Surface processing apparatus using energy beam and surface processing method

Abstract

A surface processing apparatus using an energy beam includes a measuring device, a gas source, an energy beam providing device, a multi-axis carrying platform, and a processing device. The measuring device is used to measure a workpiece to obtain surface shape information. The energy beam providing device is used to receive a processing gas to form an energy beam. The energy beam providing device includes a rotating sleeve. A plurality of openings are located on a bottom surface of the rotating sleeve. The rotating sleeve is used to rotate along a rotating axis and provide the energy beam from one of the plurality of openings to the workpiece. The processing device controls the gas source, the energy beam providing device, and the multi-axis carrying platform according to the surface shape information, wherein a distance from each opening to the rotating axis is different. The energy beam is formed as one of a beam shape or a plurality of annular shapes with different radii by rotation of the energy beam providing device.

Description

TECHNICAL FIELD

[0001] The present application relates to a machining apparatus and a machining method, and particularly relates to a surface machining apparatus and a surface machining method using an energy beam. BACKGROUND

[0002] In the field of surface polishing, the current polishing methods can be classified into traditional full-area polishing and non-traditional local-area polishing. Some large factories use the traditional full-area polishing method. For high-precision requirements and local finishing, magnetorheological finishing (MRF) or ion beam finishing (IBF) is used.

[0003] In the polishing principle of ion beam finishing, high-energy ion beams are used to bombard and remove atoms on the lens surface. Since the removal amount is at the atomic scale, irregularities of 0.02λ can be achieved, which is mainly applied to satellites and military equipment. However, the atomic removal amount results in long processing time, high-cost process environment and equipment in a vacuum environment. Therefore, it is still in academic units and research institutions. In the magnetorheological finishing technology, the production efficiency is higher than that of ion beam finishing, and the irregularity can reach 0.05λ. However, the cost of equipment is still tens of times higher than that of traditional methods, which cannot be applied to mass production online. In addition, the polishing liquid required for the above two polishing methods is micron-level high-magnetic-conductivity particles, which is easy to rust due to oxidation, causing the polishing liquid to be unable to be recycled. In addition, the above two polishing methods do not integrate a topography detection system, and the component topography is measured offline, and then the component surface is removed in a micro area to serve as a marker point for processing coordinate correction.

[0004] Therefore, how to integrate the polishing system and the detection system online, use the energy beam to etch and remove the lens surface to achieve high-precision purposes, and reduce irregularities is a problem to be solved in the field. SUMMARY

[0005] The present application provides a surface machining apparatus and a surface machining method, which can use the composite machining means of beam-shaped energy beams and ring-shaped energy beams to process workpieces, thereby improving the finishing accuracy and finishing effect.

[0006] The present application provides a surface processing apparatus using an energy beam, comprising a measuring device, a gas source, an energy beam providing device, a multi-axis carrying platform, and a processing device. The measuring device is used to measure a workpiece to obtain surface profile information. The gas source is used to provide a processing gas. The energy beam providing device is connected to the gas source to receive the processing gas to form an energy beam. The energy beam providing device comprises a rotating sleeve. The rotating sleeve comprises a plurality of openings and a plurality of first gas flow channels respectively connected to the plurality of openings. The plurality of openings are located on the bottom surface of the rotating sleeve. The cylindrical symmetry center of the rotating sleeve has a rotation axis, and the rotating sleeve is used to rotate along the rotation axis and provide the energy beam from one of the plurality of openings to the workpiece for processing. The multi-axis carrying platform is used to carry the workpiece and move the workpiece to the detection axis of the measuring device or to the transmission path of the energy beam. The processing device is electrically connected to the measuring device, the gas source, the energy beam providing device, and the multi-axis carrying platform. The processing device controls the gas source, the energy beam providing device, and the multi-axis carrying platform according to the surface profile information, wherein the distance from each opening to the rotation axis is different. The energy beam is formed into one of a beam shape or a plurality of annular shapes with different radii by the rotation of the energy beam providing device.

[0007] The present application also provides a surface processing method using an energy beam, comprising establishing a plurality of processing means, and the plurality of processing means comprises providing an energy beam in a beam shape and a plurality of annular shapes with different radii; measuring a workpiece to obtain surface profile information; calculating a processing flow for the plurality of processing means according to the surface profile information; controlling the energy beam providing device according to the processing flow; and providing the energy beam to the workpiece. Wherein, the energy beam providing device is used to rotate along a rotation axis and provide the energy beam from one of the plurality of openings to the workpiece for processing, and the minimum distance from each of the plurality of openings to the rotation axis is different.

