A method and system for connecting a traveling wave tube heat sink

Abstract

The application belongs to the technical field of processing traveling wave tubes, and specifically provides a connecting method and system for a traveling wave tube radiator, which comprises the following steps: sleeving a radiation radiator on the outside of a collector, forming an annular gap between the inner ring surface of the radiation radiator and the outer ring surface of the collector; sleeving an annular sealing element on the outer ring surface of the collector away from one end of the body of the traveling wave tube, and sealing one end of the annular gap; arranging a notch on the inner ring surface of the radiation radiator close to one end of the body of the traveling wave tube, and installing a solder ring at the notch; prepositioning the radiation radiator and the collector through a mold; placing the combined structure of the radiation radiator and the collector in a vacuum heating furnace for heating; melting the solder ring, and flowing and filling the solder in the molten state into the annular gap; taking out the combined structure of the radiation radiator and the collector from the vacuum heating furnace, and taking it to the solder solidification; and removing the mold from the radiation radiator and the collector.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of traveling wave tube processing, and particularly provides a connecting method and system for a traveling wave tube radiator. BACKGROUND

[0002] A traveling wave tube is a kind of microwave vacuum device, which has the characteristics of high frequency, wide frequency band and large power. The space traveling wave tube is widely used in satellite payload systems and plays a role in microwave final amplification. Since the high-power space traveling wave tube has a large heat power, it will cause great pressure on the temperature control system of the entire satellite. Therefore, the high-power space traveling wave tube generally adopts radiation heat dissipation, and the collector pole with the most serious heat is placed outside the satellite warehouse, and the heat is radiated to space by the radiation radiator on the collector pole. When the radiation radiator on the collector pole faces the sun, the environmental temperature of the radiation radiator is as high as +105℃, and the surface temperature of the radiator is above 200℃.

[0003] In the related technical solution, the collector pole is inserted into the inner hole of the radiation radiator, and then the positioning of the two is realized by spot welding. The outer ring surface diameter of the collector pole is equal to the inner ring surface diameter of the inner hole of the radiation radiator, and then the outer ring surface of the collector pole is attached to the inner ring surface of the radiation radiator to transfer heat.

[0004] The inventor understands that after the collector pole and the radiation radiator are positioned by spot welding, because the materials of the radiation radiator and the collector pole are different, the change sizes of the two in thermal expansion and cold contraction are different, and then a gap is easily generated between the outer ring surface of the collector pole and the inner ring surface of the radiation radiator, which cannot be in close contact. Finally, the heat dissipation efficiency of the collector pole is affected. SUMMARY

[0005] The purpose of the present application is to provide a connecting method and system for a traveling wave tube radiator to at least solve one of the above technical problems.

[0006] One or more embodiments of the present application provide a connecting method for a traveling wave tube radiator, comprising the following steps:

[0007] The radiation radiator is sleeved on the outside of the collector pole, and an annular gap is formed between the inner ring surface of the radiation radiator and the outer ring surface of the collector pole.

[0008] An annular sealing member is sleeved on the outer ring surface of the collector pole away from one end of the traveling wave tube body, and the sealing member seals one end of the annular gap. A notch is arranged on the inner ring surface of the radiation radiator close to one end of the traveling wave tube body, and a solder ring is arranged at the notch.

[0009] The radiation radiator and the collector pole are pre-positioned by a mold.

[0010] The combined structure of the radiation radiator and the collector pole is placed in a vacuum heating furnace for heating, the solder ring is melted, and the molten solder flows into and fills the annular gap.

[0011] The combination structure of the radiation heat sink and the collector is taken out from the vacuum heating furnace, and is taken to the solder solidification;

[0012] The mold is removed from the radiation heat sink and the collector.

[0013] Further, the notch is a tapered notch, and the end of the tapered notch with a smaller diameter is towards the center of the radiation heat sink, and the end of the tapered notch with a larger diameter is towards the outside of the radiation heat sink.

