An ultraviolet laser wafer cutting machine control method and system

Abstract

This application relates to the field of wafer cutting, and particularly to a control method and system for an ultraviolet laser wafer cutting machine, comprising the following steps: controlling the acquisition camera to move to a specified position; obtaining wafer image information corresponding to the uncut wafer raw material; determining Mark position information based on the wafer image information; determining target wafer position information based on the Mark position information, wherein there are multiple pieces of target wafer position information; obtaining corresponding target area position information on the wafer image information based on the target wafer position information, wherein the number of target area position information is the same as that of the target wafer position information; controlling the galvanometer to move to the wafer position corresponding to the target area position information for processing. This application has the effect of improving the processing accuracy of wafer cutting.

Description

Technical Field

[0001] The present application relates to the field of wafer cutting, and in particular, to a control method and system for an ultraviolet laser wafer cutting machine. Background Art

[0002] With the rapid development of the optoelectronic industry, the demand for high-integration and high-performance semiconductor wafers is increasing. Wafer cutting technology has an important impact on improving the yield and packaging efficiency.

[0003] Traditional wafer cutting technologies are mainly diamond cutting method and chemical etching method. The new laser cutting method integrates optics, precision instruments, and computer technology. Compared with the traditional methods, laser cutting has the advantages of high processing speed, narrow cutting groove, and high automation degree. In order to improve the processing accuracy and speed, the galvanometer scanning cutting method is generally adopted. Since the processing area of the galvanometer is limited, and the combined accuracy of the stitching algorithm is lower than that of pure galvanometer scanning cutting, the accuracy of the linear motor module will affect the overall processing accuracy. This situation needs to be further improved. Summary of the Invention

[0004] In order to improve the processing accuracy of wafer cutting, the present application provides a control method and system for an ultraviolet laser wafer cutting machine.

[0005] In a first aspect, a control method for an ultraviolet laser wafer cutting machine provided by the present application adopts the following technical solution: A control method for an ultraviolet laser wafer cutting machine includes the following steps: controlling an acquisition camera to move to a specified position; obtaining wafer image information corresponding to an uncut wafer raw material; determining Mark position information based on the wafer image information; determining target wafer position information based on the Mark position information, where there are multiple pieces of target wafer position information; obtaining corresponding target area position information on the wafer image information based on the target wafer position information, where the number of target area position information is the same as that of the target wafer position information; controlling the galvanometer to move to the wafer position corresponding to the target area position information for processing.

[0006] By adopting the above technical solution, when it is necessary to cut the wafer raw material, after the wafer raw material is placed in the cutting equipment, the system can collect the wafer image information corresponding to the wafer raw material by controlling the acquisition camera. The acquisition camera mentioned in this application selects a CCD camera used in industry, and other high-precision cameras are also acceptable; then the system determines the Mark position information through the wafer image information, and through the position of the Mark point, the position of the target wafer to be cut can be determined. Generally speaking, there are multiple target wafers on the wafer raw material, so there are multiple target wafer positions, and then the system can determine the target area information on the wafer image information. Each target area information corresponds to a target wafer to be cut. Subsequently, the system can control the galvanometer to move. It should be noted here that the system controls the cutting equipment to cut the wafer, and the high-precision galvanometer and CCD camera can magnify the target area on the wafer image during the cutting process, thereby improving the processing accuracy when cutting the wafer.

[0007] Optionally, in the process of determining the Mark position information based on the wafer image information, the following steps are also performed: determining the Mark position information multiple times; determining a set of Mark position information, where the set of Mark position information has multiple Mark position information.

[0008] By adopting the above technical solution, by determining several more Mark point positions on the wafer image before cutting, when determining the position corresponding to the target wafer through the positions of several Mark points, the accuracy of the position of the target wafer can be improved.

[0009] Optionally, in the process of controlling the galvanometer to move to the wafer position corresponding to the target area position information for processing, the following steps are performed: controlling the galvanometer to move to the wafer position corresponding to each target area position one by one; obtaining the wafer data that has been processed individually; retrieving the area quantity threshold corresponding to the target area position information of the wafer, where the area quantity threshold is obtained when determining the target wafer position information; comparing the wafer data with the area quantity threshold; if the wafer data is equal to the area quantity threshold, then control the galvanometer to reset.

