Automatic mounting mechanism, mounting control method thereof and pump source chip mounter

Abstract

The application discloses an automatic mounting mechanism, a mounting control method thereof and a pump source chip mounter. The automatic mounting mechanism comprises a mounting seat, a driving device, a pickup assembly, a first camera device and a control device. The mounting seat is movably arranged on a workbench and can reach a feeding station and a mounting station of the workbench. The driving device is used to drive the mounting seat to move. The pickup assembly comprises a pickup part rotatably arranged on the mounting seat. The pickup part is used to pick up a chip or a soldering sheet on the feeding station to the mounting station. The first camera device is used to shoot the position of a to-be-mounted piece and a chip slot of a pump source sintering disc. The control device is electrically connected with the driving device, the pickup assembly and the camera device. The first camera device is used to identify the position of the to-be-mounted piece and the chip slot. The pickup part is controlled to reciprocally move between the feeding station and the mounting station. Compared with manual chip mounting, the to-be-mounted piece can be automatically mounted in the chip slot, and the efficiency and the accuracy are high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip mounting, in particular to an automatic mounting mechanism, a mounting control method thereof and a pump source chip mounter. BACKGROUND

[0002] The pump source is a core component of the fiber laser, and in the actual production process, the soldering sheet and the chip need to be connected with the pump source base in a certain order. In the existing production process, manual operation is mostly used. Specifically, the soldering sheet and the chip are picked up by a tweezers, and then placed on the designated position of the pump source base in a certain order. Manual operation is low in efficiency, and has high requirements for the proficiency of the operator. Even the most skilled operator will be tired after a long time of work, resulting in a decline in processing quality. Since the chip mounting requires high precision, it is difficult to guarantee the quality standard. SUMMARY

[0003] The main purpose of the present application is to provide an automatic mounting mechanism, a mounting control method thereof and a pump source chip mounter, which aims to solve the technical problems of low efficiency and difficulty in guaranteeing the quality standard of manual mounting of the pump source soldering sheet or chip.

[0004] To achieve the above purpose, the automatic mounting mechanism provided by the present application is arranged on a workbench, the workbench is provided with a feeding station and a mounting station, the automatic mounting mechanism is used to mount the to-be-mounted piece in the feeding station into the chip slot on the pump source sintering disc in the mounting station, and the automatic mounting mechanism comprises:

[0005] A mounting seat is movably arranged relative to the workbench, so that it can reach the feeding station and the mounting station in the movement stroke;

[0006] A driving device is installed on the workbench, the driving device is drivingly connected to the mounting seat to drive the movement of the mounting seat;

[0007] A picking assembly is installed on the mounting seat, and the picking assembly comprises a picking part rotatably installed on the mounting seat about an axis extending in the up-down direction, the picking part is used to pick the to-be-mounted piece on the feeding station to the mounting station;

[0008] A first camera is installed on the mounting seat, the first camera is used to shoot the position of the to-be-mounted piece in the feeding station and the chip slot of the pump source sintering disc;

[0009] A control device is electrically connected to the driving device, the picking assembly and the first camera respectively.

[0010] Optionally, the first camera is arranged on the upper side of the loading station and the mounting station, and is used to take pictures from top to bottom.

[0011] The automatic mounting mechanism further comprises a second camera fixedly installed on the workbench, and the mounting seat is movable to the upper side of the second camera in the movable stroke, and the second camera is used to take pictures from bottom to top.

[0012] Optionally, the lower end of the pickup part is provided with a suction nozzle, and the suction nozzle is used to pick up the to-be-mounted component.

[0013] The mounting seat is further provided with a third camera, and the third camera is used to take pictures of the suction nozzle.

[0014] Optionally, the pickup assembly comprises a driving motor fixedly installed on the mounting seat and drivingly connected to the pickup part, so that the pickup part rotates around the axis extending in the up-down direction.

[0015] The application further provides a pump source mounting machine, which comprises at least one automatic mounting mechanism as described above, and the automatic mounting mechanism comprises:

[0016] A mounting seat movably arranged relative to the workbench, so that the mounting seat can reach the loading station and the mounting station in the movable stroke;

[0017] A driving device installed on the workbench, and the driving device is drivingly connected to the mounting seat to drive the mounting seat to move;

[0018] A pickup assembly installed on the mounting seat, and the pickup assembly comprises a pickup part rotatably installed on the mounting seat around the axis extending in the up-down direction, and the pickup part is used to pick up the to-be-mounted component on the loading station to the mounting station;

[0019] A first camera installed on the mounting seat, and the first camera is used to take pictures of the to-be-mounted component on the loading station and the position of the mounting groove of the pump source sintering disc;

[0020] A control device electrically connected to the driving device, the pickup assembly and the first camera.

[0021] The application further provides a mounting control method based on the automatic mounting mechanism as described above, and the automatic mounting mechanism comprises:

[0022] A mounting seat movably arranged relative to the workbench, so that the mounting seat can reach the loading station and the mounting station in the movable stroke;

[0023] A drive device is mounted on the workbench, and the drive device drives the mounting base to move.

