Method, device, air conditioner and storage medium for air conditioner control

Abstract

This application relates to the technical field of intelligent air conditioners, and discloses a method, device, air conditioner and storage medium for air conditioner control. The air conditioner includes: two groups of semiconductor components. The method includes: when the air conditioner starts to operate in the current working mode, controlling the air conditioner to start running, including: when the running time of the air conditioner operating in the current working mode reaches the set start time, if the average operating frequency of the air conditioner compressor is greater than the first set frequency within the set start time, obtaining the first average outdoor temperature value and the first absolute average temperature difference of the air conditioner within the first set duration; determining the first operating frequency of the air conditioner compressor and the first operating state of the current semiconductor component that match the first absolute average temperature difference; controlling the air conditioner compressor to operate at the first operating frequency, and controlling the current semiconductor component to operate at the first operating state according to the first average outdoor temperature value.

Description

Technical Field

[0001] This application relates to the technical field of intelligent air conditioners, for example, to methods, devices, air conditioners, and storage media for air conditioner control. Background Art

[0002] As a common intelligent device for adjusting the temperature and humidity of the indoor environment, air conditioners have been widely used. In related technologies, air conditioners can adopt a vapor compression refrigeration cycle to achieve the adjustment of indoor temperature, which has the advantage of high energy efficiency. However, when cooling at high temperatures or heating at low temperatures, the air conditioner may have problems such as low cooling capacity or heating capacity.

[0003] Currently, two sets of semiconductor components can be added to the air conditioner, and each set of semiconductor components is respectively connected to the indoor unit and the outdoor unit of the air conditioner. In this way, when the air conditioner operates in cooling mode, one set of semiconductor components can be controlled to operate, pre-cooling the inlet pipeline of the evaporator in the indoor unit of the air conditioner, and pre-heating the inlet pipeline of the condenser in the outdoor unit of the air conditioner, thereby increasing the cooling capacity of the air conditioner; when the air conditioner operates in heating mode, the other set of semiconductor components can be controlled to operate, pre-heating the inlet pipeline of the evaporator in the indoor unit of the air conditioner, and pre-cooling the inlet pipeline of the condenser in the outdoor unit of the air conditioner, thereby increasing the heating capacity of the air conditioner, meeting the cooling and heating requirements under harsh working conditions.

[0004] It can be seen that after the air conditioner is configured with two sets of semiconductor components, the cooling capacity or heating capacity of the air conditioner can be improved by controlling the operation of the semiconductor components, meeting the cooling and heating requirements under harsh working conditions. However, due to material limitations, after the semiconductor components are connected and operated for a long time, the cooling or heating efficiency decreases and the reliability decreases. As a result, the operation efficiency and reliability of the air conditioner are affected, and running the semiconductor components for a long time will cause the power consumption of the air conditioner to be relatively large. Summary of the Invention

[0005] To provide a basic understanding of some aspects of the disclosed embodiments, a simple summary is given below. This summary is not a comprehensive review, nor is it intended to identify key / important elements or delineate the scope of protection of these embodiments, but rather serves as a preface to the subsequent detailed description.

[0006] Embodiments of the present disclosure provide a method, a device, an air conditioner, and a storage medium for air conditioner control to solve the technical problem of excessive power consumption of the air conditioner under harsh working conditions. The air conditioner includes two sets of semiconductor components.

[0007] In some embodiments, the method includes:

[0008] When the operating time of the air conditioner running in the current operating mode reaches the set start time, if the average operating frequency of the air conditioner compressor is greater than the first set frequency within the set start time, obtain the first average indoor temperature value and the first average outdoor temperature value of the air conditioner running in the current operating mode within the first set duration, and obtain the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value;

[0009] Determine the first operating frequency of the air conditioner compressor that matches the first absolute average temperature difference, and the first operating state of the current semiconductor component, where the current semiconductor component matches the current operating mode;

[0010] Control the air conditioner compressor to operate at the first operating frequency, and control the current semiconductor component to operate at the first operating state according to the first average outdoor temperature value.

[0011] In some embodiments, the device for air conditioner control includes a processor and a memory storing program instructions, and the processor is configured to execute the above-mentioned method for air conditioner control when executing the program instructions.

[0012] In some embodiments, the air conditioner includes the above-mentioned device for air conditioner control.

[0013] In some embodiments, the storage medium stores program instructions, and the program instructions execute the above-mentioned method for air conditioner control when running.

[0014] The method, device and air conditioner for air conditioner control provided by the embodiments of the present disclosure can achieve the following technical effects:

[0015] Two groups of semiconductor components are configured in the air conditioner, and when the air conditioner starts running in the current operating mode and reaches the set start time, and the air conditioner compressor keeps running at a high frequency, the operating parameters and states of the air conditioner compressor and the semiconductor components can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value, and the average outdoor temperature value. Thus, the power of the air conditioner can be flexibly controlled, and while improving the cooling capacity or heating capacity of the air conditioner by controlling the operation of the semiconductor components and improving the cooling and heating efficiency, the power consumption of the air conditioner is reduced.

[0016] The above general description and the following description are only exemplary and explanatory, and are not used to limit the present application. Description of the Drawings

[0017] One or more embodiments are exemplarily illustrated by corresponding drawings. These exemplary illustrations and the drawings do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation, and wherein:

[0018] Figure 1 is a schematic structural diagram of an air conditioner provided by an embodiment of the present disclosure;

[0019] Figure 2 is a schematic flowchart of a method for controlling an air conditioner provided by an embodiment of the present disclosure;

[0020] Figure 3-1 is a schematic flowchart of a method for controlling an air conditioner provided by an embodiment of the present disclosure;

[0021] Figure 3-2 is a schematic flowchart of a method for controlling an air conditioner provided by an embodiment of the present disclosure;

[0022] Figure 4 is a schematic structural diagram of a device for controlling an air conditioner provided by an embodiment of the present disclosure;

[0023] Figure 5 is a schematic structural diagram of a device for controlling an air conditioner provided by an embodiment of the present disclosure;

[0024] Figure 6 is a schematic structural diagram of a device for controlling an air conditioner provided by an embodiment of the present disclosure. Detailed Description of the Embodiment

[0025] In order to more fully understand the features and technical content of the embodiments of the present disclosure, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for reference and illustration purposes only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of explanation, numerous details are provided to give a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other instances, well-known structures and devices may be shown in a simplified manner to simplify the drawings.

[0026] The terms "first", "second", etc. in the description and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that such data may be interchanged where appropriate so as to implement the embodiments of the present disclosure described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.

[0027] Unless otherwise stated, the term "plurality" means two or more.

[0028] In the embodiments of the present disclosure, the character " / " indicates an "or" relationship between the preceding and following objects. For example, A / B means: A or B.

[0029] The term "and / or" is an associative relationship describing an object, indicating that three relationships can exist. For example, A and / or B means: A or B, or, the three relationships of A and B.

[0030] In the embodiments of the present disclosure, two sets of semiconductor components are added to the air conditioner, and each set of semiconductor components is respectively connected to the indoor unit and the outdoor unit of the air conditioner. In this way, the refrigerating capacity or heating capacity of the air conditioner can be improved by controlling the operation of the semiconductor components, which not only meets the refrigeration and heating requirements under harsh working conditions, but also improves the efficiency of the air conditioner for refrigeration and heating.

[0031] Figure 1 It is a schematic structural diagram of an air conditioner provided by the embodiments of the present disclosure. As Figure 1 shown, the air conditioner includes: an indoor unit 100 of the air conditioner, an outdoor unit 200 of the air conditioner, and two sets of semiconductor components, namely a first semiconductor component 310 and a second semiconductor component 320.

[0032] The first refrigerating end 311 of the first semiconductor component 310 is connected to the indoor unit 100 of the air conditioner, and the first heating end 312 of the first semiconductor component 310 is connected to the outdoor unit 200 of the air conditioner.

[0033] The second refrigerating end 321 of the second semiconductor component 320 is connected to the outdoor unit 200 of the air conditioner, and the second heating end 322 of the second semiconductor component 320 is connected to the indoor unit 100 of the air conditioner.

