Gas-liquid separated heat uniform plate fin integrated structure

Abstract

The application discloses a vapor-liquid flow separation integrated structure of a vapor chamber fin, and relates to the field of electronic equipment thermal management.The structure is mainly composed of an integrated vapor chamber substrate and a heat dissipation fin, and the vapor chamber substrate and the heat dissipation fin are internally provided with the same cavity.A plurality of vapor-liquid baffles are arranged in the heat dissipation fin, the internal cavity of the heat dissipation fin is divided into a gas flow channel and a liquid flow channel, the liquid flow channel is inserted into a liquid pool, and the gas flow channel is located above the liquid pool.A liquid collecting ring and a liquid returning hole are arranged on the vapor-liquid baffle, condensed liquid is collected on the liquid collecting ring and returns to the liquid flow channel through the liquid returning hole, and vapor-liquid flow separation is realized.The integrated structure of the vapor chamber fin is adopted, the vapor chamber substrate serves as an evaporator, and the heat dissipation fin directly serves as a condenser, so that the contact thermal resistance caused by welding is avoided, and the fin efficiency and the heat dissipation performance are greatly improved.In addition, the special structure is adopted to realize vapor-liquid flow separation, the problem of steam carrying condensed liquid is avoided, the thickness of the condensed liquid film is reduced, and the condensation performance is enhanced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electronic equipment heat management, and is suitable for ground electronic equipment heat dissipation. BACKGROUND

[0002] As a new two-phase flow heat dissipation technology, the heat sink has the advantages of high thermal conductivity, good temperature uniformity, and reversible heat flow direction, and overcomes the problems of small contact area, large thermal resistance, and uneven heat flux density of traditional heat pipes, and has become one of the effective ways to solve the heat dissipation of high heat flux density electronic devices in future electronic industry. The heat dissipation structure composed of the heat sink and the heat dissipation fin can further improve the heat dissipation capacity.

[0003] The existing technology has a combination of heat sink and heat dissipation fin, which is generally as follows: the heat dissipation fin substrate is welded with the heat sink, as shown in FIG. Figure 1 The heat sink absorbs the heat emitted by the heat source, and the heat dissipation fin welded with the heat sink immediately dissipates the heat. However, the structure has the following problems: 1) the structure of the heat sink and the heat dissipation fin substrate has contact thermal resistance, which reduces the heat exchange performance; 2) the heat dissipation process of the heat dissipation fin is heat conduction, and with the increase of the height of the fin, the heat dissipation efficiency of the fin is greatly reduced.

[0004] If the fin is improved to a hollow structure to directly act as a condenser, the upward steam and the downward condensate will flow in reverse in the narrow fin cavity, the steam will carry the condensate upward, hinder the return of the condensate, increase the thickness of the liquid film, reduce the heat exchange performance, and may appear the carrying limit.

[0005] In summary, the existing technology lacks a heat dissipation structure of heat sink and heat dissipation fin combination, which can avoid the contact thermal resistance between the heat sink and the heat dissipation fin, ensure high fin efficiency, and prevent gas-liquid carrying in the heat dissipation fin cavity. SUMMARY

[0006] The present application discloses a gas-liquid separated heat sink fin integrated structure, which is mainly composed of an integrated heat sink substrate and a heat dissipation fin, and the heat sink substrate and the heat dissipation fin are provided with the same cavity inside. The heat dissipation fin is provided with a plurality of gas-liquid partition plates, which divide the internal cavity of the heat dissipation fin into a gas flow channel and a liquid flow channel. The liquid flow channel is inserted into the liquid pool, and the gas flow channel is located above the liquid pool. A liquid collecting ring and a liquid returning hole are arranged on the gas-liquid partition plate. The condensate is collected in the liquid collecting ring and returned to the liquid flow channel through the liquid returning hole, so as to realize the separation of gas and liquid flow. The present application adopts the heat sink fin integrated structure, the heat sink substrate acts as an evaporator, and the heat dissipation fin directly acts as a condenser, which avoids the contact thermal resistance caused by welding, and greatly improves the fin efficiency and the heat dissipation performance. In addition, the special structure is adopted to realize the gas-liquid separation, avoid the problem of steam carrying condensate, reduce the thickness of the condensate film, and enhance the condensation performance.

