An electroplated plate, an electroplating device, and an electroplating method

Abstract

The present invention discloses a plating plate, a plating device, and a plating method. The plating plate according to one embodiment includes: a receiving area and an annular area. The plating plate includes: a substrate, a plurality of processing positions for fixing a display substrate, and the display substrate includes a first processing end and a second processing end; connection terminals located at the edge position of the annular area, the connection terminals include a first connection terminal and a plurality of second connection terminals, and the number of the second connection terminals corresponds to the number of the display substrates; a plurality of conductive rings sequentially sleeved, and the conductive rings include a first conductive ring and a plurality of second conductive rings; a first node of the first conductive ring is connected to the first connection terminal, and another second node of the first conductive ring is connected to the second processing end of each display substrate. The second connection terminal is connected to the first processing end of each display substrate through a connection line, or is connected to the first processing end of each display substrate by connecting to a node of the second conductive ring.

Description

Technical Field

[0001] The present invention relates to the field of display technology. More specifically, it relates to a plating plate, a plating device, and a plating method. Background Art

[0002] With the development of displays, high-ppi displays and M-LED displays have become a trend, which also poses a greater current load capacity requirement for metal traces. The thick copper process can complete the production of metal traces with a larger current, but the electroplating methods in related technologies have problems of low efficiency and poor thickness uniformity. Summary of the Invention

[0003] The purpose of the present invention is to provide a plating plate, a plating device, and a plating method to solve at least one of the problems existing in the prior art.

[0004] To achieve the above purpose, the present invention adopts the following technical solutions:

[0005] In a first aspect of the present invention, a plating plate is provided, including: a receiving area and an annular area surrounding the receiving area,

[0006] The plating plate includes:

[0007] A substrate,

[0008] A plurality of processing positions for fixing display substrates located in the receiving area, the display substrate including a first processing end and a second processing end;

[0009] Connection terminals located at the edge position of the annular area for accessing electrical signals, the connection terminals including a first connection terminal and a plurality of second connection terminals, the number of the second connection terminals corresponding to the number of the display substrates;

[0010] A plurality of sequentially nested conductive rings located in the annular area, the conductive rings including a first conductive ring and a plurality of second conductive rings;

[0011] A first node of the first conductive ring is connected to the first connection terminal, and another second node of the first conductive ring is connected to the second processing end of each display substrate,

[0012] The second connection terminal is connected to the first processing end of each display substrate through a connection line, or is connected to the first processing end of each display substrate by connecting to a node of the second conductive ring.

[0013] Furthermore, the orthographic projection of each second conductive ring on the substrate is an annular structure, and the orthographic projections of the plurality of second conductive rings on the substrate are sequentially nested and arranged,

[0014] The second conductive ring includes a third node connected to the second connection terminal and a fourth node connected to the first processing end.

[0015] In the same second conductive ring, the conductive metal between the third node and the fourth node serves as a connection line connecting the first connection terminal and the first processing end.

[0016] Further, the second connection terminals are arranged in an array in the first direction.

[0017] The plurality of processing positions are symmetrically arranged with respect to an axis parallel to the first direction.

[0018] In a second direction perpendicular to the first direction, the second processing ends of two adjacent display substrates are arranged opposite to each other.

[0019] The first conductive ring includes a fifth node located at an edge opposite to the edge where the second node is located.

[0020] The second node and the fifth node are connected by a connection line, and the orthographic projection of the connection line on the substrate is located in the gap between the orthographic projections of the processing positions adjacent in the second direction on the substrate.

[0021] The second processing end of each display substrate is respectively connected to a point position of the connection line.

[0022] Further, the distance between the display substrate and the second conductive ring located at the innermost side of the ring sleeve is determined according to the design size, electroplating thickness, electroplating solution concentration, and electric field strength of the display panel.

[0023] A second aspect of the present invention provides an electroplating device, which includes:

[0024] An electroplating anode, a plurality of first power supplies, and the electroplating plate of the first aspect of the present invention. The second connection terminal of the electroplating plate serves as the electroplating cathode of the electroplating device.

[0025] The first power supply includes a first negative electrode and a first positive electrode. Each first negative electrode is respectively connected to the first connection terminal and each second connection terminal, and all the first positive electrodes are connected to the electroplating anode;

[0026] The voltage of the first power supply connected to the first connection terminal is less than the voltage of the first power supply connected to the second connection terminal.

[0027] Further, the electroplating device further includes an electroplated metal detection circuit connected to the electroplating plate, including:

[0028] An electroplated metal voltage detection circuit for detecting the voltage of the electroplated metal generated when each display substrate is electroplated.

[0029] An electroplated metal current detection circuit for detecting the current of the electroplated metal generated when electroplating each of the display substrates;

[0030] A control switch for switching between the electroplated metal voltage detection circuit and the electroplated metal current detection circuit; and

[0031] A second power supply for supplying power to the electroplated metal voltage detection circuit and the electroplated metal current detection circuit.

[0032] Furthermore, the control switch includes:

[0033] A first switch connected to the first connection terminal, the first switch including a first selection terminal connected to a voltmeter and a second selection terminal connected to the second negative electrode of the second power supply through a connection wire, and the other end of the voltmeter is connected to the second negative electrode;

[0034] A second switch connected to each of the second connection terminals one by one, the second switch including a third selection terminal connected to an ammeter, and the other end of the ammeter is connected to the second positive electrode of the second power supply.

