Supply device, film forming device and holding member

Abstract

The present invention provides a supply device, a film forming device, and a holding member that can uniformly expose portions of a large number of electronic components for film formation using a simple mechanism. The supply device of an embodiment supplies electronic components to a film forming processing unit of a film forming device that forms a film on the electronic components. The supply device includes: a mask having a mask hole covering a portion of the electronic components, so that the electronic components are supplied to the film forming processing unit while being passed through and held in the mask hole; a first receiving platform that holds one side of the mask and contacts one end of the electronic components passing through the mask hole; a second receiving platform that holds the other side of the mask and contacts the other end of the electronic components passing through the mask hole; and a reversing mechanism that reverses the mask while the mask is clamped between the first and second receiving platforms.

Description

Technical Field

[0001] The present invention relates to a supply device, a film forming device and a holding member. Background Art

[0002] Currently, chip-shaped electronic components with external electrodes formed on both ends are very popular in various electronic circuits. For example, chip capacitors are formed by dividing a block of dielectric sheets with internal electrodes into rectangular pieces. The external electrodes are formed by covering the sides of this rectangular component with a conductive material that connects to the internal electrodes.

[0003] As a method for forming an external electrode, as shown in Patent Document 1, the following steps are performed: inserting and holding a strip used to cover a portion of an electronic component into a through-hole, using a pressing pin of a component pressing machine to separate and move the electronic component within the through-hole, thereby exposing a portion of the electronic component (the head is exposed), and adhering (forming a film) a conductive material paste on the exposed portion to form an external electrode.

[0004] [Prior art literature]

[0005] [Patent Document]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 09-22846 Summary of the Invention

[0007] [Problems to be solved by the invention]

[0008] However, in the method described above, the protruding length (the length of the exposed portion) of the head of each electronic component is determined by the amount of pressure applied by the press-in pins, etc. Therefore, in order to suppress deviations for each electronic component and form external electrodes, it is necessary to align the protruding lengths of all electronic components within a certain range. However, it is very difficult to adjust the movement of the press-in pins of the component press-in machine. Since most electronic components are very small, the mask used to cover a portion of them must be very thin. Therefore, there is a possibility that the mask will bend and deform due to pressure, and the relative positions of the electronic components and the press-in pins of each mask hole, which is a through hole, are likely to differ. Therefore, the movement of the press-in pins must be changed according to the deformed portion, and the adjustment becomes complicated. This situation further becomes a problem when a large number of electronic components are inserted into the mask holes and supplied to the film forming device for unified film forming processing.

[0009] The embodiments of the present invention are proposed to solve the problems of the prior art described above, and their purpose is to provide a supply device, a film forming device, and a holding member that can simultaneously expose a portion of a large number of electronic components from a mask for film formation using a simple mechanism.

[0010] [Technical means to solve the problem]

[0011] In order to achieve the purpose, an embodiment is a supply device that supplies the electronic parts to a film forming processing part of a film forming device that forms a film on the electronic parts, and the supply device includes: a mask having a mask hole covering a portion of the electronic parts, so that the electronic parts are supplied to the film forming processing part in a state of passing through the mask hole and being maintained; a first supporting platform that holds one side of the mask and contacts one end of the electronic part passing through the mask hole; a second supporting platform that holds the other side of the mask and contacts the other end of the electronic part passing through the mask hole; and a reversing mechanism that reverses the mask when the mask is clamped by the first supporting platform and the second supporting platform.

[0012] Furthermore, a film forming apparatus according to an embodiment includes: the supply device; and a film forming processing unit for forming a film on the electronic component.

[0013] Moreover, an embodiment is a holding member for holding the electronic component in order to form a film on a part of the electronic component by sputtering, the holding member including: a mask having a plurality of mask holes covering a part of the electronic component, so that the electronic component passes through the mask holes and is held; and a supporting platform for holding the mask and with the end of the electronic component passing through the mask hole in contact with the supporting platform, the mask hole being an inner diameter through which the electronic component can pass, and the length in the axial direction being the same as the length of the non-sputtered area of ​​the electronic component.

[0014] [Effects of the Invention]

[0015] According to the embodiment of the present invention, it is possible to provide a supply device, a film forming device, and a holding member capable of collectively exposing parts of a large number of electronic components for film formation using a simple mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The electronic component to be supplied in the embodiment is shown in a perspective view (A), a cross-sectional view (B), and a perspective view (C) showing a state where the electronic component has entered a mask hole.

[0017] Figure 2 It is a partial perspective plan view showing the structure of the film forming apparatus according to the embodiment.

[0018] Figure 3 1. A plan view (A) and a partially sectional side view (B) showing a supply device according to an embodiment.

[0019] Figure 4 Yes Figure 3 (A) and Figure 3(B) is a partial cross-sectional side view (A) showing the electronic component when it is accommodated, and a partial cross-sectional side view (B) showing the electronic component when it is supplied.

[0020] Figure 5 The plan view (A) and the AA arrow cross-sectional view (B) of the chute are shown.

[0021] Figure 6 A plan view (A) and a BB cross-sectional view (B) of the mask are shown.

[0022] Figure 7 The plan view (A) and the CC arrow cross-sectional view (B) of the support platform are shown.

[0023] Figure 8 It is a partial sectional side view showing the state of the supporting platform on the temporary platform being grasped by the supporting platform loading section (A), the state of placing the grasped supporting platform on the supporting platform in the supporting platform loading station (B), the state of dismantling the upper supporting platform in the supporting platform dismantling station by the supporting platform dismantling section (C), and the state of placing the dismantled supporting platform on the temporary platform (D).

[0024] Figure 9 It is a partial sectional side view showing the standby state of the reversing mechanism (A), the state of transferring the receiving platform from the pusher to the reversing mechanism (B), the retreat state of the pusher (C), the state of the receiving platform in reversal (D), the state of reversal completion (E), the state of transferring the receiving platform from the reversing mechanism to the pusher (F), and the state of the pusher placing the receiving platform on the rotating table (G).

[0025] Figure 10 It is a plan view showing the released state (A), the held state (B), the reversed state (C), and the released state (D) of the receiving platform using the reversing mechanism.

[0026] Figure 11 A plan view showing the standby state of the ejection mechanism (A), a partial cross-sectional side view showing the suction state of the electronic component (B), and a partial cross-sectional side view showing the release state of the electronic component (C).

[0027] Figure 12 1. A plan view (A) and a partial cross-sectional side view (B) of the inspection device.

[0028] Figure 13 A cross-sectional view showing a pre-treatment section and a film forming section of a film forming apparatus.

[0029] Figure 14 (A)~ Figure 14 (D) is an explanatory diagram showing the operation of loading and unloading electronic components into and out of the film forming section via the load-lock chamber by the loading and unloading section.

[0030] Figure 15 It is a cross-sectional view showing a standby state of the mask (A) and a state in which the mask is attached to the slide channel (B).

[0031] Figure 16 It is a cross-sectional view showing a state where the adsorption portion is positioned on the mask (A) and a state where the electronic component is dropped (B).

[0032] Figure 17 It is a cross-sectional view showing a state where the mask is separated from the chute (A) and a state where the chute is moved in the horizontal direction (B).

[0033] Figure 18 It is a cross-sectional view showing a state where excess electronic components are sucked (A) and a state where the pusher is lowered to hold the receiving platform 250 in the holding hole (B).

[0034] Figure 19 (A)~ Figure 19 (G) is an explanatory diagram showing the order of supplying electronic components to the mask.

[0035] Figure 20 (A)~ Figure 20 (C) is an explanatory diagram showing the procedure for inverting the mask.

[0036] Figure 21 (A)~ Figure 21 (H) is an explanatory diagram showing the order of mounting and dismounting the support platform.

[0037] [Explanation of Symbols]

[0038] 1: Film forming device

[0039] 2: Supply device

[0040] 2a: Shell

[0041] 3: Film forming processing unit

[0042] 4: Control device

[0043] 31: Chamber

[0044] 32: Transport Department

[0045] 33: Preprocessing Department

[0046] 34, 35: Film forming section

[0047] 210: Containment

[0048] 211: Container

[0049] 211a, 225, 245: Partitions

[0050] 211b: Inclined surface

[0051] 212, 510: support platform

[0052] 212a: Feet

[0053] 220: chute

[0054] 221, 241, 251: plate body

[0055] 222: chute hole

[0056] 223: Next door

[0057] 230: Vibration mechanism

[0058] 231: Vibration table

[0059] 231b: Receiving hole

[0060] 232: Abutment

[0061] 240: Mask

[0062] 242: Mask hole

[0063] 243: Restriction hole

[0064] 244: Liang Department

[0065] 250, 250A, 250B: Supporting platform

[0066] 252, 261c: Support part

[0067] 253: Restriction Department

[0068] 260: Interval adjustment unit

[0069] 261, 294, 295, 296, 324, 371: Thrusters

[0070] 261a: Loading platform

[0071] 261b, 551a, Axc, Axm, Axs: Axes

[0072] 261d: Guide

[0073] 261e: Movable body

[0074] 262, 322, 520: driving source

[0075] 270: Mobile mechanism

[0076] 280: Transfer mechanism

[0077] 281, 601: Pickup mechanism

[0078] 282, 602: Guidance mechanism

[0079] 283, 603: Mobile

[0080] 284, 604: Adsorption part

[0081] 284a, 604a: adsorption plate

[0082] 284b, 604b: support plate

[0083] 284c, 293a, 411, 421, 604c: Pillars

[0084] 285, 605: Adsorption force imparting part

[0085] 285a, 605a: Magnetic components

[0086] 285b, 605b: retaining plate

[0087] 285c, 605c: connection / separation mechanism

[0088] 286, 606: Pillar Department

[0089] 287, 607: Arm

[0090] 288, 608: Guidance Department

[0091] 290: Transport Agency

[0092] 291: Motor

[0093] 291a, 530: Rotation axis

[0094] 292, 321: Rotating table

[0095] 292a: Holding hole

[0096] 293: Temporary platform

[0097] 311: Exhaust

[0098] 323: Sealed body

[0099] 331: Processing Room

[0100] 341, 351: Film forming room

[0101] 342, 352: Target

[0102] 360: Moving in and out department

[0103] 361, 412, 422: Arm

[0104] 362: Maintaining Body

[0105] 370: Load lock vacuum chamber

[0106] 400: Support platform moving mechanism

[0107] 410: Supporting platform mounting part

[0108] 413, 423: Maintenance

[0109] 420: Disassembly of the support platform

[0110] 500: Reversal mechanism

[0111] 540: Conducting Department

[0112] 550: Holding mechanism

[0113] 551: Holding arm

[0114] 552: Drive unit

[0115] 600: discharge mechanism

[0116] 610: Recycling Containers

[0117] 700: Testing agency

[0118] 710: Support frame

[0119] 720: Photography Department

[0120] C: Electronic components

[0121] Dx: moving distance

[0122] Dz: interval

[0123] E: Electrode

[0124] En: Internal electrode

[0125] F: Face

[0126] H: Holding member

[0127] h: position

[0128] P1: Transfer position

[0129] P2: Supply position

[0130] P3: Supporting platform loading position

[0131] P4: Reverse position

[0132] P5: Disassembly position of the bearing platform

[0133] P6: discharge position

[0134] P7: Check position

[0135] R: Electrode formation area

[0136] X, Y, Z: directions. DETAILED DESCRIPTION

[0137] An embodiment of the present invention (hereinafter referred to as the present embodiment) will be described in detail with reference to the drawings.

[0138] [Electronic components]

[0139] like Figure 1 As shown in (A), the electronic component C formed by this embodiment is a chip-shaped electronic component C with electrodes E made of a conductive material formed at both ends. Thus, the electronic component C has one end and the other end where the electrodes E are formed. For example, components such as capacitors, resistors, coils, and inductors are included in the electronic component C. The electronic component C has a rectangular parallelepiped, cubic, or thin plate-like shape, and the electrodes E are formed in close contact with each other in a box-like manner covering an area including a pair of opposing side surfaces. The area where the electrodes E are formed is referred to as the electrode formation area R.

