Cleaning mechanism, PCB board cutting device and cutting method thereof

Abstract

The present invention belongs to the technical field of PCB processing, and discloses a cleaning mechanism, a PCB board cutting device and a cutting method thereof. The cleaning mechanism is applied to cleaning the residues after processing the PCB board, and includes a fixing table for placing the PCB board to be processed and an identification component. The identification component is configured to identify the thickness of the PCB board on the fixing table and classify the PCB board into thin boards and thick boards. The cleaning mechanism has a first cleaning component and a second cleaning component. The first cleaning component is used for cleaning the residues left on the fixing table when processing thin boards; the second cleaning component is used for cleaning the residues left on the fixing table when processing PCB boards. The PCB board cutting device includes the above-mentioned cleaning mechanism and a cutting component that moves relative to the fixing table. By identifying the thickness of the PCB board placed on the fixing table through the identification component and adopting different cleaning components for PCB boards of different thicknesses, the sorting efficiency is improved; the cleaning cleanliness is improved and the defective rate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB processing, and in particular to a cleaning mechanism, a PCB board cutting device and a cutting method thereof. Background Art

[0002] PCB (Printed Circuit Board), also known as printed circuit board in Chinese, is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. When processing PCB boards, the common method for the remaining residues after processing is manual sorting and cleaning. On the one hand, the cleaning efficiency is low; on the other hand, the residues of PCB boards of different thicknesses are cleaned by the same method, which cannot take into account the residues of different thicknesses, and it is easy to cause unclean cleaning, which further makes it easy to bring the residues into the next process, affecting production. Therefore, it is necessary to carry out special cleaning for the processing residues of PCB boards of different thicknesses. Summary of the invention

[0003] The object of the present invention is to provide a cleaning mechanism, a PCB board cutting device and a cutting method thereof, which can adopt different cleaning components for PCB boards of different thicknesses, so as to carry out targeted cleaning, improve the cleanliness of the cleaning, reduce the probability of carrying residues into the next process, and reduce the defective rate.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] Cleaning mechanism, used to clean the residue after processing PCB board, including:

[0006] A fixing table, wherein the fixing table is configured to place the PCB board to be processed;

[0007] an identification component configured to identify the thickness of the PCB board on the fixing table and classify the PCB board into a thin board and a thick board;

[0008] A first cleaning component, the first cleaning component is used to clean the residue left on the fixing table when processing the thin plate;

[0009] The second cleaning component is used to clean the residue left on the fixing table when processing the PCB board.

[0010] Preferably, the first cleaning component comprises an absorption tube, and the absorption port of the absorption tube is connected to an external absorption device to absorb the residue on the fixing table.

[0011] Preferably, the first cleaning component includes an absorption lifting member disposed above the fixed table, and the absorption tube is disposed at the output end of the absorption lifting member so that the absorption tube can approach or move away from the fixed table.

[0012] Preferably, the second cleaning component includes a cleaning brush that moves along the upper end surface of the fixed table, and the cleaning brush can sweep the residue on the fixed table away from the fixed table.

[0013] Preferably, the second cleaning component includes a cleaning conveying portion, and the output end of the cleaning conveying portion is connected to the cleaning brush to drive it to reciprocate along one side of the fixed table, and the cleaning brush extends along a horizontal direction perpendicular to the movement direction of the cleaning brush.

[0014] Preferably, the second cleaning component includes a plurality of limiting blocks disposed on the cleaning brush, and the limiting blocks are disposed between the cleaning brush and the fixed table to limit the upward movement of part of the PCB board.

[0015] Preferably, there is also a pressing block, the pressing block is vertically movable above the fixed table, and the pressing block is disposed opposite to the limiting block to limit the upward movement of part of the PCB board.

[0016] Preferably, two limiting blocks are provided, and the two limiting blocks and the pressing block are distributed in a triangular shape.

[0017] Preferably, a residue collecting member is disposed at the moving end of the cleaning brush.

[0018] Preferably, a plurality of adsorption holes are provided on the upper end surface of the fixed table, and the adsorption holes are connected to an external vacuum pumping device.

[0019] Preferably, the identification component is a sensor disposed above the fixed table, and the sensor can measure the distance between the sensor and the PCB board on the fixed table.

