Power supply device

Abstract

The application discloses a power supply device, comprising: a circuit board having a first side and a second side arranged oppositely, the circuit board is provided with at least a first heat-generating element, the first heat-generating element is arranged close to the second side; a fan is arranged on the first side of the circuit board for providing air flow for heat dissipation, wherein an air flow direction is defined from the first side to the second side; a first flow guide is arranged side by side with the first heat-generating element; and a second flow guide is arranged at least partially above the first heat-generating element and adjacent to the first flow guide, wherein the first flow guide, the second flow guide and the first heat-generating element form a first auxiliary air duct; wherein the air direction of the first auxiliary air duct is the same as the air flow direction, the power supply device increases the air flow rate and air flow required for heat dissipation of the first heat-generating element through the first auxiliary air duct. The application can improve the heat dissipation capacity of the power supply device.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power supply, in particular to a power supply device. BACKGROUND

[0002] With the increase of power density of power supply products, the requirement for system heat dissipation is also higher and higher. For the air-cooled system, the heat dissipation of the device downstream of the air duct has become the bottleneck of the heat dissipation of the air-cooled system. As shown in Figure 1A , a fan 1 is arranged on the left side of the power supply product, and an air duct is formed from the air inlet on the left side to the air outlet on the right side, and the airflow direction is from left to right. Since the height of the electronic components upstream of the air duct is high and densely distributed, and the transformers T1 and T2 have large power consumption and are located downstream of the air duct, it is difficult to meet the temperature requirement of the transformers T1 and T2, so it is necessary to improve the heat dissipation capacity of the system.

[0003] In view of the above problems, the prior art provides some solutions. For example, as shown in Figure 1B , one solution is to arrange a heat sink 2 on the printed wiring board (PWB) of the transformer T1 / T2 respectively, and make it contact with the PWB through point heat-conducting glue to achieve the purpose of heat dissipation. However, in this solution, the temperature of the transformer T1 / T2 under normal working condition is 126℃, which cannot meet the use requirement, and the implementation of the above solution requires long working hours and high material cost. Another solution is to select a fan with larger flow to enhance heat dissipation, but this solution will bring the problems of increased system energy consumption and noise.

[0004] Therefore, it is urgent to provide a new heat dissipation method to achieve the purpose of cooling the power supply product. SUMMARY

[0005] The present application aims to provide a power supply device which can solve the problem of high temperature of electronic components in the prior art, and effectively improve the heat dissipation capacity of the system.

[0006] To achieve the above object, the present application provides a power supply device, characterized in that the power supply device comprises: a circuit board having a first side and a second side arranged oppositely, the circuit board being provided with at least a first heat-generating element, the first heat-generating element being arranged close to the second side; a fan arranged on the first side of the circuit board for providing air flow for heat dissipation, wherein an air flow direction is defined from the first side to the second side; a first flow guide arranged side by side with the first heat-generating element; and a second flow guide arranged at least partially above the first heat-generating element and adjacent to the first flow guide, wherein the first flow guide, the second flow guide and the first heat-generating element form a first auxiliary air duct, wherein the air direction of the first auxiliary air duct is the same as the air flow direction, and the power supply device increases the air flow rate and air flow volume required for heat dissipation of the first heat-generating element through the first auxiliary air duct.

[0007] In an embodiment of the present application, the power supply device further comprises a casing, wherein the casing has a top and a bottom, the circuit board is arranged on the bottom of the casing, and the first flow guide and the second flow guide are both fixed on the top of the casing.

[0008] In an embodiment of the present application, the first flow guide and the second flow guide are both baffle blocks, and the thickness of the first flow guide is greater than the thickness of the second flow guide.

[0009] In an embodiment of the present application, the second flow guide has a first side wall, the first side wall is flush with the side wall of the first heat-generating element close to the casing, and a second auxiliary air duct is formed between the first side wall and the casing, wherein the air direction of the second auxiliary air duct is the same as the air flow direction.

[0010] In an embodiment of the present application, the cross section of the first flow guide and the cross section of the second flow guide form an L shape.

[0011] In an embodiment of the present application, the second flow guide has a second side wall, the second side wall is attached to the side wall of the first flow guide close to the first heat-generating element.

[0012] In an embodiment of the present application, the first flow guide and the second flow guide are integrally formed.

