Inverter circuit board fixing structure

Abstract

The present application relates to the technical field of inverter circuit boards, and more particularly to an inverter circuit board fixing structure, comprising a chassis housing and a circuit board disposed within the chassis housing. A limiting mechanism is disposed within the chassis housing, the limiting mechanism comprising a support member and a limiting member, the support member being disposed within the chassis housing, a clamping block being disposed on a side of the limiting member proximate to the support member, the clamping block being clamped to the support member, and the circuit board being positioned between the support member and the limiting member. The present application has the effect of reducing the possibility of a reduction in the space available for wiring of the circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of inverter circuit boards, and in particular to an inverter circuit board fixing structure. Background Art

[0002] Currently, an inverter is a converter that converts DC power into constant-frequency, constant-voltage, or frequency-modulated, voltage-regulated AC power. An inverter primarily consists of two parts: the inverter housing and a printed circuit board (PCB). The PCB houses the inverter circuitry. The inverter housing typically includes several support columns to support the PCB, with screw holes provided on the columns and corresponding through-holes on the PCB. During installation, the PCB is placed inside the inverter housing, aligning the through-holes with the screw holes on the support columns. The PCB is then secured with screws, securing it directly to the interior of the inverter housing.

[0003] Regarding the above-mentioned related technologies: the circuit board and the inverter housing are fixed with screws, which requires opening a through hole on the circuit board, thereby reducing the wiring space of the circuit board. Summary of the Invention

[0004] In order to reduce the possibility of reduction in the wiring space of the circuit board, the present application provides an inverter circuit board fixing structure.

[0005] The present application provides an inverter circuit board fixing structure, which adopts the following technical solutions:

[0006] An inverter circuit board fixing structure includes a chassis shell and a circuit board arranged in the chassis shell. A limiting mechanism is provided in the chassis shell. The limiting mechanism includes a support member and a limiting member. The support member is provided in the chassis shell. A clamping block is provided on a side of the limiting member close to the support member. The clamping block is clamped with the support member, and the circuit board is located between the support member and the limiting member.

[0007] By adopting the above technical solution, the clamping block is clamped with the support member, which makes it easy to connect and fix the support member and the limiting member. The support member and the limiting member cooperate with each other to clamp and fix the circuit board, thereby facilitating the installation of the circuit board in the chassis shell, reducing the possibility of a reduction in the wiring space of the circuit board to a certain extent.

[0008] Optionally, a limiting groove is provided at one end of the support member away from the chassis shell, the inner wall of the limiting groove is provided with a first anti-slip groove, and the clamping block is provided with a second anti-slip groove. The clamping block is inserted into the limiting groove, and the first anti-slip groove and the second anti-slip groove are engaged with each other.

[0009] By adopting the above technical solution, the provision of the first anti-slip groove and the second anti-slip groove makes it difficult for the clamping block to separate from the limiting groove, thereby facilitating the improvement of the connection stability between the limiting member and the supporting member.

[0010] Optionally, a buffer gasket is provided on the side where the support member and the limiting member are close to each other.

[0011] By adopting the above technical solution, the buffer gasket is located between the circuit board and the support member and between the circuit board and the limit member, which is convenient for buffering the circuit board, thereby helping to reduce the possibility of damage to the connection between the circuit board and the support member and the limit member.

[0012] Optionally, a plurality of the limiting mechanisms are provided, and the plurality of limiting mechanisms are respectively provided in the chassis shell, and the plurality of limiting mechanisms are respectively connected to the circuit board.

[0013] By adopting the above technical solution, multiple limiting mechanisms jointly limit the circuit board, which is beneficial to improving the connection stability between the circuit board and the chassis shell.

[0014] Optionally, a cooling and heat dissipation mechanism is included, which includes a first heat conductive plate, which is arranged in the chassis shell, one end of the first heat conductive plate passes through the chassis shell, and the other end of the first heat conductive plate is attached to the circuit board.

