Refrigeration device and refrigeration appliance

Abstract

This application discloses a refrigeration device and refrigeration equipment. The refrigeration device includes: a refrigeration component; and a conductive component spaced apart from the refrigeration component. The refrigeration component and the conductive component serve as different electrodes to form an electric field between them, within which an ion wind is generated. By forming an electric field between the conductive component and the refrigeration component, and generating and accelerating charged particles to form an ion wind after the electric field reaches a certain strength, the water molecules after frost are subjected to collisions with the ions. Due to the conservation of energy, the kinetic energy of the ions is converted into the energy of the water molecules, thereby converting the ice crystal water molecules into gaseous water molecules. The frost on the surface of the refrigeration component melts quickly, resulting in high defrosting efficiency. Furthermore, the ion wind acts directly on the frozen water molecules without any energy dissipation process, so the power consumption for defrosting is extremely low, saving energy.

Description

Technical Field

[0001] This application belongs to the field of refrigeration technology, specifically relating to refrigeration devices and refrigeration equipment. Background Technology

[0002] In refrigeration equipment, refrigeration components such as evaporators cool the surrounding air. Because water molecules have a high freezing point, frost easily condenses on the evaporator surface after cooling. Current solutions for evaporator frost formation typically involve adding a heating copper tube to the bottom of the evaporator. The copper tube is heated periodically, and the frost on the evaporator surface melts through heat conduction.

[0003] However, the copper tubes are located below the evaporator and require a long heating time to completely melt the frost on the top of the evaporator. Furthermore, the heat from the heated copper tubes is absorbed by the frost on the evaporator surface through air conduction, resulting in low energy utilization. Therefore, the overall defrosting efficiency is low when using copper tube heating. Summary of the Invention

[0004] This application provides a refrigeration device and refrigeration equipment to solve the technical problem of low defrosting efficiency of refrigeration components using copper tube heating in the prior art.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: a refrigeration device, the refrigeration device comprising: a refrigeration element; a conductive element disposed at a distance from the refrigeration element; the refrigeration element and the conductive element respectively serve as different electrodes to form an electric field between the conductive element and the refrigeration element, and an ion wind is formed in the electric field.

[0006] To solve the above-mentioned technical problems, another technical solution adopted in this application is: a refrigeration device, including the above-mentioned refrigeration device.

[0007] The beneficial effects of this application are as follows: By creating an electric field between the conductive and cooling components, and generating and accelerating charged particles to form an ion wind after the electric field reaches a certain strength, the water molecules after frost formation are subjected to collisions with the ions. Due to the conservation of energy, the kinetic energy of the ions is converted into the energy of the water molecules, thereby converting the ice crystal water molecules into gaseous water molecules. The frost on the surface of the cooling component melts quickly, resulting in high defrosting efficiency. Furthermore, the ion wind acts directly on the frozen water molecules without any energy dissipation process in between, so the power consumption for defrosting is extremely low, saving energy. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0009] Figure 1 This is a schematic diagram of the arrangement of the refrigeration components and conductive components in an embodiment of the refrigeration device of this application.

[0010] Figure 2 This is a schematic diagram of the electric field defrosting principle of an embodiment of the refrigeration device of this application;

[0011] Figure 3 This is a schematic diagram of the arrangement of the refrigeration components and conductive components in an embodiment of the refrigeration device of this application.

[0012] Figure 4 This is a schematic diagram of another arrangement of the cooling components and conductive components in one embodiment of the cooling device of this application.

[0013] Figure 5 This is a schematic diagram of another arrangement of the cooling components and conductive components in one embodiment of the cooling device of this application.

[0014] Figure 6 This is a schematic diagram of the structure of a conductive element in an embodiment of the refrigeration device of this application;

[0015] Figure 7 This is a schematic diagram of the overall structure of an embodiment of the refrigeration device of this application. Detailed Implementation

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0017] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0018] Please see Figures 1 to 7 , Figure 1 This is a schematic diagram of the arrangement of the refrigeration components and conductive components in an embodiment of the refrigeration device of this application. Figure 2 This is a schematic diagram of the electric field defrosting principle of an embodiment of the refrigeration device of this application; Figure 3 This is a schematic diagram of the arrangement of the refrigeration components and conductive components in an embodiment of the refrigeration device of this application. Figure 4This is a schematic diagram of another arrangement of the cooling components and conductive components in one embodiment of the cooling device of this application. Figure 5 This is a schematic diagram of another arrangement of the cooling components and conductive components in one embodiment of the cooling device of this application. Figure 6 This is a schematic diagram of the structure of a conductive element in an embodiment of the refrigeration device of this application; Figure 7 This is a schematic diagram of the overall structure of an embodiment of the refrigeration device of this application.

