Heat dissipation devices and radiators

Abstract

The present application relates to a heat dissipation device and a radiator, wherein the heat dissipation device includes a first heat dissipation structure, the first heat dissipation structure includes a first heat conducting pipe, a first heat conducting plate and a second heat conducting plate; the cross-section of the first heat conducting pipe is a polygon, and the surface has an edge corresponding to the inner angle of the polygon; the first heat conducting plate is connected to the bottom ends of multiple first heat conducting pipes, and the multiple first heat conducting pipes are arranged at intervals along the length direction of the first heat conducting plate; the second heat conducting plate is connected to the top ends of the multiple first heat conducting pipes; at least one edge of the first heat conducting pipe is connected to at least one of the first heat conducting plate and the second heat conducting plate, and the first heat conducting plate is used to be fitted and installed on the surface of a heat generating source. When the above-mentioned heat dissipation device and radiator are in use, the temperature of the surface of the heat generating source can be transferred more quickly in multiple cavities, avoiding temperature differences in the arrangement direction of the first heat conducting pipes, dissipating heat faster, ensuring stable heat transmission in the direction of the pipe mouth of the first heat conducting pipe, and not increasing wind pressure loss, thereby achieving better heat dissipation effect.

Description

Technical Field

[0001] The present application relates to the technical field of radiators, and in particular to a heat dissipation device and a radiator. Background Art

[0002] A radiator is a device or instrument that transfers the heat generated by machinery or other equipment during operation in a timely manner to avoid affecting its normal operation.

[0003] Take the heat sinks used in computers and other electronic devices as an example. As computer hardware continues to evolve, performance and CPU computing power continue to improve, but this also leads to increased heat dissipation. CPU cooling is typically achieved with a finned heat sink. Finned heat sinks employ either a straight-in, straight-out structure or a simple layered stacked structure, and are used in conjunction with a fan to dissipate heat from the CPU. Heat generated by the CPU is transferred to the fins, which then travel along them and dissipate into the surrounding air, where it is then dissipated by the airflow generated by the fan.

[0004] However, for fin-type heat sinks, the airflow generated by the fan rotation will weaken where the fins are close to the CPU, causing the heat generated by the CPU to accumulate, resulting in an abnormal increase in CPU temperature and inability to effectively dissipate heat. Summary of the Invention

[0005] Based on this, it is necessary to provide a heat dissipation device and a radiator with better heat dissipation effect to address the above technical problems.

[0006] In a first aspect, the present application provides a heat dissipation device, including a first heat dissipation structure, wherein the first heat dissipation structure includes:

[0007] The first heat conducting pipe has a polygonal cross section and a surface with corners corresponding to the inner angles of the polygon;

[0008] a first heat conducting plate connected to the bottom ends of the plurality of first heat conducting tubes, wherein the plurality of first heat conducting tubes are arranged at intervals along the length direction of the first heat conducting plate;

[0009] a second heat conducting plate connected to top ends of the plurality of first heat conducting pipes;

[0010] At least one corner of the first heat conducting pipe is connected to at least one of the first heat conducting plate and the second heat conducting plate, and the first heat conducting plate is used to be mounted on the surface of the heat generating source.

[0011] In one embodiment, two first heat dissipation structures are symmetrically provided, and the two first heat dissipation structures share one second heat conducting plate.

[0012] In one embodiment, a second heat dissipation structure is further included, wherein the second heat dissipation structure includes:

[0013] a first heat conducting pipe;

[0014] a plurality of second heat conducting plates arranged at intervals, a plurality of the first heat conducting tubes being connected between each pair of adjacent second heat conducting plates, and the plurality of the first heat conducting tubes being arranged at intervals along the length direction of the second heat conducting plates;

[0015] At least one corner of the first heat pipe is connected to at least one second heat conducting plate. The second heat dissipation structure is located between two first heat dissipation structures. Two ends of the second heat dissipation structure and the two first heat dissipation structures respectively share two second heat conducting plates.

[0016] In one embodiment, the corners corresponding to the two opposite inner corners of the first heat conducting pipe are respectively connected to the first heat conducting plate and the second heat conducting plate, or respectively connected to the two second heat conducting plates.

[0017] In one embodiment, the first heat conducting plate comprises:

[0018] Connecting part;

[0019] The bending portion is connected between the two connecting portions, the top of the bending portion is connected to the corner of the first heat conducting pipe, and the two sides adjacent to the top of the bending portion are coplanar with the two sides adjacent to the corner of the first heat conducting pipe.