[0034] In the embodiments of the present disclosure, the semiconductor component can utilize the thermoelectric effect of the semiconductor. Connect two metals with different physical properties with a conductor and connect to direct current, and it can achieve a decrease in temperature at one end and an increase in temperature at the other end, which is commonly used for cooling of electronic components and micro heat exchangers. There are multiple sets of hot spot elements inside the semiconductor component, and a refrigeration and heating effect with a hot end of 40 - 50 °C, a cold end of -10 - -20 °C, and a temperature difference of 60 °C can be achieved.

[0035] Among them, after the first semiconductor component 310 starts to operate, there are multiple sets of hot spot elements in the first refrigerating end 311, which can achieve a temperature decrease, while there are also multiple sets of hot spot elements in the first heating end 312, but it can achieve a temperature increase. After the second semiconductor component 320 starts to operate, the two ends can also respectively achieve a temperature decrease and an increase. Among them, there are multiple sets of hot spot elements in the second refrigerating end 321, which can achieve a temperature decrease, while there are also multiple sets of hot spot elements in the second heating end 322, which can achieve a temperature increase.

[0036] In some embodiments, the first semiconductor component 310 and the second semiconductor component 320 can cooperate with the indoor evaporator and the outdoor condenser of the air conditioner to pre-cool and pre-heat the evaporator inlet pipeline and the condenser inlet pipeline respectively. As Figure 1 shown, one end of the first refrigerating end 311 is connected to the evaporator of the indoor unit 100 of the air conditioner through the indoor connector 110, and the other end is connected to one end of the first heating end 312 through the first semiconductor component connecting pipe 313. The other end of the first heating end 312 is connected to the condenser of the outdoor unit 200 of the air conditioner through the outdoor connector 210.

[0037] One end of the second heating end 322 is connected to the evaporator of the indoor unit 100 of the air conditioner through the indoor connector 110, and the other end is connected to one end of the second refrigerating end 321 through the second semiconductor component connecting pipe 323. The other end of the second refrigerating end 321 is connected to the condenser of the outdoor unit 200 of the air conditioner through the outdoor connector 210.

[0038] It can be seen that the two ends of the first semiconductor component and the second semiconductor component are arranged in opposite directions, and opposite temperature changes can be achieved after starting operation. That is, during refrigeration, when the first semiconductor component is turned on, the evaporator inlet pipeline in the indoor unit of the air conditioner can be pre-cooled, while the condenser inlet pipeline in the outdoor unit of the air conditioner can be pre-heated, realizing pre-cooling on the indoor side and pre-heating on the outdoor side; during heating, when the second semiconductor component is turned on, the evaporator inlet pipeline in the indoor unit of the air conditioner can be pre-heated, while the condenser inlet pipeline in the outdoor unit of the air conditioner can be pre-cooled, realizing pre-heating on the indoor side and pre-cooling on the outdoor side. Thus, the indoor cooling capacity can be increased when the outside temperature is high, and the indoor heating capacity can be increased when the outside temperature is low, meeting the refrigeration and heating requirements under harsh working conditions.

[0039] In some embodiments, exhaust fans for strengthening air circulation can be arranged at both ends of the two groups of semiconductor components, which can strengthen the heat exchange between both ends of the semiconductor components and the indoor / outdoor sides, thereby realizing the compensation for the cooling capacity / heating capacity of the system. As Figure 1 shown, the air conditioner may further include: four exhaust fans; wherein, the first exhaust fan 410 is located on the first refrigerating end 311, the second exhaust fan 420 is located on the first heating end 312, the third exhaust fan 430 is located on the second heating end 322, and the fourth exhaust fan 440 is located on the second refrigerating end 321.

[0040] Of course, in some embodiments, the air conditioner may also have only one, two or three exhaust fans, which can be located at any one end of any semiconductor component.

[0041] After the air conditioner is configured with two sets of semiconductor components, or two sets of semiconductor components and their corresponding exhaust fans, the cooling capacity or heating capacity of the air conditioner can be increased by controlling the operation of the semiconductor components, which not only meets the cooling and heating requirements under harsh working conditions, but also improves the cooling and heating efficiency of the air conditioner.

[0042] In the embodiment of the present disclosure, when the air conditioner starts to operate in the current working mode and reaches the set start time, and the air conditioner compressor keeps running at a high frequency, the operating parameters and states of the air conditioner compressor and semiconductor components can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value, and the average outdoor temperature value. That is, when the indoor temperature is far from the target temperature value and the outdoor working condition is harsh, after the compressor runs at a high frequency for a long time, the semiconductor components can be turned on to provide supplementary cooling or heating for the system. Thus, the power of the air conditioner can be flexibly controlled. While increasing the cooling capacity or heating capacity of the air conditioner by controlling the operation of the semiconductor components and improving the cooling and heating efficiency, the power consumption of the air conditioner is reduced.

[0043] Figure 2 It is a schematic flow chart of a method for air conditioner control provided by an embodiment of the present disclosure. The air conditioner can be configured with two sets of semiconductor components, or two sets of semiconductor components and their corresponding exhaust fans as described above. As Figure 2 shown, the process for air conditioner control includes:

[0044] Step 2001: When the running time of the air conditioner operating in the current working mode reaches the set start time, if the average running frequency of the air conditioner compressor is greater than the first set frequency within the set start time, obtain the first average indoor temperature value and the first average outdoor temperature value of the air conditioner operating in the current working mode within the first set duration, and obtain the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value.

[0045] In the embodiment of the present disclosure, the air conditioner starts to operate in the current working mode. At this time, vapor compression operation can be adopted, that is, the operation of the air conditioner compressor is controlled according to the collected indoor and outdoor temperature values. The current working mode can include: cooling, heating, dehumidification and other modes. If the outdoor working condition is relatively harsh, that is, when the outdoor temperature is too high or too low, when the air conditioner operates in the current working mode, the running frequency of the air conditioner compressor is relatively high. If the air conditioner has been operating in the current working mode for a period of time and the running frequency of the air conditioner compressor has been relatively high during this period, at this time, it indicates that the environmental working condition of the air conditioner is relatively harsh, and the corresponding semiconductor components need to be turned on for operation to supplement the cooling or heating capacity required by the air conditioner, so that the indoor temperature value adjusted by the air conditioner can quickly reach the target temperature value.

[0046] It can be seen that a set start time can be preset. After the air conditioner starts and runs until the set start time is reached, the working state of the air conditioner becomes relatively stable. Therefore, the set start time can be determined according to the performance parameters of the air conditioner, and can be 15, 20, 25, 30 minutes, etc. A first set frequency can also be preconfigured, which can be 70%, 80%, 90%, etc. of the highest frequency of the air conditioner compressor.

[0047] If the running time of the air conditioner in the current working mode reaches the set start time, for example, it has run for 20 minutes, it indicates that the air conditioner is in a stable running state. And if the average running frequency of the air conditioner compressor is greater than the first set frequency within the set start time, it means that the air conditioner compressor has been running at a high frequency. At this time, the air conditioner may need to turn on the semiconductor component to perform auxiliary cooling or heating operation. Therefore, the first average indoor temperature value and the first average outdoor temperature value of the air conditioner running in the current working mode within the first set duration can be obtained, and the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value can be obtained.

[0048] In the embodiment of the present disclosure, an indoor temperature acquisition device can be configured in the area where the air conditioner is located, and an outdoor temperature acquisition device is also configured in the outdoor area of the air conditioner. Thus, after the air conditioner runs until the set start time is reached, the indoor temperature values and outdoor temperature values collected by the indoor temperature acquisition device and the outdoor temperature acquisition device within the first set duration can be recorded. Then, according to the recorded indoor temperature values, outdoor temperature values, and the set duration, the first average indoor temperature value Trp1 and the first average outdoor temperature value Taop1 can be obtained. Among them, the set duration can be 1 minute, 5 minutes, 10 minutes, or 15 minutes, etc.

