Display panel, smart device and display panel manufacturing method

Abstract

The application provides a display panel, which comprises an array substrate, a packaging substrate and a fusion layer. The array substrate comprises: a first glass substrate, a plurality of first through holes arranged at intervals are formed in the first glass substrate; a plurality of first conductive columns, each first conductive column is located in a first through hole; a plurality of first traces; a driving chip, the driving chip is located on the surface of the first glass substrate opposite to the plurality of first traces, one end of at least part of the first conductive columns is electrically connected to the plurality of first traces, and the other end of the first conductive columns is electrically connected to the driving chip; and a light-emitting module, the light-emitting module is electrically connected to the plurality of first traces, and the driving chip is used for outputting a driving signal to drive the light-emitting module to emit light to display an image. The fusion layer is located between the first glass substrate and the packaging substrate, and is used for fixing the first glass substrate and the packaging substrate. The first glass substrate, the fusion layer and the packaging substrate enclose a closed space, and the plurality of first through holes are formed in the region of the first glass substrate located in the closed space. The application further provides a smart device and a display panel manufacturing method.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of touch display, in particular to a display panel, a smart device comprising the display panel and a display panel manufacturing method of the display panel. BACKGROUND

[0002] A display panel, such as an active-matrix organic light-emitting diode (AMOLED) display panel, usually comprises an array substrate. The array substrate is partially located in a display area and partially located in a non-display area. The array substrate comprises a glass substrate and a trace and a driving chip located on a surface of the glass substrate, wherein the trace and the driving chip are both located in the non-display area.

[0003] The non-display area of the display panel usually corresponds to a frame area of the display panel. In order to reduce the area of the frame area of the display panel, one way is to arrange the trace and the driving chip on the upper and lower surfaces of the glass substrate respectively. However, the trace and the driving chip need to be electrically connected, so a flexible conductive film needs to be newly added to extend from the upper surface of the glass substrate along the side edge of the glass substrate to the lower surface of the glass substrate to establish electrical connection between the trace and the driving chip. In the above-mentioned way, since the bending ability of the conductive film is limited, the reduction of the area of the frame area is limited, which is not conducive to improving the display area ratio of the display panel. SUMMARY

[0004] The first aspect of the present application provides a display panel comprising a display area and a non-display area, the display panel comprising:

[0005] an array substrate comprising:

[0006] a first glass substrate, a plurality of first through holes being arranged at intervals on the first glass substrate, the plurality of first through holes being located in the non-display area;

[0007] a plurality of first conductive columns, each of the first conductive columns being located in one of the first through holes;

[0008] a plurality of first traces located in the non-display area;

[0009] a driving chip located on a surface of the first glass substrate opposite to the plurality of first traces, one end of at least part of the first conductive columns being electrically connected to the plurality of first traces, and the other end being electrically connected to the driving chip; and

[0010] A light emitting module is located in the display area and on the same surface of the first glass substrate as the plurality of first wires. The light emitting module is electrically connected to the plurality of first wires. The driving chip is configured to output a driving signal to the light emitting module through the plurality of first wires to drive the light emitting module to emit light to display an image.

[0011] A packaging substrate is stacked with the glass substrate; and

[0012] A fusion layer is located between the first glass substrate and the packaging substrate and in the non-display area to fix the first glass substrate and the packaging substrate. The first glass substrate, the fusion layer, and the packaging substrate enclose a closed space. The plurality of first through holes are formed in the region of the first glass substrate located in the closed space.

[0013] In a pair of comparative display panels, the structure of the fusion layer can be damaged by laser drilling. The drilling position needs to maintain a safe distance from the fusion layer. The safe distance is not conducive to reducing the area of the non-display area. Laser drilling causes internal stress in the glass substrate. To ensure the reliability of the glass substrate, the drilling position also needs to maintain a safe distance from the side edge L of the glass substrate. The safe distance is also not conducive to reducing the area of the non-display area.

[0014] The display panel described above in the present application does not increase an additional safe distance because each first through hole and each wire is located in the closed area. In the present embodiment, the first through hole is formed by an etching process, which is not easy to damage the first glass substrate. Therefore, it is not necessary to maintain a safe distance from the side edge of the glass substrate, which is conducive to reducing the area of the non-display area.

[0015] In some embodiments, the first glass substrate is a fiber glass substrate.

