Semiconductor test fixture and method of testing semiconductor products

Abstract

The present disclosure provides a semiconductor test fixture and a semiconductor product testing method. The semiconductor test fixture comprises a fixture body and a limiting assembly. The fixture body has a containing space and is capable of rotating around a preset axis. The limiting assembly is arranged on the fixture body and is used for limiting and fixing a to-be-tested sample in a first direction and a second direction, so that the preset axis penetrates the center of the to-be-tested sample. In the present disclosure, the adjustable limiting assembly is arranged to limit the to-be-tested sample. Compared with the way of using hot melt adhesive to bond and fix the to-be-tested sample in the related art, the to-be-tested sample can be quickly fixed and the angle and position of the to-be-tested sample can be adjusted. Moreover, the limiting assembly can also make the preset axis of the rotation of the fixture body penetrate the center of the to-be-tested sample, so that the to-be-tested sample can be in the middle position of the imaging position during the rotation of the fixture body around the preset main line, and then a higher test magnification can be used, and the test precision is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of semiconductor technology, and in particular, to a semiconductor test fixture and a test method of a semiconductor product. BACKGROUND

[0002] In the field of semiconductor technology, after the semiconductor chip is processed, it usually needs to be tested, such as non-destructive failure analysis using X-rays, to avoid unqualified chips from being put into use.

[0003] In the related art, hot melt adhesive is usually used to bond and fix the chip and the test fixture. When the mounting position and angle of the chip are incorrect, the position of the chip needs to be adjusted constantly, or even the chip needs to be removed from the test fixture, which is time-consuming and easy to damage the chip. SUMMARY

[0004] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of protection of the claims.

[0005] The present disclosure provides a semiconductor test fixture and a test method of a semiconductor product.

[0006] In a first aspect, the present disclosure provides a semiconductor test fixture, comprising:

[0007] A fixture body having a receiving space for accommodating a sample to be tested, wherein the fixture body is capable of rotating about a preset axis;

[0008] A limiting assembly provided on the fixture body, the limiting assembly being configured to limit the sample to be tested in a first direction and a second direction, so that the preset axis passes through the center of the sample to be tested;

[0009] The first direction and the second direction are perpendicular to each other, and the first direction and the second direction are both perpendicular to the preset axis.

[0010] In some embodiments, the preset axis passes through the center of the sample to be tested, comprising:

[0011] The preset axis passes through the center axis of the sample to be tested.

[0012] In some embodiments, the fixture body is provided with a limiting slide, and the limiting slide extends along the first direction.

[0013] The limiting assembly comprises at least two first limiting portions, the first limiting portions are provided on the limiting slide and are capable of sliding along the limiting slide, and in the first direction, the first limiting portions are arranged on both sides of the sample to be tested.

[0014] The first limiting part is in abutment with two opposite sides of the sample to be tested to limit the sample to be tested in the first direction.

[0015] In some embodiments, the first limiting part comprises a slider and a fastener connected to each other, the slider being in sliding connection with the limiting slide;

[0016] The fastener is used to fix the slider to the limiting slide when the slider moves to the preset position of the limiting slide.

[0017] In some embodiments, the limiting assembly comprises a second limiting part, the second limiting part applying a force to the sample to be tested in the second direction to press the sample to be tested against the jig body.

[0018] In some embodiments, the top of the jig body is provided with a first through hole extending in the second direction, the first through hole being in communication with the accommodation space;

[0019] The second limiting part comprises a first pressing block and a first adjusting screw connected to each other, the first pressing block being arranged in the accommodation space, the first pressing block being used to contact the sample to be tested;

[0020] The first adjusting screw penetrates through the first through hole and forms a threaded fit with the first through hole, and rotating the first adjusting screw drives the first pressing block to move towards or away from the sample to be tested.

[0021] In some embodiments, the semiconductor test jig further comprises a connecting rod, a first end of the connecting rod being connected to an output shaft of a driving unit, the driving unit being used to drive the connecting rod to rotate;

[0022] A second end of the connecting rod is provided with an adjusting track, the jig body being in sliding connection with the adjusting track, wherein the extending direction of the adjusting track is parallel to the second direction.

[0023] In some embodiments, a side wall of the adjusting track is provided with a second through hole, the second through hole penetrating through the side wall of the adjusting track in the first direction;

[0024] The limiting assembly comprises a third limiting part, the third limiting part comprising a second pressing block and a second adjusting screw, the second pressing block being arranged inside the adjusting track, the second pressing block being used to contact the jig body;

[0025] The second adjusting screw penetrates through the second through hole and forms a threaded fit with the second through hole.

[0026] In some embodiments, the semiconductor test jig further comprises:

[0027] a first scale extending along the first direction; and / or,

[0028] a second scale extending along the second direction; and / or,

[0029] a third scale extending along a direction parallel to the second direction.

[0030] In some embodiments, the accommodation space comprises a limiting side wall, and the preset axis is perpendicular to the limiting side wall.

[0031] In the assembled state, one side of the sample under test is in contact with the limiting side wall.

[0032] In some embodiments, the material of the jig body and / or the limiting assembly comprises any one or more of plastic, carbon fiber, and ceramic, and wherein the material is non-metallic.