[0013] In an embodiment of the present application, the first flow guide has a groove, the opening of the groove faces the circuit board, a third auxiliary air duct is formed in the groove, and the air direction of the third auxiliary air duct has a third direction perpendicular to the air flow direction.

[0014] In an embodiment of the present application, a fourth auxiliary air channel is formed between the first flow guide and the first heat-generating element, the airflow of the fourth auxiliary air channel converges with the airflow of the third auxiliary air channel in the first auxiliary air channel, and the airflow direction of the fourth auxiliary air channel is the same as the airflow direction.

[0015] In an embodiment of the present application, the power supply device further comprises a third flow guide, which is arranged in a second direction opposite to the airflow direction and spaced apart from the first flow guide, wherein a third auxiliary air channel is formed between the third flow guide and the first flow guide, and the airflow direction of the third auxiliary air channel is perpendicular to the airflow direction.

[0016] In an embodiment of the present application, the third flow guide is spaced apart from the first heat-generating element, wherein a fourth auxiliary air channel is formed between the third flow guide and the first heat-generating element, the airflow of the fourth auxiliary air channel converges with the airflow of the third auxiliary air channel in the first auxiliary air channel, and the airflow direction of the fourth auxiliary air channel is the same as the airflow direction.

[0017] In an embodiment of the present application, the power supply device further comprises a first heat sink arranged in the airflow direction, and a second heat-generating element arranged on the circuit board and located between the fan, the first heat sink, and the first heat-generating element.

[0018] In an embodiment of the present application, the power supply device further comprises a flow guide plate arranged in a third direction perpendicular to the airflow direction, the flow guide plate is connected perpendicularly to the first heat sink and configured to guide part of the air-cooled airflow to the first heat-generating element.

[0019] In an embodiment of the present application, the first heat sink is provided with a wind guide groove configured to guide part of the air-cooled airflow to the first heat-generating element and the second heat-generating element.

[0020] In an embodiment of the present application, the wind guide groove is a plurality of wind guide grooves, and the plurality of wind guide grooves are arranged in the airflow direction.

[0021] In an embodiment of the present application, the first heat-generating element comprises a transformer.

[0022] In an embodiment of the present application, the first heat-generating element comprises a first transformer and a second transformer, the first transformer and the second transformer are arranged in the airflow direction and have the same height.

[0023] In an embodiment of the present application, the second flow guide is at least partially arranged above the second transformer and extends in a height direction to contact the magnetic core of the second transformer.

[0024] In an embodiment of the present application, the power supply device further comprises a second heat sink arranged along the airflow direction and located on a side of the second heat generating element away from the first heat sink and adjacent to a side wall of the casing; and / or a third heat sink arranged along the airflow direction and located downstream in the airflow direction, the third heat sink being adjacent to the second side.

[0025] In an embodiment of the present application, the first heat sink, the second heat sink, and / or the third heat sink are arranged above the circuit board.

[0026] In an embodiment of the present application, the first flow guide and the second flow guide are both made of foam material.

[0027] The present application realizes the purpose of cooling by improving the air speed and effective air volume flowing through the heat generating element. By using the present application, the air guide structure design can not only change the air flow speed and direction in two-dimensional space, but also change the air flow characteristics in three dimensions by at least partially arranging the second flow guide above the second transformer, and by combining the airflow of the fourth auxiliary air duct and the airflow of the third auxiliary air duct in the first auxiliary air duct. The present application has good heat dissipation effect, low manufacturing cost, and high work efficiency.

[0028] Additional aspects and advantages of the present application will be set forth in part in the following description, will be apparent from the description, or will be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0029] The above and other features and advantages of the present application will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings in which:

[0030] Figure 1A A structural schematic diagram of an existing power supply product;

[0031] Figure 1B A structural schematic diagram of a heat dissipation scheme of an existing power supply product;

[0032] Figure 2A A structural schematic diagram of a power supply device of a first embodiment of the present application;

[0033] Figure 2B A structural schematic diagram of a power supply device of a second embodiment of the present application; Figure 2A A sectional view along direction A-A in FIG. 6;

[0034] Figure 2C A sectional view along direction A-A in FIG. 6; Figure 2ACross-sectional view along the BB direction;

[0035] Figure 3A This is a schematic diagram of the power supply device according to the second embodiment of the present invention;

[0036] Figure 3B For along Figure 3A A cross-sectional view along the AA direction;

[0037] Figure 3C For along Figure 3A A cross-sectional view along the BB direction. Detailed Implementation