[0010] By adopting the above technical solution, since the number of target wafers on the wafer raw material is limited, when determining the position corresponding to the target wafer through the position of the Mark point, the number of target wafer positions has been determined, that is, the number of positions to be cut has been determined. During the process of magnifying the wafer image by the galvanometer for cutting, when the target wafer is cut, the equipment can be controlled to stop cutting immediately.

[0011] Optionally, during the process of controlling the galvanometer to process at the corresponding wafer position, the following steps are also carried out: obtaining the target trajectory information of the wafer corresponding to the information of the cutting target area of the galvanometer; obtaining the cut movement trajectory information of the corresponding cut in real time; comparing the cut movement trajectory information with the target trajectory information; if the cut movement trajectory information is the same as the target trajectory information, then control the cutting to be completed.

[0012] By adopting the above technical solution, during the process of the device cutting the target wafer, by matching the trajectory that the device has already cut with the target trajectory information in real time, the probability of cutting errors can be reduced during the cutting process.

[0013] Optionally, when the cut movement trajectory information is the same as the target trajectory information, the following steps are also carried out: controlling the galvanometer to continue to move along the target trajectory information and continue cutting; retrieving the galvanometer movement speed information; determining the target movement duration information based on the target trajectory information and the galvanometer movement speed information; obtaining the movement duration information based on the start of the galvanometer movement; judging whether the movement duration information is greater than the target movement duration information; if so, then control the galvanometer to stop moving.

[0014] By adopting the above technical solution, during the cutting process of the device, the movement speed of the galvanometer is constant. After setting the movement duration of the galvanometer according to the target trajectory information, it can be accurately judged whether the galvanometer has completed cutting through the movement duration information.

[0015] Optionally, during the process of judging whether the movement duration information is greater than the target movement duration information, the following steps are carried out: retrieving the overcut threshold information preset for the wafer overcut; obtaining the corresponding overcut time threshold based on the overcut threshold data and the galvanometer movement speed information; determining the overcut duration information based on the movement duration information and the target movement duration information; if the overcut duration information is equal to the overcut time threshold, then control the galvanometer to stop moving.

[0016] By adopting the above technical solution, during the process of cutting with the aid of the magnification effect of the galvanometer, after cutting along the line corresponding to the target trajectory information is completed, it is necessary to ensure that the device overcuts a certain distance to ensure the continuity of the wafer cutting. In the solution of this application, it is controlled by the cut time threshold, so that the distance that the device can overcut during cutting can be controlled.

[0017] In a second aspect, a control system for an ultraviolet laser wafer cutting machine provided by this application adopts the following technical solution: a control system for an ultraviolet laser wafer cutting machine, including:

[0018] A camera control module, used to control the acquisition camera to move to a specified position;

[0019] A wafer image acquisition module for acquiring wafer image information corresponding to an uncut wafer raw material;

[0020] A Mark position determination module for determining Mark position information based on the wafer image information;

[0021] A target wafer position determination module for determining target wafer position information based on the Mark position information, where there are multiple pieces of target wafer position information;

[0022] A target area position acquisition module for acquiring target area position information corresponding to the wafer image information based on the target wafer position information, where the number of pieces of target area position information is the same as that of the target wafer position information;

[0023] A galvanometer movement control module for controlling the galvanometer to move to the wafer position corresponding to the target area position information for processing.

[0024] By adopting the above technical solution, when the wafer raw material needs to be cut, after the wafer raw material is placed in the cutting equipment, the camera control module controls the movement of the acquisition camera, and the wafer image acquisition module can acquire the wafer image information corresponding to the wafer raw material. The acquisition camera mentioned in this application selects a CCD camera used in industry, and other high-precision cameras are also acceptable; then the target wafer position determination module determines the Mark position information through the wafer image information, and through the position of the Mark point, the target wafer position to be cut can be determined. Generally, there are multiple target wafers on the wafer raw material, so there are multiple target wafer positions. Then the target area position acquisition module can determine the target area information on the wafer image information, and each piece of target area information corresponds to a target wafer to be cut. Subsequently, the galvanometer movement control module can control the movement of the galvanometer. It should be noted here that the system controls the cutting equipment to cut the wafer, and the high-precision galvanometer and CCD camera can magnify the target area on the wafer image during the cutting process, thereby improving the processing accuracy when cutting the wafer.