[0033] In a second aspect, the disclosure provides a method for testing a semiconductor product, applied to the semiconductor testing jig of the first aspect, comprising:

[0034] placing the sample under test in the accommodation space of the jig body;

[0035] adjusting the limiting assembly so that the preset axis passes through the center of the sample under test;

[0036] controlling the jig body to rotate around the preset axis and testing the sample under test.

[0037] In some embodiments, adjusting the limiting assembly comprises:

[0038] based on the reading of the first scale by the first limiting part, adjusting the position of the plurality of first limiting parts on the limiting track until the distance between the plurality of first limiting parts and the preset axis in the first direction is equal, and the first limiting parts are in contact with the side surface of the sample under test.

[0039] In some embodiments, adjusting the limiting assembly comprises:

[0040] based on the reading of the second scale by the sample under test, determining the thickness value of the sample under test;

[0041] based on the reading of the third scale by the jig body, determining the relative position of the jig body on the third scale;

[0042] based on the thickness value and the relative position, adjusting the jig body along the second direction so that half of the thickness value coincides with a preset scale on the third scale.

[0043] In some embodiments, before determining the thickness of the sample under test, the method for testing the semiconductor product further comprises:

[0044] The second limiting part is adjusted to press the top surface of the sample under test, so that the bottom surface of the sample under test is attached to the bottom surface of the accommodation space.

[0045] In some embodiments, placing the sample under test in the accommodation space comprises:

[0046] The side surface of the sample under test is controlled to be attached to the limiting side wall of the accommodation space.

[0047] The semiconductor testing jig and the method for testing the semiconductor product provided by the present disclosure set an adjustable limiting assembly to limit the sample under test. Compared with the way of using hot melt adhesive to bond the sample under test in the related art, the angle and position of the sample under test can be quickly fixed and adjusted. Moreover, the limiting assembly can also make the preset axis of rotation of the jig body pass through the center of the sample under test, so that the sample under test can be in the middle position of the imaging plane during the rotation of the jig body, and thus a higher test magnification can be used, and the test precision is improved.

[0048] Other aspects can become apparent from the following detailed description, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0049] The accompanying drawings incorporated in and forming a part of the specification illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the embodiments of the present disclosure. Similar reference numerals in the drawings represent similar elements. The drawings in the following description are of some embodiments of the present disclosure, and not all embodiments. Other drawings can be derived from these drawings by a person of ordinary skill in the art without paying creative labor.

[0050] Figure 1 is a schematic diagram of a testing device in the related art.

[0051] Figure 2 is a schematic diagram of testing imaging according to an exemplary embodiment.

[0052] Figure 3 is a schematic diagram of testing imaging according to an exemplary embodiment.

[0053] Figure 4 is a schematic diagram of testing imaging according to an exemplary embodiment.

[0054] Figure 5 is a schematic diagram of a semiconductor testing jig according to an exemplary embodiment.

[0055] Figure 6is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0056] Figure 7 is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0057] Figure 8 is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0058] Figure 9 is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0059] Figure 10 is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0060] Figure 11 is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0061] Figure 12 is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0062] Figure 13 is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0063] Figure 14 is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0064] Figure 15 is a schematic diagram of a semiconductor test fixture according to an exemplary embodiment.

[0065] Figure 16 is a flowchart of a test method of a semiconductor product according to an exemplary embodiment.

[0066] Reference Signs:

[0067] 100', semiconductor test fixture; 200', sample to be tested; 201', test imaging; 300', detection device; 400', driving device; 500', imaging plane;

[0068] 100, semiconductor test fixture;

[0069] 10, fixture body; 10a, first structure; 10b, second structure; 11, accommodation space; 111, limiting side wall; 12, limiting slide;

[0070] 20, limiting assembly; 21, first limiting part; 211, sliding block; 212, fastener; 22, second limiting part; 221, first pressing block; 222, first adjusting screw; 23, third limiting part;

[0071] 30, connecting rod; 31, adjusting track;

[0072] 40, first scale;

[0073] 50, second scale;

[0074] 60, third scale;

[0075] 200, sample to be tested. DETAILED DESCRIPTION

[0076] To make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments will be described clearly and completely below with reference to the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only some but not all of the embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other in any manner without conflict.

[0077] In the field of semiconductor technology, after the processing of a semiconductor chip is completed, the semiconductor chip usually needs to be tested, such as non-destructive failure analysis using X-rays, to avoid unqualified chips from being put into use.

[0078] In the related art, hot melt adhesive is usually used to bond and fix the chip and the test fixture. When the mounting position and angle of the chip are incorrect, the position of the chip needs to be adjusted constantly, or even the chip needs to be removed from the test fixture, which is time-consuming and easy to damage the chip.

[0079] Reference Figure 1 is a schematic diagram of a test device in the related art. In the test device, the detection device 300', the semiconductor test fixture 100' and the imaging plane 500' are arranged in line (in the z direction shown in Figure 1 , the semiconductor test fixture 100' is provided with a sample to be tested 200', the driving device 400' can drive the semiconductor test fixture 100' to rotate, and the detection device 300' can emit test rays towards the sample to be tested 200', so that the sample to be tested 200' projects on the imaging plane 500' to produce test imaging 201' (refer to Figure 2 , Figure 3 and Figure 4 ). Among them, the area of the imaging plane 500' is usually limited.

