Monitoring method, device and storage medium of director in ion implantation process

Abstract

The present application provides a monitoring method, device and storage medium for a director in an ion implantation process; the method comprises: determining a first light intensity of an optical signal emitted by a signal generator within a round trip; determining a second light intensity of an optical signal received by a signal receiver and position information of the signal receiver; determining whether the director is abnormal based on the position information of the signal receiver within the one movement cycle, and / or determining whether the director is abnormal based on the first light intensity and the second light intensity; wherein the signal generator and the signal receiver are respectively located on both sides of the circumference of a wafer, and the round trip is a journey in which the signal receiver, driven by a motor of the orienter, moves from a starting point within a movable range of the signal receiver to an end point and then returns to the starting point.

Description

Technical Field

[0001] The present application relates to semiconductor manufacturing technology, and in particular to a detection method, device and storage medium for a director in an ion implantation process. Background Art

[0002] The orientor is a crucial component in the ion implantation process. The wafer rotates on the orientor, and optical devices measure the wafer's notch angle. The orientor uses this angle as a reference to rotate the wafer to the set angle and transfer the wafer to the base plate (plant) for ion implantation. The orientor determines the angle of ion implantation, a crucial parameter in the ion implantation process, playing a decisive role in the implantation depth and dose.

[0003] The orienter is a moving component that is subject to significant loads. It is prone to deformation due to excessive strain. Deformation can scratch the wafer. Therefore, it is important to promptly detect orienter deformation. Summary of the Invention

[0004] The embodiments of the present application provide a method, device, electronic device, and computer-readable storage medium for detecting a director in an ion implantation process, which can promptly detect whether the director is deformed.

[0005] The technical solution of the embodiment of the present application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a method for detecting a director in an ion implantation process, comprising:

[0007] determining a first light intensity of the optical signal emitted by the signal generator within a round trip;

[0008] determining a second light intensity of an optical signal received by a signal receiver and position information of the signal receiver;

[0009] determining whether the orienter is abnormal based on the position information of the signal receiver within the one movement cycle, and / or determining whether the orienter is abnormal based on the first light intensity and the second light intensity;

[0010] In which, the signal generator and the signal receiver are respectively located on both sides of the wafer circumference, and the round trip is a journey in which the signal receiver, driven by the motor of the orienter, moves from the starting point within the movable range of the signal receiver to the end point and then returns to the starting point.

[0011] In some embodiments, determining whether the direction finder is abnormal based on the position information of the signal receiver within the one movement cycle includes:

[0012] If within the one round trip, the position where the signal receiver initially receives the optical signal twice is the same, the position where the signal receiver receives all the optical signals twice is the same, and the position where the signal receiver reaches the wafer twice is the same, it is determined that there is no abnormality in the orienter.

[0013] In some embodiments, determining whether the direction finder is abnormal based on the position information of the signal receiver within the one movement cycle includes:

[0014] If the position information of the signal receiver does not satisfy at least one of the following, it is determined that the direction finder is abnormal:

[0015] In the one round trip, the position where the signal receiver initially receives the optical signal twice is the same;

[0016] The position where the signal receiver receives all the optical signals twice is the same;

[0017] If the signal receiver reaches the same position on the wafer twice, it is detected that no abnormality occurs to the orienter.

[0018] In some embodiments, determining whether the director is abnormal based on the first light intensity and the second light intensity includes:

[0019] If the signal receiver is located at the uppermost position of the wafer under the drive of the motor, and the second light intensity received by the signal receiver is equal to the first light intensity, it is determined that no abnormality occurs to the orienter.

[0020] In some embodiments, determining whether the director is abnormal based on the first light intensity and the second light intensity includes:

[0021] If, when the signal receiver is driven by the motor and is located at a first position at the uppermost end of the wafer, a second light intensity received by the signal receiver is less than the first light intensity, determining the distance between the wafer and the hardware closest to the wafer in the orienter based on the second position of the signal receiver when the second light intensity is equal to the first light intensity;

[0022] If the distance is less than a first distance threshold, determining that an abnormality occurs in the orienter;

[0023] If the distance is greater than or equal to a first distance threshold, it is determined whether an abnormality occurs in the orienter based on the first position and the second position.