[0049] After obtaining the first average indoor temperature value Trp1, the first absolute average temperature difference │Trp1 - Tset│ between the first average indoor temperature value Trp1 and the target indoor temperature value Tset can be obtained.

[0050] Step 2002: Determine the first running frequency of the air conditioner compressor that matches the first absolute average temperature difference, and the first running state of the current semiconductor component, where the current semiconductor component matches the current working mode.

[0051] Generally, when the air conditioner runs in cooling, heating, dehumidifying and other modes, the larger the first absolute average temperature difference, the greater the required cooling capacity or heating capacity. At this time, it is necessary to start the semiconductor component to run. When the first absolute average temperature difference is relatively small, the air conditioner compressor can simply continue to run in the existing state.

[0052] Since the first cooling end of the first semiconductor component is connected to the indoor unit of the air conditioner, and the first heating end of the first semiconductor component is connected to the outdoor unit of the air conditioner, after the first semiconductor component starts to operate, precooling on the indoor side and preheating on the outdoor side can be achieved; while the second cooling end of the second semiconductor component is connected to the outdoor unit of the air conditioner, and the second heating end of the second semiconductor component is connected to the indoor unit of the air conditioner. Therefore, after the second semiconductor component starts to operate, preheating on the indoor side and precooling on the outdoor side can be achieved.

[0053] It can be seen that according to the connection relationship of the first semiconductor component and the second semiconductor component, the current semiconductor component matching the current working mode can be determined. Among them, when the current working mode is the cooling mode, the current semiconductor component is the first semiconductor component; when the current working mode is the heating mode, the current semiconductor component is the second semiconductor component.

[0054] Therefore, in some embodiments, determining the first operating frequency of the air conditioner compressor matching the first absolute average temperature difference and the first operating state of the current semiconductor component includes: when the first absolute average temperature difference is less than the second set temperature value, determining the obtained operating frequency of the air conditioner compressor as the first operating frequency, and determining the shutdown state as the first operating state of the current semiconductor component; when the first absolute average temperature difference is greater than or equal to the second set temperature value, determining the startup operating state as the first operating state of the current semiconductor component.

[0055] The second set temperature value can be 3.5°C, 4.5°C, 5°C, 5.5°C, etc. In this way, when the air conditioner starts to operate and reaches the set startup time, if the first absolute average temperature difference is greater than or equal to the second set temperature value, for example, when the first absolute average temperature difference │Trp1 - Tset│≥5.5°C, it indicates that the indoor temperature is relatively high. At this time, the corresponding current semiconductor component needs to be turned on for operation, and thus the first operating state of the current semiconductor component can be determined as the startup operating state. If the first absolute average temperature difference is less than the second set temperature value, there is no need to start the current semiconductor component for operation, and only the air conditioner compressor needs to be maintained in operation. Therefore, the obtained operating frequency of the air conditioner compressor can be determined as the first operating frequency, the continuous operation of the air conditioner compressor can be maintained, and the shutdown state can be determined as the first operating state of the current semiconductor component.

[0056] For example, when the air conditioner is operating in the cooling mode, if the first absolute average temperature difference is greater than or equal to the second set temperature value, e.g., │Trp1 - Tset│≥5°C, the first operating state of the first semiconductor component can be determined as the startup operating state. In this way, after starting the first semiconductor component to operate, the evaporator inlet pipeline in the indoor unit of the air conditioner can be precooled, while the condenser inlet pipeline in the outdoor unit of the air conditioner can be preheated. Thus, the cooling capacity of the air conditioner is increased, and the cooling efficiency of the air conditioner is improved. When the air conditioner is operating in the heating mode, if the first absolute average temperature difference is greater than or equal to the second set temperature value, e.g., │Trp1 - Tset│≥5°C, the first operating state of the second semiconductor component can be determined as the startup operating state. In this way, after starting the second semiconductor component to operate, the evaporator inlet pipeline in the indoor unit of the air conditioner can be preheated, while the condenser inlet pipeline in the outdoor unit of the air conditioner can be precooled. Thus, the heating capacity of the air conditioner is increased, and the heating efficiency of the air conditioner is improved.

[0057] Step 2003: Control the air conditioner compressor to operate at the first operating frequency, and control the current semiconductor component to operate in the first operating state according to the first average outdoor temperature value.

[0058] After determining the first operating frequency of the air conditioner compressor and the first operating state of the current semiconductor component, the air conditioner compressor can be controlled to operate at the first operating frequency, and the current semiconductor component can be controlled to operate in the first operating state.

[0059] When the first absolute average temperature difference is greater than or equal to the second set temperature value, the semiconductor component can be continuously controlled to be in the startup operating state. However, due to material limitations, long-term continuous operation of the semiconductor component will reduce the reliability of the components, and long-term operation of the semiconductor will also increase the power consumption of the air conditioner. Therefore, when the first absolute average temperature difference is greater than or equal to the second set temperature value, the operating time of the current semiconductor component in the startup operating state in the air conditioner can be 5, 8, 10, or 15 minutes, etc.

[0060] Alternatively, in some embodiments, the semiconductor component does not operate continuously for a long time. The operating cycle can be set as the unit of operation. During the set operating cycle, the semiconductor component operates for a period of time and stops for the remaining time. That is, the set operating cycle includes: operating time and stop time. For example, the set operating cycle can be 20 minutes. In this way, during the periodic operation of the semiconductor component, it can operate in the manner of stopping for 10 minutes after operating for 10 minutes. At this time, both the operating time and the stop time are 10 minutes. Or, the set operating cycle can be 30 minutes. In this way, during the periodic operation of the semiconductor component, it can operate in the manner of stopping for 10 minutes after operating for 20 minutes, and so on. At this time, the operating time is 20 minutes and the stop time is 10 minutes.

[0061] Therefore, in this embodiment, controlling the current semiconductor component to operate in the first operating state may include: controlling the current semiconductor component matching the current working mode to operate in the first operating state for one cycle. Specifically, it may include: when the first absolute average temperature difference is greater than or equal to the second set temperature value, controlling the current semiconductor component to be in the startup operation state during the operating time of the set operating cycle of the semiconductor component; and controlling the current semiconductor component to be in the shutdown state during the stop time of the set operating cycle of the semiconductor component. For example, when │Trp1 - Tset│≥4.5°C, it is only necessary to control the current semiconductor component to be in the startup operation state within 10 minutes of the 20-minute set operating cycle of the semiconductor component, and then the current semiconductor component can be controlled to be in the shutdown state. That is, the current semiconductor component only needs to be started and operated for 10 minutes and then can be turned off. In this way, by controlling the operation of the semiconductor component, the cooling capacity or heating capacity of the air conditioner is improved, and while the cooling and heating efficiency is improved, the power consumption of the air conditioner is reduced.

[0062] Of course, in some embodiments, the semiconductor can operate periodically. However, it is also possible not to perform periodic control on the current semiconductor component, that is, the time when the current semiconductor component of the air conditioner is in the startup operation state may not be the operating time of the set operating cycle, and specific examples will not be listed here.

[0063] In the embodiments of the present disclosure, the power of the semiconductor component is adjustable, and the corresponding output cooling capacity or heat quantity is also different. Thus, at the same controlled input voltage, according to different controlled input currents, the semiconductor component can output different cooling capacities or heat quantities. In some embodiments, the semiconductor component corresponds to two or more operating gears. The larger the controlled input current of the semiconductor component, the higher the corresponding operating gear and the more output energy. For example, when the controlled input voltage is 220V and the controlled input currents are 0.5A, 1A, and 1.5A respectively, the semiconductor component corresponds to three gears: low, medium, and high. Of course, the semiconductor component may also only correspond to two gears: low and high, and so on.