[0080] ReferenceFigure 2 As shown in FIG. 8, when the placement position of the sample 200' is deviated, the relationship between the test imaging 201' and the imaging plane 500' can be determined. In order to ensure that the test imaging 201' can completely fall into the imaging plane 500', it is necessary to reduce the test magnification of the detection device 300', which results in low test precision.

[0081] To solve the above problems, the present disclosure provides a semiconductor test fixture and a test method of a semiconductor product. The semiconductor test fixture comprises a fixture body and a limiting assembly. The fixture body has a containing space for containing a sample to be tested. The fixture body can rotate around a preset axis. The limiting assembly is arranged on the fixture body and is used for limiting and fixing the sample to be tested in a first direction and a second direction, so that the preset axis penetrates the center of the sample to be tested. The first direction and the second direction are perpendicular to each other and perpendicular to the preset axis. In the present disclosure, the limiting assembly is adjustable to limit the sample to be tested. Compared with the way of using hot melt adhesive to bond and fix the sample to be tested in the related art, the angle and position of the sample to be tested can be quickly fixed and adjusted. In addition, the limiting assembly can also make the preset axis of the rotation of the fixture body penetrate the center of the sample to be tested, so that the sample to be tested can be in the middle position of the imaging position during the rotation of the fixture body around the preset axis. Therefore, a higher test magnification can be used, and the test precision is improved.

[0082] In an exemplary embodiment of the present disclosure, as shown in Figure 5 , the present embodiment provides a semiconductor test fixture 100 for clamping and fixing a semiconductor product, such as a chip.

[0083] In the present embodiment, as shown in Figure 5 , the semiconductor test fixture 100 comprises a fixture body 10 having a containing space 11 for containing a sample to be tested 200. The fixture body 10 with the corresponding size of the containing space 11 can be selected for fixation according to the size of the sample to be tested 200.

[0084] As shown in Figure 5 , the fixture body 10 can rotate around a preset axis (R straight line shown in Figure 5 ), and the extension direction of the preset axis R is parallel to the third direction (x direction shown in Figure 5 ). The fixture body 10 rotates around the preset axis to drive the sample to be tested 200 to rotate, so that the detection device 300' (refer to Figure 1 ) can image each angle of the sample to be tested 200 on the imaging plane 500' (refer to Figure 1The detection device 300' such as a 3D X-ray microscope can perform tomography on the sample 200 to be tested, and can slice and display the internal structure of the sample 200 to be tested at different depths, so that the micro-defects are more clearly displayed, and the purpose of distinguishing defects is achieved.

[0085] As shown in Figure 5 , the semiconductor test fixture 100 includes a limiting assembly 20 arranged on the fixture body 10.

[0086] When the sample 200 to be tested is placed in the accommodating space 11, the limiting assembly 20 can limit the sample 200 to be tested in a first direction (y direction shown in Figure 5 ) and a second direction (z direction shown in Figure 5 ). It should be noted that the first direction and the second direction are taken as the reference plane of the top surface of the fixture body 10, and when the fixture body 10 rotates around the preset axis, the first direction and the second direction will rotate synchronously with the fixture body 10, that is, Figure 1 The y direction and the z direction shown in

[0087] Of course, it can be understood that the limiting assembly 20 can also limit the sample 200 to be tested in a third direction. For example, when the limiting assembly 20 limiting in the first direction and the second direction exerts pressure on the sample 200 to be tested, so that there is a large enough friction force between the sample 200 to be tested and the fixture body 10, the sample 200 to be tested can be limited in the third direction.

[0088] In the embodiment, when the limiting assembly 20 limits the sample 200 to be tested, the preset axis of rotation of the fixture body 10 can pass through the center (i.e., the geometric center point) of the sample 200 to be tested. In one example, with reference to Figure 2 It can be determined that when the center point of the sample 200 to be tested falls on the preset axis of rotation R, no matter how the fixture body 10 rotates to any angle, the test imaging of the sample 200 to be tested can always be in the middle position of the imaging plane 500', which can carry a larger area of test imaging 201', that is, the detection device can use a higher magnification to improve the test precision. With reference to Figure 3 , Figure 3 It is shown that the center point of the sample 200 to be tested falls on the preset axis of rotation R (with reference to Figure 2 ), and the preset axis of rotation R passes through the center axis of the sample 200 to be tested, that is, the center axis of the sample 200 to be tested coincides with the preset axis of rotation R, which can make the test imaging 201' in the imaging plane 500' have the largest area.

[0089] When the limiting assembly 20 is adjusted, the manner of judging whether the preset axis passes through the center of the sample 200 under test can be, for example, a scale (to be described in detail below) can be arranged on the jig body 10, so that the judgment can be made based on the reading of the limiting assembly 20 on the scale. For another example, a distance sensor (not shown in the figure) can be arranged on the jig body 10, the distance sensor can detect the edge of the sample 200 under test, when the distance between the two distance sensors in the width direction (for example, the y direction shown in the figure) of the sample 200 under test is equal to the width of the sample 200 under test, and neither of the two distance sensors receives a feedback signal, it can be determined that the sample 200 under test is in the center position. Figure 5

[0090] Here, it should be noted that the drawings provided by the embodiments of the present disclosure are only schematic and do not limit the actual size of the semiconductor test jig 100, for example, the transverse dimension (the y direction shown in the figure) of the accommodation space 11 can be larger, as long as it can clamp and fix the sample 200 under test. Figure 5

[0091] In the embodiments of the present disclosure, the adjustable limiting assembly is arranged to limit the sample under test. Compared with the way of using hot melt adhesive to bond and fix the sample under test in the related art, the angle and position of the sample under test can be quickly fixed and adjusted; and the limiting assembly can also make the preset axis of the jig body pass through the center of the sample under test, so that the sample under test can be in the middle position of the imaging plane during the rotation of the jig body, and thus a higher test magnification can be used, and the test precision is improved.

