Thorn crystal mass transfer device

Abstract

The present invention relates to the field of MiniLED wafer mass transfer technology, and in particular to a thorn-crystal mass transfer device, which aims to alleviate the technical problems of low production capacity and poor product precision in related technologies. During thorn-crystal operation, the X-axis drive mechanism of the thorn-crystal mass transfer device moves the substrate on the substrate carrier along the X-axis, so that the substrate and the wafer clamped by the die bond assembly are precisely aligned, thereby replacing the movement of the die bond assembly in the X-axis. Through this conversion, weight reduction is achieved, and the high-frequency, high-speed, and high-precision requirements of the thorn-crystal operation can be met, alleviating the technical problems of low production capacity and poor product precision in existing thorn-crystal operations.

Description

Technical Field

[0001] The present invention relates to the field of MiniLED wafer mass transfer technology, and in particular to a spike-type mass transfer device. Background Art

[0002] MLED mass die bonding technology is a bottleneck technology in today's display industry. From OLED to miniLED, and then to microLED products (chips), the demand for mass transfer is becoming more and more urgent.

[0003] Currently, the stinging method is commonly used to transfer large quantities of chips. During stinging, a dual gantry structure moves to the stinging station. To accurately align the die with the substrate, the gantry cantilever within the gantry structure must repeatedly move in the X-axis. However, the gantry cantilever is heavy, weighing nearly 100 kilograms. This significantly limits transfer speed, resulting in low production capacity and poor product precision. Summary of the Invention

[0004] The purpose of the present invention is to provide a spike crystal mass transfer device to alleviate the technical problems of low production capacity and poor product precision in related technologies.

[0005] In order to solve the above technical problems, the technical solution provided by the present invention is:

[0006] The thorn-crystal mass transfer device provided by the present invention includes: a loading assembly, a crystal fixing assembly, a thorn-crystal assembly, a substrate feeding assembly, a substrate moving assembly and an X-axis beam assembly;

[0007] The loading assembly is used for loading wafers and includes a wafer carrier for loading wafers;

[0008] The die bonding assembly is used to clamp the wafer carrier;

[0009] The spike crystal assembly is used to transfer the core particles on the wafer to the substrate;

[0010] The substrate feeding assembly is used to transport substrates;

[0011] The substrate moving assembly is arranged at the substrate feeding assembly, and includes a substrate carrier and an X-direction driving mechanism. The substrate carrier is used to absorb the substrate transported by the substrate feeding assembly. The X-direction driving mechanism is transmission-connected to the substrate carrier and is used to drive the substrate carrier to move along the X-direction.

[0012] The X-axis crossbeam assembly is connected to the crystal bonding assembly to drive the crystal bonding assembly to move to the loading assembly and the substrate carrier, and is also connected to the thorn crystal assembly to drive the thorn crystal assembly to move to the substrate carrier.

[0013] Furthermore, the substrate feeding assembly includes a conveyor belt and a first driving mechanism;

[0014] The two conveyor belts are spaced apart and distributed in parallel, and extend along the Y direction;

[0015] The first driving mechanism is in driving connection with the conveyor belt to drive the conveyor belt to move along the Y direction.

[0016] Furthermore, the substrate feeding assembly further includes a first baffle, a second baffle and a second driving mechanism;

[0017] The first baffle and the second baffle both extend along the Y direction and are respectively arranged on both sides of the two conveyor belts to form a conveying channel;

[0018] The second driving mechanism is in transmission connection with the second baffle to drive the second baffle to move away from or toward the conveyor belt along the X direction.

[0019] Furthermore, the substrate moving assembly further includes a fixed plate and a Z-direction driving mechanism;

[0020] The X-axis driving mechanism is arranged on the fixed plate;

[0021] The Z-direction driving mechanism is in transmission connection with the fixing plate and is used for driving the fixing plate to move along the Z-direction.

[0022] Furthermore, the Z-direction drive mechanism includes an upper inclined block, a lower inclined block and a transverse drive assembly;

[0023] The fixing plate is fixed to the top surface of the upper inclined block;

[0024] The bottom surface of the upper inclined block is a first inclined surface;

[0025] The surface of the lower inclined block opposite to the first inclined surface is a second inclined surface, and the second inclined surface is adapted to the first inclined surface;

[0026] The transverse driving assembly is in transmission connection with the lower inclined block and is used for driving the lower inclined block to move horizontally.

[0027] Furthermore, the feeding assembly further includes a support plate, a first mounting plate, a third driving mechanism, a material taking mechanism and a fourth driving mechanism;

[0028] The first mounting plate is in sliding engagement with the support plate;

[0029] The third driving mechanism is in transmission connection with the first mounting plate, and is used to drive the first mounting plate to move horizontally;

[0030] The material taking mechanism is arranged on the first mounting plate and has two states: locked and unlocked;

[0031] The fourth driving mechanism is in transmission connection with the material taking mechanism and is configured to drive the material taking mechanism to switch between the locked and unlocked states under the loading condition, so as to correspondingly lock or loosen the wafer carrier.

[0032] Furthermore, the wafer carrier is provided with two locking hooks spaced apart, and the openings of the two locking hooks are arranged opposite to each other;

[0033] The material taking mechanism includes a first connecting rod and two second connecting rods;

[0034] One end of one of the second connecting rods is provided with a first fastening body adapted to one of the locking hooks, and the other end is hingedly connected to one end of the first connecting rod via a first hinge pin. One of the second connecting rods is also hingedly connected to the first mounting plate via a second hinge pin, and the second hinge pin is located between the first hinge pin and the first fastening body.