[0024] A pickup assembly is mounted on the mounting base, and the pickup assembly includes a pickup part rotatably mounted on the mounting base about an axis extending in the vertical direction, the pickup part being used to pick up the part to be mounted placed on the loading station and move it to the mounting station.

[0025] A first camera device is mounted on the mounting base. The first camera device is used to capture images of the parts to be mounted at the loading station and the position of the mounting slot of the pump source sintering plate.

[0026] The control device is electrically connected to the drive device, the pickup component, and the first camera device, respectively.

[0027] The mounting control method includes the following steps:

[0028] Obtain the pick-up position of the component to be mounted;

[0029] Control the pickup unit to move to the pickup position to pick up the component to be mounted;

[0030] Obtain the target mounting position of the component to be mounted;

[0031] The pickup unit is controlled to move to the target mounting position so as to mount the part to be mounted at the target mounting position.

[0032] Optionally, the component to be attached has a front and a back side, and the step of obtaining the pick-up position of the component to be attached includes:

[0033] Obtain first image information parameters of the front side of the component to be mounted, wherein the first image information parameters include first position parameters of the component to be mounted;

[0034] The step of controlling the pickup unit to move to the pickup position to pick up the component to be mounted includes:

[0035] Obtain the second position parameter of the pickup unit;

[0036] Calculate the first position deviation parameter based on the first position parameter and the second position parameter;

[0037] The pickup unit is controlled to move according to the first position deviation parameter so that the position parameter of the pickup unit after movement coincides with the first position parameter.

[0038] Optionally, the component to be mounted includes a soldering pad, the first image information parameter further includes a first contamination information parameter, and the step of acquiring the second position parameter of the pickup portion specifically includes:

[0039] acquiring the second position parameter of the pickup portion when the front surface of the soldering pad is free of contamination;

[0040] after the step of acquiring the first image information parameter of the component to be mounted, the method further includes:

[0041] controlling the pickup portion to place the soldering pad into a waste bin when the front surface of the soldering pad is contaminated.

[0042] Optionally, the component to be mounted includes a chip, the first image information parameter further includes a chip ID information parameter, and the step of acquiring the second position parameter of the pickup portion specifically includes:

[0043] acquiring the second position parameter of the pickup portion when the chip ID information parameter is correctly matched with an MES system;

[0044] after the step of acquiring the first image information parameter of the component to be mounted, the method further includes:

[0045] controlling the automatic mounting mechanism to stop and controlling an alarm device to issue an alarm prompt when the chip ID information parameter is incorrectly matched with the MES system.

[0046] Optionally, the step of acquiring the target mounting position of the component to be mounted includes:

[0047] acquiring image information of a pump source sintering disc, wherein the image information of the pump source sintering disc includes a model of the pump source sintering disc;

[0048] acquiring position information of a corresponding patch slot according to the model of the pump source sintering disc, and determining the position information of the corresponding patch slot as the target mounting position.

[0049] Optionally, the component to be mounted has opposite front and back surfaces, and before the step of controlling the pickup portion to move to the target mounting position to mount the component to be mounted at the target mounting position, the method further includes:

[0050] acquiring second image information parameters of the back surface of the component to be mounted, wherein the second image information parameters include third position parameters of the component to be picked up;

[0051] acquiring fourth position parameters of the pickup portion;

[0052] calculating a second position deviation parameter according to the third position parameters and the fourth position parameters;

[0053] The step of controlling the pickup portion to move to the target mounting position to mount the component to be mounted at the target mounting position comprises:

[0054] Obtaining a target mounting position parameter of the target mounting position;

[0055] Calculating a third position deviation parameter according to the fourth position parameter and the target mounting position parameter;

[0056] Determining a final position deviation parameter according to the second position deviation parameter and the third position deviation parameter;

[0057] Controlling the pickup portion to move to the target mounting position according to the final position deviation parameter.

[0058] Optionally, the component to be mounted comprises a soldering patch, and the second image information parameter further comprises a second contamination information parameter, and the step of obtaining the fourth position parameter of the pickup portion specifically comprises:

[0059] When the back surface of the soldering patch is free of contamination, obtaining the fourth position parameter of the pickup portion;

[0060] The step of obtaining the second image information parameter of the component to be mounted further comprises:

[0061] When the back surface of the soldering patch is contaminated, controlling the pickup portion to put the soldering patch into a waste bin.

[0062] Optionally, the component to be mounted comprises a chip, and the second image information parameter further comprises a second contamination information parameter, and the step of obtaining the fourth position parameter of the pickup portion specifically comprises:

[0063] When the back surface of the chip is free of contamination, obtaining the fourth position parameter of the pickup portion;

[0064] The step of obtaining the second image information parameter of the component to be mounted further comprises:

[0065] When the back surface of the chip is contaminated, controlling the pickup portion to put the chip back to the pickup position.