[0014] Further, the sealing member is a flexible sealing ring, and the inner wall surface of the radiation heat sink is provided with an annular groove, and the sealing ring is installed at the annular groove.

[0015] Further, before the collector is assembled to the radiation heat sink, solder paste is coated at the outer annular surface of the collector.

[0016] Further, before the collector is assembled to the radiation heat sink, nickel is plated at the inner annular surface of the radiation heat sink.

[0017] Further, when the radiation heat sink and the collector are pre-positioned by the mold, the radiation heat sink and the collector are kept coaxial.

[0018] Further, after the combination structure of the radiation heat sink and the collector is placed into the vacuum heating furnace, the end of the radiation heat sink towards the body of the traveling wave tube is inclined upwards and positioned.

[0019] One or more embodiments of the present application also provide a soldering system for a traveling wave tube heat sink, comprising a mold, a vacuum heating furnace and a controller, the mold is used to realize the pre-positioning of the radiation heat sink and the collector after assembly, the mold can make the radiation heat sink and the collector coaxial; the vacuum heating furnace can realize the heating of the solder ring; the controller can control the heating of the vacuum heating furnace.

[0020] Further, the mold comprises a support frame, the support frame has a support space, the support space can accommodate a slow wave section unit, the slow wave section unit is fixed coaxially with the collector, the support frame has a first positioning member, the first positioning member can support and realize the limiting of the slow wave section unit in the axial direction;

[0021] The support frame has a second positioning member, the second positioning member can be in contact with and positioned at the end surface of the radiation heat sink; the support frame has a third positioning member, the third positioning member can be in contact with and positioned at the energy output window, and the energy output window is fixed at the outside surface of the slow wave section unit close to the collector

[0022] The beneficial effects of one or more of the above technical solutions are:

[0023] The inner ring surface of the radiation heat sink and the outer ring surface of the collecting electrode form an annular gap, and then a solder ring is arranged at the end of the radiation heat sink, the solder of the solder ring flows into the annular weld in a molten state through heating, and then an annular weld layer is formed after the solder is cooled, and the inner ring surface of the radiation heat sink, the outer ring surface of the collecting electrode and the annular weld layer are fixed to form a whole. In the case that the radiation heat sink and the collecting electrode have different thermal expansion and contraction sizes, the effective heat dissipation of the collecting electrode to the radiation heat sink can still be ensured. BRIEF DESCRIPTION OF DRAWINGS

[0024] Some embodiments of the present application will be described below with reference to the accompanying drawings, in which:

[0025] Figure 1 is a schematic diagram of the mold positioning the collecting electrode and the radiation heat sink and the like structure in the embodiment of the present application.

[0026] Figure 2 is a schematic diagram of the collecting electrode fixed to the radiation heat sink in the embodiment of the present application;

[0027] Figure 3 is a schematic diagram of the collecting electrode connected to the slow wave section unit and the energy output window in the embodiment of the present application;

[0028] Figure 4 is a schematic diagram of the structure of the mold in the embodiment of the present application;

[0029] Figure 5 is a schematic diagram of the cross section of the mold positioning the collecting electrode and the radiation heat sink and the like structure in the embodiment of the present application

[0030] Figure 6 is a schematic diagram of the structure of the mold positioning the collecting electrode and the radiation heat sink and the like structure in the embodiment of the present application Figure 5 is an enlarged schematic diagram of the structure of part A in

[0031] Figure 7 is an enlarged schematic diagram of the structure of part B in Figure 5

[0032] 1, mold; 2, slow wave section unit; 3, radiation heat sink; 4, energy output window; 5, collecting electrode; 101, support frame; 102, positioning end plate; 103, cover plate; 104, positioning protrusion; 301, tapered port; 302, sealing ring. DETAILED DESCRIPTION

[0033] Those skilled in the art should understand that the embodiments described below are only preferred embodiments of the present application, which are only used to explain the technical principles of the present application, and are not used to limit the protection scope of the present application.