[0035] One end of the other second connecting rod is hinged to the first mounting plate via a third hinge pin, and the other end is provided with a second fastening body adapted to the other locking hook, and the second fastening body and the first fastening body are located on the same side of the first connecting rod. The other second connecting rod is further hinged to the other end of the first connecting rod via a fourth hinge pin, and the fourth hinge pin is located between the third hinge pin and the second fastening body.

[0036] The fourth driving mechanism includes a reset assembly and a rotation driving assembly;

[0037] The reset assembly is used to be connected to one of the second connecting rods, so that the second connecting rod has a tendency to rotate toward the locking hook around the hinge axis between the second connecting rod and the first mounting plate;

[0038] The two groups of the rotary drive assemblies are spaced apart along the sliding path of the first mounting plate, and are used for transmission connection with one of the second connecting rods, and are configured so that under the loading condition, any group of the rotary drive assemblies drives the second connecting rod to rotate around the hinge axis between it and the first mounting plate away from the locking hook.

[0039] Furthermore, the feeding assembly further includes a fifth driving mechanism;

[0040] The fifth driving mechanism is in transmission connection with the support plate and is used for driving the support plate to move along the Z direction.

[0041] Furthermore, the die bonding assembly includes a die bonding beam, a second mounting plate, a sixth driving mechanism, a clamping module and a seventh driving mechanism;

[0042] The X-axis beam assembly is in transmission connection with the crystal-bonding beam, and is used to drive the crystal-bonding beam to move along the X direction;

[0043] The second mounting plate is slidably connected to the die-bonding beam;

[0044] The sixth driving mechanism is in transmission connection with the second mounting plate, and is used to drive the second mounting plate to slide along the Y direction;

[0045] The clamping module is arranged on the second mounting plate and is rotatably engaged with the second mounting plate;

[0046] The seventh driving mechanism is in transmission connection with the clamping module, and is used for driving the clamping module to rotate around its own axis extending along the Z direction.

[0047] Furthermore, the thorn crystal assembly includes a thorn crystal beam, a third mounting plate, a camera module, a thorn crystal module and an eighth driving mechanism;

[0048] The X-axis crossbeam assembly is in transmission connection with the thorn crystal crossbeam, and is used to drive the thorn crystal crossbeam to move along the X direction;

[0049] The third mounting plate is slidably connected to the thorn crystal beam;

[0050] The camera module is arranged on the third mounting plate;

[0051] The thorn crystal module is slidably connected to the third mounting plate and can slide along the Z direction;

[0052] The eighth driving mechanism is in transmission connection with the third mounting plate and is used for driving the third mounting plate to slide along the Y direction.

[0053] In summary of the above technical solutions, the technical effects that can be achieved by the thorn crystal mass transfer device provided by the present invention are:

[0054] In the present application, the substrate feeding assembly transports the substrate, the substrate carrier absorbs the substrate, and can move along the X-direction with the substrate under the drive of the X-direction drive mechanism; the loading assembly can load the wafer onto the wafer carrier; the solid crystal assembly can move to the loading assembly under the drive of the X-axis beam assembly, clamp the wafer carrier, and then continue to move to the substrate carrier to transfer the wafer to the crystallization station; the crystallization assembly can move to the substrate carrier under the drive of the X-axis beam assembly, and transfer the core particles on the wafer to the substrate to complete the crystallization.

[0055] It can be seen that compared with the existing technology, when the crystal-piercing type mass transfer device is piercing the crystal, the X-axis drive mechanism moves the substrate on the substrate carrier along the X-axis, so that the substrate and the wafer clamped by the crystal bonding assembly are accurately aligned, thereby replacing the movement of the crystal bonding assembly in the X-axis. Through this conversion, weight reduction is achieved, which can meet the high frequency, high speed and high precision requirements of the crystal-piercing operation, and alleviate the technical problems of low production capacity and poor product precision in the existing crystal-piercing operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0057] Figure 1 A schematic structural diagram of a spike-crystal mass transfer device provided in an embodiment of the present invention;

[0058] Figure 2 A top view of a spike-crystal mass transfer device provided in an embodiment of the present invention;

[0059] Figure 3 A side view of a substrate moving assembly in a spike-type mass transfer device provided by an embodiment of the present invention;

[0060] Figure 4 A top view of a substrate moving assembly in a spike-type mass transfer device provided by an embodiment of the present invention;

[0061] Figure 5 A schematic structural diagram of the loading assembly of the spike crystal mass transfer device provided by an embodiment of the present invention when taking material;

[0062] Figure 6 for Figure 5 A top view of

[0063] Figure 7 A schematic structural diagram of a loading assembly in a spike crystal mass transfer device provided by an embodiment of the present invention;

[0064] Figure 8 for Figure 7 Enlarged view of point A in the middle;

[0065] Figure 9 for Figure 7 Enlarged view of point B in the middle;

[0066] Figure 10 A schematic structural diagram of the crystal bonding assembly in a spike-type mass transfer device provided in an embodiment of the present invention.