[0140] Figure 1 (B) is a cross-sectional view of a laminated ceramic capacitor formed by laminating dielectric sheets having internal electrodes En as an electronic component C. A pair of electrodes E formed on the outer surface of the electronic component C is a multilayer structure in which multiple layers of conductive materials are stacked, and are electrically connected to the internal electrodes En of the electronic component C. In this embodiment, a copper (Cu) film is formed as a seed layer of the electrode E on titanium (Ti) as a base layer for improving adhesion. Thereafter, the copper (Cu) is attached to the electrode forming region R by electrolytic plating using the seed layer as a seed, thereby completing the electronic component C having the electrode E. Since the base layer or seed layer also becomes part of the electrode E, in the following description of this embodiment, the formation of these layers is also referred to as "forming a film of the electrode E."

[0141] In the following description, the straight line passing through the center of a pair of side surfaces covered by the electrode E is referred to as the axis Axc of the electronic component C. In this embodiment, for example, the electronic component C may be a very small rectangular electronic component having a length of 0.6 mm in the direction of the axis Axc, a length of 0.2 mm in the direction of the axis Axc of the electrode E, and a cross-section perpendicular to the axis Axc of the electrode E of 0.3 mm x 0.3 mm. However, the present invention is applicable to both smaller and larger electronic components C.

[0142] [summary]

[0143] like Figure 2As shown in FIG. 1 , the film forming apparatus 1 of this embodiment includes a supply device 2, a film forming processing unit 3, and a control device 4. Figure 1 As shown in (C), the supply device 2 supplies the electronic component C to the film forming processing unit 3 by inserting the electronic component C into the mask hole 242 in a state where the area other than one of the electrode forming regions R is masked. The film forming processing unit 3 forms a film of the electrode material in the electrode forming region R that is not masked and exposed. In the following description, the horizontal arrangement direction of the supply device 2 and the film forming processing unit 3 is set as the Y direction, the horizontal direction orthogonal thereto is set as the X direction, and the vertical direction is set as the Z direction. The electronic component C is inserted into the mask hole 242 so that the axis Axc is along the Z direction. In addition, as described below, the mask hole 242 is provided in the mask 240.

[0144] [Supply device]

[0145] like Figure 2 、 Figure 3 (A) Figure 3 (B) Figure 4 (A) Figure 4 As shown in FIG. 2B , the supply device 2 includes a housing 210 housed within the housing 2a, a chute 220, a vibration mechanism 230, a mask 240, a receiving platform 250, a spacing adjustment unit 260, a moving mechanism 270, a transfer mechanism 280, a conveying mechanism 290, a receiving platform moving mechanism 400, a reversing mechanism 500, a discharge mechanism 600, and a detection mechanism 700. The following describes the conveying mechanism 290 that conveys the mask 240 and other components to the various components, followed by a description of the other components.

[0146] (Transportation Agency)

[0147] like Figure 2 、 Figure 3 (A) Figure 3 As shown in (B), the transport mechanism 290 is a mechanism for transporting the mask 240 with the electronic component C inserted into the mask hole 242 between the supply device 2 and the film forming processing unit 3. The transport mechanism 290 of this embodiment includes a rotating table 292 that is intermittently rotated by a motor 291. The rotating shaft 291a of the motor 291 is a hollow cylindrical shape (see Figure 8 (A)~ Figure 8(D)). A plurality of holding holes 292a as through holes are formed at equal intervals on the rotating table 292. The receiving table 250 is held by the holding holes 292a. For example, each holding hole 292a is arranged in a direction parallel to the tangent of a circle in the circumferential direction of the rotating table 292, and is arranged at equal intervals in the circumferential direction. In addition, in the present embodiment, eight holding holes 292a are provided, so that eight masks 240 are held on the rotating table 292 at intervals of 45°. A step difference for holding the receiving table 250 on which the mask 240 is placed is formed on the inner edge of the holding hole 292a (refer to Figure 3 (B)).

[0148] Furthermore, as will be described later, a temporary table 293 is provided at the center of the rotating table 292. The temporary table 293 is a table for temporarily placing the receiving table 250A or the receiving table 250B on which the mask 240 is placed. Figure 8 (A)~ Figure 8 As shown in (D), the temporary table 293 is a circular plate-shaped body, which is horizontally supported and fixed by a support 293a. The support 293a is independently provided to the rotating shaft 291a in a manner passing through the inside of the rotating shaft 291a, so that even if the rotating table 292 rotates, the temporary table 293 does not rotate.

[0149] like Figure 2 As shown, the supply device 2 is provided with a transfer station P1, a supply station P2, a receiving platform placement station P3, a reversing station P4, a receiving platform disassembly station P5, a discharge station P6, and an inspection station P7. Each station P1 to station P7 is a station in the supply device 2 for performing various processes on the mask holding the electronic component C before or after film formation by the film forming processing unit 3. The rotating table 292 repeatedly rotates and stops intermittently so that each holding hole 292a of the rotating table 292 is located at each station. In the case of this embodiment, Figure 2 Hereinafter, each of the stations P1 to P7 will be described.

[0150] The transfer station P1 is a station where a transfer mechanism 280 described below is disposed and electronic components C are transferred between a storage portion 210 storing electronic components C before film formation and a chute 220 .

[0151] The supply station P2 is a station that transfers electronic components C between the film forming processing unit 3 and the supply device 2. In other words, the supply station P2 is a station that supplies electronic components C from the supply device 2 to the film forming processing unit 3 or returns electronic components C that have been film-formed in the film forming processing unit 3 to the supply device 2.

[0152] The receiving stage placement station P3 is a station where a receiving stage placement portion 410 of a receiving stage moving mechanism 400 described below is disposed, and the receiving stage 250B placed on the temporary stage 293 is placed on the mask 240 on the rotating stage 292 .

[0153] The reversing station P4 is a station where the reversing mechanism 500 described below is installed to reverse the mask 240 with the electronic component C inserted therein while being held by the two receiving platforms 250A and 250B. The reversing station P4 is provided with a pusher 295 (see FIG. 2 ) that moves the receiving platforms 250A and 250B holding the mask 240 between the holding hole 292a of the rotating table 292 and the reversing mechanism 500. Figure 9 (A)~ Figure 9 (G)).

[0154] The receiving platform removal station P5 is a station where a receiving platform removal unit 420 of a receiving platform moving mechanism 400 described below is disposed, and the receiving platform 250A turned upside down by inversion is removed from the mask 240 and placed on the temporary table 293 .

[0155] The discharge station P6 is a station where the discharge mechanism 600 described below is installed to remove and discharge the film-formed electronic components C from the mask 240. The discharge station P6 is provided with a pusher 296 (see FIG. 2 ) that moves the support table 250 carrying the mask 240 between the holding hole 292a of the rotating table 292 and the discharge mechanism 600. Figure 11 (A)~ Figure 11 (C)).

[0156] The inspection station P7 is a station where a detection mechanism 700 described below is installed to detect the presence of electronic components C that have not been discharged by the discharge mechanism 600 and remain on the mask 240 (see FIG. Figure 12 (A) and Figure 12 (B)).

[0157] Next, the mechanism of each station P1 to station P7 arranged in the supply device 2 will be described. Figure 3 (A)~ Figure 5 (B) will describe the transfer station P1 and the storage portion 210 , the chute 220 , the vibration mechanism 230 , the interval adjustment portion 260 , the moving mechanism 270 , and the transfer mechanism 280 disposed in the vicinity thereof.

[0158] (Containment Department)

[0159] The receiving portion 210 receives a plurality of electronic components C before forming electrodes E, that is, before film formation. The receiving portion 210 includes a container 211 and a support table 212. The container 211 is a box-shaped body with an upper opening, and a plurality of partitions 211a serving as recesses are provided on the horizontal inner bottom. The plurality of partitions 211a are arranged in a matrix, and each partition 211a receives a plurality of electronic components C that are previously inserted. A portion of the inner side surface of the container 211 has the following structure: it becomes an inclined surface 211b inclined toward the inner bottom, and the electronic components C inserted from the upper edge of the container 211 slide toward the inner bottom. The support table 212 is a table that supports the container 211 in the horizontal direction, such as Figure 3 As shown in (B), it is installed on the installation surface of the supply device 2 through four legs 212a.

[0160] (Chute)

[0161] The chute 220 guides the plurality of electronic components C transferred from the receiving portion 210 to each of the plurality of mask holes 242. Figure 5 (A) Figure 5 As shown in (B), the slide 220 includes a plate body 221, a slide hole 222, and a partition wall 223. The plate body 221 is a rectangular plate-like body. The slide holes 222 are multiple holes through which the electronic components C can pass one by one. Each slide hole 222 passes through in a direction perpendicular to the surface of the plate body 221, guiding the passing electronic components C to the mask hole 242. The slide hole 222 is a quadrangular pyramid shape that expands toward the side for inserting the electronic component C, that is, the upper end side, so that the electronic component C can easily enter. In addition, the straight line in the Z direction passing through the center of the slide hole 222 is set as the axis Axs.

[0162] The partition walls 223 are arranged in a grid pattern on the surface of the plate 221. The rectangular areas enclosed by the partition walls 223 form a plurality of partitions 225 arranged in a matrix. Multiple chute holes 222 are formed in a matrix within each partition 225. Specifically, the partition walls 223 include multiple chute holes 222, forming the partitions 225 to which the electronic components C are supplied. The positions of the partitions 225 correspond one-to-one with the positions of the partitions 211a of the storage section 210.

[0163] The interior of the chute 220 is divided into a plurality of sections 225 by partitions 223. Thus, when the electronic components C are guided to the mask holes 242, as described below, even if the chute 220 vibrates, the electronic components C supplied to each section 225 are prevented from moving to other sections 225 by the partitions 223, and instead enter the chute holes 222 within each section 225. Therefore, when the chute 220 vibrates, the electronic components C are prevented from moving to other sections and becoming unevenly distributed.

[0164] Furthermore, to supply and arrange a large number of electronic components C at once, the plate 221 of the chute 220 has a large surface area, which can cause deflection, bending, or strain. If this occurs, the electronic components C will tend to move toward specific portions of the plate 221, preventing uniform supply to the mask holes 242. The partition walls 223 are located throughout the area of ​​the plate 221 where the electronic components C are supplied, thereby functioning as beams, increasing the strength of the plate 221 and preventing deflection, bending, and strain.

[0165] Furthermore, the positions of the sections 225 of the chute 220 correspond one-to-one with the positions of the sections 211a of the receiving section 210. Furthermore, a plurality of electronic components C are pre-assigned to the sections 211a of the receiving section 210 for storage. Each section 211a then attracts and moves the stored electronic components C to the corresponding section 225 of the chute 220. This allows the electronic components C to be evenly distributed within the surface of the chute 220.

[0166] (Vibration mechanism)

[0167] The vibration mechanism 230 facilitates the insertion of the electronic component C into the mask hole 242 by vibrating the slide 220 or the mask 240 described below. Figure 3 (A) Figure 3 As shown in (B), the vibration mechanism 230 includes a vibration table 231 and a base 232. The vibration table 231 is a horizontal plate-like body. The base 232 is provided on the installation surface of the supply device 2, and supports the vibration table 231 at a position offset from the chute 220 along the X direction. That is, it is arranged in alignment with the conveying mechanism 290 described below. In addition, the vibration table 231 is supported on the base 232 at its other end in such a manner that one end thereof overlaps with the mask 240 conveyed by the conveying mechanism 290 when viewed from above. A receiving hole 231b for inserting the mask 240 and the supporting platform 250 described below is provided in the portion of the vibration table 231 that overlaps with the mask 240 conveyed by the conveying mechanism 290 when viewed from above. The chute 220 is supported on the vibration table 231 in the horizontal direction in such a manner that it is located above the receiving hole 231b.

