Cooling block assembly for cooling a heat-generating electronic component

Abstract

A cooling block assembly for cooling a heat-generating electronic component, comprising: an upper block portion defining at least one internal fluid conduit, the upper block portion having a lower surface configured to face the heat-generating electronic component; a boss spaced apart from the lower surface and having a heat transfer surface configured to be in thermal contact with the heat-generating electronic component, the heat transfer surface being offset relative to the lower surface; an outer periphery of the heat transfer surface being smaller than an outer periphery of the upper block portion; in a projection of the outer periphery of the heat transfer surface and the outer periphery of the upper block portion on a plane parallel to the heat transfer surface, the outer periphery of the heat transfer surface is included in the outer periphery of the upper block portion; and a heat distribution device, a plurality of heat distribution devices for distributing heat by a phase change of a working substance contained in the heat distribution device, each heat distribution device being partially disposed between the boss and the lower surface of the upper block portion.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to European Patent Application No. 21306655.8, filed on November 29, 2021, the entire content of which is incorporated herein by reference. Technical field

[0003] The present technology relates to liquid cooling components and methods and systems for such liquid cooling components. Background art

[0004] Thermal dissipation is an important consideration in computer systems. Notably, many components of a computer system, such as a processor (also known as a central processing unit (CPU)), generate heat and thus require cooling to avoid performance degradation and, in some cases, failure. Similar considerations also arise in systems other than computer systems (e.g., power management systems). Thus, in many cases, different types of cooling solutions are implemented to facilitate the dissipation of heat from heat-generating electronic components, with the aim of collecting the thermal energy of the heat-generating electronic components and conducting this thermal energy away from these heat-generating electronic components. For example, in a data center where multiple electronic systems (e.g., servers, network devices, power equipment) are continuously operating and generating heat, such cooling solutions are particularly important.

[0005] An example of a cooling solution is a radiator, which relies on a heat transfer medium (e.g., a gas or a liquid) to carry away the heat generated by heat-generating electronic components. For example, a cooling block (sometimes referred to as a "water block") as a liquid-cooled radiator can be thermally coupled to a heat-generating electronic component and cause water (or other liquid) to flow through ducts in the cooling block to absorb the heat of the heat-generating electronic component. When the water flows out of the cooling block, the thermal energy thus collected also flows out of the cooling block.

[0006] However, some heat-generating electronic components, such as CPUs, are designed to be more powerful and / or increasingly smaller and thus become more power-dense. As a result, such heat-generating electronic components generate more heat per unit surface area. Therefore, a cooling block that performs satisfactorily in absorbing the heat of less power-dense electronic components may perform less effectively on more power-dense electronic components.

[0007] Therefore, there is a desire for a cooling block that can alleviate at least some of these drawbacks. Summary of the invention

[0008] The object of the present technology is to improve at least some of the inconveniences existing in the prior art.

[0009] According to one aspect of the present technology, there is provided a cooling block assembly for cooling a heat-generating electronic component. The cooling block assembly includes: an upper block portion defining at least one internal fluid conduit for circulating a cooling fluid therethrough, each of the at least one internal fluid conduits having an inlet for receiving the cooling fluid and an outlet for discharging the cooling fluid, the upper block portion having a lower surface configured to face the heat-generating electronic component; a boss connected to the upper block portion and spaced apart from the lower surface of the upper block portion, the boss having a heat transfer surface configured to be in thermal contact with the heat-generating electronic component, the heat transfer surface being offset relative to the lower surface in the height direction of the cooling block; the size of the boss being set such that the outer peripheral portion of the heat transfer surface is smaller than the outer peripheral portion of the upper block portion; in a projection of the outer peripheral portion of the heat transfer surface and the outer peripheral portion of the upper block portion on a plane parallel to the heat transfer surface, the outer peripheral portion of the heat transfer surface is included in the outer peripheral portion of the upper block portion; and a plurality of heat distribution devices configured to distribute heat by phase change of a working substance included in each heat distribution device, each heat distribution device being partially disposed between the boss and the lower surface of the upper block portion to distribute heat from the boss to the lower surface.

[0010] In some embodiments, the heat distribution device is one of the following: a heat pipe, a phase change material, and a loop heat pipe.