[0019] One embodiment of the present invention provides a refrigeration device 100, such as... Figure 1 As shown, the cooling device 100 includes a cooling element 110 and a conductive element 130. The conductive element 130 is spaced apart from the cooling element 110. The cooling element 110 and the conductive element 130 serve as different electrodes to form an electric field between the conductive element 130 and the cooling element 110. Thus, as... Figure 2 As shown, when an electric field of sufficient strength is formed between the conductive component 130 and the cooling component 110, the charged particles (such as electrons or ions) scattered in the air accelerate under the influence of the strong electric field, thereby gaining enough energy to cause the air molecules to dissociate into electrons and ions when they collide. These new electrons and ions then collide with other air molecules, generating new charged particles, thus producing a large number of charged particles. Charged particles with opposite charges to the electrode are attracted by the electrode charge and fly towards the electrode, neutralizing the charge on the electrode; charged particles with the same charge as the electrode are repelled and fly away from the vicinity of the electrode, carrying other molecules to form an ion wind with a certain speed. Since this ion wind is different from the wind formed by air flow, it is mainly composed of high-speed charged particles. When these high-speed charged particles hit the frost surface of the cooling component 110, the energy they carry is absorbed by the water molecules on the frost surface, thereby increasing the kinetic energy of these water molecules and accelerating their melting speed. At the same time, the deposition of these charged particles on the surface of frost also increases the thermal conductivity of the frost, enabling it to absorb heat from the surrounding environment more quickly and increasing its melting rate.

[0020] The refrigeration device 100 in this embodiment forms an electric field between the conductive component 130 and the refrigeration component 110. Once the electric field reaches a certain strength, it generates and accelerates charged particles to form an ion wind. Frost-covered water molecules are impacted by these ions. Due to energy conservation, the kinetic energy of the ions is converted into the energy of the water molecules, thus transforming the ice-crystal water molecules into gaseous water molecules. The frost on the surface of the refrigeration component 110 melts quickly, resulting in high defrosting efficiency. Furthermore, the ion wind acts directly on the frozen water molecules without any energy dissipation process, so the power consumption for defrosting is extremely low, saving energy.

[0021] The ion wind generated by the electric field can prevent water molecules from condensing into frost on the surface of the refrigeration component 110, thus slowing down the frost formation rate; it can also accelerate the defrosting speed of the already frosted surface of the refrigeration component 110, thereby improving the overall defrosting efficiency.

[0022] The conductive component 130 includes a conductive plate, which is arranged in parallel with the cooling component 110. An electric field is formed between the parallel conductive plate and the cooling component 110, and the ion wind can effectively act on the surface of the cooling component 110, converting ice crystal water molecules into gaseous water molecules and increasing the melting speed of frost on the surface of the cooling component 110.

[0023] In some embodiments, the vertical projection of the conductive element 130 onto the cooling element 110 falls entirely on the cooling element 110, so that the ion wind formed between the conductive element 130 and the cooling element 110 can completely act on the surface of the cooling element 110, ensuring defrosting efficiency. Preferably, the shape and size of the conductive element 130 are correspondingly set to the cooling element 110, and the vertical projection of the conductive element 130 onto the cooling element 110 can completely cover the frosted area of ​​the cooling element 110, so that the electric field formed between the conductive element 130 and the cooling element 110 can defrost all frosted areas of the cooling element 110, ensuring the defrosting effect of the cooling element 110.

[0024] To create an electric field between the conductive element 130 and the cooling element 110 while ensuring safety, one of the cooling element 110 and the conductive element 130 is grounded as the positive electrode, and the other is connected to a negative voltage as the negative electrode. Electrons accumulate in the electrode connected to the negative voltage, and upon reaching a predetermined negative high voltage, the electrons fly out to the other electrode, forming an ion wind.