[0168] The vibration table 231 is configured to vibrate by activating an oscillating element built into the base 232. This causes the chute 220, supported by the vibration table 231, to vibrate along with the chute 220. This vibration is then transmitted to the mask 240 and the receiving platform 250, which are in contact with the chute 220 and vibrate accordingly. The oscillating element can be, for example, an electromagnetic coil, a motor, or a piezoelectric element. The vibration direction and intensity can be set as appropriate.

[0169] (Mask)

[0170] like Figure 6 (A) Figure 6As shown in (B), the mask 240 includes a plate body 241, a mask hole 242, a limiting hole 243, and a beam portion 244. The plate body 241 is a circular plate-like member. The mask holes 242 are multiple holes that insert the electronic components C one by one through the slide slot holes 222 of the slide slot 220 overlapping the mask 240, and cover a portion of the electronic components C. Each mask hole 242 is a prism-shaped hole that passes through in a direction perpendicular to the surface of the plate body 241 and the axis Axc of the inserted electronic component C is consistent in the vertical direction. The straight line in the vertical direction passing through the center of the mask hole 242 is set as the axis Axm. The length of the mask hole 242 in the axis Axm direction is shorter than the length of the electronic component C in the axis Axc direction. More specifically, the length of the mask hole 242 in the axis Axm direction is the same as the length of the electronic component C in the axis Axc direction outside one of the electrode forming areas R. That is, the length of the mask hole 242 in the direction of the axis Axm is the same as the length of the non-sputtering region in the direction of the axis Axc of the electronic component C (see Figure 1 (C)).

[0171] The size of the cross-section perpendicular to the axis Axm of the mask hole 242 is sufficient to allow the electronic component C to be inserted by dropping it under its own weight, with the axis Axc oriented vertically. Specifically, the inner diameter of the mask hole 242 is sufficient to allow the electronic component C to pass through, and the cross-section perpendicular to the axis Axm of the mask hole 242 is slightly larger than the cross-section perpendicular to the axis Axc of the electronic component C, but smaller than the size required for insertion with the axis Axc tilted relative to the vertical. However, the size is set larger than necessary for press-fitting.

[0172] Furthermore, when forming the electrode E by sputtering described below, the size of the cross section perpendicular to the axis Axm of the mask hole 242 is preferably smaller than the size of the film forming material entering from the gap formed between the mask hole 242 and the electronic component C.

[0173] The mask hole 242 of this embodiment is in contact with the receiving platform 250 through the lower end of the inserted electronic component C, and only the electrode forming area R on the upper end side is exposed to cover the other areas (see FIG. Figure 1 (C)). Multiple mask holes 242 are arranged in a matrix within the plurality of partitions 245 arranged in a matrix. The position of each partition 245 coincides with the position of the partition 225 of the chute 220 that overlaps with it, and the position of the mask hole 242 in each partition 245 coincides with the position of the chute hole 222 in each partition 225. That is, the axis Axm of the mask hole 242 coincides with the axis Axs of the chute hole 222, and the opening at the lower end of the mask hole 242 matches the opening at the upper end of the chute hole 222 without any horizontal offset (XY direction, θ direction), thereby allowing the electronic component C to pass through.

[0174] The limiting hole 243 is a through-hole through which the limiting portion 253 of the support base 250, described below, is inserted to align the mask 240 with the support base 250 and prevent positional displacement. In this embodiment, the limiting hole 243 has a cylindrical shape corresponding to the shape of the limiting portion 253. The beam portion 244 is a thin plate fixed to the lower surface of the plate 241 so that the area outside the partition 245 is thicker. This increases the strength of the plate 241 and prevents bending or strain.

[0175] (supporting platform)

[0176] The support platform 250 is a platform that holds one or the other side of the mask 240 and is connected to one end or the other end of the electronic component C inserted into the mask hole 242. In this embodiment, the electronic component C is inserted into the mask hole 242 along the vertical direction, so the one end of the electronic component C connected to the support platform 250 becomes the bottom, and the other end on the opposite side becomes the top. In the following description, one end of the electronic component C and the end of the mask hole 242 corresponding thereto are referred to as the lower end, and the other end of the electronic component C and the end of the mask hole 242 corresponding thereto are referred to as the upper end. In addition, one side of the mask 240 held from below by the support platform 250 is referred to as the lower surface, and the other side on the opposite side is referred to as the upper surface. However, the directions of the electronic component C, the mask 240, and the mask hole 242 are not limited to this. In addition, there is a possibility that one of the two ends of the electronic component C becomes one end (lower end) and the other end (upper end) due to insertion into the mask hole 242. There is a possibility that one of the two surfaces of the mask 240 becomes one surface (lower surface) and the other surface (upper surface) due to inversion.

[0177] In this embodiment, as described below, when the mask 240 is reversed, a pair of receiving platforms 250A and 250B are used to hold the mask 240 (see FIG. Figure 20 (A)~ Figure 20 (C)). The pair of support platforms 250A and 250B can switch between the following states: a state in which the lower end of the electronic component C passing through the mask hole 242 contacts the lower surface of the mask 240; and a state in which the upper end of the electronic component C passing through the mask hole 242 contacts the upper surface of the mask 240.

[0178] The shapes of the first support platform 250 and the second support platform 250 are the same as those of the support platform 250A and the support platform 250B. In the following description, the support platform 250 is referred to as the support platform 250 without distinguishing between the support platform 250A and the support platform 250B. The support platforms 250 of this embodiment are all of the same size and shape. The functions are the same when any one of them is replaced. However, in order to facilitate the understanding of the reversal action, Figure 10 (A)~ Figure 10 (D) Figure 21(A)~ Figure 21 In (H), the receiving platform 250A is represented by a shaded circle, and the receiving platform 250B is represented by a black circle.

[0179] In addition, the electronic component C passes through the mask hole 242, as shown in FIG. Figure 1 As shown in (C), as long as the lower end surface of the electronic component C inserted into the mask hole 242 is at least flush with the surface of the mask 240 , the lower end surface of the electronic component C does not necessarily protrude from the mask hole 242 .

[0180] like Figure 7 (A) Figure 7 As shown in (B), the support platform 250 includes a plate body 251, a support portion 252, and a limiting portion 253. The plate body 251 is a circular plate-like member having the same diameter as the mask 240. The support portion 252 is a rectangular plate-like body fixed to one side of the plate body 251. When the mask 240 is overlapped on the support platform 250, the support portion 252 is provided at a position that blocks the lower end of the mask hole 242 in each partition 245. In addition, the support portion 252 is provided at a position where the mask 240 does not overlap with the beam portion 244.

[0181] The restriction portion 253 restricts (regulates) the distance between the overlapping receiving platform 250A and the receiving platform 250B (see Figure 20 (A) Figure 20 (B)). The limiting portion 253 of this embodiment is provided so as to protrude from the mutually facing surfaces of the overlapping supporting platforms 250A and 250B, and to be at the same height as each other. More specifically, the limiting portion 253 is a cylindrical pin protruding in the same direction as the support portion 252 fixed to one surface of the plate body 251. The limiting portions 253 of the supporting platforms 250A and 250B are in contact with each other when the supporting platforms 250A and 250B clamp the mask 240 with the electronic component C inserted in the mask hole 242. The front ends of the protruding pins in the limiting portions 253 of the supporting platforms 250A and 250B are at the same height from each supporting portion 252. Furthermore, the limiting portion 253 is provided at a position corresponding to the limiting hole 243 of the mask 240, and by being inserted into the limiting hole 243, the supporting platform 250 and the mask 240 are aligned during movement, and positional displacement is prevented.

[0182] Furthermore, the holding member H is formed by either the receiving platform 250A or the receiving platform 250B and the mask 240 supported thereby. Specifically, with the electronic component C inserted into the mask hole 242 of the mask 240 of the holding member H, film formation is performed in the film forming processing unit 3 on the electrode forming region R exposed from the mask hole 242.

[0183] (Interval adjustment unit)

[0184] Interval adjustment unit 260 (see Figure 3 (B)) The gap between the facing surfaces of the chute 220 and the mask 240 is adjusted. Specifically, as described below, the gap between the chute 220 and the mask 240 is adjusted to a position where the mask 240 and chute 220 contact each other (first position), a position where the chute 220 and the mask 240 are moved horizontally relative to each other (second position), and a position where the mask 240 and the support 250 are held in the retaining hole 292a (third position). In other words, the gap adjustment unit 260 of this embodiment is a lifting mechanism that raises and lowers the support 250 and the mask 240 between the first position, the second position, and the third position.

[0185] The first position is a position where the electronic component C is inserted from the chute 220 into the mask 240 by vibration (see Figure 9 (A)~ Figure 9 (G)), the second position is a position where the mask 240 leaves the chute 220 by the amount of the interval Dz and becomes a position where the upper end of the electronic component C inserted into the mask 240 does not interfere with the chute 220 (a position where the chute 220 and the mask 240 can move horizontally relative to each other) (refer to Figure 10 (A)~ Figure 10 (D)), the third position is the position where the chute 220 and the mask 240 are separated and standby (refer to Figure 18 (B)).

[0186] Furthermore, in order to make the upper end of the electronic component C in the second position not interfere with the chute 220, the distance of movement (the amount of the distance Dz) when the chute 220 and the mask 240 are relatively moved in the vertical direction (Z direction, the axis Axs direction of the chute hole 222) by the interval adjustment unit 260 is greater than the length of the electrode forming region R in the axis Axc direction and less than the length of the electronic component C in the axis Axc direction (refer to FIG. Figure 17 (A) Figure 19 (D)).

[0187] The electrode forming region R is a region where the electrode E is formed, and is therefore formed corresponding to a pair of two poles. Therefore, a region where the + and - of the two electrodes E are separated is required between the pair of electrode forming regions R. Therefore, the electrode forming region R becomes a region where a gap is left to achieve such polar separation. For example, it is also possible to Figure 1(C)) forms one of the electrodes E, sets a gap at the corner portion where the side surface is connected to the surface F, and sets the other portion as the other electrode E. That is, if the film forming area (electrode forming area R) is used as a reference, the interval Dz does not exceed the length of the axis Axc direction of the electronic component C. It is preferable to set it to a position as close as possible to the length of the axis Axc direction of the electrode forming area R in consideration of positioning errors during movement. In addition, it is preferable to set the interval Dz to a distance that can prevent the electronic component C contained in the mask hole 242 from being sucked out when suction is applied from above.

[0188] The gap adjustment unit 260 includes a pusher 261 and a drive source 262. The pusher 261 includes a mounting table 261a on which the receiving table 250 is mounted, and a shaft 261b that supports the mounting table 261a. The drive source 262 is a motor that moves the shaft 261b up and down.

[0189] (Mobile mechanism)

[0190] The moving mechanism 270 is a mechanism for relatively moving the chute 220 and the mask 240 in the horizontal direction in a manner that the axis Axs of the chute hole 222 and the axis Axm of the mask hole 242 deviate from each other, while the upper end of the electronic component C does not interfere with the chute 220 (see FIG. Figure 17 (B) Figure 19 (E)). The moving mechanism 270 of this embodiment is provided between the mounting table 261a and the shaft 261b, and moves the mounting table 261a to move the receiving table 250 and the mask 240 in the X direction. The moving mechanism 270 may be, for example, an air cylinder.

[0191] In order to realize such movement, a support portion 261c, a guide 261d, and a movable body 261e (see FIG. Figure 15 (A)~ Figure 17 (B)). Support portion 261c is a plate-shaped member connected to shaft 261b so as to face mounting platform 261a. Guide 261d is a rod-shaped member fixed to support portion 261c so as to extend in the X direction. Movable body 261e is a member having a recess that slidably fits into guide 261d. The recessed portion of movable body 261e is embedded in guide 261d, and the portion opposite the recessed portion is fixed to mounting platform 261a.