[0025] In a third aspect, a computer-readable storage medium provided by this application stores a computer program that can be loaded and executed by a processor, such as any one of the methods in a method for controlling an ultraviolet laser wafer cutting machine.

[0026] In a fourth aspect, an intelligent terminal provided by this application includes a memory and a processor, and a computer program that can be loaded and executed by the processor, such as any one of the methods in a method for controlling an ultraviolet laser wafer cutting machine, is stored on the memory.

[0027] In summary, this application includes at least one of the following beneficial technical effects:

[0028] 1. When the wafer raw material needs to be cut, after the wafer raw material is placed in the cutting equipment, the system can collect the wafer image information corresponding to the wafer raw material by controlling the acquisition camera. The acquisition camera mentioned in this application is a CCD camera used in industry, and other high-precision cameras are also acceptable. Then the system determines the Mark position information through the wafer image information. Through the position of the Mark point, the position of the target wafer to be cut can be determined. Generally, there are multiple target wafers on the wafer raw material, so there are multiple target wafer positions. Then the system can determine the target area information on the wafer image information. Each target area information corresponds to a target wafer to be cut. Subsequently, the system can control the galvanometer to move. It should be noted here that the system controls the cutting equipment to cut the wafer, and the high-precision galvanometer and CCD camera can magnify the target area on the wafer image during the cutting process, thereby improving the processing accuracy when cutting the wafer.

[0029] 2. By determining the positions of multiple Mark points, the accuracy of the target wafer position can be improved; by matching the cutting trajectory that the equipment has already performed with the target trajectory information in real time, the probability of cutting errors can be reduced during the cutting process; by setting the moving duration, it can be accurately determined whether the galvanometer has completed cutting through the moving duration information. Description of the Drawings

[0030] Figure 1 is the main flowchart of a control method for an ultraviolet laser wafer cutting machine according to an embodiment of the present application;

[0031] Figure 2 is the flowchart for detecting whether the target wafer is cut completely in a control method for an ultraviolet laser wafer cutting machine according to an embodiment of the present application;

[0032] Figure 3 is the flowchart for reducing the error of cutting the target wafer in a control method for an ultraviolet laser wafer cutting machine according to an embodiment of the present application;

[0033] Figure 4 is the flowchart for controlling the over-cutting of the equipment in a control method for an ultraviolet laser wafer cutting machine according to an embodiment of the present application;

[0034] Figure 5 is the flowchart for controlling the stop of over-cutting of the equipment in a control method for an ultraviolet laser wafer cutting machine according to an embodiment of the present application;

[0035] Figure 6 is the structural block diagram of a control system for an ultraviolet laser wafer cutting machine according to an embodiment of the present application. Detailed Embodiments

[0036] The terms used in the following embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification of the present application, the singular forms "a", "an", "the", "above-mentioned", "said", and "this" are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used in the present application refers to any or all possible combinations including one or more of the listed items.

[0037] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and should not be construed as implying or suggesting relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0038] The following is a further detailed description of the present application.

[0039] In a first aspect, an embodiment of the present application discloses a control method for an ultraviolet laser wafer cutting machine. Referring to Figure 1 , the method includes the following steps:

[0040] S1, controlling the acquisition camera to move to a specified position;

[0041] Among them, the acquisition camera here generally uses an industrial camera, a CCD camera, and other high-precision cameras can also be used. First, control the device to move the camera to the designated position.

[0042] S2, obtaining wafer image information corresponding to the uncut wafer raw material;

[0043] Among them, the wafer image information collected here is the image corresponding to the wafer raw material that needs to be cut, and the wafer raw material can be an uncut wafer or a wafer that has been partially cut.

[0044] S3, determining Mark position information based on the wafer image information;

[0045] Among them, the identification point can be determined through the position system corresponding to the Mark point. It should be noted here that there can be one or more Mark points on the wafer raw material that needs to be cut. Therefore, during the process of the system determining the Mark position information, it is necessary to determine multiple Mark positions on the wafer image. So the following steps are carried out:

[0046] S31, determining the Mark position information multiple times;

[0047] S32, determining the Mark position information set;

[0048] Among them, there are multiple Mark position information in the Mark position information set, and subsequently, the position of the wafer to be cut needs to be determined based on the positions of the Mark points. Then, through the positions of multiple Mark points, the accuracy of determining the wafer to be cut can be improved.

