Integrated laying method of microelectromechanical sensor and asphalt road surface course

Abstract

The present invention provides an integrated laying method for a microelectromechanical sensor and an asphalt road surface layer, which is used for synchronously burying the microelectromechanical sensor on a newly built road surface, a reconstructed and expanded road surface, and a regularly maintained road surface. The road surface layer includes an upper layer and a lower layer, and the method includes: determining the spatial position of the microelectromechanical sensor to be laid on the road surface layer; designing and deploying the package of the microelectromechanical sensor according to the characteristics of the spatial position to achieve the expected values of compression resistance, waterproofness, and high temperature resistance; bonding and fixing the packaged microelectromechanical sensor to the lower layer; and completing the paving of the upper layer and the compaction of the road surface layer. The present invention avoids the adverse effects on the road surface structure caused by burying sensors by means of cutting joints, grooving, etc. after the road surface is formed, and solves the problems of high temperature influence, difficult maintenance, and difficult recovery of embedded sensors through the improvement of the microelectromechanical sensor package and materials.

Description

Technical Field

[0001] The invention relates to the technical field of road construction technology, and in particular to a method for paving an integrated micro-electromechanical sensor and an asphalt road surface layer. Background Art

[0002] During the construction of smart highways, a large number of embedded and external sensors are required to monitor road performance, traffic and environment in real time. At present, the embedding process of road sensors is to locate, cut and groove after the road construction is completed, and then place the sensors in the groove for backfilling. This method destroys the integrity of the road structure and reduces the smoothness of the road surface. There is a difference between the backfill material and the original material, which can easily cause damage and cracking at the interface and reduce the service life of the road surface. In addition, embedded sensors are easily affected by vibration and high temperature during the embedding process, have a low survival rate, and there is no precedent for recycling. Summary of the invention

[0003] The present invention provides a method for the integrated paving of a micro-electromechanical sensor and an asphalt road surface layer, which avoids the adverse effects of traditional methods such as slitting and grooving on the road surface structure. Through micro-electromechanical sensor packaging and material improvement, the problems of embedded sensors being affected by high temperatures, difficult to maintain, and difficult to recycle can be solved.

[0004] In order to achieve the above-mentioned invention object, the technical solution provided by the present invention is as follows:

[0005] A method for paving a micro-electromechanical sensor and an asphalt road surface layer in an integrated manner is used for synchronously burying the micro-electromechanical sensor on a newly constructed road surface, a rebuilt or expanded road surface, or a regularly maintained road surface. The road surface layer includes an upper layer and a lower layer. The method includes: determining the spatial position of the micro-electromechanical sensor on which the road surface layer is to be laid; designing and deploying the packaging of the micro-electromechanical sensor according to the characteristics of the spatial position; bonding and fixing the packaged micro-electromechanical sensor to the lower layer; and completing the paving of the upper layer and the compaction of the road surface layer.

[0006] In some embodiments, after marking the buried position of the micro-electromechanical sensor, the method further includes: determining the position of the micro-electromechanical sensor to be recovered; drilling a hole to take out a core sample with the micro-electromechanical sensor according to the position; processing the core sample to recover the sensing element; and milling and drilling the road surface of the core sample section.

[0007] In some embodiments, after bonding and fixing the packaged micro-electromechanical sensors to the lower layer, and before completing the paving of the upper layer and compacting the road surface, the method further includes: pre-burying the packaged micro-electromechanical sensors and cables in the asphalt mixture of the surface layer, and compacting them with a small mobile compactor.

[0008] In some embodiments, determining the spatial position of the MEMS sensors for paving the road surface layer includes: using RTK (Real-time kinematic positioning) positioning technology to determine the spatial position of the MEMS sensors for paving the road surface layer.

[0009] In some embodiments, the road surface further includes a middle surface layer, and the MEMS sensors are deployed at the bottom of the middle surface layer and the upper surface layer. After the lower surface layer is completed, a handheld RTK measuring instrument is used to clarify the longitude and latitude coordinates of the buried positions of the MEMS sensors, and the coordinate positions of the MEMS sensors are marked with handheld spray paint.

