Water cooling device

Abstract

This application discloses a water-cooled heat sink comprising a heat sink substrate, a heat sink jacket, and a barrier assembly. The heat sink substrate comprises a first surface and a second surface disposed opposite each other. The first surface is formed with heat sink columns, and the second surface is configured to connect to a heat sink. The heat sink jacket is disposed on one side of the first surface of the heat sink substrate and faces the heat sink substrate. The heat sink jacket comprises a cavity for accommodating coolant. The barrier assembly comprises multiple barrier structures disposed on the inner wall of the cavity. The water-cooled heat sink provided by this application can improve the heat dissipation efficiency of chips while also enhancing resource utilization.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic devices, and in particular relates to a water-cooling heat dissipation device. Background Art

[0002] In power modules, IGBT chips (insulated-gate bipolar transistors) are core functional devices that generate heat. However, heat accumulation can severely impact device performance. As IGBT chips advance toward higher power and higher integration densities, heat generation becomes increasingly prominent, placing ever-higher demands on heat dissipation. Conventional technology uses water-cooled heat sinks to dissipate heat from IGBT chips. These devices consist of a heat sink substrate and a water jacket. The substrate is equipped with numerous heat-dissipating columns that can be inserted directly into the water jacket for heat dissipation. However, these devices suffer from low heat dissipation efficiency, severely impacting chip cooling. Summary of the Invention

[0003] The embodiment of the present application provides a water-cooling heat dissipation device, which can improve the heat dissipation efficiency of the chip.

[0004] The first aspect of the present application provides a water-cooling heat dissipation device, comprising:

[0005] A heat dissipation substrate, comprising a first surface and a second surface arranged opposite to each other, wherein the first surface is formed with heat dissipation columns, and the second surface is used for connecting to a heat dissipation element;

[0006] a heat dissipation water jacket, disposed on one side of the first surface of the heat dissipation substrate and opposite to the heat dissipation substrate, the heat dissipation water jacket comprising a cavity for accommodating a coolant;

[0007] The barrier assembly includes a plurality of barrier structures, and the barrier structures are arranged on the inner wall of the cavity.

[0008] According to an implementation scheme of the first aspect of the present application, the heat dissipation water jacket includes a liquid inlet and a liquid outlet arranged along a first direction, the liquid inlet and the liquid outlet are both connected to the cavity, the heat dissipation water jacket includes a first side wall and a second side wall arranged opposite to each other along a second direction, the second direction intersects with the first direction, and the barrier structure is formed on the first side wall and the second side wall.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, multiple rows of heat dissipation columns are formed on the first surface, each row of the heat dissipation columns includes multiple heat dissipation columns arranged along the first direction, and in adjacent rows of the heat dissipation columns along the second direction, the projections of the heat dissipation columns along the second direction do not overlap.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, a plurality of the barrier structures arranged along the first direction are formed on the first sidewall, and a plurality of the barrier structures arranged along the first direction are formed on the second sidewall;

[0011] In a row of the heat dissipation columns close to the first side wall, the orthographic projections of the heat dissipation columns on the first side wall do not overlap with the barrier structure provided on the first side wall; in a row of the heat dissipation columns close to the second side wall, the orthographic projections of the heat dissipation columns on the second side wall do not overlap with the barrier structure provided on the second side wall.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, in a row of the heat dissipation columns close to the first side wall, a center line of the barrier structure provided on the first side wall coincides with a symmetry line of the heat dissipation columns located on both sides of the barrier structure along the first direction;

[0013] In a row of the heat dissipation columns close to the second side wall, a center line of the barrier structure disposed on the second side wall coincides with a symmetry line of the heat dissipation columns located on both sides of the barrier structure along the first direction.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, a plurality of the barrier structures arranged along the first direction are formed on the first sidewall, and a plurality of the barrier structures arranged along the first direction are formed on the second sidewall;