[0024] In some embodiments, determining whether an abnormality occurs in the orienter based on the first position and the second position includes:

[0025] If the difference between the second position and the first position is less than or equal to the second distance threshold, then determine

[0026] There was no abnormality in the direction finder;

[0027] If the distance is greater than a second distance threshold, it is determined that an abnormality has occurred in the direction finder.

[0028] In a second aspect, an embodiment of the present application provides a device for detecting a director in an ion implantation process, the device comprising:

[0029] The light intensity determination module is used to determine the first intensity of the light signal emitted by the signal generator within a round trip.

[0030] Light intensity;

[0031] 5. A position determination module, configured to determine a second light intensity of an optical signal received by a signal receiver and position information of the signal receiver;

[0032] A processing module is configured to determine whether the orienter is abnormal based on the position information of the signal receiver within the one movement cycle, and / or determine whether the orienter is abnormal based on the first light intensity and the second light intensity.

[0033] Is it abnormal?

[0034] 0Wherein, the signal generator and the signal receiver are respectively located on both sides of the wafer circumference,

[0035] A round trip is a trip in which the signal receiver, driven by the motor of the orienter, moves from a starting point within the movable range of the signal receiver to an end point and then returns to the starting point.

[0036] In some embodiments, the processing module is used to:

[0037] The position where the signal receiver initially receives the optical signal twice is the same, the position where the signal receiver receives the entire optical signal twice is the same, and the position where the signal receiver arrives at the wafer twice is the same,

[0038] It is determined that no abnormality occurs in the orienter.

[0039] In some embodiments, the processing module is configured to determine that an abnormality has occurred in the direction finder if the position information of the signal receiver does not satisfy at least one of the following:

[0040] In the one round trip, the position where the signal receiver initially receives the optical signal twice is the same;

[0041] The position where the signal receiver receives all the optical signals twice is the same;

[0042] If the signal receiver reaches the same position on the wafer twice, it is detected that no abnormality occurs to the orienter.

[0043] In some embodiments, the processing module is used to determine that there is no abnormality in the orienter if the second light intensity received by the signal receiver is equal to the first light intensity when the signal receiver is located at the uppermost position of the wafer under the drive of the motor.

[0044] In some embodiments, the processing module is configured to determine, if the signal receiver is located at a first position at the uppermost end of the wafer under the drive of the motor and a second light intensity received by the signal receiver is less than the first light intensity, the distance between the wafer and the hardware in the orienter closest to the wafer based on the second position of the signal receiver when the second light intensity is equal to the first light intensity;

[0045] If the distance is less than a first distance threshold, determining that an abnormality occurs in the orienter;

[0046] If the distance is greater than or equal to a first distance threshold, it is determined whether an abnormality occurs in the orienter based on the first position and the second position.

[0047] In some embodiments, the processing module is configured to determine that no abnormality has occurred in the orienter if the difference between the second position and the first position is less than or equal to a second distance threshold;

[0048] If the distance is greater than a second distance threshold, it is determined that an abnormality occurs in the orienter.

[0049] In a third aspect, an embodiment of the present application provides an electronic device, comprising:

[0050] processor, memory, and bus;

[0051] The memory stores executable instructions;

[0052] The processor communicates with the memory via the bus, and the above method is implemented when the processor executes the executable instructions stored in the memory.

[0053] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium storing executable instructions for implementing the method provided in the embodiment of the present application when executed by a processor.

[0054] In a fifth aspect, an embodiment of the present application provides a computer program product, characterized in that the computer program product includes a computer program / instructions, and the computer program / instructions implement the above method when executed by a processor.