[0010] In some embodiments, designing and deploying the package of the MEMS sensors includes: integrating the MEMS sensors and components on a PCB board, fixing the PCB board in a bottom cover made of cast nylon material with screws, filling the inside of the bottom cover with high-temperature resistant silicone rubber. After the silicone dries, close the top cover made of cast nylon material with the bottom cover, lead out the power data line at the closing place, and cut a groove at the closing place to facilitate the subsequent recovery of the MEMS sensors.

[0011] In some embodiments, processing the core sample and recovering the sensing elements includes: knocking and breaking the core sample to take out the internal MEMS sensors, cutting and taking out the PCB board inside the MEMS sensors, using a silicone dissolving agent to dilute the filled silicone rubber, cleaning the PCB board, and taking out the sensing elements on the PCB board to achieve the recycling of the sensing elements.

[0012] In some embodiments, bonding and fixing the packaged MEMS sensors to the lower surface layer includes: at the spatial position, using high-temperature resistant epoxy resin to bond and fix the MEMS sensors to the lower surface layer.

[0013] In some embodiments, completing the paving of the upper surface layer and the compaction of the road surface layer includes: using a paver to complete the paving operation of the upper surface layer, and using a road roller to repeatedly roll the upper surface layer.

[0014] In some embodiments, milling and drilling the road surface of the core sample section includes: using a milling machine to mill the asphalt road surface from which the core sample is drilled out, with the milling depth in the range of 1 cm to 3 cm deeper than the depth of drilling the core sample, using a high-pressure blower and a water gun to wash the milled interface, and leaving time for drying in the sun.

[0015] The above technical solutions have at least the following beneficial effects compared with the prior art:

[0016] In the above solution, the microelectromechanical sensor not only has the characteristics of low power consumption, small size and high sensitivity, but also can be custom-packaged. By improving the packaging of the microelectromechanical sensor, the protection of the microelectromechanical sensor can be realized, and the survival rate of the microelectromechanical sensor during the high-temperature paving process of the asphalt pavement can be improved. In the reconstruction section and the maintenance and recycling section, by recycling and processing the packaged microelectromechanical sensor, the effective sensing elements therein can be further disassembled and recycled, so as to realize the recycling of the microelectromechanical sensor, save the construction cost of the intelligent road surface, and have certain economic efficiency and practicability.

[0017] The microelectromechanical sensor is integrally paved with the asphalt road surface layer, avoiding the construction process of positioning, cutting and grooving after the road surface construction is completed, and then placing the sensor in the groove for backfilling, thus solving a series of problems caused by this process, such as the damage of the integrity of the road surface structure, the reduction of the road surface flatness, the damage and cracking at the backfilling interface, and the reduction of the service life of the road surface.

[0018] In some implementable solutions, the packaging of the microelectromechanical sensor is designed and deployed. By externally encapsulating with cast nylon material to meet the compressive requirements and internally filling with high-temperature resistant silicone rubber to ensure waterproof sealing, it can withstand the vibration pressure and high-temperature influence generated during the road surface paving process, with a high survival rate. The series connection form is adopted for each deployment point and led out by a common wire, which can realize the power supply and data transmission of the microelectromechanical sensor. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figures 1 to 3 It is a flowchart of the integrated paving method of the microelectromechanical sensor and the asphalt road surface layer of the present invention;

[0021] Figure 4 It is a schematic diagram of the paving process of the integrated paving method of the microelectromechanical sensor and the asphalt road surface layer of the present invention;

[0022] Figure 5 It is a schematic diagram of the recycling process of the integrated paving method of the microelectromechanical sensor and the asphalt road surface layer of the present invention.