[0015] In a row of the heat dissipation columns close to the first side wall, the projections of the heat dissipation columns and the barrier structure provided on the first side wall in the first direction overlap; in a row of the heat dissipation columns close to the second side wall, the projections of the heat dissipation columns and the barrier structure provided on the second side wall in the first direction overlap; or,

[0016] Along the second direction, adjacent heat dissipation columns have a first preset distance, and adjacent heat dissipation columns have a second preset distance from the barrier structure, and the first preset distance is greater than the second preset distance.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, along the first direction, the cavity includes a first edge area close to the liquid inlet, a second edge area close to the liquid outlet, and also includes a middle area located between the first edge area and the second edge area, and the density of the barrier structure in the first edge area and the second edge area is greater than the density of the barrier structure in the middle area.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the length direction of the heat dissipation column is parallel to the arrangement direction of the heat dissipation substrate and the heat dissipation water jacket, the barrier structure is in the shape of a long strip, and the length direction of the barrier structure is the same as the length direction of the heat dissipation column.

[0019] According to any of the aforementioned embodiments of the first aspect of the present application, the shape of the cross section of the barrier structure perpendicular to its own length direction is rectangular, arc-shaped or triangular.

[0020] According to any of the foregoing embodiments of the first aspect of the present application, the barrier structure includes a first sub-section and a second sub-section, a preset gap is defined between the first sub-section and the second sub-section, the barrier structure includes a connecting end connected to the inner wall of the cavity and a free end opposite the connecting end, the preset gap gradually decreases from the connecting end toward the free end, the first sub-section and the second sub-section each include an outer surface facing away from the preset gap, and the distance between the outer surfaces of the first sub-section and the second sub-section gradually decreases from the connecting section toward the free end;

[0021] In the barrier structure, the maximum distance between the first sub-portion and the second sub-portion is greater than or equal to the distance between adjacent barrier structures.

[0022] The water-cooled heat sink provided in the present application also includes a barrier assembly, which includes multiple barrier structures disposed on the inner wall of the cavity. Thus, when the coolant flows within the cavity, the barrier structure can change the direction of the coolant flow. Specifically, the barrier structure disposed on the inner wall of the cavity can increase the flow resistance in the area near the inner wall of the cavity. The increased flow resistance in the area near the inner wall of the cavity can help the coolant flow to the central area of ​​the cavity, thereby fully dissipating heat from the heat sink and improving heat dissipation efficiency. In the water-cooled heat sink provided in the present application, the barrier assembly changes the direction of the coolant flow, thereby enhancing heat exchange between the coolant and the heat sink. At the same time, the barrier structure disposed on the inner wall increases the contact area between the coolant and the water-cooled heat sink, thereby optimizing the heat dissipation effect on the heat sink. This also allows coolant resources to be fully utilized, improving resource utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1This is a schematic structural diagram of a water-cooling heat dissipation device provided in an embodiment of the present application;

[0025] Figure 2 1 is a schematic cross-sectional view perpendicular to the arrangement direction of the liquid inlet and the liquid outlet of a water-cooling heat dissipation device provided in an embodiment of the present application;

[0026] Figure 3 This is a top view of the internal structure of a water-cooling heat dissipation device provided in an embodiment of the present application;

[0027] Figure 4 This is a top view of a heat dissipation jacket in a water-cooling heat dissipation device provided in an embodiment of the present application;

[0028] Figure 5 This is a top view of a heat dissipation jacket in another water-cooling heat dissipation device provided in an embodiment of the present application;

[0029] Figure 6 This is a top view of a heat dissipation jacket in another water-cooling heat dissipation device provided in an embodiment of the present application;

[0030] Figure 7 This is a schematic structural diagram of a heat dissipation jacket in another water-cooling heat dissipation device provided in an embodiment of the present application;

[0031] Figure 8 yes Figure 7 A top view of

[0032] Figure 9 yes Figure 8 Magnified view of the middle P region.