[0025] In some embodiments, the conductive element 130 includes a conductive plate disposed on one side of the cooling element 110. The conductive plate and the support of the cooling element 110 form an electric field to defrost the cooling element 110. In other embodiments, the conductive element 130 includes two conductive plates disposed on both sides of the cooling element 110. The two conductive plates and the cooling element 110 respectively form electric fields, defrosting the cooling element 110 on both sides, effectively defrosting the cooling element 110 and improving the defrosting efficiency of the cooling element 110.

[0026] It should be noted that the conductive plate can be a conductive structure such as a metal plate or a metal mesh.

[0027] The refrigeration component 110 includes an evaporator, which is preferably a finned evaporator with many pointed tips. Of course, the evaporator may also be other types of evaporators such as plate-tube evaporators. The refrigeration component 110 can also be the cold end of a semiconductor refrigeration system.

[0028] Specifically, the arrangement of the conductive component 130 and the cooling component 110 can have at least the following options:

[0029] The first type, such as Figure 1 As shown, the conductive component 130 includes a conductive plate located on one side of the cooling component 110. The shape and size of the conductive plate correspond to those of the cooling component 110. The cooling component 110 is connected to a negative voltage (negative pole), and the conductive plate is grounded (positive pole), forming an electrostatic field between the cooling component 110 and the conductive plate. Since the cooling component 110 is connected to a negative voltage, insulation is required at the inlet and outlet pipe ends of the cooling component 110 to ensure the normal and safe operation of the refrigeration device 100. In this application, an insulating component is provided at the ends of the inlet and outlet pipes of the cooling component 110. Specifically, an insulating pipe section can be provided at the ends of the inlet and outlet pipes of the cooling component 110 to prevent the current connected to the cooling component 110 from being conducted into the external pipes.

[0030] The second type, such as Figure 3 As shown, the conductive component 130 includes two conductive plates located on both sides of the cooling component 110. The shape and size of the conductive plates correspond to those of the cooling component 110. The cooling component 110 is connected to a negative voltage as the negative electrode, and the two conductive plates share a common ground as the positive electrode, forming electrostatic fields between the cooling component 110 and the two conductive plates. Since the cooling component 110 is connected to a negative voltage, insulation is required at the inlet and outlet pipe ends of the cooling component 110 to ensure the normal and safe operation of the cooling device 100. In this application, insulating components are provided at the ends of the inlet and outlet pipes of the cooling component 110. Specifically, an insulating pipe section can be provided at the ends of the inlet and outlet pipes of the cooling component 110 to prevent the current connected to the cooling component 110 from being conducted into the external pipes.

[0031] The third type, such as Figure 4 As shown, the conductive component 130 includes a conductive plate located on one side of the cooling component 110. The shape and size of the conductive plate correspond to those of the cooling component 110. The cooling component 110 is grounded as the positive terminal, and the conductive plate is connected to a negative voltage as the negative terminal, thus forming an electrostatic field between the cooling component 110 and the conductive plate.

[0032] The fourth type, such as Figure 5 As shown, the conductive component 130 includes two conductive plates located on both sides of the cooling component 110. The shape and size of the conductive plates correspond to those of the cooling component 110. The cooling component 110 is grounded as the positive terminal, and the conductive plates are connected to a negative voltage as the negative terminal, thus forming an electrostatic field between the cooling component 110 and the conductive plates.

[0033] It is understood that a duct is formed in the refrigeration device 100 (e.g., within the refrigeration chamber 101), and both the conductive element 130 and the refrigeration element 110 are disposed within the duct. When the humid, hot air passing through the duct comes into contact with the refrigeration element 110, the water vapor condenses upon cooling and adheres to the refrigeration element 110, and the condensed water droplets further frost and freeze. In this application, the refrigeration element 110 and the conductive element 130 are disposed within the duct, forming an electric field between them. Once the electric field reaches a certain strength, it generates and accelerates charged particles to form an ion wind. The ion wind generated by using an electric field defrosting method can prevent water molecules from condensing into frost on the surface of the refrigeration element 110, slowing down the frost formation rate; it can also accelerate the defrosting speed of the already frosted surface of the refrigeration element 110, and improve the overall defrosting efficiency.

