Method for measuring conductivity and its correction factor

Abstract

The application relates to the technical field of electronic engineering, and provides a conductivity and a conductivity correction coefficient determination method, wherein the conductivity correction coefficient determination method is as follows: first, thickness distribution data of different point positions on the surface of a measured sample is acquired; then, based on the thickness distribution data, a thickness surface of the measured sample is determined; finally, based on the thickness surface, a target conductivity correction coefficient of the measured sample is determined. The method can effectively eliminate the non-uniform thickness distribution effect of the measured sample, avoids the damage of machining methods such as turning, milling, planing and grinding to the anisotropy characteristics of the material of the measured sample, can accurately determine the conductivity correction coefficient of the measured sample, can further provide a correction scheme for the conductivity determination of the measured sample, improves the accuracy of the determined conductivity of the measured sample, guarantees the product quality of the measured sample and reasonable application.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic engineering, and in particular to a method for measuring electrical conductivity and its correction coefficient. BACKGROUND

[0002] At present, in the fields of electronics, electric power and two-dimensional materials, the Van der Pauw method is a commonly used method for measuring the in-plane electrical conductivity of a material. According to the mathematical model of the Van der Pauw method, the measured sample needs to have a large length / thickness ratio and no closed holes in the plane to satisfy the two-dimensional plane approximation; at the same time, the material of the measured sample needs to have a uniform thickness distribution so that the potential distribution in the Van der Pauw method test satisfies the uniform semi-infinite plane approximation. When the sample meets the above requirements, the Van der Pauw method can accurately measure the electrical conductivity of a material sample with an arbitrary shaped plane.

[0003] However, for a layered composite material prepared by a process such as hot pressing, or a sample formed of a homogeneous material prepared by a similar process, there is a certain degree of thickness non-uniformity, which does not meet the requirements of the two-dimensional plane approximation and the uniform semi-infinite plane approximation required by the Van der Pauw method. At the same time, if the sample is flattened by machining methods such as turning, milling, planing and grinding, the layered structure of the surface layer of the layered composite material sample will be destroyed, which will also affect the in-layer potential distribution of the sample during the Van der Pauw method test, and thus the sample still cannot meet the requirements of the mathematical model of the Van der Pauw method test.

[0004] Therefore, when measuring the electrical conductivity of the above-mentioned non-standard sample with a certain non-uniform thickness distribution characteristic and not suitable for machining and flattening by the traditional Van der Pauw method, the accuracy of the electrical conductivity cannot be guaranteed. SUMMARY

[0005] The present application provides a method for measuring electrical conductivity and its correction coefficient to solve the defects in the prior art.

[0006] The present application provides a method for measuring the correction coefficient of electrical conductivity, comprising:

[0007] Obtaining thickness distribution data of different points on the surface of the measured sample;

[0008] Determining a thickness surface of the measured sample based on the thickness distribution data;

[0009] Determining a target electrical conductivity correction coefficient of the measured sample based on the thickness surface.

[0010] According to the method for measuring the correction coefficient of electrical conductivity provided by the present application, the target electrical conductivity correction coefficient of the measured sample is determined based on the thickness surface, comprising:

[0011] determining a surface feature of the measured sample based on the thickness profile;

[0012] determining the target conductivity correction factor based on the surface feature and a query table;

[0013] The query table is used to represent the corresponding relationship between the pre-determined surface feature and the conductivity correction factor.

[0014] According to the conductivity correction factor determination method provided by the present application, the query table is determined based on the following steps:

[0015] obtaining a sample of any material with known surface feature;

[0016] Based on a numerical simulation tool, a numerical simulation model sample corresponding to the sample is established, and based on the electrode boundary condition in the numerical simulation model sample, the numerical simulation model sample is simulated and analyzed to obtain the conductivity correction factor of the sample;

[0017] Based on the surface feature and the conductivity correction factor of the sample, the query table is determined.

[0018] According to the conductivity correction factor determination method provided by the present application, the query table is determined based on the following steps:

[0019] obtaining a sample of any material with known surface feature and real conductivity;

[0020] conducting conductivity determination on the sample to obtain a determination result, and based on the determination result and the real conductivity, determining the conductivity correction factor of the sample;

[0021] Based on the surface feature and the conductivity correction factor of the sample, the query table is determined.

[0022] According to the conductivity correction factor determination method provided by the present application, the determination of the target conductivity correction factor of the measured sample based on the thickness profile further comprises:

[0023] Based on a numerical simulation tool, a numerical simulation model corresponding to the thickness profile is established;

[0024] Based on the electrode boundary condition in the numerical simulation model, the numerical simulation model is simulated and analyzed to obtain the target conductivity correction factor.