[0034] ​It should be noted that in the description of this application, terms such as "center," "upper," "lower," "top," "bottom," "vertical," "horizontal," "inner," and "outer," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0035] Furthermore, it should be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can also refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0036] like Figures 1-7 As shown, a typical embodiment of this application provides a connection method for a traveling wave tube heat sink, including the following steps:

[0037] The radiant heat sink 3 is fitted over the outside of the collecting electrode 5, and an annular gap is formed between the inner annular surface of the radiant heat sink 3 and the outer annular surface of the collecting electrode 5. An annular seal is fitted over the outer annular surface of the collecting electrode 5 at the end away from the traveling wave tube body, and the seal blocks one end of the annular gap. A groove is provided on the inner annular surface of the radiant heat sink 3 at the end near the traveling wave tube body, and a solder ring is installed at the groove.

[0038] The radiant radiator 3 and the collecting electrode 5 are pre-positioned using the mold 1; the combined structure of the radiant radiator 3 and the collecting electrode 5 is placed in a vacuum heating furnace for heating; the solder ring melts, and the molten solder flows in and fills the annular gap.

[0039] Remove the combined structure of the radiant radiator 3 and the collecting electrode 5 from the vacuum heating furnace and allow it to solidify with solder; remove the mold 1 from the radiant radiator 3 and the collecting electrode 5.

[0040] It should be noted that if the slot is used to place the solder ring, the shape of the solder ring should be consistent with the shape of the slot so that the solder ring can be nested in the slot position, making full use of the space reserved in the slot by the radiant heat sink.

[0041] As one specific structural form, the slot is a conical opening 301, with the smaller diameter end of the conical opening 301 facing the center of the radiant heat sink 3, and the larger diameter end of the conical opening 301 facing the outside of the radiant heat sink 3.

[0042] It is known that the seal is used to block the end of the annular gap away from the traveling wave tube body. When the annular gap at this position is blocked by the seal, the molten solder flowing in from the slot will also be blocked and limited by the seal, so that an annular weld layer can be formed after the solder cools down.

[0043] A preferred structural form of the seal here is a flexible sealing ring 302. The inner wall surface of the radiant heat sink 3 is provided with an annular groove, and the sealing ring 302 is installed in the annular groove.

[0044] from Figure 7 As can be clearly seen, after the sealing ring 302 is installed in the annular groove, the inner diameter of the sealing ring is smaller than the diameter of the inner annular surface of the radiant heat sink. During the process of inserting the collecting electrode into the inner hole of the radiant heat sink, the sealing ring is compressed and presses against the bottom surface of the annular groove and the outer annular surface of the collecting electrode, thereby achieving sealing.

[0045] In this embodiment, before assembling the collecting electrode 5 to the radiating heat sink 3, solder paste is applied to the outer ring surface of the collecting electrode 5.

[0046] In this embodiment, before the collecting electrode 5 is assembled to the radiating heat sink 3, nickel is plated on the inner ring surface of the radiating heat sink 3.

[0047] In this embodiment, when the radiating heat sink 3 and the collecting electrode 5 are pre-positioned through the mold 1, the radiating heat sink 3 and the collecting electrode 5 remain coaxial.

[0048] In this embodiment, after the combined structure of the radiating heat sink 3 and the collecting electrode 5 is placed into the vacuum heating furnace, the radiating heat sink 3 is tilted upwards and positioned towards the traveling wave tube body.

[0049] This embodiment also provides a welding system for a traveling wave tube heat sink, including a mold 1, a controller, and a vacuum heating furnace. The mold 1 is used to achieve pre-positioning of the radiant heat sink 3 and the collecting electrode 5 after assembly. The mold 1 enables the radiant heat sink 3 and the collecting electrode 5 to be coaxial. The vacuum heating furnace enables the heating of the solder ring. The controller controls the heating of the vacuum heating furnace.

