A stress detection circuit device for use in an explosion-proof environment

Abstract

The application provides a stress detection circuit device for an explosion-proof environment, and belongs to the technical field of electronic circuits. It solves the problem of poor explosion-proof effect of the existing stress detection device. The stress detection circuit device for the explosion-proof environment comprises a power supply module, a power supply conversion module, a control module, a signal processing module, an interface board, a working module and an energy limiting module. The power supply module is connected with the power supply conversion module. The power supply conversion module is connected in parallel with the signal processing module and the interface board. The signal processing module is connected with the control module. The signal processing module is connected with the interface board. The interface board is connected with an ultrasonic probe for detecting stress. The signal processing module comprises a digital signal processing module and an analog signal processing module. The analog signal processing module is provided with a first voltage stabilizing diode. The digital signal processing module is provided with a voltage protection module, a power supply voltage stabilizing module, a power supply voltage reducing module and an isolation module. The application has the advantages of good explosion-proof effect.

Description

Technical Field

[0001] This invention belongs to the field of electronic circuit technology, and specifically relates to a stress detection circuit device for use in explosion-proof environments. Background Technology

[0002] Chemical hazardous materials that can cause combustion or explosion under certain conditions, leading to personal injury, death, and property damage, are collectively referred to as flammable and explosive materials. Flammable and explosive materials include petroleum and natural gas.

[0003] Pipeline technology offers unique advantages for long-distance transportation of media such as oil and natural gas, and is commonly used for transporting flammable and explosive materials like oil and natural gas over long distances. Long-distance oil and gas pipelines are medium- or high-pressure pipelines, with lengths ranging from hundreds to thousands or even tens of thousands of kilometers, and transport flammable and explosive hazardous materials. Therefore, strict requirements are placed on the pipeline's resistance to deformation caused by changes in internal and external loads.

[0004] Therefore, accurate and timely detection of stress and strain in long-distance oil and gas pipelines is of great significance in preventing leaks by ensuring that the deformation of these pipelines remains within acceptable limits. The stress detection device is installed around the perimeter of the pipeline and remains energized for extended periods.

[0005] When an oil and gas pipeline leaks, flammable and explosive materials inside the pipeline will be distributed in the space around the leak, turning the environment in which the stress detection device is located into a flammable and explosive environment, i.e., an explosion-proof environment. At this time, since the stress detection device is in a powered state for a long time, the explosion-proof effect of the existing stress detection device is poor in an explosion-proof environment. Summary of the Invention

[0006] The purpose of this invention is to address the aforementioned problems in the prior art by providing a stress detection circuit device for use in explosion-proof environments.

[0007] The objective of this invention can be achieved through the following technical solution: A stress detection circuit device for explosion-proof environments, characterized in that it includes a power supply module, a power conversion module, a control module, a signal processing module, an interface board, a working module, and a power limiting module. The power supply module is connected to the power conversion module, the power conversion module is connected in parallel to the signal processing module and the interface board, the signal processing module is connected to the control module, and the signal processing module and the interface board are connected via a network communication interface and a pulse signal interface, respectively. The interface board is connected to an ultrasonic probe for stress detection. The signal processing module includes a digital signal processing module and an analog signal processing module. The analog signal processing module is equipped with a first Zener diode to prevent reverse current. The digital signal processing module is equipped with a voltage protection module to prevent high voltage generation, a power supply voltage regulator module to stabilize the power supply voltage, a power supply voltage reduction module to reduce the power supply voltage, and an isolation module for power supply isolation.

[0008] The working principle of this invention is as follows: During use, it is powered by a power module containing a 24V switching power supply to convert 220V to 24V. This 24V is then converted to 12V by a power conversion module. After the input voltage is reduced, the current is transmitted through the power lines to the signal processing module and the energy limiting module. The energy limiting module restricts the output current, preventing the circuit from burning out components due to excessive current, thus ensuring safety and minimizing the generation of electrical sparks, or ensuring that any sparks generated are insufficient to ignite the gas. The signal processing module then drives a detection device for stress detection. A first Zener diode is used to prevent reverse current flow, reducing the impact of reverse current on components. Simultaneously, a voltage protection module, a power supply voltage regulation module, a power supply voltage reduction module, and an isolation module are included to reduce the risk of fire in the digital signal processing module, thus increasing the overall explosion-proof effect.

[0009] In the aforementioned stress detection circuit device for explosion-proof environments, the power conversion module includes a 24V to 12V power module and a first intrinsically safe power supply. The signal processing module and the interface board are both connected to the first intrinsically safe power supply. The power conversion module includes a 24V to 12V power module and a first intrinsically safe power supply. The signal processing module and the interface board are both connected to the first intrinsically safe power supply. The energy limiting module includes a current-limiting resistor and a filter inductor connected in series. The current-limiting resistor is used to prevent excessive current in its branch. The power module is connected in parallel with a photoelectric module, which is used for photoelectric conversion. The interface board is also connected to a temperature sensor. A first opto-isolation module is provided between the network communication interface of the signal processing module and the network communication interface of the interface board. The first opto-isolation module is connected to the power module through a power line. An energy-limiting resistor is provided between the pulse signal interface of the signal processing module and the pulse signal interface of the interface board.