[0008] Based on the above, in the surface processing apparatus and the surface processing method using an energy beam of the present application, the surface processing apparatus comprises a measuring device, an energy beam providing device, a gas source, and a processing device. The measuring device is used to measure the surface of a workpiece to obtain surface profile information. The energy beam providing device is used to provide an energy beam to the workpiece for processing. The processing device is electrically connected to the measuring device, the gas source, and the energy beam providing device, and controls the gas source and the energy beam providing device according to the surface profile information. Therefore, the workpiece can be processed in a non-contact manner, such as surface profile finishing, and the operation parameters of the energy beam providing device are adjusted by the surface profile information obtained by surface profile measurement. In addition, the energy beam providing device is adapted to rotate along a rotation axis, and the energy beam can be formed into a beam shape or a plurality of annular shapes with different radii by the rotation of the energy beam providing device to perform the surface processing process. In this way, the workpiece can be processed by using the combined processing means of the beam-shaped energy beam and the annular energy beam.

[0009] To make the above features and advantages of the present application more obvious and easy to understand, the following specific embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0010] FIG. 1A and FIG. 1B are respectively schematic diagrams of a surface processing apparatus in different states according to an embodiment of the present application;

[0011] FIG. 2 is a side view schematic diagram of the energy beam providing device and the workpiece in the embodiment of the present application; FIG. 1B

[0012] FIG. 3 is a bottom view schematic diagram of the energy beam providing device in the embodiment of the present application; FIG. 2

[0013] FIG. 4 is a perspective view schematic diagram of the energy beam providing device in the embodiment of the present application; FIG. 2

[0014] FIG. 5 is a perspective sectional view schematic diagram of the energy beam providing device in the embodiment of the present application; FIG. 4

[0015] FIG. 6 is a perspective sectional exploded view schematic diagram of the energy beam providing device in the embodiment of the present application; FIG. 4

[0016] FIG. 7 is a perspective view schematic diagram of the rotating sleeve in the embodiment of the present application; FIG. 4

[0017] FIG. 8A to FIG. 8F are respectively perspective view schematic diagrams of the rotating sleeve in different states in the embodiment of the present application; FIG. 7

[0018] FIG. 9A to FIG. 9F are respectively bottom view schematic diagrams of the rotating sleeve in the embodiment of the present application; FIG. 8A to FIG. 8F

[0019] FIG. 10 is a perspective view schematic diagram of the energy beam providing device in another state in the embodiment of the present application; FIG. 4

[0020] FIG. 11 is a flow chart of steps of a surface processing method according to an embodiment of the present application;

[0021] FIG. 12 is a processing simulation schematic diagram of different energy beams according to an embodiment of the present application.

[0022]

BRIEF DESCRIPTION OF REFERENCE NUMERALS

[0023] 10: workpiece;

[0024] 100: surface processing apparatus;​​​​​​​​​

[0025] 110: measuring device;

[0026] 120: gas source;

[0027] 130: processing device;

[0028] 140: multi-axis carrying platform;

[0029] 200: energy beam providing device;

[0030] 210: rotating sleeve;

[0031] 212: opening;

[0032] 214: first gas flow channel;

[0033] 216: positioning groove;

[0034] 220: first electrode;

[0035] 222: gas inlet;

[0036] 224: second gas flow channel;

[0037] 230: second electrode;

[0038] 232: perforation;

[0039] 240: switching gas valve;

[0040] 242: third gas flow channel;

[0041] 244: blocking part;

[0042] 246: recess;

[0043] 250: rotating bearing;

[0044] 260: fixing ring;

[0045] 262: positioning protrusion;

[0046] 270: conductive structure;

[0047] 400-409: simulation diagram;

[0048] B: energy beam;

[0049] E1: accommodation space;

[0050] E2: gas storage space;

[0051] F: processing gas;

[0052] I: detection axis;

[0053] L: working distance

[0054] M: first portion

[0055] N: second portion

[0056] R: rotation axis

[0057] S: bottom surface

[0058] S300-S303: steps

[0059] T: top portion DETAILED DESCRIPTION

[0060] Embodiments of the present application will be described in detail below with reference to the accompanying drawings. It is to be understood that the drawings are intended to be illustrative and not restrictive. The components can not be drawn to scale in order to clearly illustrate the components. In addition, some components and / or component symbols can be omitted from some of the drawings. In the description and drawings, the same or similar components are designated with the same or similar reference numerals. When a component is described as being "disposed on," "connected to," or "coupled to" another component, it can be "directly disposed on," "directly connected to," or "directly coupled to" the other component, or intervening components can be present. It is contemplated that elements and features of one embodiment can be incorporated into another embodiment with or without modification, and all possible combinations of elements and features are within the scope of the application.