[0020] Preferably, the thickness of the thick plate is greater than or equal to n, and the thickness of the thin plate is less than n, where n is any value from 0.2 mm to 0.8 mm.

[0021] There is also provided a PCB board cutting device, including the cleaning mechanism as described above; further including:

[0022] A cutting component, the cutting component includes a cutting portion, the cutting portion is configured to cut the PCB board on the fixed table, and the cutting portion moves relative to the fixed table.

[0023] Preferably, it includes:

[0024] A first driving member, an output end of the first driving member is connected with a mounting plate, the first driving member drives the mounting plate to move along the length direction or the width direction of the PCB board, a second driving member is arranged on the mounting plate, and the second driving member drives the fixing table to move along a horizontal direction perpendicular to the driving direction of the first driving member on the mounting plate.

[0025] Preferably, the cutting assembly includes a dust suction hood arranged above the fixing table, the dust suction hood is open at both the upper and lower ends, the cutting part is located directly above the dust suction hood, and the dust suction hood is communicated with an external dust suction device.

[0026] There is also provided a cutting method, which is applicable to the PCB board cutting device as described above, and includes the following steps:

[0027] S1. Identify the type of the PCB board, and divide the PCB board into a flexible board and a rigid board;

[0028] S2. Place the PCB board on the fixing table and adsorb and fix it;

[0029] S3. According to the identification result of S1,

[0030] If the PCB board is a flexible board, then identify the thickness of the PCB board fixed on the fixing table, divide the flexible board into a thin board and a thick board, and then execute S4;

[0031] If the PCB board is a rigid board, directly execute S4;

[0032] S4. Cut the identified PCB board;

[0033] S5. If the PCB board is a flexible board, then according to the identification result of S3, when the PCB board is defined as a thin board, control the first cleaning component and / or the second cleaning component to clean the residues of the PCB board on the fixing table; when the PCB board is defined as a thick board, the second cleaning component cleans the residues of the PCB board on the fixing table;

[0034] If the PCB board is a rigid board, the second cleaning component cleans the residues of the PCB board on the fixing table.

[0035] Preferably, it further includes:

[0036] In step S3, the identification component measures the distance from the identification component to the PCB board placed on the fixing table as h, and the distance from the identification component in the identification component to the upper end face of the fixing table is a fixed value H; when H - h ≥ n, where n is any value between 0.2 mm and 0.8 mm, the PCB board is defined as a thick board; otherwise, the PCB board is defined as a thin board.

[0037] Preferably, in step S5, it further includes:

[0038] When the first cleaning component performs cleaning, the limit block and the pressure block restrict part of the PCB board from moving upward, disconnect the adsorption of the fixed table, and take away the unrestricted PCB board; the pressure block is lifted, the cleaning brush is reset, and the suction pipe in the first cleaning component sucks the residue left on the fixed table (1);

[0039] When the second cleaning component performs cleaning, the limit block and the pressure block restrict part of the PCB board from moving, disconnect the adsorption of the fixed table, and take away the unrestricted PCB board; the pressure block is lifted, and the cleaning brush in the second cleaning component sweeps the residue off the fixed table;

[0040] When the first cleaning component and the second cleaning component perform joint cleaning, the limit block and the pressure block restrict part of the PCB board from moving upward, disconnect the adsorption of the fixed table, and take away the unrestricted PCB board; the pressure block is lifted, the suction pipe in the first cleaning component sucks the residue left on the fixed table, and the cleaning brush in the second cleaning component cleans the fixed table.

[0041] Advantages of the present invention:

[0042] By identifying the thickness of the PCB board placed on the fixed table through the identification component, different cleaning components of the first cleaning component and the second cleaning component are adopted for PCB boards of different thicknesses. And the PCB board cutting device adopts the above cleaning mechanism, which can apply different cleaning components to the residues of different thicknesses after cutting. On the one hand, the first cleaning component and the second cleaning component replace the original manual sorting of waste materials, improving the sorting efficiency; on the other hand, targeted cleaning can be carried out, which can improve the cleaning cleanliness, reduce the probability of residues being brought into the next process, and reduce the defective rate. Description of the drawings

[0043] Figure 1 is a schematic diagram of one perspective of the PCB board cutting device of the present invention;

[0044] Figure 2 is a schematic diagram of another perspective of the PCB board cutting device of the present invention;

[0045] Figure 3 is a schematic diagram of the first cleaning component in the present invention;

[0046] Figure 4 is a schematic diagram of the second cleaning component in the present invention;

[0047] Figure 5 is a schematic diagram of the pressure block and the pressure lifting member in the present invention.

