Pump source chip mounter and chip mounting control method

Abstract

The application discloses a pump source patching machine and a patching control method. The pump source patching machine comprises a workbench, a rotating disc, a pump source sintering jig, two automatic feeding tools, two automatic patching mechanisms and a driving device. The workbench is circumferentially provided with a sintering disc loading and unloading station and two patching stations. The rotating disc is rotationally arranged on the workbench. The rotating disc is provided with a vacuum suction seat. The vacuum suction seat can reach the sintering disc loading and unloading station and the two patching stations. The pump source sintering jig is arranged on the vacuum suction seat. The pump source sintering jig is provided with a patching groove. The two automatic feeding tools are separately arranged on the workbench and are each provided with a material taking station for providing different pieces to be patched. The two automatic patching mechanisms are separately arranged on the workbench and are used for picking up the pieces to be patched arranged on the corresponding material taking stations to the patching grooves of the corresponding patching stations. The driving device drives the rotating disc to rotate. The two pieces to be patched comprise soldering pieces and chips. The application solves the problem of low efficiency of manual patching in the existing pump source patching process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of pump source patching, in particular to a pump source patching machine and a patching control method. BACKGROUND

[0002] The pump source is a core component of the fiber laser, and in the actual production process, the soldering sheet and the chip need to be connected with the pump source base in a certain order. In the existing production process, manual operation is mostly used. Specifically, the soldering sheet and the chip are picked up by a tweezers, and then placed on the designated position of the pump source base in a certain order. Manual operation is low in efficiency, and has high requirements for the proficiency of the operator. Even the most skilled operator will be tired after a long time of work, resulting in a decline in processing quality and difficulty in guaranteeing the quality standard. SUMMARY

[0003] The main purpose of the present application is to provide a pump source patching machine and a patching control method, which aims to solve the problem of low patching efficiency in the existing pump source patching process using manual patching and feeding.

[0004] To achieve the above-mentioned purpose, the pump source patching machine provided by the present application comprises:

[0005] A workbench is provided with a sintering disc loading and unloading station and two patching stations in the circumferential direction, and the two patching stations are respectively used for patching two kinds of to-be-patched components;

[0006] A turntable is arranged on the workbench along the upper and lower axis, and a vacuum suction seat is arranged on the turntable. The vacuum suction seat can reach the sintering disc loading and unloading station and the two patching stations in turn in the rotation stroke of the turntable;

[0007] A pump source sintering jig is adsorbed and placed on the vacuum suction seat, and a patching groove is arranged on the pump source sintering jig;

[0008] Two automatic feeding tools are arranged on the workbench corresponding to the two patching stations, and each automatic feeding tool forms a material taking station. The two material taking stations are respectively used to provide one kind of to-be-patched component;

[0009] Two automatic patching mechanisms are arranged on the workbench corresponding to the two automatic feeding tools, and are used to pick up the to-be-patched component in the corresponding material taking station to the patching groove of the pump source sintering jig in the corresponding patching station; and

[0010] A driving device is used to drive the rotation of the turntable.

[0011] Among them, the two kinds of to-be-patched components include soldering sheets and chips.

[0012] Optionally, the two picking stations include chip picking stations, the two mounting stations include chip mounting stations corresponding to the chip picking stations, and the two automatic loading fixtures include chip loading fixtures, wherein the chip loading fixtures include:

[0013] A base is provided on the worktable, and the chip picking station is formed on the base;

[0014] The mounting structure is located on the base corresponding to the chip picking station. The mounting structure includes a picking cavity and a dropping cavity that are respectively connected upward. The picking cavity has a picking space at the opening, and the dropping cavity has a dropping space at the opening.

[0015] Multiple material box fixtures are stacked vertically in the material picking chamber, and the material box fixtures are used to place chips;

[0016] A lifting member is movably disposed on the base in the vertical direction. The lifting member can extend into the material picking chamber and lift the plurality of material box fixtures upward to lift the material box fixtures at the upper end to the material picking space.

[0017] A pneumatic gripper for grasping the material box fixture in the material handling space and transferring it to the material dropping space; and

[0018] The dropper is movably disposed on the base in the vertical direction. The dropper can extend into the dropping space of the dropping chamber and load the material box fixture downwards to empty the dropping space.

[0019] Optionally, the bottom of the mounting structure is formed with two clearance through holes that respectively connect the material taking chamber and the material dropping chamber, and the two clearance through holes are respectively used for the corresponding lifting member and the falling member to pass through;

[0020] The chip loading fixture includes:

[0021] The first longitudinal motion module is provided corresponding to the material dropping cavity, and the first longitudinal motion module is movably disposed on the base in the vertical direction and is located below the corresponding clearance through hole. The return member is provided on the first longitudinal motion module.

[0022] A second longitudinal motion module is provided corresponding to the material picking cavity, and the second longitudinal motion module is movably disposed in the vertical direction on the base and below the corresponding clearance through hole; the lifting member is provided on the second longitudinal motion module; and,

[0023] The detection component includes a first sensor, a second sensor, a third sensor, a fourth sensor, a fifth sensor, and a controller disposed on the base. The first sensor is used to detect the material dropping space, the second sensor is used to detect the bottom of the material dropping chamber, the third sensor is used to detect the material picking space, the fourth sensor is used to detect the bottom of the material picking chamber, and the fifth sensor is used to detect the lower space of the material picking space. The controller is electrically connected to the first sensor, the second sensor, the third sensor, the fourth sensor, the fifth sensor, the first longitudinal motion module, and the second longitudinal motion module.

[0024] Optionally, each of the aforementioned automatic placement mechanisms includes:

[0025] The mounting base is movably configured relative to the worktable so that it can reach the corresponding material picking station and the corresponding mounting station during its travel.

[0026] A drive device is mounted on the workbench, and the drive device is connected to the mounting base to drive the mounting base to move.

[0027] A pickup assembly is mounted on the mounting base, and the pickup assembly includes a pickup part that is rotatably mounted on the mounting base along a vertical axis. The pickup part is used to pick up the part to be mounted placed on the corresponding material picking station and place it to the corresponding mounting station.

[0028] A first camera device is mounted on the mounting base. The first camera device is used to capture images of the parts to be mounted at the corresponding material handling station and the mounting slot of the pump source sintering fixture.

[0029] The control device is electrically connected to the drive device, the pickup component, and the camera device, respectively.

[0030] Optionally, the first camera device is located above the material picking station and the mounting station, for taking pictures from above;

[0031] The automatic mounting mechanism also includes a second camera device, which is fixedly mounted on the worktable. The mounting base can move to the upper side of the second camera device during its travel. The second camera device is used to take pictures from bottom to top.

[0032] Optionally, the two automatic feeding fixtures include a welding sheet feeding fixture, wherein the feeding station of the welding sheet feeding fixture is used to provide welding sheets;

[0033] The two automatic placement mechanisms include solder pad placement mechanisms, which are configured to correspond to the solder pad feeding fixtures. Each solder pad placement mechanism also includes a waste bin for holding dirty solder pads.

[0034] Optionally, the pump source sintering fixture includes:

[0035] A pump source base is disposed on the vacuum suction seat, the pump source base is provided with a mounting groove, and the bottom of the mounting groove is provided with multiple chip bonding positions; and,

[0036] A positioning fixture is disposed in the mounting groove and covers the bottom of the mounting groove. The positioning fixture has multiple positioning grooves that extend through the vertical direction, and the multiple positioning grooves are corresponding to multiple chip bonding positions.

[0037] The positioning fixture is provided with at least one positioning post, and the upper edge of the positioning post is chamfered.

[0038] Optionally, the upper surface of the positioning fixture is provided with a plurality of coding holes, and the pump source sintering fixture further includes a plurality of coding pins;

[0039] Different numbers of the coding pins can be selected and inserted into multiple coding holes in different arrangements to form a variety of visual recognition coding combinations.

[0040] Optionally, three vacuum suction holders are provided, and the three vacuum suction holders are arranged at intervals along the circumference of the turntable to correspond to the sintering tray loading and unloading station and the two mounting stations, respectively.

[0041] Optionally, the driving device includes a DD motor, the motor mount of the DD motor is disposed on the worktable, the output shaft of the DD motor rotates along the vertical axis, and the turntable is connected to the output shaft.

[0042] This invention also provides a pump source placement control method for the aforementioned pump source placement machine, wherein the two automatic feeding fixtures include a chip feeding fixture and a soldering die feeding fixture, the two picking stations include a soldering die picking station and a chip picking station, the two automatic placement mechanisms include a soldering die placement mechanism and a chip placement mechanism, and the two placement stations include a soldering die placement station and a chip placement station. The pump source placement control method comprises the following steps:

[0043] After the pump source sintering fixture is positioned and placed on the vacuum suction seat at the sintering tray loading and unloading station, the target mounting position of the chip bonding position in the mounting slot is obtained.

[0044] After the pump source sintering fixture moves from the sintering tray loading station to the welding sheet mounting station, the welding sheet feeding fixture is controlled to replenish the welding sheet to the welding sheet picking station.

[0045] The solder pad placement mechanism is controlled to move according to the target placement position so as to pick up the solder pad on the solder pad picking station and place it at the chip bonding position of the placement slot;

[0046] After the pump source sintering fixture moves from the solder pad mounting station to the chip mounting station, the chip loading fixture is controlled to replenish the chip to the chip unloading station.

[0047] The chip mounting mechanism is controlled to operate according to the target mounting position, so as to pick up the chip from the chip picking station and place it onto the solder pad at the chip bonding position.

[0048] Optionally, the chip loading fixture includes a base, a mounting structure, multiple material box fixtures, a lifting component, a lowering component, a first longitudinal motion module, and a second longitudinal motion module. The base is disposed on the worktable, the chip picking station is formed on the base, and the mounting structure is disposed on the base corresponding to the chip picking station. The mounting structure includes a picking cavity and a dropping cavity that extend upwards. The picking cavity has a picking space at its opening, and the dropping cavity has a dropping space at its opening. The multiple material box fixtures are stacked vertically on the worktable. The material receiving chamber includes a material box fixture for placing chips. A first vertical motion module is movably disposed on the base in the vertical direction. A falling member is disposed on the first vertical motion module. During the stroke of the first vertical motion module, the falling member can extend into the material receiving space and load the material box fixture downwards. A second vertical motion module is movably disposed on the base in the vertical direction. A lifting member is disposed on the second vertical motion module. During the stroke of the second vertical motion module, the lifting member can extend into the material receiving chamber and lift the plurality of material box fixtures upwards.

[0049] The step of controlling the chip loading fixture to replenish chips to the chip unloading station specifically includes the following steps:

[0050] The second occlusion signal at the second position of the chip picking station and the fifth occlusion signal at the fifth position of the chip picking station are acquired respectively.

[0051] When the second blocking signal is unblocked and the fifth blocking signal is blocked, the first blocking signal at the first position of the chip picking station and the third blocking signal at the third position of the chip picking station are respectively acquired.

[0052] When the first occlusion signal is blocked and the third occlusion signal is unblocked, the first longitudinal motion module and the second longitudinal motion module are controlled to move to drive the falling member downward by one unit height and the lifting member upward by one unit height, so as to clear the falling space and replenish the chip in the picking space at the chip picking station.

[0053] Optionally, the chip mounting mechanism includes a mounting base and a pick-up component. The mounting base is movably disposed relative to the worktable so that it can reach the chip picking station and the corresponding chip mounting station during its travel. The pick-up component is mounted on the mounting base and includes a pick-up part rotatably mounted on the mounting base along the vertical axis. The pick-up part is used to pick up the component to be mounted on the chip picking station and transfer it to the chip mounting station.

[0054] The step of controlling the chip placement mechanism to operate according to the target placement position to pick up the chip from the chip picking station and place it onto the solder pad in the placement slot specifically includes the following steps:

[0055] Obtain the position of the chip to be picked up at the chip picking station;

[0056] The pickup unit is controlled to move to the pickup position to pick up the chip;

[0057] The pickup unit is controlled to move to the target mounting position to mount the chip at the chip bonding position.

[0058] Optionally, the step of obtaining the target mounting position of the chip bonding position in the mounting slot specifically includes the following steps;

[0059] Obtain the coding information of the pump source sintering fixture to determine the model of the pump source sintering fixture;

[0060] Obtain the position information of the coordinate reference set on the pump source sintering fixture, and establish the current rectangular coordinate system based on the position information of the coordinate reference;

[0061] The preset mapping relationship is queried according to the current rectangular coordinate system to obtain the position information of each chip bonding position on the pump source sintering fixture. The preset mapping relationship is the correspondence between the model of the pump source sintering fixture and the position information of each chip bonding position on the pump source sintering fixture.

[0062] Optionally, the pump source sintering fixture is provided with multiple coding holes, and the pump source sintering fixture also includes multiple coding pins. Different numbers of the coding pins are selected and inserted into the multiple coding holes at different positions to form a variety of visual recognition codes.

[0063] The step of obtaining the encoding information to determine the model of the pump source sintering fixture includes:

[0064] Obtain the number of the coding pins and the position information of each coding pin within the plurality of coding holes;

[0065] The visual recognition code is obtained based on the position information of each of the coded pins in the plurality of coded holes;

[0066] The model of the pump source sintering fixture is determined by querying a preset coding relationship based on the visual recognition code, wherein the preset coding relationship is the correspondence between the visual recognition code and the model of the pump source sintering fixture.