[0061] FIG. 1A and FIG. 1B are schematic diagrams of a surface processing apparatus in different states according to an embodiment of the present application. Please refer to FIG. 1A and FIG. 1B The present embodiment provides a surface processing apparatus 100, which includes a measuring device 110, a gas source 120, an energy beam providing device 200, and a processing device 130. The surface processing apparatus 100 is used for processing a workpiece 10. Specifically, the workpiece 10 is, for example, an optical lens, and the surface processing apparatus 100 is used for surface processing of the workpiece 10, such as polishing, grinding, etc. Compared with conventional processing apparatuses, the surface processing apparatus 100 of the present embodiment is a processing apparatus that measures the surface of the workpiece 10 in a non-contact manner and uses an energy beam B to process the surface of the workpiece 10.

[0062] The measurement device 110 is configured to measure the workpiece 10 to obtain surface profile information, such as height information at any position on the surface of the workpiece 10. In particular, the surface processing apparatus 100 further comprises a multi-axis carrying platform 140 configured to carry the workpiece 10 and move the workpiece 10 to a detection axis I of the measurement device 110, or to a transmission path of the energy beam B. In addition, the multi-axis carrying platform 140 is controlled to move the workpiece 10 to a processing position in real time according to the requirements of the processing process, so as to achieve the purpose of precision processing. In the embodiment, the multi-axis carrying platform 140 is configured to fix the workpiece 10 and can rotate the workpiece 10 to face the measurement device 110, as shown in FIG. 1. Therefore, when the multi-axis carrying platform 140 moves the workpiece 10 to the detection axis I facing the measurement device 110, the measurement device 110 measures the workpiece 10 to sense the surface profile information of the workpiece 10. In an embodiment, the measurement device 110 is configured to measure the height of the surface of the workpiece 10 at any position to obtain the surface profile information. In an embodiment, the measurement device 110 is, for example, an optical interferometer or a contact probe detection device. That is, for example, optical measurement or contact measurement is performed on the workpiece 10, but the present application is not limited thereto. FIG. 1A The measurement device 110 is configured to measure the workpiece 10 to obtain surface profile information, such as height information at any position on the surface of the workpiece 10. In particular, the surface processing apparatus 100 further comprises a multi-axis carrying platform 140 configured to carry the workpiece 10 and move the workpiece 10 to a detection axis I of the measurement device 110, or to a transmission path of the energy beam B. In addition, the multi-axis carrying platform 140 is controlled to move the workpiece 10 to a processing position in real time according to the requirements of the processing process, so as to achieve the purpose of precision processing. In the embodiment, the multi-axis carrying platform 140 is configured to fix the workpiece 10 and can rotate the workpiece 10 to face the measurement device 110, as shown in FIG. 1. Therefore, when the multi-axis carrying platform 140 moves the workpiece 10 to the detection axis I facing the measurement device 110, the measurement device 110 measures the workpiece 10 to sense the surface profile information of the workpiece 10. In an embodiment, the measurement device 110 is configured to measure the height of the surface of the workpiece 10 at any position to obtain the surface profile information. In an embodiment, the measurement device 110 is, for example, an optical interferometer or a contact probe detection device. That is, for example, optical measurement or contact measurement is performed on the workpiece 10, but the present application is not limited thereto.

[0063] The gas source 120 is connected to the energy beam providing device 200 and is configured to provide a processing gas F (such as FIG. 5 ) to form an ion beam as the energy beam B. In an embodiment, the gas source 120 can use a combination of a main gas and at least one reaction gas. For example, the processing gas F provided by the gas source 120 includes a main gas and a reaction gas. For example, the main gas can be an inert gas such as argon (Argon, Ar), neon (Neon, Ne), or argon (Argon, Ar), and the reaction gas can be a reaction gas such as carbon tetrafluoride (CF4), nitrogen trifluoride (NF3), nitrogen (N2), or oxygen (O2). The above-mentioned mixed gas is controlled by a gas flow / mass controller to control the combined proportion of the mixed gas flowing into the energy beam providing device 200.

[0064] The processing device 130 is electrically connected to the measuring device 110, the gas source 120, the energy beam providing device 200, and the multi-axis carrying platform 140. The processing device 130 controls the gas source 120, the energy beam providing device 200, and the multi-axis carrying platform 140 according to the surface shape information provided by the measuring device 110, and further adjusts the working parameters of the gas source 120 and the energy beam providing device 200, such as power, time, frequency, working distance, etc. On the other hand, the processing device 130 obtains a machining process according to the surface shape information, and controls the multi-axis carrying platform 140 to drive the workpiece 10 to a machining position in real time to allow the energy beam B provided by the energy beam providing device 200 to perform precision machining. In the embodiment, the processing device 130 is, for example, a central processing unit (CPU), or other programmable general-purpose or special-purpose microprocessors (Microprocessor), digital signal processors (DSP), programmable controllers, application specific integrated circuits (ASIC), or other similar components or combinations of the above components. In addition, the processing device 130 can be electrically connected to the energy beam providing device 200 in a wired or wireless manner, and the present application is not limited thereto.