[0055] The method provided by an embodiment of the present application includes: determining a first light intensity of an optical signal emitted by a signal generator within a round trip; determining a second light intensity of an optical signal received by a signal receiver and the position information of the signal receiver; determining whether the orienter is abnormal based on the position information of the signal receiver within the one movement cycle, and / or determining whether the orienter is abnormal based on the first light intensity and the second light intensity; wherein the signal generator and the signal receiver are respectively located on both sides of the circumference of the wafer, and the one round trip is a journey in which the signal receiver, driven by the orienter's motor, moves from a starting point within the movable range of the signal receiver to an end point and then returns to the starting point. In this way, by using the position information of the signal receiver within a movement cycle, it is possible to timely detect whether the orienter is abnormal; by using the relationship between the first light intensity emitted by the signal generator and the second light intensity received by the signal receiver, it is possible to timely detect whether the orienter is abnormal. Moreover, since the signal receiver is a light-sensing element, the measurement accuracy is high, the stability is strong, and the measurement is convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 This is a schematic diagram of wafer inspection provided by an embodiment of the present application;

[0057] Figure 2 Schematic diagram of the concave corner of the wafer provided in an embodiment of the present application;

[0058] Figure 3 Schematic diagram of wafer concave angle deviation provided by an embodiment of the present application;

[0059] Figure 4 is a schematic diagram of the deformation of the main shaft of the orienter provided in an embodiment of the present application;

[0060] Figure 5 This is a schematic diagram of an optional processing flow of a method for detecting a director in an ion implantation process provided by an embodiment of the present application;

[0061] Figure 6 Schematic diagram of the positions of the signal generator and the signal receiver provided in the embodiment of the present application;

[0062] Figure 7 is a motion diagram of a signal receiver provided in an embodiment of the present application;

[0063] Figure 8 This is a schematic diagram of the position of the signal receiver and the received light intensity provided in an embodiment of the present application;

[0064] Figure 9 is a schematic diagram of changes in signal strength received by a signal receiver provided in an embodiment of the present application;

[0065] Figure 10 This is another optional processing flow diagram of a method for detecting a director in an ion implantation process improved by an embodiment of the present application;

[0066] Figure 11 This is a schematic diagram of the structure of a detection device for a director in an ion implantation process provided by an embodiment of the present application;

[0067] Figure 12 It is a structural diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0068] In order to make the purpose, technical solutions and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limiting this application. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0069] In the following description, reference is made to “some embodiments”, which describes a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0070] In the following description, the terms "first\second" involved are merely used to distinguish similar objects and do not represent a specific ordering of the objects. It is understandable that "first\second" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.

[0071] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.

[0072] It should be understood that in the various embodiments of the present application, the size of the serial number of each implementation process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0073] Before further explaining the embodiments of the present application, a brief description of the wafer inspection process is given. Figure 1As shown, the wafer rotates on the base of the director, the LED lamp emits light from bottom to top, the photosensitive device receives the light emitted by the LED, and finds the concave corner of the wafer. The schematic diagram of the concave corner of the wafer is as shown in Figure 2 If the main axis of the orienter is deformed, the wafer will be centrifugal when it rotates, and the position of the wafer concave angle will also deviate. The schematic diagram of the wafer concave angle deviation is shown in Figure 3 If the main axis of the orienter is deformed, it may also scratch the surface of the wafer. Figure 4 As shown, the deformation of the main shaft may refer to the main shaft being bent.

[0074] An optional processing flow diagram of a method for detecting a director in an ion implantation process provided by an embodiment of the present application is as follows: Figure 5 As shown, at least the following steps are included:

[0075] Step S101 , determining a first light intensity of an optical signal emitted by a signal generator within a round trip.