[0038] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that the invention will be thorough and complete, and the concept of the exemplary embodiments will be fully conveyed to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0039] In describing the elements / components / etc. described and / or illustrated herein, the terms “a,” “an,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc. The terms “comprising,” “including,” and “having” are used to indicate an open-ended inclusion and to mean that additional elements / components / etc. may exist in addition to those listed. Relative terms, such as “upper” or “lower,” may be used in the embodiments to describe the relative relationship of one component of the icon to another component. It is understood that if the device of the icon is flipped so that it is upside down, the component described as being on the “upper” side will become the component on the “lower” side. Furthermore, the terms “first,” “second,” etc., in the claims are used only as illustrative marks and are not intended to limit the number of objects to which they apply.

[0040] like Figures 2A-2C As shown, the power supply device 100 of the first embodiment of the present invention mainly includes a circuit board 10, a fan 20, a first current-carrying component 31, and a second current-carrying component 32. For example... Figure 2A As shown, the circuit board 10 has a first side S1 (i.e., ...) that is disposed opposite to each other. Figure 2A (left side) and second side S2 (i.e. Figure 2AThe circuit board 10 is provided with at least a first heat-generating element E1, such as a transformer, disposed close to the second side S2. A fan 20 is disposed on the first side S1 of the circuit board 10 for providing air flow for heat dissipation. In the present application, an airflow direction AD is defined from the first side S1 to the second side S2, which is parallel to the length direction L. For example, the air flow from the first side S1 to the second side S2 can be formed by the fan 20 through an air inlet formed on the first side S1 and an air outlet formed on the second side S2. In the present embodiment, the fan 20 can preferably include a first fan 21 and a second fan 22 disposed on the first side S1 (i.e. at an upstream position) and spaced apart along the width direction W, so as to form an air inlet 1 and an air inlet 2 on the first side S1.

[0041] By way of reference Figures 2A-2C In the first embodiment of the present application, the first flow guide 31 is disposed side by side with the first heat-generating element E1 along the width direction W (shown more clearly in Figure 2C ). The second flow guide 32 is disposed at least partially above the first heat-generating element E1 and adjacent to the first flow guide 31. Moreover, the first flow guide 31, the second flow guide 32 and the first heat-generating element E1 collectively form a first auxiliary air duct C1 (shown more clearly in Figure 2C ). The airflow direction of the first auxiliary air duct C1 is the same as the airflow direction AD. The power supply device 100 can increase the air flow rate and air flow volume required for heat dissipation of the first heat-generating element E1 through the first auxiliary air duct C1. Thus, the present application can achieve the purpose of cooling by improving the air flow rate and effective air volume flowing through the heat-generating element.

[0042] In some embodiments of the present application, the first heat-generating element E1 can include a transformer. As shown in Figure 2A , the first heat-generating element E1 can include a first transformer E11 and a second transformer E12, which are spaced apart along the airflow direction AD. In the first embodiment shown in Figures 2A-2C , the first transformer E11 and the second transformer E12 can have the same height. Moreover, the first transformer E11 and the second transformer E12 can be mounted on the circuit board 10 by a transformer circuit board 10e (as shown in Figure 2B ). It is understood, of course, that in other embodiments, the first heat-generating element E1 can be other electronic elements, the number of which can be one or more, and the heights of which can not be the same, which do not limit the present application.

[0043] In Figures 2A-2CIn the first embodiment shown, the second flow guide 32 can be disposed at least partially above the second transformer E12 and extend in the height direction H to contact the magnetic core of the second transformer E12.

[0044] In some embodiments of the present application, as shown in Figures 2A-2C The power supply device 100 can further include a housing 40. The housing 40 can have a top portion 41 and a bottom portion 42 disposed opposite in the height direction H. The circuit board 10 can be disposed on the bottom portion 42 of the housing 40. The first flow guide 31 and the second flow guide 32 can be fixed to the top portion 41 of the housing 40. The housing 40 can further have side walls 43 and 44 disposed opposite in the width direction W.

[0045] In some alternative embodiments, the first flow guide 31 and the second flow guide 32 can each be a baffle, which can be made of foam material, for example, but the present application is not limited thereto. As shown in Figure 2C The thickness h1 of the first flow guide 31 in the height direction H is greater than the thickness h2 of the second flow guide 32 in the height direction H.