[0048] In the figure:

[0049] 1. Fixed table; 11. Suction holes; 12. Placement plate; 13. Guide rail; 2. Identification component; 3. First cleaning component; 31. Absorption tube; 32. Pneumatic conveying device; 33. Absorption lifting member; 4. Second cleaning component; 41. Cleaning brush; 42. Cleaning conveying part; 43. Cleaning guide rail; 5. Residue collection member; 6. Limit block; 7. Pressing block; 8. Pressing lifting member; 9. Cutting component; 91. Cutting part; 92. Cutting lifting member; 93. Dust suction hood; 10. Placement rack. Detailed implementation manners

[0050] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the convenience of description, only parts related to the present invention rather than all structures are shown in the drawings.

[0051] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "above and over", and "on the top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "below and under", and "under the bottom of" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is lower than that of the second feature.

[0053] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "left", and "right" are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meanings.

[0054] As shown Figures 1-5 In the figure, this embodiment provides a cleaning mechanism, which is applied to cleaning the residues after processing the PCB board. The cleaning mechanism includes a fixing table 1 for placing the PCB board to be processed and an identification component 2. The identification component 2 is configured to identify the thickness of the PCB board on the fixing table 1 and classify the PCB board into thin boards and thick boards. The cleaning mechanism also has a first cleaning component 3 and a second cleaning component 4. The first cleaning component 3 is used to clean the residues left on the fixing table 1 when processing thin boards; the second cleaning component 4 is used to clean the residues left on the fixing table 1 when processing the PCB board.

[0055] By using the identification component 2 to identify the thickness of the PCB board placed on the fixing table 1 and adopting different cleaning components, namely the first cleaning component 3 and the second cleaning component 4, for PCB boards of different thicknesses. On the one hand, the first cleaning component 3 and the second cleaning component 4 replace the original manual waste sorting method, improving the sorting efficiency; in addition, different cleaning components are applied to residues of different thicknesses for targeted cleaning, which can improve the cleaning cleanliness, reduce the probability of residues being carried into the next process, and reduce the defective rate.

[0056] The following details this embodiment. As shown Figure 1 and 2 In the figure, this embodiment provides a cleaning mechanism, which is applied to cleaning the residues after processing the PCB board. In this embodiment, the residues mainly refer to the PCB board waste left on the upper end surface of the fixing table 1 after processing the PCB board. The cleaning mechanism includes a fixing table 1 for placing the PCB board to be processed. Specifically, a plurality of adsorption holes 11 are provided on the upper end surface of the fixing table 1. The adsorption holes 11 are connected to an external vacuum pumping device to be able to vacuum-adsorb and fix the PCB board. It can be understood that the upper end surface of the fixing table 1 is a plane to facilitate the adsorption and fixation of the PCB board; in this embodiment. Further, the adsorption holes 11 are arranged in an array on the upper end surface of the fixing table 1.

[0057] As shown Figure 2As shown, the cleaning mechanism is also provided with an identification component 2. The identification component 2 can identify the thickness of the PCB board on the fixed table 1 and classify the PCB board into thin boards and thick boards to classify the PCB boards. Specifically, an installation rack 10 is arranged above the fixed table 1, and the identification component 2 is arranged on the installation rack 10. In this embodiment, the identification component 2 is a sensor, and the sensor can measure the distance between the sensor and the PCB board on the fixed table 1. In this embodiment, the sensor used is a laser sensor. It can be understood that the laser sensor can accurately measure changes such as the position and displacement of the measured object without contact. Thus, with the above structure, when the fixed table 1 is located below the identification component 2, the longitudinal distance between the identification component 2 and the upper end surface of the fixed table 1 is relatively fixed, and the distance between the fixed table 1 and the identification component 2 is a fixed value H. When the PCB board is placed on the fixed table 1, the identification component 2 can measure the distance between the identification component 2 and the PCB board as h. When H - h ≥ n, where n is any value between 0.2 mm and 0.8 mm, the PCB board is defined as a thick board; otherwise, the PCB board is defined as a thin board. More specifically, n is 0.4 mm or 0.5 mm. In addition, using a laser sensor can also improve the accuracy of processing the PCB board and avoid processing errors caused by the lack of placement accuracy.

