A curable resin and liquid crystal sealant prepared therefrom

Abstract

The present invention relates to the field of liquid crystal packaging technology, in particular to a curable resin and a liquid crystal sealant prepared therefrom. The structural formula of the curable resin is: wherein R1 is H, glycidyl or methylglycidyl; Y is H or CH3; m is a positive integer of 0 to 2; X is an alkane or alkene with 1 to 20 carbon atoms; Z is an alcohol of an alkane or alkene with 0 to 20 carbon atoms and its epoxy derivative; R2 is H or any of the following structures: or wherein R1 is H, glycidyl or methylglycidyl; Y is H or CH3; m is a positive integer of 0 to 2; n is a positive integer of 0 to 10; and R3 is an alcohol of an alkane or alkene with 0 to 20 carbon atoms and its epoxy derivative.

Description

Technical Field

[0001] The present invention relates to the field of liquid crystal packaging, and in particular to a curable resin and a liquid crystal sealant prepared therefrom. Background Art

[0002] In recent years, with the development of flexible electronic technology in China, various new flexible liquid crystal displays have emerged. These flexible liquid crystal displays use soft substrates such as plastic films instead of traditional rigid glass substrates for manufacturing.

[0003] Conventional liquid crystal sealants are relatively rigid cured products, making them suitable for bonding substrates with minimal shape change, such as glass. However, existing products are not suitable for flexible displays formed on flexible substrates such as films because they can break or peel due to shape changes caused by bending or substrate shrinkage, making them unsuitable.

[0004] CN113168055A discloses a cured polymer composition containing a flexible skeleton, which exhibits excellent flexible responsiveness. CN112063350A discloses a composition containing a resin modified by the addition of liquid 1,2-polybutadiene, which can enhance adhesion and water resistance. CN107267117A discloses a curable resin and a liquid crystal sealant composition containing the same. The curable resin can form a flexible cured product that can maintain adhesion even when a flexible liquid crystal display is bent. The curable resin also exhibits low liquid crystal contamination and is less likely to affect liquid crystal orientation.

[0005] However, all of the aforementioned patents utilize a flexible backbone-modified epoxy resin or its modified epoxy resin acrylate as the primary curing oligomer. While the cured compositions are flexible, they suffer from long distances between crosslinking points, low crosslink density, and a significantly reduced Tg. This negatively impacts the sealant's moisture permeability. Similarly, an excessively low Tg also reduces the heat resistance of the cured product. A low heat deformation temperature can lead to diffusion of uncured components during thermal curing, posing a risk of liquid crystal contamination.

[0006] Therefore, developing a new curable resin and a liquid crystal sealant prepared therefrom has become one of the technical problems that need to be solved urgently in this field. Summary of the Invention

[0007] An object of the present invention is to provide a curable resin and a liquid crystal sealant prepared therefrom.

[0008] To achieve the above object, the present invention provides the following technical solutions:

[0009] A curable resin having the structural formula

[0010] Wherein, R1 is H, glycidyl or methylglycidyl;

[0011] Y is H or CH3;

[0012] m is a positive integer from 0 to 2;

[0013] X is an alkane or alkene of 1 to 20 carbon atoms;

[0014] Z is an alcohol or olefin with 0 to 20 carbon atoms and its epoxy derivatives;

[0015] R2 is H or any of the following structures:

[0016]

[0017] Wherein, R1 is H, glycidyl or methylglycidyl;

[0018] Y is H or CH3;

[0019] m is a positive integer from 0 to 2;

[0020] n is a positive integer from 0 to 10;

[0021] R3 is an alcohol or an alkane or alkene with 0 to 20 carbon atoms and its epoxy derivative.