[0016] In the present embodiment, the first glass substrate is a fiber glass substrate. That is, the first glass substrate in the present embodiment includes glass raw materials and fiber filaments uniformly doped in the glass raw materials. Since the first through hole is formed by etching, the etching liquid can be designed to etch the fiber filaments without etching the glass raw materials, thereby obtaining a plurality of first through holes. The above-mentioned method is not easy to damage the first glass substrate, which is conducive to improving the stability of the first glass substrate.

[0017] In some embodiments, the display panel is an active matrix light emitting diode display panel.

[0018] When the display panel is an active matrix light emitting diode display panel, the first through hole and the conductive column of the present application can achieve better narrow frame effect.

[0019] The second aspect of the present application provides a smart device, comprising:

[0020] A display panel for displaying an image, the display panel being as described in any of the above; and

[0021] A touch panel located on one side of the display panel and electrically connected to the display panel, the touch panel being configured to generate a sensing signal according to a touch operation, and the display panel being configured to display an image according to the sensing signal.

[0022] The above-mentioned smart device includes the display panel, and the display panel in the present application, each first via hole and each trace are located in the closed area, which does not increase the additional safety distance. In the embodiment, the first via hole is formed by etching process, which is not easy to cause damage to the first glass substrate, so there is no need for a safety distance from the edge of the glass substrate, which is beneficial to reduce the area of the non-display area.

[0023] In some embodiments, the touch panel includes:

[0024] A second glass substrate;

[0025] A plurality of second traces located on a surface of the second glass substrate away from the display panel;

[0026] A plurality of second via holes formed in the second glass substrate; and

[0027] A plurality of second conductive pillars, each of the second conductive pillars being located in one of the second via holes, and each of the second conductive pillars being electrically connected to the display panel.

[0028] In some embodiments, the packaging substrate has a plurality of third via holes formed therein and spaced apart from each other, each of the third via holes being filled with a third conductive pillar, each of the second conductive pillars being electrically connected to one of the third conductive pillars, and each of the third conductive pillars being electrically connected to one of the first conductive pillars.

[0029] In this way, by forming the second via holes in the second glass substrate and the third via holes in the packaging substrate, the first conductive pillars, the second conductive pillars, and the third conductive pillars are electrically connected, and the second traces on the second glass substrate can also be electrically connected to the driving chip, so that the display panel and the touch panel can be integrated in the smart device.

[0030] In some embodiments, a projection of each of the third via holes on the first glass substrate at least partially overlaps with one of the first via holes.

[0031] In some embodiments, a projection of each of the third via holes on the first glass substrate completely overlaps with one of the first via holes.

[0032] In this way, the third conductive pillars and the first conductive pillars have a larger electrical contact area, which is beneficial to improve the stability of the electrical connection.

[0033] In some embodiments, the projection of each of the second vias onto the packaging substrate at least partially overlaps with that of a third via.

[0034] In some embodiments, the projection of each of the second vias onto the packaging substrate completely overlaps with that of a third via.

[0035] This results in a larger electrical contact area between the second and third conductive posts, which helps to improve the stability of the electrical connection.

[0036] A third aspect of this application provides a method for manufacturing a display panel, comprising:

[0037] Provide a glass motherboard;

[0038] Multiple light-emitting modules and multiple sets of first wirings are formed on the same surface of the glass mother plate. Multiple sets of first through holes are opened on the glass mother plate, and a first conductive post is formed in each of the first through holes.

[0039] Cut the glass mother plate to obtain multiple array substrates. Each array substrate includes a first glass substrate, a light-emitting module, a set of first traces and a set of first vias. Each set of first traces includes multiple first traces and each set of first vias includes multiple first vias.

[0040] Each array substrate is aligned with a packaging substrate. A fusion layer is formed on the surface of the packaging substrate near the array substrate. The array substrate, the packaging substrate, and the fusion layer enclose a closed space. The light-emitting module is located within the closed space. The plurality of first through-holes are formed in the region of the array substrate located within the closed space.

[0041] A driving chip is fixed on each array substrate. The driving chip and the light-emitting module are located on different surfaces of the first glass substrate. The driving chip is electrically connected to the multiple first traces through multiple first conductive pillars.