[0067] Icons: 100 - loading assembly; 110 - wafer carrier; 120 - support plate; 130 - first mounting plate; 140 - third drive mechanism; 150 - retrieving mechanism; 160 - fifth drive mechanism; 170 - reset assembly; 180 - rotation drive assembly; 190 - buffer block; 111 - lock hook; 141 - retrieving drive motor; 142 - third slide rail; 143 - third slider; 151 - first connecting rod; 152 - second connecting rod; 153 - first fastener; 154 - first hinge pin; 155 - second hinge pin; 156 - third hinge pin; 157 - second fastener; 158 - fourth hinge pin; 159 - push rod; 171 - spring; 172 - pillar; 181 - rotary cylinder; 182 - prying block;

[0068] 200 - crystal bonding assembly; 210 - crystal bonding beam; 220 - second mounting plate; 230 - clamping module; 240 - seventh drive mechanism; 250 - first slide rail; 260 - first slider; 241 - belt; 242 - rotary adjustment motor; 243 - synchronous pulley; 244 - idler pulley;

[0069] 300 - Thorn crystal assembly; 310 - Thorn crystal beam; 320 - Third mounting plate; 330 - Camera module; 340 - Thorn crystal module; 350 - Second slide rail; 360 - Second slider;

[0070] 400-substrate feeding assembly; 410-conveyor belt; 420-first baffle; 430-second baffle; 440-transverse cylinder; 450-baffle slide rail;

[0071] 500 - Substrate moving assembly; 510 - Substrate carrier; 520 - X-axis drive mechanism; 530 - Fixed plate; 540 - Z-axis drive mechanism; 521 - Substrate drive motor; 522 - Fourth slide rail; 523 - Fourth slider; 541 - Upper inclined block; 542 - Lower inclined block; 543 - Roller slide rail; 544 - Fourth mounting plate; 545 - Transverse drive motor; 546 - Lead screw; 547 - Fifth slide rail; 548 - Fifth slider;

[0072] 600 - X-axis crossbeam assembly; 610 - X-axis crossbeam; 620 - sixth slide rail; 630 - sixth slider; 640 - fifth mounting plate;

[0073] 700-substrate; 800-material box; 900-platform. DETAILED DESCRIPTION

[0074] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0075] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0076] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0077] Currently, the stinging method is commonly used to transfer large quantities of chips. During stinging, a dual gantry structure moves to the stinging station. To accurately align the die with the substrate, the gantry cantilever within the gantry structure must repeatedly move in the X-axis. However, the gantry cantilever is heavy, weighing nearly 100 kilograms. This significantly limits transfer speed, resulting in low production capacity and poor product precision.

[0078] In view of this, the present invention provides a thorn crystal type mass transfer device, referring to Figure 1 and Figure 2 , including a loading assembly 100, a die-bonding assembly 200, a thorn crystal assembly 300, a substrate feeding assembly 400, a substrate moving assembly 500 and an X-axis crossbeam assembly 600; the loading assembly 100 is used for loading wafers and includes a wafer carrier 110 for loading wafers; the die-bonding assembly 200 is used to clamp the wafer carrier 110; the thorn crystal assembly 300 is used to transfer the core grains on the wafer to the substrate 700; the substrate feeding assembly 400 is used to transport the substrate 700; the substrate moving assembly 500 is set at the substrate feeding assembly 400, It includes a substrate carrier 510 and an X-direction drive mechanism 520. The substrate carrier 510 is used to adsorb the substrate 700 transported by the substrate feeding assembly 400. The X-direction drive mechanism 520 is connected to the substrate carrier 510 for driving the substrate carrier 510 to move along the X-direction; the X-axis beam assembly 600 is connected to the crystal bonding assembly 200 for driving the crystal bonding assembly 200 to move to the loading assembly 100 and the substrate carrier 510, and is also connected to the thorn crystal assembly 300 for driving the thorn crystal assembly 300 to move to the substrate carrier 510.

[0079] Continue to refer Figure 1 and Figure 2The substrate feeding assembly 400 transports the substrate 700, and the substrate carrier 510 absorbs the substrate 700 and can move along the X direction with the substrate 700 under the drive of the X-direction drive mechanism 520; the loading assembly 100 can load the wafer onto the wafer carrier 110; the solid crystal assembly 200 can move to the loading assembly 100 under the drive of the X-axis beam assembly 600, and clamp the wafer carrier 110, and then continue to move to the substrate carrier 510 to transfer the wafer to the crystallization station; the crystallization assembly 300 can move to the substrate carrier 510 under the drive of the X-axis beam assembly 600, and transfer the core particles on the wafer to the substrate 700 to complete the crystallization.

[0080] It can be seen that compared with the existing technology, when the crystal-piercing type mass transfer device is piercing, the X-direction drive mechanism 520 moves the substrate 700 on the substrate carrier 510 along the X-direction, so that the substrate 700 and the wafer clamped by the crystal bonding assembly 200 are precisely aligned, thereby replacing the movement of the crystal bonding assembly 200 in the X-direction. Through this conversion, weight reduction is achieved, which can meet the high frequency, high speed and high precision requirements of crystal piercing operations, and alleviate the technical problems of low production capacity and poor product precision in existing crystal piercing operations.

[0081] The following combination Figures 1 to 10 The structure and shape of the spike crystal mass transfer device provided in this embodiment are described in detail:

[0082] For further reference, Figure 1 and Figure 2 The substrate feeding assembly 400 includes a conveyor belt 410 and a first driving mechanism; the two conveyor belts 410 are spaced apart and distributed in parallel, and extend along the Y direction; the first driving mechanism is connected to the conveyor belt 410 to drive the conveyor belt 410 to move along the Y direction.