[0010] In the aforementioned stress detection circuit device for explosion-proof environments, the power supply module is connected in parallel with an electrolytic capacitor and a first fuse. The electrolytic capacitor is grounded, and the first fuse is connected to a first Zener diode. The Zener diode is connected to a power input terminal, which includes six terminals. The first and third terminals are connected in parallel and grounded, while the second and fourth terminals are connected in parallel to the Zener diode. A first optocoupler is connected between the digital signal processing module and the analog signal processing module. The first optocoupler controls the power supply of the digital signal processing module according to the analog signal processing module. The first optocoupler includes a first light-emitting diode and a phototransistor. The input and output terminals of the first light-emitting diode are both connected to the analog signal processing module. The input terminal of the phototransistor is connected to the power supply module, and the output terminal of the phototransistor is connected to the input terminal of the digital signal processing module.

[0011] In the aforementioned stress detection circuit device for explosion-proof environments, the voltage protection module includes a protection module, a circuit control module, and an excitation module. The power supply module and the excitation module are electrically connected to the circuit control module. The excitation module is used to generate an excitation signal. The first end of the protection module is connected between the power supply module and the circuit control module, and the second end of the protection module is connected to the circuit control module. The protection module is used to prevent the generation of high voltage.

[0012] In the aforementioned stress detection circuit device for explosion-proof environments, the protection module includes multiple diodes connected in parallel. The negative terminals of the diodes are connected to a first terminal, and the positive terminals of the diodes are connected to a second terminal. The circuit control module includes a signal connection terminal, a transistor, and a relay. The transistor is an NPN type, with its base connected to the signal connection terminal and a first resistor connected between the base and the signal connection terminal. The collector of the transistor is connected to the relay, and the emitter of the transistor is connected to ground. The relay is an electromagnetic relay, including an electromagnetic connection terminal and a contact terminal. The electromagnetic connection terminal is connected to both the power supply module and the transistor. At least one of the contact terminals is connected to the excitation module. The first terminal of the protection module is connected between the power supply module and the electromagnetic connection terminal, and the second terminal of the protection module is connected between the transistor and the electromagnetic connection terminal.

[0013] In the aforementioned stress detection circuit device for explosion-proof environments, the ultrasonic probe includes a probe, a contact, an insulating pad, and an insulating cover. The insulating pad is fixed to the workpiece being tested, the probe is fixed on the insulating pad, the contact is connected to and conductive with the probe, the insulating cover covers the periphery of the probe and the contact, and a sealed chamber is formed between the insulating cover and the insulating pad. The insulating pad is made of PVC, and a colloid layer is provided between the insulating pad and the workpiece, between the probe and the insulating pad, and between the insulating pad and the insulating cover. A sealing colloid is provided between the insulating pad and the insulating cover, the contact has a connecting wire, and the insulating cover has a wire hole for the connecting wire to pass through the chamber. The wire hole is filled with sealing colloid, and the connecting wire is used to connect to the interface board.

[0014] In the aforementioned stress detection circuit device for explosion-proof environments, the power supply module and the voltage regulator module are connected in parallel. The voltage regulator module includes at least one second Zener diode, which is connected to the ground terminal. The power supply module outputs a positive current or a negative current. When the power supply module outputs a positive current, the negative terminal of the second Zener diode is connected to the power supply module, and the positive terminal of the second Zener diode is connected to the ground terminal. When the power supply module outputs a negative current, the positive terminal of the second Zener diode is connected to the power supply module, and the negative terminal of the second Zener diode is connected to the ground terminal.

[0015] In the aforementioned stress detection circuit device for explosion-proof environments, the power supply step-down module includes a first step-down module, a second intrinsically safe power supply connected to at least one first step-down module, a first step-down module connected to a working module, and the first step-down module used to reduce the voltage input to the second intrinsically safe power supply and supply it to the working module. A third Zener diode and a second fuse are connected between the second intrinsically safe power supply and the working module. The device also includes a second step-down module connected in series with the first step-down module and further connected to the working module. The second step-down module is used to reduce the voltage input to the first step-down module and supply it to the working module.