[0015] By adopting the above technical solution, the first heat conducting sheet can conduct the heat on the circuit board to the outside of the chassis shell, thereby helping to reduce the possibility of overheating and failure of the circuit board.

[0016] Optionally, a plurality of the first heat conducting sheets are provided, and the plurality of the first heat conducting sheets are evenly distributed in the chassis shell, and the plurality of the first heat conducting sheets are respectively attached to the circuit board.

[0017] By adopting the above technical solution, multiple first heat conducting plates cooperate with each other to conduct and dissipate heat to different positions of the circuit board, thereby facilitating uniform heat dissipation of the circuit board and further reducing the possibility of overheating and failure of the circuit board.

[0018] Optionally, the cooling and heat dissipation mechanism includes a condensing pipe and a driving component, the condensing pipe is close to the first heat conducting plate and is attached to the circuit board, a receiving cavity is opened in the support member, the receiving cavity is connected to the condensing pipe, and coolant is stored in the receiving cavity, the driving component is arranged in the receiving cavity, and the driving component is used to drive the coolant to circulate in the receiving cavity and the condensing pipe.

[0019] By adopting the above technical solution, the driving component can drive the coolant to circulate in the accommodating cavity and the condensation pipe, thereby facilitating cooling of the circuit board, and further helping to reduce the possibility of overheating and failure of the circuit board.

[0020] Optionally, the driving assembly includes a sealing plate and an elastic member, the sealing plate is slidably inserted in the accommodating cavity and seals the accommodating cavity, the sealing plate is used to seal the coolant at one end of the accommodating cavity that is connected to the condensation pipe, the elastic member is arranged in the accommodating cavity and connected to the side of the sealing plate away from the coolant, and the elastic member is used to drive the sealing plate to slide in the accommodating cavity so that the coolant circulates in the accommodating cavity and the condensation pipe.

[0021] By adopting the above technical solution, the elastic member can drive the sealing plate to move in the accommodating cavity, thereby facilitating driving the coolant in the accommodating cavity to flow into the condensation pipe, and further facilitating the circulation of the coolant in the accommodating cavity and the condensation pipe.

[0022] Optionally, the elastic member is made of a memory alloy, and the driving assembly also includes a second heat conducting plate, which includes a heat conducting portion and a heat transfer portion located at opposite ends of the heat conducting portion, the heat transfer portion is inserted into the accommodating cavity and connected to the support member, the heat conducting portion is connected to the first heat conducting plate, and the end of the elastic member away from the sealing plate is connected to the heat transfer portion.

[0023] By adopting the above technical solution, the heat conducting part is connected to the first heat conducting plate, so that the heat extracted from the circuit board by the first heat conducting plate can be transferred to the heat transfer part through the heat conducting part, and the heat is transferred to the elastic part through the heat transfer part, thereby heating the elastic part and causing the elastic part to deform, thereby facilitating the use of the elastic part to push the sealing plate to move in the accommodating cavity, and further facilitating the cooling liquid to circulate in the accommodating cavity and the condensation pipe when the heat generated by the circuit board is excessive.

[0024] Optionally, the elastic member has a two-way shape memory effect, and the elastic member can drive the blocking plate to reciprocate in the accommodating cavity.

[0025] By adopting the above technical solution, the elastic part is a memory alloy with a two-way shape memory effect, so that the elastic part can repeatedly deform between two shapes according to the increase or decrease in temperature, which is conducive to driving the sealing plate to move back and forth in the accommodating cavity, and to a certain extent facilitates driving the coolant to circulate in the accommodating cavity and the condensation pipe.