[0192] The air cylinder serving as the moving mechanism 270 is fixed to the support portion 261c at a position capable of pressing the movable body 261e. Pressing the movable body 261e by the moving mechanism 270 causes the movable body 261e and the mounting platform 261a connected thereto to move along the guide 261d. For example, the moving mechanism 270 moves the mask hole 242 by a distance Dx approximately half the horizontal length thereof, thereby causing the axis Axs of the chute hole 222 to be offset from the axis Axm of the mask hole 242.

[0193] (Transfer mechanism)

[0194] The transfer mechanism 280 is a mechanism for transferring the electronic components C between the receiving portion 210 and the chute 220. The transfer mechanism 280 is also a mechanism for removing the electronic components C other than the electronic components C inserted into the mask hole 242 from the chute 220. Figure 3 (A) Figure 3 (B) Figure 4 (A) Figure 4 As shown in FIG. 2 (B), the transfer mechanism 280 includes a pickup mechanism 281 and a guide mechanism 282 .

[0195] The pickup mechanism 281 is a mechanism for picking up electronic components C from the storage section 210 or the chute 220. The pickup mechanism 281 includes a movable body 283, a suction unit 284, and a suction force imparting unit 285. The movable body 283 moves between the storage section 210 and the chute 220. The movable body 283 is shaped like a prism on a sector-shaped pyramid and serves as a base member that carries the suction unit 284 and the suction force imparting unit 285. The movable body 283 is arranged so that it can be moved between the storage section 210 and the chute 220 via a guide mechanism 282.

[0196] The adsorption portion 284 is a unit portion for adsorbing electronic components C in order to pick up the electronic components C. The adsorption portion 284 includes an adsorption plate 284a, a support plate 284b, and a support column 284c. The adsorption plate 284a is a component for adsorbing electronic components C. The adsorption plates 284a are rectangular plate-like bodies respectively arranged at positions corresponding to the respective partitions 225 of the chute 220, and adsorb electronic components C by applying a magnetic force from the adsorption force applying portion 285 described below. The size of the horizontal surface of the adsorption plate 284a is smaller than the area surrounded by the partition wall 223 so as to be able to approach the chute hole 222 of each partition 225. In addition, the position of each adsorption plate 284a also corresponds to each partition 211a of the container 211.

[0197] The support plate 284b is a rectangular plate-shaped body on which the adsorption plate 284a is mounted. The support plate 284b is large enough to cover the entire area of ​​the chute hole 222 where the chute 220 is formed. The adsorption plate 284a and the support plate 284b are formed in a manner to have a thickness that allows magnetic force to pass through. The material of the adsorption plate 284a and the support plate 284b is not particularly limited, and can be metal or non-metal such as resin. For example, stainless steel is used as the adsorption plate 284a and the support plate 284b. The pillar 284c is a pillar that fixes the support plate 284b to the moving body 283. The upper end of the pillar 284c is fixed to the bottom of the moving body 283, and the lower end is fixed to the support plate 284b. As a result, the support plate 284b is supported in the horizontal direction at a distance from the bottom surface of the moving body 283.

[0198] The adsorption force imparting portion 285 imparts an adsorption force to the adsorption plate 284a. The adsorption force imparting portion 285 imparts a magnetic force for adsorbing the electronic component C to the surface of the adsorption plate 284a facing the receiving portion 210 via the support plate 284b. The adsorption force imparting portion 285 includes a magnetic member 285a, a retaining plate 285b, and a contact / separation mechanism 285c. The magnetic member 285a is, for example, a permanent magnet. The size of the horizontal surface of the magnetic member 285a is approximately the same as that of the adsorption plate 284a. The retaining plate 285b is approximately the same size as the support plate 284b of the adsorption portion 284 and is disposed between the support plate 284b and the bottom of the movable body 283. On the retaining plate 285b, the magnetic member 285a is respectively installed at a position corresponding to each adsorption plate 284a across the support plate 284b.

[0199] The connecting / separating mechanism 285c adsorbs and releases the electronic component C by moving the magnetic member 285a and the adsorption plate 284a relative to each other. The connecting / separating mechanism 285c of this embodiment is arranged at the bottom of the movable body 283, and supports the magnetic member 285a in a manner that allows it to be raised and lowered. For example, a cylinder is used as the connecting / separating mechanism 285c. The connecting / separating mechanism 285c supports the retaining plate 285b in the horizontal direction, so that the magnetic member 285a is lowered and contacts the support plate 284b, thereby allowing the adsorption plate 284a to exert the adsorption force caused by the magnetic force through the support plate 284b. Moreover, the connecting / separating mechanism 285c causes the magnetic member 285a to rise and leave the support plate 284b, thereby losing the adsorption force caused by the magnetic force in the adsorption plate 284a.

[0200] The guide mechanism 282 is a mechanism that moves the movable body 283 between the storage section 210 and the chute 220. The guide mechanism 282 includes a support column 286, an arm 287, and a guide 288. The support columns 286 are a pair of corner column members erected on the support platform 212 of the storage section 210. The arm 287 is a horizontal corner column member supported by the support columns 286, extending from a position above the container 211 to a position above the storage hole 231b of the vibration table 231. The guide 288 is a biaxial movement mechanism composed of a combination of linear guides in the X and Z directions, and is provided on the arm 287. The movable body 283 is supported on the guide 288 via a slider. Thus, the guide mechanism 282 can transfer the electronic component C adsorbed by the adsorption portion 284 between the storage section 210 and the chute 220.

[0201] Furthermore, the supply device 2 includes a transport unit that transports the mask 240 holding the electronic component C to the film forming processing unit 3. Figure 14 (A)~ Figure 14 As shown in (D), this embodiment includes a pusher 294 as a conveying unit. That is, the supply station P2 is provided with a pusher 294 that moves the receiving platform 250A carrying the mask 240 between the holding hole 292a of the rotating table 292 and the loading and unloading unit 360 described below.

[0202] like Figure 14 (A)~ Figure 14 As shown in (D), the pusher 294 includes a lifting mechanism (not shown) that transfers the receiving platform 250 carrying the mask 240 to the raised position ( Figure 14 (A)) and the retreat position ( Figure 14 (B)~ Figure 14 (D)) rises and falls.

[0203] Main Use Figure 8 (A)~ Figure 8 (D) will explain the platform moving mechanism 400 in which the platform is arranged at the placement station P3 and the platform removal station P5.

[0204] (Supporting platform moving mechanism)

[0205] The receiving platform moving mechanism 400 is a mechanism that moves the other receiving platforms 250 from the temporary platform 293 and places them on the receiving platform 250 carrying the mask 240. That is, the receiving platform moving mechanism 400 is set to a state where the mask 240 is clamped by two receiving platforms 250 so that the receiving platforms 250 overlap each other. In addition, the receiving platform moving mechanism 400 is a mechanism that, after the pair of receiving platforms 250 that overlap each other are reversed by the reversing mechanism 500 described below, moves the receiving platform 250 that is on the upper side of the pair of receiving platforms 250 to the temporary platform 293. Figure 2 As shown, the receiving platform moving mechanism 400 includes a receiving platform placement portion 410 and a receiving platform removal portion 420 .

[0206] The receiving platform placement unit 410 is disposed at a position where the receiving platform 250 can be moved between the receiving platform placement station P3 and the temporary platform 293 . Figure 8 (A) shows a state where the receiving platform 250 (250B) on the temporary platform 293 is held by the receiving platform placement portion 410. Figure 8 (B) shows a state of the receiving stage 250 placed in the receiving stage placement station P3 (a state in which the receiving stage 250B is placed on the receiving stage 250A via the mask 240).

[0207] As mentioned above, Figure 8 (A) Figure 8 As shown in (B), the receiving platform loading unit 410 moves the receiving platform 250 from the temporary platform 293 and places it on the receiving platform 250 carrying the inverted mask 240. As a result, at the receiving platform loading station P3, a pair of receiving platforms 250 clamp the mask 240. The receiving platform loading unit 410 includes a pillar 411, an arm 412, and a holding unit 413. The pillar 411 is a component that is erected in the vertical direction near the rotating table 292 in the receiving platform loading station P3. The arm 412 is a component that is supported by the pillar 411 at one end and extends to the horizontal direction of the temporary platform 293 at the other end. The holding unit 413 is a robot arm that is arranged in a manner that can move in the horizontal direction along the arm 412 and is arranged in a manner that can be raised and lowered. The holding unit 413 includes a suction mechanism that holds and releases the receiving platform 250 from above. The mechanism for holding the receiving platform 250 in the holding portion 413 may be a suction mechanism using negative pressure, an adsorption mechanism using electrostatic force or magnetic force, or a mechanical gripping mechanism.

[0208] The receiving platform removal unit 420 is disposed at a position where the receiving platform 250 can be moved between the receiving platform removal station P5 and the temporary platform 293 . Figure 8 (C) is a partial cross-sectional side view showing a state where the upper support 250 (250A) in the support removal station P5 is removed by the support removal unit 420. Figure 8(D) is a partial cross-sectional side view showing a state where the receiving platform 250 (250A) is placed on the temporary platform 293.

[0209] like Figure 8 (C) Figure 8 As shown in (D), the support platform disassembly unit 420 reverses the pair of overlapping support platforms 250 and moves the support platform 250 that is on the upper side of the pair of support platforms 250 to the temporary table 293. As a result, at the support platform disassembly station P5, a state is achieved in which the mask 240 is mounted on a support platform 250 that is different from the support platform 250 that was mounted before the reversal. For example, the mask 240 with the electronic components mounted on the support platform 250A inserted is reversed and is mounted on the support platform 250B. The support platform disassembly unit 420 includes a pillar 421, an arm 422, and a holding portion 423. The pillar 421 is a component that is erected in the vertical direction near the rotating table 292 in the support platform disassembly station P5. The arm 422 is a component that is supported by the pillar 421 at one end and extends to the horizontal direction of the temporary table 293 at the other end. The holding portion 423 is a robot arm that is arranged in a manner that can move in the horizontal direction along the arm 422 and is arranged in a manner that can be raised and lowered. The holding portion 423 includes a suction mechanism for holding and releasing the receiving platform 250 from above. The holding mechanism of the holding portion 423 can also be a suction mechanism or a gripping mechanism, similar to the holding portion 413.

[0210] Main Use Figure 9 (A)~ Figure 9 (G) will explain the reversing mechanism 500 disposed at the reversing station P4.

[0211] (Reversal mechanism)

[0212] The reversing mechanism 500 is a mechanism for reversing the mask 240 while the mask 240 is held by a pair of receiving platforms 250. Figure 9 (A)~ Figure 9 As shown in (G), the reversing mechanism 500 includes a support platform 510, a drive source 520, a rotating shaft 530, a transmission unit 540, and a holding mechanism 550. The support platform 510 is a component installed near the rotating table 292 in the reversing station P4. The drive source 520 is a motor supported by the support platform 510 to rotate a horizontal axis. The rotating shaft 530 is a shaft supported horizontally and rotatably by the upper end of the support platform 510.

[0213] The transmission unit 540 transmits the rotation of the shaft of the drive source 520 to the rotating shaft 530. The transmission unit 540 is a belt drive mechanism that transmits power via belts mounted on pulleys attached to the shaft of the drive source 520 and the rotating shaft 530. Alternatively, the drive source 520 may be a motor directly connected to the rotating shaft 530, directly driving the rotating shaft 530. In such cases, the transmission unit 540 may be omitted.

[0214] like Figure 10 (A)~ Figure 10 As shown in FIG. 2(D), the holding mechanism 550 is a mechanism for holding a pair of receiving tables 250 that sandwich the mask 240. The holding mechanism 550 includes a pair of holding arms 551, a shaft 551a, and a driving unit 552.