[0016] In the aforementioned stress detection circuit device for explosion-proof environments, the isolation module includes a serial port data transmitter, a serial port data receiver, and a data transmission interface, all connected to a serial port circuit chip. A second opto-isolation module is connected between the serial port data transmitter and the serial port circuit chip. The second opto-isolation module includes a light source and a light receiver. The light source includes a light source input pin and a light source input pin. The light receiver includes a light receiving input pin and a light receiving output pin. The light source input pin is connected to a power supply via a resistor, and the light source output pin is connected to the serial port. In the data transmitting end, the light-receiving input pin is connected to the power supply, a capacitor is connected in parallel to the light-receiving input pin and grounded, the light-receiving output pin is connected to the serial port circuit chip, and the light-receiving output pin is also connected in parallel to the power supply through a resistor. The light source input pin is connected to the power supply through a resistor, the light source output pin is connected to the serial port circuit chip through a resistor, the light-receiving input pin is connected to the power supply, a capacitor is connected in parallel to the light-receiving input pin and grounded, the light-receiving input pin is connected to the light-receiving output pin through a resistor, and the light-receiving output pin is also connected in parallel to the power supply. The second opto-isolation module is a second optocoupler, which includes two sets of light sources and light receivers. One set of light sources and light receivers is not connected to the serial port circuit chip or the serial port data transmitting end or the serial port data receiving end. The light-receiving output pin of this set of light receivers is connected to the ground terminal.

[0017] In the stress detection circuit device for explosion-proof environments described above, the power supply module includes an AC power supply, an isolation transformer, a circuit breaker, and a switching power supply.

[0018] Compared with existing technologies, the present invention has the advantage of good explosion-proof effect. Attached Figure Description

[0019] Figure 1 This is the circuit schematic diagram of the present invention.

[0020] Figure 2 This is a circuit schematic diagram of the signal processing module of the present invention.

[0021] Figure 3 This is a circuit diagram of the first Zener diode in this invention.

[0022] Figure 4 This is a circuit diagram of the voltage protection module of the present invention.

[0023] Figure 5This is a circuit diagram of the second resistor in the voltage protection module of the present invention.

[0024] Figure 6 This is a circuit diagram of the power supply regulator module of the present invention.

[0025] Figure 7 This is a circuit diagram showing the positive terminal of the power supply regulator module connected to the regulator module in this invention.

[0026] Figure 8 This is a circuit diagram showing the negative terminal of the power supply regulator module connected to the voltage regulator module according to the present invention.

[0027] Figure 9 This is a schematic diagram of the structure of the ultrasonic probe of the present invention.

[0028] Figure 10 This is a schematic diagram of the internal structure of the ultrasonic probe of the present invention.

[0029] Figure 11 This is a schematic diagram of the working process of the power supply step-down module of the present invention.

[0030] Figure 12 This is a schematic diagram of the power supply step-down module circuit of the present invention.

[0031] Figure 13 This is a schematic diagram of the 9V step-down module circuit of the power supply step-down module of the present invention.

[0032] Figure 14 This is a schematic diagram of the 5V step-down module circuit of the power supply step-down module of the present invention.

[0033] Figure 15 This is a schematic diagram of the 3V step-down module circuit of the power supply step-down module of the present invention.

[0034] Figure 16 This is a circuit diagram of the isolation module of the present invention.

[0035] In the diagram, F1 is the power supply module; F3 is the control module; F4 is the power conversion module; F5 is the energy limiting module; F6 is the signal processing module; F7 is the energy limiting resistor; F9 is the 24V to 12V power supply module; F10 is the first intrinsically safe power supply; F11 is the current limiting resistor; F12 is the filter inductor; F13 is the optoelectronic module; F14 is the ultrasonic probe; F15 is the interface board; F16 is the first opto-isolation module; F17 is the temperature sensor; E1 is the digital signal processing module; E2 is the analog signal processing module; E4 is the first Zener diode; E5 is the electrolytic capacitor; E6 is the power input terminal; and E7 is the first fuse. Wire; E8, First optocoupler; E9, First light-emitting diode; E10, Phototransistor; E11, AC power supply; E12, Isolation transformer; E13, Circuit breaker; E14, Switching power supply; D2, Excitation module; D3, Protection module; D4, Diode; D6, Circuit control module; D7, Signal connection terminal; D8, Transistor; D9, First resistor; D10, Second resistor; D11, Contact terminal; D12, Electromagnetic connection terminal; C2, Voltage regulator module; C3, Working module; C4, Second voltage regulator diode; B1, Workpiece; B2, Probe; B3, Contact; B4, Insulating pad; B 5. Insulating cover; B6. Chamber; B7. Wire hole; B8. Connecting wire; B9. Sealing colloid; B10. Colloid layer; 1. Second intrinsically safe power supply; 2. 9V step-down module; 3. 9V step-down regulator; 4. First input pin; 5. First ground pin; 6. First output pin; 7. 9V output terminal; 8. Second input pin; 9. Positive current pin; 10. Negative current pin; 11. 5V step-down module; 12. 5V step-down regulator; 13. Second ground pin; 14. Compensation circuit pin; 15. Feedback pin; 16. Inductor pin; 17. Bootstrap pin; 18. Clock pulse pin; 9. 5V output terminal; 21. 3V step-down module; 22. 3V step-down regulator; 23. Third input pin; 24. Third ground pin; 25. Second output pin; 26. Third output pin; 27. 3V output terminal; 28. Third Zener diode; 29. ​​Second fuse; A1. Serial port circuit chip; A2. Serial port data transmitter; A3. Serial port data receiver; A4. Data transmission interface; A5. Second opto-isolation module; A6. Light source; A7. Light receiver; A8. Light source input pin; A9. Light source output pin; A10. Light receiving input pin; A11. Light receiving output pin. Detailed Implementation

