A semiconductor cement feeding device

Abstract

The application relates to the technical field of semiconductor chip packaging, and particularly discloses a semiconductor rubber material feeding device, which comprises a weighing part, a material distributing guide rail, a first telescopic part, double telescopic clamping jaws, a mechanical arm and a rack, the material distributing guide rail is connected to the movable end of the first telescopic part, the fixed end of the first telescopic part is connected to the rack, the weighing part is connected below one end of the material distributing guide rail, the fixed ends of the double telescopic clamping jaws are connected to the movable end of the mechanical arm, and the movable end of the mechanical arm is arranged above the material distributing guide rail. The feeding device can simultaneously perform material distributing and weighing operations on rubber materials, and improves the quality and efficiency of feeding.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip packaging technology, specifically a semiconductor adhesive feeding device. Background Technology

[0002] Chip packaging requires high-precision equipment and a cleanroom environment. To improve material loading efficiency and quality, existing large-scale chip packaging processes use automated loading devices for semiconductor adhesives. However, existing adhesives are mostly pre-made in large quantities as cylindrical rods, which are then fed into a vibratory feeder according to specifications. After being individually separated by the vibratory feeder, they are then transported to the loading device. The loading device generally does not have a device for material quality inspection, so it is impossible to distinguish the weight of each adhesive. This results in some smaller or larger adhesives being transported along with the loading device to the sleeve or mold used to hold the adhesive, and then being transported into the packaging mold. This causes the packaged chips to be of varying thicknesses and inconsistent quality. Some loading devices are equipped with weighing devices, but these weighing devices need to weigh each adhesive individually, which adds a step and delays the loading time, thus reducing the overall loading efficiency. In addition, existing loading devices have a complex structure. If the material on the gripper is pushed into the barrel using a simple structure of grippers and feeding cylinder, the lateral movement path of the gripper must be strictly limited. If the lateral movement path is deviated, the round bar will not be aligned with the hole on the barrel or the material container on the rubber mold, resulting in poor feeding accuracy. Since the existing grippers and cylinders are all general-purpose parts, it is impossible to maintain alignment without limiting components.

[0003] For example, the patent document (Chinese Patent Publication No. CN1074448802A) discloses a "Resin Alignment Machine," which mainly uses a transition conveying mechanism to transport round resin bars from a vibratory feeder to the first and second clamping plates of a feeding mechanism. Then, the feeding mechanism dispenses the resin bars into a sleeve, thus achieving the feeding operation. Furthermore, a Cartesian coordinate robot enables simultaneous resin dispensing and vibratory feeder shaping output, resulting in high resin alignment efficiency. However, its feeding mechanism lacks a component for detecting the resin material. Furthermore, the positioning of the round resin rods via the first and second clamping plates requires the use of first and second finger cylinders for material distribution and limiting. Using finger cylinders to limit the moving material necessitates complex calculations by the control device and the use of detection devices to determine when the first finger cylinder is feeding resin material, at which point it clamps the next piece of resin to be fed. The second finger cylinder clamps resin material only when it is not feeding it. Moreover, the first and second finger cylinders drive the first and second clamping plates respectively, one in front and one behind, requiring sequential coordination to feed material one by one. It cannot simultaneously feed or limit two materials, resulting in low feeding efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor adhesive feeding device that can simultaneously perform material distribution and weighing operations, thereby improving the quality and efficiency of feeding.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A semiconductor adhesive feeding device includes a weighing component, a dispensing guide rail, a first telescopic component, double telescopic grippers, a robotic arm, and a frame. The dispensing guide rail is connected to the movable end of the first telescopic component, the fixed end of the first telescopic component is connected to the frame, the weighing component is connected below one end of the dispensing guide rail, and the fixed ends of the double telescopic grippers are both connected to the movable ends of the robotic arm. The movable end of the robotic arm is positioned above the dispensing guide rail.