[0066] In the technical scheme, the automatic mounting mechanism is arranged on the workbench, the workbench is provided with a feeding station and a mounting station, the automatic mounting mechanism is used for mounting the to-be-mounted component on the feeding station into the patch slot on the pump source sintering disc on the mounting station, automatic mounting is realized, the automatic mounting mechanism comprises a mounting seat, a driving device, a pickup assembly, a first camera and a control device, the mounting seat is movably arranged relative to the workbench, so that the mounting seat can reach the feeding station and the mounting station in the movement stroke, the driving device is mounted on the workbench, the driving device is drivingly connected with the mounting seat to drive the mounting seat to move, the pickup assembly is mounted on the mounting seat, and the pickup assembly comprises a pickup portion which is rotatably mounted on the mounting seat about an axis extending in the up-down direction, the pickup portion is used for picking up the to-be-mounted component on the feeding station to the mounting station, the first camera is mounted on the mounting seat, the first camera is used for shooting the to-be-mounted component on the feeding station and the position of the patch slot on the pump source sintering disc, and the control device is electrically connected with the driving device, the pickup assembly and the first camera respectively. In the application, the mounting seat is driven by the driving device to move between the feeding station and the mounting station on the workbench, the to-be-mounted component on the feeding station is picked up to the mounting station by the pickup portion, when the pickup portion picks up and places, the first camera is used for visual identification first to judge the accurate positions of the to-be-mounted component on the feeding station and the patch slot on the pump source sintering disc on the mounting station, and then the mounting seat and the pickup portion are controlled to perform the action of picking up and placing according to the identification result. Compared with manual placing, the pickup portion is controlled to automatically pick up in the application, the pickup efficiency is high, the first camera is used for shooting positioning, the accuracy is high and the error is small. BRIEF DESCRIPTION OF DRAWINGS

[0067] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0068] Figure 1 The structural schematic diagram of an embodiment of the automatic mounting mechanism provided by the present application is shown in the figure.

[0069] Figure 2 The structural schematic diagram of another embodiment of the automatic mounting mechanism provided by the present application is shown in the figure.

[0070] Figure 3 The structural schematic diagram of another embodiment of the automatic mounting mechanism provided by the present application is shown in the figure. Figure 1Partial installation structure schematic view of the middle mounting seat, pickup device and first camera device;

[0071] Figure 4 For Figure 3 Structure schematic view of another perspective view;

[0072] Figure 5 For Figure 1 Structure schematic view of the middle pump source sintering disc;

[0073] Figure 6 Flowchart schematic view of an embodiment of the mounting control method provided by the application.

[0074] Explanation of reference numerals:

[0075] Reference Name Reference Name 1 Mounting seat 32 Driving motor 2 Driving device 4 First camera device 21 X-axis linear motion module 5 Second camera device 22 Y-axis linear motion module 6 Third camera device 23 Z-axis linear motion module 7 Feeding station 3 Pick-up assembly 8 Pump source sintering plate 31 Pick-up part 81 Patch slot 311 Suction nozzle 82 Identification code

[0076] The implementation, functional features and advantages of the application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0077] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0078] It should be noted that if the embodiments of the application involve directionality indications (such as up, down, left, right, front, back, etc.), the directionality indications are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directionality indications also change accordingly.

[0079] In addition, if the embodiments of the application involve descriptions of “first”, “second” and the like, the descriptions of “first”, “second” and the like are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by “first” and “second” can explicitly or implicitly include at least one of the features. In addition, the meaning of “and / or” appearing throughout the text includes three parallel solutions. Taking “A and / or B” as an example, it includes A solution, or B solution, or A and B solutions. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist and is not within the protection scope of the application.

[0080] The pump source is a core component of the fiber laser, and in the actual production process, the soldering sheet and the chip need to be connected with the pump source base in a certain order. In the existing production process, manual operation is mostly used. Specifically, the soldering sheet and the chip are picked up with tweezers by manual operation, and then placed on the designated position of the pump source base in a certain order. Manual operation is low in efficiency, and has a high requirement for the proficiency of the operator. Even the most skilled operator will be tired after a long time of work, resulting in a decline in processing quality. The chip mounting requires high precision, and it is difficult to guarantee the quality standard.

[0081] In view of this, the present application provides an automatic mounting mechanism, which aims to solve the technical problems of low efficiency and difficulty in guaranteeing the quality standard of manual mounting of the pump source soldering sheet or chip.

[0082] Please refer to Figures 1 to 5 for the specific embodiments of the automatic mounting mechanism provided by the present application.

[0083] In an embodiment of the present application, the automatic mounting mechanism is arranged on a workbench, and the workbench is provided with a feeding station 7 and a mounting station. The automatic mounting mechanism is used to mount the to-be-mounted component on the feeding station 7 into a patch slot 81 on a pump source sintering disc 8 on the mounting station, so as to realize automatic mounting. The automatic mounting mechanism comprises a mounting seat 1, a driving device 2, a pickup assembly 3, a first camera 4 and a control device. The mounting seat 1 is movably arranged relative to the workbench, so that it can reach the feeding station 7 and the mounting station on a movement stroke. The driving device 2 is mounted on the workbench, and the driving device 2 is drivingly connected to the mounting seat 1 to drive the mounting seat 1 to move. The pickup assembly 3 is mounted on the mounting seat 1, and the pickup assembly 3 comprises a pickup part 31 which is rotatably mounted on the mounting seat 1 about an axis extending in the up-down direction. The pickup part 31 is used to pick up the to-be-mounted component on the feeding station 7 to the mounting station. The first camera 4 is mounted on the mounting seat 1, and the first camera 4 is used to shoot the to-be-mounted component on the feeding station 7 and the position of the patch slot 81 on the pump source sintering disc 8. The control device is electrically connected to the driving device 2, the pickup assembly 3 and the first camera 4, respectively. In the present application, the driving device 2 drives the mounting seat 1 to move between the feeding station 7 and the mounting station on the workbench, and the pickup part 31 picks up the to-be-mounted component on the feeding station 7 to the mounting station. When the pickup part 31 picks up and places the to-be-mounted component, the first camera 4 is used to perform visual identification first, so as to determine the accurate position of the to-be-mounted component on the feeding station 7 and the patch slot 81 on the pump source sintering disc 8 on the mounting station. Then, the mounting seat 1 and the pickup part 31 are controlled to perform the action of picking up and placing according to the identification result. Compared with manual placement, the present application uses the pickup part 31 to automatically pick up, so that the picking up efficiency is high. The first camera 4 is used to shoot and position, so that the accuracy is high and the error is small.