[0064] It can be seen that in some embodiments, when the current semiconductor component is in the startup and operation state, it can correspond to different operating gears. Therefore, controlling the current semiconductor component to operate in the first operating state includes: when the first absolute average temperature difference is greater than or equal to the second set temperature value, determining the first operating gear of the current semiconductor component corresponding to the first average outdoor temperature value; within the operating time of the set operating cycle of the semiconductor component, controlling the current semiconductor component to operate in the first operating gear. Wherein, the semiconductor component corresponds to two or more operating gears, and the larger the controlled input current of the semiconductor component, the higher the corresponding operating gear. Of course, within the stop time of the set operating cycle of the semiconductor component, the current semiconductor component can be controlled to be in the shutdown state.

[0065] Wherein, determining the first operating gear of the current semiconductor component corresponding to the first average outdoor temperature value includes: when the first average outdoor temperature value is within the first mode temperature range matching the current working mode, determining the first gear as the first operating gear of the current semiconductor component; when the first average outdoor temperature value is within the second mode temperature range matching the current working mode, determining the second gear as the first operating gear of the current semiconductor component; when the first average outdoor temperature value is within the third mode temperature range matching the current working mode, determining the third gear as the first operating gear of the current semiconductor component.

[0066] Wherein, when the current working mode of the air conditioner is different, the corresponding first mode temperature range, second mode temperature range, and third mode temperature range are different, and the controlled input current of the semiconductor component corresponding to the third gear is greater than the controlled input current of the semiconductor component corresponding to the second gear, and the controlled input current of the semiconductor component corresponding to the second gear is greater than the controlled input current of the semiconductor component corresponding to the first gear.

[0067] For example: When the current working mode is the cooling mode, the temperature range of the first mode can be [40, 43), the temperature range of the second mode can be [43, 45), and the temperature range of the third mode can be [45, ∞). In this way, when 40°C ≤ the first average outdoor temperature value Taop1 < 43°C, the first gear can be determined as the first operating gear of the current semiconductor component; when 43°C ≤ Taop1 < 45°C, the second gear can be determined as the first operating gear of the current semiconductor component; and when 45°C ≤ Taop1, the third gear can be determined as the first operating gear of the current semiconductor component.

[0068] When the current working mode is the heating mode, the temperature range of the first mode can be (-7, 0], the temperature range of the second mode can be (-14, -7], and the temperature range of the third mode can be (∞, -14]. In this way, when -7°C < Taop1 ≤ 0°C, the first gear can be determined as the first operating gear of the current semiconductor component; when -14°C < Tao p1 ≤ -7°C, the second gear can be determined as the first operating gear of the current semiconductor component; and when Tao p1 ≤ -14°C, the third gear can be determined as the first operating gear of the current semiconductor component.

[0069] Of course, if the semiconductor component corresponds to two, four, five, etc. operating gears, the first operating gear of the current semiconductor component can also be determined according to the first average outdoor temperature value, which will not be described in detail here.

[0070] After determining the first operating gear of the current semiconductor component, in this way, the current semiconductor component can be controlled to operate at the first operating gear, or within a set time period, the current semiconductor component can be controlled to operate at the first operating gear. In some embodiments, within the operating time of the set operating cycle of the semiconductor component, the current semiconductor component can be controlled to operate at the first operating gear.

[0071] It can be seen that in the embodiments of the present disclosure, when the air conditioner starts the current working mode and runs to the set start time, and the air conditioner compressor keeps running at a high frequency, the operating parameters and states of the air conditioner compressor and the semiconductor component can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value, and the average outdoor temperature value. That is, when the indoor temperature is far from the target temperature value and the outdoor working conditions are harsh, after the compressor runs at a high frequency for a long time, the semiconductor component can be turned on to provide supplementary cooling or heating for the system. Thus, the power of the air conditioner can be flexibly controlled. While improving the cooling or heating capacity of the air conditioner and the cooling and heating efficiency by controlling the operation of the semiconductor component, the power consumption of the air conditioner is reduced. And different first average outdoor temperature values correspond to different operating gears of the semiconductor component, that is, different output energies of the semiconductor component, thereby further accelerating the cooling or heating efficiency of the air conditioner.

[0072] When the running time of the air conditioner operating in the current working mode reaches the set start time, and within the running time of the set running cycle of the semiconductor component, after controlling the current semiconductor component to operate in the first running gear, the air conditioner can be continuously controlled to operate in the vapor compression mode, and the control of the semiconductor component is no longer carried out. However, in order to improve the efficiency of the air conditioner in adjusting the temperature, in some embodiments, after controlling the current semiconductor component to operate in the first running gear, the operation of the current semiconductor component can also be controlled according to the obtained current average indoor temperature value within the current set duration, which may include: when the current semiconductor component is in the shutdown state and the duration of the air conditioner operating in the current mode reaches the preset sampling duration, obtaining the current average indoor temperature value within the current set duration in the area where the air conditioner is located, and obtaining the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value; determining the current operating state of the current semiconductor component matching the current absolute average temperature difference; and controlling the current semiconductor component to operate in the current operating state.

[0073] Within the running time of the set running cycle of the semiconductor component, after controlling the current semiconductor component to operate in the first running gear, the current semiconductor component may be in the shutdown state. At this time, the air conditioner operates in the current mode. When the duration of the air conditioner operating in the current mode reaches the preset sampling duration, the preset sampling duration may be 5, 10, 15, 25 minutes, etc. That is, within the preset sampling duration, the semiconductor component has not been started and operated and is in the shutdown state, and the air conditioner has also been operating in the current working mode. At this time, the indoor temperature value can be continuously sampled, and the indoor temperature values collected by the indoor temperature acquisition device within the set duration are recorded. Then, according to the recorded indoor temperature values and the set duration, the average indoor temperature value can be obtained.

[0074] Of course, after the air conditioner in the embodiment of the present disclosure controls the current semiconductor component to operate in the first running gear, automatic continuous control can be performed. Therefore, the current set duration corresponds to the current average indoor temperature value. Similarly, the set duration may be 1 minute, 5 minutes, 10 minutes, or 20 minutes, etc. In some embodiments, the current set duration may be zero. At this time, the current average indoor temperature value is the real-time current indoor temperature value collected by the indoor temperature acquisition device.

[0075] After obtaining the current average indoor temperature value Trp, the current absolute average temperature difference │Trp - Tset│ between the current average indoor temperature value Trp and the target indoor temperature value Tset can be obtained.

[0076] Then, the current operating state of the current semiconductor component that matches the current absolute average temperature difference can be determined, which may include: when the current absolute average temperature difference is less than the first set temperature value, determining the shutdown state as the current operating state of the current semiconductor component; when the current absolute average temperature difference is greater than or equal to the first set temperature value, determining the startup operating state as the current operating state of the current semiconductor component; wherein, the second set temperature value is greater than or equal to the first set temperature value.

[0077] The first set temperature value can be determined according to the location of the air conditioner, the performance of the air conditioner, etc., and can be 1.5°C, 2°C, 3°C, etc.

[0078] During the current control process, the current semiconductor component can be controlled to be in the shutdown state or the startup operating state. Among them, when the current absolute average temperature difference is greater than or equal to the first set temperature value, the current semiconductor component is controlled to be in the startup operating state only during the operating time of the set operating cycle of the semiconductor component. And during the stop time of the set operating cycle of the semiconductor component, the current semiconductor component is controlled to be in the shutdown state.

[0079] Similarly, during the continuous control process of the semiconductor component, the power of the semiconductor component is adjustable, that is, the semiconductor component corresponds to two or more operating gears. Thus, in some embodiments, when the current semiconductor component is in the startup operating state, it can correspond to different operating gears. Therefore, controlling the current semiconductor component to operate in the current operating state includes: when the current absolute average temperature difference is greater than or equal to the first set temperature value, determining the current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference; during the operating time of the set operating cycle of the semiconductor component, controlling the current semiconductor component to operate in the current operating gear. Among them, the semiconductor component corresponds to two or more operating gears, and the greater the control input current of the semiconductor component, the higher the corresponding operating gear. Of course, during the stop time of the set operating cycle of the semiconductor component, the current semiconductor component can be controlled to be in the shutdown state.