[0058] Thus, as Figures 2-4 shown, for different situations of processing thick boards and thin boards to clean the residues remaining on the fixed table 1, the cleaning mechanism has a first cleaning component 3 and a second cleaning component 4. The first cleaning component 3 is used to clean the residues left on the fixed table 1 when processing thin boards; the second cleaning component 4 is used to clean the residues left on the fixed table 1 when processing PCB boards. It should be noted here that PCB boards are classified into rigid circuit boards (hard boards) and flexible circuit boards (flexible boards) according to hardness and softness, which is common knowledge for those skilled in the art; before placing the PCB board, its material can be determined to control the use of the identification component 2 so as to adapt and adjust the control of the use of the first cleaning component 3 and the second cleaning component 4; that is, when the PCB board placed on the fixed table 1 is a flexible board, the identification component 2 can be controlled to identify the thickness of the PCB board and then classify and clean through the first cleaning component 3 and the second cleaning component 4; when the PCB board on the fixed table 1 is a hard board, the identification component 2 can be controlled not to identify the thickness of the PCB board and directly clean with the second cleaning component 4.

[0059] Specifically, as Figure 2 and Figure 3As shown in the figure, the first cleaning component 3 includes a suction tube 31. The suction port of the suction tube 31 is connected to an external suction device to suck the residues on the fixing table 1. More specifically, a suction lifting member 33 is provided on the mounting rack 10. In this embodiment, the suction lifting member 33 is a telescopic cylinder. The suction tube 31 is arranged at the output end of the lifting member so that the suction tube 31 can be close to or away from the fixing table 1. The suction tube 31 is connected to an external suction device to provide suction force. Since the thin plate has good flexibility, the residues left on the fixing table 1 during the processing of the thin plate can be sucked away. Further, the suction tube 31 is a telescopic tube. In this embodiment, a telescopic corrugated tube is used. One end of the suction tube 31 is connected to the suction interface of the external suction device, and the other end of the suction tube 31 is connected to a pneumatic conveying device 32. The pneumatic conveying device 32 is a prior art and will not be described in detail here. The pneumatic conveying device 32 is connected to the output end of the suction lifting member 33, that is, the suction tube 31 is telescoped along with the movement of the output end of the lifting member through the pneumatic conveying device 32. With the above structure, the distance can be better controlled through the telescopic suction tube 31, and the addition of the pneumatic conveying device 32 can achieve a better suction effect and make the cleaning more thorough. The second cleaning component 4 includes a cleaning brush 41 that moves along the upper end surface of the fixing table 1. The cleaning brush 41 can sweep the residues on the fixing table 1 away from the fixing table 1. Specifically, the second cleaning component 4 includes a cleaning conveying part 42. The output end of the cleaning conveying part 42 is connected to the cleaning brush 41 to drive it to reciprocate along one side of the fixing table 1. The cleaning brush 41 extends along the horizontal direction perpendicular to the moving direction of the cleaning brush 41. Driven by the cleaning conveying part 42, the cleaning brush 41 moves on the table surface of the fixing table 1. When there are residues of processed thick plates on the table surface, since the thick plate has poor flexibility, the cleaning brush 41 can sweep the residues away from the fixing table 1. In this embodiment, the cleaning conveying part 42 is a driving motor. More specifically, cleaning guide rails 43 extending along the side of the fixing table 1 are arranged on the opposite sides of the fixing table 1. One end of the cleaning brush 41 is slidably connected to the cleaning guide rail 43. In other embodiments, a transmission hinge can also be used to transmit the movement of the cleaning brush 41. In this embodiment, the cleaning guide rails 43 can be arranged on the opposite sides of the fixing table 1 to make the cleaning brush 41 more stable. Further, the cleaning brush 41 includes a fixing frame. The fixing frame spans above the fixing table 1 and the end of the fixing frame is slidably connected to the cleaning guide rail 43. A number of rubber strips are arranged on the fixing frame. The rubber strips are located between the fixing frame and the fixing table 1 and contact the fixing table 1 so as to be able to sweep the residues away from the table surface of the fixing table 1. To sum up, by using the first cleaning component 3 that can suck and the second cleaning component 4 that can sweep, different cleaning methods can be adopted according to the characteristics of thin plates and thick plates, making the cleaning more thorough and reducing the probability of residues being brought into the next process.