[0034] Furthermore, in addition to being a conductive plate structure such as a metal plate or metal mesh, the conductive element 130 can also be formed on the wall of the air duct, and the conductive element 130 is a conductive thin film material.

[0035] As moisture in the air gradually condenses on the cooling element 110 in the direction from the upwind end of the air duct to the downwind end, the humidity of the air gradually decreases. Therefore, the frost thickness on the cooling element 110 gradually decreases in this direction. In some embodiments, such as Figure 6 As shown, when the cooling element 110 is grounded and the conductive element 130 is connected to a negative voltage, the cooling device 100 includes at least two conductive elements 130. These at least two conductive elements 130 are arranged along the airflow direction in the duct, and the voltages connected to the at least two conductive elements 130 are different. In the direction from the upper airflow outlet to the lower airflow outlet of the duct, the voltage connected to the conductive element 130 gradually decreases, and the frost thickness of the cooling element 110 in the corresponding area gradually decreases. A higher intensity electric field is used to defrost the thicker frost areas of the cooling element 110, improving its defrosting effect; a lower intensity electric field is used to defrost the thinner frost areas of the cooling element 110, reducing energy consumption, and also reducing the defrosting frequency in this area. By setting at least two conductive elements 130, each connected to an adjustable voltage, time-controlled and intensity-controlled defrosting of the corresponding area of ​​the cooling element 110 can be achieved, improving defrosting efficiency and reducing defrosting energy consumption.

[0036] It should be noted that an insulating partition is required between two adjacent conductive components 130. All conductive components 130 are spliced ​​together into a whole through insulating partitions.

[0037] In some embodiments, such as Figure 7As shown, the refrigeration device 100 also includes a refrigeration compartment 101 and a defrosting assembly 120. The refrigeration compartment 101 is the compartment where the refrigeration component 110 is located. The refrigeration component 110 is disposed in the refrigeration compartment 101 for heat exchange with the air passing through the refrigeration compartment 101. The defrosting assembly 120 is disposed in the refrigeration compartment 101 for either frosting to reduce the humidity of the refrigeration compartment 101 or defrosting to reduce the humidity of the refrigeration compartment 101. By providing an independent defrosting assembly 120 in the refrigeration compartment 101, when the humidity of the air entering the refrigeration compartment 101 is high, or when the humidity of the air passing through the refrigeration compartment 101 is high due to reasons such as the defrosting of the refrigeration component 110, and the air humidity needs to be reduced, the defrosting assembly 120 frosts to reduce the air humidity; when the humidity of the air passing through the refrigeration compartment 101 is low due to the frosting of the refrigeration component 110, and the air humidity needs to be increased, the defrosting assembly 120 defrosts to increase the air humidity. Thus, by using a defrosting component 120, the air humidity can be increased or decreased, thereby improving the air humidity regulation function of the refrigeration device 100.

[0038] In one embodiment, such as Figure 7 As shown, the defrosting assembly 120 and the cooling component 110 are arranged sequentially along the airflow direction within the cooling chamber 101, i.e., positioned at the upper or lower airflow outlet of the cooling component 110. This allows the defrosting assembly 120 to fully contact the air passing through the cooling chamber 101, frosting or defrosting to reduce or increase the humidity of the air passing through the cooling chamber 101. Of course, in other embodiments, the defrosting assembly 120 and the cooling component 110 may also be arranged sequentially along a direction perpendicular to or other than the airflow direction within the cooling chamber 101. Specifically, the defrosting assembly 120 is located at the upper air vent of the refrigeration unit 110. After the outside air enters the refrigeration chamber 101, it preferentially contacts the refrigeration unit 110, which facilitates the contact of the defrosting assembly 120 with the relatively high humidity air, making it easier for the defrosting assembly 120 to store frost. Furthermore, since the defrosting assembly 120 is located at the upper air vent of the refrigeration unit 110, the cooling capacity of the refrigeration unit 110 and the defrosting moisture are not easily affected by the airflow direction, thus making the defrosting assembly 120 easier to control independently, regardless of the state of the refrigeration unit 110, and making the control more convenient and precise.