[0011] In some embodiments, the heat distribution device is a heat pipe. Each heat pipe includes: a housing having a heat input surface in contact with the boss and a heat output surface opposite to the heat input surface, the heat output surface being in contact with the lower surface of the upper block portion; and a working substance included in the housing, the working substance being configured to evaporate and condense sequentially to propagate heat from the heat input surface to the heat output surface.

[0012] In some embodiments, the heat distribution device is a vapor chamber.

[0013] In some embodiments, most of the lower surface of the upper block portion is in contact with the heat output surface of the heat pipe.

[0014] In some embodiments, the upper block portion defines a plurality of recesses on the lower side portion of the upper block portion for receiving the heat distribution devices.

[0015] In some embodiments, a notch is defined between the upper block portion and the boss for receiving a part of a corresponding heat distribution device in the heat distribution devices.

[0016] In some embodiments, for each heat distribution device, most of the heat distribution devices in the heat distribution devices are not disposed between the boss and the lower surface of the upper block portion.

[0017] In some embodiments, the ratio of the area defined by the outer peripheral portion of the upper block portion to the area defined by the outer peripheral portion of the heat transfer surface is equal to or greater than 3.

[0018] In some embodiments, the ratio of the area defined by the outer peripheral portion of the upper block portion to the area defined by the outer peripheral portion of the heat transfer surface is between 3 and 8, inclusive of 3 and 8.

[0019] In some embodiments, at least one fluid conduit includes a first fluid conduit and a second fluid conduit; a plurality of heat distribution devices includes a first heat distribution device and a second heat distribution device; the first heat distribution device is aligned with the first fluid conduit for distributing heat to the first fluid conduit; and the second heat distribution device is aligned with the second fluid conduit for distributing heat to the second fluid conduit.

[0020] In some embodiments, the upper block portion includes a base and a cover connected to the base, and at least one internal fluid conduit is defined between the base and the cover.

[0021] In some embodiments, at least one fluid conduit is a plurality of fluid conduits, the plurality of fluid conduits including a first fluid conduit and a second fluid conduit; the base is a first base, and the cover is a first cover, the first base and the first cover defining the first fluid conduit therebetween; the upper block portion further includes: a heat transfer base having a plurality of recessed portions defined therein, the plurality of recessed portions including a first recessed portion and a second recessed portion, the first base being received in the first recessed portion; a second base received in the second recessed portion; and a second cover connected to the second base, the first base and the first cover defining the second fluid conduit therebetween with the second base and the second cover.

[0022] Each embodiment of the present technology has at least one of the above objects and / or aspects, but not necessarily all of them. It should be understood that some aspects arising from attempting to achieve the above objects in the present technology may not meet this object and / or may meet other objects not specifically described herein.

[0023] Additional and / or alternative features, aspects, and advantages of embodiments of the present technology will become apparent from the following description, drawings, and appended claims.

[0024] It should be understood that terms related to the position and / or orientation of components, such as "upper", "lower", "top", "bottom", "front", "rear", "left", "right", are used herein for simplicity of description and do not imply a specific position / orientation limitation of the components in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] To better understand the present technology and its other aspects and additional features, reference is made to the following description, which will be used in conjunction with the appended Figure 1 wherein:

[0026] Figure 1 is a perspective view of a cooling block assembly according to an embodiment of the present technology, viewed from the top, front, and right side.

[0027] Figure 2 is Figure 1 the bottom plan view of the cooling block assembly.

[0028] Figure 3 is a cross-sectional view of Figure 1 the cooling block assembly taken along the center line 3-3 of Figure 1 the cooling block assembly.

[0029] Figure 4 is Figure 1 the partially exploded view of the cooling block assembly.

[0030] Figure 5 is Figure 1 the top plan view of a partial cooling block of the cooling block assembly.

[0031] Figure 6 is Figure 5 the bottom plan view of the cooling block.

[0032] Figure 7 is Figure 1 the perspective view of the heat transfer base of the cooling block assembly, viewed from the bottom, front, and left side.