[0046] In some alternative embodiments, with reference to Figure 2A and Figure 2C The second flow guide 32 can have a first side wall 321 flush with the side wall of the first heat-generating element E1 close to the side wall of the housing 40, as shown in Figure 2C wherein the first side wall 321 is flush with the side wall E121 of the second transformer E12. In addition, a second auxiliary air channel C2 (shown more clearly in Figure 2C ) can be further formed between the first side wall 321 of the second flow guide 32 and the housing 40, wherein the air flow direction AD of the second auxiliary air channel C2 is the same as the air flow direction AD, and the air flow F2 flowing through the second auxiliary air channel C2 can further increase the air flow rate and air flow volume required for heat dissipation of the first heat-generating element E1.

[0047] In the present embodiment, with reference to Figure 2A shown, the cross section of the first flow guide 31 in the length direction L and the cross section of the second flow guide 32 in the length direction L form an L shape. With reference to Figure 2C shown, the longitudinal section of the first flow guide 31 in the width direction W and the longitudinal section of the second flow guide 32 in the width direction W also form an L shape. In addition, the second flow guide 32 has a second side wall 322 attached to the side wall 311 of the first flow guide 31 close to the first heat-generating element E1.

[0048] In an embodiment of the present application, the first air flow member 31 and the second air flow member 32 can be independent components respectively manufactured. In other embodiments, the first air flow member 31 and the second air flow member 32 can also be integrally manufactured, which does not limit the present application.

[0049] In some embodiments of the present application, as shown in Figure 2B , the first air flow member 31 can also have a groove 310, and the groove 310 has an opening facing the circuit board 10, and a third auxiliary air duct C3 is formed in the groove 310. In combination with reference to Figure 2A , the air direction of the third auxiliary air duct C3 has a third direction D3 perpendicular to the air flow direction AD.

[0050] In some embodiments of the present application, as shown in Figure 2A , a fourth auxiliary air duct C4 can also be formed between the first air flow member 31 and the first heat generating element E1, for example, the fourth auxiliary air duct C4 can be formed between the first air flow member 31 and the first transformer E11. Moreover, the air flow F4 of the fourth auxiliary air duct C4 and the air flow F3 of the third auxiliary air duct C3 can converge in the first auxiliary air duct C1 to form the air flow F1 flowing through the first auxiliary air duct C1. Therefore, the air guide structure design of the present application can not only change the air flow rate and direction in two-dimensional space, but also change the air flow characteristics in three dimensions by at least partially arranging the second air flow member 32 above the second transformer E12, and converging the air flow of the fourth auxiliary air duct C4 and the air flow of the third auxiliary air duct C3 in the first auxiliary air duct C1. The air direction of the fourth auxiliary air duct C4 is the same as the air flow direction AD. Through the third auxiliary air duct C3 and the fourth auxiliary air duct C4, the air flow rate and air flow required for heat dissipation of the first heat generating element E1 can be further increased.

[0051] In some embodiments of the present application, as shown in Figure 2A , the power supply device 100 can also include a first heat sink 51 and a second heat generating element E2. The first heat sink 51 can be arranged to extend along the air flow direction AD, and the first heat sink 51 can be located at a position downstream in the air flow direction AD. The second heat generating element E2 can be arranged on the circuit board 10, and located between the fan 20, the first heat sink 51 and the first heat generating element E1, for example, in the electronic element area A2 in Figure 2A .

[0052] In some embodiments of the present application, as shown in Figure 2A , the power supply device 100 can also include a flow guide plate 60, which can be arranged to extend along a third direction D3 perpendicular to the air flow direction AD. The flow guide plate 60 is connected perpendicularly to the first heat sink 51, and is configured to be able to guide part of the air cooling flow to the first heat generating element E1.

[0053] AsFigure 2A As shown, the first heat sink 51 may also be provided with air guide slots 510, which can be configured to guide part of the air-cooled airflow to the first heating element E1 and the second heating element E2. Multiple air guide slots 510 may be provided, and these air guide slots 510 may be arranged at intervals along the airflow direction AD. Through the air guide slots 510 and the guide plate 60, the airflow through the first heating element E1 and the second heating element E2 can be increased. For example, the air-cooled airflow generated by the second fan 22 can be guided to the first heating element E1 and the second heating element E2.