[0023] The descriptions of the reference numerals in the drawings are as follows:

[0024] 1. Microelectromechanical sensor; 2. Embedded surface layer material; 3. Paver; 4. Roller; 5. Milling machine; 6. Core drill; 7. Sensor marking position; 8. Surface course; 9. Middle course; 10. Bottom course; 11. Base course. Detailed implementation manners

[0025] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0026] Unless otherwise defined, the technical terms or scientific terms used in the present invention shall have the ordinary meanings understood by those of ordinary skill in the art to which the present invention pertains. The "first", "second" and similar terms used in the present invention do not denote any order, quantity or importance, but are only used to distinguish different components. Similarly, the terms such as "a", "an" or "the" do not denote a quantity limitation, but mean that there is at least one. The terms such as "comprising" or "including" mean that the elements or objects appearing before this term cover the elements or objects listed after this term and their equivalents, without excluding other elements or objects. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0027] It should be noted that the "upper", "lower", "left", "right", "front" and "rear" used in the present invention are only used to represent relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0028] The present invention provides a microelectromechanical sensor and an integrated laying method for an asphalt road surface layer to solve the problems of damaging the road surface caused by grooving and burying sensors during the service process of the road surface, and the low survival rate of sensors due to the influence of vibration and high temperature during the road surface laying process when pre-burying sensors in the road surface laying. The method is used for synchronously burying the microelectromechanical sensor 1 on newly built roads, reconstructed and expanded roads, and regularly maintained roads. Among them, in combination with Figure 1 and Figure 4 , the road surface layer includes the surface course 8 and the bottom course 10. The method includes the following steps:

[0029] S100: Determine the spatial position of the microelectromechanical sensor 1 of the road surface layer to be laid;

[0030] S200: Design and deploy the package of the microelectromechanical sensor 1 according to the spatial location characteristics;

[0031] S300: Bond and fix the packaged microelectromechanical sensor 1 to the underlying layer 10;

[0032] S400: Complete the paving of the upper layer 8 and the compaction of the road surface layer.

[0033] In the above embodiments, the microelectromechanical sensor 1 is integrally paved with the asphalt road surface layer, avoiding the construction process of positioning, cutting seams and grooving after the road surface construction is completed, and then placing the sensor in the groove for backfilling, thus solving a series of problems caused by this process, such as the damage of the integrity of the road surface structure, the reduction of the road surface flatness, the damage and cracking at the backfill interface, and the reduction of the service life of the road surface.

[0034] The microelectromechanical sensor 1 has the characteristics of low power consumption, small size and high sensitivity, and can be custom-packaged. Compared with traditional mechanical sensors, which detect and convert physical quantities such as pressure, displacement and force through mechanical movement or deformation. After long-term use of these sensors buried in the road surface, mechanical components will be permanently damaged and do not have the condition of being recyclable. While the microelectromechanical sensor 1 adopts micro-nano manufacturing technology to manufacture a tiny sensor structure through miniaturization and integration technology, and uses a microelectromechanical system to detect and convert physical quantities, including vibration, acceleration, inclination, and ultrasonic wave.

[0035] Through the external package protection of the microelectromechanical sensor 1, during the road surface paving process, it can effectively resist the high temperature and vibration caused by high-temperature asphalt paving. After long-term use buried in the road surface, due to its small size and high compressive performance, it is not easily damaged. In addition, during the process of re-paving the road surface, the packaged microelectromechanical sensor 1 can also be recycled to recycle the internal precision sensing elements.

[0036] In some embodiments, in combination with Figure 2 and Figure 5 , after step S400: Mark the burial position of the microelectromechanical sensor 1, the integrated paving method of the microelectromechanical sensor and the asphalt road surface layer provided by the present invention further includes:

[0037] S500: Determine the position of the microelectromechanical sensor 1 to be recycled;

[0038] S600: Drill a hole to take out the core sample with the microelectromechanical sensor 1 according to the position of the microelectromechanical sensor 1 to be recycled;

[0039] S700: Process the drilled core sample and recycle the sensing elements;

[0040] S800: Milling the road surface of the section where the core sample is drilled.