[0022] Furthermore, it is an acryloyl curable resin or a methacryloyl curable resin, which is formed by introducing an acryloyl group or a methacryloyl group into at least a part of the epoxy group, hydroxyl group and unsaturated bond of the curable resin represented by the following formula (1);

[0023]

[0024] Wherein, R1 is H, glycidyl or methylglycidyl;

[0025] Y is H or CH3;

[0026] m is a positive integer from 0 to 2;

[0027] X is an alkane or alkene of 1 to 20 carbon atoms;

[0028] Z is an alcohol or olefin with 0 to 20 carbon atoms and its epoxy derivatives;

[0029] R2 is H or any of the following structures:

[0030]

[0031] Wherein, R1 is H, glycidyl or methylglycidyl;

[0032] Y is H or CH3;

[0033] m is a positive integer from 0 to 2;

[0034] n is a positive integer from 0 to 10;

[0035] R3 is an alcohol or an alkane or alkene with 0 to 20 carbon atoms and its epoxy derivative.

[0036] Alternatively, an acryloyl group or a methacryloyl group is introduced into all of the epoxy groups, hydroxyl groups and unsaturated bonds of the curable resin represented by the following formula (1);

[0037]

[0038] Wherein, R1 is H, glycidyl or methylglycidyl;

[0039] Y is H or CH3;

[0040] m is a positive integer from 0 to 2;

[0041] X is an alkane or alkene of 1 to 20 carbon atoms;

[0042] Z is an alcohol or olefin with 0 to 20 carbon atoms and its epoxy derivatives;

[0043] R2 is H or any of the following structures:

[0044]

[0045] Wherein, R1 is H, glycidyl or methylglycidyl;

[0046] Y is H or CH3;

[0047] m is a positive integer from 0 to 2;

[0048] n is a positive integer from 0 to 10;

[0049] R3 is an alcohol or an alkane or alkene with 0 to 20 carbon atoms and its epoxy derivative.

[0050] The curable resin of formula (1) includes one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, hydrogenated bisphenol A epoxy resin, phenol novolac epoxy resin, aliphatic epoxy resin, cresol novolac epoxy resin, glycidyl ester epoxy resin, triphenylmethane epoxy resin, epoxidized olefin epoxy resin, naphthol aralkyl epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, DCPD novolac epoxy resin, alkylene novolac epoxy resin, bisphenol Z epoxy resin, biphenyl-containing epoxy resin, and linear phenolic resin.

[0051] The long carbon epoxy in formula (1) includes one or more of methyl glycidyl ether, ethylene glycol glycidyl ether, diglycidyl ether, propenyl glycidyl ether, benzyl glycidyl ether, polyethylene glycol glycidyl ether, glycerol glycidyl ether, trimethylolpropane glycidyl ether, glycidol, carbon dodecanol epoxy, carbon tridecanol epoxy, and carbon tetradecanol epoxy.

[0052] Furthermore, it is a mixture of epoxy resin A containing a long alkyl group or epoxy resin B containing an unsaturated long alkyl group and epoxy resin C containing multiple benzene rings, and the specific structural formula is as follows:

[0053]

[0054] Wherein, R and R1 are arbitrary groups, such as alkanes, alkenes, aromatic hydrocarbons, compounds containing benzene rings, heterocycles, etc.

[0055] A method for preparing a curable resin comprises adding an epoxy alcohol of a long carbon chain alkane or olefin and an acid or anhydride compound to a four-necked flask equipped with a stirrer, stirring and mixing at 100-120° C., reacting for 2-3 hours, adding an epoxy compound, and obtaining a curable resin under the action of a catalyst and a polymerization inhibitor or a catalyst.

[0056] Specifically, the epoxy alcohol of the long carbon chain alkane reacts with an acid or an acid anhydride compound to obtain an intermediate a; the epoxy alcohol of the long carbon chain hydrocarbon reacts with an acid or an acid anhydride compound to obtain an intermediate b; the intermediate a reacts with the epoxy compound in the presence of a catalyst and a polymerization inhibitor to obtain a curable resin c; the intermediate b reacts with the epoxy compound in the presence of a catalyst and a polymerization inhibitor to obtain a curable resin d.

[0057] Alternatively, the epoxy novolac reacts with an acid or anhydride compound to obtain an intermediate e, and the intermediate e reacts with an epoxy compound to obtain a curable resin f.