[0026] In summary, this application includes at least one of the following beneficial technical effects:

[0027] 1. Through the mutual cooperation of the support member, the first anti-slip groove, the abutment block, the limit block and the second anti-slip groove, the circuit board can be clamped between the support member and the abutment block, thereby facilitating the fixing of the circuit board in the chassis housing, thereby facilitating the possibility of reducing the space available for wiring of the circuit board;

[0028] 2. Through the mutual cooperation of the support member, the first heat conducting sheet, the heat conducting portion, the heat transfer portion, the condensation pipe, the elastic member and the blocking plate, part of the heat on the circuit board can be dissipated out of the chassis shell, and the other part can be used to heat the elastic member, causing the elastic member to deform and drive the blocking plate to move in the accommodating cavity, thereby facilitating the circulation of the coolant in the accommodating cavity and the condensation pipe, thereby facilitating the cooling of the electric heating plate and reducing the possibility of overheating and failure of the circuit board to a certain extent;

[0029] 3. The elastic member is made of a memory alloy with a two-way shape memory effect, so that the elastic member can deform repeatedly between two shapes according to the increase or decrease in temperature, thereby facilitating the sealing plate to perform reciprocating motion in the accommodating cavity, and further facilitating the coolant to circulate in the accommodating cavity and the condensation pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of the inverter circuit board fixing structure of an embodiment of the present application.

[0031] Figure 2 It is a schematic diagram of the exploded structure of the inverter circuit board fixing structure of an embodiment of the present application.

[0032] Figure 3 yes Figure 1 Sectional view along line AA.

[0033] Figure 4 yes Figure 3 A partial enlarged view of point B in the middle.

[0034] Description of reference numerals:

[0035] 1. Chassis shell; 2. Circuit board; 3. Limiting mechanism; 31. Support member; 311. Limiting groove; 312. First anti-slip groove; 313. Accommodating cavity; 32. Limiting member; 321. Clamping block; 322. Second anti-slip groove; 33. Buffer gasket; 4. Cooling and heat dissipation mechanism; 41. First heat conducting plate; 42. Condensation pipe; 43. Drive assembly; 431. Sealing plate; 432. Elastic member; 433. Second heat conducting plate; 4331. Heat conducting part; 4332. Heat transfer part. DETAILED DESCRIPTION

[0036] The following is combined with Figure 1-4 This application is described in further detail.

[0037] An embodiment of the present application discloses an inverter circuit board fixing structure.

[0038] Reference Figure 1 The inverter circuit board fixing structure includes a chassis housing 1, a circuit board 2, a limiting mechanism 3, and a cooling and heat dissipation mechanism 4. The limiting mechanism 3 and the cooling and heat dissipation mechanism 4 are respectively fixedly mounted within the chassis housing 1. The limiting mechanism 3 is used to clamp the circuit board 2 within the chassis housing 1, thereby eliminating the need for openings in the circuit board 2. This helps reduce the possibility of openings in the circuit board 2, which would otherwise reduce the space available for wiring on the circuit board 2.

[0039] Reference Figure 2 There are multiple limiting mechanisms 3. In this embodiment, there are four limiting mechanisms 3. The four limiting mechanisms 3 are distributed in a rectangular array in the chassis shell 1, so that the four limiting mechanisms 3 can respectively support and limit different positions of the circuit board 2, which is beneficial to improve the connection stability between the circuit board 2 and the chassis shell 1.

[0040] Reference Figure 3 and Figure 4 The limiting mechanism 3 includes a support member 31 and a limiting member 32, wherein the support member 31 is fixedly connected to the chassis shell 1, and a limiting groove 311 is opened at one end of the support member 31 away from the chassis shell 1, and a first anti-slip pattern 312 is fixedly connected to the inner wall of the limiting groove 311.

[0041] Reference Figure 4 A clamping block 321 is fixedly connected to the side of the limiting member 32 near the support member 31, and a second anti-slip groove 322 is fixedly connected to the clamping block 321. When the clamping block 321 is inserted into the limiting groove 311, the first anti-slip groove 312 and the second anti-slip groove 322 can engage with each other, thereby confining the clamping block 321 within the limiting groove 311, making it difficult for the clamping block 321 to escape from the limiting groove 311, thereby facilitating the connection and fixation of the limiting frame to the support member 31.