[0083] refer to Figures 1 to 4 The substrate moving assembly 500 also includes a fixed plate 530 and a Z-axis drive mechanism 540. The X-axis drive mechanism 520 is mounted on the fixed plate 530. The Z-axis drive mechanism 540 is in transmission connection with the fixed plate 530 and is used to drive the fixed plate 530 to move in the Z direction. When the fixed plate 530 moves in the Z direction, the X-axis drive mechanism 520 and the substrate carrier 510 move synchronously with it, achieving lifting and lowering.

[0084] Specifically, Figure 1 For example, when the substrate carrier 510 rises in the Z direction, it can pass through the two conveyor belts 410 to contact the substrate 700 and absorb the substrate 700. Then, driven by the X-direction drive mechanism 520, the substrate 700 can move along the substrate carrier 510 in the X direction within a preset range to compensate for the movement of the die bond assembly 200 in the X direction. It should be noted that the substrate carrier 510 can absorb the substrate 700 using vacuum suction, which is not described in detail here.

[0085] For further reference, Figure 1 and Figure 2 The substrate feeding assembly 400 further includes a first baffle 420, a second baffle 430 and a second driving mechanism; the first baffle 420 and the second baffle 430 both extend along the Y direction and are disposed on both sides of the two conveyor belts 410 to form a conveying channel; the second driving mechanism is transmission-connected to the second baffle 430 to drive the second baffle 430 to move away from or toward the conveyor belt 410 along the X direction.

[0086] For details, please refer to Figure 1 and Figure 2 The first baffle 420 and the second baffle 430 on both sides of the two conveyor belts 410 form a barrier for the transported substrate 700, preventing the substrate 700 from falling from the conveyor belts 410. The second driving mechanism includes a transverse cylinder 440 and a baffle slide 450 fixed to the platform 900. The driving direction of the transverse cylinder 440 is along the X direction. The two baffle slides 450 are horizontally symmetrically distributed on both sides of the transverse cylinder 440 along the X direction, and each baffle slide 450 is slidably engaged with a baffle slider; the second baffle 430 is divided into at least three sections, and the second baffle 430 in the middle section is fixedly connected to the baffle slider. When the transverse cylinder 440 is activated, it can drive the baffle slider to slide along the X direction, thereby driving the second baffle 430 of the corresponding section to slide along the X direction, forming an avoidance, so that under the drive of the X-direction driving mechanism 520, the substrate 700 can be moved within a preset range along the X direction with the substrate carrier 510.

[0087] For further reference, Figure 3 and Figure 4 The substrate moving assembly 500 is disposed at the bottom of the conveying channel and is arranged corresponding to the movable second baffle 430. In the substrate moving assembly 500, the X-axis drive mechanism 520 includes a substrate driving motor 521, a fourth slide rail 522, and a fourth slider 523. The substrate driving motor 521 is a linear motor and is disposed on the fixed plate 530. The two fourth slide rails 522 extend along the length direction of the fixed plate 530, that is, the X-axis, and the two fourth slide rails 522 are spaced apart and arranged in parallel. Each fourth slide rail 522 is provided with a fourth slider 523, and the fourth slider 523 is fixedly connected to the substrate carrier 510. When the substrate driving motor 521 is started, it can drive the fourth slider 523 to slide repeatedly in the X-axis, and the substrate carrier 510 is moved repeatedly in the X-axis accordingly. Here, a plurality of empty substrate 700 positions are provided on the substrate carrier 510 for adsorbing the substrates 700. During the die bonding process, the movement of the substrate carrier 510 carrying the substrate 700 in the X-axis direction replaces the movement of the die bond assembly 200 in the X-axis direction.

[0088] The Z-direction drive mechanism 540 includes an upper inclined block 541, a lower inclined block 542 and a transverse drive assembly; wherein the transverse drive assembly includes a fourth mounting plate 544, a transverse drive motor 545, a lead screw 546, a fifth slide rail 547 and a fifth slider 548, and the fourth mounting plate 544 is fixedly connected to the platform 900; the transverse drive motor 545 adopts a linear motor, which is mounted on the fourth mounting plate 544 and is connected to the lower inclined block 542 through a lead screw 546; the two fifth slide rails 547 are arranged at intervals and in parallel, and extend along the length direction of the fourth mounting plate 544, that is, the Y direction, and each fifth slide rail 547 is provided with a fifth slider 548, and the fifth slider 548 is fixed to the bottom of the lower inclined block 542; a roller slide rail 543 is provided between the lower inclined block 542 and the upper inclined block 541, which plays a role in reducing the friction between the two when sliding relative to each other; the upper inclined block 541 is fixed to the bottom of the fixed plate 530.

[0089] refer to Figure 3 When the traverse drive motor 545 is activated, the lead screw 546 drives the lower inclined block 542 to slide in the Y direction. At this time, the upper inclined block 541, driven by the lower inclined block 542, rises and falls in the Z direction, thereby driving the substrate carrier 510 to rise and fall synchronously. It should be noted that a guide mechanism is provided between the fixed plate 530 and the fourth mounting plate 544. The guide mechanism includes a limit sleeve and a limit block. The limit sleeve is mounted on the limit block and can slide relative to each other. One of the limit sleeve and the limit block is fixed to the fixed plate 530, and the other is fixed to the fourth mounting plate 544. When the upper inclined block 541 is raised or lowered, the limit sleeve and the limit block slide relative to each other, thereby providing a guide and ensuring the stability of the upper inclined block 541 during its raising and lowering.