[0076] In the embodiment of the present application, a signal generator and a signal receiver are provided, and the positions of the signal generator and the signal receiver are as follows: Figure 6 As shown, the signal generator and the signal receiver are located on either side of the wafer circumference. The signal generator can be a light-emitting diode, and the intensity of the optical signal emitted by the signal generator can be between 50 lumens and 500 lumens. The signal receiver can be a photoresistor array or a phototransistor array. In this embodiment of the present application, to prevent loss of the optical signal emitted by the signal generator, light shields can be placed at certain locations to enable the signal receiver to receive the entire optical signal.

[0077] In some embodiments, a round trip refers to a trip in which the signal receiver, driven by the motor of the orienter, moves from a starting point within the movable range of the signal receiver to an end point and then returns to the starting point.

[0078] Step S102: Determine a second light intensity of an optical signal received by a signal receiver and position information of the signal receiver.

[0079] In some embodiments, the position information of the signal receiver can be determined using a decoder in the direction finder.

[0080] In some embodiments, the motion diagram of the signal receiver, such as Figure 7 As shown in the figure, the signal receiver moves up and down driven by the motor. The position of the signal receiver is different, and the intensity of the received light signal is different. A schematic diagram of the position of the signal receiver and the received light intensity, as shown in the figure Figure 8As shown, the starting point P0 within the signal receiver's movable range is located at the top of the wafer. At P0, the signal receiver cannot receive any light signals. Driven by the motor, the signal receiver moves downward until it reaches the end of its movable range, position P5. The motor then drives the signal receiver upward until it returns to its starting point, position P0.

[0081] In a moving cycle, the signal strength received by the signal receiver changes as follows: Figure 9 As shown, position P1 is the position where the signal receiver begins to receive the light signal, and position P2 is the position where the intensity of the light signal received by the signal receiver is the same as the intensity of the light signal emitted by the signal generator. Position P3 is the position where the signal receiver reaches the wafer. Position P4 is the position where the signal receiver receives no light signal at all. Position P5 is the lowest position of the signal receiver, and the signal receiver begins to move in the opposite direction at position P5. Among them, position P1 and position P11 are the same position, position P2 and position P12 are the same position, position P3 and position P13 are the same position, and position P4 and position P14 are the same position. Position P3 is the topmost position of the wafer. After the signal receiver reaches position P3, the wafer begins to rotate, and the wafer rotation speed can be between 30r / min and 90r / min.

[0082] Step S103: determining whether the orienter is abnormal based on the position information of the signal receiver within the one movement cycle, and / or determining whether the orienter is abnormal based on the first light intensity and the second light intensity.

[0083] In some embodiments, the specific implementation process of determining whether the orienter is abnormal based on the position information of the signal receiver within the one movement cycle may include: if within the one round trip, the positions at which the signal receiver initially receives the optical signal are the same twice, the positions at which the signal receiver receives all optical signals are the same twice, and the positions at which the signal receiver arrives at the wafer are the same twice, then the orienter is determined to be normal. In this embodiment of the present application, if position P1 and position P11 are at the same location, position P2 and position P12 are at the same location, position P3 and position P13 are at the same location, position P4 and position P14 are at the same location, and the distance between position P2 and position P1 is the same as the distance between position P3 and position P4, then the orienter is determined to be normal. If any of the above equivalence relationships is not satisfied, then the orienter is determined to be abnormal. That is, if any of the following three conditions is not satisfied: the positions at which the signal receiver initially receives the optical signal are the same twice, the positions at which the signal receiver receives all optical signals are the same twice, and the positions at which the signal receiver arrives at the wafer are the same twice, then the orienter is determined to be normal.

[0084] In some embodiments, the specific implementation process of determining whether the orienter is abnormal based on the first light intensity and the second light intensity may include: if the signal receiver is located at the uppermost position of the wafer under the drive of the motor, the second light intensity received by the signal receiver is equal to the first light intensity, then it is determined that the wafer is horizontal when the orienter rotates, and the wafer does not shake in the up and down directions, and it can also be determined that the orienter is not abnormal. The embodiment of the present application can detect whether the wafer is horizontal when the orienter rotates, filling the gap in the industry that the wafer cannot be detected horizontally when the orienter rotates. In addition, the method for detecting the orienter in the embodiment of the present application can be applied to wafers of any thickness.