[0058] Furthermore, the reaction formulas for synthesizing the intermediate a, intermediate b, curable resin c, curable resin d, intermediate e and curable resin f are shown in the following formulas (1) to (6), respectively:

[0059]

[0060] Wherein, R and R1 are arbitrary groups, such as alkanes, alkenes, aromatic hydrocarbons, compounds containing benzene rings, heterocycles, etc.

[0061] A liquid crystal sealant is prepared by reacting the above-mentioned curable resin, filler, photoinitiator, curing agent and coupling agent.

[0062] The preparation method of the liquid crystal sealant of the present invention comprises the following steps: adding a photoinitiator, a filler, a curing agent, a coupling agent and an epoxy resin to a curable resin under light-proof conditions, controlling the temperature at 25° C. to stir uniformly, and grinding on a three-roll grinder to uniformly disperse the materials to obtain a liquid crystal sealant.

[0063] Compared with the prior art, the present invention has the following beneficial effects:

[0064] The special structure of the curable resin of the present invention contains multiple benzene rings and unsaturated long alkyl side chains, which makes it have higher flexibility than bisphenol A epoxy resin. While improving flexibility, impact resistance and high adhesion, it also increases the Tg of the resin and increases water resistance, achieving the effect of preventing moisture from entering the display screen during reliability testing. It also has low-temperature resistance. DETAILED DESCRIPTION

[0065] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0066] Example 1 Curable Resin 1

[0067] In a four-necked flask equipped with a stirrer, condenser, and glass tee, add 57g of C12-epoxy alcohol and 41.5g of terephthalic acid. Stir and dissolve at 100-120°C. After 2-3 hours of reaction, add 79g of bisphenol F epoxy resin and 0.3g of triphenylphosphine as a catalyst. Keep the reaction at 120°C and test the acid value. When the acid value drops to 1mg / g, curable resin 1 is obtained. The reaction equation is as follows:

[0068]

[0069] Example 2 Curable Resin 2

[0070] In a four-necked flask equipped with a stirrer, condenser, and glass tee, add 57g of C12-epoxy alcohol and 41.5g of terephthalic acid. Stir and dissolve at 100-120°C. After 2-3 hours of reaction, add 39.5g of bisphenol F epoxy resin and 0.3g of triphenylphosphine as a catalyst. Keep the reaction at 120°C and test the acid value. When the acid value drops to 1mg / g, curable resin 2 is obtained. The reaction equation is as follows:

[0071]

[0072] Example 3 Curable Resin 3

[0073] In a four-necked flask equipped with a stirrer, a condenser, and a glass tee, add 84.5 g of unsaturated fatty acid glycidyl ester and 41.5 g of terephthalic acid, stir and dissolve at 100-120°C, react for 2-3 hours, then cool to 100°C, add 39.5 g of bisphenol F epoxy resin, 0.3 g of triphenylphosphine, and a polymerization inhibitor, keep the reaction warm, and monitor the acid value. When the acid value drops to 1 mg / g, a curable resin 3 is obtained. The structural formula of the reactant is as follows:

[0074]

[0075] Example 4 Curable Resin 4

[0076] In a four-necked flask equipped with a stirrer, a condenser, and a glass tee, 84.5 g of unsaturated fatty acid glycidyl ester and 41.5 g of terephthalic acid were added and dissolved with stirring at 100-120°C. After reacting for 2-3 hours, the temperature was lowered to 100°C, and 39.5 g of bisphenol F epoxy resin, 0.3 g of triphenylphosphine, and a polymerization inhibitor were added. The reaction was kept warm and the acid value was monitored. When the acid value dropped to 1 mg / g, curable resin 4 was obtained. The structural formula of the reactant is as follows:

[0077]

[0078] Example 5 Curable Resin 5

[0079] In a four-necked flask equipped with a stirrer, a condenser, and a glass tee, 118.5 g of linear phenolic epoxy resin and 41.5 g of terephthalic acid were added and dissolved with stirring at 130°C. After reacting for 2-3 hours, the temperature was lowered to 100°C, and 234 g of bisphenol F epoxy resin, 0.9 g of triphenylphosphine, and a polymerization inhibitor were added. The temperature was kept to react, and the acid value was monitored. When the acid value dropped to 1 mg / g, curable resin 5 was obtained. The structural formula of the reactant is as follows:

[0080]

[0081] Example 6

[0082] 80 parts by weight of NPEF-170 epoxy resin, 20 parts by weight of curable resin 1, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer and mixed evenly. The mixture was then ground using a three-roll grinder to obtain the liquid crystal sealant of Example 6.

