Light emitting device, method of manufacturing the same, and display apparatus

Abstract

The application provides a light-emitting device, a preparation method thereof and a display device. The light-emitting device comprises a shell, an auxiliary film layer, a light-emitting substrate located on a side of the auxiliary film layer away from a mounting surface, and a bonding structure. The shell comprises a mounting surface, and the auxiliary film layer is located on the mounting surface. The light-emitting substrate comprises a substrate and a plurality of light-emitting elements located on a side of the substrate away from the auxiliary film layer; an edge of a projection of the light-emitting substrate on the mounting surface is located outside an edge of a projection of the auxiliary film layer on the mounting surface. The bonding structure is located outside the auxiliary film layer and at least between the light-emitting substrate and the mounting surface; and a material of the bonding structure comprises an adhesive. The display device comprises the light-emitting unit device.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a light-emitting device, its preparation method, and a display device. Background Technology

[0002] Miniature light-emitting diodes, including Mini LEDs and Micro LEDs, are approximately smaller than 500μm. Due to their smaller size, ultra-high brightness, and long lifespan, their use in the display field is increasing significantly.

[0003] The backlight module of existing micro LED display devices includes a lamp board and a housing. The lamp board and the housing are bonded together by a large area of ​​adhesive. During the assembly process, air bubbles will be generated in the adhesive layer, resulting in poor flatness of the lamp board, which affects the backlight effect of the backlight module and thus affects the display effect of the display device. Summary of the Invention

[0004] This application provides a light-emitting device, a method for fabricating the same, and a display device.

[0005] According to a first aspect of the embodiments of this application, a light-emitting device is provided, the light-emitting device comprising:

[0006] Housing, the housing including a mounting surface;

[0007] An auxiliary film layer located on the mounting surface;

[0008] A light-emitting substrate located on the side of the auxiliary film layer away from the mounting surface, the light-emitting substrate including a substrate and a plurality of light-emitting elements located on the side of the substrate away from the auxiliary film layer; the edge of the orthographic projection of the light-emitting substrate on the mounting surface is located outside the edge of the orthographic projection of the auxiliary film layer on the mounting surface.

[0009] An adhesive structure is located outside the auxiliary film layer and at least between the light-emitting substrate and the mounting surface; the material of the adhesive structure includes an adhesive.

[0010] In one embodiment, the adhesive is a photosensitive adhesive.

[0011] In one embodiment, the bonding structure includes a first sub-bonding structure and a second sub-bonding structure. The first sub-bonding structure is located between the light-emitting substrate and the mounting surface, and the second sub-bonding structure is located outside the first sub-bonding structure and is in direct contact with the side of the light-emitting substrate.

[0012] In one embodiment, the distance between the side of the bonding structure facing away from the light-emitting substrate and the side of the light-emitting substrate is less than or equal to 1 mm; and / or,

[0013] The distance from the surface of the bonding structure facing away from the mounting surface to the mounting surface is less than or equal to the distance from the surface of the light-emitting substrate facing away from the mounting surface to the mounting surface.

[0014] In one embodiment, the material of the auxiliary membrane layer includes foam; and / or,

[0015] The light-emitting device further includes an adhesive layer, which is located between the mounting surface and the auxiliary film layer, or the adhesive layer is located between the light-emitting substrate and the auxiliary film layer.

[0016] In one embodiment, the distance between the edge of the orthographic projection of the light-emitting substrate onto the mounting surface and the edge of the orthographic projection of the auxiliary film layer onto the mounting surface ranges from 1 mm to 5 mm.

[0017] In one embodiment, the substrate has a plurality of first openings, the auxiliary film layer has a plurality of second openings, and the orthographic projection of one of the first openings on the mounting surface is located within the orthographic projection of one of the second openings on the mounting surface; the light-emitting device further includes a plurality of adhesive portions, a portion of which is located within the first opening and another portion is located within the second opening, and the adhesive portions are in direct contact with the mounting surface; the material of the adhesive portions includes the adhesive.

[0018] In one embodiment, the edge of the orthographic projection of the first opening on the mounting surface is located inside the edge of the orthographic projection of the second opening on the mounting surface.

[0019] In one embodiment, the light-emitting substrate further includes a plurality of reflective sheets located on the side of the substrate opposite to the mounting surface, wherein the orthographic projection of one of the reflective sheets on the mounting surface overlaps the orthographic projection of one of the first openings on the mounting surface; or...

[0020] The light-emitting substrate includes a reflector located on the side of the substrate away from the mounting surface. The reflector includes a plurality of reflective portions, and the reflective portions are respectively provided on each side of the light-emitting element. The reflector covers the plurality of first openings.

[0021] According to a second aspect of the embodiments of this application, a display device is provided, the display device including the above-described light-emitting device.

