Substrate processing apparatus

Abstract

The present application relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus for performing substrate processing on a plurality of substrates in a process chamber forming a plurality of processing spaces. The present application discloses a substrate processing apparatus, comprising: a process chamber forming N processing spaces distinguished from each other to process substrates; N gas injection portions injecting gas to the processing spaces; N substrate support portions supporting the substrates; a transfer support portion supporting the substrates as transfer objects to transfer the substrates; a rotation support portion placing the substrates respectively to make the substrates rotate around a vertical direction second rotation axis passing through the substrates; and a rotation power module providing rotation power to the transfer support portion and the rotation support portion respectively.

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus for performing substrate processing on multiple substrates within a process chamber forming multiple processing spaces. Background Technology

[0002] In the past, to achieve various objectives such as productivity and process uniformity, there have been cases where multiple substrates were processed in a single process chamber of a substrate processing apparatus.

[0003] Therefore, conventional substrate processing apparatus may include: a process chamber forming multiple processing spaces and performing substrate processing; multiple gas jetting units disposed on the upper side of the process chamber to jet process gases into the processing spaces; and multiple substrate support units disposed within the process chamber corresponding to each gas jetting unit and supporting the substrate.

[0004] At this time, multiple substrates are placed in various processing spaces through the conveying support to perform substrate processing. If the substrate processing is completed, the substrate that has completed the substrate processing is discharged to the outside of the process chamber.

[0005] On the other hand, during the substrate processing, due to the substrate position, there may be deviations in the amount of gas injected through the gas jetting section, resulting in uneven distribution of the substrate film thickness.

[0006] To improve this non-uniformity, it is necessary to rotate the substrate around a vertical rotation axis. However, existing substrate processing devices only transfer the substrate from one substrate support to another without a tool to rotate the substrate itself.

[0007] Furthermore, when adding a structure for rotating the substrate itself, it is difficult to add multiple structures for rotating multiple substrates separately within the limited internal space of the process chamber. Summary of the Invention

[0008] (The problem to be solved)

[0009] The object of the present invention is to provide a substrate processing apparatus that, in order to solve the problems described above, performs substrate processing on multiple substrates by forming multiple processing spaces, and is capable of rotating the substrate itself around a vertical rotation axis.

[0010] (Solutions)

[0011] This invention is proposed to achieve the objectives of the invention as described above. The invention discloses a substrate processing apparatus, comprising: a process chamber 100 forming N mutually distinct processing spaces S (N being a natural number of 2 or more) for processing a substrate 1; N gas injection units 200, each corresponding to one of the N processing spaces S, disposed on the upper side of the process chamber 100 and injecting gas into the processing spaces S; N substrate support units 300 facing the gas injection units 200 and supporting the substrate 1; and a transfer support unit 400 disposed in the process chamber. 100, and supports the substrate 1 as the object of transfer, so as to transfer the substrate 1; a rotating support 500, which drives the transfer support 400 to be disposed between adjacent substrate support 300, i.e. the transfer path of the substrate 1, and places the substrate 1 respectively so that the substrate 1 rotates about a second rotation axis 622 in the vertical direction passing through the substrate 1 as the center; a rotating power module 600, disposed on the lower side of the process chamber 100, and provides rotational power to the transfer support 400 and the rotating support 500 respectively.

[0012] The rotation power module 600 may include: a substrate conveying power unit 610, which rotates the conveying support unit 400 around a first vertical rotation axis 612 to convey the substrate 1; and a substrate rotation power unit 620, which provides rotational power to the rotation support unit 500 to rotate the substrate 1 around a predetermined angle around a second rotation axis 622 during the conveying process.

[0013] The substrate rotation power unit 620 may include: a substrate rotation motor 621 providing rotational power; and a second rotation shaft 622, one end of which is connected to the substrate rotation motor 621, and the other end of which is connected to the rotation support unit 500. The substrate conveying power unit 610 may include: a substrate conveying rotation motor 611 providing rotational power; and a first rotation shaft 612, one end of which is connected to the substrate conveying rotation motor 611, and the other end of which is connected to the conveying support unit 400.

[0014] The rotating support 500 may include: N rotating plates 510 disposed between the N substrate support portions 300, each holding a substrate 1 and rotating the substrate 1 around the second rotating axis 622; and a transmission portion 520 that transmits the rotational power provided by the substrate rotation power portion 620 to the rotating plates 510.

[0015] The conveying support 400 may include: a substrate placement blade 410, with one or more blades configured, and forming a support area on which the substrate 1 is supported; and a main body 420, which is attached to the substrate placement blade 410 and connected to the substrate conveying power unit 610, and is rotatable about the first rotating axis 612.

[0016] The connecting body 420 may include: a connecting body 421 disposed on the upper side of the transmission part 520 to connect with the substrate to place the blade 410; and a connecting body support 422 passing through the transmission part 520 to connect with the bottom surface of the connecting body 421, and then connecting with the first rotating shaft 612.

[0017] The transmission unit 520 may include: a main rotating component 521, connected to the base plate rotation power unit 620 for rotation; a first pulley 522, attached to the lower part of the rotating plate 510; and a transmission belt 523, wound around the main rotating component 521 and the first pulley 522 to transmit the rotational power of the main rotating component 521.

[0018] The transmission unit 520 may further include a second pulley 524, and a plurality of second pulleys 524 are configured to wind together with the main rotating component 521 and the first pulley 522 around the transmission belt 523 to change the setting direction of the transmission belt 523.

[0019] The transmission unit 520 may include at least one first bearing 527, which is disposed between the second rotating shaft 622 that passes through the main rotating component 521 and the main rotating component 521.

[0020] The rotating support 500 may include a space forming part 530, which is disposed in the process chamber 100 to form a space for the transmission part 520 inside.