[0049] S4. Determine the target wafer position information based on the Mark position information;

[0050] Among them, there are multiple target wafer position information. When determining the target wafer position information through the positions of multiple Mark points, all the targets that need to be cut on the wafer raw material need to be determined in advance.

[0051] S5. Obtain the position information of the target area corresponding to the wafer image information based on the target wafer position information;

[0052] Among them, the number of the target area position information is the same as that of the target wafer position information. After the position of each target wafer on the wafer image is marked in the system, the positions that need to be cut on the wafer raw material can be determined.

[0053] S6. Control the galvanometer to move to the wafer position corresponding to the target area position information for processing;

[0054] Among them, it should be noted that during the process of the system controlling the movement of the galvanometer, at this time, the device is synchronously operating to cut the wafer, and the high-precision galvanometer can magnify the target area on the wafer image during the cutting process, thereby improving the accuracy during the cutting process. Therefore, when the galvanometer moves, it is also the process of the device cutting the wafer by means of the galvanometer.

[0055] However, during the process of the device cutting the wafer, first, the number of positions of the target wafer is fixed. Therefore, record the number of wafers cut in real time, referring to Figure 2 , so the following steps are carried out:

[0056] S61. Control the galvanometer to move to the wafer position corresponding to each target area position one by one;

[0057] Among them, when the galvanometer moves from one target area position to another target area position, it indicates that the cutting of the target wafer has been completed at this time.

[0058] S62. Obtain the wafer data that has been processed separately;

[0059] Among them, the wafer data value here refers to the number of target wafers that the device has cut.

[0060] S63. Retrieve the threshold value of the number of regions corresponding to the target area position information of the wafer;

[0061] Among them, as mentioned above, when determining the target wafer position information, the region quantity threshold is obtained when determining the target wafer position information.

[0062] S64. Compare the wafer data with the region quantity threshold;

[0063] Among them, during the process of comparing the wafer data with the region quantity threshold, if the wafer data is less than the region quantity threshold, it indicates that there are still some target wafers not cut at this time, and the device needs to be controlled to continue the cutting operation; when the wafer data is equal to the region quantity threshold, it indicates that the corresponding target wafers on the wafer image have been cut completely.

[0064] S65. If the wafer data is equal to the region quantity threshold, the system then controls the galvanometer to reset and simultaneously controls the cutting device to stop the cutting work.

[0065] In the solution of the present application, through the execution steps of S61 to S65, during the process of the system controlling the device to cut the wafers, the device needs to perform cutting operations on a large number of wafer raw materials. It can accurately detect whether the wafer raw materials being cut are cut completely, and can also send an alarm on the system immediately after the wafer raw materials are cut completely, and timely replace the wafer raw materials on the cutting device for cutting.

[0066] And during the process of the device cutting the wafer raw materials, the magnifying effect of the galvanometer is used to improve the cutting accuracy. In order to reduce the error of cutting the target wafers, refer to Figure 3 , and the following steps are performed at this time:

[0067] S611. Obtain the target trajectory information of the galvanometer corresponding to the wafer in the cutting target area information;

[0068] Among them, during the process of the system determining the cutting target area in the wafer image information, the system can determine the target trajectory information corresponding to the target wafer to be cut through the boundary corresponding to the target cutting area, and can accurately cut the target wafer by controlling the device to move along the target trajectory.

[0069] S612. Real-time obtain the cut corresponding cut motion trajectory information.

[0070] S613. Compare the cut motion trajectory information with the target trajectory information;

[0071] Among them, during the process of the device performing cutting, the system compares the cut trajectory of the device with the target trajectory in real time, and is also detecting in real time whether there is an error in the device cutting, that is, performing cutting detection synchronously during the cutting process.

[0072] S614. If the cut motion trajectory information is identical to the target trajectory information, control the cutting to be completed.

[0073] Among them, during the cutting process of the target wafer, if the cut motion trajectory is always identical to the target trajectory, it indicates that the equipment cutting fully conforms to the cutting situation preset by the system.