[0092] In one example embodiment, as shown in Figure 5 the semiconductor test jig 100 includes a jig body 10 and a limiting assembly 20, the jig body 10 has an accommodation space 11 for accommodating a sample 200 under test, the jig body 10 can rotate around a preset axis, the limiting assembly 20 is arranged on the jig body 10, and the limiting assembly 20 is used to limit the sample 200 under test in a first direction and a second direction to make the preset axis pass through the center of the sample 200 under test. The first direction and the second direction are perpendicular to each other, and both the first direction and the second direction are perpendicular to the preset axis.

[0093] The present embodiment is used to explain how the limiting assembly 20 positions the sample 200 under test in the first direction.

[0094] In some embodiments, as shown in Figures 5 to 8 the jig body 10 is provided with a limiting slide 12, and the limiting slide 12 extends in the first direction (the y direction shown in the figure). Figure 5

[0095] Referring to Figures 5 to 8 ​​​The limiting assembly 20 includes at least two first limiting parts 21, which are arranged on the limiting slide 12 and can slide along the limiting slide 12. When the sample 200 is placed in the accommodating space 11, the plurality of first limiting parts 21 are arranged on both sides of the sample 200. The first limiting parts 21 can contact the sidewall of the sample 200. When the first limiting parts 21 arranged on both sides of the sample 200 approach each other, the plurality of first limiting parts 21 can clamp the sample 200 to limit the sample 200 in the first direction.

[0096] In some embodiments, as shown in Figures 5 to 8 , the first limiting assembly 20 includes a sliding block 211 and a fastener 212 connected to each other. The sliding block 211 is in sliding connection with the limiting slide 12. When the sliding block 211 is adjusted to a preset position of the limiting slide 12, the fastener 212 can fix the sliding block 211.

[0097] In one example, referring to Figures 5 to 8 , the sliding block 211 is provided with a threaded hole. The axial direction (z direction shown in Figure 5 ) of the threaded hole is perpendicular to the first direction (y direction shown in Figure 5 ). The fastener 212 is a screw or the like. By rotating the fastener 212, the fastener 212 can move relative to the sliding block 211 to press the jig body 10, so as to fix the sliding block 211 at the preset position of the limiting slide.

[0098] In another example, referring to Figures 13 to 15 , the axial direction of the threaded hole on the sliding block 211 can be parallel to the first direction (y direction shown in Figure 5 ). The fastener 212 is a lead screw. By rotating the lead screw, the sliding block 211 can move in the first direction. It should be noted that, in order to limit the sample 200 at the middle position, symmetrical and opposite screw threads can be arranged on the lead screw. Two sliding blocks 211 are arranged on the two end screw threads. When the lead screw is rotated, the two sliding blocks 211 can approach or move away from the rotation axis R at the same speed, so as to limit the sample 200 at the middle position.

[0099] In order to accurately know the position of the first limiting part 21 on the jig body 10, so as to determine whether the sample 200 is at the specified position, the semiconductor test jig 100 further includes a first scale 40 arranged on the jig body 10. The first scale 40 extends in the first direction.

[0100] Referring to Figure 5 and Figure 7The scale of the first scale 40 is bidirectional, and the middle position of the first scale 40 is the starting scale (0 scale), wherein the upper projection of the rotation axis falls on the starting scale.

[0101] It can be determined from the above that when the first limiting parts 21 on both sides of the sample 200 have the same reading and abut against the side surface of the sample 200, the center of the sample 200 falls on the starting scale of the first scale 40.

[0102] In one example embodiment, as shown in Figure 5 , the semiconductor test fixture 100 includes a fixture body 10 and a limiting assembly 20, the fixture body 10 has a receiving space 11 for accommodating a sample 200, the fixture body 10 can rotate around a preset axis, the limiting assembly 20 is arranged on the fixture body 10, and the limiting assembly 20 is used for limiting the sample 200 in a first direction and a second direction, so that the preset axis passes through the center of the sample 200, the first direction and the second direction are perpendicular to each other, and the first direction and the second direction are both perpendicular to the preset axis.

[0103] The semiconductor test fixture 100 provided in the embodiment can include any structure, device, etc. of the semiconductor test fixture 100 provided in the above embodiment. The embodiment is used to explain how the limiting assembly 20 limits the sample 200 in the second direction.

[0104] In the embodiment, as shown in Figure 5 , Figure 8 and Figure 9 , the limiting assembly 20 includes a second limiting part 22, the second limiting part 22 applies a force to the sample 200 in the second direction to press the sample 200 against the fixture body 10, so that the position of the sample 200 in the second direction can be limited. Of course, it can be understood that when the contact surface of the second limiting part 22 or the fixture body 10 with the sample 200 has sufficient friction, the second limiting part 22 can also limit the sample 200 in a third direction to avoid the sample 200 from being separated from the receiving space 11.