[0021] The space forming portion 530 may include: a main body portion 531 having an internal space and disposed at the lower center of the process chamber 100; and an extension portion 532 extending radially in the main body portion 531 corresponding to the position of the rotating plate 510.

[0022] The rotating support portion 500 may include: a purge gas inlet portion disposed on the main body portion 531 to supply purge gas to the installation space; and a purge gas outlet portion disposed on the extension portion 532 to draw the supplied purge gas to the outside.

[0023] The substrate rotary motor 621 and the substrate transfer rotary motor 611 are arranged vertically upwards and downwards; the first rotating shaft 612 is formed through the through hole of the substrate rotary motor 621 and can be connected to the transfer support 400.

[0024] The rotary power module 600 may further include a magnetofluid chamber 640, which is configured around the second rotation axis 622.

[0025] The rotational power module 600 may further include a support component 630, which is configured to support the substrate transmission power unit 610 and the substrate rotational power unit 620 respectively.

[0026] The substrate processing apparatus further includes a lifting drive unit 700, which moves the rotary power module 600 up and down to cause the conveying support unit 400 to move up and down.

[0027] The lifting drive unit 700 may include: a lifting power transmission unit 710 connected to the support assembly 630; and a lifting drive source 720 that moves the support assembly 630 up and down through the lifting power transmission unit 710.

[0028] The lifting drive unit 700 may further include a bellows 730, which is disposed between the support assembly 630 and the process chamber 100.

[0029] (The effect of the invention)

[0030] The substrate processing apparatus of the present invention is a substrate processing apparatus that forms multiple processing spaces to perform substrate processing on multiple substrates. It can rotate the substrate around a rotation axis perpendicular to the substrate, thereby having the advantage of improving process uniformity by rotating the substrate.

[0031] Furthermore, the substrate processing apparatus of the present invention is modularly configured with a substrate conveying power unit and a substrate rotation power unit. The substrate conveying power unit provides power to the conveying support unit for conveying multiple substrates, and the substrate rotation power unit provides power to the rotation support unit for rotating multiple substrates respectively. This has the advantage of realizing substrate rotation within a limited process chamber space without the need for space expansion. Attached Figure Description

[0032] Figure 1 This is a schematic cross-sectional view of the substrate processing apparatus of the present invention.

[0033] Figure 2a and Figure 2b As shown Figure 1 A plan view of the substrate processing apparatus. Figure 2aThis is a plan view showing the substrate processing apparatus on which the transfer support is mounted; Figure 2b This is a plan view showing a substrate processing apparatus with the transfer support removed.

[0034] Figure 3 It is shown in Figure 1 A cross-sectional view of the rotating support in the substrate processing apparatus before and after placing the substrate.

[0035] Figure 4 It is shown in Figure 1 A perspective view of the rotating support in the substrate processing apparatus.

[0036] Figure 5 It is shown in Figure 4 A plan view of the transmission belt arrangement in the rotating support section.

[0037] Figure 6 It is shown in Figure 1 A cross-sectional view of the upper part of the transmission section in the substrate processing apparatus.

[0038] Figure 7 It is shown in Figure 1 A cross-sectional view of the lower part of the transmission section in the substrate processing apparatus.

[0039] (Explanation of reference numerals in the attached diagram)

[0040] 1: Substrate 100: Process Chamber

[0041] 200: Gas injection section; 300: Substrate support section

[0042] 400: Conveyor support section; 500: Rotary support section

[0043] 600: Rotary Power Module Detailed Implementation

[0044] The substrate processing apparatus of the present invention will now be described with reference to the accompanying drawings.

[0045] like Figure 1As shown, the substrate processing apparatus of the present invention includes: a process chamber 100 forming N mutually distinct processing spaces S (N being a natural number of 2 or more) for processing a substrate 1; N gas injection units 200, each corresponding to one of the N processing spaces S, disposed on the upper side of the process chamber 100 and injecting gas into the processing spaces S; N substrate support units 300, supporting the substrate 1 while facing the gas injection units 200; a transfer support unit 400 disposed in the process chamber 100 and supporting the substrate 1 as the transfer object for transferring the substrate 1; a rotation support unit 500 disposed on the substrate transfer path and placing the substrate 1 so that the substrate 1 rotates about a second rotation axis 622 perpendicular to the substrate 1; and a rotation power module 600 disposed on the lower side of the process chamber 100 and providing rotation power to the transfer support unit 400 and the rotation support unit 500 respectively.

[0046] In addition, the substrate processing apparatus of the present invention may also include a lifting drive unit 700, which moves the rotating power module 600 up and down to move the conveying support unit 400 up and down.

[0047] The substrate 1, which is the object of processing in this invention, can be any structure used for performing substrate processing such as deposition and etching, such as a semiconductor manufacturing substrate, an LCD manufacturing substrate, an OLED manufacturing substrate, a solar cell manufacturing substrate, or a transparent glass substrate.

[0048] Then, for the substrate processing performed by the substrate processing apparatus of the present invention, any substrate processing process can be used as long as the substrate processing is performed within the processing space.

[0049] The process chamber 100, as a structure forming a processing space S for substrate processing, can adopt various structures.

[0050] As an example, the process chamber 100 may include: a chamber body 110 with an opening on its upper side; and an upper cover 120 detachably coupled to the opening of the chamber body 110 to form a substrate processing space together with the chamber body 110.

[0051] Alternatively, preferably, the process chamber 100 forms N distinct processing spaces S (N being a natural number of 2 or more) to perform substrate processing on multiple substrates.

[0052] The N processing spaces S are not completely sealed to each other within the process chamber 100, but are spatially distinct (separated).

[0053] As an example, the process chamber 100 may be formed into four processing spaces S arranged circumferentially on a plane.