[0067] In the technical solution provided by this invention, the pump source sintering fixture is manually placed on the vacuum suction holder at the sintering tray loading / unloading station. The driving device drives the turntable to rotate, thereby rotating the vacuum suction holder to the corresponding mounting station. At this time, the corresponding automatic mounting mechanism automatically picks up the solder pads at the corresponding chip picking station and places them into the mounting slot. Then, the driving device drives the turntable to rotate, thereby rotating the vacuum suction holder to another mounting station. At this time, another automatic mounting mechanism automatically picks up the solder pads at another chip picking station. The chip is picked up from the material handling station and placed into the mounting slot, thus completing the alignment and mounting of the solder pad and the chip. Finally, the drive device drives the turntable to rotate, causing the vacuum suction holder to rotate back to the sintering tray loading station. The pump source sintering fixture with the solder pad and chip mounted is then manually removed, and an unmounted pump source sintering fixture is placed. The above mounting process is repeated. The entire solder pad and chip mounting process is completed automatically by the tooling mechanism, replacing manual mounting, ensuring mounting efficiency and quality, and reducing labor costs. Attached Figure Description

[0068] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0069] Figure 1 This is a schematic diagram of a structure of an embodiment of the pump source placement machine provided by the present invention;

[0070] Figure 2 for Figure 1 A schematic diagram of the chip loading fixture in one direction;

[0071] Figure 3 for Figure 2 A schematic diagram of the chip loading fixture (excluding the horizontal motion module and mounting structure);

[0072] Figure 4 for Figure 3 A schematic diagram of the chip loading fixture (excluding the slide block);

[0073] Figure 5 for Figure 2 A structural diagram of the mounting structure (including the material box fixture);

[0074] Figure 6 for Figure 5 A schematic diagram of the structure of the chip cassette and chip cassette cover;

[0075] Figure 7 for Figure 1 A schematic diagram of the chip loading fixture from another direction;

[0076] Figure 8 for Figure 1 A schematic diagram of the structure of an embodiment of the automatic placement mechanism (solder piece placement mechanism);

[0077] Figure 9 for Figure 1 A schematic diagram of another embodiment of the automatic placement mechanism (chip placement mechanism);

[0078] Figure 10 for Figure 8 A partial installation structure diagram of the mounting base, pickup device, and first camera device;

[0079] Figure 11 for Figure 10 A partial installation structure diagram of the mounting base, pickup device, and first camera device from another perspective;

[0080] Figure 12 for Figure 8 Schematic diagram of the sintering fixture for the medium-sized pump source;

[0081] Figure 13 for Figure 12 A three-dimensional structural diagram of the sintering fixture with a pump source from another perspective;

[0082] Figure 14 for Figure 12 A schematic diagram of the positioning column and a schematic diagram of the shooting direction;

[0083] Figure 15 for Figure 14 A schematic diagram of the photographic results of the positioning column;

[0084] Figure 16 forFigure 12 A schematic diagram of a rectangular coordinate system established using two positioning pins;

[0085] Figure 17 for Figure 12 A schematic diagram showing the positions of multiple identification points on the contour boundary of the positioning groove;

[0086] Figure 18 for Figure 17 A schematic diagram of a polygonal contour fitted by multiple recognition points;

[0087] Figure 19 This is a schematic flowchart of an embodiment of the pump source patch mounting control method provided by the present invention.

[0088] Explanation of icon numbers:

[0089] 100. Automatic feeding fixture;

[0090] 100a. Chip loading fixture; 100b. Wafer loading fixture; 11. Base; 111. Temporary storage seat; 112. Rodless cylinder; 113. Slide rail; 114. Slide block; 12. Mounting structure; 121. Material bin; 1211. Limiting post; 121a. Picking chamber; 121b. Dropping chamber; 121c. Clearance through hole; 13. Material box fixture; 131. Chip material box; 132. Chip box cover; 14. Lifting component; 15. Dropping component; 16. Pneumatic gripper; 17. Lateral motion module; 171. Barcode scanner; 172. Vacuum suction cup; 18. Longitudinal motion module; 19. Detection component; 191. First sensor; 192. Second sensor; 193. Third sensor; 194. Fourth sensor; 195. Fifth sensor;

[0091] 200. Pump source sintering fixture;

[0092] 21. Pump source base; 22. Positioning fixture; 221. Positioning groove; 2211. Identification point; 222. Coding hole; 23. Positioning post; 24. Coding pin; 25. Mounting pin;

[0093] 300. Automatic placement mechanism;

[0094] 31. Mounting base; 32. Drive unit; 321. X-axis linear motion module; 322. Y-axis linear motion module; 323. Z-axis linear motion module; 33. Pick-up assembly; 331. Pick-up part; 3311. Nozzle; 332. Drive motor; 34. First camera device; 35. Second camera device; 36. Third camera device; 37. Fourth camera device; 38. Waste bin;

[0095] 400, Turntable; 41, Vacuum suction holder; 500, Worktable; 1000, Pump source chip mounter.

[0096] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0097] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0098] It should be noted that if the embodiments of the present invention involve directional indication, the directional indication is only used to explain the relative positional relationship and movement of the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0099] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0100] The pump source is a core component of a fiber laser. In actual production, the solder pads and chips need to be connected to the pump source base in a specific order. Currently, most of this is done manually. Specifically, workers use tweezers to pick up the solder pads and chips and place them in designated positions on the pump source base. Manual operation is inefficient and requires a high level of skill from the operators. Even highly skilled operators will experience fatigue after prolonged work, leading to a decline in processing quality and making it difficult to guarantee quality standards.

[0101] In view of this, the present invention proposes a pump source placement machine and a placement control method, aiming to solve the problem of low placement efficiency in the existing pump source placement process using manual placement and feeding. Figures 1 to 18 This is a schematic diagram of an embodiment of the pump source placement machine provided by the present invention. Figure 19 This is a schematic flowchart of the pump source patch control method provided by the present invention.

[0102] Please see Figure 1The pump source placement machine 1000 provided by the present invention includes a worktable 500, a turntable 400, a pump source sintering fixture 200, two automatic feeding fixtures 100, two automatic placement mechanisms 300, and a driving device. The worktable 500 is circumferentially arranged with a sintering tray loading / unloading station and two placement stations, each used to place two different types of components. The turntable 400 is rotatably mounted on the worktable 500 along its vertical axis. A vacuum suction seat 41 is provided on the turntable 400. During the rotation stroke of the turntable 400, the vacuum suction seat 41 can sequentially reach the sintering tray loading / unloading station and the two placement stations. The pump source sintering fixture 200 is adsorbed and placed on the vacuum suction seat 41. The pump source sintering fixture 200 is provided with a mounting slot; the two automatic feeding fixtures 100 are respectively set on the worktable 500 corresponding to the two mounting stations, and each of the automatic feeding fixtures 100 forms a picking station, and the two chip picking stations are respectively used to provide one of the components to be mounted; the two automatic mounting mechanisms 300 are respectively set on the worktable 500 corresponding to the two automatic feeding fixtures 100, and are used to pick up the components to be mounted placed at the corresponding chip picking stations and place them into the mounting slot of the pump source sintering fixture 200 at the corresponding mounting station; the driving device is used to drive the turntable 400 to rotate; wherein, the two components to be mounted include solder pads and chips.

[0103] In the technical solution provided by this invention, the pump source sintering fixture 200 is manually placed on the vacuum suction holder 41 at the sintering tray loading station. The driving device drives the turntable 400 to rotate, thereby rotating the vacuum suction holder 41 to the corresponding mounting station. At this time, the corresponding automatic mounting mechanism 300 automatically picks up the solder pads at the corresponding chip picking station and places them into the mounting slot. Then, the driving device drives the turntable 400 to rotate, thereby rotating the vacuum suction holder 41 to another mounting station. At this time, another automatic mounting mechanism 300 automatically picks up the solder pads at the other chip picking station. The chip is picked up from the chip picking station and placed into the mounting slot, thus completing the alignment and mounting of the solder pad and the chip. Finally, the drive device drives the turntable 400 to rotate, so that the vacuum suction holder 41 rotates back to the sintering tray loading station. The pump source sintering fixture 200 with the solder pad and chip mounted is removed manually, and then the unmounted pump source sintering fixture 200 is placed. The above mounting process is repeated. The entire solder pad and chip mounting process is completed automatically by the tooling mechanism, replacing the manual mounting method, ensuring mounting efficiency and quality, and reducing labor costs.

[0104] It should be noted that the pump source sintering fixture 200 with the solder pads and chips mounted needs to be manually placed in the sintering furnace for final sintering and welding; the chips and solder pads also need to be manually replenished to the two automatic feeding fixtures 100; at the same time, the drive control of the drive equipment can be automatic or manual.

[0105] The two automatic feeding fixtures 100 are used to provide solder pads and chips, respectively. Their specific structural forms vary; please refer to [link / reference needed]. Figures 1 to 7In this embodiment, the two chip picking stations include chip picking stations, the two mounting stations include chip mounting stations corresponding to the chip picking stations, and the two automatic loading fixtures 100 include chip loading fixtures 100a. The chip loading fixture 100a includes a base 11, a mounting structure 12, multiple material box fixtures 13, a lifting component 14, a pneumatic gripper 16, and a lowering component 15. The base 11 is disposed on the worktable 500, and the chip picking station is formed on the base 11. The mounting structure 12 is disposed on the base 11 corresponding to the chip picking station. The mounting structure 12 includes a picking cavity 121a and a dropping cavity 121b that extend upwards respectively. The picking cavity 121a has a picking space at its opening. The discharge chamber 121b has a discharge space at its opening; multiple material box fixtures 13 are stacked vertically in the picking chamber 121a, and the material box fixtures 13 are used to place chips; the lifting member 14 is movably disposed on the base 11 in the vertical direction, and the lifting member 14 can extend into the picking chamber 121a and lift the multiple material box fixtures 13 upwards to lift the material box fixtures 13 at the upper end to the picking space; the pneumatic gripper 16 is used to grab the material box fixtures 13 in the picking space to the discharge space; the return member 15 is movably disposed on the base 11 in the vertical direction, and the return member 15 can extend into the discharge space of the discharge chamber 121b and load the material box fixtures 13 downwards to empty the discharge space. In the technical solution provided in this embodiment, after the chips in the material box fixture 13 in the material picking space are picked up, the pneumatic gripper 16 can grab the material box fixture 13 onto the drop member 15 in the material dropping space. Afterwards, the lifting member 14 lifts the remaining stacked material box fixtures 13 upwards, so that the uppermost material box fixture 13 is promptly added to the material picking space. This ensures that the picking part 331 of the corresponding automatic placement mechanism 300 can pick up chips at a uniform height each time, minimizing the movement path of the picking part 331. This ensures chip pickup efficiency. Simultaneously, the downward movement of the dropper 15 moves the material box fixture 13 in the material dropping space downwards, thus clearing the material dropping space. This process is repeated to ensure the shortest gripping path of the pneumatic gripper 16, keeping it in the fastest gripping and dropping state, thus guaranteeing its gripping efficiency and further ensuring the feeding efficiency of the chip loading fixture 100a. Furthermore, by stacking multiple material box fixtures 13, the space requirement is reduced.

[0106] It should be noted that there are multiple ways for the pneumatic gripper 16 to grasp the material box fixture 13. It can be achieved by the slide rail 113 and the cylinder, or by the robotic arm. This embodiment does not limit this. At the same time, there are multiple ways to drive the lifting member 14 and the lowering member 15 to move. It can be achieved by the lead screw and slider, or by the cylinder. This embodiment does not limit this.

[0107] There are several ways to hold chips in the material box fixture 13. Chips can be placed directly on the material box fixture 13, or a chip material box 131 containing chips can be placed inside the material box fixture 13. Specifically, in this embodiment, a chip material box 131 is placed on the material box fixture 13. The chip material box 131 is used to hold multiple chips, and a chip box cover 132 is provided on the chip material box 131. The chip loading fixture 100a includes a transverse motion module 17, which is movably disposed on the base 11 in the front-back direction. The pneumatic gripper 16 is movably disposed on the transverse motion module 17 in the vertical direction. The material picking chamber 121a and the material dropping chamber 121b are arranged along the front-to-back direction below the horizontal motion module 17. The horizontal motion module 17 is equipped with a barcode scanner 171, which is used to read the QR code on the chip cover. By setting the movement direction of the horizontal motion module 17 to be the same as the arrangement direction of the material picking chamber 121a and the material dropping chamber 121b, the horizontal motion module 17 can drive the barcode scanner 171 to identify and input the QR code on the chip cover 132, ensuring that each box of chips is inspected, realizing data management of industrial production, and facilitating product traceability.