[0074] During the wafer cutting process, in order to maintain the continuity of the equipment cutting, so during the cutting process of the target wafer, after the target wafer is cut, the system needs to control the equipment to overcut a little in the extending direction of the target trajectory. In order to precisely control the overcut control, refer to Figure 4 , the following steps are carried out:

[0075] S6141. Control the galvanometer to continue moving along the target trajectory information and continue cutting.

[0076] S6142. Retrieve the galvanometer moving speed information.

[0077] Among them, during the entire wafer cutting process of the equipment, the system controls the moving speeds of the galvanometer and the cutting equipment to be constant.

[0078] S6143. Determine the target moving duration information based on the target trajectory information and the galvanometer moving speed information.

[0079] Among them, in the case where the target trajectory is determined in advance and the galvanometer moving speed is constant, the time length required for the equipment to cut the target wafer can be obtained at this time.

[0080] S6144. Obtain the moving duration information based on the start of the galvanometer movement.

[0081] Among them, when the system starts to control the movement of the galvanometer and the cutting equipment, timing can be carried out. It should be noted here that the system controls the movement of the galvanometer after the galvanometer and the cutting equipment are set up in advance.

[0082] S6145. Determine whether the moving duration information is greater than the target moving duration information.

[0083] S6146. If so, control the galvanometer to stop moving.

[0084] Among them, in order to ensure overcutting, when the moving duration information is greater than the target moving duration information, it indicates that the equipment has started to be in the overcut stage at this time. In order to control the equipment to stop cutting immediately, refer to Figure 5 , so the following steps will also be executed:

[0085] S61461. Retrieve the overcut threshold information preset for wafer overcutting.

[0086] Among them, in the embodiment of the present application, the distance corresponding to the overcut threshold information is 1mm.

[0087] S61462, acquiring a corresponding overcut time threshold based on the overcut threshold data and the galvanometer movement rate information;

[0088] S61463, determining overcut duration information based on the movement duration information and the target movement duration information;

[0089] Among them, the overcutting time information can be used to accurately control the equipment to stop cutting.

[0090] S61464: If the overcutting time information is equal to the overcutting time threshold, the galvanometer is controlled to stop moving.

[0091] In the process of cutting with the help of the galvanometer magnification effect, after the line cutting corresponding to the target trajectory information is completed, it is compared with the over-cutting time information to ensure the continuity of wafer cutting. In the present application scheme, the cutting time threshold is controlled to control the distance that the equipment can over-cut during cutting.

[0092] The implementation principle of a control method for an ultraviolet laser wafer cutting machine in an embodiment of the present application is as follows: the system first controls the acquisition camera to move to a specified position, so as to facilitate the subsequent acquisition of wafer image information corresponding to the uncut wafer raw material. There is Mark position information corresponding to multiple Mark points in the wafer image information. At this time, the system can determine the target wafer position information through the Mark position information. It should be pointed out here that there are multiple target wafer position information on the wafer image information. Then, the system obtains the target area position information corresponding to the wafer image information based on the target wafer position information. After marking the position of each target wafer on the wafer image in the system, the position on the wafer raw material that needs to be cut can be determined.

[0093] The system controls the galvanometer to move to the wafer position corresponding to the target area position information for processing. While the system controls the movement of the galvanometer, the equipment is simultaneously performing the wafer cutting operation. The high-precision galvanometer can magnify the target area on the wafer protrusion image during the cutting process, thereby improving the accuracy of the cutting process. Therefore, while the galvanometer is moving, the equipment is also cutting the wafer with the help of the galvanometer method.

[0094] And in the process of the equipment cutting the target wafer, the system controls the galvanometer to move one by one to the wafer position corresponding to each target area position, and then compares the wafer data with the area quantity threshold. If the wafer data is less than the area quantity threshold, it means that some target wafers have not been cut, and the equipment needs to be controlled to continue the cutting operation; when the wafer data is equal to the area quantity threshold, it means that the corresponding target wafer on the wafer image has been cut.