[0033] In the attached figure:

[0034] 1-water-cooled heat sink; 10-heat sink substrate; 101-first surface; 102-second surface; 103-heat sink column; 104-boss; 105-first threaded hole; 11-heat sink jacket; 110-liquid inlet; 111 third side wall; 112-fourth side wall; 113-first side wall; 114-second side wall; 115-groove; 116-sealing ring; 117-second threaded hole; 118-cavity; 12-barrier assembly; 121-barrier structure; 1211-first subsection; 1212-second subsection; 1213-connecting end; 1214-free end; x-first direction; y-second direction; D1-first preset distance; D2-second preset distance. DETAILED DESCRIPTION

[0035] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating the examples of the present application.

[0036] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0037] The inventors have discovered that the main reason for the low heat dissipation efficiency of water-cooled heat sinks for chips in conventional technologies is that there is a large gap between the inner wall of the heat-dissipating water jacket within the water-cooled heat sink and the heat-dissipating columns on the heat-dissipating substrate. This causes the fluid flow rate near the inner wall of the heat-dissipating water jacket to be significantly greater than the fluid flow rate through the heat-dissipating columns. This causes a large amount of coolant to flow rapidly through both sides of the heat-dissipating water jacket without passing through the heat-dissipating columns under the heat-dissipating substrate, resulting in the loss of coolant resources and insufficient heat exchange. This results in low heat dissipation efficiency for chips by the water-cooled heat sink, seriously affecting the chip's operating performance. Based on the research on the above issues, the inventors provide a water-cooled heat sink to improve the heat dissipation efficiency for chips.

[0038] In order to better understand this application, Figures 1 to 9 The water cooling device according to the embodiment of the present application is described in detail.

[0039] See also Figure 1The embodiment of the present application provides a water-cooled heat dissipation device 1, comprising a heat dissipation substrate 10, a heat dissipation water jacket 11, and a barrier assembly 12. The heat dissipation substrate 10 comprises a first surface 101 and a second surface 102 arranged opposite to each other, wherein the first surface 101 is formed with heat dissipation columns 103, and the second surface 102 is used to connect to the heat dissipation component. The heat dissipation water jacket 11 is arranged on one side of the first surface 101 of the heat dissipation substrate 10 and is arranged opposite to the heat dissipation substrate 10. The heat dissipation water jacket 11 comprises a cavity for accommodating coolant. The barrier assembly 12 comprises a plurality of barrier structures 121, and the barrier structures 121 are arranged on the inner wall of the cavity.

[0040] The water-cooled heat dissipation device 1 provided in the present application includes a heat dissipation substrate 10 and a heat dissipation water jacket 11. The cavity of the heat dissipation water jacket 11 is used to contain coolant. The heat dissipation water jacket 11 is tightly connected to the heat dissipation substrate 10 so that the cavity has a closed structure. The heat dissipation columns 103 on the first surface 101 of the heat dissipation substrate 10 extend into the cavity of the heat dissipation water jacket 11 and exchange heat with the coolant in the cavity through the heat dissipation columns 103. The heat dissipation substrate 10 is used to connect the heat dissipation element to be cooled to the heat dissipation water jacket 11. The heat dissipation element to be cooled is contact-connected to the second surface 102 of the heat dissipation substrate 10, so that the heat on the heat dissipation element to be cooled can be transferred to the coolant in the heat dissipation water jacket 11 through the heat dissipation columns 103 on the heat dissipation substrate 10. The heat on the heat dissipation column 103 is then carried away by the flow of the coolant, thereby carrying away the heat on the heat dissipation element to be cooled. The heat dissipation element to be cooled can be a chip, specifically, an insulated gate bipolar transistor, i.e., an IGBT chip.