[0108] In another embodiment, a chip cassette 131 is placed on the cassette fixture 13. The chip cassette 131 is used to hold multiple chips. A chip cassette cover 132 is provided on the chip cassette 131. The chip loading fixture 100a includes a transverse motion module 17, which is movably disposed on the base 11 in the front-back direction. The pneumatic gripper 16 is movably disposed on the transverse motion module 17 in the vertical direction. The picking chamber 121a and the dropping chamber 121b are arranged below the transverse motion module 17 in the front-back direction. A vacuum suction cup 172 is provided on the transverse motion module 17. The vacuum suction cup 172 is movable in the vertical direction and is used to pick up the chip cassette cover 132. 100a also includes a temporary storage seat 111, which is disposed on the base 11 and arranged on one side of the mounting structure 12 in the front-back direction. By setting the movement direction of the lateral motion module 17 to be the same as the arrangement direction of the picking chamber 121a and the dropping chamber 121b, and by setting the temporary storage seat 111 on one side of the mounting structure 12 in the front-back direction, the lateral motion module 17 can drive the vacuum suction cup 172 to accurately pick up the chip box cover 132 and place it on the temporary storage seat 111. Similarly, the lateral motion module 17 can drive the vacuum suction cup 172 to quickly pick up the chip box cover 132 from the temporary storage seat 111 and place it back on the chip box 131, thereby improving the chip picking efficiency.

[0109] Since chips need to be manually replenished promptly after being picked up from the material box fixture 13, and it is inconvenient to directly replenish and replace chips at the working positions corresponding to the pneumatic gripper 16, the lifting member 14, and the falling member 15, in this embodiment, a chip replenishment station is also formed on the base 11, and the chip picking station is arranged corresponding to the lifting member 14 and the falling member 15. The base 11 is equipped with a rodless cylinder 112 and a slide rail 113, and the slide rail 113... After passing through the chip picking station and the chip replenishment station, the slide rail 113 is provided with a slide base 114, and the rodless cylinder 112 is used to drive the slide base 114 to switch between the chip picking station and the chip replenishment station; the mounting structure 12 includes two material loading chambers 121, both of which are detachably mounted on the slide base 114 and arranged in the front-back direction, and the picking chamber 121aa and the dropping chamber 121bb are respectively formed in the two material loading chambers 121. The rodless cylinder 112 drives the slide 114 to switch between the chip picking station and the chip replenishment station, which means that the mounting structure 12 can switch between the chip picking station and the chip replenishment station. When all the chips in the material box fixture 13 have been picked up, the rodless cylinder 112 can be controlled to drive the mounting structure 12 to the chip replenishment station, so that the operator can disassemble the two material bins 121 to replace them with new material bins 121, ensuring that the replenishment process is efficient and safe.

[0110] It should be noted that the material hopper 121 can be detachably mounted on the slide block 114 in various forms, such as by snap-fit ​​connection or by limiting structure. This embodiment of the invention does not limit this.

[0111] Please see Figure 2 and Figure 5In this embodiment, the mounting structure 12 includes two material loading chambers 121 arranged in the front-back direction. Each material loading chamber 121 includes multiple upwardly extending limiting posts 1211. The multiple limiting posts 1211 are arranged at intervals in the horizontal circumferential direction to enclose and form the material picking chamber 121a or the material dropping chamber 121b. By setting two identical material loading bins 121, one for loading a full load of chips and the other for loading a completely empty bin, the versatility of the material loading bins 121 is improved. Simultaneously, since the material loading bins 13 need to move upwards or downwards within the material loading bins 121, frictional wear is inevitable. By configuring the material loading bins 121 as composed of multiple limiting posts 1211, frictional wear with the material loading bins 13 can be reduced, ensuring the service life of both the material loading bins 13 and the material loading bins 121, and reducing maintenance and replacement costs. Furthermore, the material loading bins 13 require clearance space when gripped from the side by the pneumatic gripper 16, and this clearance space can be formed between two adjacent limiting posts 1211, facilitating the gripping operation of the pneumatic gripper 16.

[0112] There are multiple ways to implement the lifting member 14 extending into the material receiving chamber 121a. Similarly, there are multiple ways to implement the falling member 15 extending into the falling chamber 121b. For details, please refer to [link to relevant documentation]. Figures 2 to 4 In this embodiment, the bottom of the mounting structure 12 has two clearance through holes 121c that respectively connect the material picking chamber 121a and the material dropping chamber 121b. The two clearance through holes 121c are respectively used for the corresponding lifting member 14 and the falling member 15 to pass through. The chip loading fixture 100a includes two longitudinal motion modules 18. The two longitudinal motion modules 18 are movably disposed on the base 11 in the vertical direction and are respectively disposed below the two clearance through holes 121c. The lifting member 14 and the falling member 15 are respectively disposed on the two longitudinal motion modules 18. By allowing the clearance through the through hole 121c, the two longitudinal motion modules 18 can drive the corresponding lifting member 14 and the falling member 15 to extend upward into the material picking chamber 121a and the material dropping chamber 121b. This driving method is relatively direct and the lifting and falling driving of the material box fixture 13 is relatively precise, so as to ensure that the material picking space can be accurately filled by a single material box fixture 13 and the material dropping space can be accurately emptied.

[0113] It should be noted that the longitudinal motion module 18 can be connected to the base 11 through a lead screw and slider mechanism, or it can be connected to the base 11 through other various forms. This embodiment of the invention does not limit this.

[0114] The lifting member 14 and the lowering member 15 can take various forms. Specifically, in this embodiment, the base 11 has multiple through holes corresponding to the two clearance through holes 121c. Both the lifting member 14 and the lowering member 15 include multiple push rods. The lower ends of the multiple push rods are connected to the longitudinal motion module 18, and the upper ends of the multiple push rods are adapted to pass through the corresponding through holes. The through holes can effectively position the push rods, so that the up and down movement direction of the push rods is accurate.

[0115] Please see Figure 7In this embodiment, the bottom of the mounting structure 12 has two clearance through holes 121c that respectively connect the material picking cavity 121a and the material dropping cavity 121b. The two clearance through holes 121c are respectively used for the corresponding lifting member 14 and the falling member 15 to pass through. The chip loading fixture 100a includes a first longitudinal motion module, a second longitudinal motion module and a detection component 19. The first longitudinal motion module is disposed corresponding to the material dropping cavity 121b, and the first longitudinal motion module is movably disposed in the vertical direction on the base 11 and below the corresponding clearance through hole 121c. The falling member 15 is disposed on the first longitudinal motion module. The second longitudinal motion module is disposed corresponding to the material picking cavity 121a, and the second longitudinal motion module is movably disposed in the vertical direction on the base 11 and below the corresponding clearance through hole 121c. The lifting member 14 is disposed on the second longitudinal motion module; the detection component 19 includes a first sensor 191, a second sensor 192, a third sensor 193, a fourth sensor 194, a fifth sensor 195 and a controller disposed on the base 11. The first sensor 191 is used to detect the material dropping space, the second sensor 192 is used to detect the bottom of the material dropping cavity 121b, the third sensor 193 is used to detect the material picking space, the fourth sensor 194 is used to detect the bottom of the material picking cavity 121a, and the fifth sensor 195 is used to detect the lower space of the material picking space. The controller is electrically connected to the first sensor 191, the second sensor 192, the third sensor 193, the fourth sensor 194, the fifth sensor 195, the first longitudinal motion module and the second longitudinal motion module.In this embodiment, the first sensor 191 can detect whether the material box fixture 13 exists in the material dropping space, and the second sensor 192 can detect whether the material box fixture 13 exists at the bottom of the material dropping cavity 121b. The first sensor 191 and the second sensor 192 are electrically connected to the controller to comprehensively reflect the current position of the material box fixture 13 in the material dropping cavity 121b, thereby determining whether to drive the first longitudinal motion module. The entire process is accurately controlled and responds promptly, greatly improving the emptying efficiency of the material dropping space. Simultaneously, the third sensor 193 can detect whether the material box fixture 13 exists in the material picking space, the fourth sensor 194 can detect whether the material box fixture 13 exists at the bottom of the material picking cavity 121a, and the fifth sensor 195 can detect whether the material box fixture 13 exists at the bottom of the material picking cavity 121a. The presence of a material box fixture 13 in the lower space of the material picking space is detected, and then electrically connected to the controller via the third sensor 193, the fourth sensor 194, and the fifth sensor 195 to comprehensively reflect the current position of the material box fixture 13 in the material picking chamber 121a, thereby determining whether feedback should be given to drive the second longitudinal motion module. The entire process is accurate and timely, greatly improving the replenishment efficiency of the material picking space. Through real-time detection by each sensor, the actions of the first longitudinal motion module and the second longitudinal motion module are synchronously controlled to simultaneously control the actions of the lifting component 14 and the falling component 15. This allows the material box fixture 13 to be replenished to the material picking space in a timely manner while the falling space is emptied, completing the preparation work for the next chip picking in a short time and improving the chip loading efficiency.

[0116] Please see Figure 1 In another embodiment, the two picking stations further include a solder pad picking station, and the two mounting stations include a solder pad mounting station corresponding to the solder pad picking station. The automatic feeding fixture 100 further includes a solder pad feeding fixture 100b, which includes a feeding feeder. The solder pad picking station is formed at one end of the feeding tape of the feeding feeder. The feeding tape has multiple solder pads attached to it and is wound around the drive roller and driven roller of the feeding feeder.

[0117] The automatic placement mechanism 300 is mainly used to pick up the parts to be placed from the corresponding material picking station and place them into the placement slot of the pump source sintering fixture 200 at the corresponding placement station. It has various structural forms; for details, please refer to [link / reference needed]. Figure 1 , Figures 8 to 11In this embodiment, each of the automatic placement mechanisms 300 includes a mounting base 31, a drive device 32, a pickup component 33, a first camera device 34, and a control device. The mounting base 31 is movably disposed relative to the worktable 500 so that it can reach the corresponding material picking station and the corresponding placement station during its travel. The drive device 32 is mounted on the worktable 500 and drives the mounting base 31 to move. The pickup component 33 is mounted on the mounting base 31. The pickup assembly 33 includes a pickup part 331 rotatably mounted on the mounting base 31 along the vertical axis. The pickup part 331 is used to pick up the component to be mounted placed on the corresponding material picking station and move it to the corresponding mounting station. The first camera device 34 is mounted on the mounting base 31 and is used to capture images of the component to be mounted at the corresponding material picking station and the mounting slot of the pump source sintering fixture 200. The control device is electrically connected to the drive device 32, the pickup assembly 33 and the camera device. In this embodiment, the driving device 32 drives the mounting base 31 to move between the corresponding material picking station and the corresponding mounting station on the workbench 500. The picking unit 331 picks up the part to be mounted from the material picking station to the corresponding mounting station. During the picking and placing, the first camera device 34 performs visual recognition to determine the precise position of the part to be mounted at the corresponding material picking station and the mounting slot on the pump source sintering fixture 200 at the corresponding mounting station. Then, based on the recognition result, the mounting base 31 and the picking unit 331 are controlled to perform the picking and placing actions. Compared to manual placement, this embodiment uses an automated picking method controlled by the picking unit 331, which has high picking efficiency. By using the first camera device 34 for image positioning, the picking and placing accuracy is high and errors are less likely to occur.

[0118] Furthermore, in this embodiment, the first camera device 34 is located above the chip picking station and the mounting station, and is used to take pictures from top to bottom; the automatic mounting mechanism 300 also includes a second camera device 35, which is fixedly mounted on the worktable 500. The mounting base 31 is movable to the upper side of the second camera device 35 during its travel, and the second camera device 35 is used to take pictures from bottom to top. In this embodiment, the first camera device 34 includes a first camera and a first light. The first camera extends vertically and is located on one side of the pickup component 33. The first light is located below the first camera for downward illumination. The mounting base 31 is provided with a camera bracket for fixing the first camera and the first light. When picking up the part to be mounted, the first camera device 34 is first moved to directly above the picking station. The first camera takes a picture, and the first light illuminates the area to determine the exact position of the part to be mounted at the picking station and whether there is dirt on the upper surface of the part. Then, the mounting base 31 is moved to move the picking part 331 to the position of the part to be mounted for picking. If there is no dirt, the subsequent mounting operation continues. The first camera device 34 is also used to photograph the pump source sintering fixture 200. The upper surface of the pump source sintering fixture 200 is provided with an identification code. The first camera device 34 identifies the identification code to determine the model of the pump source sintering fixture 200, and then determines the specific position of the multiple mounting slots of the pump source sintering fixture 200. The second camera device 35 includes a second camera and a second light. The second camera extends vertically and is fixedly installed on one side of the workbench 500. The second light is located above the second camera for upward illumination. After the pickup unit 331 picks up the part to be mounted, it first controls its movement to be directly above the second camera to take a picture, in order to determine the geometric center deviation between the part to be mounted and the pickup unit 331 and whether there is dirt on the lower surface of the part to be mounted. If there is no dirt, the displacement of the pickup unit 331 to the mounting station is calculated based on the geometric deviation, and the part to be mounted is mounted in the corresponding mounting groove of the pump source sintering fixture 200.