[0095] During the process of the device cutting the wafer raw material, the amplified effect of the galvanometer is used to improve the cutting accuracy. In order to reduce the error of the target wafer to be cut, during the process of the device cutting the target wafer, the system obtains the target trajectory information of the wafer corresponding to the information of the galvanometer in the target cutting area, and obtains the cut motion trajectory information corresponding to the already cut part in real time. Then, the cut motion trajectory information is compared with the target trajectory information. After the target wafer is cut, the system continues to control the galvanometer to move along the target trajectory information and continue cutting, and retrieves the galvanometer movement speed information. By judging whether the movement duration information is greater than the target movement duration information, in order to ensure over-cutting, when the movement duration information is greater than the target movement duration information, it indicates that the device has started to be in the over-cutting stage at this time.

[0096] In summary, the system controls the cutting device to cut the wafer, and the high-precision galvanometer and CCD camera can magnify the target area on the wafer image during the cutting process, thereby improving the processing accuracy when cutting the wafer, and then precisely controlling the opening and closing of the cutting device.

[0097] In a second aspect, an ultraviolet laser wafer cutting machine control system according to an embodiment of the present application is disclosed. Refer to Figure 6 , including: a camera control module for controlling the acquisition camera to move to a specified position;

[0098] a wafer image acquisition module for acquiring wafer image information corresponding to the uncut wafer raw material;

[0099] a Mark position determination module for determining Mark position information based on the wafer image information;

[0100] a target wafer position determination module for determining target wafer position information based on the Mark position information, where there are multiple pieces of target wafer position information;

[0101] a target area position acquisition module for acquiring target area position information corresponding to the wafer image information based on the target wafer position information, where the number of target area position information is the same as the number of target wafer position information;

[0102] a galvanometer movement control module for controlling the galvanometer to move to the wafer position corresponding to the target area position information for processing.

[0103] The implementation principle of the control system of an ultraviolet laser wafer cutting machine in an embodiment of the present application is as follows: When it is necessary to cut the wafer raw material, after the wafer raw material is placed in the cutting equipment, the camera control module controls the movement of the acquisition camera, and the wafer image acquisition module can acquire the wafer image information corresponding to the wafer raw material. The acquisition camera mentioned in the present application selects a CCD camera used in industry, and other high-precision cameras are also acceptable; then the target wafer position determination module determines the Mark position information through the wafer image information, and through the position of the Mark point, the position of the target wafer to be cut can be determined. Generally speaking, there are multiple target wafers on the wafer raw material, so there are multiple target wafer positions. Then the target area position acquisition module can determine the target area information on the wafer image information, and each target area information corresponds to a target wafer to be cut. Subsequently, the galvanometer movement control module can control the movement of the galvanometer. It should be noted here that the system controls the cutting equipment to cut the wafer, and the high-precision galvanometer and CCD camera can magnify the target area on the wafer image during the cutting process, so as to improve the processing accuracy when cutting the wafer.

[0104] In a third aspect, a computer-readable storage medium provided by the present application stores a computer program that can be loaded and executed by a processor, such as any one of the methods in a control method for an ultraviolet laser wafer cutting machine.

[0105] In a fourth aspect, an intelligent terminal provided by the present application includes a memory and a processor, and a computer program that can be loaded and executed by the processor, such as any one of the methods in a control method for an ultraviolet laser wafer cutting machine, is stored on the memory.

[0106] As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

[0107] As used in the above embodiments, depending on the context, the term "when..." can be interpreted to mean "if...", or "after...", or "in response to determining...", or "in response to detecting...". Similarly, depending on the context, the phrase "when determining..." or "if detecting (the stated condition or event)" can be interpreted to mean "if determining...", or "in response to determining...", or "when detecting (the stated condition or event)", or "in response to detecting (the stated condition or event)".

[0108] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wire (such as coaxial cable, optical fiber, digital subscriber line) or wirelessly (such as infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that the computer can access or a data storage device such as a server or data center that includes one or more integrated available media. The available medium can be a magnetic medium (such as a floppy disk, hard disk, magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid-state drive), etc.

[0109] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware with a computer program. The program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the above method embodiments. The foregoing storage medium includes various media that can store program codes, such as ROM or random access memory RAM, magnetic disks, or optical discs.