[0022] According to a third aspect of the embodiments of this application, a method for fabricating a light-emitting device is provided, the method comprising:

[0023] A housing is provided, the housing including a mounting surface;

[0024] An auxiliary film layer is disposed on the mounting surface;

[0025] At least the substrate of the light-emitting substrate and a plurality of light-emitting elements located on one side of the substrate are disposed on the side of the auxiliary film layer away from the mounting surface, and the plurality of light-emitting elements are located on the side of the substrate away from the auxiliary film layer; the edge of the substrate in the orthographic projection on the mounting surface is located outside the edge of the auxiliary film layer in the orthographic projection on the mounting surface.

[0026] An adhesive structure is formed on the outer side of the auxiliary film layer, the adhesive structure being located at least between the light-emitting substrate and the mounting surface, and the material of the adhesive structure includes an adhesive.

[0027] In one embodiment, the adhesive is a photosensitive adhesive, and the formation of an adhesive structure on the outer side of the auxiliary film layer includes:

[0028] A flowable photosensitive adhesive is disposed on the outer side of the auxiliary film layer, and the photosensitive adhesive is cured by ultraviolet light irradiation to form an adhesive structure.

[0029] In one embodiment, the substrate has a plurality of first openings, and the auxiliary film layer has a plurality of second openings, wherein the orthographic projection of one of the first openings on the mounting surface lies within the orthographic projection of one of the second openings on the mounting surface; the fabrication method further includes:

[0030] A flowable photosensitive adhesive is disposed in the first opening and the second opening, and the photosensitive adhesive is cured by ultraviolet light to form an adhesive part. A portion of the adhesive part is located in the first opening and a portion is located in the second opening, and the adhesive part is in direct contact with the mounting surface.

[0031] In one embodiment, the light-emitting substrate further includes a plurality of reflective sheets; after the process of distributing flowable photosensitive adhesive in the first and second openings and curing the photosensitive adhesive by ultraviolet light irradiation to form an adhesive portion, the preparation method further includes:

[0032] Multiple reflective sheets are disposed on the side of the substrate away from the auxiliary film layer, and the orthographic projection of one of the reflective sheets on the mounting surface covers the orthographic projection of one of the first openings on the mounting surface.

[0033] or,

[0034] The light-emitting substrate further includes a reflector, which includes multiple reflective portions; after the process of distributing flowable photosensitive adhesive in the first and second openings and curing the photosensitive adhesive by ultraviolet light irradiation to form an adhesive portion, the preparation method further includes:

[0035] A reflector is provided on the side of the substrate away from the auxiliary film layer, and the reflector covers the plurality of first openings; the reflective portion is provided on each side of the light-emitting element.

[0036] The light-emitting device and its fabrication method, as well as the display device provided in this application, utilize an auxiliary film layer located between the mounting surface of the housing and the light-emitting substrate. The edge of the orthographic projection of the light-emitting substrate onto the mounting surface is located outside the edge of the orthographic projection of the auxiliary film layer onto the mounting surface. Therefore, an adhesive structure formed on the outside of the auxiliary film layer is at least partially located between the light-emitting substrate and the mounting surface of the housing. This adhesive structure can adhere the light-emitting substrate and the housing together. In other words, the contact area between the adhesive structure and the mounting surfaces of the light-emitting substrate and the housing in this application embodiment is relatively small. Compared to a solution that uses a large-area adhesive layer to bond the light-emitting substrate and the housing together, this avoids the formation of air bubbles in the adhesive layer that could affect the light-emitting effect of the light-emitting substrate, thus helping to improve the display effect of the display device containing the light-emitting substrate. Attached Figure Description

[0037] Figure 1 This is a partial cross-sectional view of a light-emitting device provided in an exemplary embodiment of this application;

[0038] Figure 2 This is a partial cross-sectional view of a light-emitting device provided in another exemplary embodiment of this application;

[0039] Figure 3 This is a top view of a light-emitting substrate provided in an exemplary embodiment of this application;

[0040] Figure 4 This is a top view of the auxiliary film layer and bonding structure of the light-emitting substrate provided in an exemplary embodiment of this application;

[0041] Figure 5 This is a top view of a light-emitting substrate provided in another exemplary embodiment of this application;

[0042] Figure 6 yes Figure 5 A partial three-dimensional view of the light-emitting substrate shown;

[0043] Figure 7 This is a flowchart of a method for fabricating a light-emitting device provided in an exemplary embodiment of this application;

[0044] Figure 8 This is a schematic diagram of the structure during the fabrication process of a light-emitting device;

[0045] Figure 9 This is a partial cross-sectional view of a display device provided in an exemplary embodiment of this application. Detailed Implementation

[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0047] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0048] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0049] This application provides a light-emitting device, a method for fabricating the same, and a display device. The light-emitting device, its fabrication method, and the display device described in this application will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments can complement or combine with each other.

[0050] This application provides a light-emitting device. For example... Figure 1 and Figure 2 As shown, the light-emitting device includes a housing 10, an auxiliary film layer 20, a light-emitting substrate 30, and an adhesive structure 50.