[0119] In another embodiment, the two automatic feeding fixtures 100 include a solder sheet feeding fixture 100b, the feeding station of which is used to provide solder sheets; the two automatic placement mechanisms 300 include a solder sheet placement mechanism, which is arranged corresponding to the solder sheet feeding fixture 100b, and the solder sheet placement mechanism also includes a waste bin 38 for placing dirty solder sheets. Since the solder sheets are consumable parts with low usage costs, when dirt is found on the solder sheet, the picking unit 331 is directly controlled to discard the solder sheet into the waste bin 38, which helps to ensure the placement efficiency of the solder sheets.

[0120] The pickup unit 331 can pick up the component to be mounted in various ways, including clamping or gripping. Specifically, in this embodiment, the lower end of the pickup unit 331 is provided with a suction nozzle 3311, which is used to pick up the component to be mounted. The suction nozzle 3311 is connected to a vacuum device, which creates a vacuum. When picking up the component to be mounted, the pickup unit 331 abuts against the upper surface of the component, and the suction nozzle 3311 creates negative pressure to adsorb and pick up the component. The mounting base 31 is also provided with a third camera device 36, which is used to film the suction nozzle 3311. The third camera device 36 is fixedly installed on one side of the pickup unit 331 and is normally open, to film the process of the suction nozzle 3311 picking up and mounting the component to be mounted. If any abnormality occurs, it is convenient to record and analyze the cause of the abnormality. The equipment can be improved based on the analysis results to enhance accuracy and efficiency.

[0121] In this embodiment, the pickup assembly 33 includes a drive motor 332, which is fixedly mounted on the mounting base 31 and drives the pickup part 331 to rotate about an axis extending in the vertical direction. Specifically, the drive motor 332 is located on the upper side of the pickup part 331, and is connected to the pickup part 331 via a coupling to drive the pickup part 331 to rotate about an R-axis extending in the vertical direction, thereby adjusting the position angle of the part to be mounted.

[0122] Specifically, the drive motor 332 may be a servo motor.

[0123] The driving device 32 is used to drive the mounting base 31 to move between the material picking station and the mounting station. It has various structural forms. In this embodiment, the driving device 32 is specifically a three-axis platform, including an X-axis linear motion module 321, a Y-axis linear motion module 322, and a Z-axis linear motion module 323. The Y-axis linear motion module 322 drives and connects to the X-axis linear motion module 321, causing the X-axis linear motion module 321 to move linearly along the Y-axis. The X-axis linear motion module 321 drives and connects to the Z-axis linear motion module 323, causing the Z-axis linear motion module 323 to move linearly along the X-axis. The Z-axis linear motion module 323 drives and connects to the mounting base 31, causing the mounting base 31 to move linearly along the Z-axis. This allows the mounting base 31 to move along the X, Y, and Z axes based on the images captured by the first camera device 34 and the second camera device 35, as well as the calculation results. It is understandable that the X-axis, Y-axis, and Z-axis are perpendicular to each other.

[0124] In other embodiments, the three-axis platform can also be a three-axis linear motion mechanism driven by a lead screw and slide rail 113. The structure is a commonly used technical means in the prior art, and will not be described in detail here.

[0125] Please see Figures 12 to 18 In this embodiment, the pump source sintering fixture 200 includes a pump source base 21 and a positioning fixture 22. The pump source base is disposed on the vacuum suction seat 41, and the mounting groove is formed on the pump source base 21. The bottom of the mounting groove has multiple chip bonding positions. The positioning fixture 22 is disposed in the mounting groove and covers the bottom of the mounting groove. The positioning fixture 22 has multiple positioning grooves 221 that extend vertically. The multiple positioning grooves 221 are corresponding to the multiple chip bonding positions. The positioning fixture 22 has at least one positioning post 23, and the upper edge of the positioning post 23 is chamfered. By setting the positioning fixture 22 and opening multiple positioning grooves 221 corresponding to the multiple chip bonding positions on the positioning fixture 22, the solder pads and chips are sequentially mounted in the positioning grooves 221 during mounting to achieve positioning of the solder pads and chips. Therefore, the boundaries of the positioning grooves 221 need to be identified during mounting. In this invention, two positioning posts 23 are set on the positioning fixture 22, with their upper edges chamfered to facilitate the visual recognition device in identifying their outlines. By identifying the positions of the two positioning posts 23, a Cartesian coordinate system is established using them as a reference. The positions of a plurality of preset positioning slots 221 are then obtained based on this Cartesian coordinate system. Compared to the traditional method of directly photographing and recognizing the outlines of the positioning slots 221, which often becomes blurred and unrecognizable after long-term use, this invention pre-enters the positions of the corresponding positioning slots 221 into the system. The visual recognition device then only recognizes the positioning posts 23, resulting in fast, clear, and accurate recognition.

[0126] Please see Figures 14 to 15 When taking photos using a visual recognition device, a flash is typically used. The light reflects off the object's surface and back to the device for identification. By making the upper surface of the positioning post 23 smooth and its upper edge chamfered, the upper surface of the positioning post 23 reflects light during photography, while its upper edge reflects the light outwards, preventing it from being received by the visual recognition device. This creates a dark, ring-shaped outline, facilitating recognition by the device.

[0127] It should be noted that the bottom of the mounting groove is generally set in an inclined stepped shape, and multiple chip bonding positions are correspondingly set on each stepped protrusion. When the visual recognition device recognizes the positioning fixture 22, in order to ensure visual accuracy and mounting convenience, the upper surface of the positioning fixture 22 must be perpendicular to the shooting angle of the visual recognition device. Therefore, the lower surface of the positioning fixture 22 is set in a stepped shape corresponding to the bottom of the mounting groove.

[0128] It should be further noted that the outline of the positioning groove 221 is set according to the shape of the chip, and the specific shape is not limited here. In this embodiment, the positioning groove 221 is set as a rectangle.

[0129] In one specific embodiment of the present invention, two positioning posts 23 are provided, and two positioning holes are provided on the upper surface of the positioning fixture 22. Pins are provided at the lower ends of the two positioning posts 23, so that the two positioning posts 23 are respectively inserted into the two positioning holes. Each pin is interference-fitted with the corresponding positioning hole to fix the two positioning posts 23 in the two positioning holes. The positioning posts 23 are detachable to prevent wear and deformation from prolonged use, which could affect image recognition. Replacement is simple; just pull out the corresponding positioning post 23 and replace it with a new one. Replacement is simple, low-cost, and durable.

[0130] The shape of the two positioning posts 23 is not limited in this invention; they can be square, rhomboid, or circular. In this embodiment, both positioning posts 23 are circular, which facilitates production and simplifies identification. The two movable annular shapes are photographed by the visual recognition device. Positioning is achieved by identifying the centers of the two annular shapes. A Y-axis is established, passing through the origin and perpendicular to the X-axis, with the line connecting the two centers as the X-axis and one of the centers as the origin, to form a rectangular coordinate system.

[0131] Understandably, the choice of the origin, the positive direction of the X-axis, and the positive direction of the Y-axis can be selected in advance to ensure that the Cartesian coordinate system is the same after each photo recognition.

[0132] In the technical solution of this invention, the pump source generally has multiple models, and correspondingly, the pump source sintering fixture 200 has multiple models, as does the positioning fixture 22. The positions of the multiple positioning slots 221 and the positions of the positioning posts 23 are different for different models of the positioning fixture 22. Therefore, before identifying the positioning posts 23 and performing chip mounting, it is necessary to first identify the model of the pump source sintering fixture 200. However, when the pump source sintering fixture 200 is sintered in a vacuum sintering furnace, not only will the positioning slots 221 become blurred due to long-term use, but traditional code recognition or QR code recognition will also deform or melt due to high temperatures, resulting in the inability to recognize codes after only a few uses, leading to high costs and reduced production efficiency.

[0133] Please see Figure 12 and Figure 13 In this embodiment, the upper surface of the positioning fixture 22 is provided with multiple coding holes 222, and the pump source sintering fixture 200 also includes multiple coding pins 24. Different numbers of coding pins 24 can be selected and inserted into the multiple coding holes 222 in different arrangements to form various visual recognition coding combinations. The multiple coding holes 222 are arranged in an array on the upper surface of the positioning fixture 22, and the upper edges of the multiple coding pins 24 are chamfered. When identifying the model of the positioning fixture 22, the array area of ​​the multiple coding holes 222 is photographed. By identifying the coding pins 24, it is determined whether each coding pin 24 is inserted into each coding hole 222 to obtain different graphic coding information. Alternatively, the visual recognition device can be pre-set so that when the coding pin 24 is identified in the corresponding coding hole 222, the output signal is [signal], and when the coding pin 24 is not identified in the corresponding coding hole 222, the output model is [model], to obtain different binary sequence coding information.

[0134] It is understood that each of the coded pins 24 is interference-fitted with its corresponding coded hole 222 to fix each coded pin 24 in the corresponding coded hole 222. The number of coded holes 222 is not limited here; the maximum number of coded pins 24 corresponds to the number of coded holes 222. Different numbers of coded pins 24 can be arranged in multiple coded holes 222 to form various visual recognition coding combinations. In this invention, the number of coded holes 222 is at least two. To accommodate more types of positioning fixtures 22, in this embodiment, the number of coded holes 222 is [number missing], arranged in a nine-square grid. If more types of positioning fixtures 22 are required, more coded holes 222 can be provided, all of which should be within the protection scope of this invention.

[0135] Each of the coding pins 24 is detachable to prevent wear and deformation of the coding pins 24 after long-term use, which would affect photo recognition. Replacement is simple; just pull out the corresponding coding pin 24 and replace it with a new one. Replacement is simple, low-cost, and durable.

[0136] In this embodiment of the invention, the upper surface of the pump source base 21 is provided with a plurality of first mounting holes, and the positioning fixture 22 is provided with a plurality of second mounting holes corresponding to the plurality of first mounting holes; the pump source sintering fixture 200 further includes a plurality of mounting pins 25, which are respectively inserted through the plurality of second mounting holes to be inserted into the plurality of first mounting holes. The positioning fixtures 22 are fixedly mounted on the pump source base 21 by the mounting pins 25. To ensure the stability of the installation, each mounting pin 25 is interference-fitted with the corresponding first mounting hole and the corresponding second mounting hole.

[0137] Since the pump source sintering fixture 200 rotates to another mounting station after being mounted at one mounting station, the corresponding automatic mounting mechanism 300 that mounts the solder pads first may be idle, resulting in a waste of the mechanism's production capacity. Therefore, in this embodiment, three vacuum suction holders 41 are provided, spaced apart along the circumference of the turntable 400, corresponding to the sintering tray loading station and the two mounting stations respectively. By providing three vacuum suction holders 41, three pump source sintering fixtures 200 can be mounted simultaneously, ensuring that both automatic mounting mechanisms 300 are in operation during each mounting period, greatly improving the mounting efficiency of the pump source sintering fixture 200.

[0138] The drive device can have various structural forms. Specifically, in this embodiment, the drive device includes a DD motor. The motor mount of the DD motor is mounted on the worktable 500, and the output shaft of the DD motor rotates along the vertical axis. The turntable 400 is connected to the output shaft. Because the DD motor has good driving stability, using a DD motor for driving can stably drive the turntable 400 to rotate, so that the pump source sintering fixture 200 accurately reaches the corresponding placement station, thus ensuring the quality of the placement.

[0139] The pump source placement control method provided by the present invention is used in the above-mentioned pump source placement machine 1000, wherein the two automatic feeding fixtures 100 include a chip feeding fixture 100a and a soldering fixture 100b, the two chip picking stations include a soldering picking station and a chip picking station, the two automatic placement mechanisms 300 include a soldering placement mechanism and a chip placement mechanism, and the two placement stations include a soldering placement station and a chip placement station;

[0140] Please seeFigure 19 The pump source patch control method includes the following steps:

[0141] S10. After the pump source sintering fixture 200 is positioned and placed on the vacuum suction seat 41 at the sintering tray loading and unloading station, the target mounting position of the chip bonding position in the mounting slot is obtained.

[0142] S20. After the pump source sintering fixture 200 moves from the sintering tray loading station to the welding sheet mounting station, the welding sheet feeding fixture 100b is controlled to move to replenish the welding sheet to the welding sheet picking station.

[0143] S30. Control the solder pad mounting mechanism to move according to the target mounting position, so as to pick up the solder pad on the solder pad picking station and place it at the chip mounting position of the mounting slot;

[0144] S40. After the pump source sintering fixture 200 moves from the solder pad mounting station to the chip mounting station, the chip loading fixture 100a is controlled to move to replenish the chip to the chip picking station.

[0145] S50. Control the chip mounting mechanism to operate according to the target mounting position, so as to pick up the chip on the chip picking station and place it onto the solder pad at the chip bonding position.