[0042] In the display panel manufactured by the above method, each first through-hole and each trace is located within a closed area, without adding any additional safety distance. In this embodiment, the first through-hole is formed by an etching process, which is less likely to damage the first glass substrate, and therefore no safety distance is required from the side edge of the glass substrate, which helps to reduce the area of ​​the non-display area.

[0043] In some embodiments, the step of forming multiple sets of first through holes on the glass mother plate includes:

[0044] Multiple sets of first through holes are formed on the glass mother plate by chemical etching.

[0045] In this way, it is not necessary to thin the first glass substrate piece by piece, which helps to improve the manufacturing efficiency of the display panel. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of the structure of a smart device according to an embodiment of this application.

[0047] Figure 2 for Figure 1 A schematic diagram of the planar structure of the display panel.

[0048] Figure 3 This is a schematic diagram of the planar structure of the display panel in other embodiments of this application.

[0049] Figure 4 for Figure 2 A schematic diagram of the cross-sectional structure along line IV-IV.

[0050] Figure 5 for Figure 4 A schematic diagram of the planar structure of the array substrate.

[0051] Figure 6 This is a schematic diagram of the structure of a pair of display panels in proportion.

[0052] Figure 7 for Figure 1 A schematic diagram of the cross-sectional structure of the intelligent device along line VII-VII.

[0053] Figure 8 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application.

[0054] Figure 9 This is a schematic diagram of the planar structure of the display panel during the manufacturing process of an embodiment of this application.

[0055] Explanation of main component symbols

[0056]

[0057] Detailed Implementation

[0058] The embodiments of this application are described below with reference to the accompanying drawings.

[0059] Example 1

[0060] Please see Figure 1The smart device 100 of this embodiment includes a display panel 1 and a touch panel 2. The display panel 1 and the touch panel 2 are stacked on top of each other, with the touch panel 2 located on the side of the display panel 1 where the image is displayed. That is, the touch panel 2 is formed on the display panel (On Cell Touch Panel, On Cell TP).

[0061] In this embodiment, display panel 1 is an active-matrix organic light-emitting diode (OLED) display panel used to display images. In this embodiment, display panel 1 is a module in a smartphone used for displaying images. In some embodiments, display panel 1 may also be a module in a tablet computer, laptop computer, watch, or smart band used for displaying images. In other embodiments, display panel 1 may be other types of display panels, such as a liquid crystal display (LCD).

[0062] Touch panel 2 is used to receive touch operations from a touch object and generate a sensing signal based on the touch operation. The touch object can be a stylus, finger, etc. Display panel 1 is electrically connected to touch panel 2, and display panel 1 is used to display a corresponding image based on the sensing signal output by touch panel 2. For example, in smart device 100, display panel 1 displays a lock screen image. If a finger touches touch panel 2 and moves away from the surface of display panel 1, touch panel 2 generates a sensing signal, and display panel 1 can then display an unlock screen image based on this sensing signal.

[0063] Please see Figure 2 The display panel 1 has a display area AA and a non-display area NA. The display area AA is the area where images can be displayed, while the non-display area NA does not display images. In this embodiment, the display area AA is rectangular, the non-display area NA is a rectangular frame, and the non-display area NA surrounds the display area AA and is joined to it. In other embodiments, the display area AA and the non-display area NA can be other shapes. For example... Figure 3 As shown, in some embodiments, the display area AA is circular, and the non-display area NA is an annular ring surrounding the display area AA.

[0064] Please see Figure 4In this embodiment, the display panel 1 includes an array substrate 10, a packaging substrate 20, and a welding layer 30. The array substrate 10 and the packaging substrate 20 are stacked on top of each other. The welding layer 30 is located between the array substrate 10 and the packaging substrate 20, in the non-display area NA, and surrounds the edge areas of the array substrate 10 and the packaging substrate 20, for fixing the array substrate 10 and the packaging substrate 20. The packaging substrate 20 is a glass substrate, and the welding layer 30 includes a glass welding material. After the welding layer 30 is coated on the packaging substrate 20, the array substrate 10 and the packaging substrate 20 are aligned, and the welding layer 30 is melted by laser to fix the array substrate 10 and the packaging substrate 20. The packaging substrate 20 is used to protect the components inside the array substrate 10 and to maintain the strength of the display panel 1.