[0051] The housing 10 includes a mounting surface 11. The auxiliary film layer 20 is located on the mounting surface 11 of the housing 10. The light-emitting substrate 30 is located on the side of the auxiliary film layer 20 opposite to the mounting surface 11. Figure 3As shown, the light-emitting substrate 30 includes a substrate 31 and a plurality of light-emitting elements 32 located on the substrate 31, wherein the light-emitting elements 32 are located on the side of the substrate 31 opposite to the auxiliary film layer 20. The edge of the light-emitting substrate 30 in the orthographic projection of the mounting surface 11 is located outside the edge of the auxiliary film layer 20 in the orthographic projection of the mounting surface 11. The adhesive structure 50 is located outside the auxiliary film layer 20 and is located at least between the light-emitting substrate 30 and the mounting surface 11; the material of the adhesive structure 50 includes an adhesive.

[0052] The light-emitting device provided in this application embodiment has an auxiliary film layer 20 located between the mounting surface 11 of the housing 10 and the light-emitting substrate 30. The edge of the orthographic projection of the light-emitting substrate 30 onto the mounting surface 11 is located outside the edge of the orthographic projection of the auxiliary film layer 20 onto the mounting surface 11. Therefore, the adhesive structure 50 formed on the outside of the auxiliary film layer 20 is at least partially located between the light-emitting substrate 30 and the mounting surface 11 of the housing 10. The adhesive structure 50 can adhere the light-emitting substrate 30 and the housing 10 together. That is, in this application embodiment, the contact area between the adhesive structure and the mounting surfaces of the light-emitting substrate and the housing is relatively small. Compared to a solution using a large-area adhesive layer to bond the light-emitting substrate and the housing together, this avoids air bubbles in the adhesive layer that could affect the light-emitting effect of the substrate, thus improving the display effect of the display device on which the light-emitting substrate is located. Furthermore, compared to a solution using a large-area adhesive layer to bond the light-emitting substrate and the housing together, this avoids the problem of warping and deformation of the light-emitting device due to stress mismatch between the light-emitting substrate and the backplate during the manufacturing process and reliability testing, thereby improving product reliability.

[0053] In one embodiment, the housing 10 has a groove, within which the auxiliary film layer 20, the light-emitting substrate 30, and the bonding structure 50 are all located. The housing 10 may include a base plate 12 and a side plate 13 located on the base plate 12, the side plate 13 being annular. The mounting surface 11 is the top surface of the base plate 12. The housing 10 may be made of metal.

[0054] In one embodiment, the auxiliary film layer 20 is made of foam. This provides good thermal conductivity, allowing the heat generated during the operation of the light-emitting substrate 30 to be conducted to the housing 10, which then conducts the heat away, preventing excessive temperature rise in the light-emitting substrate 30 and contributing to improved performance of the light-emitting device. Furthermore, the foam provides good shock absorption, acting as a buffer to protect the light-emitting substrate 30. In other embodiments, the auxiliary film layer 20 can also be made of other elastic materials with good heat dissipation properties.

[0055] In one embodiment, the adhesive is a photosensitive adhesive. During the fabrication of the light-emitting device, an uncured, fluid photosensitive adhesive can be coated onto the outer side of the auxiliary film layer 20, and then cured by ultraviolet light irradiation to form an adhesive structure 50. When the light-emitting substrate 30 needs to be reworked, an adhesive remover can be used to remove the adhesive structure 50, thereby releasing the fixation between the light-emitting substrate 30 and the housing 10. The light-emitting substrate 30 can then be removed from the housing 10. Compared to using a large-area adhesive layer to bond the light-emitting substrate 30 to the housing 10, this avoids the problem of deformation of the light-emitting substrate when removing it from the housing 10, thus improving the rework yield of the light-emitting substrate 30. Of course, other materials can also be used as the adhesive, as long as they meet the requirements of changing from an uncured state to a cured state under the first condition and being easily separable from the light-emitting substrate and the housing under the second condition.

[0056] In one embodiment, such as Figure 1 and Figure 2 As shown, the light-emitting device further includes an adhesive layer 40, which is located between the mounting surface 11 of the housing 10 and the auxiliary film layer 20. With this configuration, the auxiliary film layer 20 is bonded to the mounting surface 11 of the housing 10 via the adhesive layer 40, preventing the auxiliary film layer 20 from moving on the mounting surface 11. This prevents the side of the auxiliary film layer 20 from being flush with the side of the light-emitting substrate 30 in some locations, or even from extending beyond the side of the light-emitting substrate 30. Consequently, at these locations, there is no adhesive structure 50 between the light-emitting substrate 30 and the mounting surface 11 of the housing 10.