[0146] In the technical solution provided in this embodiment, the pump source sintering fixture 200 is first manually positioned on the vacuum suction seat 41 at the sintering tray loading station. Then, the driving device is controlled to rotate the pump source sintering fixture 200 to the solder pad mounting station. Simultaneously, solder pads are replenished at the solder pad picking station. Then, the solder pad mounting mechanism is controlled to pick up the solder pads and place them into the corresponding mounting slots of the pump source sintering fixture 200 at the solder pad mounting station, thus completing the solder pad mounting. Finally, the driving device is controlled to rotate the pump source sintering fixture 200 to the chip mounting station. Simultaneously, the chip picking station is replenished... The chip is placed in a chip mounting mechanism, which is then controlled to pick up the chip and place it in the chip mounting position of the corresponding mounting slot of the pump source sintering fixture 200 at the chip mounting station. The chip is then stacked on top of the solder pad, thus completing the chip mounting. Finally, the drive device is controlled to rotate and reset the pump source sintering fixture 200 to the sintering tray loading station. The mounted pump source sintering fixture 200 is then manually removed and reloaded with an unmounted one. The next mounting cycle then begins. The entire solder pad and chip mounting process is automated by the fixture mechanism, replacing manual mounting. This ensures mounting efficiency and quality while reducing labor costs. It should be noted that each of the mounting slots is provided with a chip mounting position for chip bonding. The target mounting position is fixed relative to the coordinate position of the pump source sintering fixture 200. The target mounting position is obtained by the fourth camera device 37 set at the sintering tray loading station by photographing the pump source sintering fixture 200. At the same time, the coordinate position of the pump source sintering fixture 200 is fixed when it rotates to the solder pad mounting station or the chip mounting station. Therefore, when the pump source sintering fixture 200 is at the solder pad mounting station or the chip mounting station, the solder pad mounting mechanism and the chip mounting structure can move according to the target mounting position to pick up the solder pad and the chip sequentially to the chip bonding position.

[0147] Specifically, in this embodiment, the chip loading fixture 100a includes a base 11, a mounting structure 12, multiple material box fixtures 13, a lifting component 14, a lowering component 15, a first longitudinal motion module, and a second longitudinal motion module. The base 11 is disposed on the worktable 500, and the chip picking station is formed on the base 11. The mounting structure 12 is disposed on the base 11 corresponding to the chip picking station. The mounting structure 12 includes a picking cavity 121a and a dropping cavity 121b that are respectively open upwards. The picking cavity 121a has a picking space at its opening, and the dropping cavity 121b has a dropping space at its opening. The multiple material box fixtures... The 13 are stacked vertically in the material picking chamber 121a. The material box fixture 13 is used to place the chip. The first vertical motion module is movably disposed on the base 11 in the vertical direction. The falling member 15 is disposed on the first vertical motion module. During the stroke of the first vertical motion module, the falling member 15 can extend into the material dropping space and load the material box fixture 13 downward. The second vertical motion module is movably disposed on the base 11 in the vertical direction. The lifting member 14 is disposed on the second vertical motion module. During the stroke of the second vertical motion module, the lifting member 14 can extend into the material picking chamber 121a and lift the plurality of material box fixtures 13 upward.

[0148] The step S20 of controlling the chip loading fixture 100a to replenish the chip to the chip unloading station specifically includes the following steps:

[0149] S24. Acquire the second obstruction signal at the second position of the chip picking station and the fifth obstruction signal at the fifth position of the chip picking station, respectively.

[0150] S25. When the second blocking signal is unblocked and the fifth blocking signal is blocked, the first blocking signal at the first position of the chip picking station and the third blocking signal at the third position of the chip picking station are respectively acquired.

[0151] S26. When the first blocking signal is blocked and the third blocking signal is unblocked, control the first longitudinal motion module and the second longitudinal motion module to drive the falling member 15 downward by one unit height and the lifting member 14 upward by one unit height, so as to clear the falling space and replenish the chip in the picking space at the chip picking station.

[0152] It should be noted that the first position corresponds to the location of the material dropping space; the second position corresponds to the location of the bottom of the material dropping cavity 121bb; the third position corresponds to the location of the material taking space; and the fifth position corresponds to the location of the lower space of the material taking space.

[0153] When the first blocking signal is blocked and the third blocking signal is unblocked, it means that the core-picking fixture 13 has been picked up and placed in the dropping space. At this time, by controlling the first and second longitudinal motion modules, the lifting member 14 is driven upward by one unit height, and the lowering member 15 is driven downward by one unit height to replenish the core-picking fixture 13 in the picking space, while clearing the dropping space to prepare for the next core picking and transfer of the chip mounting mechanism from the fixture 13. It should be understood that the unit height is the thickness of the fixture 13.

[0154] When the second blocking signal is unblocked and the fifth blocking signal is blocked, it means that the falling member 15 has not completely fallen back to the lowest position of the falling cavity 121b. The falling cavity 121bb can still continue to stack empty material box fixtures 13, and the picking cavity 121aa still has at least one corresponding material box fixture 13 at the fifth position. The picking cavity 121aa can still continue to provide fully loaded material box fixtures 13.

[0155] It should be noted that, in order to reduce the number of times chips need to be manually added to the feeding chamber, the feeding chamber must be filled completely each time, so that the two conditions of the second blocking signal being blocked and the fifth blocking signal being unblocked can be met simultaneously.

[0156] More specifically, in this embodiment, the chip loading fixture 100a further includes a lateral motion module 17, which is movably disposed on the base 11 in the front-back direction so as to reach above the material picking space and the material dropping space. The lateral motion module 17 is provided with a pneumatic gripper 16 that can move up and down, and the pneumatic gripper 16 is used to grip the material box fixture 13.

[0157] The two automatic placement mechanisms 300 include chip placement mechanisms, each including a pick-up unit 331 for picking up and transferring chips;

[0158] After step S26, which controls the first and second longitudinal motion modules to drive the lowering member 15 downward by one unit height and simultaneously drive the lifting member 14 upward by one unit height to clear the material dropping space while replenishing the material picking space at the chip picking station, the method further includes:

[0159] S27. After the picking unit 331 has picked up all the chips in the top material box fixture 13, the horizontal motion module 17 and the pneumatic gripper 16 are controlled to move to grab the material box fixture 13 in the picking space to the dropping space.

[0160] S28. Acquire the second occlusion signal at the second position of the chip picking station and the fifth occlusion signal at the fifth position of the chip picking station, respectively.

[0161] S29a. When the second occlusion signal is unoccluded and the fifth occlusion signal is occluded, repeat the above steps S25~S28.

[0162] S29b When the second blocking signal is blocked and the fifth blocking signal is unblocked, control the first longitudinal motion module and the second longitudinal motion module to drive the lifting member 14 to the initial lifting position and drive the lowering member 15 to the initial lowering position.

[0163] In the technical solution provided in this embodiment, a lateral motion module 17 and a pneumatic gripper 16 are used to transfer an empty material box fixture 13 from the picking space to the dropping space. When the second blocking signal is unblocked and the fifth blocking signal is blocked, it means that the chip loading fixture 100a can still provide a fully loaded material box fixture 13. After the picking unit 331 has picked up all the chips in the material box fixture 13 at the top, the lateral motion module 17 and the pneumatic gripper 16 are controlled to move to grab the material box fixture 13 in the picking space to the dropping space. After that, when the second blocking signal is blocked, the fifth blocking signal is blocked. When the five-blocking signal is unblocked, it means that the falling component 15 has completely fallen back to the lowest position of the falling cavity 121b, the falling cavity 121b is fully loaded with the material box fixture 13, and the picking cavity 121a is emptied. At this time, the first longitudinal motion module and the second longitudinal motion module are controlled to move to drive the lifting component 14 to the initial lifting position and drive the falling component 15 to the initial falling position. It is easy to understand that the initial lifting position is lower than the picking cavity 121a and the initial falling position is lower than the falling cavity 121b. This makes it convenient for manual refilling of the picking cavity 121a.

[0164] After refilling the material picking chamber 121a, it is necessary to drive the lifting member 14 and the lowering member 15 to move back to the preparatory working position. Specifically, in this embodiment, before step S24 of obtaining the second blocking signal of the second position of the chip picking station and the fifth blocking signal of the fifth position of the chip picking station, the following is also included:

[0165] S22. Obtain the second blocking signal at the second position and the fourth blocking signal at the fourth position of the material picking station, respectively;

[0166] S23. When the fourth blocking signal is blocked and the second blocking signal is unblocked, control the first longitudinal motion module and the second longitudinal motion module to move, so as to drive the lifting member 14 from the initial lifting position to the fourth position and drive the falling member 15 from the initial falling position to the first position.

[0167] It should be noted that the chip picking station also includes a fourth position, which corresponds to the bottom of the picking cavity 121a. When the fourth blocking signal is blocked and the second blocking signal is unblocked, it means that the dropping cavity 121b is empty and the picking cavity 121a is fully loaded with the material box fixture 13. At this time, the lifting member 14 should be driven from the initial lifting position to the fourth position to abut against the material box fixture 13, and the falling member 15 should be driven from the initial falling position. The position is driven to the first position to prepare to receive the core-taking jig 13. This ensures that after the pneumatic gripper 16 grabs the core-taking jig 13 in the picking chamber 121a to the dropping chamber 121b, the lifting member 14 and the lowering member 15 can rise and fall at the fastest speed to replenish the picking chamber 121a and empty the dropping chamber 121b. In order to minimize the frequency of replenishment, the picking chamber 121a is filled completely each time it is manually replenished.

[0168] Furthermore, in this embodiment, the base 11 of the chip loading fixture 100a is provided with a rodless cylinder 112, and a chip replenishment station is also formed on the base 11. The rodless cylinder 112 is used to drive the mounting structure 12 to switch between the chip replenishment station and the chip picking station.

[0169] Before step S22, which involves acquiring the second blocking signal at the second position and the fourth blocking signal at the fourth position of the chip picking station, the following steps are also included:

[0170] S21. Obtain the feeding command and control the rodless cylinder 112 to drive the mounting structure 12 from the chip feeding station to the chip picking station.

[0171] After step S29b, which controls the operation of the first longitudinal motion module and the second longitudinal motion module to drive the lifting member 14 to the initial lifting position and the lowering member 15 to the initial lowering position, the following steps are further included:

[0172] Obtain a material replenishment command and control the rodless cylinder 112 to drive the mounting structure 12 from the chip picking station to the chip replenishment station.

[0173] In the technical solution provided in this embodiment, when the mounting structure 12 is in the chip replenishment station, the operator can easily replenish the mounting structure 12. After replenishment, the rodless cylinder 112 drives the mounting structure 12 to the chip picking station for subsequent picking. When all the chips in the loading box fixture 13 of the mounting structure 12 are picked up, the rodless cylinder 112 drives the mounting structure 12 to reset to the chip replenishment station. The replenishment process is convenient and efficient. At the same time, the rodless cylinder 112 can also accurately drive the mounting structure 12 to switch between the chip picking station and the chip replenishment station, and the position positioning is accurate.

[0174] There are multiple ways to obtain occlusion signals, including contact and non-contact methods. Specifically, the first occlusion signal is obtained through the first sensor 191, the second occlusion signal is obtained through the second sensor 192, the third occlusion signal is obtained through the third sensor 193, the fourth occlusion signal is obtained through the fourth sensor 194, and the fifth occlusion signal is obtained through the fifth sensor 195.

[0175] In another embodiment, the horizontal motion module 17 is also provided with a vacuum suction cup 172 that can move up and down, the material box fixture 13 is provided with a chip material box 131, the chip material box 131 is covered with a chip box cover 132, and the base 11 is provided with a temporary storage seat 111.

[0176] After the chip suction nozzle 3311 has completely picked up all the chips in the top material box fixture 13, the following steps are included before controlling the lateral motion module 17 and the pneumatic gripper 16 to move the material box fixture 13 in the picking space to the dropping space:

[0177] Obtain the occlusion signal at the third position;

[0178] When the occlusion signal of the third position is occluded, the horizontal motion module 17 and the vacuum suction cup 172 are controlled to move to pick up the chip box cover 132 in the picking space and put it onto the temporary storage seat 111.

[0179] After the chip suction nozzle 3311 has completely picked up all the chips in the top material box fixture 13, the step of controlling the lateral motion module 17 and the pneumatic gripper 16 to move the material box fixture 13 in the picking space to the dropping space also includes the following steps:

[0180] After the chip suction nozzle 3311 has completely picked up all the chips in the top material box fixture 13, the horizontal motion module 17 and the vacuum suction cup 172 are controlled to move to pick up the chip box cover 132 from the temporary storage seat 111 onto the chip box 131 in the material picking space.

[0181] The transverse motion module 17 and the pneumatic gripper 16 are controlled to move to grab the material box fixture 13 in the material picking space and move it to the material dropping space.

[0182] In the technical solution provided in this embodiment, for the chip cassette 131 with a chip cassette cover 132, the chip cassette cover 132 is first lifted onto the temporary storage seat 111 by the action of the lateral motion module 17 and the vacuum suction cup 172, so as to facilitate the subsequent chip extraction operation by the external chip suction nozzle 3311; after the chip extraction is completed, the chip cassette cover 132 is lifted back from the temporary storage seat 111 and closed onto the chip cassette 131 by the action of the lateral motion module 17 and the vacuum suction cup 172, and then the chip cassette 131 is gripped by the pneumatic gripper 16. The whole process is accurate and logical, and effectively handles the opening and chip extraction operation of the chip cassette 131.

[0183] Furthermore, in this embodiment, the lateral motion module 17 is equipped with a barcode scanner 171, which scans the barcode scanner when the occlusion signal at the third position is blocked.