[0007] A further embodiment also includes a receiving tray, a rotating assembly, and a pushing assembly. The receiving tray has at least two grooves and is located outside the other end of the material distribution guide. The input end of the receiving tray is connected to the rotating end of the rotating assembly, the fixed end of the rotating assembly is connected to the frame, and the pushing assembly is connected to the output end of the receiving tray.

[0008] In a further embodiment, the rotating assembly includes a motor, a driving disc, a driven disc, and at least two rollers. The motor is fixed on the frame, the driving disc is driven by the motor's shaft, the at least two rollers are symmetrically mounted on the driving disc, the driven disc is coaxially connected to the receiving disc, and the driven disc is provided with four U-shaped slots and four arc-shaped slots at intervals. The rollers are engaged with the U-shaped slots, and the arc-shaped protrusions are slidably connected to the arc-shaped slots.

[0009] In a further embodiment, the pushing assembly includes a second telescopic member, a connecting plate, and a pushing plate. The pushing plate is connected to the connecting plate, the connecting plate is connected to the telescopic end of the second telescopic member, and the fixed end of the second telescopic member is connected to the frame.

[0010] In a further embodiment, the feeding device also includes a material stop switch and a vibratory feeder, the vibratory feeder being connected to the frame, and the material stop switch being connected between the output end of the vibratory feeder and the weighing component.

[0011] In a further embodiment, the stop switch includes a swing assembly and a limiting plate. The fixed end of the swing assembly is connected to the frame, one end of the limiting plate is connected to the rotating end of the swing assembly, and the other end of the limiting plate is located between the weighing component and the output end of the vibratory feeder.

[0012] In a further embodiment, the material distribution guide rail includes a fixed guide rail and a movable guide rail. The fixed guide rail is connected to the frame, and the movable guide rail is connected to the first telescopic member.

[0013] In a further embodiment, the weighing component includes a load cell, a fixed claw, a movable claw, a third telescopic component, and a support. The load cell is connected to the frame via the support. The fixed claw is connected to the weighing end of the load cell. The movable claw is connected to the third telescopic component, which is connected to the frame. The movable claw and the fixed claw are slidably connected.

[0014] In a further embodiment, the telescopic gripper includes two grippers and a clamping cylinder, with the grippers connected to the movable end of the clamping cylinder.

[0015] In a further embodiment, the robotic arm includes a linear module and a mounting platform. The mounting platform is connected to the slider of the linear module, and the fixed ends of the dual telescopic grippers are respectively connected to both sides of the mounting platform.

[0016] The beneficial effects of this invention are:

[0017] 1. This invention enables simultaneous material distribution and weighing of rubber materials through a weighing component, a material distribution guide rail, a first telescopic component, a double telescopic gripper, a robotic arm, and a frame, achieving high-quality and rapid material feeding. Compared with existing technologies, the conveying mechanism of the double telescopic gripper and robotic arm can improve conveying efficiency. The weighing component detects and judges the rubber materials to control the first telescopic component to drive the material distribution guide rail, which can improve the feeding quality and efficiency.

[0018] 2. This invention improves the efficiency of pushing the rubber material into the mold's rubber material container by setting up the receiving tray, rotating component, and pushing component and their connection relationship. The structural design of the receiving tray and groove makes it easier to limit the rubber material, so that the rubber material is in a relatively stationary state when it is in the groove, which facilitates the pushing and detection of the rubber material one by one.

[0019] 3. The present invention can limit the conveying direction of the material on the conveying track of the vibratory plate by means of the material stop switch, which can counteract the gravity when the rubber material falls, making it easier for the double telescopic gripper to grab. Even if the next piece of rubber material is not accurately placed, it can return to its original position under the action of the limit plate and the swing component, reducing the probability of empty grabbing.