[0084] Further, the first camera 4 is arranged on the upper side of the feeding station 7 and the mounting station, and is used to take pictures from top to bottom. The automatic mounting mechanism further comprises a second camera 5, which is fixedly installed on the workbench. The mounting seat 1 can move to the upper side of the second camera 5 in the active stroke. The second camera 5 is used to take pictures from bottom to top. In the embodiment, the first camera 4 comprises a first camera head and a first illuminating lamp. The first camera head extends in the up-down direction and is arranged on one side of the pickup assembly 3. The first illuminating lamp is arranged on the lower side of the first camera head and is used to illuminate downward. The mounting seat 1 is provided with a camera head support for fixing the first camera head and the first illuminating lamp. When picking up the component to be mounted, the first camera 4 is first controlled to move to the directly above of the feeding station 7, and then the first camera head takes pictures and the first illuminating lamp illuminates to determine the accurate position of the component to be mounted on the feeding station 7 and whether there is dirt on the upper surface of the component to be mounted. Then the mounting seat 1 is controlled to move so that the pickup part 31 moves to the position of the component to be mounted to pick up the component. If there is dirt, the component to be picked up can be put into the waste barrel. If there is no dirt, the subsequent mounting operation is continued.

[0085] The first camera 4 is also used to take pictures of the pump source sintering disc 8. The upper surface of the pump source sintering disc 8 is provided with an identification code 82. The identification code 82 is identified by the first camera 4 to determine the model of the pump source sintering disc 8, so as to determine the specific position of the plurality of patch slots 81 of the pump source sintering disc 8.

[0086] The second camera 5 comprises a second camera head and a second illuminating lamp. The second camera head extends in the up-down direction and is fixedly installed on one side of the workbench. The second illuminating lamp is arranged on the upper side of the second camera head and is used to illuminate upward. After the pickup part 31 picks up the component to be mounted, it is first controlled to move to the directly above of the second camera head to take pictures, so as to determine the geometric center deviation of the component to be mounted and the pickup part 31 and whether there is dirt on the lower surface of the component to be mounted. If there is dirt, the component to be mounted can be put into the waste barrel. If there is no dirt, the displacement of the pickup part 31 moving to the mounting station is calculated according to the geometric deviation, and the component to be mounted is mounted in the corresponding patch slot 81 of the pump source sintering disc 8.

[0087] In an embodiment of the present application, the lower end of the pickup part 31 is provided with a suction nozzle 311 for picking up the component to be mounted. The suction nozzle 311 is connected to a vacuum device to generate a vacuum. When picking up the component to be mounted, the pickup surface abuts against the upper surface of the component to be mounted, and the suction nozzle 311 generates a negative pressure to adsorb and pick up the component to be mounted. The mounting seat 1 is further provided with a third camera 6 for photographing the suction nozzle 311. The third camera 6 is fixedly installed on one side of the pickup part 31 and is in a normally open state, and is used to photograph the process of picking up the component to be mounted by the suction nozzle 311 and mounting the component to be mounted. If an abnormality occurs, it is convenient to record and analyze the cause of the abnormality. Subsequently, the equipment can be improved according to the analysis results to improve the accuracy and efficiency.

[0088] In an embodiment of the present application, the pickup assembly 3 comprises a driving motor 32 fixedly installed on the mounting seat 1 and drivingly connected to the pickup part 31 to rotate the pickup part 31 about an axis extending in the up-down direction. Specifically, the driving motor 32 is arranged on the upper side of the pickup part 31. The driving motor 32 is drivingly connected to the pickup part 31 through a shaft coupling to drive the pickup part 31 to rotate about the R-axis extending in the up-down direction, so as to adjust the position angle of the component to be mounted.

[0089] Specifically, the driving motor 32 can be a servo motor.

[0090] In an embodiment of the present application, the driving device 2 is specifically a three-axis platform, comprising an X-axis linear motion module 21, a Y-axis linear motion module 22 and a Z-axis linear motion module 23. The Y-axis linear motion module 22 is drivingly connected to the X-axis linear motion module 21 to drive the X-axis linear motion module 21 to move linearly along the Y-axis. The X-axis linear motion module 21 is drivingly connected to the Z-axis linear motion module 23 to drive the Z-axis linear motion module 23 to move linearly along the X-axis. The Z-axis linear motion module 23 is drivingly connected to the mounting seat 1 to drive the mounting seat 1 to move linearly along the Z-axis. In this way, the mounting seat 1 can move along the X-axis, the Y-axis and the Z-axis according to the photographing and calculation results of the first camera 4 and the second camera 5. It can be understood that the X-axis, the Y-axis and the Z-axis are perpendicular to each other.