[0090] For further reference, Figures 5 to 9 The loading assembly 100 also includes a support plate 120, a first mounting plate 130, a third drive mechanism 140, a material picking mechanism 150 and a fourth drive mechanism; the first mounting plate 130 is slidably matched with the support plate 120; the third drive mechanism 140 is transmission-connected to the first mounting plate 130 for driving the first mounting plate 130 to move horizontally; the material picking mechanism 150 is arranged on the first mounting plate 130 and has two states of locking and unlocking; the fourth drive mechanism is transmission-connected to the material picking mechanism 150 and is configured to drive the material picking mechanism 150 to switch between the two states of locking and unlocking under the loading condition, so as to correspondingly lock or loosen the wafer carrier 110.

[0091] Continue to refer Figures 5 to 9The support plate 120 is integrally formed from a base plate and two surrounding panels, which are symmetrically arranged on the base plate along its length. The third drive mechanism 140 includes a retrieving drive motor 141, a third slide rail 142, and a third slider 143. The retrieving drive motor 141 can be a linear motor and is arranged on the base plate. The third slide rail 142 is fixed to the base plate along its length. The third slider 143 slides in conjunction with the third slide rail 142 and is fixedly connected to the bottom of the first mounting plate 130. When the retrieving drive motor 141 is activated, it drives the third slider 143 to slide along the X-direction, and the first mounting plate 130 moves synchronously along the X-direction accordingly. The loading assembly 100 also includes a fifth drive mechanism 160, which is transmission-connected to the support plate 120 and is used to drive the support plate 120 to move along the Z-direction. Here, the fifth drive mechanism 160 can be a cylinder. When the cylinder is activated, the support plate 120 is raised and lowered.

[0092] The wafer carrier 110 is arranged in the material box 800, and the material picking mechanism 150 is arranged on the first mounting plate 130. When the material picking drive motor 141 is started, the material picking mechanism 150 can move to the material box 800 along the X direction, and under the drive of the fourth drive mechanism, lock the wafer carrier 110, and then under the drive of the material picking drive motor 141, the wafer carrier 110 containing the wafer can be driven along the X direction away from the material box 800 to a preset position. Subsequently, the wafer carrier 110 can be raised to a preset height along the Z direction under the drive of the support plate 120, and the material picking mechanism 150 is driven by the fourth drive mechanism to switch from a locked state to an unlocked state. At this time, the wafer carrier 110 can be clamped by the crystal bonding assembly 200 and moved to the crystal pricking station.

[0093] For further reference, Figures 7 to 9The wafer carrier 110 is provided with two locking hooks 111 distributed at intervals, and the openings of the two locking hooks 111 are arranged back to back; the material picking mechanism 150 includes a first connecting rod 151 and two second connecting rods 152; one end of a second connecting rod 152 is provided with a first fastening body 153 adapted to one of the locking hooks 111, and the other end is hinged to one end of the first connecting rod 151 through a first hinge pin 154, and a second connecting rod 152 is also hinged to the first mounting plate 130 through a second hinge pin 155, and the second hinge pin 155 is between the first hinge pin 154 and the first fastening body 153; one end of the other second connecting rod 152 is hinged to the first mounting plate 130 through a third hinge pin 156, and the other end is provided with a second fastening body 157 adapted to the other locking hook 111, and the second fastening body 157 and the first fastening body 153 are at the third hinge pin 156. On the same side of a connecting rod 151, another second connecting rod 152 is also hinged to the other end of the first connecting rod 151 through a fourth hinge pin 158, and the fourth hinge pin 158 is located between the third hinge pin 156 and the second fastening body 157; the fourth driving mechanism includes a reset assembly 170 and a rotation drive assembly 180; the reset assembly 170 is used to connect with one of the second connecting rods 152, so that the second connecting rod 152 has a tendency to rotate around the hinge axis between it and the first mounting plate 130 toward the locking hook 111; two groups of rotation drive assemblies 180 are distributed at intervals along the sliding path of the first mounting plate 130, and are used to be connected to one of the second connecting rods 152 for transmission, and are configured so that under the loading condition, any group of rotation drive assemblies 180 drives the second connecting rod 152 to rotate around the hinge axis between it and the first mounting plate 130 away from the locking hook 111.

[0094] Continue to refer Figures 7 to 9 The rotary drive assembly 180 includes a rotary cylinder 181 and a dislodging block 182. The rotary cylinder 181 is in transmission connection with the dislodging block 182 to drive the dislodging block 182 to rotate. A push rod 159 is fixed to the left second connecting rod 152. The push rod 159 is located between the first fastener 153 and the second hinge pin 155. The lower end of the push rod 159 has an interference fit with a bearing. A buffer block 190 is fixed to the first mounting plate 130. When the second connecting rod 152 is in the initial position, the buffer block 190 abuts against the second connecting rod 152, providing a collision-proof and buffering effect for the second connecting rod 152. The reset assembly 170 includes a spring 171 and a support 172. The support 172 is fixed to the right second connecting rod 152 and located between the second fastener 157 and the fourth hinge pin 158. One end of the spring 171 is fixed to a groove on the side of the first mounting plate 130, and the other end is connected to the support 172. Both the first fastening body 153 and the second fastening body 157 can adopt a fixing pin shaft, and the fixing pin shaft can hook the locking hook 111 .