[0020] 4. The invention has a reasonable overall structure and is equipped with some commonly used electrical detection components, which can realize automatic feeding of rubber materials, with high efficiency, significantly reducing labor intensity and saving labor costs. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional schematic diagram of a semiconductor adhesive feeding device according to an embodiment of the present invention;

[0023] Figure 2 This is a front view schematic diagram of a semiconductor adhesive feeding device in an embodiment of the invention;

[0024] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0025] Figure 4 This is a schematic diagram of the connection of the weighing component in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the connection of the material distribution guide rail in an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the connection of the vibratory feeder in an embodiment of the present invention.

[0028] In the diagram: 1. Weighing component; 101. Weighing sensor; 102. Fixed claw; 103. Movable claw; 104. Third telescopic component; 105. Bracket; 2. Material distribution guide rail; 201. Fixed guide rail; 202. Movable guide rail; 3. First telescopic component; 4. Telescopic gripper; 401. Gripper; 402. Clamping cylinder; 5. Robotic arm; 501. Linear module; 502. Mounting platform; 6. Frame; 7. Receiving tray; 701 8. Groove; 801. Rotating assembly; 802. Motor; 802. Driving disc; 8021. Arc-shaped protrusion; 803. Driven disc; 8031. U-shaped slot; 8032. Arc-shaped slot; 804. Roller; 9. Pushing assembly; 901. Second telescopic component; 902. Connecting plate; 903. Pushing plate; 10. Stop switch; 1001. Swing assembly; 1002. Limiting plate; 11. Vibrating plate; 12. Dust collection hood. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] like Figure 1 As shown, a semiconductor adhesive feeding device includes a weighing component 1, a dispensing guide rail 2, a first telescopic component 3, double telescopic grippers 4, a robotic arm 5, and a frame 6. The dispensing guide rail 2 is connected to the movable end of the first telescopic component 3, and the fixed end of the first telescopic component 3 is connected to the frame 6. The weighing component 1 is connected below one end of the dispensing guide rail 2. The fixed ends of the double telescopic grippers 4 are both connected to the movable ends of the robotic arm 5, and the movable end of the robotic arm 5 is positioned above the dispensing guide rail 2.

[0031] Its working principle or implementation method is as follows: The robotic arm 5 uses the front jaws of the double telescopic grippers 4 to grip the rubber material from the output track of the vibratory feeder or the rubber material placement track, and then picks up the rubber material onto the weighing device 1 for weighing. After the double telescopic grippers 4 release the rubber material onto the weighing device 1, the robotic arm 5 controls the double telescopic grippers 4 to move to the output track of the vibratory feeder or the rubber material placement track again, and picks up a second piece of rubber material onto the weighing device 1 for weighing. At the same time, the rear jaws of the double telescopic grippers 4 carry the first weighed rubber material to the dispensing guide rail 2. If it meets the requirements... The robotic arm 5 can be controlled to move the rear end gripper of the double telescopic gripper 4 to the qualified area. At the same time, the front end gripper of the double telescopic gripper 4 moves the second piece of rubber to the distribution guide rail 2. If the weight of the second piece of rubber does not meet the requirements, the first telescopic component 3 is controlled to open the distribution guide rail 2, so that the unqualified rubber is distributed to the unqualified area. By repeating the above operation, the rubber pieces can be weighed one by one and then distributed and conveyed. Using the above structure, two rubber pieces can be weighed and distributed at the same time, which improves the efficiency of distribution.