[0065] FIG. 2 For FIG. 1B the side view schematic diagram of the energy beam providing device and the workpiece. Please refer to FIG. 2 . The energy beam providing device 200 is connected to the gas source 120 for receiving the machining gas F provided by the gas source 120. When performing surface machining, the energy beam providing device 200 forms the machining gas F into the energy beam B. In addition, the energy beam providing device 200 is used to rotate along the rotation axis R and provide the energy beam B from one of the plurality of openings 212 to the workpiece 10 for machining. It is worth mentioning that the opening 212 of the energy beam providing device 200 to the workpiece 10 has a working distance L, and the working distance L is greater than 0. In other words, the machining method of the embodiment is a non-contact machining method. In addition, the above-mentioned machining method can be performed under the condition that the environmental pressure is approximately standard atmospheric pressure.

[0066] FIG. 3 For FIG. 2 the bottom view schematic diagram of the energy beam providing device. Please refer to FIG. 2 and FIG. 3. It is also worth mentioning that the distances between the multiple openings 212 of the energy beam providing device 200 and the rotation axis R are different. For example, in the present embodiment, the number of the multiple openings 212 is six, and the distances between these openings 212 and the rotation axis R are 0, 1, 2, 3, 4, and 5 mm, respectively. In addition, the energy beam providing device 200 is suitable for rotating along the rotation axis R, and the energy beam B is emitted from one of the multiple openings 212 as a beam-shaped energy beam B or an annular energy beam B. Therefore, when the energy beam B is emitted from an opening 212 that is 0 mm away from the rotation axis R, it will be formed into a beam-shaped energy beam B. If the energy beam B is emitted from an opening 212 that is greater than 0 mm away from the rotation axis R, it will be formed into an annular energy beam B through high-speed rotation, and the size of the energy beam B is determined according to the openings 212 at different positions. However, the present invention does not limit the number of openings 212 and the spacing distances between each other and the rotation axis R, and can be planned and designed according to different types of workpieces 10. In this way, the workpiece 10 can be processed by a composite processing method using the bundle-shaped energy beam B and the ring-shaped energy beam B.

[0067] Please refer to FIG. 4 to FIG. 7 . FIG. 4 for FIG. 2 A three-dimensional schematic diagram of an energy beam providing device. FIG. 5 for FIG. 4 A schematic three-dimensional cross-sectional diagram of an energy beam providing device. FIG. 6 for FIG. 4 A schematic exploded perspective view of a three-dimensional cross-section of an energy beam providing device. FIG. 7 for FIG. 4A perspective view of the rotating sleeve. In detail, in this embodiment, the energy beam providing device 200 further comprises a rotating sleeve 210, a first electrode 220, a second electrode 230, and a switching gas valve 240. The rotating sleeve 210 comprises a housing space El, the plurality of openings 212 as described above, and a plurality of first gas flow channels 214 respectively connected to the plurality of openings 212. The plurality of openings 212 are located on the bottom surface S of the rotating sleeve 210, and the rotation axis R is the central axis of the rotating sleeve 210. The first electrode 220 is disposed in the housing space El, and the first electrode 220 comprises a gas inlet 222 and a second gas flow channel 224 connected to the gas inlet 222. The gas inlet 222 is connected to the gas source 120. The second electrode 230 is disposed on the bottom surface S of the rotating sleeve 210 to cover the bottom surface S, and has a plurality of perforations 232 for allowing the plurality of openings 212 of the rotating sleeve 210 to communicate with the outside. In other words, the number and position of the perforations 232 correspond to the number and position of the plurality of openings 212 of the rotating sleeve 210. The rotating sleeve 210 is located between the first electrode 220 and the second electrode 230 for applying an electric field to the processing gas F to form the energy beam B. In addition, in this embodiment, the energy beam providing device 200 further comprises a conductive structure 270 connected to the second electrode 230. The conductive structure 270 is, for example, an electric brush for providing a grounding function.

[0068] Please refer to FIG. 4 to FIG. 6The switching gas valve 240 is rotatably disposed on the top T of the rotary sleeve 210. The switching gas valve 240 includes a third gas flow passage 242 and a blocking portion 244. In addition, in the present embodiment, the energy beam providing device 200 further includes at least one rotary bearing 250 disposed between the switching gas valve 240 and the rotary sleeve 210 for allowing the switching gas valve 240 and the rotary sleeve 210 to rotate along the rotary axis R. However, the present application is not limited to the type of mechanism for rotation. It is worth mentioning that the switching gas valve 240 is disposed on the top T of the rotary sleeve 210 to form an annular gas storage space E2 between the switching gas valve 240, the shaft portion of the first electrode 220 extending toward the top T and the rotary bearing 250 for storing the processing gas F. Thus, when the gas source 120 provides the processing gas F, the processing gas F enters the gas storage space E2 through the gas inlet 222 and the second gas flow passage 224 to fill the gas storage space E2. The switching gas valve 240 is rotated to connect the third gas flow passage 242 between the gas storage space E2 and one of the plurality of first gas flow passages 214, i.e. the corresponding first gas flow passage 214, while the blocking portion 244 covers the remaining plurality of first gas flow passages 214 to block the flow of the processing gas. In this way, the opening 212 to be used for processing can be determined by controlling the position of the third gas flow passage 242 in the switching gas valve 240. In other words, the processing gas F provided by the gas source 120 is sequentially transmitted from the gas inlet 222 of the first electrode 220, through the second gas flow passage 224, the gas storage space E2, the third gas flow passage 242, one of the first gas flow passages 214 and the corresponding opening 212 to form the energy beam B.

