Preparation Process of Structural Ceramic Arm Parts for Semiconductor Equipment

Abstract

The present invention discloses a preparation process for a structural ceramic arm part of semiconductor equipment. The key technical points are as follows: It includes the following steps: Fix the 1-mm-thick stainless steel plate that has been drilled at the lower part and around according to the blank size with fastening screws, and use PE high-pressure film sealed by plastic packaging for powder filling inside and start vibration; then evacuate and seal the powder filling part, and then add a layer of PPH rubber and plastic plate with uniformly drilled holes in the middle; carry out canning and sealing in the same way for the upper part, with a total of four layers. After completion, fasten the upper stainless steel plate, and adopt the method of single-layer stacking with a perforated plate in the middle to solve the problem of blocked pressure conduction and ensure the overall and micro-region uniformity of the green body; machine the pressed green body according to the drawing, and stack and sinter the machined green body. The present invention adopts the method of single-layer filling with an opening gasket, which can make the pressure evenly transmit to each part of the blank body to ensure the overall and micro-region uniformity of the blank body.

Description

Technical Field

[0001] The present invention relates to the field of semiconductors, and particularly to a preparation process for a structural ceramic arm part of semiconductor equipment. Background Art

[0002] With the adjustment of national policies for the semiconductor equipment manufacturing industry, the semiconductor industry has developed rapidly, the industrial scale has increased rapidly, semiconductor manufacturing equipment has continued to evolve towards precision and complexity, and the technical requirements for high-precision ceramic key components have also become higher and higher. However, most large key precision components rely on imports, which severely restricts the development of the domestic semiconductor industry. Among many structural ceramic materials, the ceramic arm used for semiconductor equipment matching has the advantages of high mechanical strength, high melting point, excellent chemical stability, large resistivity, acid and alkali resistance, corrosion resistance, good insulation performance, etc. As a ceramic manipulator arm, it plays a role in handling in semiconductor equipment, equivalent to the hand of a semiconductor equipment, responsible for transporting wafer silicon wafers to designated positions. However, most of these large structural ceramic arm parts rely on imports from countries such as Japan and South Korea, which severely restricts the development of China's semiconductor industry. For this reason, we have consulted foreign structural ceramic preparation technologies and combined with our preparation process to find out the problems in the process of structural ceramic preparation, such as warping, deformation, and cracking are likely to occur. After analysis, it is found that this phenomenon is caused by the failure to control the relationship between micro-region uniformity and overall uniformity during the preparation process. In the process of structural ceramic preparation, it is necessary to take into account both the micro-region uniformity and the overall uniformity of ceramic components, and control the micro-region uniformity on the premise of ensuring overall uniformity.

[0003] The process of structural ceramic preparation is a process of energy accumulation. Powder preparation increases the surface energy of particles, the forming pressure makes the powder into a dense green body, and heat makes the particles migrate and grow into a dense sintered body. It can be seen that controlling energy can control the preparation process, and controlling process energy means reasonable distribution of energy. It can be seen that the greater the energy accumulated in the forming process, the more conducive to controlling the deformation and shrinkage fluctuations of ceramic parts and the overall uniformity of components.

[0004] For example, the Chinese patent with the publication number CN112123512A discloses a preparation process for functional ceramics, including a bottom plate, a lower die device, and an upper die device. The lower die device is installed at the upper end of the bottom plate, the upper die device is arranged above the lower die device, and the upper die device is installed on the bottom plate. The present invention can solve the problems that when the existing equipment is used for slip casting and forming of functional ceramics, it cannot scrape the ceramic slurry remaining in the equipment, and cannot fill the scraped ceramic slurry into the vacant forming cavity continuously, and the formed ceramics are prone to defects, thus reducing the success rate of ceramic slurry forming, resulting in waste of materials. At the same time, after the ceramic slurry is formed, it cannot be automatically separated, and the formed ceramics are prone to collide with the equipment and be damaged when taken out, thus reducing the integrity of the ceramics and the demoulding effect.

[0005] Another example is the Chinese patent with the existing publication number CN109231838A, which discloses a method for preparing a ceramic handicraft, comprising the following steps: 1) colorant preparation; 2) glaze preparation: weigh 10-16% of the colorant obtained in step 1) and 84-90% of lime glaze, dilute the colorant and lime glaze, mix them evenly and pass them through a 500-mesh sieve to obtain a glaze; 3) soak the unglazed ceramic handicraft in the soaking liquid for 1-2 hours, put it into a cold storage at -10--20°C for 8-12 hours after natural air drying, take it out and place it at room temperature for 12-16 hours, then glaze it, put it into a kiln and calcine it at a temperature of 1000-1200°C to obtain a ceramic handicraft, the soaking liquid is an aqueous solution of medical stone, and the obtained handicraft has bright color, uniform color and is good for human health for long-term use.