[0032] Based on the above working principle, some preferred implementation structures can also be provided for implementing the above scheme, such as... Figure 2 As shown, a semiconductor adhesive loading device further includes a receiving tray 7, a rotating assembly 8, and a pushing assembly 9. The receiving tray 7 has at least two grooves 701 and is located outside the other end of the distributing guide rail 2. The input end of the receiving tray 7 is connected to the rotating end of the rotating assembly 8, the fixed end of the rotating assembly 8 is connected to the frame 6, and the pushing assembly 9 is connected to the output end of the receiving tray 7. (See reference...) Figure 1 and Figure 2As shown, the individual pieces of rubber material distributed to the qualified area can enter the receiving tray 7 one by one. After the first groove 701 on the receiving tray 7 receives the rubber material brought by the rear jaws of the double telescopic gripper 4, it rotates a certain angle under the action of the rotating component 8 and enters the pushing range of the pushing component 9. Under the pushing action of the pushing component 9, it enters one of the rubber material barrels in the mold. When the rubber material in the first groove 701 is brought into the pushing range of the pushing component 9, the second groove 701 simultaneously receives the second piece of rubber material. After the rotating component 8 rotates a certain angle and enters the pushing range of the pushing component 9, it continues to be pushed away, while the first groove 701 receives it again. The next piece of adhesive material to be pushed can be continuously pushed in this way. The mold and the adhesive barrel are common molds used for feeding adhesive material to the heat shrink machine. They are not very relevant to the main problem solved by this application, so they will not be described in detail here. Those skilled in the art can manufacture them according to their needs. The number of grooves 701 is preferably four, which are evenly distributed on the receiving tray 7. This can match the gripping steps of the double telescopic gripper 4, so that the four grooves 701 can take turns receiving material and pushing it. The rotating component 8 and the pushing component 9 can be designed according to the receiving steps. Those skilled in the art can choose some conventional cylinders, electric cylinders, and motors to design them. There are many structures, and they can be designed according to the specific requirements of the above steps.

[0033] like Figure 3 As shown, a preferred embodiment of a rotating assembly 8 is provided, wherein the rotating assembly 8 includes a motor 801, a driving disk 802, a driven disk 803, and at least two rollers 804. The motor 801 is fixed on the frame 6. The driving disk 802 is driven by the shaft of the motor 801. The two rollers 804 are symmetrically mounted under the driving disk 802. A double arc-shaped protrusion 8021 perpendicular to the axis connecting the two rollers 804 is provided under the driving disk 802. The driven disk 803 is coaxially connected to the receiving disk 7. Four U-shaped slots 8031 ​​and four arc-shaped slots 8032 are spaced apart on the driven disk 803. The rollers 804 are engaged with the U-shaped slots 8031, and the arc-shaped protrusions 8021 are slidably connected with the arc-shaped slots 8032. (See reference...) Figure 2 and Figure 3As shown, after the double telescopic gripper 4 picks up qualified material into the first groove 701 on the receiving tray 7, the motor 801 drives the double rollers 804 on the drive disc 802 to rotate. One of the rollers 804 engages with one of the four U-shaped slots 8031, causing the driven disc 803 to rotate 90 degrees coaxially with the receiving tray 7. The second groove 701 receives the second piece of material picked up from the telescopic gripper 4. Since the double telescopic gripper 4 needs a long stroke to return from the drop point to the output track of the vibratory feeder or the material placement track for picking up the second piece of material after dropping it into the second groove 701, the time interval between placing the first and second pieces of material is shorter than the time interval between placing the second and third pieces of material. (See reference...) Figures 1-3 As shown, after the first roller 804 engages with the first U-shaped slot 8031, the driving disk 802 rotates 90°, driving the driven disk 803 to rotate 90°. The driven disk 803 drives the second groove 701 on the receiving disk 7 to match the landing point of the second piece of adhesive, and then disengages. During this process, the telescopic gripper 4 picks up the second piece of material from the distributing guide rail 2 and places it above the second groove 701. After the gripper is released, the second piece of adhesive falls into the second groove 701. The driving disk 802 continues to rotate 180 degrees. During this process, the arc-shaped protrusion 8021 slides and connects with the arc-shaped slot 8032 to limit the rotation of the driven disk 803 and the receiving disk 7, and the receiving disk 7 does not rotate. The second roller 804 begins to engage with the second U-shaped slot 8031. During this process, the telescopic gripper 4 is already on the robotic arm 5. Under the control of the system, the third piece of adhesive is picked up at the feeding end. After weighing the third piece of adhesive, it is conveyed to the distributing guide rail 2. The active disk 802 continues to rotate 90 degrees, and the telescopic gripper 4 drives the adhesive. At this time, the third groove 701 rotates to the receiving position. The second roller 804 begins to engage with the second U-shaped slot 8031, driving the third groove 701 to rotate. At the same time, the telescopic gripper 4 carries the third material to the top of the third groove 701 and places the third material on the third groove 701. The second material moves to the pushing position and is pushed out by the pushing component 9. The active disk repeats the above rotation action to meet the requirement of the double telescopic gripper 4 dropping material once every interval. The rotation of the driven disk 803 and the receiving disk 7 is limited by the sliding connection between the arc-shaped protrusion 8021 and the arc-shaped slot 8032. The roller 804 can also be replaced by a roller string composed of multiple rollers or a structure of multiple idle rollers. The usage method is similar and will not be described in detail.