[0042] Reference Figure 4 When the circuit board 2 needs to be fixed in the chassis shell 1, the circuit board 2 is first placed on the support member 31, and then the clamping block 321 is inserted into the limiting groove 311. At this time, the limiting member 32 presses against the circuit board 2, so that the support member 31 and the limiting member 32 clamp the circuit board 2, thereby facilitating the clamping and fixing of the circuit board 2 in the chassis shell 1.

[0043] Reference Figure 4A buffering pad 33 is connected to the side where the support member 31 and the stopper 32 are adjacent to each other. In this embodiment, the buffering pad 33 is made of thermally conductive rubber. When the support member 31 and the stopper 32 clamp the circuit board 2, the buffering pad 33 is located between the support member 31 and the circuit board 2, and between the stopper 32 and the circuit board 2, thereby facilitating cushioning of the circuit board 2 and reducing the possibility of damage to the connection between the circuit board 2, the support member 31, and the stopper 32.

[0044] Reference Figure 4 The cooling and heat dissipation mechanism 4 includes a first heat conducting plate 41, a condensation pipe 42 and a driving assembly 43. The first heat conducting plate 41 is fixedly installed in the chassis shell 1, and one end of the first heat conducting plate 41 is arranged outside the chassis shell 1.

[0045] When the circuit board 2 is installed in the chassis shell 1, one end of the first heat conductive sheet 41 located in the chassis shell 1 is attached to the circuit board 2, so that the first heat conductive sheet 41 can be used to dissipate heat from the circuit board 2 into the chassis shell 1, thereby helping to reduce the possibility of overheating and failure of the circuit board 2.

[0046] A plurality of first heat conducting sheets 41 are provided, evenly distributed within the chassis housing 1, with adjacent first heat conducting sheets 41 spaced apart from one another. The plurality of first heat conducting sheets 41 are respectively attached to the circuit board 2, allowing the plurality of first heat conducting sheets 41 to conduct heat from different locations on the circuit board 2 to the outside of the chassis, thereby facilitating uniform heat dissipation from the circuit board 2.

[0047] Reference Figure 4 The support member 31 defines a receiving cavity 313, which stores coolant. Condensation ducts 42 are distributed within the chassis housing 1 and interspersed between the plurality of first heat conducting plates 41. The condensation ducts 42 are in communication with the receiving cavities 313 within the plurality of support members 31, respectively, so that the coolant within the receiving cavities 313 can flow into the condensation ducts 42.

[0048] In this embodiment, the cooling liquid does not fill the accommodating cavity 313 and the condensing pipe 42 , thereby facilitating the cooling liquid to circulate between the accommodating cavity 313 and the condensing pipe 42 .

[0049] When the circuit board 2 is installed in the chassis housing 1, the condensation duct 42 is also attached to the circuit board 2, so that the condensation duct 42 can support the circuit board 2, which helps to reduce the possibility of deformation of the circuit board 2 to a certain extent. In addition, the coolant flowing in the condensation duct 42 can cool the circuit board 2, thereby helping to reduce the possibility of overheating and failure of the circuit board 2.

[0050] Reference Figure 4The drive assembly 43 includes a blocking plate 431, an elastic member 432, and a second heat conducting plate 433. The blocking plate 431 is slidably inserted into the accommodating cavity 313 and can block the accommodating cavity 313 to seal the coolant in the accommodating cavity 313 at the end of the accommodating cavity 313 that is connected to the condensation pipe 42.

[0051] Reference Figure 4 The second heat conducting sheet 433 includes a heat conducting portion 4331 and heat transfer portions 4332 located at opposite ends of the heat conducting portion 4331. The heat conducting portion 4331 is connected to the plurality of first heat conducting sheets 41, allowing heat transferred from the circuit board 2 by the plurality of first heat conducting sheets 41 to the heat conducting portion 4331, thereby facilitating heat dissipation by the heat conducting portion 4331. The heat transfer portion 4332 is inserted into the accommodating cavity 313 and fixedly connected to the support member 31. The heat transfer portion 4332 is located on the side of the sealing plate 431 facing away from the coolant.