[0020] In one embodiment, the second heat conducting plate comprises:

[0021] Connecting part;

[0022] The second heat-conducting pipe has a polygonal cross-section and has edges and corners corresponding to the inner angles of the polygon on its surface. The edges and corners corresponding to two opposite inner angles of the second heat-conducting pipe are respectively connected to the two connecting portions. The edges and corners corresponding to the other two opposite inner angles of the second heat-conducting pipe are respectively connected to the two edges and corners of the first heat-conducting pipe, and the adjacent sides of the edges and corners of the first heat-conducting pipe are respectively coplanar with the corresponding adjacent sides of the edges and corners of the second heat-conducting pipe.

[0023] In one embodiment, the diagonals of two opposite inner angles of the polygon are the symmetry axes of the polygon.

[0024] In one embodiment, the two opposite internal angles are obtuse angles or acute angles.

[0025] In one embodiment, the interior angle of the polygon is less than 180 degrees.

[0026] In a second aspect, the present application provides a radiator comprising a fan and the above-mentioned heat dissipation device, wherein the fan is fixed to the side end of the heat dissipation device and faces the pipe opening of the heat conduction pipe to drive the air flow in the heat conduction pipe.

[0027] When the above-mentioned heat dissipation device and radiator are in use, the first heat conduction plate on the bottom surface is attached to the surface of the heat source, and the internal cavity of the first heat conduction tube and the cavity formed between adjacent first heat conduction tubes are adjacent, so that the temperature of the surface of the heat source can be transferred more quickly in multiple cavities, avoiding temperature differences in the arrangement direction of the first heat conduction tubes, and the heat dissipation speed is faster. By setting the directions of the multiple first heat conduction tubes to be consistent, the stable transmission of heat in the direction of the tube openings of the first heat conduction tubes can be guaranteed without increasing wind pressure loss, and the heat dissipation effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of a first heat dissipation structure according to an embodiment of the present application;

[0029] Figure 2 A schematic diagram of two first heat dissipation structures in one embodiment of the present application;

[0030] Figure 3 Schematic diagram of a first heat dissipation structure and a second heat dissipation structure in one embodiment of the present application.

[0031] In the figure: 100, first heat dissipation structure; 110, first heat-conducting pipe; 120, first heat-conducting plate; 121, connecting portion; 122, bending portion; 130, second heat-conducting plate; 131, second heat-conducting pipe; 200, second heat dissipation structure. DETAILED DESCRIPTION

[0032] To make the purpose, technical solutions, and advantages of the embodiments of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0033] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0035] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0037] like Figure 1 As shown, in one embodiment, a heat dissipation device includes a first heat dissipation structure 100, and the first heat dissipation structure 100 includes:

[0038] The first heat conducting pipe 110 has a polygonal cross section, and its surface has corners corresponding to the inner angles of the polygon;

[0039] The first heat conducting plate 120 is connected to the bottom ends of the plurality of first heat conducting tubes 110 , and the plurality of first heat conducting tubes 110 are arranged at intervals along the length direction of the first heat conducting plate 120 ;

[0040] The second heat conducting plate 130 is connected to the top ends of the plurality of first heat conducting pipes 110;

[0041] At least one corner of the first heat conducting pipe 110 is connected to at least one of the first heat conducting plate 120 and the second heat conducting plate 130 . The first heat conducting plate 120 is adapted to be mounted on a surface of a heat generating source.

[0042] When the above-mentioned heat dissipation device is in use, the first heat conducting plate 120 on the bottom is attached to the surface of the heat source, and the internal cavity of the first heat conducting tube 110 and the cavity formed between adjacent first heat conducting tubes 110 are adjacent, so that the temperature of the surface of the heat source can be transferred quickly in multiple cavities, avoiding temperature differences in the arrangement direction of the first heat conducting tubes 110, and the heat dissipation speed is faster. By setting the directions of multiple first heat conducting tubes 110 to be consistent, the stable transmission of heat in the direction of the tube mouth of the first heat conducting tube 110 can be guaranteed without increasing wind pressure loss, and the heat dissipation effect is better.