[0007] To achieve the above object, the present application adopts the following technical solutions:

[0008] The gas-liquid separated heat uniform plate fin integrated structure is characterized in that: a plurality of heat dissipation fins are arranged equidistantly on the upper part of the heat uniform substrate, the heat uniform substrate and the heat dissipation fin are integrally formed, and a cavity which is in communication with each other is arranged inside; a certain phase change working medium is filled in the cavity, and the phase change working medium forms a liquid pool at the lower part of the heat uniform substrate; a plurality of gas-liquid partition plates are arranged in the heat dissipation fin, and the cavity inside the heat dissipation fin is divided into a plurality of gas flow channels and liquid flow channels which are staggered in sequence in the length direction of the fin; a liquid collecting ring is arranged equidistantly in the gas flow channel, and the root of the liquid collecting ring surrounds the gas flow channel and has a horn mouth shape; a backflow hole is arranged at the liquid collecting position of the root of the liquid collecting ring on the gas-liquid partition plate, and the backflow hole is in communication with the gas flow channel and the liquid flow channel; the bottom end of the liquid flow channel is located inside the liquid pool, and the gas flow channel is located at the upper part of the liquid pool.

[0009] In operation, the heat uniform substrate is an evaporator, and the heat dissipation fin is a condenser; the working medium inside the heat uniform substrate absorbs heat and evaporates into a gaseous state, the gaseous working medium above the liquid pool directly enters the gas flow channel inside the heat dissipation fin, and gradually condenses into liquid working medium in the gas flow channel; the liquid working medium is collected in the liquid collecting ring and flows back to the liquid flow channel through the backflow hole, and flows back to the lower part of the liquid pool under the action of gravity, thereby completing the heat transfer process.

[0010] Further, the heat dissipation fin is a rectangular rib, a cylindrical rib or a triangular rib; since the rib itself has good isothermal performance as a condenser, the rib efficiency does not decrease with the increase of the rib height, and the rib height can be very high.

[0011] Further, a liquid absorbing core is arranged in the heat uniform substrate, and the liquid absorbing core can be a sintered core or a wire mesh structure.

[0012] Further, a reinforcing rib is arranged in the heat uniform substrate to ensure the pressure bearing capacity of the structure.

[0013] Further, the phase change working medium of the liquid pool can be R134a, R22, acetone or water.

[0014] Further, a filling port is arranged on the side surface of the heat uniform substrate.

[0015] The present application has the following beneficial effects:

[0016] (1) The heat uniform plate fin integrated structure can avoid the contact thermal resistance caused by the welding of the heat uniform plate and the heat dissipation fin substrate.

[0017] (2) The fin directly serves as a condenser for phase change heat transfer, has excellent isothermal performance, and the fin efficiency does not decrease with the increase of the fin height, thereby ensuring high fin efficiency and excellent heat transfer performance.

[0018] (3) The hollow structure inside the fin can improve the heat transfer performance of the fin in the direction perpendicular to the temperature equalizing plate;

[0019] (4) The special structure can realize gas-liquid separation, avoid steam carrying condensed liquid, and realize smooth return flow of the condensed liquid;

[0020] (5) Multiple liquid collecting rings are arranged along the return flow direction of the condensed liquid, so that the liquid film thickness is reduced, and the condensation heat transfer performance is improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0022] Figure 1 It is a schematic view of the welding of the heat dissipation fin and the temperature equalizing plate in the prior art;

[0023] Figure 2 It is a sectional view of the fin in the direction perpendicular to the fin of the present application;

[0024] Figure 3 It is a sectional view of the fin in the direction along the fin of the present application;

[0025] Figure 4 It is a sectional view of the fin in the direction perpendicular to the bottom surface of the temperature equalizing plate of the present application;

[0026] Figure 5 It is a three-dimensional overall appearance view of the present application;

[0027] Figure 6 It is a three-dimensional sectional view in the direction perpendicular to the fin plane of the present application;