[0039] like Figure 7As shown, the defrosting assembly 120 has various design options. In one embodiment, the defrosting assembly 120 includes at least two electrodes 121. An electric field is formed between adjacent energized electrodes 121, and the two electrodes 121 serve as different electrodes, generating an ion wind within the electric field. Since the electrodes 121 are located in the refrigeration chamber 101, their temperature is low. When external gas enters the refrigeration chamber 101, it condenses into frost on the surface of the electrodes 121, reducing air humidity. Conversely, when the electric field between adjacent electrodes 121 reaches a certain intensity, it can defrost the surface of the electrodes 121, increasing air humidity. By adjusting the voltage applied to the electrodes 121, the defrosting and frost-forming speeds of the electrodes 121 can be adjusted, thereby regulating air humidity.

[0040] First, let's introduce the principle of electric field defrosting. When an electric field of sufficient strength is formed between the two electrodes 121, the charged particles (such as electrons or ions) scattered in the air are accelerated under the influence of the strong electric field, thus gaining enough energy to cause the air molecules to dissociate into electrons and ions when they collide. These new electrons and ions then collide with other air molecules, generating new charged particles, resulting in a large number of charged particles. Charged particles with opposite charges to the electrodes are attracted by the electrode charges and fly towards the electrodes, neutralizing the charge on the electrodes; charged particles with the same charges as the electrodes are repelled and fly away from the vicinity of the electrodes, carrying other molecules in a directional motion to form an ion wind with a certain speed. Since this ion wind is different from the wind formed by air flow, it is mainly composed of high-speed charged particles. When these high-speed charged particles hit the frost surface of electrode 121, the energy they carry is absorbed by the water molecules on the frost surface, thereby increasing the kinetic energy of these water molecules and accelerating their melting speed. Simultaneously, the deposition of these charged particles on the surface of the frost increases its thermal conductivity, enabling it to absorb heat from the surrounding environment more quickly and accelerating its melting. This melts the frost on the surface of electrode 121, increasing air humidity.

[0041] When the defrosting assembly 120 needs to defrost, the electric field between the two electrodes 121 is turned on or increased, so that the defrosting speed of the defrosting assembly 120 is greater than the defrosting speed of the defrosting assembly 120, thereby defrosting the defrosting assembly 120 and increasing the air humidity.

[0042] When the defrosting assembly 120 needs to frost, the electric field between the two electrodes 121 is disconnected or reduced, so that the frosting speed of the defrosting assembly 120 is greater than the defrosting speed, thereby causing the defrosting assembly 120 to frost and reduce the air humidity.

[0043] When the air humidity reaches the preset air humidity, the voltage of electrode 121 can be set to the preset voltage, or it can work according to the preset working interval, so that the frosting speed and the defrosting speed are balanced, and the preset air humidity is maintained.

[0044] Furthermore, the refrigeration unit 100 also includes a humidity sensor 140 and a control component (not shown in the figure), the control component being coupled to the humidity sensor 140 and the defrosting assembly 120, respectively. The humidity sensor 140 is disposed at the air outlet of the refrigeration compartment 101 to sense the humidity of the air outlet of the refrigeration compartment 101. The air outlet of the refrigeration compartment 101 directly exchanges heat and humidity with the outside. For example, if the refrigeration unit 100 is a refrigerator, the refrigeration compartment 101 is connected to the refrigerator compartment or the freezer compartment. By disposing of the humidity sensor 140 at the air outlet of the refrigeration compartment 101, the humidity of the air outlet of the refrigeration compartment 101 can be directly sensed, thereby accurately adjusting the operation of the defrosting assembly 120 according to the humidity of the air outlet of the refrigeration compartment 101. Specifically, in response to the outlet humidity being greater than the predetermined humidity, the controller controls the frosting and defrosting assembly 120 to frost; in response to the outlet humidity being less than the predetermined humidity, the controller controls the frosting and defrosting assembly 120 to defrost; in response to the outlet humidity being equal to the predetermined humidity, the controller controls the frosting and defrosting assembly 120 to maintain a predetermined operating state to balance the frosting speed and the defrosting speed and maintain the predetermined humidity.