[0033] Figure 8 is Figure 1 a schematic diagram of one of the plurality of heat dissipation devices of the cooling block assembly; and

[0034] Figure 9 is a cross-sectional view of a cooling block assembly according to an alternative embodiment. DETAILED DESCRIPTION

[0035] Figures 1 to 4 illustrates a cooling block assembly 200 according to an embodiment of the present technology. The cooling block assembly 200 is configured to cool a heat-generating electronic component 50 (schematically shown in Figure 3 ). In this example, the heat-generating electronic component 50 is a central processing unit (CPU). For example, the heat-generating electronic component 50 can be part of a server or other computer device operating in a data center. In use, the heat-generating electronic component 50 generates a large amount of heat and can benefit from cooling. It is contemplated that the heat-generating electronic component 50 can be any other suitable heat-generating electronic component (e.g., a graphics processing unit (GPU), a memory component, a semiconductor, etc.).

[0036] In this embodiment, the cooling block assembly 200 includes: two cooling blocks 10; a heat transfer base 160 to which the cooling blocks 10 are mounted; and a plurality of heat distribution devices 250 that are connected to the heat transfer base 160. As will be explained in detail below, the heat distribution devices 250 are configured to distribute heat through the phase change of a working substance contained in the heat distribution devices 250.

[0037] An exemplary configuration of the cooling block 10 will now be described. The cooling blocks 10 are identical to each other, and thus only one of the cooling blocks 10 will be described in detail herein. It should be understood that a similar description applies to the other cooling block 10.

[0038] The cooling block 10 has a base 12 and a cover 14 connected to the base 12. The base 12 and the cover 14 together define an internal fluid conduit 15 (schematically shown in Figure 5 ), and a cooling fluid circulates in the internal fluid conduit 15 to absorb heat from the heat-generating electronic component 50. As Figure 5 shown, the internal fluid conduit 15 extends from an inlet 17 of the cooling block 10 to an outlet 19. In this embodiment, the cooling fluid circulating through the internal fluid conduit 15 is demineralized water. However, in other embodiments, the cooling fluid can be any other suitable cooling fluid (e.g., a refrigerant). In some embodiments, the cooling fluid can be capable of two-phase flow so that the cooling fluid can change from a liquid phase to a gas phase or from a gas phase to a liquid phase according to the temperature of the cooling fluid. Therefore, the cooling fluid circulating within the cooling block 10 will be in the liquid phase at certain times, yet the cooling fluid does not necessarily always remain in the liquid phase (e.g., the cooling fluid can evaporate from a liquid to a gas when its temperature reaches a certain value).

[0039] As Figure 3 and Figure 6 best shown, the base 12 has a lower portion 16 and an upper portion 18 disposed above the lower portion 16. The lower portion 16 has an outer periphery smaller than the outer periphery of the upper portion 18, and thus, the upper portion 18 forms an outer peripheral shoulder 24 that extends outward from the upper end of the lower portion 16. As Figure 6 shown, the lower portion 16 is generally positioned in a central position relative to the upper portion 18. In this embodiment, the lower portion 16 is generally square, and thus the lower portion 16 has four outer surfaces. The lower portion 16 defines a heat contact surface 22 of the cooling block 10, and the heat contact surface 22 is provided on the lower side 20 of the base 12. The heat contact surface 22 is the surface of the base 12 through which heat is mainly transferred to the cooling block 10. Therefore, in use, the heat contact surface 22 is arranged to be in thermal contact with another surface from which heat is to be absorbed.

[0040] AsFigure 3 As shown, the base 12 defines a recessed portion 32, the shape and size of the recessed portion 32 being set such that the covering member 14 is at least partially received in the recessed portion 32. It is noted that, in the present embodiment, the recessed portion 32 is generally square, which is defined by the square shape of the fixed lip portion 30 that defines the recessed portion 32. In particular, the fixed lip portion 30 and the upper base surface 28 of the base 12 jointly define the recessed portion 32. The upper base surface 28 defines a channel 34( Figure 3 ), which partially forms the internal fluid conduit 15 of the cooling block 10. It is noted that the channel 34 establishes the path of the internal fluid conduit 15, thereby guiding the cooling fluid in the internal fluid conduit 15 to circulate through the cooling block 10 from the inlet 17 to the outlet 19. In different embodiments, the channel 34 can have any suitable shape. For example, the shape of the channel 34 can be set to partially define a serpentine path from the inlet 17 to the outlet 19.