[0054] In some embodiments of the present invention, the power supply device 100 may further include a second heat sink 52 and / or a third heat sink 53. The second heat sink 52 may extend along the airflow direction AD and be located on the side of the second heating element E2 away from the first heat sink 51, and adjacent to a side wall of the housing 40 (e.g., Figure 2C The third heat sink 53 can extend along the airflow direction AD and is located downstream in the airflow direction AD. The third heat sink 53 is close to the second side S2. Other electronic components can also be provided in the electronic component area A1 between the third heat sink 53 and the first heat-generating element E1. The first heat sink 51 and the third heat sink 53 are located on the other side wall of the housing 40 (e.g., side wall 43). Figure 2C Other electronic components may also be provided in the electronic component area A3 between the side walls 44).

[0055] In one embodiment of the present invention, the first heat sink 51, the second heat sink 52, and / or the third heat sink 53 may be disposed on the circuit board 10. In other embodiments, the first heat sink 51, the second heat sink 52, and the third heat sink 53 may also be thermally connected to power devices PE1, PE2, and PE3 respectively, for dissipating heat from the power devices PE1, PE2, and PE3 respectively.

[0056] like Figures 3A-3C The diagram illustrates the structure of a power supply device 100' according to a second embodiment of the present invention. (Compared to...) Figures 2A-2C Unlike the first embodiment shown, the power supply device 100' further includes a third airflow guide 33, which is spaced apart from the first airflow guide 31 along a second direction D2, opposite to the airflow direction AD. A third auxiliary airflow duct C3 is formed between the third airflow guide 33 and the first airflow guide 31 (refer to reference). Figure 3A and Figure 3B The third auxiliary air duct C3 has a third direction D3 that is perpendicular to the airflow direction AD.

[0057] In the embodiment, the third flow guide 33 is spaced apart from the first heating element E1, and a fourth auxiliary air channel C4 is formed between the third flow guide 33 and the first heating element E1. The airflow F4 of the fourth auxiliary air channel C4 and the airflow F3 of the third auxiliary air channel C3 converge to form the airflow F1 in the first auxiliary air channel C1. Figure 2A Similarly to the schematic embodiment shown in FIG. 1, Figure 3A The air guide structure of the embodiment shown in FIG. 2 not only changes the flow rate and direction of the airflow in two-dimensional space, but also changes the airflow characteristics in three dimensions by at least partially arranging the second flow guide 32 above the second transformer E12, and converging the airflow of the fourth auxiliary air channel C4 and the airflow of the third auxiliary air channel C3 in the first auxiliary air channel C1. The airflow direction of the fourth auxiliary air channel C4 is the same as the airflow direction AD. For example, the first flow guide 31 can be arranged side by side and spaced apart from the second transformer E12, and the first auxiliary air channel C1 is formed together with the second flow guide 32, and the third flow guide 33 can be arranged side by side and spaced apart from the first transformer E11 to form the fourth auxiliary air channel C4.

[0058] The present application reduces the temperature by improving the airflow rate and effective airflow volume through the heating element, and overcomes the problem in the prior art that the internal space of the power supply device is limited, and the temperature of the heating element downstream of the air channel cannot be further improved by adjusting the element layout.

[0059] Compared with the prior art, the present application has at least one of the following beneficial effects:

[0060] (1) Good heat dissipation effect. The present application can significantly reduce the temperature of the heating element in the power supply device, such as reducing the temperature of the MOS elements distributed on the transformer and the transformer circuit board, and improving the heat dissipation capacity of the product. According to the test results of the present application and the prior art, under the same conditions, the temperature of the transformer is reduced by at most 12℃, reaching 114℃, and the temperature of the MOS is reduced by 13℃, which can achieve the expected effect and make the product meet the design requirements.

[0061] (2) Low manufacturing cost. The prior art not only has an unsatisfactory heat dissipation effect, but also has a high manufacturing cost of the heat dissipation sheet (about 10.6 RMB). Compared with the prior art, the present application significantly reduces the cost by novel air channel design, and saves 9 RMB of material cost per product.

[0062] (3) High work efficiency. In the prior art, the fixed heat dissipation sheet requires additional manpower and waiting for the glue to solidify, so the work efficiency is low. Compared with the prior art, the present application is simpler to operate and takes less time, and does not require additional manpower.

[0063] Exemplary embodiments of the application are specifically illustrated and described herein. However, it will be appreciated that the application is not limited to the embodiments described, but rather, the application is intended to cover any modifications and equivalents included within the spirit and scope of the appended claims.