[0083] Example 7

[0084] 80 parts by weight of NPEF-170 epoxy resin, 20 parts by weight of curable resin 2, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer and mixed evenly. The mixture was then ground using a three-roll grinder to obtain the liquid crystal sealant of Example 7.

[0085] Example 8

[0086] 80 parts by weight of NPEF-170 epoxy resin, 20 parts by weight of curable resin 3, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer and mixed evenly. The mixture was then ground using a three-roll grinder to obtain the liquid crystal sealant of Example 8.

[0087] Example 9

[0088] 80 parts by weight of NPEF-170 epoxy resin, 20 parts by weight of curable resin 4, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer and mixed uniformly. The mixture was then ground using a three-roll grinder to obtain the liquid crystal sealant of Example 9.

[0089] Example 10

[0090] 80 parts by weight of NPEF-170 epoxy resin, 20 parts by weight of curable resin 5, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer and mixed uniformly. The mixture was then ground using a three-roll grinder to obtain the liquid crystal sealant of Example 10.

[0091] Example 11

[0092] 70 parts by weight of NPEF-170 epoxy resin, 5 parts by weight of curable resin 1, 5 parts by weight of curable resin 2, 5 parts by weight of curable resin 3, 5 parts by weight of curable resin 4, 5 parts by weight of curable resin 5, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer, mixed uniformly, and then ground using a three-roll grinder. The resulting product is the liquid crystal sealant of Example 11.

[0093] Example 12

[0094] 70 parts by weight of NPEF-170 epoxy resin, 8 parts by weight of curable resin 1, 8 parts by weight of curable resin 2, 8 parts by weight of curable resin 3, 8 parts by weight of curable resin 4, 3 parts by weight of curable resin 5, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer, mixed uniformly, and then ground using a three-roll grinder. The resulting product is the liquid crystal sealant of Example 12.

[0095] Example 13

[0096] 70 parts by weight of NPEF-170 epoxy resin, 10 parts by weight of curable resin 1, 5 parts by weight of curable resin 2, 8 parts by weight of curable resin 3, 5 parts by weight of curable resin 4, 3 parts by weight of curable resin 5, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer, mixed uniformly, and then ground using a three-roll grinder. The resulting product is the liquid crystal sealant of Example 13.

[0097] Comparative Example 1

[0098] 100 parts by weight of NPEF-170 epoxy resin, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer, mixed evenly, and then ground with a three-roll grinder. The resulting product is the liquid crystal sealant of Comparative Example 1.

[0099] Comparative Example 2

[0100] 100 parts by weight of NPEL-127 epoxy resin, 15 parts by weight of filler silica, 20 parts by weight of organic filler EP-4520S, 20 parts by weight of curing agent PN-40J, 1.5 parts by weight of photoinitiator OXE-01, and 2.5 parts by weight of coupling agent KH570 were added to a double planetary mixer, mixed evenly, and then ground with a three-roll grinder. The resulting product is the liquid crystal sealant of Comparative Example 2.