[0054] At this time, as Figure 1 As shown, a substrate support mounting groove 114 for mounting a substrate support portion 300 (described later) can be formed in the chamber body 110.

[0055] The mounting groove 114 of the substrate support portion can be formed on the bottom surface of the chamber body 110.

[0056] When four substrate support portions 300 are arranged in the process chamber 100, four substrate support portion mounting grooves 114 can be formed respectively.

[0057] The internal space of the process chamber 100 is usually formed as a vacuum environment. Therefore, an exhaust groove (not shown) and an exhaust port (not shown) can be formed on the bottom surface of the chamber body 110 to discharge the process gases present in the mounting grooves 114 of each substrate support.

[0058] The exhaust port (not shown) can be connected to an exhaust line, which is connected to an externally located pump.

[0059] In addition, in the bottom surface of the chamber body 110, through holes for inserting the shaft portion 320 of the substrate support portion 300 (described later) can be formed in each substrate support mounting groove 114.

[0060] A gap is formed between the mounting groove 114 of the substrate support portion and the substrate support portion 300 described later. Process gases (raw material gases, plasma gases, cleaning gases, etc.) that complete the substrate processing flow into the gap and can then be discharged through the exhaust port (not shown).

[0061] Then, the process chamber 100 may form one or more gates (not shown) for introducing and exporting the substrate 1.

[0062] The process chamber 100 may be connected to or equipped with a power supply system for performing substrate processing, an exhaust system for controlling the pressure of the processing space and discharging gases, etc.

[0063] The N gas injection units 200 are structures that are respectively arranged on the upper side of the process chamber 100 corresponding to the N processing spaces S and inject gas into the processing spaces S. Various structures can be adopted.

[0064] The number of gas injection units 200 corresponds to the number of processing spaces S, and they are installed on the upper side of the process chamber 100, so that process gas can be injected into each processing space S.

[0065] As an example, the gas injection section 200 may include: an air inlet (not shown) disposed on the upper cover 120 and formed on one side; one or more diffuser plates (not shown) for diffusing the process gas entering through the air inlet; and a plurality of injection holes (not shown) for injecting the diffused process gas into the processing space S.

[0066] The N substrate support portions 300 are structures that face the gas injection portion 200 and have a substrate placement surface 302 that supports the substrate 1, and various structures can be adopted.

[0067] The substrate support portion 300 is configured to correspond to each gas injection portion 200, and may be configured to face the gas injection portion 200 vertically.

[0068] As an example, such as Figure 1 As shown, the substrate support portion 300 may include: a substrate support plate 310, on which a substrate placement surface 302 for supporting the substrate 1 is formed; and a shaft portion 320, which is coupled to the bottom surface of the substrate support plate 310 to support the substrate support plate 310, and can move up and down via an up and down driving portion (not shown).

[0069] The substrate support plate 310 may be composed of a plate whose shape corresponds to the planar shape of the substrate 1.

[0070] Additionally, a heating element (not shown) may be built into the substrate support plate 310, which is used to heat the substrate 1 supported by the substrate placement surface 302.

[0071] The N substrate support portions 300 are arranged at equal intervals along the circumferential direction with the center of the process chamber 100 as the center.

[0072] The substrate support 300 can be a vacuum chuck or an electrostatic chuck, used to adsorb and fix the supported substrate 1.

[0073] The shaft portion 320 serves as a shaft connected to the substrate support plate 310 to support the substrate support plate 310. Through the opening 112 penetrating the lower wall of the process chamber 100, it can be connected to the bottom surface of the substrate support plate 310. Furthermore, it is connected to a separate lifting drive unit outside the process chamber, through which it can move up and down.

[0074] At this time, the substrate processing apparatus may also include a substrate lifting part 330, which is disposed at the lower part of the substrate support plate 310 to lift the substrate 1 from the substrate placement surface 302 and separate the substrate 1 from the substrate 1.

[0075] The substrate lifting unit 330 is a structure that supports the substrate 1 when the substrate 1 is vertically spaced from the substrate placement surface 302 during loading, unloading, or transfer of the substrate within the process chamber 100. Various structures can be adopted.

[0076] The substrate lifting part 330 may include: a plurality of lifting pins 332 that pass through the substrate support plate 310 vertically to support the bottom surface of the substrate 1; and a lifting pin main body 334 that is combined with the plurality of lifting pins 332 and is located at the lower part of the substrate support plate 310.

[0077] At this time, a through opening through which the lifting pin 332 passes can be formed in the substrate support plate 310.

[0078] A substrate support area can be formed at the upper end of the lifting pin 332 as a contact area that contacts the bottom surface of the substrate 1. The substrate support area is formed into a tapered shape whose horizontal cross-section becomes wider towards the upper side.

[0079] The substrate support area can be formed as a through-hole with a diameter larger than that of the substrate support plate 310, thereby physically locking onto the upper side of the through-hole and preventing it from detaching from the substrate support area to the lower side of the substrate support plate 310.

[0080] At this time, a recessed portion with a shape corresponding to the shape of the substrate support area can be formed on the upper side of the through opening.

[0081] The substrate support area is located in the recess when the substrate support plate 310 rises, and can maintain a state where it does not protrude above the substrate placement surface 302 of the substrate support plate 310.

[0082] The lifting pin main body 334, which is located at the lower part of the base plate support plate 310 and is combined with multiple lifting pins 332, can adopt various structures.

[0083] As an example, the lifting pin body 334 may be formed in a ring shape surrounding the shaft 320, in which case a plurality of lifting pins 332 are located at equal intervals around the lifting pin body 334.

[0084] Since the base plate support area is supported by the recessed portion on the upper side of the through-hole, no additional driving tool is required for the lifting pin main body 334, and it can move up and down together with the up and down movement of the base plate support 300.