[0041] In the design concept of long-life asphalt pavement, considering the actual engineering cost, as the pavement layers increase gradually, the design life of each layer gradually shortens. Since the upper layer 8 is directly exposed to the environment and vehicle loads, its service environment is relatively harsh. In order to maintain the functionality of the surface layer, it will be milled and repaved within 5 to 10 years.

[0042] Combined with Figure 2 and Figure 5 , in the above embodiments, combined with the service cycle of the surface layer and the characteristics of construction and maintenance, in the reconstruction section and the maintenance and recycling section, according to the recorded RTK coordinate positions and burial depths, the marking of the buried position of the microelectromechanical inductor is carried out by spraying paint, and the position of the sensor mark 7 to be recycled is determined. A core drill 6 is used to drill cores from the middle layer 9 and the upper layer 8 where the sensor is buried. By recycling and processing the encapsulated microelectromechanical sensor 1, the effective sensing elements therein are further disassembled and recycled, thus realizing the recycling of the microelectromechanical sensor 1, saving the construction cost of the intelligent pavement, and having certain economy and practicability.

[0043] In some embodiments, after step S300: bonding and fixing the encapsulated microelectromechanical sensor 1 to the lower layer 10, and before step S400: before the paving of the upper layer 8 and the compaction of the pavement are completed, the method provided by the present invention further includes:

[0044] The encapsulated microelectromechanical sensor 1 and the cable are pre-buried with the asphalt mixture for surface layer paving, and compacted with a small mobile rammer.

[0045] The above embodiments are applicable to intelligent highways and urban roads paved with asphalt. The microelectromechanical sensor 1 can be pre-buried with the pre-buried surface layer material 2. Among them, the pre-buried surface layer material 2 can be selected from the surface layer asphalt mixture. A small plate compactor is used for compaction and vibration. After the microelectromechanical sensor 1 is covered and compacted by the asphalt mixture, the height of the covered aggregate is measured, and the aggregate height is controlled within 1.5 cm, so as to ensure the density of the filled asphalt mixture and prevent it from being pushed by the paving during the paving of the asphalt upper layer 8.

[0046] Combined with Figure 4 and Figure 5 , for long-life asphalt pavement, the pavement surface layer is laid on the road base 11. As the pavement layers increase gradually, the stress, strain, vibration, and temperature are different during the service process of each pavement layer, and the design life and materials of each layer will change accordingly. Optionally, the road surface layer includes the upper layer 8, the middle layer 9, and the lower layer 10. Among them, the upper layer 8 is directly exposed to the environment and vehicle loads, and its service environment is relatively harsh. The bottom of the encapsulated microelectromechanical sensor 1 can be located in the middle layer 9, and the upper layer 8 covers the top of the microelectromechanical sensor 1. During the paving process of the pavement, a slipform paver 3 can be selected to complete it.

[0047] In the above embodiments, the slipform paver 3 includes a roller and a vibrating rod. In the step of pre-burying the packaged microelectromechanical sensor 1, the pre-buried surface layer material 2 can adopt the asphalt mixture paved by the middle surface layer 9, and AC-13 asphalt mixture can be selected to pre-bury the microelectromechanical sensor 1. A small plate compactor is used for compaction and vibration. After the microelectromechanical sensor 1 is covered and compacted by the material of the middle surface layer 9, the height of the covered aggregate is measured, and the aggregate height is controlled within 1 cm, and the aggregate height must be lower than the height of the roller and the vibrating rod of the slipform paver 3, so as to reduce the disturbance to the sensor and ensure the paving quality of the road surface.

[0048] In some embodiments, step S100: Determine the spatial position of the microelectromechanical sensor 1 on the road surface layer to be paved, including: using RTK (Real-time kinematic positioning) positioning technology to determine the spatial position of the microelectromechanical sensor 1 on the road surface layer to be paved.