[0080] Among them, determining the current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference includes: when the current absolute average temperature difference is greater than or equal to the first set temperature value and less than the second set temperature value, determining the previous operating gear of the current semiconductor component as the current operating gear of the current semiconductor component; when the current absolute average temperature difference is greater than or equal to the second set temperature value, if the previous operating gear is not the highest gear, performing a gear-up process on the current semiconductor component and determining the raised operating gear as the current operating gear of the current semiconductor component, and if the previous operating gear is the highest gear, determining the highest gear as the current operating gear of the current semiconductor component.

[0081] After controlling the current semiconductor component to operate in the first operating gear, continuous control is performed on the current semiconductor component. Therefore, when controlling the semiconductor component according to the current absolute average temperature difference, the previous operating gear of the current semiconductor component can be obtained, and the current operating gear of the current semiconductor component can be determined according to the current absolute average temperature difference and the previous operating gear.

[0082] For example: when the first set temperature value is 1.5 °C and the second set temperature value is 4.5 °C, if │Trp - Tset│ < 1.5 °C, the current semiconductor component can be controlled to be in the shutdown state. If │Trp - Tset│ ≥ 1.5 °C, the current semiconductor component can be controlled to be in the startup operation state, and among them, when 1.5 °C ≤ │Trp - Tset│ < 4.5 °C, the gear of the current semiconductor component can be maintained unchanged, that is, determining the previous operating gear of the current semiconductor component as the current operating gear of the current semiconductor component; if 4.5 °C ≤ │Trp - Tset│, a gear-up process needs to be performed and the raised operating gear is determined as the current operating gear of the current semiconductor component.

[0083] Among them, if the previous operating gear is not the highest gear, after performing the gear-up process, the raised operating gear is determined as the current operating gear of the current semiconductor component. If the previous operating gear is the highest gear and cannot be raised anymore, that is, the highest gear is still determined as the current operating gear of the current semiconductor component.

[0084] Since the current semiconductor component is already at the highest gear, however, │Trp - Tset│ is still relatively large, greater than or equal to the second set temperature value. In some embodiments, the air-conditioning compressor can be controlled to operate at the highest frequency, so as to continuously increase the adjustment ability of the air conditioner and further improve the efficiency of adjusting the temperature.

[0085] In the semiconductor components of the air conditioner, corresponding exhaust fans may be configured. The exhaust fans can strengthen air circulation and enhance the heat exchange between both ends of the semiconductor components and the indoor / outdoor sides, thereby realizing the compensation for the cooling capacity / heating capacity of the system. Therefore, in some embodiments, when the current semiconductor component is in the startup and running state, the corresponding exhaust fan on the current semiconductor component can also be controlled according to the current working mode.

[0086] Among them, when the first semiconductor component is in the startup and running state, control the first exhaust fan and the second exhaust fan configured on the first semiconductor component to run; when the second semiconductor component is in the startup and running state, control the third exhaust fan and the fourth exhaust fan configured on the second semiconductor component to run. Among them, in the air conditioner, the first exhaust fan is located on the first cooling end, the second exhaust fan is located on the first heating end, the third exhaust fan is located on the second heating end, and the fourth exhaust fan is located on the second cooling end.

[0087] When the semiconductor component stops running, to further reduce energy consumption, the corresponding exhaust fan can also be turned off. In some embodiments, when the current semiconductor component is in the shutdown state, control the corresponding exhaust fan on the current semiconductor component to turn off. That is, when the first semiconductor component stops running, control the first exhaust fan and the second exhaust fan configured on the first semiconductor component to stop running; when the second semiconductor component stops running, control the third exhaust fan and the fourth exhaust fan configured on the second semiconductor component to stop running.

[0088] Moreover, when the semiconductor components of the air conditioner are in the shutdown state, the air conditioner can still adopt the vapor compression refrigeration cycle to adjust the indoor temperature.

[0089] Currently, the air conditioner has a communication function. In this way, the air conditioner can also control the operation of the semiconductor components according to the received instructions. In some embodiments, when receiving the semiconductor switch instruction sent by the configured control application APP terminal, control the switch operation of the semiconductor components in the air conditioner according to the semiconductor switch instruction. In this way, the user can control the switch of the semiconductor components through the APP, improving the intelligence of the air conditioner and the user experience.

[0090] Next, the operation process will be incorporated into specific embodiments to illustrate the air conditioner control process provided by the embodiments of the present disclosure.

[0091] In this embodiment, the air conditioner can be as Figure 1As shown, it includes two sets of semiconductor components and four exhaust fans. Moreover, the first set temperature value stored in the air conditioner is 2°C, and the second set temperature value is 5°C. Additionally, the semiconductor components correspond to three operating gears, and the output energy of the third gear is greater than that of the second gear, while the output energy of the second gear is greater than that of the first gear. The first set frequency is 80% of the highest frequency of the air conditioner compressor. Also, the set start time can be 20 min, the set duration and the first set duration can both be 10 min, the set operating cycle of the semiconductor components can be 20 min, and the operating time of the set operating cycle is 10 min; and the set start time can be the operating time of the set operating cycle, which is also 10 min; the preset sampling duration can also be 10 min. The current operating mode of the air conditioner is the cooling mode, and the corresponding current semiconductor component is the first semiconductor component. Therefore, the corresponding first mode temperature range can be [40, 43), the second mode temperature range can be [43, 45), and the third mode temperature range can be [45, ∞).

[0092] Figure 3-1 、 Figure 3-2 is a schematic flowchart of a method for controlling an air conditioner provided by an embodiment of the present disclosure. Combining Figure 1 and Figure 3-1 、 Figure 3-2 , the process for controlling the air conditioner includes:

[0093] Step 3001: Determine whether the operating time of the air conditioner starting to operate in the cooling mode has reached the set start time of 20 min? If so, the start operation is completed, and step 3002 is executed; otherwise, return to step 3001.

[0094] Step 3002: Determine whether the average operating frequency of the air conditioner compressor within the set start time is greater than the first set frequency? If so, execute step 3003; otherwise, the process ends.

[0095] Step 3003: Record the indoor temperature value and outdoor temperature value of the air conditioner operating in the cooling mode within 10 min, and obtain the first average indoor temperature value Trp1 and the first average outdoor temperature value Tao1 within 10 min, and obtain the first absolute average temperature difference │Trp1 - Tset│ according to the first average indoor temperature value Trp1 and the target indoor temperature value Tset.

[0096] Step 3004: Determine whether │Trp1 - Tset│≥5 holds? If so, execute step 3006; otherwise, execute step 3005.

[0097] Step 3005: Determine the operating frequency of the obtained air conditioner compressor as the first operating frequency, and control the air conditioner compressor to operate at the first operating frequency.

[0098] Step 3006: Determine whether 40°C ≤ Taop1 < 43°C holds. If so, execute Step 3007; otherwise, execute Step 3008.

[0099] Step 3007: Determine the startup operation state as the first operation state of the first semiconductor component, and determine the first gear as the first operation gear of the first semiconductor component. Proceed to Step 3012.

[0100] Step 3008: Determine whether 43°C ≤ Taop1 < 45°C holds. If so, execute Step 3009; otherwise, execute Step 3010.

[0101] Step 3009: Determine the startup operation state as the first operation state of the first semiconductor component, and determine the second gear as the first operation gear of the first semiconductor component. Proceed to Step 3012.

[0102] Step 3010: Determine whether 45°C ≤ Taop1 holds. If so, execute Step 3011; otherwise, end the process.

[0103] Step 3011: Determine the startup operation state as the first operation state of the first semiconductor component, and determine the third gear as the first operation gear of the first semiconductor component. Proceed to Step 3012.

[0104] Step 3012: Control the first semiconductor component to operate in the first operation gear, and control the first exhaust fan on the first cooling end of the first semiconductor component to operate, and the second exhaust fan on the first heating end to operate.

[0105] Step 3013: Determine whether the operating time has reached 10 minutes, which is the set operating cycle of the semiconductor component. If so, execute Step 3014; otherwise, return to Step 3012.

[0106] Step 3014: Control the first semiconductor component to be in the shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be turned off, and the second exhaust fan on the first heating end to be turned off. And save the first operation gear as the previous operation gear.