[0028] Figure 7 It is a curve graph of the fin efficiency and the fin height relationship

[0029] Figure 8 It is a schematic view of the condensed liquid film thickness

[0030] In the drawings, 1 is a temperature equalizing base plate, 2 is a heat dissipation fin, 3 is a liquid pool, 4 is a gas-liquid partition plate, 5 is a gas flow channel, 6 is a liquid flow channel, 7 is a cavity, 8 is a return flow hole, 9 is a liquid collecting ring, and 10 is a filling port. DETAILED DESCRIPTION

[0031] In order to make those skilled in the art better understand the technical solutions of the present application, the present application will be further described in detail in combination with specific embodiments.

[0032] The temperature equalizing plate fin integrated structure with gas-liquid separation is as follows: Figure 2As shown, a plurality of heat dissipation fins 2 are equidistantly arranged on the upper part of the uniform temperature substrate 1, the uniform temperature substrate 1 and the heat dissipation fins 2 are integrally formed, and the internal cavities 7 are arranged in communication with each other; the internal cavities 7 are filled with a certain phase change working medium, and the phase change working medium forms a liquid pool 3 at the lower part of the uniform temperature substrate 1; a plurality of gas-liquid baffles 4 are arranged in the heat dissipation fins 2, and the internal cavities 7 in the heat dissipation fins 2 are divided into a plurality of gas flow channels 5 and liquid flow channels 6 which are staggered in sequence in the length direction of the fins; a liquid collecting ring 9 is equidistantly arranged in the gas flow channel 5, and the root of the liquid collecting ring 9 surrounds the gas flow channel 5 and has a horn mouth shape; a backflow hole 8 is arranged at the root of the liquid collecting ring 9 where the liquid is collected on the gas-liquid baffle 4, and the backflow hole 8 communicates the gas flow channel 5 and the liquid flow channel 6; the bottom end of the liquid flow channel 6 is located in the internal liquid pool 3, and the gas flow channel 5 is located above the liquid pool 3.

[0033] In operation, the uniform temperature substrate 1 is an evaporator, and the heat dissipation fins 2 are a condenser; the working medium in the internal uniform temperature substrate 1 absorbs heat and evaporates into a gaseous state, and the gaseous working medium above the liquid pool 3 directly enters the gas flow channel 5 in the internal heat dissipation fins 2 and gradually condenses into liquid working medium therein; the liquid working medium is collected in the liquid collecting ring 9 and flows back to the liquid flow channel 6 through the backflow hole 8 and flows back to the lower part of the liquid pool 3 under the action of gravity, thereby completing the heat transfer process.

[0034] As shown in Figure 3 the backflow hole 8 is arranged at the root of the liquid collecting ring 9 where the liquid is collected on the gas-liquid baffle 4, and the bottom end of the gas-liquid baffle 4 is located below the liquid surface of the liquid pool 3.

[0035] As shown in Figure 4 the root of the liquid collecting ring 9 surrounds the gas flow channel 5, the condensed liquid is collected at the root of the liquid collecting ring 9 and enters the liquid channel through the backflow hole 8.

[0036] As shown in Figure 5 a filling port 10 is arranged on the side of the uniform temperature substrate 1.

[0037] As shown in Figure 6 the cross-sectional view of the vertical fin plane of the present application shows the three-dimensional structure of the uniform temperature substrate 1, the liquid collecting ring 9, the gas-liquid baffle 4, the backflow hole 8, the gas flow channel 5 and the liquid flow channel 6, and the structural details of the liquid collecting ring 9, the gas-liquid baffle 4 and the backflow hole 8 are given.

[0038] The fin efficiency and fin height relationship shows that the rib itself as a condenser has good isothermal performance, and the rib efficiency does not decrease with the decrease of the rib height, as shown by the solid line, and the rib height can be very high; while the efficiency of the traditional rib decreases with the increase of the fin height, as shown by the dotted line. Figure 7 Figure 7

[0039] ​​The liquid film thickness is reduced: the present application sets multiple liquid collecting rings along the condensate backflow direction in the gas flow channel, so that the liquid film thickness is reduced, as shown in Figure 8 (Left), improving the condensation heat transfer performance; while the liquid film thickness of the condensation wall surface without the liquid collecting ring device gradually thickens, as shown in Figure 8 (Right), the condensation heat transfer performance deteriorates.