[0043] The above-mentioned heat dissipation device sets the cross-section of the first heat pipe 110 to be polygonal, and at least one edge corner on the outside of the first heat pipe 110 is connected to at least one of the first heat conducting plate 120 and the second heat conducting plate 130. This makes the first heat dissipation structure 100 different from the traditional square heat dissipation structure. If the electrical component to which it is attached vibrates during operation, the first heat dissipation structure 100 can effectively absorb the vibration and, at the same time, hinder the propagation of noise to a certain extent.

[0044] like Figure 2 As shown, in this embodiment, two first heat dissipation structures 100 are symmetrically provided, and the two first heat dissipation structures 100 share one second heat conducting plate 130 .

[0045] Specifically, the two first heat dissipation structures 100 are symmetrically arranged, and the two first heat dissipation structures 100 share a second heat conduction plate 130. Then, the first heat conduction plates 120 of the two first heat dissipation structures 100 are respectively located at both ends of the heat dissipation device, and can be used to fit and install on the surface of the heat source. There is no need to adjust the positive and negative directions during installation, and it is easy to use and quick to install.

[0046] like Figure 3 As shown, in this embodiment, the heat dissipation device further includes a second heat dissipation structure 200, and the second heat dissipation structure 200 includes:

[0047] a first heat conducting pipe 110;

[0048] Multiple second heat conducting plates 130 are arranged at intervals, and multiple first heat conducting tubes 110 are connected between each pair of adjacent second heat conducting plates 130, and the multiple first heat conducting tubes 110 are arranged at intervals along the length direction of the second heat conducting plates 130;

[0049] At least one corner of the first heat pipe 110 is connected to at least one second heat conducting plate 130 . The second heat dissipation structure 200 is located between the two first heat dissipation structures 100 . Two ends of the second heat dissipation structure 200 and the two first heat dissipation structures 100 share two second heat conducting plates 130 .

[0050] The above-mentioned multi-layer heat dissipation structure is connected in sequence to form multi-layer damping, which can better block noise, and the concave and convex bent internal structure can intercept sound waves, so that the noise is evenly mixed in all directions, resulting in energy feedback attenuation, effectively reducing noise. At the same time, since the heat dissipation device formed by the combination of multi-layer heat dissipation structures has heat conduction plates on both sides and the cavity inside the heat dissipation structure is sealed, it can prevent hot air backflow from causing the temperature inside the server cavity to rise.

[0051] In this embodiment, the corners corresponding to the two opposite inner corners of the first heat conducting pipe 110 are respectively connected to the first heat conducting plate 120 and the second heat conducting plate 130 , or respectively connected to the two second heat conducting plates 130 .

[0052] In this embodiment, the first heat conducting plate 120 includes:

[0053] Connecting portion 121;

[0054] The bending portion 122 is connected between the two connecting portions 121 . The top of the bending portion 122 is connected to the corner of the first heat pipe 110 , and the two sides adjacent to the top of the bending portion 122 are coplanar with the two sides adjacent to the corner of the first heat pipe 110 .

[0055] Specifically, the first heat conducting plate 120 has a flat plate-like structure, and a plurality of protrusions are arranged at intervals on one side of the flat plate-like structure for connecting with the corners of the first heat conducting pipe 110 .

[0056] In this embodiment, the second heat conducting plate 130 includes:

[0057] Connecting portion 121;

[0058] The second heat conducting pipe 131 has a polygonal cross-section and has edges corresponding to the inner angles of the polygon. The edges corresponding to two opposing inner angles of the second heat conducting pipe 131 are respectively connected to the two connecting portions 121. The edges corresponding to the other two opposing inner angles of the second heat conducting pipe 131 are respectively connected to the edges of the two first heat conducting pipes 110. The adjacent edges of the edges of the first heat conducting pipe 110 are coplanar with the adjacent edges of the corresponding second heat conducting pipe 131.

[0059] Specifically, the second heat conducting plate 130 has a flat plate-like structure, and a plurality of rows of protrusions are arranged at intervals on both sides of the flat plate-like structure for connecting with the corners of the first heat conducting pipe 110 .

[0060] In this embodiment, the diagonals of the two opposite inner angles of the polygon serve as the symmetry axis of the polygon, which makes the structures of the first heat pipe 110 and the second heat pipe 131 more regular and symmetrical, more convenient to manufacture, and more beautiful to use and combine.

[0061] In this embodiment, the two opposite internal angles are obtuse angles or acute angles.

[0062] Specifically, the heat pipe in this embodiment is preferably diamond-shaped, which can more effectively weaken vibration and reduce the impact of noise on the external environment.