[0036] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0037] like Figures 1-3As shown, a stress detection circuit device for explosion-proof environments includes a power supply module F1, a power conversion module F4, a control module F3, a signal processing module F6, an interface board F15, a working module C3, and a power limiting module F5. The power supply module F1 is connected to the power conversion module F4, and the power conversion module F4 is connected in parallel to the signal processing module F6 and the interface board F15. The signal processing module F6 is connected to the control module F3. The signal processing module F6 and the interface board F15 are connected via a network communication interface and a pulse signal interface, respectively. The interface board F15 is connected to an ultrasonic probe F14 for stress detection. The signal processing module F6 includes a digital signal processing module E1 and an analog signal processing module E2. The analog signal processing module E2 is equipped with a first Zener diode E4 to prevent reverse current. The digital signal processing module E1 is equipped with a voltage protection module to prevent high voltage, a power supply voltage regulator module to stabilize the power supply voltage, a power supply voltage reduction module to reduce the power supply voltage, and an isolation module for power supply isolation.

[0038] To elaborate further, the power conversion module F4 includes a 24V to 12V power module F9 and a first intrinsically safe power supply F10. The signal processing module F6 and the interface board F15 are both connected to the first intrinsically safe power supply F10. The energy limiting module F5 includes a current-limiting resistor F11 and a filter inductor F12 connected in series. The current-limiting resistor F11 is used to prevent excessive current in its branch. The power module F1 has a photoelectric module F13 connected in parallel. The photoelectric module F13 is used for photoelectric conversion. The interface board F15 is also connected to a temperature sensor. A first opto-isolation module F16 is set between the network communication interface of the signal processing module F6 and the network communication interface of the interface board F15. The first opto-isolation module F16 is connected to the power module F1 through a power line. An energy-limiting resistor F7 is set between the pulse signal interface of the signal processing module F6 and the pulse signal interface of the interface board F15.

[0039] During operation, the circuit is powered by power module F1, which contains a 24V switching power supply E14 to convert 220V to 24V. Then, power conversion module F4 converts the 24V to 12V. After the input voltage is reduced, the current is transmitted through the power lines to signal processing module F6 and energy limiting module F5. Since energy limiting module F5 can limit the output current, the circuit will not burn out the components due to excessive current, ensuring its safety. It is unlikely to generate electric sparks or the generated electric sparks are insufficient to ignite the gas. Then, signal processing module F6 drives the detection device to perform stress detection.

[0040] To elaborate further, power module F1 is connected in parallel with electrolytic capacitor E5 and first fuse E7. Electrolytic capacitor E5 is grounded. First fuse E7 is connected to first Zener diode E4. First Zener diode E4 is connected to power input terminal E6, which includes six terminals. The first and third terminals are connected in parallel and grounded. The second and fourth terminals are connected in parallel to the Zener diode. A first optocoupler E8 connects digital signal processing module E1 and analog signal processing module E2. The first optocoupler E8 is configured according to the module... The analog signal processing module E2 controls the power supply of the digital signal processing module E1. The first optocoupler E8 includes a first light-emitting diode E9 and a phototransistor E10. The input and output terminals of the first light-emitting diode E9 are both connected to the analog signal processing module E2. The input terminal of the phototransistor E10 is connected to the power supply module F1, and the output terminal of the phototransistor E10 is connected to the input terminal of the digital signal processing module E1. In this scheme, the number of first Zener diodes E4 is 3, and the first Zener diodes E4 are compliant diodes.

[0041] When a reverse current occurs in the circuit, the current will flow from the negative terminal of the first Zener diode E4 to the positive terminal of the first Zener diode E4. At this time, the reverse resistance of the first Zener diode E4 is very large, which makes the reverse leakage current extremely small, thereby blocking the reverse current from passing through, reducing the impact of the reverse current on the circuit, and reducing the risk of circuit fire.

[0042] To elaborate further, the voltage protection module includes a protection module D3, a circuit control module D6, and an excitation module D2. The power supply module F1 and the excitation module D2 are electrically connected to the circuit control module D6. The excitation module D2 is used to generate an excitation signal. The first end of the protection module D3 is connected between the power supply module F1 and the circuit control module D6, and the second end of the protection module D3 is connected to the circuit control module D6. The protection module D3 is used to prevent the generation of high voltage.