[0025] The present application also provides a conductivity determination method, comprising:

[0026] Based on the Van der Pauw method, the conductivity of the measured sample is determined to obtain the initial conductivity of the measured sample;

[0027] determining a target conductivity correction coefficient of the measured sample based on the conductivity correction coefficient determination method provided in any of the above embodiments;

[0028] correcting the initial conductivity based on the target conductivity correction coefficient to obtain a final conductivity of the measured sample.

[0029] The application further provides a conductivity correction coefficient determination device, comprising:

[0030] a data acquisition module configured to acquire thickness distribution data of different points on a surface of a measured sample;

[0031] a surface determination module configured to determine a thickness surface of the measured sample based on the thickness distribution data;

[0032] a coefficient determination module configured to determine a target conductivity correction coefficient of the measured sample based on the thickness surface.

[0033] The application further provides a conductivity determination device, comprising:

[0034] a conductivity determination module configured to determine an initial conductivity of a measured sample based on the Van der Pauw method;

[0035] a coefficient determination module configured to determine a target conductivity correction coefficient of the measured sample based on the conductivity correction coefficient determination method provided in any of the above embodiments;

[0036] a conductivity correction module configured to correct the initial conductivity based on the target conductivity correction coefficient to obtain a final conductivity of the measured sample.

[0037] The application further provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the conductivity correction coefficient determination method or the conductivity determination method according to any of the above embodiments.

[0038] The application further provides a non-transitory computer readable storage medium having a computer program stored thereon, wherein the computer program is executable on a processor to implement the conductivity correction coefficient determination method or the conductivity determination method according to any of the above embodiments.

[0039] The application further provides a computer program product comprising a computer program, wherein the computer program is executable on a processor to implement the conductivity correction coefficient determination method or the conductivity determination method according to any of the above embodiments.

[0040] The conductivity and the conductivity correction coefficient measuring method provided by the application, wherein the conductivity correction coefficient measuring method first acquires thickness distribution data of different points on the surface of the measured sample; then determines the thickness surface of the measured sample based on the thickness distribution data; and finally determines the target conductivity correction coefficient of the measured sample based on the thickness surface. The method can effectively eliminate the non-uniform thickness distribution effect of the measured sample, avoid the damage of machining methods such as turning, milling, planing and grinding to the anisotropy characteristics of the material of the measured sample, accurately determine the conductivity correction coefficient of the measured sample, and further provide a correction scheme for the conductivity measurement of the measured sample, improve the accuracy of the measured conductivity of the measured sample, and ensure the product quality of the measured sample and reasonable application. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description can also be used to obtain other drawings without creative labor by those skilled in the art.

[0042] Figure 1 is a flowchart of the conductivity correction coefficient measuring method provided by the application;

[0043] Figure 2 is the query intention in the conductivity correction coefficient measuring method provided by the application;

[0044] Figure 3 is the conductivity σ calculated under different standard conductivities σ of the two different morphology samples in the conductivity correction coefficient measuring method provided by the application true schematic diagram;

[0045] Figure 4 is a flowchart of the conductivity measuring method provided by the application;

[0046] Figure 5 is a structural schematic diagram of the conductivity correction coefficient measuring device provided by the application;

[0047] Figure 6 is a structural schematic diagram of the conductivity measuring device provided by the application;

[0048] Figure 7 is a structural schematic diagram of the electronic device provided by the application. DETAILED DESCRIPTION

[0049] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below in conjunction with the drawings in the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0050] Due to the unique three-dimensional anisotropic characteristics of the layered composite material, the two-dimensionally arranged reinforcing body or filler can provide good conductivity, heat conduction and other properties in the plane for the three-dimensional matrix, which has broad application prospects and research and development value.

[0051] However, the layered composite material is usually prepared by a process such as hot pressing, and for a sample formed by the layered composite material or a homogeneous material prepared by a similar process, there is a certain degree of thickness inhomogeneity of the layered continuity, which does not meet the uniform two-dimensional plane approximation and semi-infinite plane approximation required by the Van der Pauw method. At the same time, if the sample is flattened by machining methods such as turning, milling, planing and grinding, the layered structure of the surface layer of the sample will be destroyed, which will affect the in-layer potential distribution of the layered composite material, and thus the sample still cannot meet the requirements of the mathematical model of the Van der Pauw method.

[0052] Based on this, the present application provides a conductivity correction coefficient determination method, which is suitable for determining the conductivity correction coefficient of any measured sample, and then determining the accurate conductivity of the measured sample according to the conductivity correction coefficient of the measured sample.