[0215] The pair of holding arms 551 can hold and release the pair of receiving platforms 250 that clamp the mask 240 by relatively moving with the drive unit 552 via the shaft 551a in directions of contact with and separation from the edges of the pair of receiving platforms 250. The holding arms 551 have a first contact surface that contacts the upper surface of the upper receiving platform 250 and a second contact surface that contacts the lower surface of the lower receiving platform 250. The first and second contact surfaces hold the edges of the pair of receiving platforms 250 from above and below.

[0216] The shafts 551a are respectively installed between the pair of holding arms 551 and connected to the driving unit 552. The driving unit 552 includes a cylinder and a compression spring, etc., which can move the pair of shafts 551a respectively installed on the pair of holding arms 551 along their axial directions to adjust the distance between the pair of holding arms 551.

[0217] Thus, the pair of holding arms 551 move relatively in the direction of contact with / separation from the edge portions of the pair of receiving platforms 250, for example, in a holding position ( Figure 10 (B) Figure 10 (C)) and the release position ( Figure 10 (A) Figure 10 Furthermore, the holding position of the support platform 250 on the holding arm 551 relative to the rotating table 292 is the same as the position h in the Z-axis direction (height direction) of the release position, and the movement of the support platform 250 between the rotating table 292 and the position h is as follows: Figure 9 (A) Figure 9 As shown in (B), this is performed by using a pusher 295 to move the receiving platform 250 up and down.

[0218] Main Use Figure 11 (A)~ Figure 11 (C) will explain the discharge mechanism 600 disposed at the discharge station P6.

[0219] (Discharge mechanism)

[0220] The discharge mechanism 600 is a mechanism for discharging and recovering the electronic components C after film formation from the mask holes 242. Figure 11 (A) Figure 11 (B) Figure 11 As shown in (C), the discharge mechanism 600 includes a picking mechanism 601, a guiding mechanism 602, and a recovery container 610. The electronic components C that have completed film formation are recovered in the recovery container 610. The picking mechanism 601 uses the mask 240 to adsorb and hold the electronic components C that have completed film formation and picks them up, and uses the recovery container 610 to release the adsorption and hold and open. The guiding mechanism 602 moves the picking mechanism 601 between the mask 240 located at the discharge station P6 and the recovery container 610. The picking mechanism 601 includes a moving body 603, an adsorption portion 604, and an adsorption force imparting portion 605. In addition, the discharge mechanism 600 is basically the same structure as the transfer mechanism 280. That is, the picking mechanism 601 and the guiding mechanism 602 have the same structure as the picking mechanism 281 and the guiding mechanism 282, and the movable body 603, the adsorption part 604, and the adsorption force imparting part 605 have the same structure as the movable body 283, the adsorption part 284, and the adsorption force imparting part 285 of the transfer mechanism 280.

[0221] The movable body 603 is provided so as to be movable between the mask 240 on the receiving platform 250 of the discharge station P6 and the recovery container 610 via the guide mechanism 602. The recovery container 610 is a box-shaped body with an upper opening. The adsorption unit 604 includes an adsorption plate 604a, a support plate 604b, and a pillar 604c. The adsorption plate 604a is provided corresponding to each partition 245 of the mask 240. The adsorption force imparting unit 605 includes a magnetic member 605a, a retaining plate 605b, and a contact / separation mechanism 605c. The adsorption plate 604a, the support plate 604b, and the pillar 604c have the same structure as the adsorption plate 284a, the support plate 284b, and the pillar 284e. The magnetic member 605a, the retaining plate 605b, and the contact / separation mechanism 605c have the same structure as the magnetic member 295a, the retaining plate 285b, and the contact / separation mechanism 285e.

[0222] The guide mechanism 602 includes a support 606 , an arm 607 , and a guide 608 similar to the support 286 , the arm 287 , and the guide 288 . The guide mechanism 602 can transfer the electronic components C sucked by the suction unit 604 between the mask 240 and the collection container 610 .

[0223] Main Use Figure 12 (A) and Figure 12 (B) describes the detection mechanism 700 disposed at the inspection station P7.

[0224] (Testing Agency)

[0225] The detection mechanism 700 detects whether or not the electronic components C remain on the mask 240 from which the electronic components C are discharged by the discharge mechanism 600. Figure 12 (A) Figure 12 As shown in FIG. 7B , the detection mechanism 700 includes a support frame 710 extending from the vicinity of the rotating table 292 to above the holding hole 292 a, and an imaging unit 720 supported by the support frame 710. The imaging unit 720 is a camera that is set to face downward so as to have a field of view capable of imaging the entire region where the mask holes 242 of the mask 240 are formed.

[0226] Next, use Figure 2 、 Figure 13 The film forming processing unit 3 will be described. Figure 13 Will Figure 2 The pre-processing unit 33 , the film forming unit 34 , and the film forming unit 35 are shown arranged in the figure.

[0227] [Film Forming Processing Department]

[0228] The film forming processing unit 3 is a device that forms a film on the portion of the electronic component C exposed from the mask hole 242, that is, the electrode forming region R, using plasma. Figure 2 、 Figure 13 As shown, the film forming unit 3 includes a chamber 31, a transport unit 32, a pre-processing unit 33, a film forming unit 34, and a film forming unit 35. The chamber 31 is a container whose interior can be evacuated by exhaust from an exhaust unit 311. The exhaust unit 311 includes piping and an exhaust circuit (not shown) connected to the exhaust port. The transport unit 32 includes a rotary table 321, a drive source 322, a sealing member 323, and a pusher 324.

[0229] The rotating table 321 is a circular table that intermittently rotates the receiving table 250, which has been loaded into the chamber 31, and moves it to various locations, such as the pretreatment unit 33, the film forming unit 34, the film forming unit 35, and the load lock unit described below. The sealing body 323 is a component used to seal each location and isolate it from the chamber 31. The sealing body 323 carries the receiving table 250 and is held in place by holding holes arranged at equal intervals on the rotating table 321. A pusher 324 raises and lowers the sealing body 323 to positions corresponding to the various locations within the film forming unit 3.

[0230] The pretreatment unit 33 performs surface treatment on the electrode forming region R using plasma. The surface treatment is, for example, ion bombardment, in which ions generated by the plasma in the processing gas clean the surface of the electrode forming region R. The pretreatment unit 33 includes a processing chamber 331, which is located at the top side of the chamber 31 and is sealed by a raised sealing body 323. The pretreatment unit 33 performs surface treatment on the electrode forming region R exposed from the mask 240.

[0231] The film forming units 34 and 35 perform a film forming process on the electrode forming region R of the electronic component C by sputtering. Sputtering is a process in which ions generated by plasma in the sputtering gas cause the film forming material ejected from the targets 342 and 352 to be deposited on the surface of the electrode forming region R. The film forming units 34 and 35 include film forming chambers 341 and 351, which are arranged on the top side of the chamber 31 and sealed by the rising sealing body 323. The film forming process is performed on the electrode forming region R exposed from the mask 240.

[0232] Targets 342 and 352 containing film-forming materials are provided in the film-forming chamber 341 and the film-forming chamber 351. Targets 342 and 352 are components formed of a film-forming material that is deposited on the electronic component C by sputtering to form a film. Targets 342 and 352 are held by a backing plate (not shown) and are connected to a power supply via electrodes. As a film-forming material for the base layer, for example, Ti is used, and as a seed layer for the electrode E, for example, Cu, Au, Ag, etc. are used. However, various materials can be applied as long as they are materials that can be formed into a film by sputtering. In addition, in the present embodiment, the base layer is formed in the film-forming section 34, and the seed layer for the electrode E is formed in the film-forming section 35. As a material for the base layer, for example, titanium (Ti) is used, and as a material for the seed layer for the electrode E, for example, copper (Cu) is used.

[0233] Furthermore, in this embodiment, two film forming units 34 and 35 are provided to form two layers, namely, the base layer and the seed layer. However, if the base layer is not required, only one film forming unit may be provided. Furthermore, if more layers need to be formed, two or more film forming units may be provided.

[0234] Furthermore, if Figure 2 and Figure 14 (A)~ Figure 14 As shown in (D), the film forming processing section 3 includes a loading interlock vacuum chamber 370, which enables the loading and unloading of the support table 250 carrying the mask 240 relative to the chamber 31 while maintaining the vacuum state in the loading and unloading section 360 and the chamber 31 for loading and unloading the support table 250 carrying the mask 240.

[0235] The loading and unloading unit 360 includes an arm 361 and a holding member 362. The arm 361 is a long member disposed between the supply device 2 and the chamber 31 in a direction parallel to the plane of the rotating table 321. The arm 361 is configured to intermittently rotate in 180-degree increments about an axis parallel to the rotation axis of the rotating table 321 and to move along the axis by a drive mechanism (not shown).

[0236] The holder 362 is a member provided at each end of the arm 361 and holds the support platform 250. The holder 362 holds the support platform 250 using a holding mechanism such as a vacuum chuck, an electrostatic chuck, or a mechanical chuck. The holder 362 also functions as a lid for opening and closing the load lock chamber 370. Specifically, a sealing material such as an O-ring is provided on the holder 362 to seal the load lock chamber 370.

[0237] The load lock chamber 370 allows the susceptor 250 to be moved in and out while maintaining the vacuum within the chamber 31. The load lock chamber 370 is a sealed space surrounded by a through hole in the chamber 31, a retaining member 362 of the loading / unloading unit 360, and the inner side surface of the sealing member 323 of the chamber 31. A pusher 371 is provided within the chamber 31 to raise and lower the sealing member 323 to a position corresponding to the load lock chamber 370.

[0238] Although not shown in the figure, the load lock chamber 370 is provided with an exhaust line connected to an air pressure circuit as a path for decompressing the sealed load lock chamber 370 , and a ventilation line connected to a valve, etc. for breaking the vacuum of the load lock chamber 370 .

[0239] [Control device]

[0240] The control device 4 is a device that controls each part of the film forming device 1 (see Figure 2 The control device 4 may include, for example, a computer running a predetermined program. The control device 4 is executed by a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU).

[0241] For example, the control device 4 controls the vibration of the vibration table 231 caused by the vibration mechanism 230, the lifting and lowering of the support table 250 and the mask 240 by the interval adjustment part 260, the movement of the slide 220 by the moving mechanism 270, the input and removal of the electronic parts C by the transfer mechanism 280, the transportation of the support table 250 by the conveying mechanism 290, the loading and unloading of the support table 250 relative to the chamber 31 by the loading and unloading part 360 and the loading interlock vacuum chamber 370, the plasma treatment by the pretreatment part 33, the film forming treatment by the film forming part 35, the transportation of the support table 250 by the conveying part 32, etc.

[0242] Furthermore, the control device 4 controls movement of the receiving stage 250 by the receiving stage moving mechanism 400, inversion of the mask 240 by the inversion mechanism 500, discharge of the electronic components C by the discharge mechanism 600, and detection of the presence of the electronic components C by the detection mechanism 700.

[0243] [action]

[0244] In addition to the Figure 1 (A)~ Figure 14 In addition to (D), also refer to Figure 15 (A)~ Figure 21 The explanatory diagram (H) of FIG. 1 illustrates the process of forming a film on an electronic component C by the film forming apparatus 1 of the present embodiment as described above. Figure 4 As shown in (A), multiple electronic components C are placed in advance in the container 211 of the storage section 210, and the multiple electronic components C are stored in each partition 211a. The number of electronic components C stored in each partition 211a is greater than the number of chute holes 222 in each partition 225 of the chute 220 and the number of mask holes 242 in each partition 245 of the mask 240. Furthermore, by grinding with a flat plate, etc., the positions of the electronic components C stored in each partition 211a can be averaged so that they are evenly spaced within each partition 211a.