[0184] Before the step of controlling the lateral motion module 17 and the vacuum suction cup 172 to pick up the chip cassette cover 132 in the picking space and place it onto the temporary storage base 111, the following steps are also included:

[0185] The horizontal motion module 17 is controlled to move so as to obtain the QR code information parameters on the chip box cover 132 through the barcode scanner 171.

[0186] In the technical solution provided in this embodiment, by obtaining the QR code information parameters of the chip box before removing the cover 132, it can be ensured that each box of chips is tested, realizing data-driven management of industrial production and facilitating product traceability.

[0187] In this embodiment, the chip mounting mechanism includes a mounting base 31 and a pick-up component 33. The mounting base 31 is movably disposed relative to the worktable 500 so that it can reach the chip picking station and the corresponding chip mounting station during its travel. The pick-up component 33 is mounted on the mounting base 31 and includes a pick-up part 331 rotatably mounted on the mounting base 31 along the vertical axis. The pick-up part 331 is used to pick up the chip placed on the chip picking station and transfer it to the chip mounting station.

[0188] Step S50, which controls the chip placement mechanism to operate according to the target placement position to pick up the chip from the chip picking station and place it onto the solder pad in the placement slot, specifically includes the following steps:

[0189] S51. Obtain the position of the chip to be picked up at the chip picking station;

[0190] S52, Control the pickup unit 331 to move to the pickup position to pick up the chip;

[0191] S54. Control the pickup unit 331 to move to the target mounting position so as to mount the chip at the chip bonding position.

[0192] In the technical solution provided in this embodiment, the first camera device 34 is controlled to capture images of the chip picking station to determine the chip's pick-up position. Based on the position information of the pick-up position, the driving device 32 is controlled to drive the picking part 331 to move to the pick-up position. The nozzle 3311 of the picking part 331 is controlled to connect with the vacuum to pick up the chip. Then, the picking part 331 is controlled to move to the target mounting position and the chip is mounted at the chip mounting position. The nozzle 3311 is then controlled to disconnect from the vacuum to complete one mounting operation. The process is then repeated at the chip picking station for the next mounting operation.

[0193] In this embodiment, the chip has a front and a back side;

[0194] Step S51, which involves obtaining the pick-up position of the chip at the chip picking station, specifically includes:

[0195] S511. Obtain first image information parameters of the front side of the chip, wherein the first image information parameters include first position parameters;

[0196] S512, the step of controlling the pickup unit 331 to move to the pickup position to pick up the chip includes:

[0197] S513, Obtain the second position parameter of the pickup unit 331;

[0198] S514. Calculate the first position deviation parameter based on the first position parameter and the second position parameter;

[0199] S515. Control the movement of the pickup unit 331 according to the first position deviation parameter, so that the position parameter of the pickup unit 331 after movement coincides with the first position parameter.

[0200] In the technical solution provided in this embodiment, the first position parameter is specifically the coordinate position of the geometric center of the chip, and the second position parameter is specifically the coordinate position of the geometric center of the nozzle 3311. The control device calculates a first position deviation parameter between the first position parameter and the second position parameter to guide the drive device 32 to drive the X-axis linear motion module 321, the Y-axis linear motion module 322, the Z-axis linear motion module 323, and the drive motor 332 according to the first deviation parameter, so as to drive the nozzle 3311 of the pickup part 331 to move to coincide with the geometric center of the upper surface of the chip, and control the drive motor 332 to drive the nozzle 3311 to rotate along the R-axis to adjust the pickup angle.

[0201] It should be noted that in the technical solution of the present invention, an XYZ three-axis coordinate system is established with the X-axis linear motion module 321, the Y-axis linear motion module 322 and the Z-axis linear motion module 323 as the reference. In the embodiments of the present invention, the X-axis, Y-axis or Z-axis can be used as the up and down direction, and there is no limitation. In this embodiment, the Z-axis is used as the up and down direction, and subsequent embodiments will all use the Z-axis as the up and down direction as the reference.

[0202] In this embodiment, the first image information parameter further includes a chip ID information parameter, and step S513 of obtaining the second position parameter of the pickup unit 331 specifically includes:

[0203] S513a. When the chip ID information parameter is correctly matched with the chip and the MES system, the second position parameter of the pickup unit 331 is obtained.

[0204] After step S511 of obtaining the first image information parameters of the front of the chip, the method further includes:

[0205] S513b: When the chip ID information parameters do not match the MES system correctly, control the automatic placement mechanism 300 to stop and control the alarm device to issue an alarm prompt.

[0206] It should be noted that each chip has a different chip ID information parameter and different performance. Therefore, when installing multiple chips in the mounting slot of the pump source sintering fixture 200, they need to be installed in a set order. When mounting the chips in sequence, the first camera device 34 needs to identify the chip ID information parameter of the corresponding chip and compare it with the MES system. If the match is correct, the second position parameter of the pickup unit 331 is obtained for pickup. If the chip ID information parameter of the corresponding chip does not match the MES system, the automatic mounting mechanism 300 is stopped and an alarm is issued, waiting for manual intervention to avoid incorrect chip mounting that would affect the finished product quality of the pump source.

[0207] In this embodiment, the chip has a front and a back side. Before step S54, which involves controlling the pickup unit 331 to move to the target mounting position to mount the chip at the chip bonding position, the method further includes:

[0208] S531. Obtain the second image information parameters of the reverse side of the chip, wherein the second image information parameters include a third position parameter;

[0209] S532, Obtain the fourth position parameter of the picking unit 331;

[0210] S533. Calculate the second position deviation parameter based on the third position parameter and the fourth position parameter;

[0211] Step S54, which involves controlling the pickup unit 331 to move to the target mounting position to mount the chip at the chip bonding position, includes:

[0212] S541. Calculate the third position deviation parameter based on the fourth position parameter and the parameter of the target mounting position;

[0213] S542. Determine the final position deviation parameter based on the second position deviation parameter and the third position deviation parameter;

[0214] S543. Control the pickup unit 331 to move to the target mounting position according to the final position deviation parameter.

[0215] In the technical solution provided in this embodiment, to improve the accuracy of chip mounting, after the pickup unit 331 picks up the chip and before mounting the chip at the bonding position, the chip is first moved to directly above the second camera device 35. The second camera device 35 obtains the third position parameter of the back side of the chip. Specifically, the third position parameter is the position coordinate of the geometric center of the chip at this time. Then, the fourth position parameter information of the pickup unit 331 is obtained. Specifically, the fourth position parameter information is the position coordinate of the geometric center of the nozzle 3311 at this time. The control device calculates the second position deviation parameter based on the third and fourth position parameter information to guide the pickup unit 331 to calibrate the accurate position of the chip.

[0216] Simultaneously, the third position deviation parameter is calculated based on the fourth position parameter of the pickup unit 331 and the parameter of the target mounting position. Based on the second position deviation parameter and the third position deviation parameter, the final position deviation parameter is determined. Then, based on the final position deviation parameter, the pickup unit 331 moves to the target mounting position and accurately mounts the chip in the corresponding mounting slot of the pump source sintering fixture 200.

[0217] It should be noted that, to reduce computational load, the fourth position parameter is generally a fixed value. Specific coordinate parameters are pre-set for the pickup unit 331's movement above the second camera device 35 to ensure that the pickup unit 331 always moves to the same position. These specific coordinate parameters include the X, Y, Z, and R axis information of the nozzle 3311. Furthermore, the chip is generally rectangular, and the mounting groove of the pump source sintering fixture 200 also has a rectangular cross-section. The third position parameter of the chip also includes the position coordinates of the chip's four vertices to determine the chip's R-axis information. It is understood that the chip can also be circular or other polygonal; its shape information can be pre-entered into the system for positional identification. The specific shape is not limited here.

[0218] In this embodiment, the second image information parameter further includes a second dirt information parameter, and step S532 of obtaining the fourth position parameter of the pickup unit 331 specifically includes:

[0219] S532a. When the reverse side of the chip is free of dirt, the fourth position parameter of the pickup unit 331 is obtained.

[0220] After step S531, which involves obtaining the second image information parameters of the reverse side of the chip, the method further includes:

[0221] S532b: When the back of the chip is dirty, the pickup unit 331 is controlled to put the chip back to the pickup position.

[0222] In this embodiment, the second dirt information parameter is used to determine whether there is dirt on the back of the chip. If there is no dirt, the fourth position parameter of the pickup unit 331 is obtained, and the chip is mounted to the target mounting position. If there is dirt on the back of the chip, in order to avoid affecting the sintering and soldering effect during sintering and to avoid the chip displacement caused by dirt, the pickup unit 331 is controlled to put the chip back to the pickup position. Specifically, the chip is put back to the first position parameter.

[0223] It should be noted that the chips are generally placed in the chip cassette 131, which has multiple receiving slots to accommodate multiple chips. If the back of a chip is dirty, the chip is placed back into the corresponding receiving slot for manual processing. At the same time, the corresponding mounting slot on the pump source sintering fixture 200 is opened, and the picking unit 331 is controlled to pick up the next chip from the next receiving slot and mount the next chip into the next mounting slot on the pump source sintering fixture 200. If the back of the next chip is still dirty, the process is repeated. After the mounting slots of the pump source sintering fixture 200 are completed, the mounting slots without mounted chips are manually processed. The system can record and mark the position of the mounting slots without mounted chips, as well as the position of the corresponding chip on the chip cassette 131, for easy manual processing.

[0224] In this embodiment, the solder pad mounting mechanism includes a mounting base 31 and a pickup component 33. The mounting base 31 is movably disposed relative to the worktable 500 so that it can reach the solder pad picking station and the corresponding solder pad mounting station during its travel. The pickup component 33 is mounted on the mounting base 31 and includes a pickup part 331 rotatably mounted on the mounting base 31 along the vertical axis. The pickup part 331 is used to pick up the solder pad placed on the solder pad picking station and transfer it to the solder pad mounting station.

[0225] Step S30, which controls the solder pad placement mechanism to operate according to the target placement position to pick up the solder pad from the solder pad picking station to the chip bonding position in the placement slot, specifically includes the following steps:

[0226] S31. Obtain the position of the welding sheet to be picked up at the welding sheet picking station;

[0227] S32. Control the pickup unit 331 to move to the pickup position to pick up the solder piece;

[0228] S34. Control the pickup unit 331 to move to the target mounting position so as to mount the solder pad to the chip bonding position.

[0229] In the technical solution provided in this embodiment, the first camera device 34 is controlled to capture the solder sheet picking station to determine the position to be picked up of the solder sheet. Based on the position information of the position to be picked up, the driving device 32 is controlled to drive the picking part 331 to move to the position to be picked up, and the suction nozzle 3311 of the picking part 331 is controlled to connect with the vacuum to pick up the solder sheet. Then, the picking part 331 is controlled to move to the target mounting position and the solder sheet is mounted at the solder sheet mounting position. The suction nozzle 3311 is controlled to disconnect from the vacuum to complete one mounting. Then, the process is repeated at the solder sheet picking station to continue the next mounting.

[0230] In this embodiment, the solder pad has a front side and a back side;

[0231] Step S31, which involves obtaining the position of the welding piece to be picked up at the welding piece picking station, specifically includes:

[0232] S311. Obtain first image information parameters of the front side of the solder sheet, wherein the first image information parameters include a first position parameter;

[0233] S312, the step of controlling the pickup unit 331 to move to the pickup position to pick up the solder piece includes:

[0234] S313, Obtain the second position parameter of the pickup unit 331;

[0235] S314. Calculate the first position deviation parameter based on the first position parameter and the second position parameter;

[0236] S315. Control the movement of the pickup unit 331 according to the first position deviation parameter, so that the position parameter of the pickup unit 331 after movement coincides with the first position parameter.

[0237] In the technical solution provided in this embodiment, the first position parameter is specifically the coordinate position of the geometric center of the solder sheet, and the second position parameter is specifically the coordinate position of the geometric center of the suction nozzle 3311. The control device calculates a first position deviation parameter between the first position parameter and the second position parameter to guide the drive device 32 to drive the X-axis linear motion module 321, the Y-axis linear motion module 322, the Z-axis linear motion module 323, and the drive motor 332 according to the first deviation parameter, so as to drive the suction nozzle 3311 of the pickup unit 331 to move to coincide with the geometric center of the upper surface of the solder sheet, and control the drive motor 332 to drive the suction nozzle 3311 to rotate along the R-axis to adjust the pickup angle.

[0238] Furthermore, in this embodiment, the first image information parameter further includes a first dirt information parameter, and step S313 of obtaining the second position parameter of the pickup unit 331 specifically includes:

[0239] S313a. When there is no dirt on the front side of the solder sheet, obtain the second position parameter of the pickup unit 331;

[0240] After step S311 of obtaining the first image information parameters of the front side of the solder sheet, the method further includes:

[0241] S313b. When the front side of the solder sheet is dirty, the picking unit 331 is controlled to put the solder sheet into the waste bin 38.