[0053] Figure 1 A flowchart of the conductivity correction coefficient determination method provided in the embodiments of the present application is shown in Figure 1 The method comprises the following steps:

[0054] S11, obtaining thickness distribution data of different point positions on the surface of a measured sample;

[0055] S12, determining a thickness surface of the measured sample based on the thickness distribution data;

[0056] S13, determining a target conductivity correction coefficient of the measured sample based on the thickness surface.

[0057] Specifically, the conductivity correction coefficient determination method provided in the embodiments of the present application has an execution subject of a conductivity correction coefficient determination device, which can be configured in a computer. The computer can be a local computer or a cloud computer, and the local computer can be a computer, a tablet and the like, which is not limited here.

[0058] Firstly, step S11 is performed to obtain thickness distribution data of different point positions on the surface of the measured sample. The measured sample refers to a sample whose conductivity correction coefficient needs to be determined, which can meet the requirements of two-dimensional plane approximation and uniform semi-infinite plane approximation, or can not meet the requirements of two-dimensional plane approximation or uniform semi-infinite plane approximation. That is, the measured sample can be a non-standard sample with certain non-uniform thickness distribution characteristics or not suitable for processing and flattening, or a standard sample with uniform thickness distribution, which is not limited here.

[0059] The material of the measured sample can be pure metal material, or layered composite material or homogeneous material prepared by processing, and other materials with non-uniform thickness or processing damage, which is not limited here.

[0060] On the surface of the measured sample, a plurality of uniformly or non-uniformly distributed point positions can be obtained by position sampling. The specific number of point positions can be set as needed, for example, it can be 3 to 10 trillion, which is not limited here, and each point position can be characterized by two-dimensional coordinates.

[0061] At each point position, the thickness data of the measured sample can be measured to obtain the thickness distribution data. It can be understood that the thickness distribution data is a set of thickness data measured at each point position, which can be three-dimensional data, characterized by the corresponding relationship between two-dimensional coordinates and thickness data.

[0062] The thickness distribution data can be automatically detected by three-dimensional imaging or three-dimensional scanning, three-coordinate scanning, industrial CT, etc., to form a data set, or manually measured by thickness gauge, vernier caliper, screw micrometer, etc., to form a point table. Due to the limitation of labor cost and time cost, the data amount in the data set is usually more than that in the point table.

[0063] Then step S12 is performed to determine the thickness surface of the measured sample by fitting or interpolating the thickness distribution data of the measured component. The thickness surface obtained by fitting can be referred to as a fitting surface, and the thickness surface obtained by interpolation can be referred to as an interpolation surface.

[0064] Here, the process of fitting or interpolation can be realized by Matlab, Excel, Origin, etc., which is not limited here.

[0065] Finally, step S13 is performed to determine the target conductivity correction coefficient of the measured sample by using the thickness surface. Here, the target conductivity correction coefficient can be obtained by numerical simulation analysis of the thickness surface, or the surface features of the measured sample can be extracted by the thickness surface to determine the corresponding conductivity correction coefficient, which is taken as the target conductivity correction coefficient, according to the correspondence between the surface features and the conductivity correction coefficient of the measured sample.

[0066] The conductivity correction coefficient determination method provided in the embodiments of the present application first acquires the thickness distribution data of different point positions on the surface of the measured sample, then determines the thickness surface of the measured sample based on the thickness distribution data, and finally determines the target conductivity correction coefficient of the measured sample based on the thickness surface. This method can effectively eliminate the non-uniform thickness distribution effect of the measured sample, avoid the damage to the anisotropy characteristics of the material of the measured sample caused by machining methods such as turning, milling, planing and grinding, accurately determine the conductivity correction coefficient of the measured sample, and further provide a correction scheme for the conductivity determination of the measured sample, improve the accuracy of the determined conductivity of the measured sample, and ensure the product quality of the measured sample and reasonable application.

[0067] Based on the above embodiments, the conductivity correction coefficient determination method provided in the embodiments of the present application includes the following steps:

[0068] determining the surface features of the measured sample based on the thickness surface;

[0069] determining the target conductivity correction coefficient based on the surface features and a query table;

[0070] The query table is used to represent the correspondence between the pre-determined surface features and the conductivity correction coefficient.

[0071] Specifically, when determining the target conductivity correction coefficient of the measured sample, the surface features of the measured sample can be determined by the thickness surface first. The surface features can include the surface peak height features and the surface peak width features of the measured sample, and can further include the position information of the surface peak points of the measured sample. The surface peak height features and the surface peak width features can be obtained by normalizing the parameters of the thickness surface, and the parameters of the thickness surface can be obtained from the expression of the thickness surface.