[0034] like Figure 3As shown, a preferred embodiment of a pusher assembly 9 is provided. The pusher assembly 9 includes a second telescopic member 901, a connecting plate 902, and a pusher plate 903. The pusher plate 903 is connected to the connecting plate 902, and the connecting plate 902 is connected to the telescopic end of the second telescopic member 901. The fixed end of the second telescopic member 901 is connected to the frame 6. When there is adhesive material in the groove 701 located at the pusher position, the second telescopic member 901 drives the pusher plate 903 to push the adhesive material in the groove 701 into the adhesive material container of the mold along the direction of the groove 701.

[0035] As shown in Figure 6, the feeding device also includes a baffle switch 10 and a vibratory feeder 11. The vibratory feeder 11 is connected to the frame 6, and the baffle switch 10 is connected between the output end of the vibratory feeder 11 and the weighing component 1. The baffle switch 10 is used to limit the amount of adhesive material in the vibratory feeder 11, so that the adhesive material can be replenished at the output end according to the needs of the double telescopic grippers 4, preventing the adhesive material from continuously being conveyed and falling onto the frame when it is not needed, thus preventing it from being at the feeding position. The material distribution technology of the vibratory feeder 11 is already existing technology and is not closely related to the inventive point of this application. Those skilled in the art can select a suitable or slightly modified vibratory feeder according to the size of the adhesive material and the conveying requirements, which will not be described in detail here. The structure of the baffle switch 10 can also be varied. For example, it can be driven by some driving components to block the front end of the conveying track of the vibratory feeder 11. After receiving the driving signal, the driving components can release the conveying track of the vibratory feeder 11.

[0036] like Figure 4 As shown, a preferred embodiment of a material stop switch 10 is provided. The material stop switch 10 includes a swing assembly 1001 and a limiting plate 1002. The fixed end of the swing assembly 1001 is connected to the frame 6. One end of the limiting plate 1002 is connected to the rotating end of the swing assembly 1001, and the other end of the limiting plate 1002 is located between the weighing component 1 and the output end of the vibratory feeder 11. The swing assembly 1001 can be a rotating cylinder with some limiting structures to drive the rotating shaft to rotate. The rotating shaft then drives the limiting plate 1002 to rotate. Under the action of the swing assembly 1001, the limiting plate 1002 can rotate a small angle along the direction of the rubber material conveying, so that the grippers of the double telescopic grippers 4 can pass through. After the grippers pass through, under the action of the swing assembly 1001, the limiting plate 1002 is driven back to its original position to block and limit the next piece of rubber material to be clamped.

[0037] like Figure 5 As shown, the material distribution guide rail 2 includes a fixed guide rail 201 and a movable guide rail 202. The fixed guide rail 201 is connected to the frame 6, and the movable guide rail 202 is connected to the first telescopic member 3. The first telescopic member 3 drives the movable guide rail 202 to create a gap between it and the fixed guide rail 201, allowing the waste material to fall into a special waste recycling bin.