[0065] The array substrate 10 includes a first glass substrate 11. The first glass substrate 11 has a first surface 111 adjacent to the encapsulation substrate 20 and a second surface 112 distant from the encapsulation substrate 20. The first glass substrate 11 is partially located in the display area AA and partially located in the non-display area NA. That is, the first surface 111 of the first glass substrate 11 is partially located in the display area AA and partially located in the non-display area NA, and the second surface 112 is partially located in the display area AA and partially located in the non-display area NA.

[0066] The array substrate 10 also includes a light-emitting module 12. The light-emitting module 12 emits image light under the drive of a driving signal. The image light is emitted towards the encapsulation substrate 20 for displaying an image. The light-emitting module 12 is located on the first surface 111 of the first glass substrate 11 and is located in the display area AA. The array substrate 10, the encapsulation substrate 20, and the bonding layer 30 enclose a closed space S1, within which the light-emitting module 12 is located.

[0067] The light-emitting module 12 includes multiple thin-film transistors (not shown) and multiple light-emitting elements (not shown) electrically connected to each thin-film transistor in a one-to-one correspondence. Each thin-film transistor outputs a driving signal to drive a light-emitting element to emit light. By changing the driving signal to change the emission color and brightness of each light-emitting element, the image displayed by the smart device 100 can be changed. Each light-emitting element is an organic light-emitting diode (OLED).

[0068] The array substrate 10 also includes multiple first traces 13 and a driver chip 14. Each first trace 13 is located on the first surface 111 of the first glass substrate 11 and is located in the non-display area NA. Each first trace 13 is made of a conductive material, such as metal. Each first trace 13 is electrically connected to one or more thin-film transistors within the light-emitting module 12.

[0069] The driver chip 14 is located on the second surface 112 of the first glass substrate 11, and is located in the non-display area NA. The driver chip 14 is electrically connected to each of the first traces 13, and is used to output the driving signal to each thin-film transistor of the light-emitting module 12.

[0070] In this embodiment, a plurality of first through holes 113 are spaced apart on the first glass substrate 11. Each first through hole 113 is located in the non-display area NA. Each first through hole 113 penetrates the first surface 111 and the second surface 112 of the first glass substrate 11. The array substrate 10 also includes a plurality of first conductive pillars 15. Each first conductive pillar 15 is embedded in a first through hole 113 and extends from the first surface 111 of the first glass substrate 11 to the second surface 112 of the first glass substrate 11. Each conductive pillar 15 is formed of a conductive material filling the first through hole 113, and the conductive material may be metal. Among the plurality of first conductive pillars 15, at least some of the first conductive pillars 15 have one end electrically connected to one or more first traces 13 and the other end electrically connected to the driver chip 14. That is, each first through hole 113 has a first conductive pillar 15. In the aforementioned plurality of first through holes 113, at least some of the first conductive posts 15 in the first through holes 113 are used to establish an electrical connection between the first trace 13 on the first surface 111 and the driving chip 14 on the second surface 112.

[0071] The first through-hole 113 and the first conductive post 15 enable the conductive structures (first trace 13, driving chip 14) on the first surface 111 and the second surface 112 of the first glass substrate 11 to establish an electrical connection. It is not necessary to set all the conductive structures in the area of ​​the first surface 111 of the first glass substrate 11 located in the non-display area NA, which helps to reduce the area of ​​the first glass substrate 11 located in the non-display area NA, thereby helping to reduce the area of ​​the bezel area of ​​the display panel 1 (smart device 100).

[0072] In this embodiment, each first through-hole 113 and each first trace 13 are formed in the region of the first glass substrate 11 located in the enclosed space S1. That is, please refer to... Figure 5 In this embodiment, the projection pattern S of the fusion layer 30 on the first glass substrate 11 is a closed rectangular frame. The projection pattern S of the fusion layer 30 on the first glass substrate 11 encloses a closed area S2. Each first through hole 113 and each trace are located within the closed area S2.

[0073] Please see Figure 6In one example, to reduce the area of ​​the bezel region of the display panel, the driver chip 410 and the wiring 420 are respectively disposed on the upper and lower surfaces of the glass substrate 430. Holes are drilled in the glass substrate 430 using laser etching, and conductive pillars 440 are filled in the through holes 470. The conductive pillars 440 establish the electrical connection between the wiring 420 on the upper and lower surfaces of the glass substrate 430 and the driver chip 410. However, the above method has many technical problems.