[0006] The above patents all have some advantages, but they all have some disadvantages, such as: for the preparation of large-scale structural ceramics, it is key to ensure the overall uniformity and micro-domain uniformity of the green body. Molding and sintering are the key. A good molding method can prepare a ceramic green body with overall and micro-domain uniformity. The above patents have problems with overall uniformity and micro-domain uniformity in the preparation of large-scale parts, which need to be improved. In addition, in today's society with increasingly developed science and technology, especially in the high-end manufacturing industry, high-end intelligent equipment has gradually replaced manual operation, especially in the harsh environment with corrosive, radioactive and toxic work sites, intelligent robots can be competent in such harsh environments. The ceramic arm supporting the intelligent robot has the advantages of high mechanical strength, acid and alkali resistance, corrosion resistance, and good insulation performance. However, in the preparation process of structural ceramics, the arm parts are prone to warping and deformation, and leveling treatment is required. In particular, the large-scale structural ceramic arm parts must increase the thickness of the green body, which brings certain difficulties to the sintering machine processing, seriously affecting the product performance and bringing hidden dangers to production safety. For this reason, the sintering technology of this installation can change this situation, ensure the flatness of structural ceramics, and ensure the performance of the product. The conventional sintering method is to place the machined green body on a homogeneous gasket with good flatness, sprinkle corundum sand and stack them neatly layer by layer. The number of stacking layers will not exceed five layers, especially for ceramic green bodies with a large aspect ratio. Due to their large size, only two or three layers can be placed. Due to the large size of the green body, the temperature field in the furnace is uneven, which is easy to produce stress. At the same time, the surface tension of the upper and lower ends of the green body is different, resulting in cracking and deformation. The upper and lower ends of the green body have different colors due to different temperatures and atmospheres, resulting in color difference. This seriously affects product performance and even causes scrapping, affects production efficiency and increases production costs. Summary of the invention

[0007] In view of the problems mentioned in the background technology, the purpose of the present invention is to provide a process for preparing a semiconductor equipment structural ceramic arm component to solve the problems mentioned in the background technology.

[0008] The above technical object of the present invention is achieved by the following technical solutions:

[0009] A preparation process for a structural ceramic arm part of semiconductor equipment includes the following steps: Fix the lower part and the surroundings of a 1mm-thick stainless steel plate with punched holes according to the blank size using fastening screws, and seal the inner layer with PE high-pressure film for powder filling and start vibration; then evacuate and seal the powder filling part, and then add a layer of PPH rubber and plastic plate with evenly punched holes in the middle; can and seal the upper part in the same way for a total of four layers. After completion, fasten the upper stainless steel plate, and use the method of single-layer stacking with a perforated plate in the middle to solve the problem of blocked pressure conduction and ensure the overall and micro-region uniformity of the green body; machine the pressed green body according to the drawing, stack and sinter the machined green body; when sintering, draw the same-quality gaskets adjusted to the horizontal state according to the size and shape of the green body with a pencil, and evenly sprinkle corundum sand; stack small gaskets evenly in sequence according to the shape of the green body, and also evenly sprinkle corundum sand on the small gaskets to prevent shrinkage blockage, then place the green body on the small gaskets and adjust it well, and sprinkle corundum sand in the same way on the green body, put small gaskets and the green body; stack multiple layers according to the thickness of the green body, and place a same-quality upper gasket with the same shape as the green body on the upper layer of the green body.

[0010] Preferably, after fixing the stainless steel plate, seal the inner layer with PE high-pressure film for powder filling, and the filled powder is high-purity alumina with a mass fraction greater than 99.99%, and then start vibration.

[0011] Preferably, when filling powder with the sealed PE high-pressure film and starting vibration, control the vibration platform to adjust the frequency to 30HZ.

[0012] Preferably, when evacuating and sealing the powder filling part, control the evacuation time to be 180S, and then add a layer of PPH rubber and plastic plate with evenly punched holes in the middle.

[0013] Preferably, after completing the canning and sealing for a total of four layers, fasten the upper stainless steel plate, and then press it by isostatic pressing at 150 MPa.

[0014] Preferably, stack small gaskets evenly in sequence according to the shape of the green body, and the size of the small gaskets is selected as small gaskets with a thickness of 1mm.