[0107] Step 3015: Determine whether the duration of the first semiconductor component being in the shutdown state and the air conditioner being in the cooling mode operation state is ≥ 10 minutes. If so, execute Step 3016; otherwise, return to Step 3015.

[0108] Step 3016: Determine whether the current absolute average temperature difference │Trp - Tset│ < 2 holds. If so, execute Step 3017; otherwise, execute Step 3018.

[0109] Step 3017: Control the first semiconductor component to be in the shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be turned off, and the second exhaust fan on the first heating end to be turned off.

[0110] Step 3018: Determine whether 2 ≤ │Trp - Tset│ < 5 holds? If so, execute Step 3019; otherwise, execute Step 3020.

[0111] Step 3019: Determine the previous operating gear of the first semiconductor component as the current operating gear of the first semiconductor component. Proceed to Step 3022.

[0112] If the previous operating gear is the third gear, the current operating gear remains the third gear; if the previous operating gear is the first gear, the current operating gear remains the first gear.

[0113] Step 3020: Determine whether the previous operating gear of the first semiconductor component is the highest gear? If so, execute Step 3023; otherwise, execute Step 3021.

[0114] Step 3021: Upshift the previous operating gear, and determine the elevated operating gear as the current operating gear of the first semiconductor component. Proceed to Step 3022.

[0115] Step 3022: Control the first semiconductor component to operate at the current operating gear. Proceed to Step 3025.

[0116] Step 3023: Determine the highest gear as the current operating gear of the first semiconductor component.

[0117] Step 3024: Control the first semiconductor component to operate at the highest gear, and control the air-conditioning compressor to operate at the highest frequency. Proceed to Step 3025.

[0118] Step 3025: When the running time reaches 10 min of the set running cycle of the semiconductor component, control the first semiconductor component to be in the shutdown state, and control the first exhaust fan on the first cooling end of the first semiconductor component to be turned off, and the second exhaust fan on the first heating end to be turned off. And save the current operating gear as the previous operating gear. Proceed to Step 3015.

[0119] It can be seen that in this embodiment, two sets of semiconductor components are configured in the air conditioner. Moreover, when the air conditioner starts to operate in the cooling mode and reaches the set start time, and the air conditioner compressor maintains high-frequency operation, the operating parameters and states of the air conditioner compressor and the first semiconductor component can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value, as well as the average outdoor temperature value. That is, when the indoor temperature is far from the target temperature value and the outdoor working conditions are harsh, after the compressor operates at high frequency for a long time, the first semiconductor component can be turned on to provide supplementary cooling capacity for the system. Thus, the power of the air conditioner can be flexibly controlled. While improving the cooling capacity of the air conditioner by controlling the operation of the first semiconductor component and enhancing the cooling efficiency, the power consumption of the air conditioner is reduced.

[0120] According to the above process for air conditioner control, a device for air conditioner control can be constructed.

[0121] Figure 4 It is a schematic structural diagram of a device for air conditioner control provided by an embodiment of the present disclosure. The air conditioner is as described above, including two sets of semiconductor components, or including two sets of semiconductor components and their corresponding exhaust fans. As Figure 4 shown, the device for air conditioner control includes: a first acquisition module 4100, a determination module 4200, and a first control module 4300.

[0122] The first acquisition module 4100 is configured to, when the operating time of the air conditioner operating in the current working mode reaches the set start time, if the average operating frequency of the air conditioner compressor is greater than the first set frequency within the set start time, acquire the first average indoor temperature value and the first average outdoor temperature value of the air conditioner operating in the current working mode within the first set duration, and obtain the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value.

[0123] The first determination module 4200 is configured to determine the first operating frequency of the air conditioner compressor that matches the first absolute average temperature difference, and the first operating state of the current semiconductor component, where the current semiconductor component matches the current working mode.

[0124] The first control module 4300 is configured to control the air conditioner compressor to operate at the first operating frequency, and control the current semiconductor component to operate in the first operating state according to the first average outdoor temperature value.

[0125] In some embodiments, the first determination module 4200 includes:

[0126] The first determination unit is configured to, when the first absolute average temperature difference is less than the second set temperature value, determine the obtained operating frequency of the air-conditioning compressor as the first operating frequency, and determine the shutdown state as the first operating state of the current semiconductor component.

[0127] The second determination unit is configured to, when the first absolute average temperature difference is greater than or equal to the second set temperature value, determine the startup operating state as the first operating state of the current semiconductor component.

[0128] In some embodiments, the first control module 4300 includes:

[0129] The first gear determination unit is configured to, when the first absolute average temperature difference is greater than or equal to the second set temperature value, determine the first operating gear of the current semiconductor component corresponding to the first average outdoor temperature value.

[0130] The first control unit is configured to control the current semiconductor component to operate at the first operating gear during the operating time of the set operating cycle of the semiconductor component; and control the current semiconductor component to be in the shutdown state during the stop time of the set operating cycle of the semiconductor component.

[0131] Wherein, the semiconductor component corresponds to two or more operating gears, and the greater the control input current of the semiconductor component, the higher the corresponding operating gear.

[0132] In some embodiments, the device further includes:

[0133] The second acquisition module is configured to, when the current semiconductor component is in the shutdown state and the duration of the air conditioner operating in the current mode reaches the preset sampling duration, acquire the current average indoor temperature value within the current set duration in the area where the air conditioner is located, and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value.

[0134] The second determination module is configured to determine the current operating state of the current semiconductor component matching the current absolute average temperature difference.

[0135] The second control module is configured to control the current semiconductor component to operate in the current operating state.

[0136] In some embodiments, the second control module includes:

[0137] The second gear determination unit is configured to, when the current absolute average temperature difference is greater than or equal to the first set temperature value, determine the current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference.

[0138] A second control unit, configured to control the current semiconductor component to operate at the current operating gear during the operating time of the set operating cycle of the semiconductor component; and control the current semiconductor component to be in the shutdown state during the stop time of the set operating cycle of the semiconductor component.

[0139] Wherein, the second set temperature value is greater than or equal to the first set temperature value.

[0140] In some embodiments, the second determination unit is specifically configured to, when the current absolute average temperature difference is greater than or equal to the first set temperature value and less than the second set temperature value, determine the previous operating gear of the current semiconductor component as the current operating gear of the current semiconductor component; when the current absolute average temperature difference is greater than or equal to the second set temperature value, if the previous operating gear is not the highest gear, perform a gear-up process on the current semiconductor component, and determine the increased operating gear as the current operating gear of the current semiconductor component; when the current absolute average temperature difference is greater than or equal to the second set temperature value, if the previous operating gear is the highest gear, determine the highest gear as the current operating gear of the current semiconductor component.

[0141] In some embodiments, the second control module further includes: a third control unit, configured to, when the current absolute average temperature difference is greater than or equal to the second set temperature value, if the previous operating gear is the highest gear, control the air-conditioning compressor to operate at the highest frequency.

[0142] The following is an example to illustrate the air-conditioning control process of the device for air-conditioning control provided by the embodiments of the present disclosure.

[0143] The air conditioner can be as Figure 1 shown, including two sets of semiconductor components and four exhaust fans. The first set temperature value stored in the air conditioner is 2.5 °C, and the second set temperature value is 5.5 °C. Moreover, the semiconductor component corresponds to 3 operating gears, the output energy of the third gear is greater than the output energy of the second gear, and the output energy of the second gear is greater than the output energy of the first gear. And, the first set frequency is 70% of the highest frequency of the air-conditioning compressor. The set start time can be 20 min, the set duration and the first set duration can be 12 min, the set operating cycle of the semiconductor component can be 30 min, and the operating time of the set operating cycle is 15 min; and the set start time can be the operating time of the set operating cycle, which is also 15 min; the preset sampling duration can also be 18 min. The current operating mode of the air conditioner is the heating mode, the corresponding current semiconductor component is the second semiconductor component, the corresponding first mode temperature range can be (-7, 0], the second mode temperature range can be (-15, -7], and the third mode temperature range can be (∞, -15].