[0074] Firstly, the display panel also includes an encapsulation substrate 450 stacked on top of the glass substrate 430. A fusion layer 460 is provided between the glass substrate 430 and the encapsulation substrate 450, and the fusion layer 460 is located in the non-display area NA. The glass substrate 430, the encapsulation substrate 450, and the fusion layer 460 enclose a closed space S3. The drilling location is located outside the closed space S3, and the trace 420 extends from inside the closed space S3 through the fusion layer 460 to outside the closed space S3. Since laser drilling may damage the structure of the fusion layer 460, the drilling location needs to maintain a safe distance d1 from the fusion layer 460. The safe distance d1 is not conducive to reducing the area of ​​the non-display area NA.

[0075] Secondly, laser drilling causes internal stress in the glass substrate 430, which leads to cracks on the glass substrate 430. In order to ensure the reliability of the glass substrate 430, the drilling position needs to maintain a certain safe distance d2 from the side edge L of the glass substrate 430. The safe distance d2 is also not conducive to reducing the area of ​​the non-display area NA.

[0076] Thirdly, laser drilling requires the glass substrate 430 to be thinned. Drilling and filling of conductive pillars 440 can only be carried out after the glass substrate 430 has been thinned, which reduces the efficiency of display panel manufacturing.

[0077] Fourthly, the aperture size formed by laser drilling has technological limitations, which restricts its ability to reduce the bezel size.

[0078] Fifthly, the above methods are not suitable for situations where the display panel includes touch functionality.

[0079] In the smart device 100 of this embodiment, each first through-hole 113 and each trace are located within the enclosed space S1, without increasing the additional safety distance d1. In this embodiment, the first through-hole 113 is formed by an etching process, which is less likely to damage the first glass substrate 11, and therefore no safety distance d2 is required, which helps to reduce the area of ​​the non-display area NA.

[0080] In this embodiment, the first glass substrate 11 is an optical fiber glass substrate. That is, the first glass substrate 11 in this embodiment includes glass raw material and fiber filaments uniformly doped in the glass raw material. In this embodiment, since the first through-hole 113 is formed by etching, the etching solution can be designed to etch the fiber filaments without etching the glass raw material, thereby obtaining multiple first through-holes 113. The above method is less likely to damage the first glass substrate 11, which is beneficial to improving the stability of the first glass substrate 11.

[0081] During the manufacturing process, a glass mother plate is usually cut to form multiple first glass substrates 11 in batches. If the first glass substrates 11 need to be thinned before drilling, each first glass substrate 11 after cutting needs to be thinned. In this embodiment, the first through hole 113 is etched, which does not need to be done after cutting the first glass substrates 11 into small pieces and thinning them, which helps to improve the manufacturing efficiency of the display panel 1.

[0082] Please see Figure 7 In this embodiment, the touch panel 2 includes a second glass substrate 21 and a second trace 24 formed on the surface of the second glass substrate 21 away from the display panel 1 (the second glass substrate 21 also has other necessary structures such as touch electrodes; this embodiment mainly describes the structures related to the inventive point). The second glass substrate 21 has a plurality of second through holes 22, each filled with a second conductive post 23. One end of each second conductive post 23 is electrically connected to the second trace 24, and the other end is electrically connected to a first conductive post 15.

[0083] Multiple third through holes 201 are also formed on the packaging substrate 20. Each third through hole 201 is filled with a third conductive post 202.

[0084] The number of third through holes 201 on the packaging substrate 20 is the same as the number of second through holes 22 on the second glass substrate 21, and the plurality of third through holes 201 correspond one-to-one with the plurality of second through holes 22. That is, the projection of each second through hole 22 on the packaging substrate 20 at least partially overlaps with a third through hole 201, thereby making each second conductive post 23 electrically contact a third conductive post 202.

[0085] In this embodiment, the projection of each second through hole 22 on the packaging substrate 20 completely coincides with a third through hole 201, so that the second conductive post 23 and the third conductive post 202 have a large contact area, which is beneficial to improving the stability of electrical connection.

[0086] The projection of the third through-hole 201 on the packaging substrate 20 at least partially overlaps with the projection of the third through-hole 113 on the first glass substrate 11, thereby making each third conductive post 202 electrically contact a first conductive post 15. In this embodiment, the projection of each third through-hole 201 on the first glass substrate 11 completely overlaps with a first through-hole 113, so that the third conductive post 202 and the first conductive post 15 have a large contact area, which is beneficial to improving the stability of electrical connection.