[0041] The water-cooled heat sink 1 provided herein also includes a barrier assembly 12 comprising a plurality of barrier structures 121 disposed on the inner wall of the cavity. Thus, when coolant flows within the cavity, the barrier structures 121 can redirect the coolant's flow. Specifically, the barrier structures 121 disposed on the inner wall of the cavity increase the flow resistance in the area near the inner wall. This increased flow resistance in the area near the inner wall facilitates the coolant's flow toward the central area of ​​the cavity, thereby effectively dissipating heat from the heat sink 103 and improving heat dissipation efficiency. In the water-cooled heat sink 1 provided herein, the barrier assembly 12 redirects the coolant's flow, thereby enhancing heat exchange between the coolant and the heat sink 103. Furthermore, the barrier structures 121 disposed on the inner wall increase the contact area between the coolant and the water-cooled heat sink 1, thereby optimizing the heat dissipation effect on the heat sink. This also allows for full utilization of coolant resources and improves resource utilization.

[0042] In a feasible embodiment, the barrier structure 121 and the heat dissipation water jacket 11 are integrally formed.

[0043] In the above embodiment, the barrier structure 121 and the heat dissipation water jacket 11 are integrally formed, thereby simplifying the assembly process of the water-cooling heat dissipation device 1 and improving the connection strength between the barrier structure 121 and the heat dissipation water jacket 11 .

[0044] In another feasible embodiment, the barrier structure 121 and the heat dissipation water jacket 11 are formed separately. Specifically, the barrier structure 121 and the heat dissipation water jacket 11 can be fixedly connected, for example, by welding, or the barrier structure 121 and the heat dissipation water jacket 11 can be detachably connected, for example, by screws, etc., which is not particularly limited in this application.

[0045] In a feasible implementation manner, the heat dissipation water jacket 11 may be made of a material with high thermal conductivity (such as T1 copper).

[0046] In one possible implementation, Figure 1 and Figure 2 As shown, due to processing requirements, a boss 104 is formed on the first surface 101 of the heat dissipation substrate 10, protruding from the first surface 101. The heat dissipation column 103 is formed on the boss, that is, the heat dissipation column 103 protrudes from the boss and extends away from the second surface 102. The extension direction is the length direction of the heat dissipation column 103. The cross-section of the heat dissipation column 103 perpendicular to its length can be circular, that is, the shape of the heat dissipation column 103 is cylindrical; the cross-section of the heat dissipation column 103 perpendicular to its length can also be rectangular, that is, the shape of the heat dissipation column 103 is a cuboid, etc., and this application does not specifically limit this.

[0047] In the above embodiment, the distance D between the edge of the barrier structure 121 on the inner wall surface of the heat dissipation water jacket 11 facing the heat dissipation substrate 10 and the surface of the boss 104 facing the heat dissipation water jacket 11 must meet relevant assembly requirements to avoid collision between the barrier structure 121 and the boss 104.

[0048] In one possible implementation, Figure 2 As shown, the heat dissipation substrate 10 and the heat dissipation water jacket 11 are detachably connected. Specifically, the heat dissipation substrate 10 and the heat dissipation water jacket 11 are connected and fixed by screws and threaded holes.

[0049] Specifically, a groove 115 is formed on the side of the heat dissipation jacket 11 facing the heat dissipation substrate 10. The groove 115 is used to accommodate a sealing ring 116. The heat dissipation jacket 11 and the heat dissipation substrate 10 are sealed by the sealing ring 116 located in the groove 115 to prevent the coolant from flowing out.

[0050] Specifically, the heat dissipation substrate 10 is formed with a plurality of first threaded holes 105, which are arranged along the edge of the heat dissipation substrate 10. The surface of the heat dissipation jacket 11 facing the heat dissipation substrate 10 is formed with a plurality of second threaded holes 117, which correspond one-to-one with the first threaded holes 105. The plurality of second threaded holes 117 are formed between the groove 115 and the edge of the heat dissipation jacket 11. Screws are inserted through the first threaded holes 105 and the second threaded holes 117, respectively, to securely connect the heat dissipation substrate 10 to the heat dissipation jacket 11.