[0095] Specifically, refer to Figure 5 and Figure 6When the first mounting plate 130 moves to the material taking position, the rotating cylinder 181 arranged near the material box 800 drives the prying block 182 to rotate. Relative to the first mounting plate 130, the prying block 182 presses against the bearing and rotates toward the outside. At this time, the second connecting rod 152 above rotates clockwise around the second hinge pin 155, and drives the upper end of the first connecting rod 151 to swing to the lower left through the first hinge pin 154. In this way, the second connecting rod 152 at the bottom will rotate counterclockwise around the third hinge pin 156 under the drive of the first connecting rod 151, and the two second connecting rods 152 are opened, that is, in an unlocked state, and the spring 171 is stretched at this time. When the rotating cylinder 181 rotates a certain angle, the material-taking drive motor 141 drives the first mounting plate 130 to move a set distance toward the material box 800. At this time, the rotating cylinder 181 drives the prying block 182 to rotate in the opposite direction to the initial position of the prying block 182. Then, under the action of the restoring force of the spring 171, the upper second connecting rod 152 rotates counterclockwise around the second hinge pin 155, and the lower second connecting rod 152 rotates clockwise around the third hinge pin 156. The first fastener 153 and the second fastener 157 respectively hook the corresponding locking hooks 111 to lock the wafer carrier 110.

[0096] When the material retrieving drive motor 141 drives the first mounting plate 130 along the X-axis, the fastener hooks onto the wafer carrier 110 and moves together to the loading and grabbing position. When the die bond assembly 200 moves to the loading and grabbing position to clamp the wafer carrier 110, the rotary cylinder 181, located away from the magazine 800, drives the corresponding opening block 182 to rotate. The opening block 182 presses against the bearing and opens outward. Similarly, the two second connecting rods 152 rotate outward and open, and the fastener disengages the locking hook 111. At this time, the die bond assembly 200 can grab the wafer carrier 110.

[0097] For further reference, Figure 1 、 Figure 2 and Figure 10 The X-axis beam assembly 600 includes an X-axis beam 610, a sixth slide rail 620, a sixth slider 630, and a fifth mounting plate 640; the two X-axis beams 610 are symmetrically arranged on the platform 900, and the two sixth slide rails 620 are spaced apart along the inner width direction of the X-axis beam 610; multiple sixth sliders 630 are arranged on the X-axis beam 610, and the sixth sliders 630 on each X-axis beam 610 are distributed along the X direction and slide in correspondence with the sixth slide rail 620; the fifth mounting plate 640 corresponds to the sixth slider 630 one by one, and the two are fixedly connected. In addition, a linear motor is also provided on the X-axis beam 610, and the linear motor is transmission-connected to the fifth mounting plate 640, which can drive the fifth mounting plate 640 to slide along the length direction of the X-axis beam 610, that is, the X direction. Reference Figure 1 and Figure 2The crystal fixing assembly 200 includes a crystal fixing beam 210, which is connected between the two X-axis beams 610, and its two ends are fixedly connected to the fifth mounting plate 640 respectively. In this way, the crystal fixing assembly 200 can move along the X direction under the drive of the linear motor; the thorn crystal assembly 300 includes a thorn crystal beam 310, which is also connected between the two X-axis beams 610, and its two ends are fixedly connected to the corresponding fifth mounting plate 640 respectively. In this way, the thorn crystal assembly 300 can move along the X direction under the drive of the corresponding linear motor.

[0098] Continue to refer Figure 1 、 Figure 2 and Figure 10 The crystal bonding assembly 200 also includes a second mounting plate 220, a sixth driving mechanism, a clamping module 230 and a seventh driving mechanism 240; the second mounting plate 220 is slidably connected to the crystal bonding beam 210; the sixth driving mechanism is transmission-connected to the second mounting plate 220, and is used to drive the second mounting plate 220 to slide along the Y direction; the clamping module 230 is arranged on the second mounting plate 220 and is rotatably matched with the second mounting plate 220; the seventh driving mechanism 240 is transmission-connected to the clamping module 230, and is used to drive the clamping module 230 to rotate around its own axis extending along the Z direction.

[0099] Specifically, refer to Figure 1 、 Figure 2 and Figure 10 The sixth driving mechanism includes a first slide rail 250, a first slider 260 and a crystal-bonding linear motor; along the inner width direction of the crystal-bonding beam 210, the two first slide rails 250 are arranged at intervals, the first slider 260 slides with the first slide rail 250, and the second mounting plate 220 is L-shaped as a whole, and its vertical part is fixedly connected to the first slider 260. The crystal-bonding linear motor is arranged in the crystal-bonding beam 210 and is transmission-connected to the second mounting plate 220, which can drive the second mounting plate 220 to slide along the length direction of the crystal-bonding beam 210, that is, the Y direction. The clamping module 230 and the seventh driving mechanism 240 are both arranged on the horizontal part of the second mounting plate 220. The seventh driving mechanism 240 includes a belt 241, a rotation adjustment motor 242, a synchronous wheel 243 and an idler wheel 244, wherein the output end of the rotation adjustment motor 242 is connected to the synchronous wheel 243, the idler wheel 244 is spaced apart from the synchronous wheel 243, and the belt 241 is tightened around the synchronous wheel 243, the idler wheel 244 and the clamping module 230; when the rotation adjustment motor 242 is started, it drives the synchronous wheel 243, the belt 241, the idler wheel 244 and the clamping module 230 to rotate, thereby adjusting the angle in real time, so that the core particles can be transferred to the empty substrate 700 in the correct direction and angle.