[0085] That is, if the substrate support 300 moves upward above a predetermined range, the lifting pin main body 334 supported by the bottom of the process chamber 100 moves upward together with the substrate support 300 through the recess of the substrate support 300. Then, if the substrate support 300 moves downward again, the lifting pin main body 334 can also move downward together.

[0086] As the substrate support portion 300 moves downward, the lifting pin main body portion 334 is supported by the bottom of the process chamber 100, thereby the substrate support area protrudes upward from the upper recess of the through opening, and the lifting pin 332 can support the substrate 1 in a state where the substrate 1 is separated from the substrate 1 by the substrate placement surface 302.

[0087] The transfer support 400 is a structure provided in the process chamber 100 to support the substrate 1, which is the object of transfer, for transferring the substrate 1. Various structures can be adopted.

[0088] At this time, the transfer support 400 may be a structure provided in the process chamber 100 to transfer the substrate 1 from one substrate support 300 side to another substrate support 300 side of the N substrate supports 300.

[0089] In addition, the transfer support 400 can transfer substrate 1 from one substrate support 300 to the rotary support 500 (described later), or it can transfer substrate 1 from the rotary support 500 to one or another substrate support 300.

[0090] For example, the conveying support 400 may include: a substrate placement blade 410, one or more in number, and a placement area for placing the substrate 1 is formed thereon; a connecting body 420, which is connected to the substrate placement blade 410 and connected to the substrate conveying power unit 610, and is capable of rotating about the vertical direction.

[0091] The substrate placement blade 410 is a structure that enters between the substrate 1, which is lifted upward by the lifting pin 332 of the substrate support 300, and the substrate placement surface 302 to form a placement area for supporting the substrate 1. Various structures can be adopted.

[0092] The substrate placement blades 410 can be configured in a number corresponding to N substrate support portions 300, and can be joined in a radial pattern on the joining body portion 420.

[0093] On the other hand, the substrate placement blade 410 can be made of various materials depending on the process environment, but it is preferably made of a material that is resistant to high temperatures and corrosion when exposed to the process environment. As an example, the substrate placement blade 410 is made of ceramic material and can be formed by ceramic processing, but it is not limited thereto.

[0094] Furthermore, the substrate placement blade 410 can be formed into various shapes as long as it can stably transmit or receive the substrate 1 without interfering with the lifting pin 332. As an example, such as Figure 2a and Figure 2b As shown, it can be formed into a hook shape.

[0095] The main body 420 may be a structure in which at least one substrate is attached to place the blade 410 and is connected to the substrate transmission power unit 610 described later, which is capable of rotating around the vertical direction.

[0096] That is, the main body 420 receives power through the substrate transmission power unit 610 described later, and can rotate around the first rotation axis 612 in the vertical direction passing through the center, thereby rotating and combining the radial substrate placement blade 410, and then transmitting the substrate 1.

[0097] For example, the connecting body 420 may include: a connecting body 421, disposed on the upper side of the body 531 described later, i.e. the center side of the rotating support 500, for placing the blade 410 on the connecting substrate; and a connecting body support 422, which passes through the transmission part 520 to connect to the bottom surface of the connecting body 421 and then connects to the first rotating shaft 612.

[0098] The connecting body 421 can have the following structure: it is disposed on the upper side at the center of the rotating support 500, and at least one substrate can be attached to it by threaded connection to place the blade 410. The connecting body support 422 rotates with the substrate transmission power unit 610, and the substrate transmission power unit 610 is connected to the connecting body support 422 to rotate the connecting body support 422.

[0099] The supporting part 422 of the bonding body can have the following structure: one end is bonded to the bottom surface of the bonding body 421 to be connected to the substrate transmission power part 610 described later, and the other end passes through the transmission part 520 disposed between the bonding body 421 and the substrate transmission power part 610 to be connected to the substrate transmission power part 610.

[0100] At this time, the connecting main support 422 can pass through the transmission part 520 without interfering with or contacting it, and can be connected to the first rotating shaft 612 in the substrate transmission power part 610. More specifically, the first rotating shaft 612 is inserted into the connecting hole formed inside the connecting main support 422 to connect or interfere with it, and the connecting main support 422 can rotate with the rotation of the first rotating shaft 612.

[0101] On the other hand, the connecting body support 422 can be connected to the bottom surface of the connecting body 421 to transmit rotational power to the connecting body 421 and the substrate placement blade 410. Of course, the connecting body support 422 can simply be configured on the bottom surface of the connecting body 421. As the rotation passes through, it interferes with the connecting body 421, thereby allowing the connecting body 421 to rotate.

[0102] In addition, the rotating power module 600, which includes the substrate transmission power unit 610, moves up and down via the lifting drive unit 700 (described later), and the connecting main body 420 can move up and down together, thereby transmitting the substrate 1 via the substrate placement blade 410.

[0103] In this case, the connecting main body 420 can move up and down on the upper side of the transmission part 520, and can move up and down without interference while the connecting main body support 422 passes through the transmission part 520.

[0104] The rotating support 500 can be configured to rotate the substrate 1 around a second rotation axis 622 in the vertical direction passing through the substrate 1, and can adopt various structures.

[0105] For example, the rotating support 500 may include: at least one rotating plate 510, which holds the substrate 1 and rotates the substrate 1 about a rotation axis perpendicular to the substrate 1; and a transmission part 520, which transmits rotational power to the rotating plate 510.

[0106] In addition, the rotating support 500 may also include a space forming part 530, which includes a main body 531 and an extension 532. The main body 531 is disposed below the process chamber 100 and a transmission part 520 is disposed inside it. The extension 532 is formed radially on the main body 531 and a rotating plate 510 is disposed at its inner end.