[0085] If the signal receiver is driven by the motor and is located at the first position at the top end of the wafer, and the second light intensity received by the signal receiver is less than the first light intensity, then the orienter may or may not be abnormal. Specifically, when the signal receiver is located at the first position, if the orienter is not abnormal, the wafer will not hinder the signal receiver from receiving the light signal. In this scenario, the second position of the signal receiver when the first light intensity is equal to the second light intensity can be further determined, and the distance between the wafer and the hardware closest to the wafer in the orienter can be determined based on the second position; if the distance is less than the first distance threshold, it is determined that the orienter is abnormal; specifically, the first distance threshold is a pre-set value, such as the first distance threshold is set to 5mm. The distance between the wafer and the hardware closest to the wafer in the orienter determined based on the second position can refer to the distance between the wafer and the hardware closest to the wafer when the signal receiver is located at the second position.

[0086] If the distance between the wafer and the hardware closest to the wafer is greater than or equal to a first distance threshold, a determination is made as to whether an orienter anomaly has occurred based on the first and second positions. Specifically, if the difference between the second position and the first position is less than or equal to the second distance threshold, the orienter is determined to be normal; if the distance is greater than the second distance threshold, the orienter is determined to be anomaly. The second distance threshold is a pre-set value, such as 1 mm.

[0087] In the embodiment of the present application, another optional processing flow diagram of the detection method of the director in the ion implantation process is as follows: Figure 10 As shown,

[0088] Step S201: During a movement cycle, the direction finder is detected based on the position information of the signal receiver to see if there is any abnormality. If the direction finder is detected to be abnormal, an alarm is issued. If the direction finder is detected to be normal, step S202 is executed.

[0089] In some embodiments, the description of the movement period and the process of detecting whether an abnormality occurs in the orienter according to the position information of the signal receiver are the same as the above steps S101 and S103 and are not repeated here.

[0090] In step S202, the orienter rotates until the signal receiver reaches a first position at the top of the wafer. If, at this first position, the second light intensity received by the signal receiver equals the first light intensity emitted by the signal generator, the rotator is detected to be normal. If the second light intensity received by the signal receiver is less than the first light intensity emitted by the signal generator, step S203 is executed.

[0091] When the signal receiver is located at the first position, if there is no abnormality in the director, the wafer will not prevent the signal receiver from receiving the optical signal.

[0092] Step S203: Determine a second position of the signal receiver when the second light intensity is equal to the first light intensity.

[0093] In step S204, when the signal receiver is in the second position, the distance between the wafer and the hardware closest to the wafer is determined. If the distance is less than a first distance threshold, the orienter is determined to be abnormal. If the distance is greater than or equal to the first distance threshold, step S205 is executed.

[0094] Step S205: Determine whether the orienter has an abnormality based on the distance difference between the first position and the second position. If the distance difference between the first position and the second position is less than or equal to a second distance threshold, the orienter is determined to be normal. If the distance difference between the first position and the second position is greater than the second distance threshold, the orienter is determined to have an abnormality.

[0095] A schematic diagram of the structure of a detection device for a director in an ion implantation process provided in an embodiment of the present application is shown in FIG. Figure 11 Shown, including:

[0096] The light intensity determination module 401 is used to determine a first light intensity of the light signal emitted by the signal generator within a round trip;

[0097] A position determination module 402 is configured to determine a second light intensity of an optical signal received by a signal receiver and position information of the signal receiver;

[0098] a processing module 403, configured to determine whether the orientator is abnormal based on the position information of the signal receiver within the one movement cycle, and / or determine whether the orientator is abnormal based on the first light intensity and the second light intensity;

[0099] In which, the signal generator and the signal receiver are respectively located on both sides of the wafer circumference, and the round trip is a journey in which the signal receiver, driven by the motor of the orienter, moves from the starting point within the movable range of the signal receiver to the end point and then returns to the starting point.