[0040] The present application has the following beneficial effects:

[0041] (1) The integrated structure of the vapor chamber fin can avoid the contact thermal resistance generated by the welding of the vapor chamber and the heat dissipation fin substrate;

[0042] (2) The fin directly serves as a condenser for phase change heat transfer, has excellent isothermality, and the fin efficiency does not decrease with the increase of fin height, thereby ensuring high fin efficiency and excellent heat transfer performance.

[0043] (3) The hollow structure inside the fin can improve the heat transfer performance of the fin perpendicular to the vapor chamber;

[0044] (4) The special structure realizes gas-liquid separation and avoids steam carrying condensate, so as to realize the smooth backflow of the condensate;

[0045] (5) Multiple liquid collecting rings are set along the condensate backflow direction, so that the liquid film thickness is reduced, and the condensation heat transfer performance is improved.

[0046] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any changes or replacements within the technical range disclosed by the present application can be easily thought of by those skilled in the art, and should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A vapor-liquid-divided isothermal plate fin integrated structure, characterized by, The application relates to a heat-dissipating device, which comprises an isothermal substrate (1), a plurality of heat-dissipating fins (2) arranged equidistantly on the upper portion of the isothermal substrate (1), and a plurality of cavities (7) arranged in the isothermal substrate (1) and the heat-dissipating fins (2) and integrated into the isothermal substrate (1) and the heat-dissipating fins (2); the cavities (7) are filled with a certain phase-change working medium, the phase-change working medium forms a liquid pool (3) at the lower portion of the isothermal substrate (1); a plurality of gas-liquid baffles (4) are arranged in the heat-dissipating fins (2), the cavities (7) in the heat-dissipating fins (2) are divided into a plurality of gas flow channels (5) and liquid flow channels (6) which are staggered in the length direction of the fins; a liquid collecting ring (9) is arranged equidistantly in the gas flow channel (5), the root of the liquid collecting ring (9) surrounds the gas flow channel (5) and has a trumpet shape; a backflow hole (8) is arranged at the root of the liquid collecting ring (9) on the gas-liquid baffle (4) and is used for connecting the gas flow channel (5) and the liquid flow channel (6); the bottom end of the liquid flow channel (6) is located in the liquid pool (3), and the gas flow channel (5) is located above the liquid pool (3); during operation, the isothermal substrate (1) is used as an evaporator, and the heat-dissipating fin (2) is used as a condenser; the working medium in the isothermal substrate (1) absorbs heat and evaporates into a gaseous state, the gaseous working medium above the liquid pool (3) directly enters the gas flow channel (5) in the heat-dissipating fin (2) and gradually condenses into liquid working medium; the liquid working medium is collected in the liquid collecting ring (9) and flows back to the liquid flow channel (6) through the backflow hole (8) and then flows back to the liquid pool (3) under the action of gravity, so that the heat transfer process is completed.

2. The vapor-liquid flow-dividing, vapor chamber fin-integrated structure of claim 1, wherein: The heat-dissipating fin (2) is one or more of a rectangular rib, a cylindrical rib and a triangular rib.

3. The vapor-liquid flow-dividing, vapor chamber fin-integrated structure of claim 1, wherein: A liquid absorbing core is arranged in the isothermal substrate (1) and is one or more of a sintered core and a wire mesh.

4. The vapor-liquid flow-dividing, vapor chamber fin-integrated structure of claim 1, wherein: A reinforcing rib is arranged in the isothermal substrate (1) to ensure the pressure bearing capacity of the structure.

5. The vapor-liquid flow-dividing, vapor chamber fin-integrated structure of claim 1, wherein: The phase-change working medium in the liquid pool (3) is one or more of R134a, R22, acetone and water.

6. The vapor-liquid flow-dividing, vapor chamber fin-integrated structure of claim 1, wherein: A filling opening (10) is arranged on the side of the isothermal substrate (1).

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