[0041] In this embodiment, the covering member 14 is a plate-like member, which is generally flat, and the shape of the plate-like member can be set to be received within the recessed portion 32. As Figure 5 shown, the covering member 14 defines an inlet opening 23 and an outlet opening 25, and the inlet opening 23 and the outlet opening 25 correspond to the inlet 17 and the outlet 19 of the cooling block 10, respectively. Thus, the cooling liquid is fed into the internal fluid conduit 15 and discharged from the internal fluid conduit 15 through the inlet opening 23 and the outlet opening 25 of the covering member 14, respectively. The inlet pipe 40 and the outlet pipe 42 are connected to the covering member 14 at the inlet opening 23 and the outlet opening 25, respectively, to fluidly connect the internal fluid conduit 15 to an external cooling fluid source. For example, in a data center, the external cooling liquid source can include a circuit of cooling equipment, which includes one or more dry coolers installed outside the data center. Thus, during use, in the present embodiment, the cooling fluid continuously recirculates between the external cooling fluid source and the cooling block 10.

[0042] As Figure 3 shown, the covering member 14 is received in the recessed portion 32 of the base 12, wherein the lower surface 36 of the covering member 14 faces the upper base surface 28. In particular, the lower surface 36 is arranged to contact the upper base surface 28. Thus, the internal fluid conduit 15 of the liquid cooling block 10 is defined by the lower surface 36 of the covering member 14 and the channel 34 of the base 12. It is conceivable that, in some embodiments, the covering member 14 can define a channel complementary to the channel 34 of the base 12 in the lower surface 36. In addition, in other embodiments, the channel 34 can be omitted from the base 12, and the covering member 14 can alternatively define the channel.

[0043] In this embodiment, the thickness of the cover member 14 is approximately equal to the height of the fixed lip portion 30 such that when the cover member 14 is disposed in the recess portion 32, the upper (outer) surface 38 of the cover member 14 is generally flush with the upper surface of the fixed lip portion 30. Additionally, in this embodiment, the cover member 14 is welded to the base 12 along the outer peripheral portion of the cover member 14. For example, the cover member 14 can be laser welded to the base 12.

[0044] Referring Figure 4 , the heat spreader base 160 has a base body 162 that has an upper side 164 and a lower side 166 opposite the upper side 164. The base body 162 has a main portion 163 that receives the cooling block 10. Notably, as Figure 4 best shown, the main portion 163 has two upper base surfaces 176 on the upper side 164. Two fixed lip portions 178 extend upwardly from the upper base surfaces 176 and surround the respective base surfaces 176 of the upper base surfaces 176. Accordingly, the main portion 163 of the heat spreader base 160 defines two recess portions 180, each recess portion 180 being defined by one of the upper base surfaces 176 and the corresponding fixed lip portion 178. The shape and size of the recess portions 180 are configured to at least partially receive the base 12 of the cooling block 10.

[0045] In this embodiment, two cooling blocks 10 cooperate with the heat spreader base 160. More specifically, the lower portions 16 of the cooling blocks 10 are inserted into the respective recess portions 180 of the heat spreader base 160. To this end, the shape and size of each recess portion 180 are configured such that: when the lower portion 16 of the corresponding cooling block 10 is inserted into the recess portion 180, the inner surface 179 ( Figure 4 ) of the fixed lip portion 178 defining the recess portion 180 and the outer surface 29 ( Figure 6 ) of the lower portion 16 closely fit. The fixed lip portions 178 of the heat spreader base 160 thus surround the lower portions 16 of the corresponding cooling blocks 10, thereby restricting the horizontal movement (e.g., forward, backward, and lateral) of the lower portions 16 of the corresponding cooling blocks 10 relative to the heat spreader base 160. Prior to inserting the lower portions 16 into the respective recess portions 180, a thermal interface material can be applied to one or both of the thermal contact surface 22 and the upper base surface 176.