[0043] To elaborate further, the protection module D3 includes multiple diodes D4 connected in parallel. The cathode of diode D4 is connected to the first terminal, and the anode of diode D4 is connected to the second terminal. The circuit control module D6 includes a signal connection terminal D7, a transistor D8, and a relay. Transistor D8 is an NPN type. The base of transistor D8 is connected to the signal connection terminal D7, and a first resistor D9 is connected between the base and the signal connection terminal D7. The collector of transistor D8 is connected to the relay, and the emitter of transistor D8 is connected to the ground terminal. The relay is an electromagnetic relay, which includes an electromagnetic connection terminal D12 and a contact terminal. D11 and electromagnetic connection terminal D12 are respectively connected to power module F1 and transistor D8. At least one end of contact terminal D11 is connected to excitation module D2. The first end of protection module D3 is connected between power module F1 and electromagnetic connection terminal D12, and the second end of protection module D3 is connected between transistor D8 and electromagnetic connection terminal D12. In this scheme, there are 3 diodes D4. The first end of contact terminal D11 is connected to excitation module D2, the second end of contact terminal D11 is connected to ground terminal, and a second resistor D10 is connected between the second end of contact terminal D11 and ground terminal.

[0044] The protection module D3 is used to prevent the generation of high voltage when the equipment is powered off. When the circuit is powered off, the protection module D3 and the circuit control module D6 form a loop to prevent high voltage from being generated at both ends of the circuit control module D6, which could cause circuit failure.

[0045] To elaborate further, the ultrasonic probe F14 includes a probe B2, a contact B3, an insulating pad B4, and an insulating cover B5. The insulating pad B4 is fixed to the measured part of the workpiece B1. The probe B2 is fixed on the insulating pad B4. The contact B3 is connected to and conducts electricity with the probe B2. The insulating cover B5 covers the periphery of the probe B2 and the contact B3, forming a sealed chamber B6 between the insulating cover B5 and the insulating pad B4. The insulating pad B4 is made of PVC. A space is provided between the insulating pad B4 and the workpiece B1. A gel layer B10 is provided between the probe B2 and the insulating pad B4. The gel layer B10 is made of glass glue. A sealing gel B9 is provided between the insulating pad B4 and the insulating cover B5. The contact B3 has a connecting wire B8. The insulating cover B5 has a wire hole B7 for the connecting wire B8 to pass through the chamber B6. The wire hole B7 is filled with sealing gel B9. The connecting wire B8 is used to connect to the interface plate F15. The sealing gel B9 is made of glass glue.

[0046] During stress testing, an insulating cover B5 is installed on the outside of the probe to seal the probe B2. At the same time, there is an insulating pad B4 between the probe B2 and the workpiece B1. This ensures that even if the circuit fails, no electrical sparks will leak outside the insulating cover B5 when the probe B2 is always powered on. In the event of a flammable or explosive gas leak, an explosion is prevented.

[0047] To elaborate further, the power module F1 and the voltage regulator module C2 are connected in parallel. The voltage regulator module C2 includes at least one second Zener diode C4, which is connected to the ground terminal. The power module F1 outputs either a positive or negative current. When the power module F1 outputs a positive current, the negative terminal of the second Zener diode C4 is connected to the power module F1, and the positive terminal of the second Zener diode C4 is connected to the ground terminal. When the power module F1 outputs a negative current, the positive terminal of the second Zener diode C4 is connected to the power module F1, and the negative terminal of the second Zener diode C4 is connected to the ground terminal.

[0048] The voltage regulator module C2 is used to stabilize the power supply voltage, which fluctuates greatly and does not meet the requirements of the working module C3, within its set value range, so that the working module C3 can work normally under the rated working voltage and reduce the possibility of the working module C3 catching fire due to voltage instability.

[0049] To elaborate further, the power supply step-down module includes a first step-down module, a second intrinsically safe power supply 1 connected to at least one first step-down module, a first step-down module connected to a working module C3, the first step-down module being used to reduce the input voltage of the second intrinsically safe power supply 1 and supply it to the working module C3, a third Zener diode 28 and a second fuse 29 being connected between the second intrinsically safe power supply 1 and the working module C3, and also includes a second step-down module connected in series with the first step-down module, the second step-down module also being connected to the working module C3, the second step-down module being used to reduce the input voltage of the first step-down module and supply it to the working module C3.

[0050] The output terminal of the second intrinsically safe power supply 1 is connected to the input terminal of the first step-down module. Through the step-down processing of the first step-down module, different low voltages are output to connect to the working module C3. Since the power supply is the second intrinsically safe power supply 1, the low voltage output by the first step-down module reduces the possibility of igniting flammable and explosive materials under extreme discharge conditions.

[0051] To elaborate further, the first step-down module includes a 9V step-down module 2, which steps down the voltage to 9V. The 9V step-down module 2 includes a 9V step-down regulator 3, which includes a first input pin 4, a first ground pin 5, and a first output pin 6. The first input pin 4 is connected to the power module F1, and the first ground pin 5 is connected to the ground terminal. A capacitor is connected between the first input pin 4 and the first ground pin 5. The first output pin 6 is connected in parallel with a polarized capacitor and a DC bus. The other end of the polarized capacitor is connected to the ground terminal. The other end of the DC bus is connected in parallel with a 9V output terminal 7 and a capacitor bank. The capacitor bank includes two capacitors connected in parallel. The other end of the capacitor bank is connected to the ground terminal. The first output pin 6 includes a positive current pin 9 and a negative current pin 10.