[0057] In another embodiment, the adhesive layer 40 is located between the light-emitting substrate 30 and the auxiliary film layer 20. This arrangement ensures that the auxiliary film layer 20 is bonded to the light-emitting substrate 30 via the adhesive layer 40, preventing relative movement between the auxiliary film layer 20 and the light-emitting substrate 30. This prevents the side of the auxiliary film layer 20 from being flush with or even extending beyond the side of the light-emitting substrate 30 at certain locations, thus eliminating the adhesive structure 50 between the light-emitting substrate 30 and the mounting surface 11 of the housing 10 at those locations.

[0058] Preferably, the adhesive layer 40 is located between the mounting surface 11 of the housing 10 and the auxiliary film layer 20. When the light-emitting substrate 30 needs to be reworked, the adhesive structure 50 can be removed by using a desiccant, which facilitates the separation of the light-emitting substrate 30 from the auxiliary film layer 20 and the housing 10.

[0059] In one embodiment, the light-emitting element 32 can be a Mini LED or a Micro LED, with the Mini LED having a size of approximately 100μm to 500μm and the Micro LED having a size of less than 100μm.

[0060] In one embodiment, the distance between the edge of the orthographic projection of the light-emitting substrate 30 onto the mounting surface 11 of the housing 10 and the edge of the orthographic projection of the auxiliary film layer 20 onto the mounting surface 11 of the housing 10 is in the range of 1mm to 5mm. The edge of the orthographic projection of the light-emitting substrate 30 onto the mounting surface 11 of the housing 10 is also the edge of the orthographic projection of the substrate 31 of the light-emitting substrate 30 onto the mounting surface 11 of the housing 10. This arrangement avoids both situations where the distance between the edge of the projection of the light-emitting substrate 30 onto the mounting surface 11 of the housing 10 and the edge of the projection of the auxiliary film layer 20 onto the mounting surface 11 of the housing 10 is too small, resulting in insufficient adhesive to accommodate the gap between the light-emitting substrate 30 and the mounting surface 11 of the housing 10, thus preventing the formed bonding structure 50 from firmly bonding the light-emitting substrate 30 to the housing 10; and where the distance between the edge of the projection of the light-emitting substrate 30 onto the mounting surface 11 of the housing 10 and the edge of the projection of the auxiliary film layer 20 onto the mounting surface 11 of the housing 10 is too large, preventing the adhesive from completely filling the gap between the light-emitting substrate 30 and the mounting surface 11 of the housing 10, thus affecting the bonding effect between the light-emitting substrate 30 and the housing 10. The distance between the edge of the projection of the light-emitting substrate 30 onto the mounting surface 11 of the housing 10 and the edge of the projection of the auxiliary film layer 20 onto the mounting surface 11 of the housing 10 can be, for example, 1mm, 2mm, 3mm, 4mm, 5mm, etc.

[0061] In one embodiment, the bonding structure 50 is annular and surrounds the auxiliary film layer 20. This results in a stronger bond between the light-emitting substrate 30 and the mounting surface of the housing 10. In other embodiments, the bonding structure 50 may include a plurality of bonding blocks spaced apart around the auxiliary film layer 20.

[0062] In one embodiment, such as Figure 1 and Figure 2 As shown, the bonding structure 50 includes a first sub-bonding structure 51 and a second sub-bonding structure 52. The first sub-bonding structure 51 is located between the light-emitting substrate 30 and the mounting surface 11 of the housing 10, and the second sub-bonding structure 52 is located outside the first sub-bonding structure 51 and is in direct contact with the side of the light-emitting substrate 30. This arrangement results in a relatively large contact area between the bonding structure 50 and both the light-emitting substrate 30 and the mounting surface 11 of the housing 10, allowing for a more secure bond between the light-emitting substrate 30 and the housing 10.

[0063] like Figure 4As shown, the adhesive structure 50 surrounds the auxiliary film layer 20, meaning the adhesive structure 50 is located outside the auxiliary film layer 20, and the auxiliary film layer 20 is located inside the adhesive structure 50. In other words, the area outside the auxiliary film layer 20 is where the adhesive structure 50 is located, i.e., outside the auxiliary film layer; the area enclosed by the adhesive structure 50 is where the auxiliary film layer 20 is located, i.e., inside the adhesive structure 50. Similarly, the second sub-adhesive structure 52 surrounds the first sub-adhesive structure 51, meaning the second sub-adhesive structure 52 is located outside the first sub-adhesive structure 51, and the first sub-adhesive structure 51 is located inside the second sub-adhesive structure 52.

[0064] In one embodiment, such as Figure 1 and Figure 2 As shown, the light-emitting device also includes a frame 60, which is annular, and the auxiliary film layer 20, the light-emitting substrate 30 and the bonding structure 50 are all located within the frame 60.

[0065] There is a gap between the inner surface of the frame 60 and the auxiliary film layer 20, the light-emitting substrate 30 and the bonding structure 50.