[0052] Reference Figure 4 The elastic member 432 is disposed within the accommodating cavity 313 and is located between the sealing plate 431 and the heat transfer portion 4332. The elastic member 432 is connected to the sealing plate 431 and the heat transfer portion 4332, respectively. In this embodiment, the elastic member 432 is made of a memory alloy having a two-way shape memory effect and is a spring.

[0053] The two-way shape memory effect refers to the phenomenon that a component made of a memory alloy can deform repeatedly between two shapes when repeatedly heated and cooled under the action of external stress.

[0054] In this embodiment, when the elastic member 432 is heated to a corresponding temperature, the elastic member 432 will stretch, and when the elastic member 432 is cooled to a corresponding temperature, the elastic member 432 will contract.

[0055] Reference Figure 4 When there is too much heat on the circuit board 2, the first heat conducting sheet 41 transfers too much heat to the heat transfer part 4332 through the heat conduction part 4331, causing the temperature of the heat transfer part 4332 to rise, and the heat transfer part 4332 heats the elastic member 432.

[0056] Reference Figure 4 When the elastic member 432 is heated to the corresponding temperature, the elastic member 432 extends, so that the elastic member 432 pushes the sealing plate 431 to move in the direction away from the heat transfer portion 4332 in the accommodating cavity 313, so that the sealing plate 431 pushes the coolant to flow from the accommodating cavity 313 to the condensation pipe 42, thereby reducing the temperature of the condensation pipe 42. The condensation pipe 42 cools the circuit board 2, thereby reducing the possibility of overheating and failure of the circuit board 2 to a certain extent.

[0057] When the temperature of the circuit board 2 drops to a certain level, the temperatures of the first heat conducting sheet 41, the heat conducting portion 4331, and the heat transfer portion 4332 also drop accordingly, thereby lowering the temperature of the elastic member 432. This in turn causes the elastic member 432 to contract, driving the sealing plate 431 toward the heat transfer portion 4332. At this point, the volume of the accommodating chamber 313 increases, causing the coolant in the condensation pipe 42 to flow back into the accommodating chamber 313 for storage.

[0058] The elastic member 432 can deform repeatedly between two shapes according to the increase or decrease of its own temperature, which is conducive to driving the sealing plate 431 to move back and forth in the accommodating cavity 313, and then driving the coolant to circulate in the accommodating cavity 313 and the condensation pipe 42, so as to facilitate cooling of the circuit board 2.

[0059] In this embodiment, a plurality of elastic members 432 are provided in the same accommodating cavity 313 . The plurality of elastic members 432 cooperate with each other to facilitate driving the blocking plate 431 to move in the accommodating cavity 313 .

[0060] Reference Figure 2 After the coolant absorbs heat and evaporates, the steam can condense on the inner wall of the condensation pipe 42 and the accommodating chamber 313 that is not filled with coolant, and flow back into the accommodating chamber 313 and the condensation pipe 42, thereby facilitating the recycling of the coolant.

[0061] The implementation principle of the inverter circuit board fixing structure according to the embodiment of the present application is as follows: when the circuit board 2 needs to be fixed in the chassis housing 1, the circuit board 2 is first placed on the support member 31, and then the clamping block 321 is inserted into the limiting groove 311, so that the limiting member 32 and the support member 31 clamp the circuit board 2. The above steps are repeated, and the remaining three clamping blocks 321 are respectively inserted into the corresponding limiting grooves 311, so that the four limiting members 32 are respectively pressed against the circuit board 2, thereby stably installing the circuit board 2 in the chassis housing 1.

[0062] An inverter circuit board fixing structure in an embodiment of the present application, through the mutual cooperation of the support member 31, the limit member 32 and the clamping block 321, can be connected and fixed to the chassis housing 1 without having to open a hole in the circuit board 2, thereby reducing the possibility of opening a hole in the circuit board 2 and resulting in a reduction in the wiring space of the circuit board 2.