[0101] Test method:

[0102] Stability test: Take 0.1g of each of the prepared examples and comparative examples and place them in the tray of a cone-plate viscometer. At a constant temperature of 25°C, measure the viscosity at 2.5rpm and record the value. Store the remaining liquid crystal sealant in a black ink bottle and store it in a constant temperature device at 25°C for seven days. After seven days, monitor the viscosity at 25°C and 2.5rpm. Compare it with the initial viscosity. An increase of no more than 10% is recorded as An increase of 10%-20% is marked as □, and an increase of more than 20% is marked as

[0103] Strength test: Use a dispenser to evenly apply the liquid crystal sealant prepared in the embodiment and comparative example between two pieces of ITO glass or ITO glass coated with an alignment film, and apply pressure to make them fit together. Keep the diameter of the glue point at 1.5mm after fitting. Use 420mW / cm 2 The specimens were irradiated with ultraviolet light for 60 seconds and then thermally cured at 120°C for 50 minutes to obtain strength test pieces. The strength of the test pieces was tested on a tensile testing machine equipped with a pin-type fixture. The measured force was 50 N / mm. 2 The above is recorded as The measured force is 30-50N / mm 2 The space between them is marked as □, and the measured force is less than 30N / mm 2 Recorded as

[0104] Water vapor permeability test:

[0105] The liquid crystal sealants prepared in Examples and Comparative Examples were coated with a coater to form a smooth sheet with a thickness of 250 μm. 2 Irradiate with ultraviolet light for 60 seconds and heat cure at 120℃ for 50 minutes to obtain moisture permeability test piece. According to ASTM E96 method, measure in a constant temperature and humidity device at 60℃. Monitor the data after 3 days and record the moisture permeability. 2 ·24h is recorded as The moisture permeability is 10-20g / m 2·24 hours is marked as □, and the moisture permeability is greater than 20g / m 2 ·24h is recorded as

[0106] The test results are shown in the following table.

[0107]

[0108]

[0109] The above test results demonstrate that curing resins containing multiple benzene rings and long unsaturated olefin side chains offer greater flexibility and enhanced bonding strength compared to bisphenol A epoxy resins, while maintaining minimal stability. Furthermore, these curing resins increase the rigidity ratio and crosslink density, thereby raising the resin's Tg and achieving excellent moisture barrier properties during reliability testing.

[0110] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A curable resin, characterized in that: Its structural formula is （1）， Wherein, R1 is H, glycidyl or methylglycidyl; Y is H or CH3; m is a positive integer from 0 to 2; X is an alkane or alkene with 1 to 20 carbon atoms; Z is an alcohol or olefin with 0 to 20 carbon atoms and its epoxy derivatives; R2 is H or any of the following structures: (2) or (3), Wherein, R1 is H, glycidyl or methylglycidyl; Y is H or CH3; m is a positive integer from 0 to 2; n is a positive integer from 0 to 10; R3 is an alcohol or an alkane or alkene with 0 to 20 carbon atoms and its epoxy derivatives.

2. The curable resin according to claim 1, wherein: The acrylate curable resin or methacrylate curable resin is formed by introducing an acrylate group or a methacrylate group into at least a part of the epoxy group, hydroxyl group and unsaturated bond of the curable resin represented by the following formula (1); （1）， Wherein, R1 is H, glycidyl or methylglycidyl; Y is H or CH3; m is a positive integer from 0 to 2; X is an alkane or alkene with 1 to 20 carbon atoms; Z is an alcohol or olefin with 0 to 20 carbon atoms and its epoxy derivatives; R2 is H or any of the following structures: (2) or (3), Wherein, R1 is H, glycidyl or methylglycidyl; Y is H or CH3; m is a positive integer from 0 to 2; n is a positive integer from 0 to 10; R3 is an alcohol or an alkane or alkene with 0 to 20 carbon atoms and its epoxy derivatives.

3. The curable resin according to claim 1, wherein: It is an acryloyl curable resin or a methacryloyl curable resin, which is formed by introducing acryloyl groups or methacryloyl groups into all of the epoxy groups, hydroxyl groups and unsaturated bonds of the curable resin represented by the following formula (1); （1）， Wherein, R1 is H, glycidyl or methylglycidyl; Y is H or CH3; m is a positive integer from 0 to 2; X is an alkane or alkene with 1 to 20 carbon atoms; Z is an alcohol or olefin with 0 to 20 carbon atoms and its epoxy derivatives; R2 is H or any of the following structures: (2) or (3), Wherein, R1 is H, glycidyl or methylglycidyl; Y is H or CH3; m is a positive integer from 0 to 2; n is a positive integer from 0 to 10; R3 is an alcohol or an alkane or alkene with 0 to 20 carbon atoms and its epoxy derivatives.