[0049] In the above embodiments, the road surface further includes a middle surface layer 9, and the microelectromechanical sensor 1 is deployed at the bottom of the middle surface layer 9 and the upper surface layer 8. After the lower surface layer 10 is completed, a handheld RTK measuring instrument is used to clarify the longitude and latitude coordinates of the buried position of the microelectromechanical sensor 1, and the coordinate position of the microelectromechanical sensor 1 is marked with a handheld spray paint.

[0050] In some embodiments, step S200: Design and deploy the package of the microelectromechanical sensor 1, including: integrating the microelectromechanical sensor 1 and components on a PCB board, fixing the PCB board in the bottom cover made of cast nylon material with screws, and filling the inside of the bottom cover with high-temperature resistant silicone rubber. After the silicone dries, close the top cover made of cast nylon material with the bottom cover, lead out the power data line at the closing place, and cut a groove at the closing place for the subsequent recovery of the microelectromechanical sensor 1.

[0051] In some embodiments, step S700: Process the drilled core sample and recover the sensing element, including: knocking and crushing the core sample to take out the internal microelectromechanical sensor 1, cutting and taking out the PCB board inside the microelectromechanical sensor 1, using a silicone dissolving agent to dilute the filled silicone rubber, cleaning the PCB board, and taking out the sensing element on the PCB board to realize the recycling of the sensing element.

[0052] In the above embodiments, in combination with Figure 5, a core drill 6 can be used to drill cores from the intermediate layer 9 and the surface layer 8 where the sensors are buried. In one embodiment, the surface layer 8 is 3 cm thick and the intermediate layer 9 is 4 cm thick. Therefore, the core drilling depth can be set to 8 cm to 9 cm. The core samples are taken to the laboratory, the internal sensors are taken out by knocking and breaking, the outer package of the microelectromechanical sensor 1 is cut by a cutting machine, and the silicone rubber filled in the microelectromechanical sensor 1 is diluted with a silicone solvent to obtain the PCB board of the sensor, and the sensor components in the PCB board are recycled.

[0053] In some embodiments, step S300: Bond and fix the packaged microelectromechanical sensor 1 to the bottom layer 10, including: At the spatial position where the microelectromechanical sensor 1 needs to be laid, use high-temperature resistant epoxy resin to bond and fix the microelectromechanical sensor 1 to the bottom layer 10.

[0054] In the above embodiment, a two-component high-temperature resistant epoxy resin can be used to bond the packaged microelectromechanical sensor 1 to the top of the bottom layer 10. Mix the two-component high-temperature resistant epoxy resin in a ratio of 1:1, apply the mixed glue to the marked position on the top of the bottom layer 10 and the bottom of the packaged microelectromechanical sensor 1, and place it for a sufficient time as required to make the two firmly bonded.

[0055] In some embodiments, step S400: Complete the paving and compaction of the surface layer 8, including: Use a paver to complete the paving operation of the surface layer 8, and use a road roller 4 to repeatedly roll the surface layer 8.

[0056] Specifically, the paving operation of the surface layer in the buried area can be completed by a slipform paver 3, and a roller compactor is used for compaction. More specifically, the paving operation of the intermediate layer 9 is completed by a slipform paver 3, and the intermediate layer 9 is repeatedly rolled by a road roller 4 to complete the paving of the intermediate layer 9. Then, the paving operation of the surface layer 8 is completed by a slipform paver 3, and the surface layer 8 is repeatedly rolled by a roller 4 to complete the paving of the surface layer 8.

[0057] In some embodiments, in step S800: Milling the road surface of the core-drilled sample section, including: Use a milling machine 5 to mill the asphalt road surface from which the core samples are drilled. The milling depth is in the range of 1 cm to 3 cm deeper than the depth of drilling the core samples. Use a high-pressure blower and a water gun to wash the milled interface, and leave time for drying in the sun.