[0091] In other embodiments, the three-axis platform can also be a three-axis linear motion mechanism driven by a screw rod slide rail. The specific structure is a common technical means in the prior art, and will not be described in detail here.

[0092] The application further provides a pump source patching machine comprising at least one automatic patching mechanism as described above. It should be noted that the detailed structure of the automatic patching mechanism in the pump source patching machine can refer to the embodiments of the automatic patching mechanism, which will not be repeated here. Since the automatic patching mechanism is used in the pump source patching machine of the application, the embodiments of the pump source patching machine of the application include all the technical solutions of all the embodiments of the automatic patching mechanism, and the technical effects are also completely the same, which will not be repeated here.

[0093] It should be further noted that the to-be-patched component includes a solder patch and a chip, and the solder patch is first patched and then the chip is patched during patching. In the technical solution of the application, two automatic patching mechanisms are specifically provided, and the two automatic patching mechanisms are respectively used to patch the solder patch and the chip in the patching groove 81 of the pump source sintering disc 8.

[0094] Please refer to Figure 6 The application further provides a patching control method of an automatic patching mechanism, which is based on the automatic patching mechanism as described above. It should be noted that the detailed structure of the automatic patching mechanism can refer to the embodiments of the automatic patching mechanism, which will not be repeated here. Since the patching control method of the application is based on the automatic patching mechanism, the automatic patching mechanism includes all the technical solutions of all the embodiments of the automatic patching mechanism, and the technical effects are also completely the same, which will not be repeated here.

[0095] In an embodiment of the application, the patching control method comprises the following steps:

[0096] Step S10, obtaining a to-be-picked position of the to-be-patched component;

[0097] Step S30, controlling the picking part 31 to move to the to-be-picked position to pick up the to-be-patched component;

[0098] Step S50, obtaining a target patching position of the to-be-patched component;

[0099] Step S70, controlling the picking part 31 to move to the target patching position to patch the to-be-patched component at the target patching position.

[0100] In the embodiment, the first camera 4 is controlled to capture the feeding station 7 to determine the pickup position of the component to be mounted, the driving device 2 is controlled to drive the pickup part 31 to the pickup position according to the position information of the pickup position, the suction nozzle 311 of the pickup part 31 is controlled to be in communication with the vacuum to pick up the component to be mounted by suction; then the first camera 4 is controlled to move to the mounting station and capture an image to obtain the target mounting position of the component to be mounted; the pickup part 31 is controlled to move to the target mounting position and mount the component to be mounted at the target mounting position, the suction nozzle 311 is controlled to be disconnected from the vacuum, and one mounting is completed, and then the above steps are repeated to continue the next mounting.

[0101] In the embodiment, the component to be mounted has opposite front and back surfaces, and the step S10 of obtaining the pickup position of the component to be mounted includes:

[0102] The step S11 of obtaining the first image information parameter of the front surface of the component to be mounted, wherein the first image information parameter includes a first position parameter of the component to be mounted;

[0103] The step S30 of controlling the pickup part 31 to move to the pickup position to pick up the component to be mounted includes:

[0104] The step S31 of obtaining a second position parameter of the pickup part 31;

[0105] The step S32 of calculating a first position deviation parameter according to the first position parameter and the second position parameter;

[0106] The step S33 of controlling the pickup part 31 to move according to the first position deviation parameter, so that the position parameter of the pickup part 31 after movement coincides with the first position parameter.

[0107] It should be noted that in the technical scheme of the present application, an XYZ three-axis coordinate system is established with the X-axis linear motion module 21, the Y-axis linear motion module 22 and the Z-axis linear motion module 23 as the reference. In the embodiment, the X-axis, the Y-axis or the Z-axis can be used as the up-down direction, which is not limited herein. In the embodiment, the Z-axis is used as the up-down direction, and the subsequent embodiments are all based on the Z-axis as the up-down direction.

[0108] The first position parameter is specifically the coordinate position of the geometric center of the to-be-mounted piece, and the second position parameter is specifically the coordinate position of the geometric center of the suction nozzle 311. A first position deviation parameter of the first position parameter and the second position parameter is calculated by the control device, so as to guide the driving device 2 to drive the X-axis linear motion module 21, the Y-axis linear motion module 22, the Z-axis linear motion module 23 and the driving motor 32 according to the first deviation parameter, so that the suction nozzle 311 of the picking part 31 is moved to the geometric center of the upper surface of the to-be-mounted piece, and the driving motor 32 is controlled to drive the suction nozzle 311 to rotate along the R-axis to adjust the picking angle.

[0109] In an embodiment of the present application, the to-be-mounted piece includes a soldering sheet, and the first image information parameter further includes a first dirt information parameter. The step S31 of acquiring the second position parameter of the picking part 31 specifically includes:

[0110] The step S311 of acquiring the second position parameter of the picking part 31 when the front surface of the soldering sheet is not dirty.