[0060] Further, as Figure 1 and Figure 2As shown, a residue collection member 5 is provided at the moving end of the cleaning brush 41 so that the residues swept away from the fixing table 1 by the cleaning brush 41 can be received by the residue collection member 5, thereby ensuring the cleanliness of the table surface of the fixing table 1. Preferably, the residue collection member 5 is a tipping machine. When the residues move onto the tipping machine, they can be directly received and flipped by the tipping machine for collection, reducing manual collection and improving the collection efficiency. The tipping machine is a prior art and will not be elaborated here. In other embodiments, the residue collection member 5 can also adopt collection devices such as a collection cylinder or a collection trough. With the above structure, after the second cleaning component 4 cleans the residues, it can avoid the messy stacking of residues and also avoid interfering with the next cleaning of the second cleaning component 4.

[0061] Furthermore, as Figure 4 shown, the second cleaning component 4 includes a plurality of limiting blocks 6 provided on the cleaning brush 41. The limiting blocks 6 are arranged between the cleaning brush 41 and the fixing table 1 to limit the upward movement of part of the PCB board. Specifically, the plurality of limiting blocks 6 are arranged at intervals on the fixing frame and are arranged between the fixing frame and the surface of the fixing table 1. On the one hand, arranging the limiting blocks 6 on the cleaning brush 41 can save the drive for driving the limiting blocks 6, saving space and cost; on the other hand, after the PCB board is processed on the fixing table 1, the movement of the cleaning brush 41 makes the limiting blocks 6 located above the PCB board to limit the upward movement of part of the PCB board (such as the residue part), and the unconstrained part of the PCB board (such as the cut PCB board blank) is taken away, making it more convenient for the two to be separated. Further, the cleaning mechanism is also provided with a pressing block 7. The pressing block 7 is arranged above the fixing table 1 in a liftable manner, and the pressing block 7 is arranged opposite to the limiting blocks 6 to limit the upward movement of part of the PCB board (such as the residue part). Specifically, a pressing lifting member 8 is arranged above the fixing table 1. In this embodiment, the pressing lifting member 8 is a lifting cylinder, and the pressing block 7 is connected to the output end of the pressing lifting member 8 so that the pressing block 7 can approach or move away from the PCB board. More specifically, two limiting blocks 6 are arranged at intervals along the fixing frame, and the pressing block 7 is located between the two limiting blocks 6, so that the two limiting blocks 6 and the pressing block 7 are distributed in a triangle, which can make the pressing more stable, and also facilitate the faster separation of the residues from the cut PCB blank, and is also convenient for subsequent cleaning of the residues.

[0062] This embodiment also provides a PCB board cutting device, as Figure 2As shown in the figure, the cutting device includes the above-mentioned cleaning mechanism; at the same time, it also has a cutting assembly 9, and the cutting assembly 9 can cut the PCB board on the fixing table 1. Specifically, the cutting assembly 9 has a cutting part 91 for cutting. In this embodiment, the cutting part 91 is a laser cutting part 91, and in other embodiments, it can also be continuous drilling cutting. More specifically, the mounting rack 10 has a cutting lifting member 92. In this embodiment, the cutting lifting member 92 is a cylinder, and the laser cutting part 91 is arranged at the output end of the lifting member to be able to approach or move away from the fixing table 1, so as to facilitate the focusing of the laser cutting part 91 on the PCB board on the fixing table 1. The cutting assembly 9 includes a dust suction hood 93 arranged above the fixing table 1, that is, the dust suction hood 93 is arranged between the laser cutting part 91 and the fixing table 1. The dust suction hood 93 is open at both the top and bottom, and the cutting part 91 is located directly above the dust suction hood 93 so that the laser emitted by the laser cutting part 91 can pass through the dust suction hood 93. The dust suction hood 93 is connected to an external dust suction device, and the dust generated during cutting can be sucked away through the dust suction hood 93 to avoid the dust obscuring the cutting laser and causing cutting errors. Further, in this embodiment, the pressing and lifting member 8 in the cleaning mechanism is arranged on the outer wall of the dust suction hood 93 to reduce the lifting distance of the pressing and lifting member 8.