[0069] More specifically, the plurality of first gas flow passages 214 is equal in number to the plurality of openings 212 and are connected in correspondence with each other. The plurality of first gas flow passages 214 is different in length. In detail, in the present embodiment, each first gas flow passage 214 includes a first portion M and a second portion N, wherein the first portion M is connected to the second portion N, each first portion M is equal in length and parallel to the extension direction of the rotary sleeve 210, and each second portion N is different in length and perpendicular to the extension direction of the rotary sleeve 210, as shown in FIG. 7The second portions N are shown in detail. In particular, the length of each second portion N varies with the distance of the corresponding opening 212 to the rotation axis R. If the distance of the opening 212 to the rotation axis R is larger, the length of the corresponding second portion N is smaller. The sum of the distance of each corresponding opening 212 to the rotation axis R and the length of the second portion N is equal to each other and smaller than the radius of the cylindrical structure of the rotating sleeve 210. In other words, the sum of the distance of each opening 212 to the rotation axis R and the length of each corresponding first gas flow channel 214 is equal. In particular, when the process gas F flows through the second portion N of the first gas flow channel 214, it is excited to form a plasma state by the electric field applied between the first electrode 220 and the second electrode 230, and then provides the energy beam B to the workpiece 10 through the opening 212.

[0070] Fig. 9A to Fig. 9D are schematic perspective views of the rotating sleeve 210 in different states. FIG. 8F Fig. 10A and Fig. 10B are schematic bottom views of the rotating sleeve 210. Please refer to Fig. 9A to Fig. 9D. FIG. 7 Fig. 11A and Fig. 11B are schematic bottom views of the rotating sleeve 210. Please refer to Fig. 9A to Fig. 9D. FIG. 9A to FIG. 9F Fig. 12A and Fig. 12B are schematic bottom views of the rotating sleeve 210. Please refer to Fig. 9A to Fig. 9D. FIG. 8A to FIG. 8F Fig. 13A and Fig. 13B are schematic bottom views of the rotating sleeve 210. Please refer to Fig. 9A to Fig. 9D. FIG. 8A to FIG. 9F For example, the number of the openings 212 is six, and the distance of the openings 212 to the rotation axis R is 0, 1, 2, 3, 4, 5 mm respectively (for convenience, the first opening, the second opening, and so on are referred to below). When the first opening is used for processing in the surface processing process, the switching gas valve 240 is controlled to rotate so that the third gas flow channel 242 is connected to the corresponding first gas flow channel 214, and thus a beam-shaped energy beam B is provided, as shown in Fig. 10A and Fig. 10B. FIG. 8A FIG. 9A When the second / third / fourth / fifth / sixth opening 210 is used for processing, the switching gas valve 240 is controlled to rotate so that the third gas flow channel 242 is connected to the corresponding second / third / fourth / fifth / sixth first gas flow channel 214, and thus a beam-shaped energy beam B is provided at the second / third / fourth / fifth / sixth opening 210. Then, the rotating sleeve 210 is rotated by the control of the processing device 130, and thus the beam-shaped energy beam B is rotated to form a ring-shaped energy beam B with a radius of 1 / 2 / 3 / 4 / 5 mm, as shown in Fig. 11A and Fig. 11B. FIG. 8B to FIG. 8F FIG. 9B to FIG. 9F In particular, when the ring-shaped energy beam B is formed, the rotating sleeve 210, the second electrode 230, and the switching gas valve 240 are rotated relative to the first electrode 220 through the rotation bearing 250. In the present embodiment, the central angles of any two adjacent second portions N are the same, but the present application is not limited thereto.