[0045] When the defrosting assembly 120 includes at least two electrodes 121, when the humidity sensor 140 detects that the current humidity is less than a predetermined humidity, the controller controls the electrodes 121 to increase the differential voltage, so that the defrosting speed is greater than the frosting speed, thereby increasing the outlet air humidity. The increased differential voltage can be determined based on the current humidity; the lower the current humidity, the higher the differential voltage. Of course, the differential voltage can also be a fixed value. When the humidity sensor 140 detects that the current humidity is greater than the predetermined humidity, the controller controls the electrodes 121 to decrease the differential voltage, so that the defrosting speed is less than the frosting speed, thereby reducing the outlet air humidity. The decreased differential voltage can be determined based on the current humidity; the higher the current humidity, the higher the differential voltage. Of course, the differential voltage can also be a fixed value. When the humidity sensor 140 detects that the current humidity is equal to the predetermined humidity, the controller maintains the predetermined voltage on the electrodes 121, and the defrosting speed and frosting speed of the electrodes 121 are dynamically balanced. The predetermined voltage is determined by adjustment based on actual conditions and is related to the predetermined humidity set by the user.

[0046] Furthermore, if the refrigeration unit 100 is a refrigerator, the humidity sensor 140 can detect the air humidity at the outlet of the refrigeration compartment 101 after the user opens the door to add or remove food from the refrigerator or freezer compartment, and after the refrigeration unit 110 defrosts. The humidity sensor 140 can also periodically detect the air humidity at the outlet of the refrigeration compartment 101; this is not limited here. Of course, the refrigeration unit 100 can also be other refrigeration units such as an air conditioner.

[0047] In some embodiments, electrode 121 includes a first conductive plate. Adjacent first conductive plates are arranged in parallel to each other to form an electric field. The ion wind formed by energizing two adjacent parallel first conductive plates can effectively act on the surface of the first conductive plate, converting ice crystal water molecules into gaseous water molecules and melting the frost on the surface of the first conductive plate.

[0048] In order not to affect the air flow in the refrigeration chamber 101, the length of the first conductive plate is arranged along the air flow direction, so that the first conductive plate can fully contact the air in the refrigeration chamber 101 to frost to reduce humidity or defrost to increase humidity without affecting the air flow.

[0049] It should be noted that the first conductive plate can be a conductive structure such as a metal plate or a metal mesh.

[0050] Furthermore, in addition to being a conductive plate structure such as a metal plate or metal mesh, the electrode 121 is fixed inside the refrigeration chamber 101 by a support member (not shown in the figure). The support member is a support rod structure that is connected to the inner wall of the refrigeration chamber 101 and the electrode plate 121 respectively, and the support member is preferably made of insulating material. Of course, the electrode 121 can also be formed on the chamber wall of the refrigeration chamber 101, and the electrode 121 is made of conductive thin film material.

[0051] An electric field is formed by electrode 121. By adjusting the voltage of the electric field, the frost thickness and defrosting speed of the defrosting component 120 can be precisely controlled, thereby achieving precise regulation of air humidity. The frost and defrosting processes of the defrosting component 120 are independently controllable, resulting in low control costs, simple methods, high regulation efficiency, and strong controllability for humidity regulation.

[0052] It should be noted that the second conductive element 130 and the electrode 121 are controlled by separate voltages.

[0053] In other embodiments, the defrosting assembly 120 includes a heating element disposed in the cooling chamber 101. Because the heating element is disposed in the cooling chamber 101, its temperature is low. When external gas enters the cooling chamber 101, it condenses into frost on the surface of the heating element, reducing air humidity. When the heating element is activated, heat melts the frost on its surface, increasing air humidity. By adjusting the heating temperature of the heating element, the frosting and defrosting speeds can be adjusted, thereby regulating air humidity.

[0054] It should be noted that the heating element is different from the heating element used in the prior art for heating the cooling element 110. The heating element in this application is used to melt frost on the heating element to increase air humidity.

[0055] In some embodiments, such as when the refrigeration unit 100 requires humidification upon initial use, the defrosting assembly 120 may not have frost. Therefore, when increased air humidity is needed, the defrosting assembly 120 cannot increase the air humidity. The refrigeration unit 100 also includes a humidifier (not shown), which is connected to the refrigeration chamber 101. When the defrosting assembly 120 is frost-free and cannot humidify, the humidifier humidifies the refrigeration chamber 101 to assist in the humidification function of the defrosting assembly 120.

[0056] Specifically, the humidifier includes a water tank and a fan. The water tank is connected to the cooling chamber 101, and the fan is located on one side of the water tank to blow the water vapor in the water tank into the cooling chamber 101, thereby increasing the humidity of the cooling chamber 101. The water in the water tank can be added by the user.