[0035] Furthermore, when the first selection terminal of the first switch is in a closed state, the third selection terminal of any one of the second switches is in a closed state, and the third selection terminals of the other second switches are in an open state, an electroplated metal voltage detection circuit for detecting the electroplated metal formed on the display substrate corresponding to the second switch in the closed state is formed;

[0036] When the second selection terminal of the first switch is in a closed state, the third selection terminal of any one of the second switches is in a closed state, and the third selection terminals of the other second switches are in an open state, an electroplated metal current detection circuit for detecting the electroplated metal formed on the display substrate corresponding to the second switch in the closed state is formed.

[0037] Furthermore, the first switch further includes a fourth selection terminal, which is electrically connected to the first negative electrode of the first power supply connected to the first connection terminal,

[0038] The second switch further includes a fifth selection terminal, which is electrically connected to the first negative electrode of the first power supply connected to the second connection terminal.

[0039] Furthermore, when the fourth selection terminal of the first switch is in a closed state and all the fifth selection terminals are in a closed state, the electroplating device performs electroplating.

[0040] A third aspect of the present invention provides a method of electroplating using the electroplating device of the second aspect of the present invention, characterized in that the method includes:

[0041] Fixing the display substrates to be processed in each processing position respectively;

[0042] In response to the electroplating instruction, adjust the voltage of the first power supply connected to the first connection terminal so that the voltage of the first power supply connected to the first connection terminal is set to be less than the voltage of the first power supply connected to the second connection terminal;

[0043] In response to the electroplating instruction, energize the first power supply to form electroplated metal on the display substrate.

[0044] Furthermore, the electroplating device further includes an electroplated metal detection circuit connected to the electroplating plate, including an electroplated metal voltage detection circuit, an electroplated metal current detection circuit, a control switch; and a second power supply;

[0045] The method further includes,

[0046] In response to the detection instruction, switch to control the control switch, and use the electroplated metal voltage detection circuit to detect the voltage value corresponding to the electroplated metal formed on each display substrate;

[0047] In response to the detection instruction, switch to control the control switch, and use the voltage metal voltage detection circuit to detect the current value corresponding to the electroplated metal formed on each display substrate;

[0048] Determine the resistance value of the electroplated metal according to the voltage value and the current value.

[0049] Furthermore, it further includes:

[0050] Determine the resistance values of all display substrates during the electroplating process, and obtain the electroplating average value according to the resistance values;

[0051] According to the comparison result between the resistance value and the electroplating average value, adjust the voltage value of the first power supply connected to the display substrate, where,

[0052] If the resistance value is less than the electroplating average value, reduce the voltage value of the first power supply;

[0053] If the resistance value is greater than the electroplating average value, increase the voltage value of the first power supply.

[0054] The beneficial effects of the present invention are as follows:

[0055] In the embodiment of the present invention, by arranging a plurality of conductive rings in the conductive area and designing the connection modes of the nodes of the conductive rings with the first connection terminal and the second connection terminal, and the connection modes of the display substrate with the first connection terminal and the second connection terminal, a current collection ring can be formed during electroplating to change the magnetic field distribution around each display substrate, thereby improving the electroplating uniformity. Description of the Drawings

[0056] The following further describes in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0057] Figure 1a and Figure 1b respectively show the schematic diagrams of the electroplating processes of thick copper metal wires in the related art;

[0058] Figure 2a shows the electroplating bath model in the related art;

[0059] Figure 2b shows Figure 2a the three-dimensional distribution model diagram of the electric field lines of the electroplating bath model shown;

[0060] Figure 2c shows Figure 2a the schematic diagram of the electroplating thickness distribution of the electroplated sample shown;

[0061] Figure 3 shows the schematic diagram of the structure of the electroplating plate according to an embodiment of the present invention;

[0062] Figures 4a - 4c shows the schematic diagram of the influence of the widths of different dummy metal wires on the electric field distribution where the electroplated metal is located;

[0063] Figure 5 shows the data schematic diagram of the widths of different dummy metal wires and the electroplated metal thickness;

[0064] Figure 6 shows the schematic diagram of the influence of the annular structure of the dummy metal wire on the electric field distribution where the electroplated metal is located;

[0065] Figures 7a - 7c shows the schematic diagram of the influence of the distance between the boundaries of different dummy metal wires and the electroplated metal on the electric field distribution where the electroplated metal is located;

[0066] Figure 8 shows the data schematic diagram of the influence of the distance between the boundaries of different dummy metal wires and the electroplated metal on the electroplating thickness;

[0067] Figure 9 shows the schematic diagram of the structure of the electroplating device according to another embodiment of the present invention;

[0068] Figure 10 shows the schematic diagram of the structure of the electroplating processing circuit of the electroplating device according to an embodiment of the present invention;

[0069] Figure 11 shows Figure 10 the equivalent schematic diagram of the electroplating processing circuit shown;

[0070] Figure 12 shows the schematic diagram of the structure of the electroplated metal detection circuit of the electroplating device according to an embodiment of the present invention;

[0071] Figure 13 Show a schematic connection diagram of an electroplated metal detection circuit corresponding to an exemplary display substrate;

[0072] Figure 14 Show Figure 12 An equivalent schematic diagram of the electroplated metal detection circuit described above;

[0073] Figure 15 Show a schematic diagram of the overall circuit structure of the electroplating device according to an embodiment of the present invention;

[0074] Figure 16 Show Figure 15 An equivalent schematic diagram of the circuit structure diagram shown above;

[0075] Figure 17 Show a schematic diagram of the steps of a method for electroplating according to another embodiment of the present invention. Detailed implementation manners

[0076] To describe the present invention more clearly, the present invention will be further described below in conjunction with embodiments and drawings. Similar components in the drawings are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the protection scope of the present invention.