[0144] Figure 5 is a schematic structural diagram of an air conditioner control device provided by an embodiment of the present disclosure. As Figure 5 shown, the air conditioner control device includes: a first acquisition module 4100, a first determination module 4200, a first control module 4300, a second acquisition module 4400, a second determination module 4500, and a second control module 4600. Among them, the first determination module 4200 includes: a first determination unit 4210 and a second determination unit 4220. The first control module 4300 includes: a first gear determination unit 4310 and a first control unit. The second control module 4600 includes: a second gear determination unit 4610, a second control unit 4620, and a third control unit 4630.

[0145] When the air conditioner is turned on and the heating mode is started. Thus, when the heating operation time of the air conditioner reaches 20 minutes, if within 20 minutes, the average operating frequency of the air conditioner compressor is greater than the first set frequency, the first acquisition module 4100 can record the indoor temperature value and the outdoor temperature value of the air conditioner operating in the heating mode within 12 minutes, and obtain the first average indoor temperature value Trp1 and the first average outdoor temperature value Tao1 within 12 minutes, and according to the current average indoor temperature value Trp1 and the target indoor temperature value Tset, obtain the current absolute average temperature difference │Trp1 - Tset│.

[0146] Thus, if │Trp1 - Tset│ < 5.5°C, the first determination unit 4210 in the first determination module 4200 can determine the operating frequency of the acquired air conditioner compressor as the first operating frequency, and determine the shutdown state as the first operating state of the second semiconductor component. Therefore, the first control module 4300 can control the air conditioner compressor to perform heating operation at the first operating frequency, control the second semiconductor component to be in the shutdown state, and control the third exhaust fan on the second heating end of the second semiconductor component to be closed, and the fourth exhaust fan on the second cooling end to be closed.

[0147] If │Trp1-Tset│≥5.5°C, the second determination unit 4220 in the first determination module 4200 can determine the startup operation state as the first operation state of the second semiconductor component. Moreover, if -7°C < Taop1 ≤ 0°C, the first gear determination unit 4310 in the first control module 4300 can determine the first gear as the first operation gear of the second semiconductor component. If -15°C < Taop1 ≤ -7°C, the first gear determination unit 4310 can determine the second gear as the first operation gear of the second semiconductor component. If Taop1 ≤ -7°C, the first gear determination unit 4310 can determine the third gear as the first operation gear of the second semiconductor component. Thus, the first control unit 4320 in the first control module 4300 can control the second semiconductor component at the first operation gear, and control the third exhaust fan on the second heating end of the second semiconductor component to operate, and the fourth exhaust fan on the second cooling end to operate.

[0148] When the running time reaches 15 minutes of the set running cycle of the semiconductor component, the first control unit 4320 can control the second semiconductor component to be in the shutdown state, and control the third exhaust fan on the second heating end of the second semiconductor component to close, and the fourth exhaust fan on the second cooling end to close. And save the first operation gear as the previous operation gear.

[0149] After controlling the second semiconductor component to operate at the first operation gear, the second semiconductor component can be continuously controlled. Among them, when the second semiconductor component is in the shutdown state and the duration of the air conditioner in the current mode operation state reaches the preset sampling duration of 18 minutes, the second acquisition module 4400 acquires the current average indoor temperature value Trp within the current set duration of 12 minutes in the area where the air conditioner is located, and obtains the current absolute average temperature difference │Trp-Tset│ between the current average indoor temperature value and the target indoor temperature value.

[0150] Moreover, when │Trp-Tset│ < 2.5°C, the second determination module 4500 can determine the shutdown state as the current operation state of the second semiconductor component. Thus, the second control module 4600 can control the second semiconductor component to be in the shutdown state, and control the third exhaust fan on the second heating end of the second semiconductor component to close, and the fourth exhaust fan on the second cooling end to close.

[0151] If │Trp - Tset│≥2.5°C, the second determination module 4500 can determine the startup operation state as the current operation state of the second semiconductor component. Moreover, when 2.5°C ≤ │Trp - Tset│<5.5°C, the second gear determination unit 4610 in the second control module 4600 determines the previous operation gear of the second semiconductor component as the current operation gear of the second semiconductor component. That is, the second control unit 4620 in the second control module 4600 can control the second semiconductor component at the current operation gear, and control the third exhaust fan on the second heating end of the second semiconductor component to operate, and the fourth exhaust fan on the second cooling end to operate. When the operation time reaches 15 minutes of the set operation cycle of the semiconductor component, the second control unit 4620 can control the second semiconductor component to be in the shutdown state, and control the third exhaust fan on the second heating end of the second semiconductor component to close, and the fourth exhaust fan on the second cooling end to close. And save the current operation gear as the previous operation gear.

[0152] If 5.5°C ≤ │Trp - Tset│, the second gear determination unit 4610 in the second control module 4600 can perform a gear up process. That is, if the previous operation gear is not the highest gear, perform a gear up process on the second semiconductor component, and determine the increased operation gear as the current operation gear of the second semiconductor component; and, if the previous operation gear is the highest gear, determine the highest gear as the current operation gear of the second semiconductor component.

[0153] That is, the second control unit 4620 in the second control module 4600 can control the second semiconductor component at the current operation gear, and control the third exhaust fan on the second heating end of the second semiconductor component to operate, and the fourth exhaust fan on the second cooling end to operate. When the operation time reaches 15 minutes of the set operation cycle of the semiconductor component, the second control unit 4620 can control the second semiconductor component to be in the shutdown state, and control the third exhaust fan on the second heating end of the second semiconductor component to close, and the fourth exhaust fan on the second cooling end to close. And save the current operation gear as the previous operation gear.

[0154] Moreover, when the current absolute average temperature difference is greater than or equal to the second set temperature value, if the previous operation gear is the highest gear, the third control unit 4630 in the second control module 4600 can control the air conditioner compressor to operate at the highest frequency.

[0155] It can be seen that in this embodiment, two sets of semiconductor components are configured in the air conditioner. In this way, when the device for air conditioner control runs in the heating mode and reaches the set start time, and the air conditioner compressor keeps running at high frequency, the operating parameters and states of the air conditioner compressor and the second semiconductor component can be adjusted according to the absolute average temperature difference between the average indoor temperature value and the target indoor temperature value, and the average outdoor temperature value. That is, when the indoor temperature is far from the target temperature value and the outdoor working conditions are harsh, after the compressor runs at high frequency for a long time, the second semiconductor component can be turned on to provide supplementary cooling capacity for the system. Thus, the power of the air conditioner can be flexibly controlled. While increasing the heating capacity of the air conditioner by controlling the operation of the second semiconductor component and improving the heating efficiency, the power consumption of the air conditioner is reduced.

[0156] This embodiment of the present disclosure provides a device for air conditioner control, and its structure is as Figure 6 shown, including:

[0157] A processor 1000 and a memory 1001, and may further include a communication interface 1002 and a bus 1003. Among them, the processor 1000, the communication interface 1002, and the memory 1001 can complete mutual communication through the bus 1003. The communication interface 1002 can be used for information transmission. The processor 1000 can call the logical instructions in the memory 1001 to execute the method for air conditioner control in the above embodiment.

[0158] In addition, when the logical instructions in the above-mentioned memory 1001 are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium.

[0159] The memory 1001, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as the program instructions / modules corresponding to the method in this embodiment of the present disclosure. The processor 1000 executes functional applications and data processing by running the program instructions / modules stored in the memory 1001, that is, implements the method for air conditioner control in the above method embodiment.

[0160] The memory 1001 may include a program storage area and a data storage area. Among them, the program storage area can store an operating system and application programs required for at least one function; the data storage area can store data created according to the use of the terminal air conditioner, etc. In addition, the memory 1001 can include a high-speed random access memory and can also include a non-volatile memory.

[0161] An embodiment of the present disclosure provides an air conditioner control device, including: a processor and a memory storing program instructions, the processor being configured to execute an air conditioner control method when executing the program instructions.