[0107] Additionally, the rotating support portion 500 may include: a purge gas inlet portion disposed in the main body portion 531 to supply purge gas into the interior of the space forming portion 530; and a purge gas outlet portion disposed in the extension portion 532 to draw the supplied purge gas to the outside.

[0108] The rotating plate 510 can be a structure that places the substrate 1 and rotates the substrate 1 around the second rotation axis 622, that is, around the rotation axis perpendicular to the substrate 1.

[0109] That is, the rotating plate 510 rotates around the second rotation axis 622 in the vertical direction, thereby enabling the substrate 1 placed on the upper surface to rotate around the second rotation axis 622.

[0110] At this time, the rotating plate 510 is attached to the upper part of the first pulley 522 (described later), and can rotate with the rotation of the first pulley 522. It can also be formed into an appropriate size, so as to move up and down without interfering with the placement of the blade 410 on the hook-shaped substrate.

[0111] On the other hand, in this case, if the rotating plate 510 is placed and the substrate 1 is rotated in a state where it has a smaller planar area than the substrate 1, the substrate 1 may not be able to rotate smoothly. Therefore, the rotating plate 510 is made of an electrostatic chuck or a vacuum chuck that adsorbs the substrate 1, or the substrate 1 can be supported by a material that increases friction with the substrate 1.

[0112] The rotating plate 510 may be disposed at at least one of the N substrate support portions 300. For example, the N rotating plates 510 may be respectively disposed between the substrate support portions 300 to simultaneously rotate the N substrates 1 supported by the N substrate support portions 300.

[0113] Thus, the rotating plate 510 is disposed among N substrate support portions 300, and is configured such that the substrate rotation power unit 620, described later, is connected to the rotating plate 510 from the center of the plane of the process chamber 100, thereby providing rotational power to the rotating plate 510.

[0114] The transmission unit 520 may be a structure that transmits rotational power to the rotating plate 510.

[0115] For example, the transmission unit 520 may include: a main rotating component 521 connected to the base plate rotation power unit 620 for rotation; a first pulley 522 attached to the lower part of the rotating plate 510; and a transmission belt 523 wound around the main rotating component 521 and the first pulley 522 to transmit the rotational power of the main rotating component 521.

[0116] In addition, the transmission unit 520 may also include a second pulley 524, and a plurality of second pulleys 524 are configured. The second pulleys 524, together with the main rotating component 521 and the first pulley 522, are wound around the transmission belt 523 to change the setting direction of the transmission belt 523.

[0117] In addition, the transmission part 520 may also include: at least one first bearing 527 disposed between the second rotating shaft 622 that passes through the main rotating part 521 and the main rotating part 521; and at least one second bearing 528 disposed between the main rotating part 521 and the main body part 531 on which the main rotating part 521 is disposed.

[0118] The main rotating component 521 is a structure that is connected to the base plate rotating power unit 620 for rotation, and can be inserted into and disposed in the main body 531 in the setting space forming unit 530 described later.

[0119] At this time, the main rotating component 521 can be connected to the substrate rotating power unit 620 described later to rotate. More specifically, the main rotating component 521 forms a through portion 529 that is inserted into the second rotating shaft 622 in the substrate rotating power unit 620. It is interfered with by the rotation of the second rotating shaft 622 and can rotate together with the second rotating shaft 622.

[0120] At this time, at least one through part 529 is formed along the circumferential direction with the center as the reference. For example, a pair of through parts 529 are symmetrically formed, and a pair of second rotating shafts 622 are inserted to rotate, thereby rotating the main rotating component 521.

[0121] At this time, the through portion 529 can be formed in a shape corresponding to the cross-sectional shape of the second rotating shaft 622, and the planar shape can be formed as a circle or a polygon.

[0122] Accordingly, the transmission belt 523 rotatably connected to the main rotating component 521 can ultimately rotate the first pulley 522 and the rotating plate 510 attached to the upper side of the first pulley 522.

[0123] For this purpose, at least a portion of the main rotating component 521 can be wound around the transmission belt 523 described later. By rotating at least a portion of the transmission belt 523 in one direction, at least one first pulley 522 connected to the transmission belt 523 can be rotated bidirectionally.

[0124] The first pulley 522 is disposed at the inner end of the extension 532, and at least one first pulley 522 may be configured corresponding to the rotating plate 510 attached to the upper side, for example, N first pulleys 522 may be configured.

[0125] Thus, the first pulley 522 can rotate together with the main rotating component 521 when it rotates, and can move within the process chamber 100 to maintain the tension of the transmission belt 523 wound around the outer peripheral surface above a predetermined level.

[0126] The transmission belt 523 may be a structure that is wound around the main rotating component 521 and the first pulley 522 to transmit the rotational power of the main rotating component 521.

[0127] That is, such as Figure 5 As shown, the transmission belt 523 can be wound around at least a portion of the outer peripheral surface of a plurality of first pulleys 522 and second pulleys 524 arranged around the main rotating component 521, thereby rotating the plurality of first pulleys 522 by a single transmission belt 523 as the single main rotating component 521 rotates.

[0128] The second pulley 524 may be a structure that is adjacent to the main rotating component 521 and a plurality of the second pulleys 524 are appropriately arranged between the main rotating component 521 and the first pulley 522 to change the setting direction of the transmission belt 523.

[0129] The first bearing 527 is a structure disposed between the second rotating shaft 622, which is provided through the main rotating component 521, and the main rotating component 521. It may be provided so that the second rotating shaft 622 can rotate smoothly within the through portion 529 of the second rotating shaft 622.

[0130] At this time, as shown in the figure, the first bearing 527 can be used with a single structure according to the second rotating shaft 622. As another example, multiple first bearings 527 can also be arranged vertically at intervals.