[0077] As Figure 1a shown, thick copper metal lines can be fabricated by the method of 'Seed layer fabrication → Copper plating → Etching' or, as Figure 1b shown, by the method of 'Seed layer fabrication → Photoresist patterning / or etching → Copper plating'. The former has certain precision limitations in copper etching, and the etched boundary is not smooth, and at the same time, the etching efficiency is relatively low; in the latter, due to the current crowding effect, the electric field lines will gather at the edge positions of the metal lines and the edge positions of the circuit board lines, resulting in a thicker copper plating thickness at the edges than in the middle as the electroplating progresses, that is, causing the problem of electroplating uniformity.

[0078] Through the experiments and research of the inventor, it is proposed that the reasons affecting electroplating uniformity are: as Figure 2a shown, a common electroplating cell model is shown, Figure 2a The three-dimensional distribution model of the electric field lines of the electroplating cell model shown as Figure 2b shown, when the anode and cathode are connected to the power supply, the electric field line distribution points from the anode to the cathode, Figure 2c Show Figure 2a A schematic diagram of the electroplating thickness distribution of the electroplated sample shown as

[0079] As Figure 2b shown, the electric field line distribution in the middle region is relatively sparse, and the electric field line distribution on the edge side is denser than that of the middle metal line. Therefore, as the electroplating progresses, asFigure 2c As shown, the metal wires are electroplated thicker at the edge positions where the electric field lines are densely distributed, while they are electroplated thinner at the positions in the middle where the electric field lines are sparsely distributed, resulting in problems with electroplating uniformity.

[0080] Therefore, as Figure 3 shown, the embodiments of the present invention propose an electroplating plate, an electroplating device, and a manufacturing method to solve the problems of the above embodiments.

[0081] As Figure 3 shown, the first embodiment of the present invention proposes an electroplating plate, including: a receiving area AA and an annular area BB surrounding the receiving area AA.

[0082] The electroplating plate includes:

[0083] a substrate 10,

[0084] processing positions 11 for a plurality of fixed display substrates 20 located in the receiving area AA, and the display substrate 20 includes a first processing end 21 and a second processing end 22;

[0085] connection terminals 12 located at the edge positions of the annular area BB for accessing electrical signals, the connection terminals include a first connection terminal 121 and a plurality of second connection terminals 122, and the second connection terminals 122 correspond to the first processing ends 21 one by one;

[0086] a plurality of sequentially nested conductive rings 13 located in the annular area BB, and the conductive rings 13 include a first conductive ring 131 and a plurality of second conductive rings 132;

[0087] a first node 131A of the first conductive ring 131 is connected to the first connection terminal 121, and another second node 131B of the first conductive ring 131 is connected to the second processing end 22 of each display substrate 20.

[0088] The second connection terminals 122 are connected to the first processing ends 21 of each display substrate 20 through connection lines 14, or are connected to the first processing ends 21 of each display substrate 20 by connecting the nodes of the second conductive rings 132.

[0089] In the embodiments of the present invention, by arranging a plurality of conductive rings 13 in the conductive area and designing the connection modes of the nodes of the conductive rings 13 with the first connection terminal 121 and the second connection terminals 122, and the connection modes of the display substrate 20 with the first connection terminal 121 and the second connection terminals 122, a current collection ring can be formed during electroplating to change the magnetic field distribution around each display substrate 20, thereby improving electroplating uniformity.

[0090] The embodiments of the present invention draw the conclusion that the conductive rings 13 can improve the magnetic field distribution through the following multiple tests:

[0091] Place a dummy metal wire, i.e., a virtual metal wire, above the electroplated metal so that the metal at the edge position and the internal metal are in the same electric field environment.

[0092] In a specific example, set the distance between the lower boundary of the dummy metal wire and the upper boundary of the electroplated metal to be fixed at 0.15 mm, and gradually increase the width of the dummy metal wire. Taking the electroplating thickness set to 10 mm as an example, the schematic diagram of changing the electric field distribution by changing the width of the dummy metal wire is as Figures 4a - 4c shown.

[0093] To quantitatively represent the uniformity of the electroplated metal, as Figure 5 shown, after electroplating is completed, the maximum thickness, minimum thickness, average thickness and root mean square error of the electroplating thickness on the electroplated metal wire are respectively counted.

[0094] Figure 5 In the figure, the horizontal axis represents the width of the dummy metal wire in mm; the vertical axis represents the maximum thickness, minimum thickness, average thickness of the maximum electroplated metal and the root mean square error of the electroplating thickness. The simulation results show that when the distance between the dummy metal and the electroplated metal is fixed, as the width of the dummy metal increases, the maximum value of the thickness of the electroplated metal continuously increases, the minimum value changes little, and at the same time, the root mean square error of the electroplating thickness also becomes larger, that is, the electroplating uniformity becomes worse.

[0095] Therefore, in the embodiment of the present invention, by arranging dummy metal wires on each side of the electroplated metal, the uniformity can be improved. Exemplarily, after arranging a dummy metal wire in a ring structure, the electric field distribution is as Figure 6 shown, and it can be found that the uniformity of multiple electroplated metals is improved.