[0063] In addition, to complete the cutting of the PCB board, the cutting part 91 moves relative to the fixed table 1. Specifically, the PCB board cutting device includes a first driving member, and the output end of the first driving member is connected to a placement plate 12. The first driving member drives the placement plate 12 to move along the length or width direction of the PCB board. In this embodiment, the first driving member uses a driving motor, and in other embodiments, a cylinder or the like can also be used. To make the movement of the placement plate 12 smoother, a guide rail 13 is provided along the moving direction of the placement plate 12, and the placement plate 12 is slidably connected to the guide rail 13; in other embodiments, a conveyor belt or a conveyor hinge can also be used. It should be noted here that since the residue collection member 5 is provided at the moving end of the cleaning brush 41, due to the existence of the guide rail 13, the moving distance of the cleaning brush 41 will include the length of the guide rail 13. Thus, in the PCB board cutting device, the residue collection member 5 is provided at the moving end of the placement plate 12. In addition, there is also a second driving member provided on the placement plate 12, and the second driving member drives the fixed table 1 to move horizontally on the placement plate 12 in a direction perpendicular to the driving direction of the first driving member. In this embodiment, the second driving member uses a driving motor, and in other embodiments, a cylinder or the like can also be used. To make the movement of the fixed table 1 more convenient, a guide rail 13 is also provided along the driving direction of the second driving member, and the fixed table 1 is slidably connected to the guide rail 13 extending along the driving direction of the second driving member. Thus, with the above structure, the fixed table 1 can move in the horizontal direction in a cross shape, and the PCB board on the fixed table 1 can be cut in the horizontal direction. Similarly, in other embodiments, a fixed fixed table 1 can also be used, and the cutting assembly 9 can be made to move in the horizontal cross direction, so that the cutting assembly 9 moves relative to the fixed table 1. In addition, the PCB board cutting device also has a PLC control system to effectively control and process data for the cutting assembly 9 and the cleaning mechanism.

[0064] This embodiment also provides a cutting method, which is applicable to the above-mentioned PCB board cutting device, and includes the following steps: S1. First, identify the type of the PCB board, and classify the PCB board into a flexible board and a rigid board; S2. Place the PCB board identified in S1 on the fixing table 1, and turn on the vacuum pumping device to adsorb and fix the PCB board; S3. According to the identification result of S1, if the PCB board is a flexible board, then continue to identify the thickness of the PCB board fixed on the fixing table 1 through the identification component 2, classify the flexible board into a thin board and a thick board, and then execute S4; specifically, the identification component 2 measures the distance from the identification component 2 to the PCB board placed on the fixing table 1 as h, and the distance from the identification component 2 in the identification component 2 to the upper end surface of the fixing table 1 is a fixed value H; when H - h ≥ n, where n is any value from 0.2 mm to 0.8 mm, preferably 0.4 mm or 0.5 mm, the PCB board is defined as a thick board; otherwise, the PCB board is defined as a thin board. If the PCB board placed on the fixing table 1 is a rigid board, directly execute S4. S4. Cut the identified PCB board; specifically, adjust the position of the fixing table 1 through the first driving member and the second driving member, then adjust the focal length of the cutting part 91 and drive the fixing table 1 to move through the first driving member and the second driving member, so as to cut the PCB board. After the cutting is completed, execute S5. S5. According to the identification result of S2, if the PCB board is a flexible board and the PCB board is defined as a thin board, control the first cleaning component 3 and / or the second cleaning component 4 to clean the residue of the PCB board on the fixing table 1; if the PCB board is a flexible board and the PCB board is defined as a thick board, the second cleaning component 4 cleans the residue of the PCB board on the fixing table 1; furthermore, when the PCB board is a rigid board, the second cleaning component 4 cleans the residue of the PCB board on the fixing table 1. Specifically: when the first cleaning component 3 performs cleaning, the pressing and lifting member 8 controls the pressing block 7 to descend, and at the same time the cleaning and conveying part 42 drives the cleaning brush 41 and the limiting block 6 to move above the PCB board. It can be understood that the specific positions restricted by the limiting block 6 and the pressing block 7 can be located through the identification component 2. Generally, the limiting block 6 and the pressing block 7 jointly restrict the waste of the PCB board on the opposite side (i.e., the residue part). At this time, the adsorption of the fixing table 1 is disconnected and the un-restricted PCB board (i.e., the processed PCB board finished product) is taken away by manual or a pick-and-place manipulator; after the picking is completed, the pressing block 7 is lifted, the cleaning brush 41 is reset, and the lifting member in the first cleaning component 3 drives the pneumatic conveying device 32 to suck the residue left on the fixing table 1; when the second cleaning component 4 performs cleaning, similarly, the limiting block 6 and the pressing block 7 restrict the PCB board (i.e., the residue part), disconnect the adsorption of the fixing table 1 and take away the un-restricted PCB board; the pressing block 7 is lifted, and the cleaning brush 41 in the second cleaning component 4 sweeps the residue of the PCB board off the fixing table 1 and is received by the residue collecting member 5.When the first cleaning component 3 and the second cleaning component 4 perform joint cleaning, the limit block 6 and the pressure block 7 restrict part of the PCB board from moving upward, disconnect the adsorption of the fixing table 1 and take away the unrestricted PCB board; the pressure block 7 is lifted, and the suction tube 31 in the first cleaning component 3 sucks the residues left on the fixing table 1, and then the cleaning brush 41 in the second cleaning component 4 cleans the fixing table 1. Thus, by adopting the above cutting method, different cleaning methods can be carried out after cutting different PCB plates, reducing the probability of residues being brought into the next process and reducing the defective rate.