[0057] Furthermore, along the airflow direction within the refrigeration compartment 101, the humidifier is positioned at the upper air outlet of the defrosting assembly 120. After the water vapor from the humidifier enters the refrigeration compartment 101, it comes into contact with the defrosting assembly 120. When the temperature of the defrosting assembly 120 is low, some of the water vapor condenses on it, providing moisture for the assembly to regulate humidity. The water vapor from the humidifier can also flow out from the air outlet of the refrigeration compartment 101 with the airflow, increasing the air humidity at the outlet of the refrigeration compartment 101. Thus, the humidifier can both provide frost to the defrosting assembly 120 and assist in increasing the air humidity within the refrigeration compartment 101.

[0058] In addition, the humidifier is connected to the drain outlet of the cooling chamber 101, meaning that the water generated by the defrosting of the cooling unit 110 can flow into and be stored in the humidifier through the drain outlet, thereby realizing the recycling of water in the cooling chamber 101.

[0059] The refrigeration component 110 includes an evaporator, which is preferably a finned evaporator with many pointed tips. Of course, the evaporator may also be other types of evaporators such as plate-tube evaporators. The refrigeration component 110 can also be the cold end of a semiconductor refrigeration system.

[0060] Another embodiment of this application provides a refrigeration device, including the refrigeration apparatus 100 in any of the above embodiments. The refrigeration device includes a refrigerator, an air conditioner, or a semiconductor refrigeration device, etc.

[0061] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of those features. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications will change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. A process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0062] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A refrigeration apparatus, characterized by comprising: The refrigeration device includes: Refrigeration room; Refrigeration components are installed inside the refrigeration room; The conductive component is spaced apart from the cooling component; The cooling element and the conductive element serve as different electrodes to form an electric field between the conductive element and the cooling element, and an ion wind is formed within the electric field; A frosting and defrosting assembly is installed in the refrigeration compartment for frosting to reduce the humidity of the refrigeration compartment, or defrosting to increase the humidity of the refrigeration compartment. The defrosting assembly includes at least two electrodes, and an electric field is formed between adjacent energized electrodes. An ion wind is formed within the electric field to promote defrosting. A humidity sensor is installed at the air outlet of the refrigeration room to sense the humidity of the air outlet of the refrigeration room; The control unit is coupled to the humidity sensor and the defrosting assembly respectively, so as to adjust the operation of the defrosting assembly according to the outlet air humidity of the refrigerated room.

2. The refrigeration appliance of claim 1, wherein, The conductive component includes a conductive plate, which is arranged parallel to the cooling component.

3. The refrigeration appliance of claim 1, wherein, The vertical projection of the conductive element onto the cooling element falls entirely on the cooling element.

4. The refrigeration appliance of claim 1, wherein, One of the cooling component and the conductive component is grounded, and the other is connected to a negative voltage.

5. The refrigeration appliance of claim 4, wherein, The refrigeration component is connected to a negative voltage, and the conductive component is grounded; the ends of the inlet and outlet pipes of the refrigeration component are provided with insulating components.

6. The refrigeration appliance of claim 1, wherein, The conductive component includes a conductive plate, which is disposed on one side of the cooling component; Alternatively, the conductive component may include two conductive plates, which are respectively disposed on both sides of the cooling component.

7. The refrigeration device according to claim 6, characterized in that, The conductive plate is a metal plate or a metal mesh.

8. The refrigeration device according to claim 1, characterized in that, The refrigeration device has an air duct, and both the conductive component and the refrigeration component are disposed in the air duct.

9. The refrigeration device according to claim 8, characterized in that, The conductive element is formed on the wall of the air duct.

10. The refrigeration device according to claim 8, characterized in that, The cooling component is grounded, the conductive component is connected to a negative voltage, and the cooling device includes at least two of the conductive components; the at least two conductive components are arranged along the airflow direction in the air duct, and the at least two conductive components are connected to different voltages.

11. The refrigeration device according to claim 1, characterized in that, The refrigeration component includes an evaporator.

12. The refrigeration device according to claim 11, characterized in that, The evaporator is a finned evaporator.

13. A refrigeration device, characterized in that, Includes the refrigeration device described in any one of claims 1-12.

Images