High-precision back-drilling method and circuit board

By precisely controlling the drilling depth and the removal of the conductive metal layer on the substrate, the problem of insufficient backdrilling accuracy in the existing technology is solved, and high-precision backdrilling is achieved, ensuring signal transmission integrity and circuit board quality.

CN116261280BActive Publication Date: 2025-10-21KINWONG ELECTRONICS TECH LONGCHUAN
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Patent Information

Application Number
CN202310155092.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-02-22
Publication Date
2025-10-21
Estimated Expiration
2043-02-22

AI Technical Summary

Technical Problem

Existing technologies cannot achieve high-precision backdrilling, resulting in backdrilling that is too deep or too shallow, affecting signal transmission integrity, and even causing line connection failure or residual metal layer affecting signal transmission.

Method used

By first drilling a first hole with a depth of distance M and an aperture of d1 on the substrate, and etching away the target metal layer, then drilling a second hole with an aperture of d2 and performing copper electroplating, and finally drilling a third hole with an aperture of d4, it is ensured that the conductive metal layer is completely removed to avoid excessive length of the residual pile.

Benefits of technology

High-precision back drilling is achieved, which avoids the influence of excessively long back drilling stumps on signal transmission, ensures the integrity of information transmission, and improves the quality of circuit boards.

✦ Generated by Eureka AI based on patent content.

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    Figure CN116261280B_ABST
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Abstract

The application relates to the technical field of printed wiring boards, and discloses a high-precision back-drilling drilling method and a wiring board. The high-precision back-drilling drilling method comprises the following steps: providing a substrate, the substrate comprising a target metal layer, a first metal layer and a second metal layer, the substrate further being provided with a test hole, one side of the target metal layer facing the first metal layer being a target surface, and one side of the first metal layer facing away from the target metal layer being a reference surface; obtaining the distance M between the target surface and the reference surface in the test hole; drilling a first hole on the substrate; etching and removing the target metal layer in the first hole; drilling a second hole with a hole diameter d2 on the substrate; carrying out copper plating on the substrate; and drilling a third hole with a hole diameter d4 on the substrate. The application provides a high-precision back-drilling drilling method and a wiring board, can control the back-drilling precision better, and avoids the problem that the back-drilling residual pile is too long and affects signal transmission.
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Citation Information

Patent Citations

  • A manufacturing method for interlayer connection in a PCB and the PCB

    CN107580426A

  • Methods of forming high aspect ratio plated through holes and high precision STUB removal in a printed circuit board

    US20150208514A1