[0065] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. Cleaning mechanism, applied to clean the residues after processing a PCB board, Characterized in that, Comprising: A fixed table (1), the fixed table (1) being configured to place the PCB board to be processed; An identification component (2), the identification component (2) being configured to identify the thickness of the PCB board on the fixed table (1) and classify the PCB board into a thin board and a thick board; A first cleaning component (3), the first cleaning component (3) being used to clean the residues left on the fixed table (1) when processing the thin board; A second cleaning component (4), the second cleaning component (4) being used to clean the residues left on the fixed table (1) when processing the PCB.

2. The cleaning mechanism according to claim 1, Characterized in that, The first cleaning component (3) includes an absorption tube (31), and the absorption port of the absorption tube (31) is connected to an external absorption device to absorb the residues on the fixed table (1).

3. The cleaning mechanism according to claim 2, Characterized in that, The first cleaning component (3) includes an absorption lifting member (33) arranged above the fixed table (1), and the absorption tube (31) is arranged at the output end of the absorption lifting member (33) so that the absorption tube (31) can approach or move away from the fixed table (1).

4. The cleaning mechanism according to claim 1, Characterized in that, The second cleaning component (4) includes a cleaning brush (41) moving along the upper end surface of the fixed table (1), and the cleaning brush (41) can sweep the residues on the fixed table (1) away from the fixed table (1).

5. The cleaning mechanism according to claim 4, Characterized in that, The second cleaning component (4) includes a cleaning conveying part (42), the output end of the cleaning conveying part (42) is connected to the cleaning brush (41) to drive it to reciprocate along one side of the fixed table (1), and the cleaning brush (41) extends along the horizontal direction perpendicular to the moving direction of the cleaning brush (41).

6. The cleaning mechanism according to claim 4, Characterized in that, The second cleaning component (4) includes a plurality of limiting blocks (6) arranged on the cleaning brush (41), and the limiting blocks (6) are arranged between the cleaning brush (41) and the fixed table (1) to limit part of the PCB board from moving upward.

7. The cleaning mechanism according to claim 6, Characterized in that, It further has a pressing block (7), the pressing block (7) is arranged above the fixed table (1) in a liftable manner, and the pressing block (7) is arranged opposite to the limiting blocks (6) to limit part of the PCB board from moving upward.

8. The cleaning mechanism according to claim 7, Characterized in that, Two limiting blocks (6) are arranged, and the two limiting blocks (6) and the pressing block (7) are distributed in a triangle.

9. The cleaning mechanism according to claim 4, Characterized in that, A residue collection member (5) is arranged at the moving end of the cleaning brush (41).