[0096] Therefore, in the embodiment of the present invention, by arranging dummy metal wires on each side of the electroplated metal, the uniformity can be improved.

[0097] Based on the above settings, the embodiment of the present invention arranges a plurality of conductive rings 13 sleeved in sequence, and connects the first node 131A of the first conductive ring 131 to the first connection terminal 121, and the other second node 131B of the first conductive ring 131 is connected to the second processing end 22 of each display substrate 20. The second connection terminal 122 is connected to the first processing end 21 of each display substrate 20 through a connection wire 14, or is connected to the first processing end 21 of each display substrate 20 by connecting the nodes of the second conductive ring 132, thereby forming a current collection ring, which can improve the current convergence effect on the edge side of the electroplated metal to improve the electroplating uniformity.

[0098] In an alternative embodiment, as Figure 3As shown, the orthographic projection of each of the second conductive rings 132 on the substrate 10 is an annular structure, and a plurality of the second conductive rings 132 are arranged in a nested manner in the orthographic projection on the substrate 10. In this embodiment, a plurality of conductive ring structures are provided to further improve the electroplating uniformity.

[0099] In the embodiment of the present invention, the manner in which the second connection terminal 122 is connected to the first processing end 21 of each display substrate 20 is not unique. One is to directly connect to the first processing end 21 of the display substrate 20 through the connection line 14, and the other is to use a partial metal trace of the conductive ring 13 as the connection line 14 to connect to the first processing end 21 of the display substrate 20. In a specific example, the second conductive ring 132 includes a third node 122C connected to the second connection terminal 122 and a fourth node 122D connected to the first processing end 21. In the same second conductive ring 132, the conductive metal between the third node 122C and the fourth node 122D serves as the connection line 14 connecting the first connection terminal 121 and the first processing end 21. Through this setting, the reuse of the connection line 14 is realized, and the complexity of the wiring is reduced.

[0100] In an alternative embodiment, as Figure 3 shown, the second connection terminals 122 are arranged in an array along the first direction.

[0101] A plurality of processing positions 11 are arranged symmetrically about an axis parallel to the first direction.

[0102] In a second direction perpendicular to the first direction, the second processing ends 22 of two adjacent display substrates 20 are arranged opposite to each other.

[0103] In the embodiment of the present invention, the first direction is the row direction and the second direction is the column direction. Six display substrates 20 are arranged symmetrically about the axis in the horizontal row direction. In this structure, the six display substrates 20 include two rows, with three in each row. In this embodiment, the number of the second conductive rings 132 is the same as the number of the display substrates 20 in the first direction, that is, there are three second conductive rings 132.

[0104] Through this setting, the display substrates 20 in the first row can be directly connected to the second connection terminals 122, while the display substrates 20 in the second row use the conductive metal of the corresponding conductive ring 13 as the connection line 14. Through this setting, the reuse of the connection line 14 is realized, and the complexity of the wiring is reduced.

[0105] Furthermore, in an alternative embodiment, the first conductive ring 131 includes a fifth node 131E, which is located at an edge opposite to the edge where the second node 131B is located.

[0106] The second node 131B and the fifth node 131E are connected by a connection line 14. The orthographic projection of the connection line 14 on the substrate 10 is located in the gap of the orthographic projection of the adjacent display substrate 20 on the substrate in the second direction. Through this setting, by using the connection line 14 connecting the second node 131B and the fifth node 131E, a solution is realized to connect the first connection terminal 121 and the first processing end 21 by the conductive metal of the connection line 14 and the first conductive ring 131, thereby forming a current loop for subsequent monitoring of the electroplating process using this electroplating plate.

[0107] In an alternative embodiment, the distance between the display substrate and the second conductive ring located at the innermost side of the ring sleeve is determined according to the design size, electroplating thickness, electroplating solution concentration, and electric field strength of the display panel. The distance between the to-be-processed position 11 and the smallest second conductive ring 132 is set.

[0108] In a specific example, as Figure 5 shown, in the process of monitoring the electroplating thickness based on the change in the width of the dummy metal wire in the foregoing embodiment, when the width of the dummy metal wire is 0.1 mm, the average electroplating thickness (10.01 mm) is closest to the target electroplating value (10 mm), and at the same time, the root mean square error of the electroplating thickness is also relatively small. Therefore, in a preferred embodiment, the widths of the first conductive ring 131 and the second conductive ring 132 are 0.1 mm.

[0109] Furthermore, in the embodiment of the present invention, the distance between the boundary of the first conductive ring 131 close to the display substrate 20 (or the processing position 11) and the boundary of the display substrate 20 (or the processing position 11) is designed.

[0110] In a specific example, when the width of the orthographic projection of the first conductive ring 131 on the substrate remains unchanged and the distance between the boundary of the first conductive ring 131 close to the display substrate 20 and the display substrate 20 is gradually increased, the influence of the distance between the boundary of the first conductive ring 131 close to the display substrate 20 and the display substrate 20 on the electroplating uniformity is as Figures 7a - 7c shown.

[0111] The simulation results are as Figure 8 shown. When the width of the orthographic projection of the first conductive ring 131 on the substrate remains unchanged and the distance between the boundary of the first conductive ring 131 close to the display substrate 20 and the display substrate 20 is gradually increased, the maximum thickness of the electroplated metal decreases, the minimum thickness changes little, and at the same time, the root mean square error of the electroplating thickness shows a trend of first decreasing and then increasing. In a specific example, when the distance between the boundary of the conductive ring 13 close to the display substrate 20 and the display substrate 20 is 0.1 mm or 0.15 mm, the root mean square error of the electroplating thickness is the smallest, that is, the electroplating uniformity is the best.