[0051] In one possible implementation, Figure 1 As shown, the heat dissipation water jacket 11 includes a liquid inlet 110 and a liquid outlet arranged along a first direction x, and the liquid inlet 110 and the liquid outlet are both connected to the cavity. The heat dissipation water jacket 11 includes a first side wall 113 and a second side wall 114 arranged opposite to each other along a second direction y, and the second direction y intersects with the first direction x. The barrier structure 121 is formed on the first side wall 113 and the second side wall 114.

[0052] In the above embodiment, the cross-section of the heat dissipation jacket 11 along a direction perpendicular to the arrangement of the heat dissipation jacket 11 and the heat dissipation substrate 10 is rectangular. That is, the heat dissipation jacket 11 includes a first side wall 113 and a second side wall 114 disposed opposite each other, as well as a third side wall 111 and a fourth side wall 112 disposed opposite each other. In this case, the first direction x is perpendicular to the second direction y. The third side wall 111 and the fourth side wall 112 are arranged along the first direction x, while the first side wall 113 and the second side wall 114 are arranged along the second direction y. A liquid inlet 110 is formed on the third side wall 111, and a liquid outlet is formed on the fourth side wall 112. Coolant flows into the cavity along the first direction x and flows out of the cavity along the first direction x. The coolant flows into and out of the cavity through the liquid inlet 110 and the liquid outlet, forming an alternating cycle.

[0053] In the above embodiment, the barrier structure 121 is formed on the side of the first side wall 113 and the second side wall 114 facing the cavity, so that when the coolant flows from the liquid inlet 110 to the liquid outlet, the flow resistance can be enhanced in the area close to the first side wall 113 and the second side wall 114, so as to reduce the flow rate of the coolant in the edge area of ​​the cavity, so that the coolant flows to the middle position of the cavity, and the heat dissipation column 103 is located in the middle position of the cavity, thereby enhancing the heat exchange efficiency between the coolant and the heat dissipation column 103 and improving the heat dissipation effect.

[0054] At the same time, in the above embodiment, the setting of the barrier structure 121 increases the contact area between the coolant and the water-cooled heat sink 1, thereby helping to improve the heat conduction efficiency between the water-cooled heat sink 1 and the coolant, and further improving the heat dissipation effect of the water-cooled heat sink 1.

[0055] In one possible implementation, Figure 3 As shown, multiple rows of heat dissipation columns 103 are formed on the first surface 101 , each row of heat dissipation columns includes multiple heat dissipation columns 103 arranged along the first direction x, and in adjacent rows of heat dissipation columns 103 along the second direction y, the projections of the heat dissipation columns 103 along the second direction y do not overlap.

[0056] In the above embodiment, the projections of adjacent rows of heat dissipation columns 103 in the second direction y do not overlap, so that the heat dissipation columns 103 can be arranged in a staggered manner, so that the coolant is dispersed into multiple paths during circulation to fully contact the heat dissipation columns 103.

[0057] In one possible implementation, Figure 3 As shown, a plurality of barrier structures 121 arranged along a first direction x are formed on the first sidewall 113, and a plurality of barrier structures 121 arranged along the first direction x are formed on the second sidewall 114. In a row of heat dissipating columns 103 near the first sidewall 113, the orthographic projections of the heat dissipating columns 103 on the first sidewall 113 do not overlap with the barrier structures 121 disposed on the first sidewall 113; and in a row of heat dissipating columns 103 near the second sidewall 114, the orthographic projections of the heat dissipating columns 103 on the second sidewall 114 do not overlap with the barrier structures 121 disposed on the second sidewall 114.

[0058] In the above embodiment, the heat dissipation column 103 and the barrier structure 121 are staggered along the second direction y, which helps to further reduce the distance between the barrier structure 121 and the heat dissipation column 103 along the first direction x, so as to further reduce the flow of the coolant flowing through the area close to the first side wall 113 and the second side wall 114, and increase the flow through the area between the heat dissipation columns 103, thereby improving the heat exchange efficiency.