[0015] Preferably, when placing a same-quality upper gasket with the same shape as the green body on the upper layer of the green body, evenly distributed small holes are opened in the solid part of the same-quality upper gasket for heat conduction.

[0016] In summary, the present invention mainly has the following beneficial effects:

[0017] First, the present invention adopts the method of single-layer filling and adding perforated gaskets, which can make the pressure evenly transmitted to each part of the green body to ensure the overall and micro-region uniformity of the green body.

[0018] 2. In the present invention, a 1-mm homogeneous small spacer is placed on the spacer in the horizontal state, reducing the hindrance of sintering shrinkage, increasing convective heat transfer, and preventing defects caused by different surface tensions on the upper and lower end faces of the green body, ensuring the flatness and overall performance of the green body.

[0019] 3. The spacer with regular opening holes on the uppermost layer of the green body in the present invention can not only ensure uniform heating of the green body but also prevent the green body from deforming due to the weight of the upper spacer.

[0020] 4. In the conventional stacking method of the present invention, only 3 - 4 layers can be stacked for large-sized thin-walled products and only 2 - 3 layers for thick-walled products. The improved type can achieve multi-layer stacking, ensuring uniform heating, consistent shrinkage, and flatness of the green body.

[0021] 5. The present invention will not cause deformation and cracking due to stress generated by temperature gradient. The upper opening spacer can not only prevent the green body from deforming but also evenly transfer heat, ensuring consistent shrinkage and good flatness of the green body, and realizing the localization of large-scale semiconductor structure ceramics. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a product structure diagram of the present invention;

[0023] Figure 2 It is a structure diagram of the small spacer of the present invention;

[0024] Figure 3 It is a structure diagram of the homogeneous upper spacer of the present invention.

[0025] 2. Product; 3. Small spacer; 4. Homogeneous upper spacer. DETAILED DESCRIPTION OF THE INVENTION

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. Embodiment 1

[0027] Reference Figures 1 to 3, The preparation process of the structural ceramic arm part of semiconductor equipment includes the following steps: Fix the 1mm thick stainless steel plate with holes punched according to the blank size with fastening screws at the lower part and around, and seal the inner layer with PE high-pressure film for powder filling and start vibration; then evacuate and seal the powder filling part, and then add a layer of PPH rubber and plastic plate with evenly punched holes in the middle; close the upper part in the same way for a total of four layers of canning. After completion, fasten the upper stainless steel plate, and adopt the method of single-layer stacking with a perforated plate in the middle to solve the problem of blocked pressure conduction and ensure the overall and micro-region uniformity of the green body; machine the pressed green body according to the drawing, stack and sinter the machined green body; when sintering, draw a good outline of the homogeneous gasket adjusted to the horizontal state according to the size and shape of the green body with a pencil, and evenly sprinkle corundum sand; stack small gaskets 3 evenly in sequence according to the shape of the green body, and also evenly sprinkle corundum sand on the small gaskets 3 to prevent shrinkage blockage, then place the green body on the small gaskets 3 and adjust it well, and sprinkle corundum sand in the same way on the green body, put small gaskets 3 and the green body; stack multiple layers according to the thickness of the green body, and place a homogeneous upper gasket 4 with the same shape as the green body on the upper layer of the green body.

[0028] Among them, after fixing the stainless steel plate, seal the inner layer with PE high-pressure film for powder filling, and the filled powder is high-purity alumina with a mass fraction greater than 99.99%, and then start vibration; when filling powder with the sealed PE high-pressure film and starting vibration, control the vibration platform frequency to 30HZ; when evacuating and sealing the powder filling part, control the evacuation time to 180S, and then add a layer of PPH rubber and plastic plate with evenly punched holes in the middle; after the four-layer canning and sealing are completed, fasten the upper stainless steel plate, and then press it by isostatic pressing at 150 MPa; stack small gaskets 3 evenly in sequence according to the shape of the green body, and the size of the small gaskets 3 is selected as small gaskets 3 with a thickness of 1mm; when placing a homogeneous upper gasket 4 with the same shape as the green body on the upper layer of the green body, evenly distributed small holes are opened in the solid part of the homogeneous upper gasket 4 for heat conduction.