[0112] In a specific example, compared with Figure 2c the thickness distribution schematic diagram shown, the maximum thickness of the electroplated metal wire is 12.36 mm, the minimum thickness is 8.9 mm, the average thickness is 10.05 mm, and the root mean square error of the electroplating thickness is 0.69.

[0113] Based on the structural design of the electroplated plate of this embodiment, the maximum thickness of the electroplated metal wire is 11.05 mm, the minimum thickness is 8.19 mm, the average thickness is 9.2 mm, the root mean square error of the electroplating thickness is 0.579, and the electroplating uniformity has been greatly improved.

[0114] Furthermore, the embodiment of the present invention designs an electroplating device by using the electroplated plate of the previous embodiment, as Figures 9 - 16 described in the electroplating device 3, the device includes:

[0115] an electroplating anode 31, a plurality of first power supplies 32 ( Figure 9 not shown in the figure), and the electroplated plate 1 of the previous embodiment of the present invention. The second connection terminal 122 of the electroplated plate serves as the electroplating cathode of the electroplating device.

[0116] The first power supply 32 includes a first negative electrode 321 and a first positive electrode 322. Each first negative electrode 321 is respectively connected to the first connection terminal 121 (PIN1) and each second connection terminal 122 (PIN2 to PIN7), and all the first positive electrodes 322 are connected to the electroplating anode 31;

[0117] The voltage of the first power supply 32 connected to the first connection terminal 121 is less than the voltage of the first power supply 32 connected to the second connection terminal 122.

[0118] As Figure 9 and Figure 10 shown, in the embodiment of the present invention, each display substrate 20 is connected to the first negative electrode 321 of a first power supply 32, and the first positive electrode 322 is connected to the electroplating anode 31 to simultaneously perform the electroplating process on multiple display substrates 20. Moreover, the voltage of the first power supply 32 connected to the first connection terminal 121 is less than the voltage of the first power supply 32 connected to the second connection terminal 122. Each first power supply 32 is connected to the display substrate 20 through the second connection terminal 122, and through the circuit structure design of the circuit board, a plurality of independent and complete electroplating processing circuits are formed.

[0119] As Figure 11As shown, during the electroplating process, after each first power supply 32 is energized, the circuit between the first connection terminal 121 and the first power supply 32 is conducted, and the circuit between the second connection terminal 122 and the first power supply 32 is conducted, forming individual electroplating circuits. Further, in an alternative embodiment, an ammeter is provided between the second connection terminal 122 and the first negative electrode 321 of the first power supply 32 to monitor the current during the electroplating process, thereby monitoring the electroplating process.

[0120] In an alternative embodiment, as Figure 12 shown, the electroplating device further includes an electroplated metal detection circuit connected to the electroplating plate, including:

[0121] An electroplated metal voltage detection circuit for detecting the voltage of the electroplated metal generated when each display substrate 20 is electroplated;

[0122] An electroplated metal current detection circuit for detecting the current of the electroplated metal generated when each display substrate 20 is electroplated;

[0123] A control switch 34 for switching the electroplated metal voltage detection circuit and the electroplated metal current detection circuit; and

[0124] A second power supply 33 for supplying power to the electroplated metal voltage detection circuit and the electroplated metal current detection circuit.

[0125] In the embodiment of the present invention, the electroplated metal detection circuit is used to test the process accuracy of the electroplating thickness. The electroplated metal voltage detection circuit and the electroplated metal current detection circuit are used to determine the resistance of the electroplated metal formed on each display substrate 20, and whether the electroplating process of the current display substrate 20 is uniform is judged by the resistance.

[0126] In an alternative embodiment, as Figure 12 shown, the control switch 34 includes:

[0127] A first switch 341 connected to the first connection terminal 121. The first switch 341 includes a first selection end a connected to a voltmeter and a second selection end b connected to the second negative electrode 331 of the second power supply 33 through a connection line 14. The other end of the voltmeter is connected to the second negative electrode 331;

[0128] A second switch 342 connected to each second connection terminal 122 one by one. The second switch 342 includes a third selection end c connected to an ammeter, and the other end of the ammeter is connected to the second positive electrode of the second power supply 33.

[0129] In the embodiment of the present invention, the first switch 341 and the second switch 342 are utilized, the respective selection terminals of the first switch 341 are designed, and the respective selection terminals of the second switch 342 are designed, so as to realize the switching between the voltage detection circuit and the current detection circuit. Moreover, the first switch 341 and the second switch 342 are utilized to realize the sharing of some circuits in the two circuits, thereby simplifying the circuit structure.

[0130] Under the circuit structure of this embodiment, the relationship between the electroplated metal voltage detection circuit and the electroplated metal current detection circuit and the control state of the control switch is as follows:

[0131] In an alternative embodiment,

[0132] As Figure 13 shown, when the first selection terminal a of the first switch 341 is in the closed state, any third selection terminal c of the second switch 342 is in the closed state, and the other third selection terminals c of the second switch 342 are in the open state, an electroplated metal voltage detection circuit for detecting the electroplated metal formed on the display substrate 20 corresponding to the closed second switch 342 is constituted;

[0133] As Figure 14 shown, when the second selection terminal b of the first switch 341 is in the closed state, any third selection terminal c of the second switch 342 is in the closed state, and the other third selection terminals c of the second switch 342 are in the open state, an electroplated metal current detection circuit for detecting the electroplated metal formed on the display substrate 20 corresponding to the closed second switch 342 is constituted.