[0066] The frame 60 can limit the auxiliary film layer 20, the light-emitting substrate 30 and the bonding structure 50 to prevent them from shifting too much during the assembly process.

[0067] In one embodiment, such as Figure 1 As shown, the distance between the side surface of the light-emitting substrate 30 and the inner surface of the adhesive frame 60 is greater than or equal to 1.5 mm. This arrangement ensures that the space between the side surface of the adhesive structure 50 away from the light-emitting substrate 30 and the adhesive frame 60 is sufficient to accommodate an ultraviolet lamp to irradiate the photosensitive adhesive.

[0068] And ensure that the space is large enough to accommodate enough desiccant to react with the adhesive structure 50 to separate the light-emitting substrate 30 from the housing 10.

[0069] In one embodiment, such as Figure 1 As shown, the distance d1 between the side of the bonding structure 50 facing away from the light-emitting substrate 30 and the side of the light-emitting substrate 30 is less than or equal to 1 mm. This arrangement avoids the bonding structure 50 affecting the assembly of the frame 60.

[0070] In one embodiment, the distance d2 from the surface 5 of the bonding structure 50 facing away from the mounting surface 11 of the housing 10 to the mounting surface 11 of the housing 10 is less than or equal to the distance d2 from the surface 5 of the light-emitting substrate 30 facing away from the mounting surface 11 of the housing 10.

[0071] The distance d3 from the surface of the mounting surface 11 of the housing 10 to the mounting surface 11 of the housing 10. The display device containing the light-emitting device also includes an optical film layer, such as a diffusion film, a light-diffusing film, or a prism, located on the side of the light-emitting substrate 30 facing away from the mounting surface 11 to optimize light. By setting d2 to be less than or equal to d3, then...

[0072] This avoids the bonding structure 50 extending beyond the light-emitting substrate 30 and affecting the setting of these optical film layers, as well as affecting the stretching of these optical film layers during the operation of the display device.

[0073] Furthermore, the distance d2 from the surface of the bonding structure 50 away from the mounting surface 11 of the housing 10 to the mounting surface 11 of the housing 10 is greater than or equal to 0.5 mm. This configuration ensures that the bonding structure 50 firmly bonds the light-emitting substrate 30 to the housing 10.

[0074] In one embodiment, such as Figure 2 and Figure 3 As shown, the substrate 31 has a plurality of first openings 311, and the auxiliary film layer 20 has a plurality of second openings 21. One of the first openings 311 is located in...

[0075] The orthographic projection of the mounting surface 11 of the housing 10 lies within the orthographic projection of a second opening 21 on the mounting surface 11 of the housing 10. The light-emitting device further includes a plurality of adhesive portions 53, a portion of which is located within the first opening 311 and another portion within the second opening 21, and the adhesive portion 53 is in direct contact with the mounting surface 11 of the housing 10. The material of the adhesive portion 53 includes the adhesive. The first opening 311 and the second opening 21 can correspond one-to-one, and the orthographic projection of each first opening 311 on the mounting surface 11 of the housing 10 lies within the orthographic projection of the corresponding second opening 21 on the mounting surface 11 of the housing 10. When the light-emitting device includes an adhesive layer 40, the adhesive layer 40 may be provided with a third opening that corresponds one-to-one with the second opening 21, and the orthographic projection of the third opening on the mounting surface 11 of the housing 10 and the orthographic projection of the second opening 21 on the mounting surface 11 of the housing 10 can overlap. The adhesive portion 53 corresponds one-to-one with the first opening 311, and each first opening 311 and the corresponding second opening 21 are provided with an adhesive portion 53. With this arrangement, part of the adhesive portion 53 is in direct contact with the substrate 31, and the other part is in direct contact with the mounting surface 11 of the housing 10, so that the adhesive portion 53 bonds the light-emitting substrate 30 and the housing 10 together.

[0076] Furthermore, the edge of the orthographic projection of the first opening 311 onto the mounting surface 11 of the housing 10 is located inside the edge of the orthographic projection of the second opening 21 onto the mounting surface 11 of the housing 10. With this configuration, the adhesive portion 53 contacts both the surface of the light-emitting substrate 30 facing the auxiliary film layer 20 and the inner surface of the first opening 311. The contact area between the adhesive portion 53 and the light-emitting substrate 30 is relatively large, which helps to improve the bonding strength between the light-emitting substrate 30 and the housing 10.

[0077] In one embodiment, the plurality of first openings 311 are evenly spaced on the substrate 31. This ensures that the adhesive portions 53 are evenly distributed, resulting in a stronger bond between the light-emitting substrate 30 and the housing 10.

[0078] In one embodiment, the radius of the first opening 311 ranges from 0.5mm to 1mm, and the radius of the second opening 21 ranges from 3mm to 4mm. For example, the radius of the first opening 311 is 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc., and the radius of the second opening 21 is 3mm, 3.2mm, 3.4mm, 3.6mm, 3.8mm, 4mm, etc.