4. The curable resin according to any one of claims 1 to 3, characterized in that: One or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, hydrogenated bisphenol A epoxy resin, phenol novolac epoxy resin, aliphatic epoxy resin, cresol novolac epoxy resin, glycidyl ester epoxy resin, triphenylmethane epoxy resin, epoxidized olefin epoxy resin, naphthol aralkyl epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, DCPD novolac epoxy resin, alkylene novolac epoxy resin, bisphenol Z epoxy resin, biphenyl-containing epoxy resin, and linear phenolic resin are inserted into the polymer molecular segment of the curable resin of formula (1) in the form of segment / block.

5. The curable resin according to claim 4, wherein: It is a mixture of epoxy resin A containing a long alkyl group or epoxy resin B containing an unsaturated long alkyl group and epoxy resin C containing multiple benzene rings. The specific structural formula is as follows: ， Wherein, R and R1 are arbitrary groups.

6. The curable resin according to any one of claims 1 to 3, characterized in that: The alcohol of the 0-20 carbon alkane or alkene and its epoxy derivative include one or more of methyl glycidyl ether, ethylene glycol glycidyl ether, diglycidyl ether, propenyl glycidyl ether, benzyl glycidyl ether, polyethylene glycol glycidyl ether, glycerol glycidyl ether, trimethylolpropane glycidyl ether, glycidol, carbon dodecanol epoxy, carbon tridecanol epoxy, and carbon tetradecanol epoxy.

7. The curable resin according to claim 6, wherein: It is a mixture of epoxy resin A containing a long alkyl group or epoxy resin B containing an unsaturated long alkyl group and epoxy resin C containing multiple benzene rings. The specific structural formula is as follows: ， Wherein, R and R1 are arbitrary groups.

8. A method for preparing a curable resin, characterized in that: Add epoxy alcohol of long carbon chain alkane or olefin and acid or acid anhydride compound into a four-necked flask equipped with a stirrer, stir and mix at 100-120°C, react for 2-3 hours, then add epoxy compound, and obtain curable resin under the action of catalyst and polymerization inhibitor or catalyst; Specifically, the epoxy alcohol of the long carbon chain alkane reacts with an acid or an acid anhydride compound to obtain an intermediate a; the epoxy alcohol of the long carbon chain olefin reacts with an acid or an acid anhydride compound to obtain an intermediate b; the intermediate a reacts with the epoxy compound in the presence of a catalyst and a polymerization inhibitor to obtain a curable resin c; the intermediate b reacts with the epoxy compound in the presence of a catalyst and a polymerization inhibitor to obtain a curable resin d. Alternatively, the novolac epoxy resin reacts with an acid or anhydride compound to obtain an intermediate e, and the intermediate e reacts with an epoxy compound to obtain a curable resin f.

9. The method for preparing a curable resin according to claim 8, wherein: The reaction formulas for synthesizing the intermediate a, intermediate b, curable resin c, curable resin d, intermediate e, and curable resin f are shown in the following formulas (1) to (6), respectively. ， Wherein, R and R1 are arbitrary groups.

10. A liquid crystal sealant prepared using the curable resin according to any one of claims 1 to 7, characterized in that: The invention is prepared by reacting the curable resin according to any one of claims 1 to 7, a filler, a photoinitiator, a curing agent and a coupling agent.

11. The method for preparing the liquid crystal sealant according to claim 10, characterized in that: In a light-proof condition, a photoinitiator, a filler, a curing agent, a coupling agent and an epoxy resin are added to the curable resin, the temperature is controlled at 25° C. and stirred evenly, and the mixture is ground on a three-roll grinder to uniformly disperse the materials to obtain a liquid crystal sealant.

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