[0105] In one example, referring to Figure 5 , Figure 8 and Figure 9 , the top of the fixture body 10 can be provided with a first through hole, the first through hole extends in the second direction to communicate the receiving space 11 and the external atmosphere. The first through hole can be a threaded hole.

[0106] Continuing to refer to Figure 5 , Figure 8 and Figure 9The second limiting part 22 comprises a first pressing block 221 and a first adjusting screw 222. The first adjusting screw 222 is threadedly connected with the first through hole, and the first pressing block 221 is rotationally connected with the first adjusting screw 222. The first pressing block 221 is arranged in the accommodating space 11 and is used to contact the sample 200. The first adjusting screw 222 penetrates the first through hole and is threadedly connected with the first through hole. It can be understood that, when the first adjusting screw 222 is rotated in different directions (including clockwise and counterclockwise), the first adjusting screw 222 can drive the first pressing block 221 to move towards or away from the sample 200. When the first pressing block 221 moves away from the sample 200 until the first pressing block 221 is separated from the sample 200, the sample 200 can be adjusted in position and angle or the sample 200 after testing can be taken out. When the first pressing block 221 moves towards the sample 200 until the first pressing block 221 presses the sample 200, the sample 200 can be tested.

[0107] In an optional embodiment, as shown in Figures 13 to 15 The jig body 10 comprises a first structure 10a and a second structure 10b. The second structure 10b is used to support the bottom surface of the sample 200. The first structure 10a can be close to or away from the second structure 10b. When the first structure 10a is close to the second structure 10b, the first structure 10a can abut against the top surface of the sample 200, so as to clamp and fix the sample 200 together with the second structure 10b. In the jig body 10 provided in the embodiment, when the first structure 10a is away from the second structure 10b, the first structure 10a and the second structure 10b have a larger accommodating space therebetween, so as to be able to clamp the sample 200 with a larger thickness (z direction shown in Figure 5 In the first direction (y direction shown in Figure 5 The jig body 10 has a wider space, so as to be able to test a wider sample 200.

[0108] Of course, it can be understood that the way of pressing the sample 200 is not limited to this, and various mechanical mechanisms and driving devices can also be combined. For example, a pressing block can be installed on the output shaft of a driving motor. The pressing block is in the shape of an eccentric wheel. When the driving motor drives the eccentric wheel to rotate to a preset angle, the eccentric wheel can press the sample 200. For another example, an electric push rod can be used to drive the pressing block to press the sample 200. In order to avoid damage to the sample 200 caused by excessive movement of the driving motor and the electric push rod, a pressure sensor can be arranged on the pressing block.

[0109] In an exemplary embodiment, as shown in Figure 5As shown in

[0110] The semiconductor test fixture 100 provided by the embodiment can include any structure, device, etc. of the semiconductor test fixture 100 provided by the above embodiment.

[0111] The embodiment is used for explaining how the limiting assembly 20 limits the sample 200 in the second direction.

[0112] In the embodiment, as shown in Figure 5 , Figure 10 , Figure 11 and Figure 12 , the semiconductor test fixture 100 includes a connecting rod 30, an axis direction of the connecting rod 30 coincides with the preset axis R, a first end of the connecting rod 30 is connected with an output shaft of a driving device 400' (refer to Figure 1 ), and the driving device 400' can drive the connecting rod 30 to rotate around the preset axis R. As shown in Figure 5 , Figure 10 , Figure 11 and Figure 12 , a second end of the connecting rod 30 is provided with an adjusting track 31, the fixture body 10 is slidingly connected with the adjusting track 31, an extension direction of the adjusting track 31 is parallel to the second direction (z direction shown in Figure 5 ), and the position of the sample 200 in the second direction can be adjusted by sliding the fixture body 10 in the adjusting track 31.

[0113] It can be determined from the above that, by adjusting the position of the fixture body 10 in the adjusting track 31, the driving unit can drive the first connecting rod 30 and the fixture body 10 to rotate around the preset axis, so that the sample 200 can always be located at the middle position of the imaging plane, and when the detection device uses a larger magnification for testing, the sample 200 is still completely located in the imaging plane.

[0114] In one example, as shown in Figure 11 , a side wall of the adjusting track 31 is provided with a second through hole (which has been filled by the third limiting part 23, and thus is not shown), the second through hole penetrates the side wall of the adjusting track 31 along the first direction (y direction shown in Figure 5 ).

[0115] Continuing to refer toFigure 11 The limiting component 20 includes a third limiting part 23, which includes a second clamping block and a second adjusting screw. The second clamping block is disposed inside the adjusting track 31 and is used to contact the fixture body 10. The second adjusting screw passes through the second through hole and forms a threaded engagement with the second through hole. When the second adjusting screw is rotated, it can drive the second clamping block to move toward or away from the fixture body 10. When the second clamping block moves away from the fixture body 10 until it separates, the position of the fixture body 10 in the adjusting track can be adjusted. After the position of the fixture body 10 is adjusted to the specified position, the fixture body 10 can be pressed and fixed by rotating the second adjusting screw.