[0071] FIG. 10 Fig. 14A and Fig. 14B are schematic bottom views of the rotating sleeve 210. Please refer to Fig. 9A to Fig. 9D. FIG. 4 ​​A perspective view of the energy beam providing device in another state. Please refer to FIG. 4 to FIG. 6 and FIG. 10 In this embodiment, the outer wall of the switching valve 240 comprises a groove 246, the outer wall of the rotating sleeve 210 comprises a plurality of positioning slots 216, and the energy beam providing device 200 further comprises a fixing ring 260, which is slidably arranged between the switching valve 240 and the rotating sleeve 210. The inner wall of the fixing ring 260 comprises a positioning protrusion 262, which is used to be inserted into one of the groove 246 of the switching valve 240 or the plurality of positioning slots 216 of the rotating sleeve 210 along a direction parallel to the rotation axis R. Specifically, when performing the surface processing procedure, the fixing ring 260 is slid along the direction parallel to the rotation axis R to insert the positioning protrusion 262 into one of the positioning slots 216 of the rotating sleeve 210, thereby fixing the relative position of the rotating sleeve 210 and the switching valve 240 (i.e., the fixing ring 260 is temporarily combined with the rotating sleeve 210). When switching to use different openings 212 to provide the energy beam, the fixing ring 260 is first slid in the opposite direction of the above-mentioned direction to disengage the positioning protrusion 262 from the positioning slots 216 of the rotating sleeve 210 and insert it into the groove 246 of the switching valve 240. Then, the fixing ring 260 is rotated to drive the switching valve 240 to rotate to another positioning slot 216, and then the fixing ring 260 is slid along the above-mentioned direction to insert the positioning protrusion 262 into the above-mentioned another positioning slot 216 to fix the relative position of the rotating sleeve 210 and the switching valve 240 (i.e., the fixing ring 260 is temporarily combined with the rotating sleeve 210). In other words, moving the fixing ring 260 will drive the switching valve 240 to rotate, so that the third gas flow channel 242 in the switching valve 240 corresponds to the first gas flow channel 214 to be switched. In this embodiment, the plurality of positioning slots 216 can be designed to have the same spacing, and the number of the plurality of positioning slots 216 is the same as the number of the plurality of openings 212. In this way, the convenience of operating the fixing ring 260 can be improved. Further, in this embodiment, the positioning protrusion 262 slides in the groove 246, but the two are not completely disengaged. The position of the positioning slot 216 can represent the position of the first gas flow channel 214, and the position of the positioning protrusion 262 can represent the position of the third gas flow channel 242.

[0072] FIG. 11 A step flow chart of the surface processing method according to an embodiment of the present application. FIG. 12 A simulation diagram of processing different energy beams according to an embodiment of the present application. Please refer to FIG. 1A to FIG. 2 and FIG. 8A to FIG. 12 In this embodiment, FIG. 11 the step flow of the surface processing method shown can be applied to at least FIG. 1A and FIG. 1B the surface processing device 100 shown, so the following will be described with reference to FIG. 1A andFIG. 1B The surface processing apparatus 100 is shown as an example. In the surface processing, first, the step S300 of establishing a plurality of processing means can be performed. The plurality of processing means includes providing a beam-shaped energy beam B and a plurality of annular energy beams B with different radii. For example, in the present embodiment, the energy beam providing device 200 of the surface processing apparatus 100 has six different processing means, which include providing a beam-shaped energy beam B and a plurality of annular energy beams B with different radii, i.e. FIG. 9A to FIG. 9F The six different shapes of energy beams B are generated. These processing means can be simulated by the processing device 130 and the simulation results obtained by these processing means are stored respectively. FIG. 9A to FIG. 9F The simulation results of the generated energy beams B can be shown in the simulation diagrams 401 to 406 in FIG. 12 , wherein the simulation diagrams 401 and 402 represent the simulation results of the processing means at different working distances (such as the working distance L shown in FIG. 9A ), and the simulation diagrams 403 to 406 represent the simulation results of the annular energy beams B with different radii. FIG. 2

[0073] In addition, while the above steps are performed, the step S301 of measuring the workpiece 10 to obtain the surface profile information can be performed. For example, in the present embodiment, the workpiece 10 is processed to change the surface roughness of the workpiece 10. In detail, the workpiece 10 is moved by the multi-axis carrying platform 140 to the detection axis I of the measuring device 110 for measurement to obtain the surface profile information (such as the height information of any position on the surface of the workpiece 10), which is transmitted to the processing device 130 for storage. The simulation diagram 400 shows the surface height information of the workpiece 10, wherein the RMS represents the root mean square, and the degree of surface roughness is shown as RMS = 0.846λ. In an embodiment, the step S301 can be performed before or simultaneously with the step S300, and the present application is not limited thereto.