[0162] An embodiment of the present disclosure provides an air conditioner, including the above-mentioned air conditioner control device.

[0163] An embodiment of the present disclosure provides a computer-readable storage medium storing computer-executable instructions, the computer-executable instructions being configured to execute the above-mentioned air conditioner control method.

[0164] An embodiment of the present disclosure provides a computer program product, the computer program product including a computer program stored on a computer-readable storage medium, the computer program including program instructions, when the program instructions are executed by a computer, causing the computer to execute the above-mentioned air conditioner control method.

[0165] The above-mentioned computer-readable storage medium may be a transient computer-readable storage medium or a non-transient computer-readable storage medium.

[0166] The technical solution of the embodiment of the present disclosure may be embodied in the form of a software product, the computer software product being stored in a storage medium, including one or more instructions for causing a computer air conditioner (which may be a personal computer, a server, or a network air conditioner, etc.) to execute all or part of the steps of the method described in the embodiment of the present disclosure. The foregoing storage medium may be a non-transient storage medium, including: a USB flash drive, a portable hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disc, etc., which are various media that can store program codes, or may also be a transient storage medium.

[0167] The above description and the accompanying drawings fully illustrate the embodiments of the present disclosure, enabling those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process, and other changes. The embodiments merely represent possible variations. Unless explicitly required, the individual components and functions are optional, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. The scope of the embodiments of the present disclosure includes the entire scope of the claims and all available equivalents of the claims. When used in this application, although terms such as "first", "second", etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without changing the meaning of the description, the first element may be called the second element, and similarly, the second element may be called the first element, as long as all occurrences of the "first element" are consistently renamed and all occurrences of the "second element" are consistently renamed. The first element and the second element are both elements, but they may not be the same element. Moreover, the terms used in this application are only used to describe the embodiments and do not limit the claims. As used in the description of the embodiments and the claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to also include the plural forms. Similarly, as used in this application, the term "and / or" refers to any and all possible combinations including one or more of the associated listed items. Additionally, when used in this application, the term "comprise" and its variants "comprises" and / or "comprising" etc. mean the presence of the stated features, wholes, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups of these. Without further limitation, an element defined by the statement "comprising one..." does not exclude the presence of additional identical elements in the process, method, or air conditioner including the said element. Herein, each embodiment may focus on the differences from other embodiments, and the same or similar parts among the embodiments may be referred to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method part disclosed in the embodiments, the relevant parts may refer to the description of the method part.

[0168] Those skilled in the art will realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner may depend on the specific application and design constraints of the technical solution. The skilled person may use different methods for each specific application to implement the described functions, but such implementation should not be considered to exceed the scope of the embodiments of the present disclosure. The skilled person can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0169] In the embodiments disclosed herein, the disclosed methods, products (including but not limited to devices, air conditioners, etc.) can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units can be merely a logical function division, and there can be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of the devices or units can be in electrical, mechanical, or other forms. The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to implement this embodiment. In addition, the functional units in the embodiments of the present disclosure can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit.

[0170] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a part of code, which contains one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions noted in the blocks may occur in an order different from that noted in the accompanying drawings. For example, two consecutive blocks may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in an order different from that disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. Each block in the block diagram and / or flowchart, and combinations of blocks in the block diagram and / or flowchart, may be implemented by a dedicated hardware-based system that performs the specified functions or actions, or may be implemented by a combination of dedicated hardware and computer instructions.

Claims

1. A method for air conditioner control, characterized in that, The air conditioner includes two sets of semiconductor components. Among them, the first refrigerating end of the first semiconductor component is connected to the indoor unit of the air conditioner, the first heating end of the first semiconductor component is connected to the outdoor unit of the air conditioner, the second refrigerating end of the second semiconductor component is connected to the outdoor unit of the air conditioner, and the second heating end of the second semiconductor component is connected to the indoor unit of the air conditioner. The method includes: When the running time of the air conditioner operating in the current working mode reaches the set start time, if the average running frequency of the air conditioner compressor is greater than the first set frequency within the set start time, obtain the first average indoor temperature value and the first average outdoor temperature value of the air conditioner operating in the current working mode within the first set duration, and obtain the first absolute average temperature difference between the first average indoor temperature value and the target indoor temperature value; Determine the first running frequency of the air conditioner compressor and the first running state of the current semiconductor component that match the first absolute average temperature difference, where the current semiconductor component matches the current working mode; Control the air conditioner compressor to run at the first running frequency, and control the current semiconductor component to run in the first running state according to the first average outdoor temperature value; Among them, the determining the first running frequency of the air conditioner compressor and the first running state of the current semiconductor component that match the first absolute average temperature difference includes: When the first absolute average temperature difference is less than the second set temperature value, determine the obtained running frequency of the air conditioner compressor as the first running frequency, and determine the shutdown state as the first running state of the current semiconductor component; When the first absolute average temperature difference is greater than or equal to the second set temperature value, determine the start running state as the first running state of the current semiconductor component; The controlling the current semiconductor component to run in the first running state includes: When the first absolute average temperature difference is greater than or equal to the second set temperature value, determine the first running gear of the current semiconductor component corresponding to the first average outdoor temperature value; Within the running time of the set running cycle of the semiconductor component, control the current semiconductor component to run at the first running gear; Within the stop time of the set running cycle of the semiconductor component, control the current semiconductor component to be in the shutdown state; Among them, the semiconductor component corresponds to two or more running gears, and the greater the control input current of the semiconductor component, the higher the corresponding running gear.

2. The method according to claim 1, characterized in that, When the current working mode is the refrigeration mode, the current semiconductor component is the first semiconductor component; when the current working mode is the heating mode, the current semiconductor component is the second semiconductor component.

3. The method according to claim 1, characterized in that, After controlling the current semiconductor component to run at the first running gear, it further includes: When the current semiconductor component is in the shutdown state and the duration of the air conditioner running in the current mode reaches the preset sampling duration, obtain the current average indoor temperature value within the current set duration in the area where the air conditioner is located, and obtain the current absolute average temperature difference between the current average indoor temperature value and the target indoor temperature value; Determine the current operating state of the current semiconductor component that matches the current absolute average temperature difference; Control the current semiconductor component to operate in the current operating state.

4. The method according to claim 3, characterized in that, The controlling the current semiconductor component to operate in the current operating state includes: When the current absolute average temperature difference is greater than or equal to the first set temperature value, determine the current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference; During the operating time of the set operating cycle of the semiconductor component, control the current semiconductor component to operate in the current operating gear; During the stop time of the set operating cycle of the semiconductor component, control the current semiconductor component to be in the shutdown state; Wherein, the second set temperature value is greater than or equal to the first set temperature value.

5. The method according to claim 4, characterized in that, The determining the current operating gear of the current semiconductor component corresponding to the current absolute average temperature difference includes: When the current absolute average temperature difference is greater than or equal to the first set temperature value and less than the second set temperature value, determine the previous operating gear of the current semiconductor component as the current operating gear of the current semiconductor component; When the current absolute average temperature difference is greater than or equal to the second set temperature value, if the previous operating gear is not the highest gear, perform a gear-up process on the current semiconductor component, and determine the raised operating gear as the current operating gear of the current semiconductor component; and, if the previous operating gear is the highest gear, determine the highest gear as the current operating gear of the current semiconductor component.

6. The method according to claim 5, characterized in that, Further includes: When the current absolute average temperature difference is greater than or equal to the second set temperature value, if the previous operating gear is the highest gear, control the air conditioner compressor to operate at the highest frequency.

7. A device for air conditioner control, the air conditioner includes two sets of semiconductor components, the device includes a processor and a memory storing program instructions, characterized in that, The processor is configured to execute the method for air conditioner control according to any one of claims 1 to 6 when executing the program instructions.

8. An air conditioner, characterized in that, Includes: The device for air conditioner control according to claim 7.

9. A storage medium storing program instructions, characterized in that, When the program instructions are running, execute the method for air conditioner control according to any one of claims 1 to 6.

Images