[0131] The second bearing 528 is a structure disposed between the main rotating component 521 and the main body 531 in which the main rotating component 521 is disposed, which allows the main rotating component 521 to rotate smoothly within the main body 531.

[0132] In addition, the transmission part 520 may include a first pulley support part 525 and a second pulley support part 526. The first pulley support part 525 and the second pulley support part 526 are respectively disposed under the first pulley 522 and the second pulley 524 to support the first pulley 522 and the second pulley 524.

[0133] The first pulley support portion 525 is a structure provided at the lower part of the first pulley 522 to support the first pulley 522. A plurality of first pulley support portions 525 may be configured corresponding to the first pulley 522, and the plurality of first pulley support portions 525 may be provided at the inner end of the extension portion 532.

[0134] The second pulley support 526 may be a structure in which a plurality of second pulleys 524 are provided on the upper surface of the main body 531 at a position adjacent to the main rotating component 521.

[0135] The space forming part 530 may include: a main body part 531, which is disposed below the process chamber 100 and has a transmission part 520 disposed inside it; and an extension part 532, which is formed radially on the main body part 531 and has a rotating plate 510 disposed at its inner end.

[0136] That is, the space forming part 530 may include an extension part 532. In order to stably set the main rotating part 521, the first pulley 522 and the transmission belt 523 connecting the main rotating part 521 and the first pulley 522, the main body part 531 is arranged in the center with a shape corresponding to these parts, and the extension part 532 extends radially from the main body part 531.

[0137] Furthermore, the space forming section 530 can be configured as a single structure with an internal space. As another example, such as... Figure 4 As shown, it may also include a separate upper cover 540.

[0138] At this time, the aforementioned rotating plate 510 is configured to be exposed above the cover portion 540, and can be connected to the first pulley 522 disposed inside the set space forming portion 530 through the cover portion 540.

[0139] On the other hand, the main body 531 is disposed below the process chamber 100 and may have a hollow cylindrical shape.

[0140] Accordingly, a structure consisting of a main rotating component 521, a first rotating shaft 612, and a second rotating shaft 622 can be provided inside the main body 531, which can respectively connect to the lower rotating power module 600 structure, the rotating support part 500, and the transmission support part 400.

[0141] The extension 532 extends radially from the main body 531 and can be formed into a shape corresponding to the substrate support 300.

[0142] The purge gas inlet section is a structure disposed in the main body 531 to supply purge gas inside the space forming section 530. It is connected to an external supply source and guides the purge gas through the main body 531 to the outer shell extension section.

[0143] The purge gas outlet is a structure configured in the extension 532 to pump the supplied purge gas to the outside. It is connected to an external pump to draw the supplied purge gas and can guide the purge gas supplied from the main body 531 to flow continuously towards the extension 532.

[0144] The rotary power module 600 is configured in the lower part of the process chamber 100 to provide rotary power to the transfer support 400 and the rotary support 500 respectively, and various structures can be adopted.

[0145] For example, the rotation power module 600 may include: a substrate conveying power unit 610, which rotates the conveying support unit 400 around a first vertical rotation axis 612 to convey the substrate 1; and a substrate rotation power unit 620, which provides rotational power to the rotation support unit 500 to cause the substrate 1 to rotate by a predetermined angle around a second rotation axis 622 during the conveying process.

[0146] In addition, the rotary power module 600 may also include a magnetofluid chamber 640, which is disposed between the rotary power module 600 and the process chamber 100 or the space forming part 530.

[0147] In addition, the rotational power module 600 may also include a support component 630, which is configured to support the substrate transmission power unit 610 and the substrate rotational power unit 620 in the vertical direction, respectively.

[0148] The support component 630 can be configured to support the substrate transmission power unit 610 and the substrate rotation power unit 620 in the vertical direction, and various structures can be adopted.

[0149] For example, such as Figure 7 As shown, the support component 630 may include: a first support portion 633, a support substrate transmission power portion 610; a second support portion 632, a support substrate rotation power portion 620; and an uppermost support portion 634, which is disposed at the uppermost end.

[0150] More specifically, the support component 630 may have a second support portion 632 at the top and a first support portion 633 at the bottom, with the second support portion 632 and the first support portion 633 spaced apart vertically to support the substrate transmission power unit 610 and the substrate rotation power unit 620, which are arranged vertically.

[0151] Additionally, the uppermost support portion 634 can be configured such that the bellows 730, described later, is disposed between the uppermost support portion 634 and the bottom surface of the process chamber 100 or the bottom surface of the substrate rotating housing.

[0152] On the other hand, a guide portion 631 may also be configured on the side of the support component 630. The guide portion 631 is connected to the first support portion 633, the second support portion 632 and the uppermost support portion 634 to guide the vertical movement of the lifting drive portion 700 described later. At this time, the guide portion 631 can adapt to the LM guide.

[0153] On the other hand, the first support portion 633 and the uppermost support portion 634 may be formed through the center so that the first rotating shaft 612 extending from the substrate power transmission portion 610 described later passes through it.

[0154] The substrate transmission power unit 610 is a structure that is supported by the lower first support unit 633 and connected to the transmission support unit 400 to provide rotational power, and various structures can be adopted.

[0155] For example, the substrate conveying power unit 610 may include: a substrate conveying rotary motor 611 that provides rotational power; and a first rotating shaft 612, one end of which is connected to the substrate conveying rotary motor 611 and the other end of which is connected to the conveying support unit 400.

[0156] More specifically, the substrate conveying power unit 610 may include a first rotating shaft 612, which extends upward to connect to the substrate conveying rotating motor 611 when it is supported by the first support unit 633.

[0157] At this time, the first rotating shaft 612 is connected to the substrate conveying rotating motor 611, and can be connected along the first rotating shaft 612, and can extend upward through the second support part 632 and the uppermost support part 634.