[0087] Each third conductive post 202 extends toward the first glass substrate 11 and makes electrical contact with a first conductive post 15 on the first glass substrate 11, thereby establishing an electrical connection with the driver chip 14. That is, the second conductive post 23, the third conductive post 202 and the first conductive post 15 together establish an electrical connection between the second trace 24 and the driver chip 14.

[0088] That is, in this embodiment, among the plurality of first conductive pillars 15 on the first glass substrate 11, a portion of the first conductive pillars 15 are used to electrically connect the first trace 13, and another portion of the first conductive pillars 15 are used to make electrical contact with the third conductive pillar 202.

[0089] Therefore, the smart device 100 of this embodiment, while helping to reduce the area of ​​the bezel region of the display panel 1, can also be applied to situations where the smart device 100 includes a touch panel 2.

[0090] This embodiment also provides a method for manufacturing the display panel 1 described above. Please refer to [link to relevant documentation]. Figure 8 The methods for manufacturing display panels include:

[0091] Step S11: Provide a glass mother plate;

[0092] Step S12: Multiple light-emitting modules and multiple sets of first wirings are formed on the same surface of the first glass mother plate. Multiple sets of first through holes are opened on the glass mother plate, and a first conductive post is formed in each of the first through holes.

[0093] Step S13: Cut the glass mother plate to obtain multiple array substrates. Each array substrate includes a first glass substrate, a light-emitting module, a set of first traces and a set of first vias. Each set of first traces includes multiple first traces and each set of first vias includes multiple first vias.

[0094] Step S14: Align each array substrate with a packaging substrate. A fusion layer is formed on the surface of the packaging substrate near the array substrate. The array substrate, the packaging substrate, and the fusion layer enclose a closed space. The light-emitting module is located within the closed space. The plurality of first through-holes are formed in the region of the array substrate located within the closed space.

[0095] Step S15: A driving chip is fixed on each array substrate. The driving chip and the light-emitting module are located on different surfaces of the first glass substrate. The driving chip is electrically connected to the multiple first traces through multiple first conductive pillars.

[0096] Please see Figure 9 In this embodiment, the glass mother plate 110 is used to batch form multiple array substrates 10. In step S12, the formation order of the light-emitting module 12, multiple sets of first traces 13, and multiple sets of through-holes 113 is not limited. It can be arranged according to the actual structural design and process type, ensuring that subsequent steps do not damage the structure formed in previous steps. In some embodiments, the first through-holes 113 are formed by chemical etching, while the light-emitting module 12 mainly uses an exposure and development (etching) step. Therefore, the formation of the first through-holes 113 can also be performed simultaneously with a step in the light-emitting module 12, which helps simplify the manufacturing process of the display panel 1.

[0097] In this embodiment, the fusion layer 30 is first formed on the encapsulation substrate 20. After cutting off the array substrate 10 in step S13, the surface of the array substrate 10 with the first trace 13 is aligned with the surface of the encapsulation substrate 20 with the fusion layer 30, so that the first glass substrate 11 and the encapsulation substrate 20 are fixed by the fusion layer 30. After the first glass substrate 11 and the encapsulation substrate 20 are fixed, the first glass substrate 11, the encapsulation substrate 20 and the fusion layer 30 are formed in a closed space S1, so that the light-emitting module 12 is located in the closed space S1, and each first through hole 113 is located in the area of ​​the first glass substrate 11 located in the closed space S1 (that is, forming a... Figure 4 (The structure shown).

[0098] In this embodiment, to facilitate the electrical connection between the display panel 1 and the touch panel 2, the positions of the second through hole 22 on the touch panel 2, the third through hole 201 on the encapsulation substrate 20, and the first through hole 113 on the first glass substrate 11 should strictly correspond, so that after the display panel 1 and the touch panel 2 are mated, the projection of each second through hole 22 on the first glass substrate 11 coincides with at least a portion of the first through hole 113, so that the second conductive post 23 in each second through hole 22 can make electrical contact with the first conductive post 15 in the first through hole 113, thereby establishing an electrical connection between the touch panel 2 and the display panel 1.