[0029] Among them, the present invention adopts the method of single-layer filling and perforated gasket, which can evenly transmit pressure to each part of the green body to ensure the overall and micro-region uniformity of the green body; on the gasket in the horizontal state, a 1-mm homogeneous small gasket 3 is placed to reduce the hindrance of sintering shrinkage, increase convective heat transfer, and prevent defects caused by different surface tensions at the upper and lower ends of the green body, ensuring the flatness and overall performance of the green body; the gasket with regular opening holes on the uppermost layer of the green body of the present invention can not only ensure uniform heating of the green body, but also prevent the green body from deforming due to the weight of the upper gasket; for large-sized thin-walled products 2, the conventional stacking method can only stack 3-4 layers, and for thick-walled products 2, only 2-3 layers. The improved type can achieve multi-layer stacking, ensuring uniform heating, consistent shrinkage, and flatness of the green body; the present invention will not cause deformation and cracking due to stress generated by temperature gradient. The upper perforated gasket can not only prevent the green body from deforming but also evenly transmit heat, ensuring consistent shrinkage and good flatness of the green body, realizing the localization of large semiconductor structure ceramics. The produced products 2 are shown in Figure 2 。

[0030] Among them, the sintering curve of the product is as follows:

[0031] Segment number Temperature (°C) Time (min) Remarks Segment number 1 Room temperature 240 Evaporation of moisture Segment number 2 150 300 Segment number 3 300 120 Segment number 4 300 360 Segment number 5 500 180 Volatilization of organic matter Segment number 6 500 1200 Segment number 7 1300 180 Phase transformation of α-Al2O3 Segment number 8 1300 360 Segment number 9 1500--1555 240-360 Grain growth and increased density Segment number 10 1500-1555 120 Segment number 11 1300 -121 Segment number 12 Segment number 13 Segment number 14 Segment number 15

[0032] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. Preparation process of a structural ceramic arm component for semiconductor equipment, characterized in that: It includes the following steps: Fix the lower part and the periphery of the 1-mm-thick perforated stainless steel plate according to the blank size with fastening screws, seal the inner layer with plastic-sealed PE high-pressure film for powder filling and start vibration; then evacuate and seal the powder filling place, and then add a layer of evenly perforated PPH rubber and plastic board in the middle; can and seal the upper part in the same way for a total of four layers. After completion, fasten the upper stainless steel plate, and adopt the method of single-layer stacking with a perforated plate in the middle to solve the problem of blocked pressure conduction and ensure the overall and micro-region uniformity of the green body; machine the pressed green body according to the drawing, stack and sinter the machined green body; when sintering, draw the same-quality gasket adjusted to the horizontal state with a pencil according to the size and shape of the green body, and evenly sprinkle corundum sand; stack small gaskets (3) evenly in sequence according to the shape of the green body, and evenly sprinkle corundum sand on the small gaskets (3) to prevent shrinkage blockage, then place the green body on the small gaskets (3) and adjust it well, and sprinkle corundum sand in the same way on the upper part of the green body, put small gaskets (3) and the green body; stack multiple layers according to the thickness of the green body, and place a same-quality upper gasket (4) with the same shape as the green body on the upper layer of the green body.

2. The preparation process of the semiconductor equipment structural ceramic arm part according to claim 1, characterized in that: After fixing the stainless steel plate, seal the inner layer with plastic-sealed PE high-pressure film for powder filling. The filled powder is high-purity alumina with a mass fraction greater than 99.99%, and then start vibration.

3. The preparation process of the structural ceramic arm piece of the semiconductor equipment according to claim 1, characterized in that: When filling powder with the plastic-sealed PE high-pressure film and starting vibration, control the vibration platform to adjust the frequency to 30HZ.

4. The preparation process of the structural ceramic arm part of the semiconductor equipment according to claim 1, characterized in that: When evacuating and sealing the powder filling place, control the evacuation time to be 180S, and then add a layer of evenly perforated PPH rubber and plastic board in the middle.

5. The preparation process of the structural ceramic arm part of the semiconductor equipment according to claim 1, characterized in that: After the canning and sealing of the four layers are completed, fasten the upper stainless steel plate, and then press it by isostatic pressing at 150 MPa.

6. The preparation process of the structural ceramic arm part of the semiconductor equipment according to claim 1, characterized in that: Stack small gaskets (3) evenly in sequence according to the shape of the green body. The size of the small gaskets (3) is selected as small gaskets (3) with a thickness of 1mm.

7. The preparation process of the structural ceramic arm part of the semiconductor equipment according to claim 1, wherein: When placing a same-quality upper gasket (4) with the same shape as the green body on the upper layer of the green body, evenly distributed small holes are opened in the solid part of the same-quality upper gasket (4) for heat conduction.

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