[0245] Moreover, if Figure 15 As shown in (A), the receiving platform 250 carrying the mask 240 is placed on the supporting platform 261a of the pusher 261. At this time, by inserting the limiting portion 253 of the receiving platform 250 into the limiting hole 243 of the mask 240, the mask 240 and the receiving platform 250 are aligned and prevented from shifting. Figure 15As shown in (B), the pusher 261 at the transfer station P1 raises the mounting table 261a, thereby setting the mask 240 to the first position where the lower surface of the chute 220 contacts the lower surface of the chute 220. At this time, the lower end of the chute hole 222 coincides with the upper end of the mask hole 242. Moreover, at this time, the overlapping area of ​​the chute hole 222 and the mask hole 242 becomes larger than the surface F in the direction perpendicular to the axis Axc of the electronic component C (refer to Figure 1 The area of ​​(C)) is larger.

[0246] also, Figure 21 (A)~ Figure 21 (H) is an explanatory diagram showing the order of loading and unloading the receiving platform 250. More specifically, it is a diagram illustrating the process of transporting the receiving platform 250 carrying the mask 240 holding the completed film-formed electronic component C from the supply station P2 to the discharge station P6 via the reversing station P4. Figure 21 (A)~ Figure 21 (H) focuses on a certain mask 240 to explain the process. In the supply device 2 of this embodiment, when all masks 240 are mounted on the holding holes 292a of the turntable 292, the turntable 292 stops (positions) at each station P1 to station P7 and performs repeated rotation and conveying.

[0247] First, the operation of supplying the electronic components C to the mask 240 will be described. Figure 4 As shown in (A), the moving body 283 of the pickup mechanism 281 moves horizontally via the guide mechanism 282 and is positioned above the container 211. At this point, the holding plate 285b is lowered by the contact / separation mechanism 285c, and the magnetic member 285a contacts the support plate 284b. As a result, the magnetic attraction force acts on the attraction plate 284a via the support plate 284b.

[0248] The holding hole 292 a is positioned directly below the receiving hole 231 b of the vibration table 231 whenever the rotation table 292 stops due to intermittent rotation. Figure 3 (A) Figure 3 (B) shows a state where the support base 250 carrying the mask 240 with the electronic component C inserted therein is held by the holding hole 292a and positioned directly below the receiving hole 231b. Figure 4 As shown in FIG. 2A , the pusher 261 of the interval adjustment unit 260 moves the receiving platform 250 carrying the mask 240 between the holding hole 292a and the receiving hole 231b of the rotating platform 292. As a result, the proximity chute 220 and the mask 240 are brought into substantial contact.

[0249] Next, the guide mechanism 282 causes the movable body 283 of the pickup mechanism 281 to descend, so that each adsorption plate 284a approaches each partition 211a of the container 211. Thus, each adsorption plate 284a adsorbs and holds a plurality of electronic components C by magnetic force. Then, the guide mechanism 282 causes the movable body 283 of the pickup mechanism 281 to ascend, and the electronic components C are picked up from the container 211. Thereafter, the movable body 283 is moved horizontally by the guide mechanism 282 and positioned above the chute 220. Then, as shown in FIG. Figure 4 (B) Figure 16 (A) Figure 19 As shown in (A), the moving body 283 descends and the adsorption plate 284a approaches each partition 225 of the chute 220.

[0250] Afterwards, if Figure 16 (B) Figure 19 As shown in (B), the holding plate 285b is raised by the contact / separation mechanism 285c, and the magnetic member 285a leaves the support plate 284b, thereby releasing the magnetic force acting on each adsorption plate 284a. Therefore, the electronic components C adsorbed by each adsorption plate 284a fall to each partition 225 of the chute 220. Then, the movable body 283 is raised by the guide mechanism 282, whereby the adsorption plate 284a retreats from each partition 225 of the chute 220. In this way, the electronic components C are supplied to the chute 220. Thereafter, the holding plate 285b is lowered by the contact / separation mechanism 285c, and the magnetic member 285a is connected to the support plate 284b, thereby restoring the state in which the magnetic force acts on each adsorption plate 284a.

[0251] Then, the vibration mechanism 230 vibrates the vibration table 231, thereby vibrating the chute 220, the mask 240 and the receiving table 250. Figure 19 As shown in (C), the electronic components C housed in each partition 225 of the slide groove 220 enter the slide groove hole 222 one by one from the upper end side, and are guided in a manner such that the axis Axc becomes vertical in the process of passing through the slide groove hole 222 and fall into the mask hole 242.

[0252] The electronic component C that has entered the mask hole 242 contacts the support portion 252 of the receiving platform 250 at its lower end, and only the electrode forming region R on the upper end side is exposed from the mask hole 242. However, the electrode forming region R exposed from the mask hole 242 enters the chute hole 222. Furthermore, the electronic component C that has entered the chute hole 222 may also be placed on the electronic component C that has entered the mask hole 242.

[0253] Then, if Figure 17 (A) Figure 19As shown in (D), the gap adjustment unit 260 lowers the mounting table 261a, thereby moving the mask 240 away from the lower surface of the chute 220 and setting it to the second position. The gap Dz at this time is set to be equal to the height of the electrode forming area R exposed from the mask hole 242. As a result, the boundary between the electronic component C entering the chute hole 222 and the electronic component C entering the mask hole 242 is flush with the lower surface of the chute 220, allowing the chute 220 to move horizontally.

[0254] Then, if Figure 17 (B) Figure 19 As shown in (E), the support table 250, carrying the mask 240, is moved in the X direction by a moving distance Dx via the moving mechanism 270. The moving distance Dx is approximately half the horizontal length of the mask hole 242. In this way, by misaligning the axis Axs of the chute hole 222 and the axis Axm of the mask hole 242, the electronic component C entering the mask hole 242 is prevented from falling through the chute hole 222, and the vertical movement of the electronic component C entering the mask hole 242 is restricted by the bottom surface of the chute 220.

[0255] Furthermore, the moving distance Dx is not limited to a distance approximately half the horizontal length of the mask hole 242. Any distance is sufficient as long as the electronic component C is prevented from falling from the chute hole 222 and the vertical movement of the electronic component C entering the mask hole 242 is restricted. To prevent the electronic component C from moving between the chute hole 222 and the mask hole 242, the distance may be sufficient as long as the electronic component C moves to a position where the area of ​​the overlapping surface of the chute hole 222 and the mask hole 242 is smaller than the area of ​​the surface F perpendicular to the axis Axc of the electronic component C.

[0256] In the state described, Figure 18 (A) Figure 19 As shown in (F), the guide mechanism 282 moves the movable body 283 to the top of the chute 220 and then descends, whereby the adsorption plate 284a descends and approaches the partitions 225 of the chute 220. Thus, each adsorption plate 284a adsorbs and holds the electronic components C in each partition 225 by magnetic force. At this time, the magnetic force to be adsorbed acts not only on the electronic components C entering the chute hole 222, but also on the electronic components C entering the mask hole 242. However, the electronic components C entering the mask hole 242 are not adsorbed because their movement is restricted by the chute 220. Then, the movable body 283 is raised by the guide mechanism 282, and the electronic components C are picked up from the chute 220 and removed. Thereafter, the movable body 283 is moved horizontally by the guide mechanism 282 and moves horizontally to the top of the container 211. Furthermore, the movable body 283 descends, and the adsorption plate 284a approaches the partitions 211a of the container 211 (refer to Figure 4 (B) Figure 4(A)).

[0257] Subsequently, the contact / separation mechanism 285c raises the holding plate 285b, causing the magnetic member 285a to separate from the support plate 284b, thereby releasing the magnetic force acting on each attraction plate 284a. Consequently, the electronic components C attracted by each attraction plate 284a fall into each partition 211a of the container 211. Furthermore, the guide mechanism 282 raises the movable body 283, causing the attraction plates 284a to retreat from each partition 211a of the container 211. This removes the electronic components C from the chute 220.

[0258] Then, if Figure 18 (B) Figure 19 As shown in (G), the support table 250 carrying the mask 240 is lowered by the lowering of the support table 261a of the pusher 261, and the support table 250 is lowered to the third position where the support table 250 is held in the holding hole 292a of the rotating table 292. As a result, the mask 240 with the electronic component C inserted into the mask hole 242 is supplied to the rotating table 292 together with the support table 250. In addition, the moving mechanism 270 returns the support table 250 carrying the mask 240 to the initial position.

[0259] The pusher 261 then descends, withdrawing from the receiving platform 250 and the rotating platform 292. Furthermore, the rotating platform 292 intermittently rotates, positioning the receiving platform 250, held by the holding hole 292a, at the supply station P2. The loading / unloading unit 360 loads the receiving platform 250, positioned at the supply station P2 and carrying the mask 240 holding the electronic component C, into the chamber 31 via the load lock chamber 370. The loaded receiving platform 250 is held on the rotating platform 321 while being mounted on the sealing body 323.

[0260] Specifically, when the receiving table 250 on which the mask 240 holding the electronic component C is placed is carried in, Figure 14 As shown in (A), in the chamber 31 of the film forming unit 3, the lower end of the load-lock chamber 370 is sealed by a sealing member 323, which is urged by a pusher 371. Furthermore, the interior of the chamber 31 is evacuated by an air pressure circuit to achieve a vacuum. Furthermore, the loading / unloading unit 360 positions the holders 362, mounted on both ends of the arms 361, above the load-lock chamber 370 and at the supply station P2.

[0261] In the supply station P2, the pusher 294 applies force to the receiving platform 250 on which the mask 240 holding the electronic component C is placed, thereby raising the receiving platform 250 to a raised position for transfer to the loading and unloading section 360, and transferring the receiving platform 250 to the holding body 362 of the loading and unloading section 360. The holding body 362 holds the transferred receiving platform 250. After transferring the receiving platform 250 to the loading and unloading section 360, the pusher 294 descends and retreats to a retreat position (below the holding hole 292a of the rotating table 292) Figure 14 (B)~ Figure 14 (D)).

[0262] like Figure 14 As shown in (B), the arm 361 of the loading and unloading unit 360 is rotated to position the receiving platform 250 to face the upper opening of the load lock chamber 370. Figure 14 As shown in FIG. 3 (C), the arm 361 descends, and the holding body 362 seals the upper end of the load lock chamber 370. Thus, the load lock chamber 370 is sealed by the sealing body 323 and the holding body 362.

[0263] In this state, the load lock chamber 370 is depressurized to the same level as the chamber 31 by exhausting the air from the exhaust line through an air pressure circuit (not shown). The holder 362 releases the holder 250 and places the holder 250 on the sealing body 323 that seals the load lock chamber 370. Figure 14 As shown in FIG. 3 (D), the pusher 371 is lowered, and the receiving table 250 is mounted on the holding hole of the rotating table 321.

[0264] In this manner, the receiving stage 250 on which the mask 240 holding the electronic component C is placed is carried into the chamber 31 of the film forming processing unit 3 .

[0265] like Figure 13 As shown, the rotating stage 321 transports the receiving stage 250 to the pre-treatment section 33 and raises the sealing body 323 using the pusher 324. The receiving stage 250, carrying the mask 240 with the electronic component C inserted therein, is then placed in the processing chamber 331 and sealed. In the processing chamber 331, the electrode forming region R of the electronic component C exposed through the mask hole 242 is subjected to surface treatment.

[0266] The rotating table 321 then sequentially transports the receiving table 250 to the film forming section 34 and the film forming section 35. Similarly to the above, the seal 323 is raised and sealed by the pusher 324, and a film is formed in the electrode forming region R within the film forming chamber 341 and the film forming chamber 351. In this embodiment, a titanium film is formed in the film forming section 34, and a copper film is formed in the film forming section 35.