[0099] The above-described method for manufacturing the display panel 1 can achieve all the beneficial effects of the aforementioned display panel 1 (smart device 100).

[0100] Those skilled in the art should recognize that the above embodiments are merely illustrative of the present invention and are not intended to limit the present invention. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A display panel, comprising a display area and a non-display area, characterized in that, The display panel includes: Array substrate, including: A first glass substrate, wherein a plurality of first through holes are spaced apart and the plurality of first through holes are located in the non-display area; Multiple first conductive pillars, each of which is located in a first through hole; Multiple first traces are located in the non-display area; A driver chip is located on the surface opposite to the plurality of first traces on the first glass substrate. At least one end of a portion of the first conductive pillars is electrically connected to the plurality of first traces, and the other end is electrically connected to the driver chip. A light-emitting module is located in the display area and is on the same surface of the first glass substrate as the plurality of first traces. The light-emitting module is electrically connected to the plurality of first traces. The driving chip is used to output driving signals to the light-emitting module through the plurality of first traces to drive the light-emitting module to emit light to display an image. The encapsulation substrate is stacked with the glass substrate; and A fusion layer is located between the first glass substrate and the encapsulation substrate, and in the non-display area, for fixing the first glass substrate and the encapsulation substrate. The first glass substrate, the fusion layer, and the encapsulation substrate enclose a closed space, and the plurality of first through holes are formed in the area of ​​the first glass substrate located within the closed space.

2. The display panel as described in claim 1, characterized in that, The first glass substrate is an optical fiber glass substrate.

3. The display panel as described in claim 1 or 2, characterized in that, The display panel is an active matrix light-emitting diode display panel.

4. A smart device, characterized in that, include: A display panel for displaying images, said display panel as described in any one of claims 1-3; and A touch panel is located on one side of the display panel and is electrically connected to the display panel. The touch panel is used to generate a sensing signal based on a touch operation, and the display panel displays an image based on the sensing signal.

5. The intelligent device as described in claim 4, characterized in that, The touch panel includes: Second glass substrate; Multiple second traces are located on the surface of the second glass substrate away from the display panel; Multiple second through holes are formed on the second glass substrate; and A plurality of second conductive posts, each second conductive post being located in a second through hole, and each second conductive post being electrically connected to the display panel.

6. The intelligent device as described in claim 5, characterized in that, The packaging substrate has a plurality of third through holes spaced apart. Each third through hole is filled with a third conductive post. Each second conductive post is electrically connected to a third conductive post, and each third conductive post is electrically connected to a first conductive post.

7. The intelligent device as described in claim 6, characterized in that, The projection of each of the third through holes onto the first glass substrate at least partially overlaps with a first through hole.

8. The intelligent device as described in claim 7, characterized in that, The projection of each of the third through holes onto the first glass substrate completely overlaps with that of a first through hole.

9. The intelligent device according to any one of claims 6-8, characterized in that, The projection of each of the second vias onto the packaging substrate at least partially overlaps with that of a third via.

10. The intelligent device as described in claim 9, characterized in that, The projection of each of the second through holes onto the packaging substrate completely overlaps with that of the third through hole.

11. A method for manufacturing a display panel, characterized in that, include: Provide a glass motherboard; Multiple light-emitting modules and multiple sets of first wirings are formed on the same surface of the glass mother plate. Multiple sets of first through holes are opened on the glass mother plate, and a first conductive post is formed in each of the first through holes. Cut the glass mother plate to obtain multiple array substrates. Each array substrate includes a first glass substrate, a light-emitting module, a set of first traces and a set of first vias. Each set of first traces includes multiple first traces and each set of first vias includes multiple first vias. Each array substrate is aligned with a packaging substrate. A fusion layer is formed on the surface of the packaging substrate near the array substrate. The array substrate, the packaging substrate, and the fusion layer enclose a closed space. The light-emitting module is located within the closed space. The plurality of first through holes are formed in the area of ​​the array substrate located within the closed space. as well as A driving chip is fixed on each array substrate. The driving chip and the light-emitting module are located on different surfaces of the first glass substrate. The driving chip is electrically connected to the multiple first traces through multiple first conductive pillars.

12. The method for manufacturing a display panel as described in claim 11, characterized in that, The step of opening multiple sets of first through holes on the glass motherboard includes: Multiple sets of first through holes are formed on the glass mother plate by chemical etching.

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