[0052] To elaborate further, the first step-down module includes a 5V step-down module 11, which steps down the voltage to 5V. The 5V step-down module 11 includes a 5V step-down regulator 12, which includes a second input pin 8, a second ground pin 13, a compensation circuit pin 14, a feedback pin 15, an inductor pin 16, a bootstrap pin 17, and a clock pulse pin 18. The second input pin 8 is connected to the power module F1, and a capacitor is connected in parallel to it and grounded. The second ground pin 13 is connected to the ground terminal. The clock pulse pin 18 is connected to the ground terminal. The compensation circuit pin 14 is connected to a capacitor bank and grounded. The capacitor bank includes two capacitors connected in parallel, one of which is connected in series with a resistor. A diode D4 is connected between the second input pin 8 and the bootstrap pin 17, through which current flows. A bootstrap capacitor is connected between the bootstrap pin 17 and the inductor pin 16. A Zener diode and a DC bus are connected in parallel to the inductor pin 16. The other end of the Zener diode is connected to the ground. The DC bus is connected to the 5V output terminal 19 and the capacitor bank. The capacitor bank includes two capacitors connected in parallel, with the other end of the capacitor bank connected to the ground. The DC bus is also connected to the feedback pin 15 through a resistor. The feedback pin 15 is also connected in parallel with a resistor and connected to the ground.

[0053] To elaborate further, the second step-down module includes a 3V step-down module 21, which steps down the voltage to 3V. The 3V step-down module 21 includes a 3V step-down regulator 22, which includes a third input pin 23, a third ground pin 24, a second output pin 25, and a third output pin 26. The third input pin 23 is connected to the first step-down module. A capacitor is connected in parallel to the third input pin 23 and is also connected to the ground terminal. The third ground pin 24 is connected to the ground terminal. A capacitor, a polarized capacitor, a second light-emitting diode, and a 3V output terminal 27 are connected in parallel to the second output pin 25 and the third output pin 26. The other end of the capacitor is connected to the ground terminal, and the other end of the polarized capacitor is also connected to the ground terminal. The second light-emitting diode is connected in series with a resistor and is also connected to the ground terminal.

[0054] To elaborate further, the isolation module includes a serial data transmitter A2, a serial data receiver A3, and a data transmission interface A4, all connected to the serial port circuit chip A1. A second opto-isolation module A5 connects the serial data transmitter A2 and the serial port circuit chip A1, and the same module connects the serial data receiver A3 and the serial port circuit chip A1. The second opto-isolation module A5 includes a light source A6 and a light receiver A7. The light source A6 includes a light source input pin A8 and a light receiver A7. The light receiver A7 includes a light receiving input pin A10 and a light receiving output pin A11. The light source input pin A8 is connected to the power supply via a resistor, and the light source output pin A9 is connected to the serial data transmitter A2. Pin A10 is connected to the power supply. The light-receiving input pin A10 is connected in parallel with a capacitor and grounded. The light-receiving output pin A11 is connected to the serial port circuit chip A1. The light-receiving output pin A11 is also connected in parallel with the power supply through a resistor. The light source input pin A8 is connected to the power supply through a resistor. The light source output pin A9 is connected to the serial port circuit chip A1 through a resistor. The light-receiving input pin A10 is connected to the power supply. The light-receiving input pin A10 is connected in parallel with a capacitor and grounded. The light-receiving input pin A10 is connected to the light-receiving output pin A11 through a resistor. The light-receiving output pin A11 is also connected in parallel with the power supply. The second opto-isolation module A5 is the second optocoupler. The second optocoupler includes two sets of light sources A6 and light receivers A7. One set of light sources A6 and light receivers A7 is not connected to the serial port circuit chip A1 or the serial port data transmitter A2 or the serial port data receiver A3. The light-receiving output pin A11 of this set of light receivers A7 is connected to the ground terminal. The light source A6 in this scheme is the third light-emitting diode.

[0055] The serial data transmitter A2 and the serial data receiver A3 are each connected to a second opto-isolation module A5, thereby isolating the intrinsically safe power supply from the non-intrinsically safe power supply. Here, the intrinsically safe power supply is a third intrinsically safe power supply, so that the intrinsically safe power supply and the non-intrinsically safe power supply will not interfere with each other, ensuring that when a short circuit occurs in the circuit, generating sparks or thermal effects, it will not cause an explosion of the surrounding flammable gases.

[0056] To elaborate further, the power module F1 includes an AC power supply E11, an isolation transformer E12, a circuit breaker E13, and a switching power supply E14.

[0057] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

[0058] Although this document uses a large number of technical terms, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of the invention; interpreting them as any additional limitation would be contrary to the spirit of the invention.