[0059] In one possible implementation, Figure 3 As shown, in a row of heat dissipation columns 103 close to the first side wall 113 , the center line C1 of the barrier structure 121 disposed on the first side wall 113 coincides with the symmetry lines C2 of the heat dissipation columns 103 located on both sides of the barrier structure 121 along the first direction x.

[0060] In a row of heat dissipating columns 103 near the second sidewall 114 , a center line C3 of the barrier structure 121 disposed on the second sidewall 114 coincides with a symmetry line C4 of the heat dissipating columns 103 located on both sides of the barrier structure 121 along the first direction x.

[0061] In the above embodiment, the heat dissipation columns 103 on both sides of the barrier structure 121 can be ensured to be at the same distance from the barrier structure 121, that is, equal space is provided between the barrier structure 121 and the heat dissipation columns 103 for the circulation of the coolant, which helps to distribute the coolant more evenly, making the heat dissipation effect of each part in the water-cooled heat dissipation device 1 more uniform.

[0062] In a feasible embodiment, in a row of heat dissipation columns 103 near the first side wall 113, the distances between the barrier structure 121 arranged on the first side wall 113 and the heat dissipation columns 103 located on both sides of the barrier structure 121 along the first direction x are d1 and d2 respectively, and the distance between the center line C1 of the barrier structure 121 arranged on the first side wall 113 and the symmetry line C2 of the heat dissipation columns 103 located on both sides of the barrier structure 121 along the first direction x is less than or equal to min{d1, d2}.

[0063] In a row of heat dissipation columns 103 near the second sidewall 114, the distances between the barrier structure 121 disposed on the second sidewall 114 and the heat dissipation columns 103 located on either side of the barrier structure 121 along the first direction x are d3 and d4, respectively. The distance between the centerline C3 of the barrier structure 121 disposed on the second sidewall 114 and the symmetry line C4 of the heat dissipation columns 103 located on either side of the barrier structure 121 along the first direction x is less than or equal to min{d3, d4}.

[0064] In the above embodiment, the distance difference between the heat dissipation columns 103 on both sides of the barrier structure 121 and the barrier structure 121 can be reduced, that is, a relatively equal space is provided between the barrier structure 121 and the heat dissipation columns 103 for the circulation of the coolant, which helps to distribute the coolant more evenly, making the heat dissipation effect of each part in the water-cooled heat dissipation device 1 more uniform.

[0065] In one possible implementation, Figure 3 As shown, a plurality of barrier structures 121 arranged along a first direction x are formed on the first sidewall 113, and a plurality of barrier structures 121 arranged along the first direction x are formed on the second sidewall 114. In a row of heat dissipating columns 103 near the first sidewall 113, the projections of the heat dissipating columns 103 and the barrier structures 121 disposed on the first sidewall 113 overlap in the first direction x; in a row of heat dissipating columns 103 near the second sidewall 114, the projections of the heat dissipating columns 103 and the barrier structures 121 disposed on the second sidewall 114 overlap in the first direction x.

[0066] In the above embodiment, the heat dissipation columns 103 in a row of heat dissipation columns 103 near the first side wall 113 extend between adjacent barrier structures 121 located on the first side wall 113, and the heat dissipation columns 103 in a row of heat dissipation columns 103 near the second side wall 114 extend between adjacent barrier structures 121 located on the second side wall 114, thereby further reducing the space between the barrier structures 121 on the first side wall 113 and the second side wall 114 and the heat dissipation columns 103, so as to further reduce the flow rate of the coolant flowing through the areas near the first side wall 113 and the second side wall 114, increase the flow rate of the coolant flowing through the areas between the heat dissipation columns 103, and thus improve the heat exchange efficiency.