[0134] Exemplarily, as Figure 12 、 Figure 13 and Figure 14 shown, 6 display substrates 20 correspond to 6 second connection terminals 122 pin2 to pin7. Each second connection terminal 122 is respectively connected to a second switch 342, and the first connection terminal 121 is connected to the first switch 341.

[0135] By applying voltages between pin1 and pin2, pin1 and pin3, pin1 and pin4, pin1 and pin5, pin1 and pin6, and pin1 and pin7, the voltages and currents of the corresponding display substrate 20 can be tested, so as to determine the resistance value of the display substrate 20.

[0136] In a specific example, as Figure 13 shown, the first switch 341 is placed at the first selection terminal a end, the third selection terminal c of the second switch 342 corresponding to pin2 is in the closed state, and the second switches 342 corresponding to pin3 to pin7 are all in the open state, then a voltage detection circuit for measuring the display substrate 20 corresponding to pin2 is constituted.

[0137] In a specific example, as Figure 14 shown, the first switch 341 is placed at the b end of the second selection terminal, the third selection terminal c of the second switch 342s2 is in a closed state, the current flowing through the display substrate 20 is measured, and the second switches 342 corresponding to pin3 to pin7 are all in an open state, thus forming a current detection circuit for measuring the current of the display substrate 20 corresponding to pin2. Further, the resistance value of the display substrate 20 is calculated using the formula R = U / I.

[0138] The circuit connection structures of the voltages and currents of other display substrates 20 are similar and will not be elaborated here. In an alternative embodiment, the thickness of the electroplated metal of the display substrate 20 is inversely proportional to the resistance value.

[0139] From the resistance calculation formula: R = ρ×L / S = ρ×L / (w*t), it can be known that, where ρ is the resistivity, L is the resistance length, S is the resistance cross-sectional area, w is the cross-sectional length of the equivalent resistance, and t is the cross-sectional width of the equivalent resistance, that is, the electroplated metal thickness.

[0140] According to the electroplating material, the magnitude of the conductivity ρ can be known. Since the patterns between different display substrates 20 are the same, the equivalent L and equivalent W between different display substrates 20 are the same. Therefore, the resistance magnitude can be used to characterize the difference in the electroplated thickness of the display substrate 20, and the relationship between the thickness and the resistance can be determined through the mapping relationship in actual mass production applications.

[0141] In a specific example, based on the above formula, it can be known that the larger the resistance value, the smaller the thickness t; the smaller the resistance value, the larger the thickness. Therefore, it is possible to determine whether the thickness of the electroplated metal is in a normal state according to the resistance value.

[0142] In an alternative embodiment, the resistance values of all display substrates during the electroplating process are determined, and an electroplating average value is obtained based on the resistance values. In the comparison between the resistance value and the electroplating average value, if the resistance value is less than the electroplating average value, the voltage value of the first power supply is decreased; if the resistance value is greater than the electroplating average value, the voltage value of the first power supply is increased.

[0143] That is to say, when the resistance value is larger than the average value of the measured resistances of all display substrates, it indicates that the electroplated thickness of this display substrate is smaller than the average electroplated thickness. At this time, it is necessary to increase the pressure difference between this display substrate and the electroplating anode, that is, it is necessary to increase the voltage of the corresponding first power supply to increase the electroplating speed; on the contrary, when the resistance value is smaller than the average value, it indicates that the electroplated thickness is larger, and it is necessary to reduce the pressure difference between this display substrate and the anode, that is, it is necessary to reduce the voltage of the corresponding first power supply to reduce the electroplating speed. Through this setting, the uniformity of the rates of multiple display substrates electroplated simultaneously is achieved.

[0144] In an alternative embodiment, the equivalent resistance length L, the S-resistance cross-sectional area, and the cross-sectional length w of the equivalent resistance of the display substrate 20 according to the embodiments of the present invention are designed according to the design requirements of the electroplated metal of the display substrate 20.

[0145] In an alternative embodiment, as Figure 15 and Figure 16 shown, the first switch 341 further includes a fourth selection terminal d, which is electrically connected to the first negative electrode 321 of the first power supply 32 connected to the first connection terminal 121.

[0146] The second switch 342 further includes a fifth selection terminal e, which is electrically connected to the first negative electrode 321 of the first power supply 32 connected to the second connection terminal 122.

[0147] The present invention designs the dual selection terminals of the first switch 341 as triple selection terminals, and sets the second switch 342 to include a dual selection terminal with a third selection terminal c and a fifth selection terminal e, so as to realize the multiplexing of part of the circuits of the normal electroplating process and the resistance detection circuit, and simplify the circuit.

[0148] In an alternative embodiment, when the fourth selection terminal d of the first switch 341 is in a closed state and all the fifth selection terminals e are in a closed state, the electroplating device performs electroplating. At this time, as described in the foregoing embodiment, after each first power supply 32 is energized, individual electroplating circuits are formed.

[0149] In an alternative embodiment, the electroplating processing period and the resistance detection period are in different periods, that is, the normal electroplating process of this embodiment cannot be carried out simultaneously with the thickness detection of the electroplated metal, but the corresponding processes are carried out in different periods. The settings of the electroplating processing period and the resistance detection period are designed by those skilled in the art according to actual applications, and will not be elaborated here.