[0079] In one embodiment, each first opening 311 is surrounded by four light-emitting elements 32 arranged in two rows and two columns, and the distance from the first opening 311 to the four light-emitting elements 32 surrounding it can be substantially the same.

[0080] In one embodiment, the cross-section of the light-emitting substrate can be rectangular, and the distance between two adjacent first openings 311 can be one-quarter of the long side of the cross-section of the light-emitting substrate. With this configuration, the number of adhesive portions can ensure the firmness of the bonding between the light-emitting substrate 30 and the housing 10, while avoiding an excessive number of first openings 311 that could affect the strength of the light-emitting substrate 30.

[0081] In one embodiment, the light-emitting substrate 30 further includes a plurality of reflective sheets 71 located on the side of the substrate 31 facing away from the mounting surface 11 of the housing 10. The orthographic projection of one reflective sheet 71 onto the mounting surface 11 of the housing 10 overlaps the orthographic projection of one of the first openings 311 onto the mounting surface 11 of the housing 10. The reflective sheets 71 and the first openings 311 can correspond one-to-one, with the orthographic projection of each reflective sheet 71 onto the mounting surface 11 of the housing 10 overlapping the orthographic projection of the corresponding first opening 311 onto the mounting surface 11 of the housing 10. This configuration results in higher reflectivity of the reflective sheets, preventing uneven brightness of the displayed image caused by excessively low reflectivity at the first opening 311.

[0082] Furthermore, the area of ​​the reflector 71 is larger than the cross-section of the first opening 311. The cross-section refers to the section parallel to the mounting surface.

[0083] In some embodiments, the material of the reflective sheet 71 may be polycarbonate or polyethylene terephthalate.

[0084] In another embodiment, such as Figure 5 and Figure 6 As shown, the light-emitting substrate 30 further includes a reflector 72 located on the side of the substrate 31 facing away from the mounting surface 11. The reflector 72 includes a plurality of reflective portions 721, and each side of the light-emitting element 32 is provided with a reflective portion 721. The reflector 72 covers the plurality of first openings. By providing the reflector 72, the emissivity of the light emitted by the light-emitting element 32 can be improved. At the same time, the reflector 72 covers each of the first openings 311, which can avoid the problem of uneven brightness of the display device where the light-emitting device is located due to the low reflectivity at the first openings 311.

[0085] This application also provides a method for fabricating a light-emitting device. For example... Figure 7 As shown, the preparation method includes steps 110 to 140.

[0086] In step 110, a housing is provided, the housing including a mounting surface.

[0087] In step 120, an auxiliary film layer is disposed on the mounting surface.

[0088] In one embodiment, the auxiliary membrane layer can be bonded to the mounting surface via an adhesive layer.

[0089] In step 130, at least the substrate of the light-emitting substrate and the light-emitting element located on one side of the substrate are disposed on the side of the auxiliary film layer away from the mounting surface, and the plurality of light-emitting elements are located on the side of the substrate away from the auxiliary film layer; the edge of the substrate in the orthographic projection on the mounting surface is located outside the edge of the auxiliary film layer in the orthographic projection on the mounting surface.

[0090] In this embodiment, such as Figure 8 As shown, a pressure head fixture 73 can be used to move the light-emitting substrate 30 onto the auxiliary film layer 20. Specifically, the pressure head fixture 73 includes multiple suction nozzles 731. The suction nozzles 731 draw air inward, causing the light-emitting substrate 30 to adhere to the suction nozzles 731. The pressure head fixture 73 then moves the light-emitting substrate 30 onto the auxiliary film layer 20. Subsequently, the air path of the suction nozzles 731 changes, spraying air into the light-emitting substrate 30 and applying pressure to it.

[0091] In step 140, an adhesive structure is formed on the outer side of the auxiliary film layer, the adhesive structure being located at least between the substrate and the mounting surface, and the material of the adhesive structure including an adhesive.

[0092] In one embodiment, the adhesive is a photosensitive adhesive, and step 140, which forms the bonding structure on the outer side of the auxiliary film layer, includes the following process:

[0093] A flowable photosensitive adhesive is disposed on the outer side of the auxiliary film layer, and the photosensitive adhesive is cured by ultraviolet light irradiation to form an adhesive structure.

[0094] like Figure 8 As shown, the ultraviolet lamp 74 can be placed on the side of the auxiliary film layer 20, and the ultraviolet light emitted by the ultraviolet lamp 74 can irradiate the photosensitive adhesive on the outside of the auxiliary film layer 20.

[0095] In one embodiment, the substrate has a plurality of first openings, and the auxiliary film layer has a plurality of second openings. The orthographic projection of one of the first openings on the mounting surface lies within the orthographic projection of one of the second openings on the mounting surface. The preparation method further includes: distributing a flowable photosensitive adhesive within the first and second openings, and subjecting the photosensitive adhesive to ultraviolet light irradiation to cure it, forming an adhesive portion. A portion of the adhesive portion is located within the first opening, and a portion is located within the second opening, and the adhesive portion is in direct contact with the mounting surface. This step can be performed after step 140, before step 140, or simultaneously with step 140.