[0158] Therefore, as Figure 6 As shown, the first rotating shaft 612 passes through the second rotating shaft connecting part 623 and can be connected to the connecting body support part 421. Rotating the connecting body support part 421 can then rotate the transmission support part 400.

[0159] At this time, the end of the first rotating shaft 612 can be combined with the main support portion 421 to rotate integrally with the main support portion 421. As another example, at least a portion of the first rotating shaft 612 is inserted into the groove formed in the main support portion 421 and can rotate integrally by interference.

[0160] Furthermore, since the end of the first rotating shaft 612 is connected to the connecting main support 421, the support assembly 630 can move up and down to transmit the support 400 through the lifting drive 700 described later to raise or lower the support assembly 630.

[0161] The substrate rotation power unit 620 is a structure that is arranged on the upper side of the substrate transmission power unit 610 in the vertical direction to provide rotational power to the transmission unit 520, and various structures can be adopted.

[0162] For example, the substrate rotation power unit 620 may include: a substrate rotation motor 621, which is supported by a second support unit 632 and provides rotation power; and a second rotation shaft 622, one end of which is connected to the substrate rotation motor 621 and the other end of which is connected to the transmission unit 520.

[0163] In addition, the substrate rotation power unit 620 may also include a second rotation shaft connection part 623, which connects the second rotation shaft 622 and the substrate rotation motor 621.

[0164] At this time, the substrate rotation power unit 620 can form a hollow structure, which is configured to allow the first rotation shaft 612 mentioned above to pass through.

[0165] That is, the substrate rotation power unit 620 is disposed on the upper side of the substrate transmission power unit 610 and has a through hole so that the first rotation shaft 612 passes through to connect to the transmission support unit 400.

[0166] The substrate rotary motor 621 may be configured to overlap the substrate transfer rotary motor 611 in a vertical direction in the second support portion 632 and provide rotational power.

[0167] For the second rotating shaft 622, a plurality of second rotating shafts 622 may be arranged around the first rotating shaft 612, inserted into the through portion 529 formed in the main rotating member 521 and interfered with, so that the main rotating member 521 can be rotated by the rotation of the second rotating shaft 622.

[0168] For this purpose, the second rotating shaft 622 is connected to the substrate rotating motor 621 and can be formed to extend in the upward direction, and a plurality of the second rotating shafts 622 can be arranged around the first rotating shaft 612.

[0169] The second rotating shaft connecting part 623 is a ring-shaped structure that combines multiple second rotating shafts 622 at its lower end, combines multiple second rotating shafts 622 on its upper surface, and extends to the lower surface to be connected to the substrate rotating motor 621.

[0170] At this time, the second rotating shaft connecting part 623 can be configured in a ring shape so that the first rotating shaft 612 passes through the center of the second rotating shaft connecting part 623.

[0171] The magnetofluid chamber 640, which serves as the structure surrounding the second rotating shaft 622, can be of various structures.

[0172] For example, the magnetofluid chamber 640 is a structure designed to maintain a seal between vacuum and atmospheric pressure even when the second rotating shaft 622 and the first rotating shaft 612 disposed inside the second rotating shaft 622 are rotated, and can be applied to any of the previously disclosed forms.

[0173] In this case, the magnetofluid chamber 640 may surround the first rotating shaft 612 and a plurality of second rotating shafts 622 disposed adjacent to the outer peripheral surface of the first rotating shaft 612, and may be disposed below the process chamber 100 or between the space forming portion 530 and the uppermost support portion 634 to perform sealing.

[0174] The lifting drive unit 700 serves as a structure for the vertical movement and rotation power module 600 to move the transmission support unit 400 vertically, and various structures can be adopted.

[0175] For example, such as Figure 7 As shown, the lifting drive unit 700 may include: a lifting power transmission unit 710 connected to the support assembly 630; and a lifting drive source 720 that moves the support assembly 630 up and down through the lifting power transmission unit 710.

[0176] In addition, the lifting drive unit 700 may also include a bellows 730, which is disposed between the support assembly 630 and the bottom surface of the main body 531 by moving up and down.

[0177] In addition, the lifting drive unit 700 may also include a lifting support unit 740, which is connected to the support assembly 630 and supports the lifting power transmission unit 710.

[0178] The lifting drive source 720 may include a drive motor or a cylinder actuator supported at the lower end of the support assembly 630.

[0179] The lifting power transmission unit 710 may include: lifting pulleys 711 and 712, which are respectively connected between the lifting drive source 720 and the support assembly 630; a lifting belt 713, which transmits drive between the lifting drive source 720 and the support assembly 630; and a lifting shaft 714, which is connected at one end to any one of the lifting pulleys 711 and 712 and at the other end to the first support unit 633, so as to move up and down by the rotational power transmitted from the lifting drive source 720 through the lifting pulleys 711 and 712, thereby moving the support assembly 630 up and down.

[0180] For example, the lifting shaft 714 is installed through and bolted to the lifting support part 740. With one end of the lifting shaft 714 connected to the output side of the lifting pulley parts 711 and 712, and the other end connected to the bottom surface of the first support part 633, the lifting shaft 714 moves up and down by rotating the lifting pulley part 712, thereby moving the support assembly 630 up and down.

[0181] Thus, the lifting drive unit 700 can move the support assembly 630 up and down, and through the movement of the support assembly 630, the first rotating shaft 612 rises or falls, thereby moving the transmission support unit 400 up and down.

[0182] The above is only a partial description of the preferred embodiments that can be implemented by the present invention. As is well known, the scope of the present invention should not be limited by the above embodiments. The technical ideas and fundamental technical ideas of the present invention described above are all included within the scope of the present invention.