[0063] In this embodiment, the interior angle of the polygon is less than 180 degrees.

[0064] Specifically, the arrangement of the second heat pipe 131 further increases the concave-convex bending structure inside the heat dissipation device, which can better reduce noise, and the overall shape is symmetrical, easy to process and beautiful.

[0065] In one embodiment, a heat sink includes a fan and the above-mentioned heat dissipation device. The fan is fixed to the side end of the heat dissipation device and faces the pipe opening of the heat conduction pipe to drive the air flow in the heat conduction pipe.

[0066] During use, the heat source emits heat and transfers it through the connection portion 121 to the cavities within each heat pipe and between adjacent heat pipes. The fan then operates, driving airflow within the heat pipes and the cavities between adjacent heat pipes, thereby removing the heat. The airflow moves in a straight line, ensuring stable heat transfer in that direction without increasing wind pressure loss, achieving rapid heat dissipation. Furthermore, the concave-convex curved structure within the heat dissipation device intercepts the noise waves generated by the fan, evenly mixing the noise in all directions and attenuating energy feedback, effectively reducing noise.

[0067] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A heat dissipation device, characterized in that: The first heat dissipation structure includes: The first heat conducting pipe has a polygonal cross section and a surface with corners corresponding to the inner angles of the polygon; a first heat conducting plate connected to the bottom ends of the plurality of first heat conducting tubes, wherein the plurality of first heat conducting tubes are arranged at intervals along the length direction of the first heat conducting plate; a second heat conducting plate connected to top ends of the plurality of first heat conducting pipes; At least one corner of the first heat conducting pipe is connected to at least one of the first heat conducting plate and the second heat conducting plate, and the first heat conducting plate is used to be mounted on the surface of the heat generating source.

2. The heat dissipation device according to claim 1, characterized in that: Two first heat dissipation structures are symmetrically provided, and the two first heat dissipation structures share one second heat conducting plate.

3. The heat dissipation device according to claim 2, characterized in that: Also included is a second heat dissipation structure, the second heat dissipation structure comprising: a first heat conducting pipe; a plurality of second heat conducting plates arranged at intervals, a plurality of the first heat conducting tubes being connected between each pair of adjacent second heat conducting plates, and the plurality of the first heat conducting tubes being arranged at intervals along the length direction of the second heat conducting plates; At least one corner of the first heat pipe is connected to at least one second heat conducting plate. The second heat dissipation structure is located between two first heat dissipation structures. Two ends of the second heat dissipation structure and the two first heat dissipation structures respectively share two second heat conducting plates.

4. The heat dissipation device according to claim 3, characterized in that: The edges corresponding to the two opposite inner corners of the first heat conducting pipe are respectively connected to the first heat conducting plate and the second heat conducting plate, or respectively connected to the two second heat conducting plates.

5. The heat dissipation device according to claim 4, characterized in that: The first heat conducting plate comprises: Connecting part; The bending portion is connected between the two connecting portions, the top of the bending portion is connected to the corner of the first heat conducting pipe, and the two sides adjacent to the top of the bending portion are coplanar with the two sides adjacent to the corner of the first heat conducting pipe.

6. The heat dissipation device according to claim 4, characterized in that: The second heat conducting plate comprises: Connecting part; The second heat-conducting pipe has a polygonal cross-section and has edges and corners corresponding to the inner angles of the polygon on its surface. The edges and corners corresponding to two opposite inner angles of the second heat-conducting pipe are respectively connected to the two connecting portions. The edges and corners corresponding to the other two opposite inner angles of the second heat-conducting pipe are respectively connected to the two edges and corners of the first heat-conducting pipe, and the adjacent sides of the edges and corners of the first heat-conducting pipe are respectively coplanar with the corresponding adjacent sides of the edges and corners of the second heat-conducting pipe.

7. The heat dissipation device according to claim 5 or 6, characterized in that: The diagonals of two opposite inner angles of the polygon are the symmetry axes of the polygon.

8. The heat dissipation device according to claim 7, characterized in that: The two opposite internal angles are obtuse angles or acute angles.

9. The heat dissipation device according to claim 8, characterized in that: The interior angle of the polygon is less than 180 degrees.

10. A radiator, characterized in that: The heat dissipation device comprises a fan and any one of claims 1 to 9, wherein the fan is fixed at a side end of the heat dissipation device and faces the pipe opening of the heat conduction pipe to drive the air flow in the heat conduction pipe.

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