[0063] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An inverter circuit board fixing structure, comprising a chassis shell (1) and a circuit board (2) arranged in the chassis shell (1), characterized in that: A limiting mechanism (3) is provided in the chassis shell (1), the limiting mechanism (3) comprising a support member (31) and a limiting member (32), the support member (31) being provided in the chassis shell (1), a clamping block (321) being provided on a side of the limiting member (32) close to the support member (31), the clamping block (321) being clamped to the support member (31), and the circuit board (2) being located between the support member (31) and the limiting member (32); The cooling and heat dissipation mechanism (4) includes a first heat conducting plate (41), the first heat conducting plate (41) is arranged in the chassis shell (1), one end of the first heat conducting plate (41) passes through the chassis shell (1), and the other end of the first heat conducting plate (41) is in contact with the circuit board (2); The cooling and heat dissipation mechanism (4) further includes a condensing pipe (42) and a driving assembly (43), wherein the condensing pipe (42) is close to the first heat conducting plate (41) and is in contact with the circuit board (2), a receiving cavity (313) is provided in the support member (31), the receiving cavity (313) is communicated with the condensing pipe (42), a cooling liquid is stored in the receiving cavity (313), and the driving assembly (43) is arranged in the receiving cavity (313), and the driving assembly (43) is used to drive the cooling liquid to circulate in the receiving cavity (313) and the condensing pipe (42); The driving assembly (43) includes a blocking plate (431) and an elastic member (432), wherein the blocking plate (431) is slidably inserted into the accommodating cavity (313) and seals the accommodating cavity (313), and the blocking plate (431) is used to block the coolant at one end of the accommodating cavity (313) that is connected to the condensation pipe (42), and the elastic member (432) is arranged in the accommodating cavity (313) and connected to a side of the blocking plate (431) that is away from the coolant, and the elastic member (432) is used to drive the blocking plate (431) to slide in the accommodating cavity (313) so that the coolant circulates in the accommodating cavity (313) and the condensation pipe (42).

2. The inverter circuit board fixing structure according to claim 1, characterized in that: A limiting groove (311) is provided at one end of the support member (31) away from the chassis housing (1); a first anti-slip groove (312) is provided on the inner wall of the limiting groove (311); a second anti-slip groove (322) is provided on the clamping block (321); the clamping block (321) is inserted into the limiting groove (311); the first anti-slip groove (312) and the second anti-slip groove (322) are engaged with each other.

3. The inverter circuit board fixing structure according to claim 1, wherein: A buffer gasket (33) is provided on the side where the support member (31) and the limiting member (32) are close to each other.

4. The inverter circuit board fixing structure according to claim 1, wherein: A plurality of the limiting mechanisms (3) are provided, and the plurality of limiting mechanisms (3) are respectively provided in the chassis shell (1), and the plurality of limiting mechanisms (3) are respectively connected to the circuit board (2).

5. The inverter circuit board fixing structure according to claim 1, characterized in that: A plurality of the first heat conducting sheets (41) are provided, the plurality of the first heat conducting sheets (41) are evenly distributed in the chassis shell (1), and the plurality of the first heat conducting sheets (41) are respectively attached to the circuit board (2).

6. The inverter circuit board fixing structure according to claim 1, wherein: The elastic member (432) is made of a memory alloy. The driving assembly (43) further includes a second heat conducting plate (433), which includes a heat conducting portion (4331) and a heat transfer portion (4332) located at opposite ends of the heat conducting portion (4331). The heat transfer portion (4332) is inserted into the accommodating cavity (313) and connected to the support member (31). The heat conducting portion (4331) is connected to the first heat conducting plate (41). The end of the elastic member (432) away from the sealing plate (431) is connected to the heat transfer portion (4332).

7. The inverter circuit board fixing structure according to claim 6, characterized in that: The elastic member (432) has a two-way shape memory effect, and the elastic member (432) can drive the blocking plate (431) to reciprocate in the accommodating cavity (313).

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