[0100] For further reference, Figure 1 and Figure 2The thorn crystal assembly 300 also includes a third mounting plate 320, a camera module 330, a thorn crystal module 340 and an eighth driving mechanism; the third mounting plate 320 is slidingly connected to the thorn crystal beam 310; the camera module 330 is arranged on the third mounting plate 320; the thorn crystal module 340 is slidingly connected to the third mounting plate 320 and can slide along the Z direction; the eighth driving mechanism is transmission-connected to the third mounting plate 320, and is used to drive the third mounting plate 320 to slide along the Y direction.

[0101] Continue to refer Figure 1 and Figure 2 The eighth drive mechanism includes a second rail 350, a second slider 360, and a spike linear motor. Two second rails 350 are spaced apart along the inner width of the spike beam 310. The second slider 360 slidably engages with the second rails 350. The third mounting plate 320 is fixedly connected to the second slider 360. The spike linear motor is disposed within the spike beam 310 and is in transmission connection with the third mounting plate 320, driving the third mounting plate 320 to slide along the length of the spike beam 310, i.e., in the Y direction. The spike module 340, mounted on the third mounting plate 320, has a sliding path extending along the Z direction. Based on the image captured by the camera module 330, the spike module 340 can move in the Z direction to transfer the die from the wafer held by the die bond assembly 200 to the empty substrate 700.

[0102] The working process of the spike crystal mass transfer device provided in this embodiment is as follows:

[0103] S100: The loading assembly 100 loads the wafer carrier 110 to the material picking position, the substrate feeding assembly 400 loads the empty substrate 700 onto the substrate moving assembly 500, the transverse drive motor 545 drives the substrate carrier 510 to rise and adsorb the empty substrate 700, the transverse cylinder 440 retracts, driving the second baffle 430 to move, leaving space for the substrate moving assembly 500 to move.

[0104] S200: The die bonding assembly 200 moves to the material taking position of the loading assembly 100 via the gantry X-axis and Y-axis to grab the wafer carrier 110, and then moves to the wafer pricking working position.

[0105] S300: The thorn crystal assembly 300 moves to the thorn crystal working position in the X and Y directions through the gantry.

[0106] S400:

[0107] S410: The wafer held by the clamping module 230 in the die bond assembly 200 is moved in the Y direction via the first slide rail 250, while the X-axis gantry remains stationary. The substrate drive motor 521 drives the empty substrate 700 on the substrate carrier 510 to move in the X direction, replacing the X-axis movement in the die bond assembly 200.

[0108] S420: The camera module 330 on the stinging assembly 300 takes pictures of the mark points on the wafer, and the wafer on the clamping module 230 is rotated to a suitable position by the rotating adjustment motor 242; the camera module 330 records the position of each core particle on the wafer by scanning and taking pictures, and the rotating adjustment motor 242 adjusts the position and posture of each core particle during the stinging operation; the stinging module 340 moves to the crystal position in the X and Y directions through the gantry, and the stinging module 340 stings the crystal up and down along the Z direction.

[0109] S500: After the crystal is pierced, the transverse cylinder 440 extends to drive the second baffle 430 to move; the transverse drive motor 545 retracts to drive the substrate carrier 510 to descend, stop adsorbing the substrate 700, and transport the transplanted substrate 700 away through the conveyor belt 410.

[0110] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A thorn crystal mass transfer device, characterized in that: include: A loading assembly (100), a crystal fixing assembly (200), a crystal pricking assembly (300), a substrate feeding assembly (400), a substrate moving assembly (500) and an X-axis beam assembly (600); The loading assembly (100) is used for loading wafers and includes a wafer carrier (110) for loading wafers; The die-bonding assembly (200) is used to clamp the wafer carrier (110); The thorn crystal assembly (300) is used to transfer the core particles on the wafer to the substrate (700); The substrate feeding assembly (400) is used to transport the substrate (700); The substrate moving assembly (500) is arranged at the substrate feeding assembly (400), and comprises a substrate carrier (510) and an X-direction driving mechanism (520); the substrate carrier (510) is used to adsorb the transport substrate of the substrate feeding assembly (400); the X-direction driving mechanism (520) is connected to the substrate carrier (510) in a transmission manner, and is used to drive the substrate carrier (510) to move along the X-direction; The X-axis crossbeam assembly (600) is in transmission connection with the crystal bonding assembly (200) to drive the crystal bonding assembly (200) to move to the loading assembly (100) and the substrate carrier (510), and is also in transmission connection with the thorn crystal assembly (300) to drive the thorn crystal assembly (300) to move to the substrate carrier (510); The loading assembly (100) further includes a support plate (120), a first mounting plate (130), a third driving mechanism (140), a material taking mechanism (150), and a fourth driving mechanism; The first mounting plate (130) is slidably engaged with the support plate (120); The third driving mechanism (140) is in transmission connection with the first mounting plate (130) and is used to drive the first mounting plate (130) to move horizontally; The material taking mechanism (150) is arranged on the first mounting plate (130) and has two states: locked and unlocked; The fourth driving mechanism is in transmission connection with the material taking mechanism (150), and is configured to drive the material taking mechanism (150) to switch between two states, locked and unlocked, in a loading state, so as to correspondingly lock or loosen the wafer carrier (110); The wafer carrier (110) is provided with two locking hooks (111) that are spaced apart, and the openings of the two locking hooks (111) are arranged opposite to each other; The material taking mechanism (150) comprises a first connecting rod (151) and two second connecting rods (152); One end of one of the second connecting rods (152) is provided with a first fastening body (153) adapted to one of the locking hooks (111), and the other end is hinged to one end of the first connecting rod (151) via a first hinge pin (154). One of the second connecting rods (152) is also hinged to the first mounting plate (130) via a second hinge pin (155), and the second hinge pin (155) is located between the first hinge pin (154) and the first fastening body (153); One end of the other second connecting rod (152) is hinged to the first mounting plate (130) through a third hinge pin (156), and the other end is provided with a second fastening body (157) adapted to the other locking hook (111), and the second fastening body (157) and the first fastening body (153) are located on the same side of the first connecting rod (151), and the other second connecting rod (152) is further hinged to the other end of the first connecting rod (151) through a fourth hinge pin (158), and the fourth hinge pin (158) is located between the third hinge pin (156) and the second fastening body (157); The fourth driving mechanism includes a reset assembly (170) and a rotation driving assembly (180); The reset assembly (170) is used to connect to one of the second connecting rods (152), so that the second connecting rod (152) has a tendency to rotate around the hinge axis between the second connecting rod and the first mounting plate (130) toward the locking hook (111); The two groups of the rotary drive assemblies (180) are spaced apart along the sliding path of the first mounting plate (130), and are used for transmission connection with one of the second connecting rods (152), and are configured so that under the loading condition, any one group of the rotary drive assemblies (180) drives the second connecting rod (152) to rotate around the hinge axis between the second connecting rod and the first mounting plate (130) away from the locking hook (111).