[0046] Now returning to Figure 3, the base body 162 further has a boss 220 connected to the main portion 163. The boss 220 is provided on the lower side 166 of the base body 162 and is spaced apart from the lower surface 167 of the main portion 163 in the height direction of the cooling block assembly 200. The lower surface 167 is located on the lower side 166 of the heat transfer base 160 and is configured to face the heat-generating electronic component 50. Accordingly, the boss 220 is provided below the main portion 163, and the boss 220 can be referred to as the "lower block portion", while the main portion 163 of the heat transfer base 160 and the cooling block 10 together can be referred to as the "upper block portion" 189 of the cooling block assembly 100. Accordingly, the upper block portion 189 defines two internal fluid ducts 15, and the boss 220 is provided below the upper block portion 189, and the boss 220 is the portion of the cooling block assembly 200 that makes thermal contact with the heat-generating electronic component 50. It is noted that the boss 220 defines a heat transfer surface 170 that is configured to make thermal contact with the heat-generating electronic component 50 (a thermal interface material is provided between the heat transfer surface 170 and the heat-generating electronic component 50). Accordingly, the heat transfer surface 170 is a surface of the heat transfer base 160 through which heat is mainly transferred to the cooling block assembly 100. The heat transfer surface 170 is offset relative to the lower surface 167 of the upper block portion 189. In this example, the boss 220 and the heat transfer surface 170 of the boss 220 are generally square.

[0047] As can be seen Figure 2 from, the size of the boss 220 is significantly smaller than the size of the upper block portion 189. It is noted that the size of the boss 220 is set to match the size of the surface of the heat-generating electronic component 50. In particular, the size of the boss 220 is set such that the outer peripheral portion 221 of the heat transfer surface 170 is smaller than the outer peripheral portion 195 of the upper block portion 189. The outer peripheral portion 195 of the upper block portion 189 is defined by the edges of the heat transfer base 160 that are perpendicular to the heat transfer surface 170. For example, in this embodiment, the ratio of the area defined by the outer peripheral portion 195 of the upper block portion 189 to the area defined by the outer peripheral portion 221 of the heat transfer surface 170 is equal to or greater than 3. In particular, in this example, the ratio of the area defined by the outer peripheral portion 195 of the upper block portion 189 to the area defined by the outer peripheral portion 221 of the heat transfer surface 170 is between 3 and 8 (inclusive).

[0048] In addition, the boss 220 is generally centered in the longitudinal and lateral directions relative to the upper block portion 189. Accordingly, in the projection of the outer peripheral portion 221 and the outer peripheral portion 195 on a plane parallel to the heat transfer surface 170, the outer peripheral portion 221 of the heat transfer surface 170 is included in the outer peripheral portion 195 of the upper block portion 189.

[0049] Referring to Figure 3 andFigure 8 The heat distribution device 250 is configured to distribute heat through the phase change of a working substance contained within each heat distribution device 250. In this embodiment, two heat distribution devices 250 are provided, and each heat distribution device 250 is aligned with a corresponding one of the internal fluid conduits 15 within the internal fluid conduit 15. That is, each heat distribution device 250 is disposed below a corresponding one of the internal fluid conduits 15 within the internal fluid conduit 15 so as to diffuse heat into the corresponding internal fluid conduit 15. It is contemplated that in some embodiments, a single internal fluid conduit 15 and heat distribution device 250 may thus be aligned with a portion of a single internal fluid conduit 15.

[0050] As Figure 2 and Figure 3 shown, in this embodiment, each heat distribution device 250 is partially disposed between the boss 220 and the lower surface 167 of the upper block portion 189 so as to distribute heat from the boss 220 to the lower surface 167. It is noted that by positioning the heat distribution device 250 in this manner, the heat distribution device 250 can distribute the heat absorbed by the boss 220 from the heat-generating electronic component 50 to a larger surface, namely the lower surface 167, thereby providing effective cooling for the heat-generating electronic component 50.

[0051] As Figure 7 best shown, in this example, the main portion 163 of the base body 162 defines two recesses 168 on the lower side 166 for receiving the corresponding heat distribution devices 250 of the heat distribution devices 250. Further, in this example, each recess 168 extends to the edge 169 of the base body 162. This can facilitate the installation and positioning of the heat distribution devices 250 on the heat dissipation base 160. In this embodiment, the heat distribution devices 250 are fixed to the heat dissipation base 160. In particular, in this example, the heat distribution devices 250 are soldered to the heat dissipation base 160. In other embodiments, the heat distribution devices 250 may be connected to the heat dissipation base 160 in any other suitable manner.

[0052] In addition, as Figure 3 best shown, in this embodiment, the base body 162 defines two notches 185 between the lower surface 167 of the base body 162 and the boss 220. Each notch 185 receives a component 260 of the corresponding heat distribution device 250 therein so that the component 260 is disposed between the lower surface 167 and the boss 220. Each component 260 is a small portion of the corresponding heat distribution device 250. It is noted that each component 260 is less than half of the corresponding heat distribution device 250. Thus, for each heat distribution device 250, most of the heat distribution device 250 is not disposed between the boss 220 and the lower surface 167.