Claims

1. A power supply device, characterized in that, The power supply device includes: A circuit board having a first side and a second side disposed opposite to each other, the circuit board having at least a first heating element disposed near the second side; A fan is disposed on the first side of the circuit board for providing airflow for heat dissipation, wherein an airflow direction is defined from the first side to the second side; The first drainage component is arranged side by side with the first heating element; The second air intake element is at least partially disposed above the first heating element and adjacent to the first air intake element, wherein the first air intake element, the second air intake element and the first heating element form a first auxiliary air duct, wherein the airflow direction of the first auxiliary air duct is the same as the airflow direction, and the power supply device increases the air velocity and airflow required for the first heating element to dissipate heat through the first auxiliary air duct. The housing has a top and a bottom, the circuit board is disposed at the bottom of the housing, and the first drain member and the second drain member are both fixed to the top of the housing; A third auxiliary air duct, wherein the airflow direction of the third auxiliary air duct has a third direction perpendicular to the airflow direction; and A fourth auxiliary air duct, wherein the airflow of the fourth auxiliary air duct and the airflow of the third auxiliary air duct converge in the first auxiliary air duct, and the airflow direction of the fourth auxiliary air duct is the same as the airflow direction; Wherein, the third auxiliary air duct is formed between the third air guide and the first air guide, the third air guide is spaced apart from the first air guide along a second direction, the second direction is opposite to the airflow direction, and the third air guide is spaced apart from the first heating element, and the fourth auxiliary air duct is formed between the third air guide and the first heating element; or, the third auxiliary air duct is formed in a groove of the first air guide, the opening of the groove faces the circuit board, and the fourth auxiliary air duct is formed between the first air guide and the first heating element.

2. The power supply device according to claim 1, characterized in that, Both the first drainage component and the second drainage component are baffles, and the thickness of the first drainage component is greater than the thickness of the second drainage component.

3. The power supply device according to claim 2, characterized in that, The second draining element has a first sidewall, which is flush with the sidewall of the first heating element near the housing, and forms a second auxiliary air duct between the first sidewall and the housing, wherein the airflow direction of the second auxiliary air duct is the same as the airflow direction.

4. The power supply device according to claim 2, characterized in that, The cross-section of the first drainage element and the cross-section of the second drainage element form an L-shape.

5. The power supply device according to claim 4, characterized in that, The second drain has a second sidewall that is attached to the sidewall of the first drain near the first heating element.

6. The power supply device according to claim 4, characterized in that, The first drainage component and the second drainage component are integrally manufactured.

7. The power supply device according to claim 1, characterized in that, The power supply device further includes: A first heat sink is provided, extending along the airflow direction, and the first heat sink is located in the middle of the airflow direction; and The second heating element is disposed on the circuit board and located between the fan, the first heat sink and the first heating element.

8. The power supply device according to claim 7, characterized in that, The power supply device further includes: A deflector plate extends along a third direction perpendicular to the airflow direction. The deflector plate is perpendicularly connected to the first heat sink and is configured to guide a portion of the air-cooled airflow to the first heat-generating element.

9. The power supply device according to claim 7, characterized in that, The first heat sink is provided with an air guide groove, which is configured to guide part of the air-cooled airflow to the first heating element and the second heating element.

10. The power supply device according to claim 9, characterized in that, There are multiple air guide channels, which are arranged at intervals along the airflow direction.

11. The power supply device according to claim 1, characterized in that, The first heating element includes a transformer.

12. The power supply device according to claim 1, characterized in that, The first heating element includes a first transformer and a second transformer, which are spaced apart along the airflow direction and have the same height.

13. The power supply device according to claim 12, characterized in that, The second current-draining element is at least partially disposed above the second transformer and extends in the height direction to contact the magnetic core of the second transformer.

14. The power supply device according to claim 7, characterized in that, Also includes: The second heat sink extends along the airflow direction and is located on the side of the second heating element away from the first heat sink, and adjacent to a side wall of the housing; and / or, The third heat sink extends along the airflow direction and is located downstream in the airflow direction, and the third heat sink is close to the second side.

15. The power supply device according to claim 14, characterized in that, The first heat sink, the second heat sink, and / or the third heat sink are disposed on the circuit board.

16. The power supply device according to claim 1, characterized in that, Both the first drainage element and the second drainage element are made of foam material.

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