Claims

1. A substrate processing apparatus, characterized in that, include: The process chamber (100) forms N distinct processing spaces (S) for processing the substrate (1), wherein N is a natural number greater than 2; N gas injection units (200) are respectively disposed on the upper side of the process chamber (100) corresponding to the N processing spaces (S), and inject gas into the processing spaces (S); N substrate support portions (300) face the gas injection portion (200) and support the substrate (1); A transfer support (400) is rotatably disposed in the process chamber (100) and supports the substrate (1) as the transfer object, and transfers the substrate (1) from one substrate support (300) side to another substrate support (300) side of the N substrate supports (300). A rotating support (500) is fixedly disposed on the substrate (1) conveying path between adjacent substrate supports (300) in a manner independent of the conveying support (400), and supports the substrate (1) conveyed by the conveying support (400), and causes the substrate (1) to rotate about a second rotation axis (622) in the vertical direction passing through the substrate (1). A rotary power module (600) is disposed on the lower side of the process chamber (100) and provides rotary power to the transfer support (400) and the rotary support (500) respectively.

2. The substrate processing apparatus according to claim 1, characterized in that, The rotary power module (600) includes: The substrate conveying power unit (610) rotates the conveying support unit (400) around the first vertical rotation axis (612) to convey the substrate (1); the substrate rotation power unit (620) provides rotational power to the rotation support unit (500) to make the substrate (1) rotate by a predetermined angle around the second rotation axis (622) during the conveying process.

3. The substrate processing apparatus according to claim 2, characterized in that, The substrate rotation power unit (620) includes: A substrate rotary motor (621) provides rotational power; a second rotating shaft (622) is connected at one end to the substrate rotary motor (621) and at the other end to the rotating support (500); The substrate power transmission unit (610) includes: A substrate transfer rotary motor (611) provides rotational power; a first rotating shaft (612) is connected at one end to the substrate transfer rotary motor (611) and at the other end to the transfer support (400).

4. The substrate processing apparatus according to claim 3, characterized in that, The rotating support (500) includes: N rotating plates (510) are arranged between N substrate support portions (300), and the substrates (1) are placed thereon, and the substrates (1) are rotated about the second rotating axis (622); the transmission portion (520) transmits the rotational power provided by the substrate rotation power portion (620) to the rotating plates (510).

5. The substrate processing apparatus according to claim 4, characterized in that, The transmission support (400) includes: A substrate placement blade (410) is arranged in a number of one or more, and a support area for supporting the substrate (1) is formed on it; a main body (420) is attached to the substrate placement blade (410) and connected to the substrate transmission power unit (610), and can rotate about the first rotation axis (612).

6. The substrate processing apparatus according to claim 5, characterized in that, The main body (420) includes: The connecting body (421) is disposed on the upper side of the transmission part (520) to hold the blade (410) on the substrate; the connecting body support part (422) passes through the transmission part (520) to be connected to the bottom surface of the connecting body (421) and then connected to the first rotating shaft (612).

7. The substrate processing apparatus according to claim 4, characterized in that, The transmission unit (520) includes: A main rotating component (521) is connected to the base plate rotating power unit (620) for rotation; a first pulley (522) is attached to the lower part of the rotating plate (510); a transmission belt (523) is wound around the main rotating component (521) and the first pulley (522) to transmit the rotational power of the main rotating component (521).

8. The substrate processing apparatus according to claim 7, characterized in that, The transmission unit (520) further includes a second pulley (524), and a plurality of second pulleys (524) are configured to wind together with the main rotating component (521) and the first pulley (522) around the transmission belt (523) to change the setting direction of the transmission belt (523).

9. The substrate processing apparatus according to claim 7, characterized in that, The transmission unit (520) includes at least one first bearing (527). The first bearing (527) is disposed between the second rotating shaft (622) that passes through the main rotating component (521) and the main rotating component (521).

10. The substrate processing apparatus according to claim 4, characterized in that, The rotating support (500) includes a space forming part (530). The setting space forming part (530) is disposed in the process chamber (100) to form a setting space for setting the transmission part (520) inside.

11. The substrate processing apparatus according to claim 10, characterized in that, The space forming section (530) includes: The main body (531) has an internal space and is located at the lower center of the process chamber (100); the extension (532) extends radially in the main body (531) corresponding to the position of the rotating plate (510).

12. The substrate processing apparatus according to claim 11, characterized in that, The rotating support (500) includes: A purge gas inlet is disposed in the main body (531) to supply purge gas to the installation space; a purge gas outlet is disposed in the extension (532) to draw the supplied purge gas to the outside.

13. The substrate processing apparatus according to claim 3, characterized in that, The substrate rotary motor (621) and the substrate transfer rotary motor (611) are arranged vertically upwards and downwards. The first rotating shaft (612) passes through the through hole formed in the substrate rotating motor (621) to connect to the transfer support (400).

14. The substrate processing apparatus according to claim 3, characterized in that, The rotary power module (600) further includes a magnetofluid chamber (640) configured around the second rotation axis (622).

15. The substrate processing apparatus according to claim 13, characterized in that, The rotary power module (600) also includes a support assembly (630). The support assembly (630) is configured to support the substrate transmission power unit (610) and the substrate rotation power unit (620), respectively.

16. The substrate processing apparatus according to claim 15, characterized in that, Also includes: The lifting drive unit (700) moves the rotating power module (600) up and down, so that the transmission support unit (400) moves up and down.

17. The substrate processing apparatus according to claim 16, characterized in that, The lifting drive unit (700) includes: A lifting power transmission unit (710) is connected to the support assembly (630); a lifting drive source (720) moves the support assembly (630) up and down through the lifting power transmission unit (710).

18. The substrate processing apparatus according to claim 16, characterized in that, The lifting drive unit (700) also includes a bellows (730) which is disposed between the support assembly (630) and the process chamber (100).

Images