottom end of a lifting mechanism, and a bottom end of a lifting mechanism. The lifting mechanism comprises a bottom end of a lifting mechanism, and a bottom end of a lifting mechanism. The lifting mechanism comprises a lifting mechanism, a lifting mechanism, a lifting mechanism and a bottom end of a lifting mechanism.

2. The pre-alignment device for multi-specification flat-edge wafers according to claim 1, characterized in that: An abutment portion is provided at one end of the lower plate, and the adjusting screw passes through the support plate and abuts against the surface of the abutment portion.

3. The pre-alignment device for multi-specification flat-edge wafers according to claim 1, characterized in that: The support plate is provided with a mounting portion, the long cap shaft is installed on the mounting portion, the mounting portion is also provided with a first mounting hole, the lower plate is provided with a second mounting hole, the compression spring is sleeved between the lower plate and the support plate through the first mounting hole and the second mounting hole, and the upper plate is provided with a groove that cooperates with the mounting portion.

4. The pre-alignment device for multi-specification flat-edge wafers according to claim 3, characterized in that: The mounting portion is provided with two long cap shafts, which are symmetrically arranged on the mounting portion; the seesaw is provided with two short cap shafts, which are symmetrically arranged on the seesaw.

5. The pre-alignment device for multi-specification flat-edge wafers according to claim 1, characterized in that: The support plate and the rocker are both sleeved with bearings, the long cap shaft and the short cap shaft are both sleeved in the bearings, the long cap shaft and the short cap shaft are respectively rotatably connected to the support plate and the rocker through the bearings, and a fastening nut is also provided at one end of the long cap shaft and the short cap shaft away from the adsorption surface.

6. The pre-alignment device for multi-specification flat-edge wafers according to claim 1, characterized in that: The two ends of the upper plate are respectively provided with a first hinge part, and the two ends of the lower plate are respectively provided with a second hinge part. The support plate and the rocker plate are hinged at the two ends of the upper plate and the lower plate through the first hinge part, the second hinge part and the pin.

7. The pre-alignment device for multi-specification flat-edge wafers according to claim 1, characterized in that: The suction cup is provided with a mounting groove, the alignment device is installed in the mounting groove, the mounting groove is also provided with a first through hole and a second through hole, the short cap shaft is placed in the first through hole, and the long cap shaft is placed in the second through hole.

8. The pre-alignment device for multi-specification flat-edge wafers according to claim 1, characterized in that: The surfaces of the first adsorption tank and the second adsorption tank are both provided with convex particles.

9. The pre-alignment device for multi-specification flat-edge wafers according to claim 1, characterized in that: The suction cup is also provided with a fixing hole for installing the suction cup.

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