[0072] For example, in a three-dimensional coordinate system constructed by taking the coordinate plane of different point positions on the surface of the measured sample as the xoy plane and taking the thickness direction of the different point positions as the z axis, if the length and width dimensions of the measured sample are x0 and y0 respectively, and the expression of the thickness surface is z=z0+A*exp(B1*((x-x0) / x0)+B2*((y-y0) / y0)), the surface features of the measured sample can be determined by the thickness surface as follows. c) / w1)^C1+B2*((yy c ) / w2)^C2)). z0 is the intercept parameter of the thickness surface on the z-axis, x c and y c These are the peak center parameters of the thickness surface on the x-axis and y-axis, respectively; A is the peak height coefficient parameter of the thickness surface on the xoy plane; B1 and B2 are the coefficient parameters of the thickness surface in the x and y directions, respectively; w1 and w2 are the peak width coefficient parameters of the thickness surface in the x and y directions, respectively; and C1 and C2 are the exponent parameters of the thickness surface in the x and y directions, respectively. In this embodiment of the invention, the following provisions are made:

[0073] x c =x0 / 2=y c =y0 / 2,

[0074] B1 = B2 = 0.5,

[0075] C1 = C2 = 2,

[0076] w1 = w2, meaning that in this embodiment of the invention, the sample being tested is a square, and the thickness surface of the sample being tested is a Gaussian surface with rotational symmetry, and its rotation axis is located at the center of the sample being tested and is parallel to the normal of the surface of the sample being tested.

[0077] The surface peak height feature can be determined by the following method: First, determine the sum of the coefficient parameter of the thickness surface on the xoy plane and the intercept parameter of the thickness surface on the z axis. Then, the ratio of the peak height coefficient parameter of the thickness surface on the xoy plane to the sum is taken as the surface peak height feature, i.e., A / (A+z0).

[0078] The surface peak width characteristic can be determined based on the following method: the ratio of the peak width parameters w1 and / or w2 of the thickness surface in the x and / or y directions to the length and / or width of the sample under test is taken as the surface peak width characteristic, i.e., ((w1^2+w2^2) / (x0^2+y0^2))^0.5. In this embodiment of the invention, since w1=w2 and x0=y0, the surface peak width characteristic is w1 / x0.

[0079] Subsequently, by utilizing the surface characteristics of the sample under test and substituting them into the lookup table, the target conductivity correction coefficient of the sample under test can be determined.

[0080] This lookup table represents the predetermined correspondence between surface features and conductivity correction coefficients. In this embodiment of the invention, the lookup table is as follows: Figure 2 As shown, Figure 2 The horizontal axis represents the surface peak characteristic, i.e., A / (A+z0), and the vertical axis represents the surface peak width characteristic, i.e., w1 / x0. Figure 2The abscissa and ordinate corresponding to the same conductivity correction factor f can be fitted or interpolated to obtain a curve or a group of curves, Figure 2 In the embodiment, only the curves corresponding to the conductivity correction factors f of 1.10, 1.20, 1.30 and 1.40 are shown.

[0081] If the surface peak height characteristic of the measured sample is A / (A+z0)=35% and the surface peak width characteristic is w1 / x0=45%, it can be known from the query table that the target conductivity correction factor of the measured sample is f=1.062.

[0082] In order to determine the applicability of the query table, in the embodiment, the sensitivity of the query table to samples of different materials and different morphologies is verified by a simulation method. The sample morphology can be represented by the surface peak height characteristic and the surface peak width characteristic of the sample, and different materials can be represented based on different standard conductivities.

[0083] In the COMSOL Multiphysical software, the conductivity correction factors of two samples with different morphologies are calculated under the condition that the standard conductivity σ is 0.1%IACS-200%IACS, and then the initial conductivity determined by the conventional method is corrected by using the conductivity correction factor, so as to obtain the calculated conductivity σ true .

[0084] The conductivities σ true calculated by the two samples with different morphologies under different standard conductivities σ are as shown in the following table. true As shown in the following table, the standard conductivity σ and the calculated conductivity σ test have a strong consistency, so the query table is not sensitive to samples of different materials and can be applied to samples of various materials with different conductivities.

[0085] In the embodiment, since the query table is introduced, the determination process of the target conductivity correction factor can be simplified, the determination difficulty can be reduced, and the determination efficiency can be improved.