Claims

1. A stress detection circuit device for use in explosion-proof environments, characterized in that, The system includes a power supply module (F1), a power conversion module (F4), a control module (F3), a signal processing module (F6), an interface board (F15), a working module (C3), and a power limiting module (F5). The power supply module (F1) is connected to the power conversion module (F4). The power conversion module (F4) is connected in parallel to the signal processing module (F6) and the interface board (F15). The signal processing module (F6) is connected to the control module (F3). The signal processing module (F6) and the interface board (F15) are connected via a network communication interface and a pulse signal interface, respectively. The interface board (F15) is connected to an ultrasonic probe (F14) for detecting stress. The signal processing module (F6) includes a digital signal processing module (E1) and an analog signal processing module (E2). The analog signal processing module (E2) is equipped with a first Zener diode (E4) for preventing reverse current. The digital signal processing module (E1) is equipped with a voltage protection module for preventing high voltage, a power supply voltage regulator module for stabilizing the power supply voltage, a power supply step-down module for reducing the power supply voltage, and an isolation module for power supply isolation. The ultrasonic probe (F14) includes a probe (B2), a contact (B3), an insulating pad (B4), and an insulating cover (B5). The insulating pad (B4) is fixed to the measured part of the workpiece (B1). The probe (B2) is fixed on the insulating pad (B4). The contact (B3) is connected to and conductively connected to the probe (B2). The insulating cover (B5) covers the periphery of the probe (B2) and the contact (B3). A sealed cavity (B6) is formed between the insulating cover (B5) and the insulating pad (B4). The insulating pad (B4) is made of PVC. A colloid layer (B10) is provided between the probe (B2) and the workpiece (B1), a colloid layer (B10) is provided between the probe (B2) and the insulating pad (B4), a sealing colloid (B9) is provided between the insulating pad (B4) and the insulating cover (B5), the contact (B3) has a connecting wire (B8), the insulating cover (B5) has a wire hole (B7), the wire hole (B7) is used for the connecting wire (B8) to pass through the chamber (B6), the wire hole (B7) is filled with sealing colloid (B9), and the connecting wire (B8) is used to connect to the interface plate (F15).

2. The stress detection circuit device for explosion-proof environments according to claim 1, characterized in that, The power conversion module (F4) includes a 24V to 12V power module (F9) and a first intrinsically safe power supply (F10). The signal processing module (F6) and the interface board (F15) are both connected to the first intrinsically safe power supply (F10). The power conversion module (F4) includes a 24V to 12V power module (F9) and a first intrinsically safe power supply (F10). The signal processing module (F6) and the interface board (F15) are both connected to the first intrinsically safe power supply (F10). The power limiting module (F5) includes a current-limiting resistor (F11) and a filter inductor (F12) connected in series. The current-limiting resistor (F11)... 1) To prevent excessive current in the branch circuit, the power module (F1) is connected in parallel with a photoelectric module (F13), which is used for photoelectric conversion. The interface board (F15) is also connected to a temperature sensor. A first opto-isolation module (F16) is provided between the network communication interface of the signal processing module (F6) and the network communication interface of the interface board (F15). The first opto-isolation module (F16) is connected to the power module (F1) through a power line. A finite-energy resistor (F7) is provided between the pulse signal interface of the signal processing module (F6) and the pulse signal interface of the interface board (F15).

3. The stress detection circuit device for explosion-proof environments according to claim 1, characterized in that, The power module (F1) is connected in parallel with an electrolytic capacitor (E5) and a first fuse (E7). The electrolytic capacitor (E5) is grounded. The first fuse (E7) is connected to a first Zener diode (E4). The first Zener diode (E4) is connected to a power input terminal (E6). The power input terminal (E6) includes six terminals. The first and third terminals are connected in parallel and grounded. The second and fourth terminals are connected in parallel to the first Zener diode (E4). The digital signal processing module (E1) and the analog signal processing module (E2) are connected via a first... An optocoupler (E8) is provided. The first optocoupler (E8) controls the power supply of the digital signal processing module (E1) according to the analog signal processing module (E2). The first optocoupler (E8) includes a first light-emitting diode (E9) and a phototransistor (E10). The input and output terminals of the first light-emitting diode (E9) are both connected to the analog signal processing module (E2). The input terminal of the phototransistor (E10) is connected to the power supply module (F1), and the output terminal of the phototransistor (E10) is connected to the input terminal of the digital signal processing module (E1).

4. The stress detection circuit device for explosion-proof environments according to claim 1, characterized in that, The voltage protection module includes a protection module (D3), a circuit control module (D6), and an excitation module (D2). The power supply module (F1) and the excitation module (D2) are electrically connected to the circuit control module (D6). The excitation module (D2) is used to generate an excitation signal. The first end of the protection module (D3) is connected between the power supply module (F1) and the circuit control module (D6), and the second end of the protection module (D3) is connected to the circuit control module (D6). The protection module (D3) is used to prevent the generation of high voltage.