[0267] Thereafter, the rotating table 321 transports the receiving table 250 carrying the mask 240 holding the film-formed electronic component C to the loading and unloading position corresponding to the load lock vacuum chamber 370. The loading and unloading unit 360 unloads the receiving table 250 from the chamber 31 through the load lock vacuum chamber 370 by the reverse operation of the loading operation (see FIG. Figure 14 (D) → Figure 14 (C) → Figure 14 (B) → Figure 14 (A)). The unloaded receiving platform 250 is held by the holding hole 292a of the rotating platform 292 positioned at the supply station P2 of the supply device 2. At this time, in the following description, the receiving platform 250 held by the holding hole 292a is referred to as the receiving platform 250A.

[0268] Then, if Figure 21 As shown in (A), the receiving platform 250A is positioned as the receiving platform placement station P3 by the rotating platform 292. Then, as shown in FIG. Figure 8 (A) Figure 8 (B) Figure 21 As shown in FIG. 2B , the receiving stage 250B previously placed on the temporary stage 293 is held by the holding portion 413 of the receiving stage placement portion 410 and is superimposed on the mask 240 on the receiving stage 250A.

[0269] Figure 20 (A) is a diagram showing a state in which the receiving platform 250 is overlapped on the mask 240 mounted on the receiving platform 250A by the receiving platform mounting portion 410. Figure 20 As shown in (A), the mask 240 is sandwiched between a pair of support platforms 250A and 250B. The restriction portion 253 of the newly overlapped support platform 250B enters the restriction hole 243 of the mask 240 for alignment and prevents displacement. Furthermore, the spacing between the two support platforms 250 is defined by the restriction portion 253 of the opposite support platform 250A abutting against it.

[0270] The distance between the two overlapping receiving platforms 250 is set to be equal to or slightly greater than the axial length of the electronic component C. The two receiving platforms 250 have the same shape and size. Therefore, the protrusion of the restricting portion 253 of each receiving platform 250 is the same. Furthermore, the protrusion of the supporting portion 252 of each receiving platform 250 is the same. Therefore, twice the difference between the protrusion of the restricting portion 253 and the supporting portion 252 is set to be equal to or slightly greater than the axial length of the electronic component C. In other words, the difference between the protrusion of the restricting portion 253 and the supporting portion 252 is set to be half the length set to be equal to or slightly greater than the axial length of the electronic component C. Furthermore, the thickness of the plate 241 of the mask 240 is greater than the difference between the protrusion of the restricting portion 253 and the supporting portion 252, and less than twice the difference between the protrusion of the restricting portion 253 and the supporting portion 252. This thickness is such that the electrode forming region R of the electronic component C is exposed when the mask 240 overlaps the supporting portion 252. Due to this dimensional relationship, the limiting portion 253 of the other receiving platform 250 can be inserted into the limiting hole 243 provided in the plate 241 of the mask 240 placed on one receiving platform 250. Furthermore, even if the two overlapping receiving platforms 250 are inverted (turned over), the electrode forming area R at the other end of the electronic component C, whose one end is in contact with the other receiving platform 250, remains exposed to the same extent as before the inversion.

[0271] like Figure 9 (A) Figure 21 As shown in (C), a pair of receiving platforms 250A and 250B holding the mask 240 are positioned at the reversing station P4 by the rotating platform 292. Then, as shown in FIG. Figure 9 As shown in (B), the pusher 295 is used to raise the pair of support platforms 250A and 250B holding the mask 240, and the pusher 295 is moved upward so that the distance between the pusher 295 and the holding mechanism 550 becomes a distance that can convey the support platforms 250A and 250B (the distance at which the pusher 295 contacts the support platform 250B on the lower side), that is, the pusher 295 is positioned at position h. Then, the pair of holding arms 551 of the holding mechanism 550 clamps the pair of support platforms 250A and 250B. That is, the pair of holding arms 551 are moved upward. Figure 10 Move the open position shown in (A) to Figure 10 (B) is held in position. Then, as Figure 9 As shown in FIG. 5 (C), the pusher 295 moves downward so that the distance between the pusher 295 and the holding mechanism 550 becomes a distance that allows the pair of the receiving platform 250A and the receiving platform 250B to be reversed.

[0272] Then, if Figure 9 (D) Figure 9 (E), Figure 10 (C) Figure 21As shown in FIG. 5 (D), the holding arm 551 is rotated 180 degrees, so that the pair of receiving platforms 250A and 250B are reversed. Figure 20 (B) is a diagram showing the state of the mask 240 and the receiving platform 250A and the receiving platform 250B after the inversion at this time. By the inversion, the mask 240 is also inverted, so as shown in FIG. Figure 20 As shown in FIG. 2B , the mask 240 descends under its own weight and contacts the support 250 (support 250B) on the lower side. As a result, the electrode forming region R on the opposite side of the film-forming side of the electronic component C is exposed from the upper end of the mask hole 242 .

[0273] Then, if Figure 9 As shown in (F), the pusher 295 moves upward so that the distance between the pusher 295 and the holding mechanism 550 becomes a distance that can convey the support platform 250A and the support platform 250B (the distance at which the pusher 295 contacts the support platform 250B on the lower side), that is, it is positioned at position h. Figure 10 As shown in (D), a pair of holding arms 551 of the holding mechanism 550 releases a pair of support platforms 250A and 250B, as shown in the release position. Figure 9 As shown in FIG. 1 (G), the pair of receiving platforms 250A and 250B holding the mask 240 are lowered by the pusher 295 and returned to the holding hole 292 a of the rotating table 292 .

[0274] like Figure 21 As shown in (E), a pair of receiving platforms 250A and 250B holding the mask 240 are positioned at the receiving platform removal station P5 by the rotating platform 292. Figure 8 (C) Figure 21 As shown in (F), the upper side of the receiving platform 250A is held and removed by the holding portion 423 of the receiving platform removal portion 420. Figure 8 (D) Figure 21 As shown in (G), it is moved to the temporary stage 293 and placed.

[0275] Figure 20 (C) is a diagram showing a state in which the receiving platform 250A is removed from the mask 240 mounted on the receiving platform 250B by the receiving platform removal portion 420. Figure 20 As shown in (C), the mask 240 is placed on a receiving platform 250B which is a different receiving platform from the receiving platform 250A placed before the inversion.

[0276] Furthermore, if Figure 21 As shown in the supply station P2 in (F), the receiving table 250B carrying the inverted mask 240 passes through the discharge station P6, the inspection station P7, and the transfer station P1 by the rotating table 292 and is positioned at the supply station P2.

[0277] Next, at the supply station P2, as described above, the receiving table 250B carrying the inverted mask 240 is carried into the chamber 31 of the film forming processing unit 3 via the loading and unloading unit 360 through the load lock chamber 370. Within the chamber 31, the exposed electrode forming regions R are subjected to film forming as described above. Specifically, the electrode forming regions R at the ends of the electronic component C, which are opposite to the electrode forming regions R at which film forming has already been completed, are subjected to film forming. Thus, electrodes E are formed in the electrode forming regions R at both ends of the electronic component C. Thereafter, the receiving table 250B is returned to the holding hole 292a of the rotary table 292 in the supply station P2 via the loading and unloading unit 360 through the load lock chamber 370.

[0278] Furthermore, through the rotating table 292, the supporting table 250B carrying the mask 240 holding the electronic component C and having undergone film forming treatment with a pair of electrode forming areas R at both ends is intermittently rotated while passing through the supporting table loading station P3, the reversing station P4, the supporting table disassembly station P5, and is positioned at the discharge station P6.

[0279] At the discharge station P6, the electronic component C is discharged from the mask 240 by the discharge mechanism 600. Figure 11 As shown in (B), the moving body 603 of the pickup mechanism 601 is on standby at the discharge station P6. The magnetic member 605a is brought into contact with the support plate 604b by the connection / disconnection mechanism 605c, resulting in a state in which the magnetic attraction force acts on the attraction plate 604a. In this state, the pusher 261 at the discharge station P6 causes the mask 240 and the support platform 250B to rise together and approach the attraction plate 604a. As a result, each attraction plate 604a attracts and holds multiple electronic components C through magnetic force.

[0280] Then, the mask 240 is lowered by the pusher 261 and returned to the turntable 292, thereby picking up the electronic component C from the mask 240. As the mask 240 descends, the movable body 603 begins to move horizontally without changing its height through the guide mechanism 602. At this time, in order to allow the electronic component C held by the adsorption plate 604a to pass through without collision, the upper surface of the recovery container 610 is at the same height as the upper surface of the table 292. In this way, when the electronic component C is discharged, the time required to raise the movable body 603 in order to pick up the electronic component C is no longer required, thereby suppressing the cycle time. Moreover, by returning the mask 240 to the turntable 292 while performing this picking action, the turntable 292 can turn to the next rotation action, so there is no need to wait for the action of recovering the movable body 603 to the recovery container 610.

[0281] like Figure 11As shown in (C), after the movable body 603 stops above the recovery container 610, it descends to enter the recovery container 601, and the adsorption plate 604a stops at a position near the bottom of the recovery container 610. The holding plate 605b is raised by the connection / separation mechanism 605c, and the magnetic force acting on each adsorption plate 604a is released, so that the electronic components C adsorbed by each adsorption plate 604a fall into the recovery container 610. In this way, the electronic components C are released at a position near the bottom of the recovery container 610, thereby reducing damage to the electronic components C. The movable body 603 that has released the electronic components C rises, moves horizontally to the top of the discharge station P6 and waits. While the movable body 603 returns to the discharge station P6, the mask 240 can be moved to the discharge station P6 by the turntable 292, so that no extra waiting time is required.

[0282] Next, the receiving platform 250B carrying the mask 240 is positioned at the inspection station P7 by the rotating platform 292. Figure 12 (A) Figure 12 As shown in (B), the photographing unit 720 of the detection mechanism 700 photographs the mask 240. When the control device 4 can extract the electronic component C from the image, the electronic component C remains, and the device is stopped, and the operator takes out the electronic component C. Moreover, the operator can also identify the presence or absence of the electronic component C based on the image displayed on the display device. When there are no electronic components C remaining, the turntable 292 positions the receiving platform 250B at the transfer station P1. Thereafter, the electronic component C is transferred to the chute 220 by the transfer mechanism 280 in the same manner as described above. In addition, when the processing state in each part of the turntable 292 is a state in which the turntable 292 can rotate, the turntable 292 can be reversed, thereby discharging the electronic components C that are considered to be remaining during the inspection again at the discharge station P6 through the discharge mechanism 600.

[0283] [Effect]

[0284] (1) The present embodiment is a supply device 2 that supplies electronic components C to a film forming processing section 3 of a film forming device 1 that forms a film on an electronic component C. The supply device 2 includes: a mask 240 having a mask hole 242 that covers a portion of the electronic component C, so that the electronic component C is supplied to the film forming processing section 3 in a state where the electronic component C passes through the mask hole 242 and is held; a first supporting platform 250 that holds one side of the mask 240 and contacts one end of the electronic component C that passes through the mask hole 242; a second supporting platform 250 that holds the other side of the mask 240 and contacts the other end of the electronic component C that passes through the mask hole 242; and an inverting mechanism 500 that inverts the mask 240 while the mask 240 is clamped by the first supporting platform 250 and the second supporting platform 250.

[0285] The film forming apparatus 1 of the present embodiment includes a supply device 2 and a film forming processing unit 3 for forming a film on electronic components C.

[0286] Thus, a supply device 2, film-forming apparatus 1, and holding member H can be constructed that can collectively expose portions of a large number of electronic components C for film formation using a simple mechanism. Specifically, the length of the tip of the electrode forming region R protruding from the mask aperture 242 at the upper end of the electronic component C can be controlled by a support base 250 that contacts the lower end of the electronic component C, making position adjustment easy using a simple mechanism. This is effective when collectively exposing portions of a large number of electronic components C from the mask 240 for film formation. Furthermore, by holding the mask 240 with the support base 250 and inverting it, the end of the electronic component C where the electrode forming region R is protruding can be switched without replacing the electronic component C in the mask aperture 242, thereby facilitating film formation on both ends of the electronic component C. Furthermore, since the film-formed surface of the electronic component C is not squeezed out, causing the opposite surface to protrude, damage to the film-formed surface of the electronic component C during replacement of the electronic component C can be prevented.