[0116] In another example (not shown in the accompanying diagram), see [reference needed]. Figure 14 and Figure 15 The first limiting part 21 shown in the figure is implemented by the third limiting part 23, which includes a third adjusting screw. The axial direction of the third adjusting screw can be aligned with the second direction. Figure 5 The third adjusting screw is parallel to the connecting rod 30 (as shown in the z-direction), and the third adjusting screw is rotatably connected to the connecting rod 30. The fixture body 10 is provided with a threaded hole, and the third adjusting screw and the threaded hole on the fixture body 10 cooperate to form a screw-slider 211 mechanism. When the third adjusting screw is rotated, the fixture body 10 can move relative to the connecting rod 30.

[0117] In related technologies, when hot melt adhesive is used to fix the sample directly to the fixture, the center point of the sample will change on the imaging plane when the fixture rotates the sample due to the sample's certain thickness. It will no longer be located in the middle position. In addition, the thickness of the hot melt adhesive applied each time may be different, and the thickness of the sample may also be different, resulting in low test accuracy and poor test results.

[0118] In order to determine the relative position of the fixture body 10 and the connecting rod 30 and whether the sample 200 to be tested is in the specified position, the semiconductor testing fixture 100 also includes a second scale 50 and a third scale 60. The second scale 50 is disposed on the fixture body 10 and extends along the second direction. The second scale 50 is used to measure the thickness h of the sample 200 to be tested in the second direction. The third scale 60 is disposed on the connecting rod 30 and extends along the second direction. The third scale 60 is used to measure the relative position of the fixture body 10 and the connecting rod 30.

[0119] Reference Figures 10 to 12, the third scale 60 has a two-way extending scale, and a middle position of the third scale 60 is a starting scale (i.e., a preset scale), and a projection of the rotation axis on the third scale 60 falls on the starting scale. According to a reading of the initial scale of the second scale 50 on the jig body 10 on the third scale 60, the position of the jig body 10 can be determined. Generally, in order to improve the reading speed, the initial scale (0 scale) of the second scale 50 is adjusted to coincide with the initial scale (0 scale) of the third scale 60. Figure 9 The initial scale (0 scale) of the second scale 50 can be adjusted to coincide with the initial scale (0 scale) of the third scale 60.

[0120] It can be determined that half of the thickness value h / 2 is adjusted to coincide with the preset scale (initial scale / 0 scale) on the third scale 60, and when the to-be-tested sample 200 is rotated by 90°, the to-be-tested sample 200 is still in the middle position of the imaging plane, and the test effect of the detection device is improved.

[0121] In an example embodiment, as shown in Figure 5 , the semiconductor test jig 100 includes a jig body 10 and a limiting assembly 20, the jig body 10 has a containing space 11 for containing a to-be-tested sample 200, the jig body 10 can rotate around a preset axis, the limiting assembly 20 is arranged on the jig body 10, and the limiting assembly 20 is used for limiting the to-be-tested sample 200 in a first direction and a second direction, so that the preset axis penetrates the center of the to-be-tested sample 200, the first direction and the second direction are perpendicular to each other, and the first direction and the second direction are both perpendicular to the preset axis.

[0122] The semiconductor test jig 100 provided in the embodiment can include any structure, device, etc. of the semiconductor test jig 100 provided in any of the above embodiments.

[0123] The embodiment describes how to limit the placement angle of the to-be-tested sample 200 in the containing space 11. It should be noted that, in order to test the to-be-tested sample 200 using a larger magnification, taking a rectangular profile to-be-tested sample 200 as an example, it is necessary to ensure that one of the central axes of the rectangular profile to-be-tested sample 200 is parallel to the first direction, and the other central axis is parallel to the second direction.

[0124] In some embodiments, as shown in Figure 5 , Figure 7 and Figure 9 , the containing space 11 has a limiting side wall 111, and a plane where the limiting side wall 111 is located is arranged perpendicularly to the preset axis on which the jig body 10 rotates. When the to-be-tested sample 200 is in an assembled state, one side of the to-be-tested sample 200 can be attached to the limiting side wall 111, so as to ensure that the to-be-tested sample 200 is placed at a correct angle.

[0125] In some embodiments, the length of the sliding block 211 of the first limiting part 21 of the limiting assembly 20 can be increased (in the x direction shown in the figure) so that when the two sliding blocks 211 clamp the two side walls of the sample 200, the sample 200 can be ensured to be placed at the correct angle. Figure 7

[0126] In some embodiments, the material of the jig body 10 and the limiting assembly 20 is any one or more of plastic, carbon fiber, ceramic, or other non-metal materials. These materials have the advantages of light weight, low density, no absorption of X-rays, and easy penetration of the test rays of the 3D X-ray microscope.

[0127] According to the exemplary embodiments of the present disclosure, as shown in Figure 16 The present disclosure provides a semiconductor product testing method, which can use the semiconductor testing jig provided by the above-mentioned embodiments of the present disclosure. The semiconductor product testing method can include the following steps:

[0128] Step S100: placing a sample to be tested in the accommodation space of the jig body.

[0129] In this step, the sample to be tested can be placed in the accommodation space at the correct angle according to the length, width, and thickness of the sample to be tested and the length, width, and height of the accommodation space.

[0130] After the placement is completed, at least part of the structure of the sample to be tested is usually not in the accommodation space, so as to facilitate subsequent angle and position adjustment of the sample to be tested.

[0131] Step S200: adjusting the limiting assembly so that the preset axis penetrates the center of the sample to be tested.

[0132] In this step, the limiting assembly can be adjusted to adjust the placement position of the sample to be tested in the accommodation space and the relative position of the jig body and the connecting rod until the rotation axis of the jig body penetrates the center of the sample to be tested.