[0242] It should be noted that the chip mounting of the pump source requires high precision, therefore the surface of the solder pad must be free of contaminants. Contaminants can cause chip displacement during sintering, affecting the laser output of the pump source. Therefore, the first image information parameter also includes the first contaminant information parameter of the front side of the solder pad. The first contaminant information parameter is used to determine whether there is contamination on the front side of the solder pad. If there is no contamination, subsequent steps proceed normally. If contamination is detected on the front side of the solder pad, after the picking unit 331 picks up the solder pad, it is controlled to place the solder pad into the waste bin 38 for recycling, and then a new solder pad is picked up from the picking station.

[0243] In this embodiment, the solder pad has a front and a back side, and before step S34 of controlling the pickup unit 331 to move to the target mounting position to mount the solder pad at the solder pad bonding position, the method further includes:

[0244] S331. Obtain the second image information parameters of the reverse side of the solder sheet, wherein the second image information parameters include a third position parameter;

[0245] S332, Obtain the fourth position parameter of the picking unit 331;

[0246] S333. Calculate the second position deviation parameter based on the third position parameter and the fourth position parameter;

[0247] Step S34, which involves controlling the pickup unit 331 to move to the target mounting position to mount the solder pad onto the chip bonding position, includes:

[0248] S341. Calculate the third position deviation parameter based on the fourth position parameter and the parameter of the target mounting position;

[0249] S342. Determine the final position deviation parameter based on the second position deviation parameter and the third position deviation parameter;

[0250] S343. Control the pickup unit 331 to move to the target mounting position according to the final position deviation parameter.

[0251] In the technical solution provided in this embodiment, to improve the accuracy of solder pad placement, after the pick-up unit 331 picks up the solder pad and before placing it at the solder pad bonding position, the solder pad is first moved to directly above the second camera device 35. The second camera device 35 obtains the third position parameter of the back side of the solder pad. Specifically, the third position parameter is the position coordinate of the geometric center of the solder pad at this time. Then, the fourth position parameter information of the pick-up unit 331 is obtained. Specifically, the fourth position parameter information is the position coordinate of the geometric center of the nozzle 3311 at this time. The control device calculates the second position deviation parameter based on the third and fourth position parameter information to guide the pick-up unit 331 to calibrate the accurate position of the solder pad.

[0252] Simultaneously, the third position deviation parameter is calculated based on the fourth position parameter of the pickup unit 331 and the parameter of the target mounting position. Based on the second position deviation parameter and the third position deviation parameter, the final position deviation parameter is determined. Then, based on the final position deviation parameter, the pickup unit 331 moves to the target mounting position and accurately mounts the solder pad in the corresponding mounting slot of the pump source sintering fixture 200.

[0253] It should be noted that, to reduce computational load, the fourth position parameter is generally a fixed value. Specific coordinate parameters are pre-set for the pickup unit 331's movement above the second camera device 35 to ensure that the pickup unit 331 always moves to the same position. These specific coordinate parameters include the X, Y, Z, and R axis information of the suction nozzle 3311. Furthermore, the shape of the solder sheet is generally a rectangle, and the cross-sectional shape of the mounting groove in the pump source sintering fixture 200 is also rectangular. The third position parameter of the solder sheet also includes the position coordinates of the four vertices of the solder sheet to determine its R-axis information. It is understood that the shape of the solder sheet can also be circular or other polygonal; its shape information can be pre-entered into the system for positional identification. The specific shape is not limited here.

[0254] In this embodiment, the second image information parameter further includes a second dirt information parameter, and step S332 of obtaining the fourth position parameter of the pickup unit 331 specifically includes:

[0255] S332a. When there is no dirt on the reverse side of the solder sheet, obtain the fourth position parameter of the pickup unit 331;

[0256] After step S331 of obtaining the second image information parameters of the reverse side of the solder sheet, the method further includes:

[0257] S332b: When the reverse side of the solder sheet is dirty, the picking unit 331 is controlled to put the solder sheet into the waste bin 38.

[0258] In this embodiment, the second contamination information parameter is used to determine whether there is contamination on the reverse side of the solder pad. If there is no contamination, the fourth position parameter of the pickup unit 331 is obtained, and the solder pad is mounted to the target mounting position. If there is contamination on the reverse side of the solder pad, in order to avoid affecting the sintering and welding effect during sintering and to avoid chip displacement caused by contamination, the pickup unit 331 is controlled to put the solder pad into the waste bin 38 to recycle the solder pad, and then returns to the pickup position to pick up the next solder pad.

[0259] In this embodiment, step S10 of obtaining the target mounting position of the chip bonding position in the mounting groove specifically includes the following steps;

[0260] S11. Obtain the coding information of the pump source sintering fixture 200 to determine the model of the pump source sintering fixture 200;

[0261] S12. Obtain the position information of the coordinate reference set on the pump source sintering fixture 200, and establish the current rectangular coordinate system with the position information of the coordinate reference;

[0262] S14. Query the preset mapping relationship according to the current rectangular coordinate system to obtain the position information of each chip bonding position on the pump source sintering fixture 200. The preset mapping relationship is the correspondence between the model of the pump source sintering fixture 200 and the position information of each chip bonding position on the pump source sintering fixture 200.

[0263] In the technical solution provided in this embodiment, the pump source sintering fixture 200 has multiple models. The positioning groove 221 of the pump source sintering fixture 200 has different positions and coordinate reference positions for different models. First, the coding information on the pump source sintering fixture 200 is obtained by taking a picture using a visual recognition device to determine the model of the pump source sintering fixture 200. Then, the coordinate reference position information on the pump source sintering fixture 200 that needs to be mounted is obtained by taking a picture, and a current rectangular coordinate system is established based on the current coordinate reference position information. According to the current rectangular coordinate system, the preset mapping relationship is queried. The preset mapping relationship is specifically the correspondence between the model of the pump source sintering fixture 200 and the position information of each chip mounting position on the pump source sintering fixture 200, thereby obtaining the position information of each chip mounting position on the pump source sintering fixture 200. By setting coordinate references and the preset mapping relationship, it is not necessary to identify each bonding position individually when identifying each chip mounting position, which reduces the identification efficiency. Only the model and corresponding coordinate reference are needed to obtain the position information of each chip mounting position. This also avoids the problem that the chip mounting positions may become blurred due to long-term use of the pump source sintering fixture 200, which may lead to the inability to identify them.

[0264] In this embodiment, the pump source sintering fixture 200 is provided with a plurality of coding holes 222, and the pump source sintering fixture 200 also includes a plurality of coding pins 24. Different numbers of the coding pins 24 are selected and inserted into the plurality of coding holes 222 at different positions to form a variety of visual recognition codes.

[0265] Step S11, which involves obtaining the coding information of the pump source sintering fixture 200 to determine the model of the pump source sintering fixture 200, includes:

[0266] S111. Obtain the number of the coding pins 24 and the position information of each coding pin 24 within the plurality of coding holes 222;

[0267] S112. Obtain the visual recognition code based on the position information of each of the coding pins 24 in the plurality of coding holes 222;

[0268] S113. Determine the model of the pump source sintering fixture 200 by querying the preset coding relationship according to the visual recognition code, wherein the preset coding relationship is the correspondence between the visual recognition code and the model of the pump source sintering fixture 200.

[0269] In the technical solution provided in this embodiment, when the pump source sintering fixture 200 is sintered in a vacuum sintering furnace, not only will the positioning groove 221 become blurred due to long-term use, but traditional coding or QR code recognition will also deform or melt due to high temperature, resulting in the inability to recognize after a few uses, which is costly and affects production efficiency.

[0270] In this embodiment, the upper surface of the positioning fixture 22 is provided with a plurality of coding holes 222, and the pump source sintering fixture 200 further includes a plurality of coding pins 24. Different numbers of the coding pins 24 can be selected and inserted into the plurality of coding holes 222 in different arrangements to form various visual recognition coding combinations. The plurality of coding holes 222 are arranged in an array on the upper surface of the positioning fixture 22, and the upper edges of the plurality of coding pins 24 are chamfered. When identifying the model of the positioning fixture 22, the array area of ​​the plurality of coding holes 222 is photographed, and the presence or absence of a coding pin 24 in each coding hole 222 is determined by identifying the coding pins 24, thereby obtaining different graphic coding information.

[0271] Furthermore, in this embodiment, a plurality of the encoding holes 222 are arranged in an array, and the visual recognition encoding includes a binary sequence;

[0272] Step S112, which involves obtaining the visual recognition code based on the position information of each of the coding pins 24 in the plurality of coding holes 222, includes:

[0273] S1121. Obtain image information of the plurality of encoding holes 222;

[0274] S1122. Based on the image information of the multiple encoding holes 222, determine the values ​​of each digit of the binary sequence to form a visual recognition code.

[0275] Multiple coding holes 222 are arranged in an array on the upper surface of the positioning fixture 22, and the upper edges of multiple coding pins 24 are beveled. When identifying the model of the positioning fixture 22, the array area of ​​multiple coding holes 222 is photographed. By identifying multiple coding holes 222 in a fixed order, it is determined whether each coding hole 222 has a coding pin 24 inserted in it, so as to obtain different binary coding sequences.

[0276] Furthermore, step S1122, which determines the value of each digit of the binary sequence based on the image information of the plurality of encoding holes 222, includes:

[0277] S11221. When there is no coding pin 24 corresponding to the coding hole 222, the value of the number of bits in the binary sequence corresponding to the coding hole 222 is determined to be 0.

[0278] S11222 When the encoding pin 24 is present in the corresponding encoding hole 222, the value of the number of bits in the binary sequence corresponding to the encoding hole 222 is determined to be 1.

[0279] In this embodiment, a visual recognition device can be pre-set to output a signal of 1 when the coded pin 24 is identified in the corresponding coded hole 222, and output a signal of 0 when the coded pin 24 is not identified in the corresponding coded hole 222. The recognition results of multiple coded holes 222 are sequentially combined to obtain different binary number sequence encoding information.

[0280] In this embodiment, the pump source sintering fixture 200 is provided with two positioning posts 23;

[0281] Step S12, which involves obtaining the position information of a coordinate reference set on the pump source sintering fixture 200 and establishing the current rectangular coordinate system based on the position information of the coordinate reference, includes:

[0282] S121. Obtain the first contour image information of the two positioning posts 23 to obtain two first annular patterns;

[0283] S122. Establish an abscissa along the direction of the line connecting the centers of the two first annular shapes, and establish a ordinate along the direction passing through one of the two centers and perpendicular to the abscissa, to form the current rectangular coordinate system.

[0284] In this embodiment, two positioning posts 23 are provided on the pump source sintering fixture 200. The upper edges of the two positioning posts 23 are chamfered to facilitate the visual recognition device to identify the outline of the two positioning posts 23. The position of the two positioning posts 23 is identified, and a current rectangular coordinate system is established with the two positioning posts 23 as the reference.

[0285] Please see Figure 14 and Figure 15When taking photos using a visual recognition device, a flash is typically used. The light reflects off the object's surface and back to the device for identification. By making the upper surface of the positioning post 23 smooth and its upper edge chamfered, the upper surface of the positioning post 23 reflects light during photography, while its upper edge reflects the light outwards, preventing it from being received by the visual recognition device. This creates a dark, ring-shaped outline, facilitating recognition by the device.

[0286] Specifically, in this embodiment, the upper surface of the pump source sintering fixture 200 is provided with two positioning holes, and the lower ends of the two positioning posts 23 are provided with pins, so that the two positioning posts 23 are respectively inserted into the two positioning holes. Each pin is interference-fitted with the corresponding positioning hole, so that the two positioning posts 23 are fixedly installed in the two positioning holes. Each positioning post 23 is detachable to prevent wear and deformation of the positioning post 23 after long-term use, which would affect image recognition. Replacement is simple; just pull out the corresponding positioning post 23 and replace it with a new one. Replacement is simple, low-cost, and durable.

[0287] The shape of the two positioning posts 23 is not limited in this invention; they can be square, rhomboid, or circular. In this embodiment, both positioning posts 23 are circular, which facilitates production and simplifies identification. The two movable annular shapes are photographed by the visual recognition device. Positioning is achieved by identifying the centers of the two annular shapes. A Y-axis is established, passing through the origin and perpendicular to the X-axis, with the line connecting the two centers as the X-axis and one of the centers as the origin, to form a rectangular coordinate system.

[0288] Understandably, the choice of the origin, the positive direction of the X-axis, and the positive direction of the Y-axis can be selected in advance to ensure that the Cartesian coordinate system is the same after each photo recognition.

[0289] In this embodiment, each chip mounting position on the pump source sintering fixture 200 is provided with a positioning groove 221, and the pump source sintering fixture 200 is provided with two positioning posts 23.

[0290] Before step S14, which involves querying a preset mapping relationship based on the current Cartesian coordinate system to obtain the position information of each chip mounting position on the pump source sintering fixture 200, the following is also included:

[0291] S121. Obtain the second contour image information of the two positioning posts 23 to obtain two second annular patterns;

[0292] S122. Establish an abscissa with the direction of the line connecting the centers of the two second annular shapes, and establish a ordinate through one of the two centers and perpendicular to the abscissa to form an associated rectangular coordinate system.

[0293] S123. After setting multiple identification points 2211 on the contour boundary of the positioning groove 221, image information of each identification point 2211 is obtained.