[0086] On the basis of the above embodiment, in the conductivity correction factor determination method provided in the embodiment, the query table corresponds to the surface shape of the sample one by one, the query tables corresponding to different sample surface shapes can be the same or different, which is determined according to the actual situation, and is not limited specifically here.

[0087] Correspondingly, the target conductivity correction factor of the measured sample is determined based on the thickness surface, and the target conductivity correction factor of the measured sample is determined based on the thickness surface.

[0088] The surface shape of the measured sample is determined.

[0089] Determine the target conductivity correction coefficient based on the surface feature and the corresponding query table of the surface shape, that is, find the target conductivity correction coefficient corresponding to the surface feature of the measured sample from the query table corresponding to the surface shape of the measured sample.

[0090] The surface shape of the measured sample can be square, rectangular, or circular, and can also be other irregular shapes, which are not limited here.

[0091] Based on the above embodiments, the conductivity correction coefficient determination method provided in the embodiments of the present application is determined based on the following steps:

[0092] Obtain a sample of any material with known surface features;

[0093] Based on a numerical simulation tool, establish a numerical simulation model sample corresponding to the sample, and based on the electrode boundary conditions in the numerical simulation model sample, perform simulation analysis on the numerical simulation model sample to obtain the conductivity correction coefficient of the sample;

[0094] Determine the query table based on the surface features and the conductivity correction coefficient of the sample.

[0095] Specifically, since the query table has good applicability, it can be determined using a sample of any material.

[0096] First, a sample of any material with known surface features can be obtained, which can be a virtual sample obtained by software simulation. The surface features of the sample can be obtained by analyzing the thickness distribution data samples of different points on the surface of the sample, which will not be described here.

[0097] Then, using a numerical simulation tool, a numerical simulation model sample corresponding to the sample can be established, and the numerical simulation model sample is simulated and analyzed using the electrode boundary conditions in the numerical simulation model sample to obtain the conductivity correction coefficient of the sample. The numerical simulation tool can be COMSOL, Aansys workbench, Maxwell, Fluent, etc., which are not limited here.

[0098] The electrode boundary condition refers to the boundary condition corresponding to four or more electrodes configured on the surface of the sample: one of the electrodes corresponds to a boundary condition with a fixed potential value or a ground boundary, and the other two adjacent electrodes correspond to input / output current boundaries with equal numerical values and opposite directions, and the fourth or more electrodes do not define a boundary condition.

[0099] In the simulation analysis of the numerical simulation model sample, a physical field such as an electric field, a magnetic field, an electromagnetic field, or an electrostatic field or an interface can be selected, that is, the simulation analysis of the numerical simulation model sample under the corresponding physical field is realized.

[0100] Finally, the corresponding relationship between the surface feature of the sample sample and the conductivity correction coefficient is constructed, and thus the required query table is obtained.

[0101] In the embodiment of the application, the query table can be determined by using a sample sample of any material due to the wide applicability of the query table, and thus the difficulty of determining the query table can be greatly reduced.

[0102] On the basis of the above embodiment, the conductivity correction coefficient determination method provided in the embodiment of the application is determined based on the following steps:

[0103] A sample sample of any material with known surface feature and real conductivity is obtained;

[0104] The conductivity of the sample sample is determined to obtain a determination result, and the conductivity correction coefficient of the sample sample is determined based on the determination result and the real conductivity;

[0105] The query table is determined based on the surface feature and the conductivity correction coefficient of the sample sample.

[0106] Specifically, the query table can be determined by using a sample sample of any material due to the good applicability of the query table.

[0107] Firstly, a sample sample of any material with known surface feature and real conductivity can be obtained, and the sample sample can be a real sample constructed or generated.

[0108] Then, the conductivity of the sample sample is determined by using a method such as the Van der Pauw method to obtain a determination result.

[0109] Finally, the corresponding relationship between the surface feature and the conductivity correction coefficient of the sample sample is constructed, and thus the required query table is obtained.

[0110] In the embodiment of the application, the query table can be determined by using a sample sample of any material due to the wide applicability of the query table, and thus the difficulty of determining the query table can be greatly reduced.

[0111] On the basis of the above-mentioned embodiments, the conductivity correction coefficient determination method provided in the embodiments of the present application, for determining the target conductivity correction coefficient of the measured sample based on the thickness surface, further comprises:

[0112] Based on the numerical simulation tool, a numerical simulation model corresponding to the thickness surface is established;

[0113] Based on the electrode boundary condition in the numerical simulation model, the numerical simulation model is simulated and analyzed to obtain the target conductivity correction coefficient.