[0133] In one example, the rotation axis of the jig body can penetrate the central axis of the sample to be tested.

[0134] In another example, the rotation axis of the jig body can have an included angle with the central axis of the sample to be tested. That is, the sample to be tested can be fixed in the accommodation space of the jig body at an angle.

[0135] Step S300: controlling the jig body to rotate around the preset axis and testing the sample to be tested.

[0136] ​In this step, after the to-be-tested sample is placed, the driving unit can be controlled to drive the jig body to rotate around the rotation axis, so that the to-be-tested sample is at different angles in the three-dimensional space, and the detection device can test the to-be-tested sample at different angles.

[0137] In the embodiments of the present disclosure, the to-be-tested sample is positioned by the limiting assembly, so that the preset axis of rotation of the jig body penetrates the center of the to-be-tested sample, and compared with the related art of using hot melt adhesive to bond the to-be-tested sample and the test jig, the to-be-tested sample can be quickly fixed, and the to-be-tested sample will not be damaged when the placement angle and position of the to-be-tested sample are adjusted.

[0138] In one example embodiment, the present embodiment is a further description of step S200 in the above-mentioned embodiments, and adjusting the limiting assembly can specifically include the following steps:

[0139] In step S210, the positions of the plurality of first limiting portions on the limiting track are adjusted based on the readings of the first limiting portions on the first scale, until the distances between the plurality of first limiting portions and the preset axis in the first direction are equal, and the first limiting portions are all in abutment with the side surface of the to-be-tested sample.

[0140] In this step, the scale of the first scale can be set to extend in two directions, and the middle position of the first scale is the starting scale (0 scale), and the projection of the rotation axis on the first scale falls on the starting scale.

[0141] As can be determined from the above, when the first limiting portions located on both sides of the to-be-tested sample have the same reading, and the first limiting portions are all in abutment with the side surface of the to-be-tested sample, the projection of the center of the to-be-tested sample on the first scale falls on the starting scale of the first scale.

[0142] In one example embodiment, the present embodiment is a further description of step S200 in the above-mentioned embodiments, and adjusting the limiting assembly can specifically include the following steps:

[0143] In step S220, the thickness value of the to-be-tested sample is determined based on the reading of the to-be-tested sample on the second scale.

[0144] Before determining the thickness of the to-be-tested sample, the semiconductor product testing method further includes:

[0145] The second limiting portion is adjusted to press the top surface of the to-be-tested sample, so that the bottom surface of the to-be-tested sample is attached to the bottom surface of the accommodation space.

[0146] In this step, in order to improve the reading speed, the initial scale of the second scale can be set to be flush with the bottom surface of the accommodation space, and the reading of the top of the to-be-tested sample on the second scale is the thickness of the to-be-tested sample.

[0147] Step S230, determining the relative position between the jig body and the third scale based on the reading of the jig body on the third scale.

[0148] In this step, the scale of the third scale is bidirectional, and the middle position of the third scale is the initial scale (i.e., the preset scale), and the projection of the rotation axis on the third scale falls on the initial scale. According to the reading of the initial scale of the second scale on the jig body on the third scale, the position of the jig body can be determined.

[0149] Generally, in order to improve the reading speed, the initial scale of the second scale can be adjusted to coincide with the initial scale of the third scale. Figure 12 The initial scale of the second scale can be adjusted to coincide with the initial scale of the third scale.

[0150] Step S240, adjusting the jig body in the second direction according to the thickness value and the relative position, so that half of the thickness value coincides with the preset scale on the third scale.

[0151] In this step, it can be determined that when half of the thickness value is adjusted to coincide with the preset scale (i.e., the initial scale) on the third scale, in the thickness direction of the sample to be measured, one half of the sample to be measured is on one side of the rotation axis, and the other half of the sample to be measured is on the other side of the rotation axis, so that the thickness of the sample to be measured can be avoided to affect the test.

[0152] In one exemplary embodiment, the present embodiment is a further description of step S100 in the above-mentioned embodiment, and placing the sample to be measured in the accommodation space can specifically include the following steps:

[0153] Step S110, controlling the side of the sample to be measured to be attached to the limiting side wall of the accommodation space.

[0154] In this step, when the sample to be measured is in the assembled state, the side of the sample to be measured is attached to the limiting side wall, which can ensure that the sample to be measured is placed at the correct angle. Taking a rectangular profile sample to be measured as an example, it is necessary to ensure that one of the central axes of the rectangular profile sample to be measured is parallel to the first direction, and the other central axis is parallel to the second direction.

[0155] Each embodiment or implementation in the present specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between each embodiment can be referred to each other.

[0156] In the description of the present specification, the description of the terms "embodiment", "exemplary embodiment", "some implementations", "illustrative implementation", "example" and the like means that the specific features, structures, materials or characteristics described in conjunction with the implementation or example are included in at least one implementation or example of the present disclosure.

[0157] In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Also, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0158] In the description of the present disclosure, it should be explained that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0159] It can be understood that the terms "first", "second" and the like used in the present disclosure can be used in the present disclosure to describe various structures, but these structures are not limited by these terms. These terms are only used to distinguish the first structure from another structure.

