A rolling processing method for copper and its alloy heterogeneous alloy composite foil
By surface grinding and spot welding diffusion connection of rolled pure copper plates and copper-manganese alloy plates, combined with hot pressing, hot rolling and cold rolling processes, the processing limitations of pure metal foils were solved and the production of high-performance copper and its alloy composite foils was achieved.
Patent Information
- Application Number
- CN202111491666.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-12-08
- Publication Date
- 2025-09-19
- Estimated Expiration
- 2041-12-08
AI Technical Summary
The application of pure metal foil in existing technologies restricts the updating and iteration speed of related products and cannot meet the requirements of further processing.
Rolled pure copper plates and copper-manganese alloy plates are used as raw materials. After surface grinding and spot welding, they are diffused and connected in a hot pressing furnace, and then hot pressing, hot rolling, cold rolling and other processes are carried out to form copper and its alloy heterogeneous alloy composite foils.
The copper and its alloy composite foil with good connection effect and size meeting the design requirements is achieved, which improves the processing plasticity and performance of the product.
Abstract
Description
Technical field:
[0001] The present invention relates to the technical field of copper and its alloy processing, in particular to a rolling processing method of copper and its alloy heterogeneous alloy composite foil. Background technology:
[0002] Copper and its alloys have good conductivity and ductility, and are widely used in chips, electrodes and other parts of the electronics, battery and chemical industries, and are widely used in actual industrial production.
[0003] At present, with the development and technological updates of the electronics, energy and chemical industries, the application of pure metal foils has restricted the update and iteration speed of related products and cannot meet the requirements for further processing of their foils. Therefore, it is necessary to develop preparation processes and technologies for pure copper and its alloy foils to break through the space and performance limitations of single metal foil reprocessing and meet the needs of designers for high-performance new structural design. Summary of the invention:
[0004] The purpose of the present invention is to provide a rolling processing method for copper and its alloy heterogeneous alloy composite foil, so as to solve the problems that the application of pure metal foil in the prior art restricts the updating and iteration speed of related products and cannot meet the requirements for further processing of the foil.
[0005] In order to achieve the above objectives, the technical solution of the present invention is:
[0006] A rolling processing method for copper and its alloy heterogeneous alloy composite foil is disclosed. To ensure processing plasticity, a rolled pure copper plate and a copper-manganese alloy plate are used as raw materials, wherein the copper-manganese alloy is a copper-rich alloy or a manganese-rich alloy, and the thickness ratio of the rolled pure copper plate to the copper-manganese alloy plate is 1:1-1:20. The rolled pure copper plate and the copper-manganese alloy plate are surface-grinded to remove pits, adhered and spot-welded around the edges, and then placed in a hot pressing furnace for diffusion bonding. The hot pressing temperature is 650-950°C and the pressure is 80-140 MPa.
[0007] The rolling processing method of the copper and its alloy heterogeneous alloy composite foil is that the hot-pressed rolled pure copper plate-copper-manganese alloy plate is a multi-layer structure, and one or more groups are stacked in the form of rolled pure copper plate-copper-manganese alloy plate-rolled pure copper plate or copper-manganese alloy plate-rolled pure copper plate-copper-manganese alloy plate.
[0008] The rolling processing method of the copper and its alloy heterogeneous alloy composite foil is as follows: the composite plate after hot pressing is heated to 700-900°C and kept warm for 1-4 hours before being hot rolled; the hot rolling temperature is 500-700°C, the total hot rolling deformation is not less than 80%, and the total thickness of the composite plate after hot rolling is not more than 1.5 mm.
[0009] The rolling processing method of the copper and its alloy heterogeneous alloy composite foil comprises the following steps: the hot-rolled composite plate is surface-polished to remove oxide scale, and then annealed in a vacuum heat treatment furnace at 700-900° C. for 1-4 hours.
[0010] The rolling processing method of the copper and its alloy heterogeneous alloy composite foil is described. The annealed composite plate is cold-rolled into foil on a twenty-roll continuous rolling mill at room temperature. The total cold rolling deformation is not less than 85%. The total thickness of the composite foil after cold rolling is 0.01mm to 0.2mm, and the thickness ratio of adjacent pure copper and copper-manganese alloy is 1:1 to 1:20.
[0011] The rolling processing method of the copper and its alloy heterogeneous alloy composite foil comprises the following steps: the cold-rolled composite foil is annealed in a vacuum heat treatment furnace at 700-900°C for 1-4 hours, and then bent and straightened, and strip-cut to obtain the finished composite foil.
[0012] The design concept of the present invention is:
[0013] The method of the present invention is based on the actual demand of the electronics, energy and chemical industries for pure copper-copper alloy composite foils. By designing its rolling process, a finished pure copper-copper alloy composite foil with good connection effect and dimensions meeting design and redevelopment requirements is obtained.