[0114] Specifically, in the embodiments of the present application, the target conductivity correction coefficient of the measured sample can also be determined by numerical simulation analysis of the thickness surface, that is, a numerical simulation model corresponding to the thickness surface can be established by using a numerical simulation tool, and then the numerical simulation model is simulated and analyzed by using the electrode boundary condition in the numerical simulation model to obtain the target conductivity correction coefficient. The process is consistent with the process of determining the conductivity correction coefficient of the sample sample described above, and will not be repeated here.

[0115] In the embodiments of the present application, the numerical simulation tool can be used to accurately determine the target conductivity correction coefficient of the measured sample, thereby improving the accuracy.

[0116] Since the traditional Van der Pauw method cannot guarantee the accuracy of the conductivity when determining the conductivity of the measured sample with non-uniform thickness distribution, based on the above-mentioned embodiments, as shown in Figure 4 The embodiments of the present application also provide a conductivity determination method, which comprises:

[0117] S21, determining the conductivity of the measured sample based on the Van der Pauw method to obtain the initial conductivity of the measured sample;

[0118] S22, determining the target conductivity correction coefficient of the measured sample based on the conductivity correction coefficient determination method provided in the above-mentioned embodiments;

[0119] S23, correcting the initial conductivity based on the target conductivity correction coefficient to obtain the final conductivity of the measured sample.

[0120] Specifically, the conductivity determination method provided in the embodiments of the present application has an execution subject of a conductivity determination device, which can be configured in a computer, which can be a local computer or a cloud computer. The local computer can be a computer, a tablet, etc., which is not limited here.

[0121] First, step S21 is performed, and the conventional Van der Pauw method is used to determine the conductivity of the measured sample to obtain the initial conductivity of the measured sample.

[0122] Then, step S22 is performed to determine the target conductivity correction factor of the measured sample based on the conductivity correction factor determination method provided in the above embodiments. This step can refer to the above embodiments in which the conductivity correction factor determination device is the main execution subject, and will not be described here.

[0123] Finally, step S23 is performed to correct the initial conductivity using the target conductivity correction factor obtained in step S22, so that the final conductivity of the measured sample is obtained. The final conductivity is the accurate conductivity of the measured sample.

[0124] The conductivity determination method provided in the embodiments of the present application first determines the initial conductivity of the measured sample based on the Van der Pauw method, then determines the target conductivity correction factor of the measured sample based on the conductivity correction factor determination method provided in the above embodiments, and finally corrects the initial conductivity based on the target conductivity correction factor to obtain the final conductivity of the measured sample. This method can effectively eliminate the non-uniform thickness distribution effect of the measured sample by introducing the target conductivity correction factor and its determination method, avoid the damage to the anisotropy characteristics of the material of the measured sample caused by machining methods such as turning, milling, planing, and grinding, and obtain the true and accurate conductivity determination result of the measured sample formed by layered composite materials or non-layered homogeneous materials.

[0125] Based on the above embodiments, the conductivity determination method provided in the embodiments of the present application, which corrects the initial conductivity based on the target conductivity correction factor to obtain the final conductivity of the measured sample, includes:

[0126] Determining the final conductivity based on the ratio of the initial conductivity to the target conductivity correction factor.

[0127] Specifically, when the initial conductivity is corrected using the target conductivity correction factor, the ratio of the initial conductivity to the target conductivity correction factor can be calculated, and the ratio is determined as the final conductivity of the measured sample. That is, if the initial conductivity is σ test , the target conductivity correction factor is f, and the final conductivity of the measured sample is σ true = σ test / f.

[0128] The following specific embodiments are given to explain in detail:

[0129] Embodiment 1

[0130] For example, a pure copper material non-uniform thickness sample with a size of about 100mm*100mm*1.5mm is taken as the measured sample 1, and the initial conductivity of the measured sample is σ test= 112.9% IACS.

[0131] The thickness distribution data of the measured sample 1 is shown in Table 1, wherein the unit of each data is mm.

[0132] Table 1 Thickness distribution data table of the measured sample 1

[0133]

[0134]

[0135] The expression of the thickness surface of the measured sample 1 is:

[0136] z = 0.755358397 + 0.755358397 * exp(-0.5*((x-52.3290587) / 42.2822194)^2-((y-42.2822194) / 42.6343018)^2));

[0137] According to the thickness surface of the measured sample 1, a three-dimensional numerical simulation model is established in Ansys Maxwell software, and a three-dimensional current model is used. Under the input current of 1A, the target conductivity correction factor of the measured sample 1 is calculated to be f = 1.131.