[0038] like Figure 4 As shown, the weighing component 1 includes a weighing sensor 101, a fixed claw 102, a movable claw 103, a third telescopic member 104, and a bracket 105. The weighing sensor 101 is connected to the frame 6 via the bracket 105. The fixed claw 102 is connected to the weighing end of the weighing sensor 101. The movable claw 103 is connected to the third telescopic member 104, which is also connected to the frame 6. The movable claw 103 and the fixed claw 102 are slidably connected. The working principle of this weighing component is as follows: when the adhesive falls onto the fixed claw 102, it is weighed by the weighing sensor 101 connected to the fixed claw 102. The weighing sensor 101 feeds back the detected signal to the controller. The third telescopic member 104 drives the movable claw to rise, lifting the adhesive. The telescopic claw 4 then picks it up and distributes it onto the dispensing guide rail 2.

[0039] like Figure 4 As shown, the telescopic gripper 4 includes two grippers 401 and a clamping cylinder 402, with the grippers 401 connected to the movable end of the clamping cylinder 402. Driven by the clamping cylinder 402, the two grippers 401 can clamp or release the adhesive material. Those skilled in the art will recognize that the function of the telescopic gripper 4 can also be achieved using other mechanical structures, such as structures using two cylinders or two hydraulic cylinders to drive the two grippers together.

[0040] like Figure 1 As shown, the robotic arm 5 includes a linear module 501 and a mounting platform 502. The mounting platform 502 is connected to the slider of the linear module 501, and the fixed ends of the double telescopic grippers 4 are respectively connected to both sides of the mounting platform 502. The driving component of the linear module 501, such as a motor, can drive the mounting platform 502 to slide on the track of the linear module as required. The linear module 501 is a commonly used component in the mechanical field. The structure of the mounting platform 502 can be designed according to the structure of the telescopic grippers 4 and the gripping requirements, which will not be described in detail here.

[0041] like Figure 1 As shown, a dust collection cover 12 is also installed on the retractable gripper 4 for connecting to the vacuum cleaner.

[0042] The aforementioned feeding device also includes a controller and some position sensors, used to detect the arrival signal of the rubber material and the arrival signal of the aforementioned limit member, in order to control the action of some corresponding driving components. The aforementioned usage of position sensors and controllers is a common technical means in the field. Those skilled in the art can arrange them reasonably on the frame according to the feeding steps of the rubber material and make electrical connections. The telescopic components can be common components such as cylinders and hydraulic cylinders, which will not be described in detail here.