[0067] In one feasible embodiment, along the second direction y, adjacent heat sinks 103 have a first predetermined distance D1, and the heat sinks 103 and the barrier structure 121 have a second predetermined distance D2, where the first predetermined distance D1 is greater than the second predetermined distance D2. In this case, by setting the space between the barrier structure 121 and the heat sink 103 to be smaller than the space between adjacent heat sinks 103, the coolant is more likely to flow between the heat sinks 103, while the coolant is less likely to flow into the areas near the first sidewall 113 and the second sidewall 114, i.e., the area near the barrier structure 121. This increases the coolant flow rate in the areas between the heat sinks 103, thereby improving heat exchange efficiency.

[0068] In a feasible embodiment, along the first direction x, the cavity includes a first edge area close to the liquid inlet 110, a second edge area close to the liquid outlet, and an intermediate area between the first edge area and the second edge area, and the density of the barrier structure 121 in the first edge area and the second edge area is greater than the density of the barrier structure 121 in the intermediate area.

[0069] In the above embodiment, the barrier structures 121 can be arranged regularly or irregularly along the first direction x. Specifically, since the coolant flow rate is generally faster in the first and second edge regions near the liquid inlet 110 and the liquid outlet, and slower in the intermediate region between the first and second edge regions, the barrier structures 121 can be arranged to have a first predetermined density in the first and second edge regions near the liquid inlet 110 and the liquid outlet, and a second predetermined density in the intermediate region between the first and second edge regions, with the first predetermined density being less than the second predetermined density. This increases the barrier effect on the coolant in the intermediate positions, allowing more coolant to flow between the heat sinks 103, thereby improving heat exchange efficiency. The first predetermined density and the second predetermined density refer to the spacing between adjacent barrier structures 121.

[0070] Specifically, the arrangement of the barrier structure 121 can be flexibly changed according to the internal structure of the heat dissipation water jacket 11 and the flow rate of the coolant, and is not particularly limited in this application.

[0071] In one feasible embodiment, the length direction of the heat dissipation column 103 is parallel to the arrangement direction of the heat dissipation substrate 10 and the heat dissipation water jacket 11. The barrier structure 121 is in the shape of an elongated strip, and the length direction of the barrier structure 121 is the same as the length direction of the heat dissipation column 103. This facilitates manufacturing and increases the area of ​​the barrier surface of the barrier structure 121 in contact with the coolant, thereby enhancing its barrier effect.

[0072] In one possible implementation, Figures 4 to 6As shown, the cross-section of the barrier structure 121 perpendicular to its length is rectangular, arc-shaped or triangular. Other irregular cross-sections may also be used, and this application does not specifically limit this.

[0073] In one possible implementation, Figures 7 to 9 As shown, the barrier structure 121 includes a first sub-portion 1211 and a second sub-portion 1212, with a preset gap between the first sub-portion 1211 and the second sub-portion 1212. The barrier structure 121 includes a connecting end 1213 connected to the inner wall of the cavity and a free end 1214 opposite to the connecting end 1213. The preset gap gradually decreases from the connecting end 1213 to the free end 1214. The first sub-portion 1211 and the second sub-portion 1212 both include outer surfaces facing away from the preset gap. The distance between the outer surfaces of the first sub-portion 1211 and the second sub-portion 1212 gradually decreases from the connecting end 1213 to the free end 1214.

[0074] In the barrier structure 121 , the maximum distance L1 between the first sub-portion 1211 and the second sub-portion 1212 is greater than or equal to the distance L2 between adjacent barrier structures 121 .