[0100] In some embodiments, the processing module 403 is used to determine that there is no abnormality in the orienter if, within the round trip, the position where the signal receiver initially receives the optical signal twice is the same, the position where the signal receiver receives all the optical signals twice is the same, and the position where the signal receiver arrives at the wafer twice is the same.

[0101] In some embodiments, the processing module 403 is configured to determine that an abnormality has occurred in the direction finder if the position information of the signal receiver does not satisfy at least one of the following:

[0102] In the one round trip, the position where the signal receiver initially receives the optical signal twice is the same;

[0103] The position where the signal receiver receives all the optical signals twice is the same;

[0104] If the signal receiver reaches the same position on the wafer twice, it is detected that no abnormality occurs to the orienter.

[0105] In some embodiments, the processing module 403 is used to determine that there is no abnormality in the orienter if the second light intensity received by the signal receiver is equal to the first light intensity when the signal receiver is located at the uppermost position of the wafer under the drive of the motor.

[0106] In some embodiments, the processing module 403 is configured to determine, if the signal receiver is located at a first position at the uppermost end of the wafer under the drive of the motor and a second light intensity received by the signal receiver is less than the first light intensity, the distance between the wafer and the hardware in the orienter closest to the wafer based on the second position of the signal receiver when the second light intensity is equal to the first light intensity;

[0107] If the distance is less than a first distance threshold, determining that an abnormality occurs in the orienter;

[0108] If the distance is greater than or equal to a first distance threshold, it is determined whether an abnormality occurs in the orienter based on the first position and the second position.

[0109] In some embodiments, the processing module 403 is configured to determine that no abnormality occurs in the orienter if the difference between the second position and the first position is less than or equal to a second distance threshold;

[0110] If the distance is greater than a second distance threshold, it is determined that an abnormality occurs in the orienter.

[0111] According to an embodiment of the present application, the present application also provides an electronic device, a readable storage medium and a computer program product.

[0112] Figure 12 A schematic block diagram of an example electronic device 800 that can be used to implement an embodiment of the present application is shown. In some optional embodiments, the electronic device 800 can be a terminal device or a server. In some optional embodiments, the electronic device 800 can implement the detection method of the director in the ion implantation process provided by the embodiment of the present application by running a computer program. For example, the computer program can be a native program or software module in the operating system; it can be a local (Native) application (Application, APP), that is, a program that needs to be installed in the operating system to run; it can also be a small program, that is, a program that can be run only by downloading it to a browser environment; it can also be a small program that can be embedded in any APP. In short, the above-mentioned computer program can be an application, module or plug-in in any form.

[0113] In actual applications, the electronic device 800 can be an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms. Cloud technology refers to a hosting technology that unifies a series of resources such as hardware, software, and networks within a wide area network or local area network to achieve data computing, storage, processing, and sharing. The electronic device 800 can be a smartphone, tablet computer, laptop computer, desktop computer, smart speaker, smart TV, smart watch, etc., but is not limited to these.

[0114] Electronic device is intended to refer to various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. Electronic device can also refer to various forms of mobile devices, such as personal digital assistants, cellular phones, smart phones, wearable devices, vehicle-mounted terminals, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or claimed herein.