[0074] ​Next, after the above steps S300 and S301 are completed, step S302 is performed to calculate a machining process according to the surface profile information. The machining process is at least one of a plurality of machining means. For example, in the present embodiment, the processing device 130 can calculate the surface profile error according to the surface profile information obtained in step S301 and the ideal surface profile (i.e., the surface profile after machining is completed). Then, the machining process required at least one machining means is calculated according to the surface profile error. For example, it can be known from the machining simulation result of simulation diagram 407 that the machining means that provides the beam-shaped energy beam B in simulation diagram 401 and simulation diagram 402 sequentially performs machining, and the surface roughness of RMS=0.202λ is obtained. It can be known from the machining simulation result of simulation diagram 408 that the machining means that provides the ring-shaped energy beam B in simulation diagram 404 to simulation diagram 406 sequentially performs machining, and the surface roughness of RMS=0.238λ is obtained. It can be known from the machining simulation result of simulation diagram 409 that the composite machining means that provides the beam-shaped and ring-shaped energy beam B in simulation diagram 401, simulation diagram 402, and simulation diagram 404 sequentially performs machining, and the surface roughness of RMS=0.184λ is obtained.

[0075] After the above steps are completed, step S303 is performed to control the energy beam providing device 200 to provide the energy beam B to the workpiece 10 to perform machining to generate a machining result, and to control the multi-axis carrying platform 140 to move the machining position of the workpiece 10. The energy beam providing device 200 is used to rotate along the rotation axis R and provide the energy beam B from one of the plurality of openings 212 to the workpiece 10 to perform machining. The machining result is the surface roughness of the workpiece 10 after machining. Specifically, when the above calculation is completed to determine a machining process, the processing device 130 controls the gas source 120 and the energy beam providing device 200 to perform the above machining process. The machining gas F is introduced into the opening 212 to be used by controlling the position of the third gas flow channel 242 in the switching gas valve 240, and the power, time, and working distance of each machining process are set by the processing device 130. On the other hand, the processing device 130 controls the multi-axis carrying platform 140 to move the machining position of the workpiece 10 according to the above settings, so as to achieve precision machining.

[0076] In particular, step S302 can be further subdivided into providing ideal surface profile information, calculating the surface profile information and the ideal surface profile information to obtain surface profile error information, and obtaining the required at least one machining means based on the surface profile error information. The ideal surface profile information is an ideal value of the surface roughness to be achieved (e.g. RMS < 0.1 λ). The surface profile error information is the difference between the surface profile information of the workpiece 10 and the ideal surface profile information. Thus, after calculating the surface profile error information, the processing device 130 will calculate the optimal machining means based on the surface profile error information to perform the machining process with the best efficiency. In addition, in different embodiments, step S302 can be performed for different regions of the surface of the workpiece 10. That is, the optimal machining process can be calculated for different regions to perform the machining process for different regions. In this way, different machining processes can be performed for different regions of the surface of the workpiece 10 to achieve a more efficient machining process.

[0077] It is worth mentioning that in the present embodiment, the surface machining method using the energy beam B can further include establishing a machining target, and if the machining result is greater than the machining target, repeating the measurement of the workpiece 10 to obtain the surface profile information. On the other hand, if the machining result is less than or equal to the machining target, the machining is stopped. The machining target is, for example, a pre-ordered target value of the surface roughness of the workpiece 10. In other words, after the machining is performed, the machined workpiece 10 can be measured again by performing step S301, and if the surface profile information measured again has not reached the machining target, step S302 and S303 can be performed again as required. In this way, the machining precision can be further improved, and the machining process can be made more efficient. In other embodiments, the workpiece can be machined to change the chemical or physical properties of the surface of the workpiece, and the present application is not limited thereto.

[0078] In summary, in the surface machining apparatus and the surface machining method using an energy beam of the present application, the surface machining apparatus includes a measurement device, an energy beam providing device, a gas source, and a processing device. The measurement device is used to measure the surface of the workpiece to obtain the surface profile information. The energy beam providing device is used to provide the energy beam to the workpiece to perform the machining. The processing device is electrically connected to the measurement device, the gas source, and the energy beam providing device, and controls the gas source and the energy beam providing device based on the surface profile information. Thus, the surface of the workpiece can be machined non-contact, for example, surface finishing, and the operation parameters of the energy beam providing device are adjusted by the surface profile information obtained by the surface measurement. In addition, the energy beam providing device is adapted to rotate along a rotation axis, and the energy beam can be formed into a beam-shaped or a plurality of annular energy beams with different radii by the rotation of the energy beam providing device to perform the surface machining process. In this way, the workpiece can be machined by using the combination of the beam-shaped energy beam and the annular energy beam as a composite machining means.

[0079] While the application has been disclosed with reference to the embodiments described above, it should be understood that various modifications can be made without departing from the spirit and scope of the application, which are defined by the following claims.