[0058] In the above embodiment, a milling machine can be used to mill the upper layer 8 and the middle layer 9. In one embodiment, the upper layer 8 is 3 cm, the middle layer 9 is 4 cm, and the overall milling depth is controlled within 10 cm. After the milling is completed, a high-pressure blower and a water gun are used to rinse the milled interface and dry it in the sun to create good conditions for the subsequent surface paving. Afterwards, on the milled lower layer 10, according to steps S100 to S400, the positioning and embedding of the sensors of the maintenance section are completed.

[0059] In summary, combined Figure 3 The present invention provides an optional embodiment, which can integrate the micro-electromechanical sensor and the road surface layer during the construction phase, and is conducive to the maintenance and recovery of the micro-electromechanical sensor 1 when the road service cycle exceeds, the sensor is damaged, or the road is rebuilt. The embodiment can be described as the following steps:

[0060] S1 sensor positioning: Use RTK (Real-time kinematic positioning) positioning technology to determine the buried position of MEMS sensor 1;

[0061] S2 sensor packaging: The external packaging is made of cast nylon material to meet the pressure resistance requirements, and the internal packaging is filled with high-temperature resistant silicone rubber to ensure waterproof and airtightness. Each deployment point is connected in series with a wire to achieve power supply and data transmission of the micro-electromechanical sensor 1;

[0062] S3 sensor fixing: at the buried position, the micro-electromechanical sensor 1 is bonded to the underlying layer 10 using a high temperature resistant epoxy resin;

[0063] S4 pre-embedding treatment: the micro-electromechanical sensor 1 and the cable are pre-embedded using the asphalt mixture paved in this layer, and compacted using a small mobile compactor;

[0064] S5 Surface paving: Carry out paving work on the surface layer. The paver completes the surface paving work in the buried area and compacts it with a roller roller;

[0065] S6 sensor marking: marking the buried position of the MEMS sensor 1 according to the recorded RTK coordinate position and buried depth, and determining the position of the recovered sensor;

[0066] S7 sensor recycling: Take out the asphalt mixture where the sensor is buried into the laboratory by drilling and coring. Take out the internal MEMS sensor 1 by knocking and breaking it, and cut out the PCB board inside the MEMS sensor 1. Use silica gel solvent to dilute the filled silica gel and clean the PCB board. Finally, take out the sensing element on the PCB board to realize the recycling of the sensing element;

[0067] S8 surface milling: Use a milling machine to mill the asphalt pavement with drilled cores. The milling depth should not be less than the core drilling depth, and the designed depth should be 1cm to 2cm greater than the core drilling depth. Then use a high-pressure blower and water gun to rinse the milled interface, and finally dry it in the sun.

[0068] Afterwards, positioning of the micro-electro-mechanical sensor 1, re-embedding and embedding of the micro-electro-mechanical sensor 1 in the maintenance section can be completed according to the process flow from S1 to S8.

[0069] Compared with the current method of directly burying sensors by grooving in the road surface, the method for integrated paving of micro-electromechanical sensors and asphalt road surface provided by the present invention pre-buries the sensors in the road surface during the paving or maintenance of the surface layer, avoiding grooving again to damage the road surface, which not only improves the efficiency of sensor burying, but also ensures the flatness of the road surface and the integrity of the road surface structure. Through the packaging and material improvement of the micro-electromechanical sensor 1, the problems of embedded sensors being affected by high temperatures, difficult maintenance, and difficult to recycle are solved.

[0070] There are a few points to note:

[0071] (1) The drawings of the embodiments of the present invention only relate to the structures related to the embodiments of the present invention, and other structures may refer to the general design.

[0072] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present invention, the thickness of the layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0073] (3) In the absence of conflict, the embodiments of the present invention and the features therein may be combined with each other to obtain new embodiments.