[0287] (2) The first and second receiving platforms 250 have the same shape. Therefore, there is no need to distinguish between the upper and lower receiving platforms 250, eliminating the need to prepare separate receiving platforms 250. Consequently, the receiving platforms 250 can be placed in the same location, thereby minimizing the need for expansion of the device installation area and facilitating management of the receiving platforms 250. In particular, the upper surface of the receiving platform 250 is covered by the mask 240 during film formation, minimizing adhesion of film-forming material and eliminating the need to distinguish between used and unused surfaces.

[0288] (3) When the mask 240 is inverted, the gap between the first support 250 and the second support 250 in contact with the electronic component C is equal to or slightly larger than the length in the direction of the axis Axc of the electronic component C. Therefore, not only the lower end of the electronic component C, on which film formation has been completed, but also the upper end can be in contact with the support 250 or inverted with a slight gap therebetween. This prevents the upper end from strongly colliding with the support 250 during inversion, thereby preventing friction or damage to the film-forming surface caused by the collision.

[0289] (4) The first supporting platform 250 and the second supporting platform 250 include a limiting portion 253, which limits (regulates) the interval of the position in contact with the electronic component C by contacting each other in a state of clamping the mask 240. Therefore, the first supporting platform 250 and the second supporting platform 250 can be positioned with the mask 240 to prevent displacement. Moreover, there is no need to make special adjustments to the interval between the first supporting platform 250 and the second supporting platform 250. By overlapping each other to form a certain interval, the interval can be maintained during the movement. In addition, if the interval limited by the limiting portion 253 is greater than the length of the axis Axc direction of the electronic component C, the electronic component C will not contact the supporting platform 250, so the damage caused by friction is small.

[0290] (5) The limiting portions 253 of the first support platform 250 and the second support platform 250 are provided so as to protrude from the surfaces of the first support platform 250 and the second support platform 250 facing each other, and are arranged at the same height. Therefore, a pair of support platforms 250 including the limiting portions 253 protruding to the same extent can be reversed to function as the first support platform 250 and the second support platform 250.

[0291] (6) The supply device 2 includes: a temporary table 293 for temporarily placing the first receiving table 250 or the second receiving table 250; and a receiving table moving mechanism 400, which moves the first receiving table 250 or the second receiving table 250 from the temporary table 293 to the mask 240 to be reversed and overlaps them. After the reversal, the first receiving table 250 and the second receiving table 250 that is on the upper side are moved to the temporary table 293.

[0292] Therefore, by processing the new receiving platform 250 and the old receiving platform 250 through the common temporary platform 293, the moving path of the receiving platform 250 can be shortened and the operation related to the reversal can be performed efficiently. In addition, in this embodiment, the temporary platform 293 is arranged in the center of the rotating platform 292 to prevent the expansion of the space.

[0293] (7) The holding member H of this embodiment is used to hold the electronic component C in order to form a film on a part of the electronic component C by sputtering. The holding member H includes: a mask 240 having a plurality of mask holes 242 covering a part of the electronic component C, so that the electronic component C passes through the mask holes 242 and is held; and a supporting platform 250 that holds the mask 240 and contacts the end of the electronic component C passing through the mask holes 242. The mask hole 242 has an inner diameter that the electronic component C can pass through, and the length in the direction of the axis Axm is the same as the length of the non-sputtered area of ​​the electronic component C.

[0294] Therefore, by inserting the electronic component C into the mask hole 242 and bringing the end of the electronic component C into contact with the receiving platform 250 holding the mask 240, the electronic component C can be held in the mask hole 242 while maintaining a constant height. Furthermore, because the length of the mask hole 242 in the direction of the axis Axm is the same as the length of the electronic component C in the direction of the axis Axc outside the electrode forming region R, it is easy to expose the head of the electronic component C, where the electrode forming region R is exposed outside the mask hole 242. This allows the heads of a large number of electronic components C to be exposed collectively using a simple mechanism.

[0295] [Modification]

[0296] The present embodiment also considers the following modified examples.

[0297] (1) The support platform 250 may be formed as a flat surface without the support portion 252. Furthermore, the mask 240 may be formed as a flat surface by only including the plate 241 and excluding the beam portion 244. The support platform 250 and the mask 240 may be fixed or integrally formed.

[0298] The limiting portion 253 can be a member such as the pin described above, or a wall surrounding the mask 240. Furthermore, the limiting portion 253 can be omitted, and the spacing between the receiving platforms 250 can be limited by the electronic components C. In this case, one receiving platform 250 is placed on top of the other, and the other is reversed, with the receiving platforms 250 supported by both ends of the electronic components C. Since the limiting portion 253 is not required, the structure can be simplified.

[0299] (2) In the above-described embodiment, the receiving platform moving mechanism 400 includes two parts: a receiving platform loading part 410 and a receiving platform disassembly part 420. However, the receiving platform 250 can also be made into a device that moves the receiving platform 250 from the temporary platform 293 and moves the receiving platform 250 on the mask 240 to the temporary platform 293 by using one receiving platform moving mechanism 400.

[0300] (3) In the above embodiment, the magnetic member 285a and the magnetic member 605a of the adsorption force imparting portion 285 and the adsorption force imparting portion 605 are permanent magnets, but an electromagnet may also be used. In the above case, there is no need to provide a mechanism for connecting / separating the magnetic member 285a and the magnetic member 605a, and the presence or absence of the adsorption force caused by the magnetic force can be switched by switching the current. Moreover, even if the magnetic member 285a is an electromagnet, it can be combined with a mechanism for connecting / separating the magnetic member 285a and the magnetic member 605a. In the above case, the influence of the magnetic force can be reliably blocked by the mechanism for connecting / separating the magnetic member 285a, and even a small and lightweight electronic component C can be reliably released from the adsorption hold.

[0301] (4) The adsorption portion may include a suction port for holding the electronic component C by suction through negative pressure, and a suction pipe for supplying negative pressure to the suction port. In the case described, the adsorption force imparting portion is set as a negative pressure generating circuit that imparts suction force through negative pressure, and is connected to the suction pipe. Thus, even electronic components C that are difficult to adsorb by magnetic force and are of a material or shape can be adsorbed and held by negative pressure, and the adsorption can be released by stopping the negative pressure, thereby supplying the electronic component C. The opening area of ​​the suction port is set to be less than the area of ​​the smallest surface of the electronic component C. The suction port can be set as a large number of holes formed in the adsorption plate, and the suction port can also be covered with a porous material with air permeability. Thus, the suction port can be narrowed, thereby suppressing the electronic component C from being sucked into the suction pipe.

[0302] (5) The moving mechanism 270 only needs to move the mask 240 and the receiving platform 250 relative to the chute 220. In the present embodiment, the moving mechanism 270 is provided in the interval adjustment portion 260 to move the mask 240 and the receiving platform 250, but it can also be provided as a structure to move the chute 220. In the case described above, the chute 220 is supported by the vibration table 231 of the vibration mechanism 230 in a manner that allows relative movement. In addition, the moving mechanism 270 is provided between the vibration table 231 and the chute 220. The moving mechanism 270 can use, for example, an air cylinder to move the chute 220 relative to the vibration table 231 so as to move the chute 220 along the X direction. In this way, the chute 220 can be configured to move relative to the mask 240.

[0303] (6) The film forming processing unit 3 is not limited to an apparatus that performs film formation by sputtering. It may be an apparatus that forms the electrode E by applying a conductive material to the electrode forming region R exposed from the mask hole 242 of the mask 240, or it may be an apparatus that forms the electrode E by immersing the electrode forming region R in a conductive material.

[0304] (7) The chute 220 only needs to have at least one partition 225. That is, it can be one or more. The mask 240 only needs to have at least one partition 245, and the storage portion 211a only needs to have at least one partition 211a. That is, it can be one or more.

[0305] (8) The electrode forming region R may be a region on at least one end of the electronic component C, as long as it is a region on the outer surface of the electronic component C that is electrically connected to the internal electrode En. For example, the electrode forming region R may be a region on both ends or only one end of the electronic component C in the direction of the axis Axc. In other words, the film forming processing unit 3 may be capable of forming a film on at least one end of the electronic component C.

[0306] The electrode forming region R may be a partial region of the electronic component C. For example, it may be a box-shaped region including the surface F in the direction of the axis Axc of the electronic component C, or it may be only the surface F in the direction of the axis Axc of the electronic component C (see FIG. Figure 1 (A)~ Figure 1 (C)). That is, the mask hole 242 only needs to cover a portion of the electronic component C, and particularly includes a form that covers a portion or all of the side surface (surface along the axis Axc) of the electronic component C. When the mask hole 242 covers the entire side surface of the electronic component C, the electronic component C is held by the mask hole 242 in a state where only the surface F in the direction perpendicular to the axis Axc is exposed.

[0307] (9) In the above embodiment, Figure 9 During the reversal of (E), the pusher 295 is described as retreating (descending) to a position below the position h in such a manner that the distance between the pusher 295 and the holding mechanism 550 becomes a distance that allows reversal. However, the retreat position may also be below the rotating table 292. Even during the reversal operation, the rotating table 292 may be rotated as needed. Of course, in the case where the need is not assumed, as in Figure 9 (A)~ Figure 9 As shown in (G), the retreat position can be made as close to the holding mechanism 550 as possible. This can shorten the receiving time. In addition, a lifting mechanism can be provided in the reversing mechanism 500 to make the holding mechanism 550 retreat (rise) to a position above the position h. In the above case, Figure 9 (C)~ Figure 9 During (F), the pusher 295 stays at position h, and the holding mechanism 550 is Figure 9 (C) rises in Figure 9 Furthermore, the pusher 295 can cooperate with the reversing mechanism 500 to form the distance required for reversal. Thus, the time required for reversal can be shortened.

[0308] [Other embodiments]

[0309] While the embodiments and variations of the various parts of the present invention have been described above, these embodiments and variations are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms and can be omitted, replaced, combined, or modified without departing from the spirit of the invention. These embodiments and variations thereof are intended to be included within the scope and spirit of the invention and are also intended to be included within the invention as described in the claims.

Claims

1. A supply device for supplying electronic components to a film forming processing section of a film forming apparatus for forming a film on the electronic components, comprising: a mask having a mask hole covering a portion of the electronic component, so that the electronic component is supplied to the film forming processing section in a state of being passed through the mask hole and held; A first receiving platform holds one side of the mask and is in contact with one end of the electronic component passing through the mask hole; a second receiving platform, holding the other side of the mask and having the other end of the electronic component passing through the mask hole in contact with the second receiving platform; a reversing mechanism for reversing the mask while the mask is held by the first receiving platform and the second receiving platform; a temporary platform for temporarily placing the first bearing platform or the second bearing platform; and The receiving platform moving mechanism moves the first receiving platform or the second receiving platform from the temporary platform to overlap the inverted mask, and after inversion, moves the upper side of the first receiving platform and the second receiving platform to the temporary platform.

2. The supply device according to claim 1, wherein The first supporting platform and the second supporting platform have the same shape.

3. The supply device according to claim 1, wherein The first receiving platform and the second receiving platform include regulating portions that come into contact with each other while sandwiching the mask, thereby regulating a distance between positions that come into contact with the electronic component.

4. The supply device according to claim 3, wherein The restricting portions of the first and second receiving platforms are provided so as to protrude from surfaces of the first and second receiving platforms that face each other, and have the same height as each other.

5. A film forming device comprising: The supply device according to any one of claims 1 to 4; as well as The film forming processing unit forms a film on the electronic component.

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