[0150] Based on the electroplating device of the above embodiments of the present invention, on the one hand, through the structural design of the electroplating plate itself, a current collection ring can be formed during electroplating, reducing the current crowding effect and improving electroplating uniformity; on the other hand, through the circuit design between the electroplating plate and each structure of the evaporation device, by performing resistance testing on different display substrates 20, the electroplating thickness is deduced according to the resistance test results, achieving the purpose of electroplating thickness monitoring. At the same time, according to the electroplating thickness monitoring results, the voltage magnitude of the first power supply 32 corresponding to the display substrate 20 is adjusted, thereby adjusting the electroplating speed to ensure that all display substrates 20 can be evenly electroplated and improving electroplating uniformity during electroplating.

[0151] Based on the foregoing embodiments, as Figure 17As shown in the figure, another embodiment of the present invention provides a method for electroplating using the electroplating device of the above embodiment. The method includes:

[0152] Fix the display substrate 20 to be processed in each processing position 11 respectively;

[0153] In response to the electroplating instruction, adjust the voltage of the first power supply 32 connected to the first connection terminal 121 so that the voltage of the first power supply 32 connected to the first connection terminal 121 is set to be less than the voltage of the first power supply 32 connected to the second connection terminal 122;

[0154] In response to the electroplating instruction, energize the first power supply 32 to form electroplated metal on the display substrate 20.

[0155] In this embodiment, in response to the electroplating instruction, using the circuit design of each component and the electroplating plate in the above electroplating device, multiple display substrates 20 can be processed simultaneously. During the electroplating process, the use of multiple conductive rings 13 on the electroplating plate can improve the current aggregation effect, so as to improve the thickness uniformity of the electroplated metal formed on the display substrate 20.

[0156] For the circuit used in the electroplating method of this embodiment, the connection relationship and working principle of the foregoing embodiment can be referred to, and will not be elaborated here.

[0157] In an optional embodiment, as Figure 12 shown, the electroplating device further includes an electroplated metal detection circuit connected to the electroplating plate, including an electroplated metal voltage detection circuit, an electroplated metal current detection circuit, a control switch; and a second power supply 33;

[0158] The method further includes,

[0159] In response to the detection instruction, switch and control the control switch, and use the electroplated metal voltage detection circuit to detect the voltage value corresponding to the electroplated metal formed on each display substrate 20;

[0160] In response to the detection instruction, switch and control the control switch, and use the voltage metal voltage detection circuit to detect the current value corresponding to the electroplated metal formed on each display substrate 20;

[0161] Determine the resistance value of the electroplated metal according to the voltage value and the current value.

[0162] In this embodiment, on the basis of the normal electroplating process based on the electroplating processing circuit, the embodiment of the present invention further designs an electroplated metal detection circuit, which can respectively detect the voltage and current of the electroplated metal, and determine the resistance value of the electroplated metal according to the voltage value and the current value, so as to realize the thickness detection of electroplating and timely discover the display substrate 20 with abnormal electroplating thickness in the electroplating process.

[0163] Further, based on the above process, an embodiment of the present invention further proposes an adjustment scheme using the resistance value. In an alternative embodiment, the method further includes:

[0164] In an alternative embodiment, determine the resistance values of all the display substrates during the electroplating process, and obtain the electroplating average value according to the resistance values. In the comparison between the resistance value and the electroplating average value, if the resistance value is less than the electroplating average value, then decrease the voltage value of the first power supply; if the resistance value is greater than the electroplating average value, then increase the voltage value of the first power supply.

[0165] Through this process, it is possible to adjust the abnormal display substrate 20 whose electroplating effect is different from that of other display substrates 20. By adjusting the voltage value of this abnormal display panel, an increase or decrease in the electroplating speed of this abnormal display panel can be achieved, and the uniformity of the electroplating rate of multiple simultaneously electroplated display substrates 20 can be realized.

[0166] It should be noted that for specific embodiments of the process and principle of the electroplating method in the embodiments of the present invention, reference may be made to the electroplating plate and electroplating device in the foregoing embodiments, which will not be elaborated herein.

[0167] In the description of the present invention, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.

[0168] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is impossible to enumerate all the implementation manners here. Any obvious changes or modifications derived from the technical solutions of the present invention still fall within the protection scope of the present invention.

Claims

1. An electroplated plate, characterized in that, Comprising: A receiving area and an annular area surrounding the receiving area, The electroplating plate includes: A substrate, A plurality of processing positions for fixing the display substrate located in the receiving area, the display substrate including a first processing end and a second processing end; Connection terminals located at the edge position of the annular area for accessing electrical signals, the connection terminals including a first connection terminal and a plurality of second connection terminals, the number of the second connection terminals corresponding to the number of the display substrates; A plurality of sequentially nested conductive rings located in the annular area, the conductive rings including a first conductive ring and a plurality of second conductive rings; A first node of the first conductive ring is connected to the first connection terminal, and another second node of the first conductive ring is connected to the second processing end of each display substrate, The second connection terminal is connected to the first processing end of each display substrate through a connection line, or is connected to the first processing end of each display substrate by connecting the nodes of the second conductive ring.