Claims

1. A surface processing apparatus using an energy beam, characterized by, include: A measuring device, used for measuring a workpiece to obtain surface information; a gas source for providing process gas; an energy beam providing device, connected to the gas source, for receiving the processing gas to form an energy beam, the energy beam providing device comprising: A rotating sleeve comprising a plurality of openings and a plurality of first gas flow channels respectively connected to the plurality of openings, wherein the plurality of openings are located on a bottom surface of the rotating sleeve, and the cylindrical symmetry center of the rotating sleeve has a rotation axis for rotating along the rotation axis and providing the energy beam from one of the plurality of openings to the workpiece for processing; a multi-axis carrying platform, for carrying the workpiece and moving the workpiece to the detection axis of the measuring device, or moving the workpiece to the transmission path of the energy beam; and A processing device is electrically connected to the measuring device, the gas source, the energy beam providing device and the multi-axis supporting platform. The processing device controls the gas source, the energy beam providing device and the multi-axis supporting platform according to the surface shape information, wherein the distances between each of the multiple openings and the rotation axis are different, and the energy beam is formed into a beam or one of multiple rings with different radii through the rotation of the energy beam providing device.

2. The surface processing apparatus using an energy beam according to Claim 1, wherein The energy beam providing device further comprises: a first electrode disposed in the accommodating space of the rotating sleeve, the first electrode comprising an air inlet and a second gas flow channel connected to the air inlet; a second electrode disposed on the bottom surface of the rotating sleeve, wherein the rotating sleeve is located between the first electrode and the second electrode; and The switching gas valve is rotatably disposed on the top of the rotating sleeve. The switching gas valve includes a third gas flow channel and a blocking portion. The switching gas valve rotates to connect the third gas flow channel between the second gas flow channel and one of the multiple first gas flow channels, while the blocking portion covers the remaining multiple first gas flow channels.

3. The apparatus for surface processing using an energy beam according to Claim 1, wherein The number of the plurality of first gas flow channels is the same as the number of the plurality of openings.

4. The apparatus for surface processing using an energy beam according to Claim 1, wherein The lengths of the plurality of first gas flow channels are different.

5. The apparatus for surface processing using an energy beam according to Claim 1, wherein Each of the plurality of first gas flow channels includes a first portion and a second portion. The first portions have the same length and are parallel to the extending direction of the rotating sleeve. The second portions have different lengths and are perpendicular to the extending direction of the rotating sleeve.

6. The energy beam application apparatus for surface processing according to Claim 5, wherein The central angles of any two adjacent second parts are the same.

7. The apparatus for surface processing using an energy beam according to Claim 1, wherein The distances from each of the plurality of openings to the rotation axis are equal to the sum of the lengths of the corresponding first gas flow channels.

8. The apparatus for surface processing using an energy beam according to Claim 2, wherein The energy beam providing device further comprises: At least one rotary bearing is disposed between the switching valve and the rotary sleeve.

9. The apparatus for surface processing using an energy beam according to Claim 2, wherein The outer wall of the switching gas valve includes a groove, the outer wall of the rotating sleeve includes a plurality of positioning grooves, and the energy beam providing device further includes: A fixing ring is slidably disposed on the switching valve and the rotating sleeve. The inner wall of the fixing ring includes a protrusion for being combined with the groove or one of the plurality of positioning grooves.

10. The energy beam application apparatus for surface processing according to Claim 9, wherein The spacing between the plurality of positioning grooves is the same.

11. The energy beam application apparatus for surface processing according to Claim 9, wherein The number of the plurality of positioning grooves is the same as the number of the plurality of openings.

12. The apparatus for surface processing using an energy beam according to Claim 2, wherein The energy beam providing device further comprises: a conductive structure connected to the second electrode.

13. A surface processing method using an energy beam, characterized by, comprising: establishing a plurality of machining means, the plurality of machining means comprising a beam-like energy beam providing device and a plurality of ring-like energy beam providing devices with different radii; measuring the workpiece to obtain surface profile information; calculating a machining procedure according to the surface profile information, wherein the machining procedure is at least one of the plurality of machining means; and controlling the energy beam providing device to provide the energy beam to the workpiece for machining to obtain a machining result, and controlling the multi-axis supporting platform to move the machining position of the workpiece, wherein the energy beam providing device is used to rotate along a rotation axis and provide the energy beam to the workpiece for machining from one of a plurality of openings, and the minimum distances from each of the plurality of openings to the rotation axis are different.

14. The surface processing method using an energy beam according to Claim 13, wherein The step of calculating a machining procedure according to the surface profile information further comprises: providing ideal surface profile information; calculating the surface profile information and the ideal surface profile information to obtain surface profile error information; and obtaining at least one of the plurality of machining means according to the surface profile error information.

15. The surface processing method using an energy beam according to Claim 13, wherein The surface machining method further comprises: establishing a machining target, wherein the machining target is a pre-subscribed target value of the surface roughness of the workpiece; and if the machining result is greater than the machining target, repeating the step of measuring the workpiece to obtain surface profile information, and if the machining result is less than or equal to the machining target, stopping machining.

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