10. The cleaning mechanism according to any one of claims 1-9, Characterized in that, The upper end surface of the fixed table (1) is provided with a plurality of adsorption holes (11), and the adsorption holes (11) are connected to an external vacuum pumping device.

11. The cleaning mechanism according to any one of claims 1-9, characterized in that, the identification component (2) is a sensor arranged above the fixed table (1), and the sensor can measure the distance between the sensor and the PCB board on the fixed table (1).

12. The cleaning mechanism according to any one of claims 1-9, characterized in that, the thickness of the thick plate is greater than or equal to n, and the thickness of the thin plate is less than n, where n is any value between 0.2 mm and 0.8 mm.

13. A PCB board cutting device, characterized in that, comprising: the cleaning mechanism according to any one of claims 1-12; a cutting component (9), the cutting component (9) includes a cutting part (91), the cutting part (91) is configured to cut the PCB board on the fixed table (1), and the cutting part (91) moves relative to the fixed table (1).

14. The PCB board cutting device according to claim 13, characterized in that, comprising: a first driving member, the output end of the first driving member is connected with a placement plate (12), the first driving member drives the placement plate (12) to move along the length direction or the width direction of the PCB board, and a second driving member is arranged on the placement plate (12), and the second driving member drives the fixed table (1) to move on the placement plate (12) in a direction perpendicular to the driving direction of the first driving member horizontally.

15. The PCB board cutting device according to claim 13, characterized in that, the cutting component (9) includes a dust suction hood (93) arranged above the fixed table (1), the dust suction hood (93) has upper and lower openings, the cutting part (91) is located directly above the dust suction hood (93), and the dust suction hood (93) is communicated with an external dust suction device.

16. A cutting method, applicable to the PCB board cutting device according to any one of claims 13-15, characterized in that, comprising the following steps: S1. Identify the type of the PCB board, and divide the PCB board into a flexible board and a rigid board; S2. Place the PCB board on the fixed table (1) and adsorb and fix it; S3. According to the identification result of S1, if the PCB board is a flexible board, then identify the thickness of the PCB board fixed on the fixed table (1), divide the flexible board into a thin board and a thick board, and then execute S4; if the PCB board is a rigid board, then directly execute S4; S4. Cut the identified PCB board; S5. If the PCB board is a flexible board, then according to the identification result of S3, when the PCB board is defined as a thin board, control the first cleaning component (3) and / or the second cleaning component (4) to clean the residue on the PCB board on the fixed table (1); when the PCB board is defined as a thick board, the second cleaning component (4) cleans the residue on the PCB board on the fixed table (1); if the PCB board is a rigid board, the second cleaning component (4) cleans the residue on the PCB board on the fixed table (1).

17. The cutting method according to claim 16, characterized in that, further comprising: In step S3, the recognition component (2) measures the distance from the recognition component (2) to the PCB board placed on the fixed table (1) as h, and the distance from the recognition component (2) in the recognition component (2) to the upper end face of the fixed table (1) is a fixed value H; when H - h ≥ n, where n is any value between 0.2 mm and 0.8 mm, the PCB board is defined as a thick board; otherwise, the PCB board is defined as a thin board.

18. The cutting method according to claim 16, characterized in that, in step S5, it further comprises: When the first cleaning component (3) performs cleaning, the limit block (6) and the pressing block (7) limit the upward movement of part of the PCB board, disconnect the adsorption of the fixed table (1) and take away the unconstrained PCB board; the pressing block (7) is lifted, the cleaning brush (41) is reset, and the suction pipe (31) in the first cleaning component (3) sucks the residue left on the fixed table (1); When the second cleaning component (4) performs cleaning, the limit block (6) and the pressing block (7) limit the movement of part of the PCB board, disconnect the adsorption of the fixed table (1) and take away the unconstrained PCB board; the pressing block (7) is lifted, and the cleaning brush (41) in the second cleaning component (4) sweeps the residue off the fixed table (1); When the first cleaning component (3) and the second cleaning component (4) perform joint cleaning, the limit block (6) and the pressing block (7) limit the upward movement of part of the PCB board, disconnect the adsorption of the fixed table (1) and take away the unconstrained PCB board; the pressing block (7) is lifted, the suction pipe (31) in the first cleaning component (3) sucks the residue left on the fixed table (1), and the cleaning brush (41) in the second cleaning component (4) sweeps the fixed table (1).

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