[0096] In one embodiment, the edge of the orthographic projection of the first opening onto the mounting surface of the housing is located inside the edge of the orthographic projection of the second opening onto the mounting surface of the housing.

[0097] In one embodiment, the light-emitting substrate further includes a plurality of reflective sheets located on the side of the substrate opposite to the mounting surface. After the steps of distributing flowable photosensitive adhesive within the first and second openings and subjecting the photosensitive adhesive to ultraviolet light irradiation to cure it and form an adhesive portion, the preparation method further includes:

[0098] Multiple reflective sheets are disposed on the side of the substrate away from the auxiliary film layer, and the orthographic projection of one of the reflective sheets on the mounting surface covers the orthographic projection of one of the first openings on the mounting surface.

[0099] In this embodiment, the reflective sheet and the first opening are one-to-one correspondences, and the orthographic projection of each reflective sheet on the mounting surface of the housing covers the orthographic projection of the corresponding first opening on the mounting surface of the housing. After forming the adhesive portion, the reflective sheet is disposed on the side of the first opening facing away from the auxiliary film layer.

[0100] In another embodiment, the light-emitting substrate further includes a reflector, the reflector including a plurality of reflective portions. After the steps of distributing flowable photosensitive adhesive within the first and second openings and irradiating the photosensitive adhesive with ultraviolet light to cure it and form an adhesive portion, the preparation method further includes:

[0101] A reflector is provided on the side of the substrate away from the auxiliary film layer, the reflector covering the plurality of first openings, and the reflective portion is provided on each side of the light-emitting element.

[0102] By setting a reflector, the emissivity of the light emitted by the light-emitting element can be improved. At the same time, the reflector covers each of the first openings, which can prevent uneven brightness of the display device where the light-emitting device is located from being caused by too low reflectivity at the first openings. After forming the bonding part, the reflector is set on the side of the first opening away from the auxiliary film layer.

[0103] In one embodiment, the method for fabricating the light-emitting device further includes: mounting a frame onto the mounting surface of the housing. The frame is annular, and the auxiliary film layer 20, the light-emitting substrate 30, and the bonding structure 50 are surrounded by the frame.

[0104] In one embodiment, the step of mounting the frame on the mounting surface of the housing can be performed before step 110 or after step 140.

[0105] The embodiments of the light-emitting device fabrication method provided in this application and the embodiments of the light-emitting device belong to the same inventive concept. The relevant details and beneficial effects can be referred to each other, and will not be repeated here.

[0106] This application also provides a display device, which includes the above-described light-emitting device.

[0107] In some embodiments, the display device may be a liquid crystal display device, such as... Figure 9 As shown, the liquid crystal display device includes a liquid crystal panel 90 and a backlight disposed on the non-display side of the liquid crystal panel, the backlight including the light-emitting device described above.

[0108] like Figure 9 As shown, the display device also includes an optical film layer 80 located between the liquid crystal panel 90 and the light-emitting device. The optical film layer 80 may include an upper diffuser plate, an upper prism, a lower prism, a lower diffuser plate, a light-diffusing film, etc. When the light-emitting element of the light-emitting device emits blue light, the optical film layer 80 may also include a quantum dot film and a blue light transmission film to achieve color display of the display device.

[0109] In another embodiment, the light-emitting device in the display device is used as a display substrate. When the light-emitting device is used as a display substrate, each light-emitting element is a sub-pixel.

[0110] The display device can be any suitable display device, including but not limited to mobile phones, tablets, televisions, monitors, laptops, digital photo frames, navigators, e-readers, and any other products or components with display functions.

[0111] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0112] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0113] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A light-emitting device, characterized in that, The light-emitting device includes: Housing, the housing including a mounting surface; An auxiliary film layer located on the mounting surface; A light-emitting substrate located on the side of the auxiliary film layer away from the mounting surface, the light-emitting substrate including a substrate and a plurality of light-emitting elements located on the side of the substrate away from the auxiliary film layer; the edge of the orthographic projection of the light-emitting substrate on the mounting surface is located outside the edge of the orthographic projection of the auxiliary film layer on the mounting surface; the orthographic projections of the auxiliary film layer on the mounting surface and the orthographic projections of the light-emitting substrate on the mounting surface all fall on the mounting surface. An adhesive structure is located outside the auxiliary film layer and at least between the light-emitting substrate and the mounting surface; the adhesive structure is made of an adhesive. The substrate has a plurality of first openings, and the auxiliary film layer has a plurality of second openings. The edge of the orthographic projection of one of the first openings on the mounting surface is located inside the edge of the orthographic projection of one of the second openings on the mounting surface. The light-emitting device also includes a plurality of adhesive portions. A portion of the adhesive portion is located in the first opening, and another portion is located in the second opening, and the adhesive portion is in direct contact with the mounting surface. The material of the adhesive portion includes the adhesive.