[0115] like Figure 12As shown, the electronic device 800 includes a computing unit 801, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage unit 808 into a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of the electronic device 800 can also be stored. The computing unit 801, the ROM 802, and the RAM 803 are connected to each other via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0116] Multiple components in the electronic device 800 are connected to the I / O interface 805, including an input unit 806, such as a keyboard, a mouse, etc.; an output unit 807, such as various types of displays, speakers, etc.; a storage unit 808, such as a magnetic disk, an optical disk, etc.; and a communication unit 809, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 809 allows the electronic device 800 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0117] The computing unit 801 can be various general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units that run machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 801 performs the various methods and processes described above, such as a detection method for a director in an ion implantation process. For example, in some optional embodiments, the detection method for a director in an ion implantation process can be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 808. In some optional embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 800 via ROM 802 and / or communication unit 809. When the computer program is loaded into RAM 803 and executed by the computing unit 801, one or more steps of the detection method for a director in an ion implantation process described above can be performed. Alternatively, in other embodiments, the calculation unit 801 may be configured as a method for detecting a director in an ion implantation process in any other appropriate manner (for example, by means of firmware).

[0118] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0119] The program code for implementing the method for detecting a director in an ion implantation process disclosed herein can be written in any combination of one or more programming languages. The program code can be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the program code is executed by the processor or controller, the functions / operations specified in the flow chart and / or block diagram are implemented. The program code can be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0120] In the context of the present disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium can include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0121] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0122] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), and the Internet.

[0123] A computer system may include a client and a server. The client and server are generally remote from each other and typically interact through a communication network. The client-server relationship arises through computer programs running on the respective computers and having a client-server relationship with each other. The server may be a cloud server, a server in a distributed system, or a server integrated with a blockchain.

[0124] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved. This is not a limitation herein.

[0125] An embodiment of the present application provides a computer-readable storage medium storing executable instructions, wherein the executable instructions are stored. When the executable instructions are executed by a processor, the processor will execute the method for detecting a director in an ion implantation process provided in the embodiment of the present application.

[0126] In some embodiments, the computer-readable storage medium may be a memory such as FRAM, ROM, PROM, EPROM, EEPROM, flash memory, magnetic surface memory, optical disk, or CD-ROM; or various devices including one or any combination of the above memories.

[0127] In some embodiments, executable instructions may be in the form of a program, software, software module, script, or code, written in any form of programming language (including compiled or interpreted languages, or declarative or procedural languages), and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or other unit suitable for use in a computing environment.

[0128] By way of example, executable instructions may be deployed to be executed on one computing device, or on multiple computing devices at one site, or on multiple computing devices distributed across multiple sites and interconnected by a communication network.

[0129] An embodiment of the present application provides a computer program product, which includes a computer program / instructions. When the computer program / instructions are executed by a processor, the instruction dispatching method described in the present application is implemented.

[0130] The above are merely examples of the present application and are not intended to limit the scope of protection of the present application. Any modifications, equivalent replacements, and improvements made within the spirit and scope of the present application are included in the scope of protection of the present application.

Claims

1. A method for detecting a director in an ion implantation process, characterized in that: The method comprises: determining a first light intensity of the optical signal emitted by the signal generator within a round trip; determining a second light intensity of an optical signal received by a signal receiver and position information of the signal receiver; determining whether the orienter is abnormal based on position information of the signal receiver within a movement cycle, and / or determining whether the orienter is abnormal based on the first light intensity and the second light intensity; The signal generator and the signal receiver are respectively located on both sides of the wafer circumference, and the round trip is a trip in which the signal receiver, driven by the motor of the orienter, moves from a starting point within the movable range of the signal receiver to an end point and then returns to the starting point. Determining whether the direction finder is abnormal based on the position information of the signal receiver within a movement cycle includes: If, within the one round trip, the positions at which the signal receiver initially receives the optical signal twice are the same, the positions at which the signal receiver receives all optical signals twice are the same, and the positions at which the signal receiver reaches the wafer twice are the same, then it is determined that no abnormality occurs in the orienter; Determining whether the director is abnormal based on the first light intensity and the second light intensity includes: If the signal receiver is located at the uppermost position of the wafer under the drive of the motor, and the second light intensity received by the signal receiver is equal to the first light intensity, it is determined that no abnormality occurs to the orienter.