[0043] See Figures 1 to 6As shown, during use, the linear module 501 drives the mounting platform 502 and the two grippers 401 of the telescopic gripper 4 on the front side of the mounting platform 502 to move to the position of the first piece of adhesive material blocked by the rear end of the limiting plate 1002. Under the control of the clamping cylinder 402, the first piece of adhesive material is clamped. Under the action of the swing component 1001, the limiting plate 1002 opens the conveying track at the front end of the vibratory feeder 11. The linear module 501 drives the adhesive material to above the fixed claw 102. At the same time, under the action of the swing component 1001, the limiting plate 1002 returns to the front end of the conveying track of the vibratory feeder 11 to continue to limit the second piece of adhesive material on the conveying track. Under the control of the clamping cylinder 402, the two grippers 401 are released, and the adhesive material falls into the material trough of the fixed claw 102. The material is then collected by the weighing sensor. The device 101 weighs the first piece of adhesive and sends the weighing signal back to the controller. The third telescopic component 104 drives the movable claw 103 to lift the adhesive in the material slot of the fixed claw 102 to the material release position of the two grippers 401. Under the action of the clamping cylinder 402, the two grippers 401 clamp the first piece of adhesive between the fixed guide rail 201 and the movable guide rail 202. The telescopic claw 4 continues to move to the position of the second piece of adhesive under the action of the linear module 501, repeating the weighing process of the first piece of adhesive, so that the second piece of adhesive is located on the movable claw 103. If the weighing result of the weighing sensor 101 is unqualified, the first telescopic component 3 drives the movable guide rail 202 and the fixed guide rail 201 to create a gap large enough for the waste material to fall. If it is qualified... If the controller stops the first telescopic component 3 from moving, it simultaneously controls the grippers 401 of the double telescopic grippers 4 to pick up the first and second adhesive materials. The first adhesive material falls into the groove 701, and the second adhesive material is transported to the original position of the first adhesive material. At this time, the telescopic grippers 4 continue to move to the position of the third adhesive material under the action of the linear module 501, repeating the above-mentioned material picking and weighing operation, so that the third adhesive material is located on the movable gripper 103. After the first roller 804 engages with the first U-shaped slot 8031, the driving plate 802 rotates 90°, driving the driven plate 803 to rotate 90°. The driven plate 803 drives the second groove 701 on the receiving plate 7 to match the drop point of the second adhesive material, and then disengages. During this process... If the second piece of material is qualified, the telescopic gripper 4 picks up the second piece of material from the distribution guide rail 2 and places it above the second groove 701. At the same time, the third piece of material is gripped onto the distribution guide rail 2 by the two grippers 401 on the front side. After the grippers are released, the second piece of material goes into the second groove 701, and the third piece of material goes into the distribution guide rail 2. The second telescopic component 901 drives the pusher plate 903 to push the first piece of material into the material bucket of the mold along the direction in which the first piece of material fell into the groove 701. The driving plate 802 continues to rotate 180 degrees. During this process, the arc-shaped protrusion 8021 slides and connects with the arc-shaped slot 8032 to limit the rotation of the driven plate 803 and the receiving plate 7, and the receiving plate 7 does not rotate. The second roller 804 begins to engage with the second U-shaped slot 8031.During the process, the fourth piece of rubber is picked up and placed onto the movable claw 103. Repeating the above steps, the linear module 501 completes one stroke, simultaneously conveying two pieces of rubber to the weighing and dispensing positions, thus performing both weighing and dispensing operations. Furthermore, it can continuously pick up, weigh, dispense, and push the rubber on the vibratory feeder's conveyor track, accurately separating qualified materials, improving work efficiency and processing quality.

[0044] Based on the above principles, structure, or implementation methods, those skilled in the art can reasonably select, connect, and arrange relevant electrical components at appropriate positions on the frame, and through programming methods, realize the automatic material distribution, weighing, and conveying of the above-mentioned feeding device. Other implementation methods can also be reasonably derived based on the above structure, and these reasonable selections and implementation methods should all be covered within the scope of the embodiments of this invention.

[0045] It should be noted that the terms "first," "second," etc., used in this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," "longitudinal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings.