[0138] The final conductivity of the measured sample 1 is σ true = 112.9% IACS / 1.131 = 99.8% IACS, which meets the standard conductivity of the material of the measured sample 1.

[0139] Example 2

[0140] For example, the layered composite sample with a size of about 20mm*20mm*0.4mm is taken as the measured sample 2, and its initial conductivity is σ test = 119.5% IACS.

[0141] The thickness distribution data obtained by using the vernier caliper and the thickness gauge is shown in Table 2, wherein the unit of each data is mm.

[0142] Table 2 Thickness distribution data table of the measured sample 2

[0143]

[0144] The thickness surface of the measured sample 2 is obtained by spline function interpolation of the three-dimensional surface.

[0145] The thickness curve of the measured sample 2 is input into the COMSOL Multiphysical finite element software, a two-dimensional current interface is used, under an input current of 5A, the target conductivity correction coefficient of the measured sample 2 is calculated to be f = 1.162. The final conductivity of the measured sample 2 is σ true = 119.5% IACS / 1.162 = 102.8% IACS, which meets the standard conductivity of the material of the measured sample 2.

[0146] Example 3

[0147] For example, the measured sample 3 is a layered composite material sample with a size of about 100mm*100mm*1mm, which is tested by the Van der Pauw method, and the initial conductivity is σ test = 107.5% IACS.

[0148] The data set A composed of the thickness distribution data of the measured sample 3 is measured by using a high-precision three-dimensional scanning measuring instrument;

[0149] The data stored in the data set A is fitted to obtain the thickness curve of the measured sample 3, the thickness curve is input into the COMSOL Multiphysical finite element software, a three-dimensional current interface is used, under an input current of 1A, the conductivity correction coefficient of the measured sample 3 is calculated to be f = 1.048. The final conductivity of the measured sample 3 is σ true = 107.5% IACS / 1.048 = 102.6% IACS, which meets the standard conductivity of the material of the measured sample 3.

[0150] Example 4

[0151] For example, the measured sample 4 of pure copper with a non-uniform thickness distribution is tested by the Van der Pauw method, and the initial conductivity is σ test = 107.2%, the surface peak height characteristic is A / (A+z0) = 35%, and the surface peak width characteristic is w1 / x0 = 45%. Based on the query table shown in Figure 2 , it can be known that the target conductivity correction coefficient is f = 1.062. The final conductivity of the measured sample 4 is σ true = 107.2% IACS / 1.062 = 101.1% IACS, which meets the standard conductivity of the pure copper material of the measured sample 4.

[0152] As shown in Figure 5 , on the basis of the above examples, the conductivity correction coefficient measuring device provided in the embodiment of the application comprises:

[0153] The data acquisition module 51 is configured to acquire the thickness distribution data of different point positions on the surface of the measured sample;

[0154] The curved surface determination module 52 is configured to determine a thickness curved surface of the measured sample based on the thickness distribution data.

[0155] The coefficient determination module 53 is configured to determine a target conductivity correction coefficient of the measured sample based on the thickness curved surface.

[0156] Based on the above-mentioned embodiments, the conductivity correction coefficient determination device provided in the embodiments of the present application further comprises a coefficient determination module, which is specifically configured to:

[0157] determine a surface peak height feature and a surface peak width feature of the measured sample based on the thickness curved surface;

[0158] determine the target conductivity correction coefficient based on the surface feature and a query table;

[0159] The query table is used to represent the corresponding relationship between the pre-determined surface feature and the conductivity correction coefficient.

[0160] Based on the above-mentioned embodiments, the conductivity correction coefficient determination device provided in the embodiments of the present application further comprises a query table determination module, which is configured to:

[0161] obtain a sample sample of any material with a known surface feature;

[0162] establish a numerical simulation model sample corresponding to the sample sample based on a numerical simulation tool, and perform simulation analysis on the numerical simulation model sample based on an electrode boundary condition in the numerical simulation model sample to obtain a conductivity correction coefficient of the sample sample;

[0163] determine the query table based on the surface feature and the conductivity correction coefficient of the sample sample.

[0164] Based on the above-mentioned embodiments, the conductivity correction coefficient determination device provided in the embodiments of the present application further comprises a query table determination module, which is configured to:

[0165] obtain a sample sample of any material with a known surface feature and a known real conductivity;

[0166] determine a conductivity correction coefficient of the sample sample based on a determination result and the real conductivity, wherein the determination result is obtained by performing conductivity determination on the sample sample;

[0167] determine the query table based on the surface feature and the conductivity correction coefficient of the sample sample.