[0014] The advantages and beneficial effects of the present invention are:
[0015] 1. The present invention is a rolling processing method for copper and its alloy heterogeneous alloy composite foil, which can meet the actual demand of the electronics, energy and chemical industries for pure copper-copper alloy composite foil.
[0016] 2. The present invention is a rolling processing method for copper and its alloy heterogeneous alloy composite foil. By designing a hot pressing process before hot rolling, it can not only remove the air from the composite plate, but also achieve a certain degree of overlap through self-diffusion, and utilize the mechanical bonding of the subsequent rolling process. Specific implementation method:
[0017] In practice, the present invention utilizes rolled pure copper plates and copper-manganese alloy plates as starting materials, where the copper-manganese alloy plates can be either copper-rich or manganese-rich. The rolled pure copper plates and copper-manganese alloy plates are surface-polished, spot-welded, and then diffusion-bonded in a hot press. The bonded composite plates are then hot-rolled, surface-polished, and annealed in a vacuum heat treatment furnace. The annealed composite plates are then cold-rolled on a continuous rolling mill at room temperature. The cold-rolled composite foil undergoes vacuum heat treatment and annealing, followed by stretch bending, straightening, and strip shearing to produce the finished composite foil.
[0018] Below, the present invention is further described in detail by examples.
[0019] Example 1
[0020] In this embodiment, the rolling processing method of copper and its alloy heterogeneous alloy composite foil, the specific process and results are as follows:
[0021] To ensure workability, rolled pure copper and copper-manganese alloy sheets were used as starting materials. The copper-manganese alloy sheet composition, calculated by weight, was 95% Mn and 5% Cu. The thickness ratio of the rolled pure copper to copper-manganese alloy sheets was 1:6. The rolled pure copper and copper-manganese alloy sheets were surface-grinded to remove pits, spot-welded around the edges, and then diffusion-bonded in a hot-pressing furnace. The hot-pressing temperature was 750°C and the pressure was 120 MPa. The hot-pressed composite sheet can be a two-layer structure, stacked in a stacked pattern of rolled pure copper and copper-manganese alloy sheets. The hot-pressed composite sheet was heated at 850°C for 2 hours before being hot-rolled at 650°C, achieving a total deformation of 90%. The resulting composite sheet had a total thickness of 1.5 mm. After surface grinding to remove oxide scale, the hot-rolled composite sheet was annealed in a vacuum heat treatment furnace at 850°C for 2 hours. The annealed composite sheet was cold-rolled at room temperature on a 20-high tandem mill, achieving a total cold-rolling deformation of 90%. The total thickness of the cold-rolled composite foil was 0.15 mm, with a thickness ratio of 1:6 between adjacent rolled pure copper and copper-manganese alloy sheets. The cold-rolled composite foil was then heat-treated in a vacuum furnace at 850°C for 2 hours, followed by annealing, bending straightening, and strip shearing to produce the finished composite foil.
[0022] In this embodiment, the performance indicators of the copper and its alloy heterogeneous alloy composite foil are as follows: room temperature tensile strength reaches 300 MPa, and elongation reaches 10%.
[0023] Example 2
[0024] In this embodiment, the rolling processing method of copper and its alloy heterogeneous alloy composite foil, the specific process and results are as follows:
[0025] To ensure processing plasticity, rolled pure copper and copper-manganese alloy plates were used as starting materials. The copper-manganese alloy plate composition, calculated by weight, was 50% Mn and 50% Cu. The thickness ratio of the rolled pure copper to copper-manganese alloy plates was 1:2. The rolled pure copper and copper-manganese alloy plates were surface-grinded to remove pits, spot-welded around the edges, and then diffusion-bonded in a hot-pressing furnace. The hot-pressing temperature was 700°C and the pressure was 100 MPa. The rolled pure copper and copper-manganese alloy plates could be a three-layer structure, stacked in a stacked pattern of rolled pure copper, copper-manganese alloy, and rolled pure copper. The hot-pressed composite plate was heated at 750°C for 3 hours before being hot-rolled at 600°C, achieving a total deformation of 85%. The total thickness of the hot-rolled composite plate was 1.2 mm. After surface grinding to remove oxide scale, the hot-rolled composite plate was annealed in a vacuum heat treatment furnace at 750°C for 3 hours. The annealed composite sheet was cold-rolled at room temperature on a 20-high tandem mill, with a total cold-rolling deformation of 85%. The total thickness of the cold-rolled composite foil was 0.12 mm, with a 1:2 thickness ratio between adjacent rolled pure copper and copper-manganese alloy sheets. The cold-rolled composite foil was then heat-treated in a vacuum furnace at 750°C for 3 hours, followed by annealing, bending straightening, and strip shearing to produce the finished composite foil.