[0111] The step S11 of acquiring the first image information parameter of the to-be-mounted piece further includes:

[0112] The step S301 of controlling the picking part 31 to put the soldering sheet into a waste bucket when the front surface of the soldering sheet is dirty.

[0113] It should be noted that the chip mounting of the pump source requires high precision, and therefore the surface of the soldering sheet cannot be dirty. If the surface is dirty, the chip may be displaced during sintering, which affects the laser output of the pump source. Therefore, the first image information parameter further includes the first dirt information parameter of the front surface of the soldering sheet. Whether the front surface of the soldering sheet is dirty is determined by the first dirt information parameter. If there is no dirt, the subsequent steps are performed normally. If it is determined that the front surface of the soldering sheet is dirty, the picking part 31 picks up the soldering sheet, and then controls the picking part 31 to put the soldering sheet into a waste bucket for recycling, and then picks up a new soldering sheet from the feeding station 7.

[0114] In another embodiment of the present application, the to-be-mounted piece includes a chip, and the first image information parameter further includes a chip ID information parameter. The step S31 of acquiring the second position parameter of the picking part 31 specifically includes:

[0115] The step S312 of acquiring the second position parameter of the picking part 31 when the chip ID information parameter and the chip are correctly matched with the MES system.

[0116] The step S11, after the step of acquiring the first image information parameter of the component to be mounted, further comprises the steps of:

[0117] The step S302, when the chip ID information parameter is not matched correctly with the MES system, the automatic mounting mechanism is controlled to stop, and the alarm device is controlled to issue an alarm prompt.

[0118] It should be noted that the chip ID information parameter of each chip is different, and the performance is also different, so when the plurality of chips are mounted in the patch slot 81 of the pump source sintering disc 8, they need to be mounted in a set order. When mounting the chips in order, the chip ID information parameter corresponding to the chip needs to be identified by the first camera device 4 and compared with the MES system. If the match is correct, the second position parameter of the pickup part 31 is acquired for pickup. If the chip ID information parameter corresponding to the chip is not matched correctly with the MES system, the automatic mounting mechanism is controlled to stop, and an alarm prompt is issued, waiting for manual intervention, so as to avoid the influence of the finished product quality of the pump source caused by the wrong mounting of the chip.

[0119] In an embodiment of the present application, the step S50 of acquiring the target mounting position of the component to be mounted comprises the steps of:

[0120] The step S51, acquiring the image information of the pump source sintering disc 8, wherein the image information of the pump source sintering disc 8 comprises the model of the pump source sintering disc 8;

[0121] The step S52, according to the model of the pump source sintering disc 8, the position information of the corresponding patch slot 81 is acquired, and the position information of the corresponding patch slot 81 is determined as the target mounting position.

[0122] It should be noted that the upper surface of the pump source sintering disc 8 is provided with an identification code 82 for identifying the model of the pump source sintering disc 8, and the position information of the patch slot 81 of each model of the pump source sintering disc 8 is recorded in the system in advance. The image information of the pump source sintering disc 8 is acquired by the first camera device 4 to identify the identification code 82, and the model of the pump source sintering disc 8 is further determined; according to the model of the pump source sintering disc 8, the position information of the plurality of patch slots 81 is sequentially set as the target mounting position.

[0123] In an embodiment of the present application, the component to be mounted has opposite front and back surfaces, and the step S70, before the step of controlling the pickup part 31 to move to the target mounting position to mount the component to be mounted at the target mounting position, further comprises the steps of:

[0124] Step S61, acquiring second image information parameters of the reverse side of the component to be mounted, wherein the second image information parameters include third position parameters of the component to be picked up;

[0125] Step S62, acquiring fourth position parameters of the picking part 31;

[0126] Step S63, calculating second position deviation parameters according to the third position parameters and the fourth position parameters;

[0127] Step S70, controlling the picking part 31 to move to the target mounting position to mount the component to be mounted on the target mounting position, including:

[0128] Step S71, acquiring target mounting position parameters of the target mounting position;

[0129] calculating third position deviation parameters according to the fourth position parameters and the target mounting position parameters;

[0130] Step S72, determining final position deviation parameters according to the second position deviation parameters and the third position deviation parameters;

[0131] Step S73, controlling the picking part 31 to move to the target mounting position according to the final position deviation parameters.

[0132] In this embodiment, in order to improve the mounting accuracy, after the picking part 31 picks up the component to be mounted, before mounting the component to be mounted, the component to be mounted is first moved to the top of the second camera 5, and the third position parameters of the component to be mounted are acquired by the second camera 5, specifically, the third position parameters are the position coordinates of the geometric center of the component to be mounted at this time, and then the fourth position parameter information of the picking part 31 is acquired, specifically, the fourth position parameter information is the position coordinates of the geometric center of the suction nozzle 311 at this time; the control device calculates the second position deviation parameters according to the third position parameter information and the fourth position parameter information to guide the picking part 31 to calibrate the accurate position of the component to be mounted.