2. The spike crystal mass transfer device according to claim 1, characterized in that: The substrate feeding assembly (400) comprises a conveyor belt (410) and a first driving mechanism; The two conveyor belts (410) are spaced apart and distributed in parallel, and extend along the Y direction; The first driving mechanism is in transmission connection with the conveyor belt (410) to drive the conveyor belt (410) to move along the Y direction.

3. The spike crystal mass transfer device according to claim 2, characterized in that: The substrate feeding assembly (400) further includes a first baffle (420), a second baffle (430) and a second driving mechanism; The first baffle (420) and the second baffle (430) both extend along the Y direction and are respectively arranged on both sides of the two conveyor belts (410) to form a conveying channel; The second driving mechanism is in transmission connection with the second baffle (430) to drive the second baffle (430) to move away from or toward the conveyor belt (410) along the X direction.

4. The spike crystal mass transfer device according to claim 2, characterized in that: The substrate moving assembly (500) further includes a fixed plate (530) and a Z-direction driving mechanism (540); The X-direction driving mechanism (520) is arranged on the fixing plate (530); The Z-direction driving mechanism (540) is in transmission connection with the fixed plate (530) and is used to drive the fixed plate (530) to move along the Z-direction.

5. The spike crystal mass transfer device according to claim 4, characterized in that: The Z-direction driving mechanism (540) comprises an upper inclined block (541), a lower inclined block (542) and a transverse driving assembly; The fixing plate (530) is fixed to the top surface of the upper inclined block (541); The bottom surface of the upper inclined block (541) is a first inclined surface; The surface of the lower inclined block (542) opposite to the first inclined surface is a second inclined surface, and the second inclined surface is adapted to the first inclined surface; The transverse driving assembly is in transmission connection with the lower inclined block (542) and is used for driving the lower inclined block (542) to move horizontally.

6. The spike crystal mass transfer device according to claim 1, characterized in that: The loading assembly (100) further includes a fifth driving mechanism (160); The fifth driving mechanism (160) is in transmission connection with the support plate (120) and is used to drive the support plate (120) to move along the Z direction.

7. The spike crystal mass transfer device according to claim 1, characterized in that: The crystal bonding assembly (200) comprises a crystal bonding beam (210), a second mounting plate (220), a sixth driving mechanism, a clamping module (230) and a seventh driving mechanism (240); The X-axis beam assembly (600) is in transmission connection with the crystal-fixing beam (210) and is used to drive the crystal-fixing beam (210) to move along the X direction; The second mounting plate (220) is slidably connected to the crystal-fixing beam (210); The sixth driving mechanism is in transmission connection with the second mounting plate (220) and is used for driving the second mounting plate (220) to slide along the Y direction; The clamping module (230) is arranged on the second mounting plate (220) and is rotatably engaged with the second mounting plate (220); The seventh driving mechanism (240) is in transmission connection with the clamping module (230) and is used to drive the clamping module (230) to rotate around its own axis extending in the Z direction.

8. The spike crystal mass transfer device according to claim 1, characterized in that: The thorn crystal assembly (300) comprises a thorn crystal beam (310), a third mounting plate (320), a camera module (330), a thorn crystal module (340) and an eighth driving mechanism; The X-axis crossbeam assembly (600) is in transmission connection with the thorn crystal crossbeam (310) and is used to drive the thorn crystal crossbeam (310) to move along the X direction; The third mounting plate (320) is slidably connected to the spike crystal beam (310); The camera module (330) is arranged on the third mounting plate (320); The thorn crystal module (340) is slidably connected to the third mounting plate (320) and can slide along the Z direction; The eighth driving mechanism is in transmission connection with the third mounting plate (320) and is used for driving the third mounting plate (320) to slide along the Y direction.

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