[0075] While the embodiments described above are not exhaustive, they do not limit the invention to specific embodiments. Clearly, numerous modifications and variations are possible based on the above description. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A water-cooling heat dissipation device, characterized in that: include: A heat dissipation substrate, comprising a first surface and a second surface arranged opposite to each other, wherein the first surface is formed with heat dissipation columns, and the second surface is used for connecting to a heat dissipation element; a heat dissipation water jacket, disposed on one side of the first surface of the heat dissipation substrate and opposite to the heat dissipation substrate, the heat dissipation water jacket comprising a cavity for accommodating a coolant; A barrier assembly comprising a plurality of barrier structures, wherein the barrier structures are arranged on the inner wall of the cavity; Wherein, the heat dissipation water jacket comprises a liquid inlet and a liquid outlet arranged along a first direction, and the liquid inlet and the liquid outlet are both communicated with the cavity; Along the first direction, the cavity includes a first edge area close to the liquid inlet, a second edge area close to the liquid outlet, and an intermediate area between the first edge area and the second edge area. The density of the barrier structure in the first edge area and the second edge area is greater than the density of the barrier structure in the intermediate area.

2. The water cooling device according to claim 1, characterized in that: The heat dissipation water jacket includes a first side wall and a second side wall arranged opposite to each other along a second direction, the second direction intersects with the first direction, and the blocking structure is formed on the first side wall and the second side wall.

3. The water cooling device according to claim 2, characterized in that: A plurality of rows of heat dissipation columns are formed on the first surface, each row of the heat dissipation columns includes a plurality of heat dissipation columns arranged along a first direction, and projections of the heat dissipation columns in adjacent rows along the second direction do not overlap.

4. The water cooling device according to claim 3, characterized in that: A plurality of the barrier structures arranged along the first direction are formed on the first sidewall, and a plurality of the barrier structures arranged along the first direction are formed on the second sidewall; In a row of the heat dissipation columns close to the first side wall, the orthographic projections of the heat dissipation columns on the first side wall do not overlap with the barrier structure provided on the first side wall; In a row of the heat dissipation columns close to the second side wall, the orthographic projections of the heat dissipation columns on the second side wall do not overlap with the blocking structure provided on the second side wall.

5. The water cooling device according to claim 4, characterized in that: In a row of the heat dissipation columns close to the first side wall, a center line of the barrier structure provided on the first side wall coincides with a symmetry line of the heat dissipation columns located on both sides of the barrier structure along the first direction; In a row of the heat dissipation columns close to the second side wall, a center line of the barrier structure disposed on the second side wall coincides with a symmetry line of the heat dissipation columns located on both sides of the barrier structure along the first direction.

6. The water cooling device according to claim 3, characterized in that: A plurality of the barrier structures arranged along the first direction are formed on the first sidewall, and a plurality of the barrier structures arranged along the first direction are formed on the second sidewall; In a row of the heat dissipation columns close to the first side wall, the projections of the heat dissipation columns and the barrier structure provided on the first side wall in the first direction overlap; in a row of the heat dissipation columns close to the second side wall, the projections of the heat dissipation columns and the barrier structure provided on the second side wall in the first direction overlap; or, Along the second direction, adjacent heat dissipation columns have a first preset distance, and adjacent heat dissipation columns have a second preset distance from the barrier structure, and the first preset distance is greater than the second preset distance.

7. The water cooling device according to claim 1, characterized in that: The length direction of the heat dissipation column is parallel to the arrangement direction of the heat dissipation substrate and the heat dissipation water jacket. The barrier structure is in the shape of an elongated strip, and the length direction of the barrier structure is the same as the length direction of the heat dissipation column.

8. The water cooling device according to claim 7, characterized in that: The cross-section of the barrier structure perpendicular to its length direction is in the shape of a rectangle, an arc or a triangle.

9. The water cooling device according to claim 7, characterized in that: The barrier structure includes a first sub-section and a second sub-section, with a preset gap between the first sub-section and the second sub-section. The barrier structure includes a connecting end connected to the inner wall of the cavity and a free end opposite the connecting end. The preset gap gradually decreases from the connecting end to the free end. The first sub-section and the second sub-section each include an outer surface facing away from the preset gap. The distance between the outer surface of the first sub-section and the outer surface of the second sub-section gradually decreases from the connecting end to the free end. In the barrier structure, the maximum distance between the first sub-portion and the second sub-portion is greater than or equal to the distance between adjacent barrier structures.

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