5. A stress detection circuit device for explosion-proof environments according to claim 4, characterized in that, The protection module (D3) includes multiple diodes (D4) connected in parallel. The cathode of each diode (D4) is connected to a first terminal, and the anode of each diode (D4) is connected to a second terminal. The circuit control module (D6) includes a signal connection terminal (D7), a transistor (D8), and a relay. The transistor (D8) is an NPN type. The base of the transistor (D8) is connected to the signal connection terminal (D7), and a first resistor (D9) is connected between the base and the signal connection terminal (D7). The collector of the transistor (D8) is connected to the relay. The emitter of (D8) is connected to the ground terminal. The relay is an electromagnetic relay. The relay includes an electromagnetic connection terminal (D12) and a contact terminal (D11). The electromagnetic connection terminal (D12) is connected to the power supply module (F1) and the transistor (D8) respectively. At least one of the contact terminals (D11) is connected to the excitation module (D2). The first end of the protection module (D3) is connected between the power supply module (F1) and the electromagnetic connection terminal (D12). The second end of the protection module (D3) is connected between the transistor (D8) and the electromagnetic connection terminal (D12).

6. The stress detection circuit device for explosion-proof environments according to claim 1, characterized in that, The power supply module (F1) and the voltage regulator module (C2) are connected in parallel. The voltage regulator module (C2) includes at least one second Zener diode (C4). The second Zener diode (C4) is connected to the ground terminal. The power supply module (F1) outputs a positive current or a negative current. When the power supply module (F1) outputs a positive current, the negative terminal of the second Zener diode (C4) is connected to the power supply module (F1), and the positive terminal of the second Zener diode (C4) is connected to the ground terminal. When the power supply module (F1) outputs a negative current, the positive terminal of the second Zener diode (C4) is connected to the power supply module (F1), and the negative terminal of the second Zener diode (C4) is connected to the ground terminal.

7. The stress detection circuit device for explosion-proof environments according to claim 1, characterized in that, The power supply step-down module includes a second intrinsically safe power supply (1) and a first step-down module. The second intrinsically safe power supply (1) is connected to at least one first step-down module. The first step-down module is connected to the working module (C3). The first step-down module is used to reduce the voltage input to the second intrinsically safe power supply (1) and deliver it to the working module (C3). A third Zener diode (28) and a second fuse (29) are connected between the second intrinsically safe power supply (1) and the working module (C3). The module also includes a second step-down module, which is connected in series with the first step-down module. The second step-down module is also connected to the working module (C3). The second step-down module is used to reduce the voltage input to the first step-down module and deliver it to the working module (C3).

8. A stress detection circuit device for explosion-proof environments according to claim 1, characterized in that, The isolation module includes a serial port data transmitter (A2), a serial port data receiver (A3), and a data transmission interface (A4) respectively connected to the serial port circuit chip (A1). A second opto-isolation module (A5) is connected between the serial port data transmitter (A2) and the serial port circuit chip (A1), and the second opto-isolation module (A5) is also connected between the serial port data receiver (A3) and the serial port circuit chip (A1). The second opto-isolation module (A5) includes a light source (A6) and a light receiver (A7). The light source (A6) includes a light source input pin (A7). 8) and light source input pin (A8), the light receiver (A7) includes a light receiving input pin (A10) and a light receiving output pin (A11). The second opto-isolation module (A5) includes a light source (A6) and a light receiver (A7). The light source (A6) includes a light source input pin (A8) and a light receiving output pin (A11). The light source input pin (A8) is connected to the power supply through a resistor. The light source output pin (A9) is connected to the serial port data transmission terminal (A2). The light-receiving input pin (A10) is connected to the power supply. A capacitor is connected in parallel to the light-receiving input pin (A10) and grounded. The light-receiving output pin (A11) is connected to the serial port circuit chip (A1). The light-receiving output pin (A11) is also connected in parallel to the power supply through a resistor. The light source input pin (A8) is connected to the power supply through a resistor. The light source output pin (A9) is connected to the serial port circuit chip (A1) through a resistor. The light-receiving input pin (A10) is connected to the power supply. A capacitor is connected in parallel to the light-receiving input pin (A10) and grounded. The input pin (A10) is connected to the light-receiving output pin (A11) through a resistor. The light-receiving output pin (A11) is also connected in parallel with the power supply. The second opto-isolation module (A5) is a second optocoupler. The second optocoupler includes two sets of light sources (A6) and light receivers (A7). One set of light sources (A6) and light receivers (A7) is not connected to the serial port circuit chip (A1), the serial port data transmitter (A2), or the serial port data receiver (A3). The light-receiving output pin (A11) of the light receiver (A7) of the second opto-isolation module (A5) is connected to the ground terminal.

9. A stress detection circuit device for explosion-proof environments according to claim 1, characterized in that, The power module (F1) includes an AC power supply (E11), an isolation transformer (E12), a circuit breaker (E13), and a switching power supply (E14).

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