Claims

1. A control method for an ultraviolet laser wafer cutting machine, which moves a collection camera to a preset reference point position through a linear motor module, takes pictures with the collection camera for image processing, and obtains wafer image information corresponding to an uncut wafer raw material, characterized in that, It includes the following steps: Determine the reference point position information based on the wafer image information; Determine the target wafer position information based on the reference point position information, where there are multiple pieces of target wafer position information; Obtain the corresponding target area position information on the wafer image information based on the target wafer position information, where the number of pieces of target area position information is the same as that of the target wafer position information; Control the galvanometer to move to the wafer position corresponding to the target area position information for processing; During the process of controlling the galvanometer to move to the wafer position corresponding to the target area position information for processing, the following steps are carried out: Control the galvanometer to move to the wafer position corresponding to each target area position one by one; Obtain the wafer data that has been processed individually; Retrieve the area quantity threshold corresponding to the target area position information of the wafer, where the area quantity threshold is obtained when determining the target wafer position information; Compare the wafer data with the area quantity threshold; If the wafer data is equal to the area quantity threshold, control the galvanometer to reset; During the process of controlling the galvanometer to process at the corresponding wafer position, the following steps are also carried out: Obtain the target trajectory information of the galvanometer when cutting the wafer corresponding to the target area information; Obtain the cut movement trajectory information that has been cut in real time; Compare the cut movement trajectory information with the target trajectory information; If the cut movement trajectory information is the same as the target trajectory information, control the cutting to be completed.

2. The control method of an ultraviolet laser wafer cutting machine according to claim 1, wherein, During the process of determining the reference point position information based on the wafer image information, the following steps are also carried out: Determine the reference point position information multiple times; Determine the reference point position information set, where the reference point position information set has multiple pieces of reference point position information.

3. The control method of an ultraviolet laser wafer cutting machine according to claim 1, characterized in that, When the cut movement trajectory information is the same as the target trajectory information, the following steps are also carried out: Control the galvanometer to continue moving along the target trajectory information and continue cutting; Retrieve the galvanometer movement speed information; Determine the target movement duration information based on the target trajectory information and the galvanometer movement speed information; Obtain the movement duration information based on the start of the galvanometer movement; Judge whether the movement duration information is greater than the target movement duration information; If so, control the galvanometer to stop moving.

4. The control method of an ultraviolet laser wafer cutting machine according to claim 3, wherein During the process of judging whether the movement duration information is greater than the target movement duration information, the following steps are carried out: Retrieve the overcut threshold information preset for the wafer overcut; Obtain the corresponding overcut time threshold based on the overcut threshold data and the galvanometer movement speed information; Determine the overcut duration information based on the movement duration information and the target movement duration information; If the overcut duration information is equal to the overcut time threshold, control the galvanometer to stop moving.

5. An ultraviolet laser wafer cutting machine control system, characterized in that, It includes: A camera control module for controlling the acquisition camera to move to a specified position; A wafer image acquisition module for acquiring the wafer image information corresponding to the uncut wafer raw material; A reference point position determination module for determining the reference point position information based on the wafer image information; A target wafer position determination module for determining the target wafer position information based on the reference point position information, where there are multiple pieces of target wafer position information; A target area position acquisition module, which is used to acquire the target area position information corresponding to the wafer image information based on the target wafer position information, where the number of target area position information is the same as that of the target wafer position information; A galvanometer movement control module, which is used to control the galvanometer to move to the wafer position corresponding to the target area position information for processing; Specifically, the galvanometer movement control module is used for: Controlling the galvanometer to move to the wafer position corresponding to each target area position one by one; Obtaining the wafer data that has been processed separately; Retrieving the threshold value of the number of areas corresponding to the target area position information of the wafer, where the threshold value of the number of areas is obtained when determining the target wafer position information; Comparing the wafer data with the threshold value of the number of areas; If the wafer data is equal to the threshold value of the number of areas, controlling the galvanometer to reset; Specifically, the galvanometer movement control module is further used for: Obtaining the target trajectory information of the galvanometer when cutting the wafer corresponding to the target area information; Real-time obtaining the cut movement trajectory information that has been cut correspondingly; Comparing the cut movement trajectory information with the target trajectory information; If the cut movement trajectory information is the same as the target trajectory information, controlling the cutting to be completed.

6. A computer-readable storage medium storing a computer program that can be loaded and executed by a processor to perform the method according to any one of claims 1 to 4.

7. An intelligent terminal, including a memory and a processor, where the memory stores a computer program that can be loaded and executed by the processor to perform the method according to any one of claims 1 to 4.

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