[0133] Meanwhile, the third position deviation parameters are calculated according to the fourth position parameters of the picking part 31 and the target mounting position parameters, the final position deviation parameters are determined according to the second position deviation parameters and the third position deviation parameters, and then the picking part 31 is guided to move to the target mounting position according to the final position deviation parameters, and the component to be mounted is accurately mounted in the corresponding patch groove 81 of the pump source sintering disc 8.

[0134] It should be noted that, in order to reduce the amount of calculation, the fourth position parameter is generally a fixed value, and the specific coordinate parameter of the pickup part 31 moving to the upper side of the second camera 5 is set in advance to ensure that the pickup part 31 moves to the same position each time, and the specific coordinate parameter includes the X-axis, Y-axis, Z-axis and R-axis information of the suction nozzle 311. In addition, the shape of the to-be-mounted component is generally a quadrilateral rectangle, and the cross-sectional shape of the patch groove 81 of the pump source sintering disc 8 is also rectangular, and the third position parameter of the to-be-mounted component further includes the position coordinates of the four vertices of the to-be-mounted component to determine the R-axis information of the to-be-mounted component. It can be understood that the shape of the to-be-mounted component can also be circular or other polygonal, and the shape information can be recorded into the system in advance to facilitate the identification of the position information, and the specific shape is not limited here.

[0135] In an embodiment of the present application, the to-be-mounted component includes a soldering sheet, and the second image information parameter further includes a second contamination information parameter, and the step of acquiring the fourth position parameter of the pickup part 31 specifically includes:

[0136] Step S621, when the back of the soldering sheet is free of contamination, acquiring the fourth position parameter of the pickup part 31;

[0137] After the step of acquiring the second image information parameter of the to-be-mounted component in step S61, the method further includes:

[0138] Step S64, when the back of the soldering sheet is contaminated, controlling the pickup part 31 to put the soldering sheet into a waste barrel.

[0139] In this embodiment, it is determined by the second contamination information parameter whether the back of the soldering sheet is contaminated, and if not, the fourth position parameter of the pickup part 31 is acquired, and the soldering sheet is mounted to the target mounting position; if the back of the soldering sheet is contaminated, in order to avoid affecting the sintering welding effect during sintering, and to avoid chip displacement caused by contamination, the pickup part 31 is controlled to put the soldering sheet into a waste barrel for recycling the soldering sheet, and then returns to the pickup position to pick up the next soldering sheet.

[0140] In another embodiment of the present application, the to-be-mounted component includes a chip, and the second image information parameter further includes a second contamination information parameter, and the step of acquiring the fourth position parameter of the pickup part 31 specifically includes:

[0141] Step S622, when the back of the chip is free of contamination, acquiring the fourth position parameter of the pickup part 31;

[0142] After the step of acquiring the second image information parameter of the to-be-mounted component in step S61, the method further includes:

[0143] Step S65, when the back of the chip has dirt, control the pickup unit 31 to put the chip back to the position to be picked up.

[0144] In the embodiment, the second dirt information parameter is used to determine whether the back of the chip has dirt, if not, the fourth position parameter of the pickup unit 31 is obtained, and the chip is mounted to the target mounting position; if the back of the chip has dirt, to avoid affecting the sintering welding effect during sintering, and avoid the dirt causing the chip displacement, the pickup unit 31 is controlled to put the chip back to the position to be picked up, specifically, the chip is put back to the first position parameter.

[0145] It should be noted that the chip is generally placed in the receiving tray, and a plurality of receiving grooves are arranged on the chip tray to correspond to receive a plurality of chips, if the back of the chip has dirt, the chip is put back to the corresponding receiving groove to wait for manual processing, at the same time, the corresponding patch groove 81 on the pump source sintering tray 8 is left open, the pickup unit 31 is controlled to pick up the next chip from the next receiving groove, and the next chip is correspondingly mounted in the next patch groove 81 on the pump source sintering tray 8; if the back of the next chip still has dirt, the same is true. After the mounting of the plurality of patch grooves 81 on the pump source sintering tray 8 is completed, the patch grooves 81 without mounting are processed manually, and the system can record and mark the position of the patch groove 81 without mounting the chip, and the position of the corresponding chip on the receiving tray, so as to facilitate manual processing.