[0160] In one or more drawings, the same elements are represented by similar reference signs. For the sake of clarity, parts of the drawings are not drawn to scale. In addition, some known parts can not be shown. For the sake of simplicity, structures obtained after several steps can be described in one drawing. Many specific details of the present disclosure are described below, such as the structure, material, size, processing process and technology of the device, so that the present disclosure can be more clearly understood. But as those skilled in the art can understand, the present disclosure can be implemented without these specific details.

[0161] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, and not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A testing method for semiconductor products applied to a semiconductor testing fixture, characterized in that, The semiconductor testing fixture includes: The fixture body has a accommodating space for accommodating the sample to be tested, wherein the fixture body is rotatable about a preset axis; A limiting component is disposed on the fixture body. The limiting component is used to limit and fix the sample to be tested in a first direction and a second direction, so that the preset axis passes through the center of the sample to be tested. A second scale, which extends along the second direction; The third scale, the extension direction of which is parallel to the second direction; Wherein, the first direction and the second direction are perpendicular to each other, and both the first direction and the second direction are perpendicular to the preset axis; The testing methods for the semiconductor products include: The sample to be tested is placed in the accommodating space of the fixture body; Adjusting the limiting component so that the preset axis passes through the center of the sample to be tested includes: determining the thickness value of the sample to be tested based on the reading of the sample to be tested on the second scale; determining the relative position of the fixture body and the third scale based on the reading of the fixture body on the third scale; and adjusting the fixture body along the second direction according to the thickness value and the relative position so that half of the thickness value coincides with the preset scale on the third scale. The fixture body is controlled to rotate around the preset axis, and the sample to be tested is tested.

2. The testing method for semiconductor products according to claim 1, characterized in that, The preset axis passes through the center of the sample to be tested and includes: The preset axis passes through the central axis of the sample to be tested.

3. The testing method for semiconductor products according to claim 1, characterized in that, The fixture body is provided with a limiting slide, which extends along the first direction; The limiting component includes at least two first limiting parts, which are disposed on the limiting slide and can slide along the limiting slide. In the first direction, a plurality of first limiting parts are disposed on both sides of the sample to be tested. The first limiting part abuts against two opposite sides of the sample to be tested to limit the sample to be tested in the first direction.

4. The testing method for semiconductor products according to claim 3, characterized in that, The first limiting part includes a connected slider and a fastener, wherein the slider is slidably connected to the limiting slide rail; The fastener is used to fix the slider to the limiting slide when the slider moves to the preset position of the limiting slide.

5. The testing method for semiconductor products according to claim 1, characterized in that, The limiting component includes a second limiting part, which applies a force to the sample to be tested along the second direction to press the sample to be tested against the fixture body.

6. The testing method for semiconductor products according to claim 5, characterized in that, The top of the fixture body is provided with a first through hole extending along the second direction, and the first through hole communicates with the accommodating space; The second limiting part includes a first clamping block and a first adjusting screw connected together. The first clamping block is disposed in the accommodating space and is used to contact the sample to be tested. The first adjusting screw passes through the first through hole and forms a threaded engagement with the first through hole. By rotating the first adjusting screw, the first clamping block is driven to move toward or away from the sample to be tested.

7. The test method for semiconductor products according to any one of claims 1-6, characterized in that, The semiconductor testing fixture also includes a connecting rod, the first end of which is connected to the output shaft of the drive unit, and the drive unit is used to drive the connecting rod to rotate. An adjustment rail is provided at the second end of the connecting rod, and the fixture body is slidably connected to the adjustment rail, wherein the extension direction of the adjustment rail is parallel to the second direction.

8. The testing method for semiconductor products according to claim 7, characterized in that, The side wall of the adjustment track is provided with a second through hole, which penetrates the side wall of the adjustment track along the first direction. The limiting component includes a third limiting part, which includes a second clamping block and a second adjusting screw. The second clamping block is disposed inside the adjusting track and is used to contact the fixture body. The second adjusting screw passes through the second through hole and forms a threaded engagement with the second through hole.

9. The testing method for semiconductor products according to claim 3, characterized in that, The semiconductor testing fixture also includes: A first scale, which extends along the first direction.

10. The testing method for semiconductor products according to claim 1, characterized in that, The accommodating space includes a limiting sidewall, and the preset axis is perpendicular to the limiting sidewall; In the assembled state, one side of the sample to be tested is in contact with the limiting sidewall.

11. The testing method for semiconductor products according to claim 1, characterized in that, The materials of the fixture body and / or the limiting component include plastic, carbon fiber, ceramic, and any one or more other non-metallic materials.

12. The method for testing semiconductor products according to claim 9, characterized in that, Adjustable limit components, including: Based on the reading of the first limiting part on the first scale, the positions of the plurality of first limiting parts on the limiting slide are adjusted until the distance between the plurality of first limiting parts and the preset axis is equal in the first direction, and the first limiting parts all abut against the side of the sample to be tested.

13. The testing method for semiconductor products according to claim 5, characterized in that, Before determining the thickness of the sample to be tested, the testing method for the semiconductor product further includes: Adjust the second limiting part to press the top surface of the sample to be tested so that the bottom surface of the sample to be tested fits against the bottom surface of the accommodating space.

14. The testing method for semiconductor products according to claim 10, characterized in that, Place the sample to be tested in the accommodating space, including: The side of the sample to be tested is controlled to fit against the limiting sidewall of the accommodating space.

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