2. The electroplated board according to claim 1, wherein The orthographic projection of each second conductive ring on the substrate is an annular structure, and when the plurality of second conductive rings are sequentially nested in the orthographic projection on the substrate and the second connection terminal is connected to the first processing end of each display substrate by connecting the nodes of the second conductive ring, The second conductive ring includes a third node connected to the second connection terminal and a fourth node connected to the first processing end, In the same second conductive ring, the conductive metal between the third node and the fourth node serves as a connection line connecting the first connection terminal and the first processing end.

3. The electroplating plate according to claim 2, wherein The second connection terminals are arranged in an array along a first direction, The plurality of processing positions include being axially symmetrically arranged along an axis parallel to the first direction, In a second direction perpendicular to the first direction, the second processing ends of two adjacent display substrates are arranged opposite to each other, The first conductive ring includes a fifth node located at an edge opposite to the edge where the second node is located, The second node and the fifth node are connected by a connection line, and the orthographic projection of the connection line on the substrate is located in the gap between the orthographic projections of the processing positions adjacent in the second direction on the substrate, The second processing end of each display substrate is respectively connected to the connection point of the connection line.

4. The electroplating plate according to any one of claims 1 to 3, wherein The distance between the display substrate and the second conductive ring located at the innermost side of the nested rings is determined according to the design size, electroplating thickness, electroplating solution concentration and electric field strength of the display panel.

5. An electroplating device, characterized in that, The device includes: An electroplating anode, a plurality of first power supplies and the electroplating plate according to any one of claims 1 to 4, and the second connection terminal of the electroplating plate serves as the electroplating cathode of the electroplating device, The first power supply includes a first negative electrode and a first positive electrode, each first negative electrode is respectively connected to the first connection terminal and each second connection terminal, and all the first positive electrodes are connected to the electroplating anode; The voltage of the first power supply connected to the first connection terminal is less than the voltage of the first power supply connected to the second connection terminal.

6. The electroplating device according to claim 5, wherein The electroplating device further includes an electroplating metal detection circuit connected to the electroplating plate, comprising: An electroplating metal voltage detection circuit for detecting the voltage of the electroplating metal generated when electroplating each of the display substrates; An electroplating metal current detection circuit for detecting the current of the electroplating metal generated when electroplating each of the display substrates; A control switch for switching between the electroplating metal voltage detection circuit and the electroplating metal current detection circuit; and A second power source for supplying power to the electroplating metal voltage detection circuit and the electroplating metal current detection circuit.

7. The electroplating device according to claim 6, characterized in that The control switch includes: A first switch connected to the first connection terminal, the first switch including a first selection terminal connected to a voltmeter and a second selection terminal connected to the second negative electrode of the second power source through a connection wire, and the other end of the voltmeter is connected to the second negative electrode; A second switch connected to each of the second connection terminals one by one, the second switch including a third selection terminal connected to an ammeter, and the other end of the ammeter is connected to the second positive electrode of the second power source.

8. The electroplating device according to claim 7, wherein When the first selection terminal of the first switch is in the closed state, the third selection terminal of any one of the second switches is in the closed state, and the third selection terminals of the other second switches are in the open state, an electroplating metal voltage detection circuit for detecting the electroplating metal formed on the display substrate corresponding to the second switch in the closed state is constituted; When the second selection terminal of the first switch is in the closed state, the third selection terminal of any one of the second switches is in the closed state, and the third selection terminals of the other second switches are in the open state, an electroplating metal current detection circuit for detecting the electroplating metal formed on the display substrate corresponding to the second switch in the closed state is constituted.

9. The electroplating device according to claim 7, wherein The first switch further includes a fourth selection terminal electrically connected to the first negative electrode of the first power source connected to the first connection terminal, The second switch further includes a fifth selection terminal electrically connected to the first negative electrode of the first power source connected to the second connection terminal.

10. The electroplating device according to claim 9, wherein, When the fourth selection terminal of the first switch is in the closed state and all the fifth selection terminals are in the closed state, the electroplating device performs electroplating.

11. A method for electroplating using the electroplating device according to any one of claims 5 to 10, characterized in that, The method includes: Fixing the display substrates to be processed in each processing position respectively; In response to an electroplating instruction, adjusting the voltage of the first power source connected to the first connection terminal so that the voltage of the first power source connected to the first connection terminal is set to be less than the voltage of the first power source connected to the second connection terminal; Powering on the first power source in response to an electroplating instruction to form electroplating metal on the display substrate.

12. The electroplating method according to claim 11, characterized in that, The electroplating device further includes an electroplating metal detection circuit connected to the electroplating plate, including an electroplating metal voltage detection circuit, an electroplating metal current detection circuit, a control switch, and a second power source; The method further includes, In response to a detection instruction, switching and controlling the control switch, and using the electroplating metal voltage detection circuit to detect the voltage value corresponding to the electroplating metal formed on each display substrate; In response to a detection instruction, switch to control the control switch, and use a voltage metal voltage detection circuit to detect the current value corresponding to the electroplated metal formed on each display substrate; Determine the resistance value of the electroplated metal according to the voltage value and the current value.

13. The electroplating method according to claim 12, wherein It further includes: Determine the resistance values of all the display substrates during the electroplating process, and obtain an electroplating average value according to the resistance values; Adjust the voltage value of the first power supply connected to the display substrate according to the comparison result between the resistance value and the electroplating average value, where if the resistance value is less than the electroplating average value, reduce the voltage value of the first power supply; if the resistance value is greater than the electroplating average value, increase the voltage value of the first power supply.

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