[0026] In this embodiment, the performance indicators of the copper and its alloy heterogeneous alloy composite foil are as follows: room temperature tensile strength reaches 320 MPa, and elongation reaches 12%.
[0027] Example 3
[0028] In this embodiment, the rolling processing method of copper and its alloy heterogeneous alloy composite foil, the specific process and results are as follows:
[0029] To ensure processing plasticity, rolled pure copper and copper-manganese alloy plates were used as starting materials. The copper-manganese alloy plate's composition, calculated by weight, was 30% Mn and 70% Cu. The thickness ratio of the rolled pure copper to copper-manganese alloy plates was 1:10. The rolled pure copper and copper-manganese alloy plates were surface-grinded to remove pits, spot-welded around the edges, and then diffusion-bonded in a hot-pressing furnace. The hot-pressing temperature was 900°C and the pressure was 80 MPa. The rolled pure copper and copper-manganese alloy plates could be a three-layer structure, stacked in a stacking pattern of copper-manganese alloy plate, rolled pure copper plate, and copper-manganese alloy plate. The hot-pressed composite plate was heated at 900°C for 1 hour before being hot-rolled at 650°C, achieving a total deformation of 95%. The resulting composite plate had a total thickness of 1.0 mm. After surface grinding to remove oxide scale, the hot-rolled composite plate was annealed in a vacuum heat treatment furnace at 900°C for 1 hour. The annealed composite sheet was cold-rolled at room temperature on a 20-high tandem mill, achieving a total cold-rolling deformation of 95%. The resulting composite foil had a total thickness of 0.16 mm, with a thickness ratio of 1:10 between adjacent rolled pure copper and copper-manganese alloy sheets. The cold-rolled composite foil was then heat-treated in a vacuum furnace at 900°C for one hour, followed by annealing, bending straightening, and strip shearing to produce the finished composite foil.
[0030] In this embodiment, the performance indicators of the copper and its alloy heterogeneous alloy composite foil are as follows: room temperature tensile strength reaches 330 MPa, and elongation reaches 12%.
[0031] The above description is only a preferred example of the present invention and does not limit the present invention in any way. Any simple modification, change and equivalent variation made to the above embodiment according to the essence of the invention technology shall still fall within the scope of protection of the technical solution of the present invention.
Claims
1. A rolling processing method for copper and its alloy heterogeneous alloy composite foil, characterized in that: To ensure processing plasticity, rolled pure copper plates and copper-manganese alloy plates are used as raw materials, wherein the copper-manganese alloy is a copper-rich alloy or a manganese-rich alloy, and the thickness ratio of the rolled pure copper plates to the copper-manganese alloy plates is 1:1 to 1:
20. The rolled pure copper plates and the copper-manganese alloy plates are surface-grinded to remove pits, spot-welded around the edges, and then placed in a hot pressing furnace for diffusion bonding. The hot pressing temperature is 650 to 950°C and the pressure is 80 to 140 MPa. The hot-pressed composite sheet is heated to 700-900°C and kept warm for 1-4 hours before being hot-rolled at a temperature of 500-700°C. The total deformation of the hot rolling is not less than 80%, and the total thickness of the hot-rolled composite sheet is not more than 1.5 mm. After hot rolling, the composite plate is ground to remove the oxide scale, and then annealed in a vacuum heat treatment furnace at 700-900°C for 1-4 hours; The annealed composite sheet is cold rolled into foil on a twenty-roll continuous rolling mill at room temperature, with a total cold rolling deformation of not less than 85%, a total thickness of the cold-rolled composite foil of 0.01 mm to 0.2 mm, and a thickness ratio of adjacent pure copper to copper-manganese alloy of 1:1 to 1:20; The cold-rolled composite foil is annealed in a vacuum heat treatment furnace at 700-900°C for 1-4 hours, and then bent, straightened, and cut into strips to obtain the finished composite foil.
2. The rolling processing method of copper and its alloy heterogeneous alloy composite foil according to claim 1, characterized in that: The hot-pressed rolled pure copper plate-copper-manganese alloy plate is a multi-layer structure, which is stacked in one or more groups in the form of rolled pure copper plate-copper-manganese alloy plate-rolled pure copper plate or copper-manganese alloy plate-rolled pure copper plate-copper-manganese alloy plate.
Citation Information
Patent Citations
Copper, molybdenum-copper and copper three-layer composite plate and manufacturing method thereof
CN103949472A
Micro-nano layer-shaped copper / copper alloy composite board and preparation method thereof
CN113634597A