[0053] In this embodiment, the heat distribution device 250 is a heat pipe. More specifically, in this example, the heat distribution device 250 is a vapor chamber (i.e., a flat heat pipe). Thus, referring to Figure 8 , in this embodiment, each heat distribution device 250 functions based on the following: A working substance (e.g., water) contained in each heat distribution device 250 evaporates on the evaporator side 254 of the heat distribution device 250 in response to being heated to a given temperature. The working substance thus changes from a liquid state to a gaseous state. Then, the vaporized working substance travels to the condenser side 256 of the heat distribution device 250 opposite the evaporator side 254, where heat is transferred outward from the working substance to a cooler surface (in this case, the lower surface 167) in contact with the condenser side 256. The working substance thus condenses back to a liquid and again reaches the evaporator side 254 through the wick material 277.

[0054] As Figure 8 shown, each heat distribution device 250 has a housing 270 that has a heat input surface 272 (on the evaporator side 254) and a heat output surface 274 opposite the heat input surface 272. A portion of the heat input surface 272 (constituted by the component 260) is in contact with the boss 220. The heat output surface 274 is in contact with the lower surface 167 of the upper block portion 189. The combined surface area of the heat output surfaces 274 of the two heat distribution devices 250 is relatively large, such that most of the lower surface 167 of the upper block portion 189 is in contact with the heat output surface 274. Thus, the heat distribution device 250 diffuses the heat absorbed thereby to most of the upper block portion 189. A thermal interface material can be applied between the heat input surface 272 of each of the heat distribution devices 250 and the boss 200, and between the heat output surface 274 of each of the heat distribution devices 250 and the lower surface 167.

[0055] In other embodiments, the heat distribution device 250 can be other types of heat pipes, including, for example, annular heat pipes. Additionally, in other embodiments, the heat distribution device 250 can be a loop heat pipe or a phase change material.

[0056] Although the cooling block assembly 200 has been shown and described as including two cooling blocks 10 and a heat spreading base 160, in other embodiments, the heat spreading base 160 itself can constitute a cooling block. For example, referring to Figure 9, in an alternative embodiment, the channel 34 corresponding to the internal fluid conduit 15 is defined by the upper base surface 176 of the heat transfer base 160, and the recess 180 directly receives the cover 14 in the recess 180. In other words, the base 12 is omitted. In this case, the upper block portion 189 includes the heat transfer base 160 and the cover 14, and the internal fluid conduit 15 is defined between the heat transfer base 160 and the cover 14. In the case where the cooling block assembly 200 has only one internal fluid conduit 15, then a single cover 14 can be provided.

[0057] As can be seen from the above, the cooling block assembly 200 described herein diffuses the heat absorbed from the heat-generating electronic component 50 to a larger surface, i.e., the heat output surface 274 of the heat distribution device 250, so that the cooling fluid circulating through the two internal fluid conduits 15 (or a larger single internal fluid conduit 15) can absorb the heat and carry away the heat when the cooling fluid is discharged. Therefore, the cooling block assembly 200 allows the cooling of small and power-intensive heat-generating electronic components 50, which may be difficult for a cooling block having a size comparable to the size of the heat-generating electronic component 50.

[0058] Modifications and improvements to the above-described embodiments of the present technology may be apparent to those skilled in the art. The above description is intended to be exemplary and not restrictive. Therefore, the scope of the present technology is limited only by the scope of the appended claims.