2. The light-emitting device according to claim 1, characterized in that, The adhesive is a photosensitive adhesive.

3. The light-emitting device according to claim 1, characterized in that, The bonding structure includes a first sub-bonding structure and a second sub-bonding structure. The first sub-bonding structure is located between the light-emitting substrate and the mounting surface, and the second sub-bonding structure is located outside the first sub-bonding structure and is in direct contact with the side of the light-emitting substrate.

4. The light-emitting device according to claim 1, characterized in that, The distance between the side of the bonding structure facing away from the light-emitting substrate and the side of the light-emitting substrate is less than or equal to 1 mm; and / or, The distance from the surface of the bonding structure facing away from the mounting surface to the mounting surface is less than or equal to the distance from the surface of the light-emitting substrate facing away from the mounting surface to the mounting surface.

5. The light-emitting device according to claim 1, characterized in that, The auxiliary membrane layer is made of foam; and / or, The light-emitting device further includes an adhesive layer, which is located between the mounting surface and the auxiliary film layer, or the adhesive layer is located between the light-emitting substrate and the auxiliary film layer.

6. The light-emitting device according to claim 1, characterized in that, The distance between the edge of the light-emitting substrate projected onto the mounting surface and the edge of the auxiliary film layer projected onto the mounting surface ranges from 1 mm to 5 mm.

7. The light-emitting device according to claim 1, characterized in that, The light-emitting substrate further includes a plurality of reflective sheets located on the side of the substrate opposite to the mounting surface, wherein the orthographic projection of one of the reflective sheets on the mounting surface overlaps the orthographic projection of one of the first openings on the mounting surface; or, The light-emitting substrate includes a reflector located on the side of the substrate away from the mounting surface. The reflector includes a plurality of reflective portions, and the reflective portions are respectively provided on each side of the light-emitting element. The reflector covers the plurality of first openings.

8. A display device, characterized in that, The display device includes the light-emitting device according to any one of claims 1 to 7.

9. A method for fabricating a light-emitting device, characterized in that, The preparation method includes: A housing is provided, the housing including a mounting surface; An auxiliary film layer is disposed on the mounting surface; At least one light-emitting substrate and a plurality of light-emitting elements located on one side of the substrate are disposed on the side of the auxiliary film layer away from the mounting surface, and the plurality of light-emitting elements are located on the side of the substrate away from the auxiliary film layer; the edge of the orthographic projection of the substrate on the mounting surface is located outside the edge of the orthographic projection of the auxiliary film layer on the mounting surface; the orthographic projection of the auxiliary film layer on the mounting surface and the orthographic projection of the light-emitting substrate on the mounting surface both fall on the mounting surface. An adhesive structure is formed on the outer side of the auxiliary film layer, the adhesive structure being located at least between the light-emitting substrate and the mounting surface, and the material of the adhesive structure includes an adhesive. The substrate has a plurality of first openings, and the auxiliary film layer has a plurality of second openings. The edge of the orthographic projection of one of the first openings on the mounting surface is located inside the edge of the orthographic projection of one of the second openings on the mounting surface. The fabrication method further includes: A flowable photosensitive adhesive is disposed in the first opening and the second opening, and the photosensitive adhesive is cured by ultraviolet light to form an adhesive part. A portion of the adhesive part is located in the first opening and a portion is located in the second opening, and the adhesive part is in direct contact with the mounting surface.

10. The method for fabricating a light-emitting device according to claim 9, characterized in that, The adhesive is a photosensitive adhesive, and the bonding structure formed on the outer side of the auxiliary film layer includes: A flowable photosensitive adhesive is disposed on the outer side of the auxiliary film layer, and the photosensitive adhesive is cured by ultraviolet light irradiation to form an adhesive structure.

11. The method for fabricating a light-emitting device according to claim 9, characterized in that, The light-emitting substrate further includes multiple reflective sheets; after the process of placing flowable photosensitive adhesive in the first and second openings and curing the photosensitive adhesive by ultraviolet light irradiation to form an adhesive portion, the preparation method further includes: Multiple reflective sheets are disposed on the side of the substrate away from the auxiliary film layer, and the orthographic projection of one of the reflective sheets on the mounting surface covers the orthographic projection of one of the first openings on the mounting surface. or, The light-emitting substrate further includes a reflector, which includes multiple reflective portions; after the process of distributing flowable photosensitive adhesive in the first and second openings and curing the photosensitive adhesive by ultraviolet light irradiation to form an adhesive portion, the preparation method further includes: A reflector is provided on the side of the substrate away from the auxiliary film layer, and the reflector covers the plurality of first openings; the reflective portion is provided on each side of the light-emitting element.

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