2. The method according to claim 1, characterized in that The determining whether the orienter is abnormal based on the position information of the signal receiver within the one movement cycle includes: During the round trip, if the position information of the signal receiver does not satisfy at least one of the following, it is determined that an abnormality occurs in the direction finder: The position where the signal receiver initially receives the optical signal twice is the same; The position where the signal receiver receives all the optical signals twice is the same; The signal receiver arrives at the same position on the wafer twice.

3. The method according to claim 1, characterized in that The determining whether the director is abnormal based on the first light intensity and the second light intensity includes: If, when the signal receiver is driven by the motor and is located at a first position at the uppermost end of the wafer, a second light intensity received by the signal receiver is less than the first light intensity, determining the distance between the wafer and the hardware closest to the wafer in the orienter based on the second position of the signal receiver when the second light intensity is equal to the first light intensity; If the distance is less than a first distance threshold, determining that an abnormality occurs in the orienter; If the distance is greater than or equal to a first distance threshold, it is determined whether an abnormality occurs in the orienter based on the first position and the second position.

4. The method according to claim 3, characterized in that The determining whether an abnormality occurs in the orienter based on the first position and the second position includes: If the difference between the second position and the first position is less than or equal to a second distance threshold, it is determined that no abnormality occurs in the orienter; If the distance is greater than a second distance threshold, it is determined that an abnormality occurs in the orienter.

5. A detection device for a director in an ion implantation process, characterized in that: The device includes: a light intensity determination module for determining a first light intensity of a light signal emitted by a signal generator within a round trip; a position determination module, configured to determine a second light intensity of an optical signal received by a signal receiver and position information of the signal receiver; a processing module, configured to determine whether the orienter is abnormal based on position information of the signal receiver within a movement cycle, and / or determine whether the orienter is abnormal based on the first light intensity and the second light intensity; The signal generator and the signal receiver are respectively located on both sides of the wafer circumference, and the round trip is a trip in which the signal receiver, driven by the motor of the orienter, moves from a starting point within the movable range of the signal receiver to an end point and then returns to the starting point. The processing module is configured to determine that no abnormality occurs in the orienter if, within the one round trip, the positions at which the signal receiver initially receives the optical signal twice are the same, the positions at which the signal receiver receives all optical signals twice are the same, and the positions at which the signal receiver reaches the wafer twice are the same; The processing module is used to determine that no abnormality occurs in the orienter if the second light intensity received by the signal receiver is equal to the first light intensity when the signal receiver is located at the uppermost position of the wafer under the drive of the motor.

6. The device according to claim 5, characterized in that The processing module is configured to determine that an abnormality has occurred in the direction finder if the position information of the signal receiver does not satisfy at least one of the following during the round trip: The position where the signal receiver initially receives the optical signal twice is the same; The position where the signal receiver receives all the optical signals twice is the same; The signal receiver arrives at the same position on the wafer twice.

7. The device according to claim 5, characterized in that the processing module being configured to determine, if the signal receiver is located at a first position at the uppermost end of the wafer under the drive of the motor and a second light intensity received by the signal receiver is less than the first light intensity, the distance between the wafer and the hardware in the orienter closest to the wafer based on the second position of the signal receiver when the second light intensity is equal to the first light intensity; If the distance is less than a first distance threshold, determining that an abnormality occurs in the orienter; If the distance is greater than or equal to a first distance threshold, it is determined whether an abnormality occurs in the orienter based on the first position and the second position.

8. The device according to claim 7, characterized in that The processing module is configured to determine that no abnormality occurs in the orienter if the difference between the second position and the first position is less than or equal to a second distance threshold; If the distance is greater than a second distance threshold, it is determined that an abnormality occurs in the orienter.

9. An electronic device, characterized in that: The electronic device includes at least one processor; and a memory in communication with the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 4.

10. A computer-readable storage medium, characterized in that Executable instructions are stored, and when executed by a processor, they are used to implement the method described in any one of claims 1 to 4.

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