[0146] The above description is only the preferred embodiment of the present application, and does not limit the patent scope of the present application, any equivalent structural transformation made under the inventive concept of the present application, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A mounting control method characterized by comprising: The application discloses an automatic mounting mechanism, which is arranged on a workbench, wherein the workbench is provided with a feeding station and a mounting station, and the automatic mounting mechanism is used for mounting a to-be-mounted component on the feeding station into a patch slot on a pump source sintering disc on the mounting station. The automatic mounting mechanism comprises: a mounting seat, which is movably arranged on the workbench and can reach the feeding station and the mounting station in a movement stroke; a driving device, which is arranged on the workbench and is connected with the mounting seat to drive the mounting seat to move; a pickup assembly, which is arranged on the mounting seat and comprises a pickup part, which is rotatably arranged on the mounting seat along an axis extending in the up-down direction and is used for picking up the to-be-mounted component on the feeding station to the mounting station; a first camera, which is arranged on the mounting seat and is used for shooting the to-be-mounted component on the feeding station and the position of the patch slot on the pump source sintering disc; and a control device, which is electrically connected with the driving device, the pickup assembly and the first camera. The first camera is arranged on the upper side of the feeding station and the mounting station and is used for shooting from the top to the bottom. The automatic mounting mechanism further comprises a second camera, which is fixedly arranged on the workbench, and the mounting seat can move to the upper side of the second camera in the movement stroke. The second camera is used for shooting from the bottom to the top to determine whether the to-be-mounted component deviates from the geometric center of the pickup part and whether the lower surface of the to-be-mounted component is dirty. The mounting control method comprises the following steps: S10, obtaining a to-be-picked position of the to-be-mounted component; S30, controlling the pickup part to move to the to-be-picked position to pick up the to-be-mounted component; S50, obtaining a target mounting position of the to-be-mounted component; S70, controlling the pickup part to move to the target mounting position to mount the to-be-mounted component on the target mounting position. The to-be-mounted component has opposite front and back surfaces, and the step S10 of obtaining the to-be-picked position of the to-be-mounted component comprises the following steps: S11, obtaining first image information parameters of the front surface of the to-be-mounted component, wherein the first image information parameters comprise first position parameters of the to-be-mounted component; S30, the step of controlling the pickup part to move to the to-be-picked position to pick up the to-be-mounted component comprises the following steps: S31, obtaining second position parameters of the pickup part; S32, calculating first position deviation parameters according to the first position parameters and the second position parameters; S33, controlling the pickup part to move according to the first position deviation parameters so that the position parameters of the pickup part after moving coincide with the first position parameters; S70, the step of controlling the pickup part to move to the target mounting position to mount the to-be-mounted component on the target mounting position further comprises the following steps: driving the to-be-mounted component to move directly above the second camera. S61, acquire second image information parameters of the reverse side of the component to be mounted, wherein the second image information parameters comprise third position parameters of the component to be picked up; S62, acquire fourth position parameters of the pickup part; S63, calculate second position deviation parameters according to the third position parameters and the fourth position parameters; S70, the step of controlling the pickup part to move to the target mounting position to mount the component to be mounted on the target mounting position comprises: S71, acquire target mounting position parameters of the target mounting position; calculate third position deviation parameters according to the fourth position parameters and the target mounting position parameters; S72, determine final position deviation parameters according to the second position deviation parameters and the third position deviation parameters; S73, control the pickup part to move to the target mounting position according to the final position deviation parameters.

2. The mounting control method according to Claim 1, wherein The lower end of the pickup part is provided with a suction nozzle for picking up the component to be mounted. The mounting seat is further provided with a third camera for shooting the suction nozzle.

3. The mounting control method according to Claim 1, wherein The pickup assembly comprises a driving motor fixedly installed on the mounting seat and drivingly connected with the pickup part to rotate the pickup part about an axis extending in the up-down direction.

4. The mounting control method according to Claim 1, wherein The component to be mounted comprises a soldering sheet, the first image information parameters further comprise first dirt information parameters, and the step S31 of acquiring the second position parameters of the pickup part specifically comprises: S311, when the front side of the soldering sheet is not dirty, acquire the second position parameters of the pickup part; S11, after the step of acquiring the first image information parameters of the component to be mounted, further comprising: S301, when the front side of the soldering sheet is dirty, control the pickup part to put the soldering sheet into a waste barrel.

5. The mounting control method according to Claim 1, wherein The component to be mounted comprises a chip, the first image information parameters further comprise chip ID information parameters, and the step S31 of acquiring the second position parameters of the pickup part specifically comprises: S312, when the chip ID information parameters are correctly matched with an MES system, acquire the second position parameters of the pickup part; S11, after the step of acquiring the first image information parameters of the component to be mounted, further comprising: S302, when the chip ID information parameters are incorrectly matched with the MES system, control the automatic mounting mechanism to stop and control an alarm device to issue an alarm prompt.

6. The mounting control method according to Claim 1, wherein The step S50 of acquiring the target mounting position of the component to be mounted comprises: S51, acquire image information of a pump source sintering disc, wherein the image information of the pump source sintering disc comprises a model of the pump source sintering disc; S52, acquire position information of a corresponding patch slot according to the model of the pump source sintering disc, and determine the position information of the corresponding patch slot as the target mounting position.

7. The mounting control method according to Claim 1, wherein The component to be mounted comprises a soldering sheet, the second image information parameters further comprise second dirt information parameters, and the step S62 of acquiring the fourth position parameters of the pickup part specifically comprises: S621, when the reverse side of the soldering sheet is not dirty, acquire the fourth position parameters of the pickup part; S61. After the step of obtaining the second image information parameters of the component to be mounted, the following is further included: S64. When the reverse side of the solder sheet is dirty, control the picking unit to put the solder sheet into the waste bin.

8. The mounting control method according to Claim 1, wherein The component to be mounted includes a chip, and the second image information parameter further includes a second dirt information parameter. Step S62, obtaining the fourth position parameter of the pickup unit, specifically includes: S622. When the reverse side of the chip is free of dirt, obtain the fourth position parameter of the pickup unit; S61. After the step of obtaining the second image information parameters of the component to be mounted, the following is further included: S65. When the back of the chip is dirty, control the pickup unit to put the chip back to the pickup position.

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