[0050] As a specific structural form of the mold, in this embodiment, the mold 1 includes a support frame 101. The support frame 101 has a support space capable of accommodating the slow-band unit 2. The slow-band unit 2 is coaxially fixed with the collecting electrode 5. The support frame 101 has a first positioning member, which can support and limit the slow-band unit 2 along the axial direction. The first positioning member here can be... Figure 4 Positioning protrusion 104 in the middle.

[0051] The support frame 101 has a second positioning element, which can contact and position itself against the end face of the radiant heat sink 3. Specifically, the second positioning element can be two positioning end plates 102 on the end face of the support frame. The two positioning end plates can fit against the end face of the radiant heat sink, and the positioning end plates can be fixed to the radiant heat sink by bolts and screw holes.

[0052] The support frame 101 has a third positioning element that can contact and position the energy output window 4, which is fixed to the outer side of the slow-band unit 2 near the collector 5. Specifically, the third positioning element can be a cover plate, which is fixed to the energy output window.

[0053] The technical solutions of this application have been described in conjunction with the preferred embodiments above. However, it will be readily understood by those skilled in the art that the scope of protection of this application is not limited to the above preferred embodiments. Without departing from the technical principles of this application, those skilled in the art can disassemble and combine the technical solutions in the above preferred embodiments, and can also make equivalent changes or substitutions to the relevant technical features. Any changes, equivalent substitutions, improvements, etc., made within the technical concept and / or technical principles of this application will fall within the scope of protection of this application.

Claims

1. A method of connecting a heat sink to a traveling wave tube, characterized by, The method comprises the following steps: a radiation heat sink is sleeved outside the collector, and an annular gap is formed between the inner annular surface of the radiation heat sink and the outer annular surface of the collector; an annular sealing member is sleeved at the outer annular surface of the collector away from one end of the body of the traveling wave tube, and the sealing member seals one end of the annular gap; a notch is arranged at the inner annular surface of the radiation heat sink close to one end of the body of the traveling wave tube, and a solder ring is arranged at the notch; the radiation heat sink and the collector are pre-positioned by a mold; the combined structure of the radiation heat sink and the collector is placed in a vacuum heating furnace for heating; the solder ring is melted, and the molten solder flows into and fills the annular gap; the combined structure of the radiation heat sink and the collector is taken out of the vacuum heating furnace and cooled to solidify the solder; the mold is removed from the radiation heat sink and the collector; the notch is a tapered notch, the smaller-diameter end of the tapered notch is directed to the center of the radiation heat sink, and the larger-diameter end of the tapered notch is directed to the outside of the radiation heat sink; after the combined structure of the radiation heat sink and the collector is placed in the vacuum heating furnace, the one end of the radiation heat sink directed to the body of the traveling wave tube is tilted upward and positioned; tin paste is coated on the outer annular surface of the collector before the collector is assembled to the radiation heat sink; and the inner annular surface of the radiation heat sink is plated with nickel before the collector is assembled to the radiation heat sink.

2. The method of claim 1, wherein The sealing member is a flexible sealing ring, the inner wall surface of the radiation heat sink is provided with an annular groove, and the sealing ring is arranged at the annular groove.

3. The method of claim 1, wherein When the radiation heat sink and the collector are pre-positioned by the mold, the radiation heat sink and the collector are coaxial.

4. A solder system for a traveling wave tube heat sink, characterized by, The method comprises: a mold for realizing the pre-positioning of the assembled radiation heat sink and collector, the mold enabling the radiation heat sink and the collector to be coaxial; a vacuum heating furnace capable of heating the solder ring; a controller capable of controlling the heating of the vacuum heating furnace; the mold comprises a support frame having a support space capable of accommodating a slow-wave section unit fixed coaxially with the collector, the support frame having a first positioning member capable of supporting and limiting the slow-wave section unit in the axial direction; the support frame has a second positioning member capable of contacting and positioning the end surface of the radiation heat sink; the support frame has a third positioning member capable of contacting and positioning the energy output window fixed at the outer surface of the slow-wave section unit close to the collector.

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