[0074] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. The protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A method for integrally laying a microelectromechanical sensor and an asphalt road surface layer, which is used for synchronously embedding the microelectromechanical sensor on newly built roads, roads under reconstruction and expansion, and regularly maintained roads. The road surface layer includes a surface course and a base course, and is characterized in that, Including: Determine the spatial position of the MEMS sensors to be laid on the road surface layer; Design and deploy the encapsulation of the MEMS sensors according to the characteristics of the spatial position to achieve the expected values of compression resistance, waterproofness, and high temperature resistance; Bond and fix the encapsulated MEMS sensors to the lower surface layer; Complete the paving of the upper surface layer and the compaction of the road surface layer; Wherein, after determining the spatial position of the MEMS sensors to be laid on the road surface layer, it further includes: Determine the positions of the MEMS sensors to be recycled; Drill holes to take out the core samples with the MEMS sensors according to the determined positions of the MEMS sensors to be recycled; Process the core samples and recycle the sensing elements; Milling and planing the road surface of the section where the core samples are drilled.

2. The integrated laying method of the microelectromechanical sensor and the asphalt road surface layer according to claim 1, after bonding and fixing the encapsulated microelectromechanical sensor to the bottom layer and before completing the paving of the upper layer and the compaction of the road surface, is characterized in that It also includes: Use the asphalt mixture for surface layer paving to pre-bury the encapsulated MEMS sensors and cables, and tamp them with a small mobile rammer.

3. The integrated laying method of the micro-electromechanical sensor and the asphalt road surface layer according to claim 1, characterized in that, The determination of the spatial position of the MEMS sensors to be laid on the road surface layer includes: using RTK (Real-time kinematic positioning) positioning technology to determine the spatial position of the MEMS sensors to be laid on the road surface layer.

4. The integrated laying method of the microelectromechanical sensor and the asphalt road surface layer according to claim 3, wherein, The road surface also includes a middle surface layer. The MEMS sensors are deployed at the bottom of the middle surface layer and the upper surface layer. After the lower surface layer is completed, use a handheld RTK measuring instrument to clarify the longitude and latitude coordinates of the buried positions of the MEMS sensors, and mark the coordinate positions of the MEMS sensors with handheld spray paint.

5. The integrated laying method of the microelectromechanical sensor and the asphalt road surface layer according to claim 1, characterized in that, The design and deployment of the encapsulation of the MEMS sensors include: Integrate the MEMS sensors and components on a PCB board, fix the PCB board in the bottom cover made of cast nylon material with screws, and fill the inside of the bottom cover with high-temperature resistant silicone rubber. After the silicone is dry, close the top cover made of cast nylon material with the bottom cover, lead out the power data line at the closing place, and cut a groove at the closing place for the subsequent recycling of the MEMS sensors.

6. The integrated laying method of the micro-electromechanical sensor and the asphalt road surface layer according to claim 5, characterized in that The processing of the core samples and the recycling of the sensing elements include: Break the core samples by knocking, take out the internal MEMS sensors, cut out the PCB board inside the MEMS sensors, use silicone dissolving agent to dilute the filled silicone rubber, clean the PCB board, and take out the sensing elements on the PCB board to realize the recycling of the sensing elements.

7. The integrated laying method of the microelectromechanical sensor and the asphalt road surface layer according to claim 1, characterized in that, The bonding and fixing of the encapsulated MEMS sensors to the lower surface layer include: at the spatial position, use high-temperature resistant epoxy resin to bond and fix the MEMS sensors to the lower surface layer.

8. The integrated laying method of the microelectromechanical sensor and the asphalt road surface layer according to claim 1, characterized in that The completion of the paving of the upper surface layer and the compaction of the road surface layer includes: using a paver to complete the paving operation of the upper surface layer, and using a road roller to repeatedly roll the upper surface layer.

9. The integrated laying method of the microelectromechanical sensor and the asphalt road surface layer according to claim 1, characterized in that The milling and drilling of the road surface of the section where the core sample is taken includes: using a milling machine to mill the asphalt road surface from which the core sample is taken by drilling, with the milling depth in the range of 1 cm to 3 cm deeper than the depth of drilling the core sample, using a high-pressure blower and a water gun to wash the milled interface, and leaving time for drying in the sun.

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