Claims

1. A cooling block assembly (200) for cooling a heat - generating electronic component (50), comprising: An upper block portion (189) defining at least one internal fluid conduit (15) for circulating a cooling fluid therethrough, each of the at least one internal fluid conduits (15) having an inlet (17) for receiving the cooling fluid and an outlet (19) for discharging the cooling fluid; The upper block portion (189) includes a heat - spreading base (160) having a base body (162), and a lower surface (167) of the base body (162) is configured to face the heat - generating electronic component (50); A boss (220) connected to a main portion (163) of the base body (162), the boss (220) being disposed on a lower side (166) of the base body (162) and spaced from the lower surface (167) of the base body (162) in a height direction of the cooling block assembly (200). A notch (185) is defined between the lower surface (167) of the base body (162) and the boss (220). The boss (220) has a heat - transfer surface (170) configured to be in thermal contact with the heat - generating electronic component (50). The heat - transfer surface (170) is offset relative to the lower surface (167) of the base body (162) in the height direction of the cooling block assembly (200). The size of the boss (220) is set such that an outer peripheral portion (221) of the heat - transfer surface (170) is smaller than an outer peripheral portion (195) of the base body (162); In a projection of the outer peripheral portion of the heat - transfer surface and the outer peripheral portion of the base body on a plane parallel to the heat - transfer surface (170), the outer peripheral portion (221) of the heat - transfer surface (170) is contained in the outer peripheral portion (195) of the base body (162); and A plurality of heat - distribution devices (250) configured to distribute heat by a phase change of a working substance contained in each heat - distribution device (250). Each heat - distribution device (250) is partially disposed in a corresponding notch (185) located between the boss (220) and the lower surface (167) of the base body (162) to distribute heat from the boss (220) to the lower surface (167) of the base body (162).

2. The cooling block assembly (200) according to claim 1, wherein, The heat - distribution device (250) is one of the following: a heat pipe, a phase - change material, and a loop heat pipe.

3. The cooling block assembly (200) according to claim 2, wherein, The heat - distribution device (250) is a heat pipe, and each heat pipe includes: A housing (270), the housing (270) having: a heat input surface (272) in contact with the boss; and a heat output surface (274) opposite the heat input surface (272), the heat output surface (274) being in contact with the lower surface (167) of the base body (162); and The working substance contained in the housing (270), the working substance being configured to evaporate and condense in sequence to transfer heat from the heat input surface (272) to the heat output surface (274).

4. The cooling block assembly (200) according to claim 3, wherein, The heat distribution device (250) is a vapor chamber.

5. The cooling block assembly (200) according to claim 3 or 4, wherein, Most of the lower surface (167) of the base body (162) is in contact with the heat output surface (274) of the heat pipe.

6. The cooling block assembly (200) according to any one of claims 1 to 4, wherein, The main part (163) of the base body (162) defines two recesses (168) on the lower side of the main part for receiving the heat distribution device (250).

7. The cooling block assembly (200) according to any one of claims 1 to 4, wherein, For each heat distribution device (250), most of the heat distribution device (250) is not disposed between the boss (220) and the lower surface (167) of the base body (162).

8. The cooling block assembly (200) according to any one of claims 1 to 4, wherein, The ratio of the area defined by the outer peripheral portion (195) of the base body (162) to the area defined by the outer peripheral portion (221) of the heat transfer surface (170) is equal to or greater than 3.

9. The cooling block assembly (200) according to claim 8, wherein, The ratio of the area defined by the outer peripheral portion (195) of the base body (162) to the area defined by the outer peripheral portion (221) of the heat transfer surface (170) is between 3 and 8, including 3 and 8.

10. The cooling block assembly (200) according to any one of claims 1 to 4, wherein: The at least one internal fluid conduit (15) includes a first fluid conduit and a second fluid conduit; The plurality of heat distribution devices (250) includes a first heat distribution device and a second heat distribution device; The first heat distribution device is aligned with the first fluid conduit to distribute heat to the first fluid conduit; And The second heat distribution device is aligned with the second fluid conduit to distribute heat to the second fluid conduit.

11. The cooling block assembly (200) according to any one of claims 1 to 4, wherein, The upper block portion includes a base (12) and a cover (14) connected to the base (12), and the at least one internal fluid conduit (15) is defined between the base (12) and the cover (14).

12. The cooling block assembly (200) according to claim 11, wherein: The at least one internal fluid conduit (15) is a plurality of fluid conduits, the plurality of fluid conduits including a first fluid conduit and a second fluid conduit; The base (12) is a first base, and the cover (14) is a first cover, and the first base and the first cover define the first fluid conduit located between the first base and the first cover; The upper block portion (189) further includes: A heat transfer base (160), the heat transfer base (160) being defined with a plurality of recessed portions (180), the plurality of recessed portions (180) including a first recessed portion and a second recessed portion, the first base being received in the first recessed portion; A second base, the second base being received in the second recessed portion; and A second cover, the second cover being connected to the second base, the second base and the second cover defining the second fluid conduit located between the second base and the second cover.

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