[0046] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A semiconductor adhesive feeding device, characterized in that, The system includes a weighing component (1), a material distribution guide rail (2), a first telescopic component (3), double telescopic grippers (4), a robotic arm (5), and a frame (6). The material distribution guide rail (2) is connected to the movable end of the first telescopic component (3), and the fixed end of the first telescopic component (3) is connected to the frame (6). The weighing component (1) is connected below one end of the material distribution guide rail (2), and the fixed ends of the double telescopic grippers (4) are all connected to the movable end of the robotic arm (5). The movable end of the robotic arm (5) is located above the material distribution guide rail (2). The weighing component (1) includes a weighing sensor (101), a fixed claw (102), a movable claw (103), a third telescopic component (104), and a bracket (105). The weighing sensor (101) is connected to the frame (6) via the bracket (105). The fixed claw (102) is connected to the weighing end of the weighing sensor (101). The movable claw (103) is connected to the third telescopic component (104). The third telescopic component (104) is connected to the frame (6). The movable claw (103) is slidably connected to the fixed claw (102). When the rubber material falls onto the fixed claw (102), it is weighed by the weighing sensor (101) connected to the fixed claw (102). The weighing sensor (101) feeds back the detected signal to the controller. The third telescopic component (104) drives the movable claw to rise and lift the rubber material. The telescopic claw (4) then picks it up and distributes it onto the material distribution guide rail (2). The telescopic gripper (4) includes two grippers (401) and a clamping cylinder (402), wherein the grippers (401) are connected to the movable end of the clamping cylinder (402); The robotic arm (5) includes a linear module (501) and a mounting platform (502). The mounting platform (502) is connected to the slider of the linear module (501), and the fixed ends of the double telescopic grippers (4) are respectively connected to both sides of the mounting platform (502). It also includes a receiving tray (7), a rotating assembly (8) and a pushing assembly (9). The receiving tray (7) is provided with at least two grooves (701). The receiving tray (7) is located outside the other end of the material distribution guide rail (2). The input end of the receiving tray (7) is connected to the rotating end of the rotating assembly (8). The fixed end of the rotating assembly (8) is connected to the frame (6). The pushing assembly (9) is connected to the output end of the receiving tray (7). After the first groove (701) on the receiving tray (7) receives the rubber material brought by the double telescopic gripper (4), it rotates at a certain angle under the action of the rotating component (8) and comes into the pushing range of the pushing component (9). Under the pushing action of the pushing component (9), it enters one of the rubber material barrels in the mold. When the rubber material in the first groove (701) is brought into the pushing range of the pushing component (9), the second groove (701) simultaneously catches the second rubber material. After the rotating component (8) rotates at a certain angle and reaches the pushing range of the pushing component (9), it continues to be pushed away. At the same time, the first groove (701) catches the next rubber material to be pushed.

2. The semiconductor adhesive feeding device according to claim 1, characterized in that, The rotating assembly (8) includes a motor (801), a driving disk (802), a driven disk (803), and at least two rollers (804). The motor (801) is fixed on the frame (6). The driving disk (802) is driven and connected to the shaft of the motor (801). The at least two rollers (804) are symmetrically mounted on the driving disk (802). The driven disk (803) is coaxially connected to the receiving disk (7). The driven disk (803) is provided with four U-shaped slots (8031) and four arc-shaped slots (8032) spaced apart. The rollers (804) are engaged with the U-shaped slots (8031), and the arc-shaped protrusions (8021) are slidably connected with the arc-shaped slots (8032).

3. The semiconductor adhesive feeding device according to claim 1, characterized in that, The pushing assembly (9) includes a second telescopic member (901), a connecting plate (902) and a pushing plate (903). The pushing plate (903) is connected to the connecting plate (902). The connecting plate (902) is connected to the telescopic end of the second telescopic member (901). The fixed end of the second telescopic member (901) is connected to the frame (6).

4. The semiconductor adhesive feeding device according to claim 1, characterized in that, The feeding device also includes a material stop switch (10) and a vibratory plate (11). The vibratory plate (11) is connected to the frame (6), and the material stop switch (10) is connected between the output end of the vibratory plate (11) and the weighing component (1).

5. A semiconductor adhesive feeding device according to claim 4, characterized in that, The stop switch (10) includes a swing assembly (1001) and a limit plate (1002). The fixed end of the swing assembly (1001) is connected to the frame (6). One end of the limit plate (1002) is connected to the rotating end of the swing assembly (1001). The other end of the limit plate (1002) is located between the weighing component (1) and the output end of the vibratory plate (11).

6. The semiconductor adhesive feeding device according to claim 1, characterized in that, The material distribution guide rail (2) includes a fixed guide rail (201) and a movable guide rail (202). The fixed guide rail (201) is connected to the frame (6), and the movable guide rail (202) is connected to the first telescopic member (3).

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