[0294] S124. Fit each of the identification points 2211 according to a preset rule to form a polygonal outline;

[0295] S125. Establish a preset mapping relationship by matching the coordinate position information of each polygonal contour in the associated rectangular coordinate system with the model of the pump source sintering fixture 200.

[0296] Please see Figure 12 and Figure 13 In the technical solution provided in this embodiment, the pump source sintering fixture 200 is provided with a plurality of positioning slots 221 corresponding to each chip mounting position, which are used to position the chip and prevent the chip from shifting during transportation. Before the pump source sintering fixture 200 is put into use, the positions of the positioning slots 221 of each type of pump source need to be entered into the system for easy data retrieval during subsequent use. During system input, the associated Cartesian coordinate system of the current pump source sintering fixture 200 is first established by photographing and recognizing the two positioning posts 23. Then, multiple recognition points 2211 are set on the contour boundary of the positioning groove 221 using a visual recognition device. The contour boundary information of the positioning groove 221 at each recognition point 2211 is obtained. The visual recognition device can fit the contour boundary information of the positioning groove 221 at each recognition point 2211 according to preset rules, and connect them to form the polygonal contour. The coordinate position information of each polygonal contour in the associated Cartesian coordinate system is matched with the model of the pump source sintering fixture 200, and a preset mapping relationship has been established. When put into production, the coordinates of the polygonal contour of each positioning groove 221 of the corresponding model in the corresponding Cartesian coordinate system can be called according to the preset mapping relationship. The accuracy is high and the recognition efficiency is high.

[0297] It should be noted that the outline of the positioning groove 221 is set according to the shape of the chip, and the specific shape is not limited here. In this embodiment, the positioning groove 221 is set as a rectangle.

[0298] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A pump source patcher, characterized by, The utility model relates to a kind of automatic pick-and-place device for two kinds of components, comprising: Workbench, sintering tray loading and unloading station and two mounting stations are arranged circumferentially, two mounting stations are used to mount two kinds of components to be mounted respectively; Rotary table is arranged on the workbench along the up-down axis, the rotary table is provided with vacuum chuck, the vacuum chuck can reach sintering tray loading and unloading station and two mounting stations in turn in the rotary travel of the rotary table; Pump source sintering fixture is adsorbed and placed in the vacuum chuck, the pump source sintering fixture is provided with mounting groove; Two automatic feeding tools are arranged on the workbench corresponding to two mounting stations respectively, each automatic feeding tool is formed with material taking station, two material taking stations are used to provide one of the components to be mounted respectively; Two automatic mounting mechanisms are arranged on the workbench corresponding to two automatic feeding tools respectively, to pick up the component to be mounted placed in corresponding material taking station to the mounting groove of pump source sintering fixture in corresponding mounting station; And, Driving device is used to drive the rotary table to rotate; Wherein, the two kinds of components to be mounted include soldering sheet and chip; Each automatic mounting mechanism comprises: Mounting seat, which is movably arranged relative to the workbench, so that it can reach corresponding material taking station and corresponding mounting station in the activity stroke; Driving device is installed on the workbench, the driving device is drivingly connected with the mounting seat, to drive the mounting seat to move; Pick-up assembly is installed on the mounting seat, and the pick-up assembly comprises pick-up part rotatably mounted on the mounting seat along the up-down axis, the pick-up part is used to pick up the component to be mounted placed in corresponding material taking station to corresponding mounting station; First camera is installed on the mounting seat, the first camera is used to shoot the position of the component to be mounted in corresponding material taking station and the mounting groove of pump source sintering fixture; Control device is electrically connected with the driving device, the pick-up assembly and the camera respectively; The pump source sintering fixture comprises: Pump source base is arranged in the vacuum chuck, the pump source base is provided with mounting groove, the bottom of the mounting groove is provided with a plurality of chip mounting positions;And, Positioning fixture is arranged in the mounting groove and covers the bottom of the mounting groove, the positioning fixture is provided with a plurality of positioning grooves penetrating in the up-down direction, a plurality of positioning grooves are arranged corresponding to a plurality of chip mounting positions; Wherein, the positioning fixture is provided with two positioning columns, the edge of the upper end of the positioning column is chamfered; Two positioning columns are circular columns, so that the visual recognition device can recognize the outline of two positioning columns, and a rectangular coordinate system is established based on two positioning columns by recognizing the position of two positioning columns.

2. The pump source taping machine of claim 1, wherein, Two material taking stations include chip material taking station, two mounting stations include chip mounting station corresponding to the chip material taking station, two automatic feeding tools include chip feeding tool, the chip feeding tool comprises: Base is arranged on the workbench, the chip material taking station is formed in the base; The mounting structure is arranged on the base corresponding to the chip taking station, and comprises upwardly penetrating taking cavities and dropping cavities respectively, the taking cavity has a taking space at an opening, and the dropping cavity has a dropping space at an opening; A plurality of magazine jigs are arranged in the taking cavities in a stacked manner, and the magazine jigs are used for placing chips; A jacking member is movably arranged on the base in the up-down direction, the jacking member can extend into the taking cavity and jack up the plurality of magazine jigs upwardly to jack up the magazine jigs at the upper end to the taking space; A pneumatic hand claw is used to grasp the magazine jigs in the taking space to the dropping space; and A dropping member is movably arranged on the base in the up-down direction, the dropping member can extend into the dropping space of the dropping cavity and load the magazine jigs downwardly to empty the dropping space.

3. The pump source taping machine of claim 2, wherein, The bottom of the mounting structure is formed with two accommodating through holes respectively communicating the taking cavities and the dropping cavities, and the two accommodating through holes are respectively used for the corresponding jacking member and the dropping member to pass through; The chip feeding tooling comprises: A first longitudinal movement module is arranged corresponding to the dropping cavity, and the first longitudinal movement module is movably arranged on the base in the up-down direction and below the corresponding accommodating through hole, and the dropping member is arranged on the first longitudinal movement module; A second longitudinal movement module is arranged corresponding to the taking cavity, and the second longitudinal movement module is movably arranged on the base in the up-down direction and below the corresponding accommodating through hole, and the jacking member is arranged on the second longitudinal movement module; and A detection assembly comprises a first sensor, a second sensor, a third sensor, a fourth sensor, a fifth sensor and a controller arranged on the base, the first sensor is used to detect the dropping space, the second sensor is used to detect the bottom of the dropping cavity, the third sensor is used to detect the taking space, the fourth sensor is used to detect the bottom of the taking cavity, the fifth sensor is used to detect the lower space of the taking space, and the controller is electrically connected with the first sensor, the second sensor, the third sensor, the fourth sensor, the fifth sensor, the first longitudinal movement module and the second longitudinal movement module.

4. The pump source taping machine of claim 1, wherein, The first camera is arranged on the upper side of the taking station and the mounting station to shoot from top to bottom; The automatic mounting mechanism further comprises a second camera, the second camera is fixedly installed on the workbench, the mounting seat can be moved to the upper side of the second camera in the movable stroke, and the second camera is used to shoot from bottom to top.

5. The pump source taping machine of claim 4, wherein, The two automatic feeding tools comprise a solder patch feeding tool, and the taking station of the solder patch feeding tool is used to provide solder patches; The two automatic mounting mechanisms comprise a solder patch mounting mechanism, the solder patch mounting mechanism is arranged corresponding to the solder patch feeding tool, and the solder patch mounting mechanism further comprises a waste barrel, and the waste barrel is used to place dirty solder patches.

6. The pump source taping machine of claim 1, wherein, The upper surface of the positioning jig is provided with a plurality of code holes, and the pump source sintering jig further comprises a plurality of code pins; Different numbers of the coding pins are selected and inserted into the coding holes in different combinations to form a plurality of visual identification coding combinations.

7. The pump source taping machine of claim 1, wherein, The vacuum suction seats are provided in three, and the three vacuum suction seats are arranged in a spaced manner along the circumference of the rotary disc to correspond to the sintering disc loading and unloading station and the two pad mounting stations respectively.

8. The pump source taping machine of claim 1, wherein, The driving device comprises a DD motor, a motor base of the DD motor is arranged on the workbench, an output rotating shaft of the DD motor rotates along an up-down axis, and the rotary disc is connected to the output rotating shaft.

9. A method of patch pump control for a patch pump as claimed in any one of claims 1 to 8, wherein, The two automatic feeding tools comprise a chip feeding tool and a soldering pad feeding tool, the two material taking stations comprise a soldering pad material taking station and a chip material taking station, the two automatic mounting mechanisms comprise a soldering pad mounting mechanism and a chip mounting mechanism, and the two mounting stations comprise a soldering pad mounting station and a chip mounting station. After the pump source sintering jig is positioned and placed on the vacuum suction seat at the sintering disc loading and unloading station, the target mounting position of the chip mounting position in the mounting groove is obtained. After the pump source sintering jig moves from the sintering disc loading and unloading station to the soldering pad mounting station, the soldering pad feeding tool is controlled to supplement the soldering pad material taking station with soldering pads. According to the target mounting position, the soldering pad mounting mechanism is controlled to pick up the soldering pad on the soldering pad material taking station to the chip mounting position of the mounting groove. After the pump source sintering jig moves from the soldering pad mounting station to the chip mounting station, the chip feeding tool is controlled to supplement the chip material taking station with chips. According to the target mounting position, the chip mounting mechanism is controlled to pick up the chip on the chip material taking station to the soldering pad.

10. The pump source patch control method of claim 9, wherein, The chip feeding tool comprises a base, a mounting structure, a plurality of material box jigs, a jacking member, a falling member, a first longitudinal movement module and a second longitudinal movement module, the base is arranged on the workbench, the chip material taking station is formed in the base, the mounting structure is arranged on the base corresponding to the chip material taking station, the mounting structure comprises a material taking cavity and a material falling cavity which are respectively upwardly penetrated, the material taking cavity has a material taking space at an opening, the material falling cavity has a material falling space at an opening, a plurality of the material box jigs are arranged in a stacked manner in the material taking cavity, the material box jigs are used for placing chips, the first longitudinal movement module is movably arranged on the base along an up-down direction, the falling member is arranged on the first longitudinal movement module, and on the stroke of the first longitudinal movement module, the falling member can extend into the material falling space and load the material box jigs downwardly, the second longitudinal movement module is movably arranged on the base along the up-down direction, and the jacking member is arranged on the second longitudinal movement module, and on the stroke of the second longitudinal movement module, the jacking member can extend into the material taking cavity and jack up the plurality of material box jigs upwardly. The step of controlling the chip feeding tool to supplement the chip material taking station with chips comprises the following steps. respectively acquire a second shielding signal of a second position of the chip taking station and a fifth shielding signal of a fifth position of the chip taking station; respectively acquire a first shielding signal of a first position of the chip taking station and a third shielding signal of a third position of the chip taking station when the second shielding signal is unshielded and the fifth shielding signal is shielded; when the first shielding signal is shielded and the third shielding signal is unshielded, control the first longitudinal movement module and the second longitudinal movement module to drive the falling piece downward by one unit height and drive the jacking piece upward by one unit height, so as to empty the falling space and supplement the chip in the taking space of the chip taking station.

11. The pump source patch control method of claim 9, wherein, The chip mounting mechanism comprises a mounting seat and a picking assembly. The mounting seat is movably arranged relative to the workbench, so that it can reach the chip taking station and the corresponding chip mounting station in the active stroke. The picking assembly is mounted on the mounting seat, and the picking assembly comprises a picking part rotatably mounted on the mounting seat along an up-down axis. The picking part is used to pick the to-be-mounted piece on the chip taking station to the chip mounting station. The step of controlling the chip mounting mechanism according to the target mounting position to pick the chip on the chip taking station to the solder pad in the mounting groove specifically comprises the following steps: acquire the to-be-picked position of the chip on the chip taking station; control the picking part to move to the to-be-picked position to pick the chip; control the picking part to move to the target mounting position to mount the chip on the chip mounting position.

12. The pump source patch control method of claim 9, wherein, The step of acquiring the target mounting position of the chip mounting position in the mounting groove specifically comprises the following steps: acquire the coding information of the pump source sintering fixture to determine the model of the pump source sintering fixture; acquire the position information of the coordinate reference arranged on the pump source sintering fixture, and establish a current rectangular coordinate system based on the position information of the coordinate reference; query a preset mapping relationship according to the current rectangular coordinate system to acquire the position information of each chip mounting position on the pump source sintering fixture, wherein the preset mapping relationship is a corresponding relationship between the model of the pump source sintering fixture and the position information of each chip mounting position on the pump source sintering fixture.

13. The pump source patch control method of claim 12, wherein, The pump source sintering fixture is provided with a plurality of coding holes, and the pump source sintering fixture further comprises a plurality of coding pins. Different numbers of coding pins are inserted into different positions of the plurality of coding holes to form a plurality of visual identification codes. The step of acquiring the coding information of the pump source sintering fixture to determine the model of the pump source sintering fixture comprises: acquire the number of the coding pins and the position information of each coding pin in the plurality of coding holes; acquire the visual identification code according to the position information of each coding pin in the plurality of coding holes; According to the visual identification code, a preset coding relationship is inquired to determine the model of the pump source sintering fixture, wherein the preset coding relationship is a corresponding relationship between the visual identification code and the model of the pump source sintering fixture.

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