[0168] Based on the above-mentioned embodiments, the conductivity correction coefficient determination device provided in the embodiments of the present application further comprises a coefficient determination module, which is specifically configured to:

[0169] A numerical simulation model corresponding to the thickness surface is established based on numerical simulation tools.

[0170] Based on the electrode boundary conditions within the numerical simulation model, the numerical simulation model is simulated and analyzed to obtain the target conductivity correction coefficient.

[0171] Specifically, the functions of each module in the conductivity correction coefficient measuring device provided in this embodiment of the invention correspond one-to-one with the operation flow of each step in the above method-like embodiments, and the achieved effects are also the same. For details, please refer to the above embodiments, and this will not be repeated in this embodiment of the invention.

[0172] like Figure 6 As shown, based on the above embodiments, the conductivity measuring device provided in this embodiment of the invention includes:

[0173] The conductivity measurement module 61 is used to measure the conductivity of the sample under test based on the van der Burg method to obtain the initial conductivity of the sample under test.

[0174] The coefficient determination module 62 is used to determine the target conductivity correction coefficient of the tested sample based on the conductivity correction coefficient determination method provided in the above embodiments.

[0175] The conductivity correction module 63 is used to correct the initial conductivity based on the target conductivity correction coefficient to obtain the final conductivity of the sample under test.

[0176] Based on the above embodiments, the conductivity measuring device provided in this embodiment of the invention, wherein the conductivity correction module is specifically used for:

[0177] The final conductivity is determined based on the ratio of the initial conductivity to the target conductivity correction coefficient.

[0178] Specifically, the functions of each module in the conductivity measuring device provided in this embodiment of the invention correspond one-to-one with the operation flow of each step in the above method-like embodiments, and the achieved effects are also the same. For details, please refer to the above embodiments, and this will not be repeated in this embodiment of the invention.

[0179] Figure 7 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 7As shown, the electronic device can include a processor 710, a communications interface 720, a memory 730, and a communications bus 740, wherein the processor 710, the communications interface 720, and the memory 730 complete communications with each other through the communications bus 740. The processor 710 can invoke a logical instruction in the memory 730 to execute the conductivity correction coefficient determination method provided in each of the above embodiments, which includes: obtaining thickness distribution data of different point positions on a surface of a measured sample; determining a thickness surface of the measured sample based on the thickness distribution data; and determining a target conductivity correction coefficient of the measured sample based on the thickness surface. Alternatively, the processor 710 can execute the conductivity determination method provided in each of the above embodiments, which includes: determining the initial conductivity of the measured sample based on the Van der Pauw method; determining the target conductivity correction coefficient of the measured sample based on the conductivity correction coefficient determination method provided in each of the above embodiments; and correcting the initial conductivity based on the target conductivity correction coefficient to obtain the final conductivity of the measured sample.

[0180] In addition, the logical instruction in the memory 730 described above can be implemented in the form of a software functional unit and sold or used as an independent product, which can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application essentially or the part that contributes to the prior art or part of the technical solutions can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a plurality of instructions to make a computer device (which can be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in each embodiment of the present application. The foregoing storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various program code storage media.

[0181] In another aspect, the present application also provides a computer program product, which comprises a computer program stored on a non-transitory computer readable storage medium, and the computer program can be executed by a processor to enable a computer to perform the conductivity correction coefficient determination method provided in the above embodiments, which comprises: obtaining thickness distribution data of different point positions on a surface of a measured sample; determining a thickness surface of the measured sample based on the thickness distribution data; and determining a target conductivity correction coefficient of the measured sample based on the thickness surface. Alternatively, the computer program can be executed by the processor to enable the computer to perform the conductivity determination method provided in the above embodiments, which comprises: determining the conductivity of the measured sample based on the Van der Pauw method to obtain an initial conductivity of the measured sample; determining the target conductivity correction coefficient of the measured sample based on the conductivity correction coefficient determination method provided in the above embodiments; and correcting the initial conductivity based on the target conductivity correction coefficient to obtain a final conductivity of the measured sample.

[0182] In another aspect, the present application also provides a non-transitory computer readable storage medium, which stores a computer program, and the computer program can be executed by a processor to enable the computer to perform the conductivity correction coefficient determination method provided in the above embodiments, which comprises: obtaining thickness distribution data of different point positions on a surface of a measured sample; determining a thickness surface of the measured sample based on the thickness distribution data; and determining a target conductivity correction coefficient of the measured sample based on the thickness surface. Alternatively, the computer program can be executed by the processor to enable the computer to perform the conductivity determination method provided in the above embodiments, which comprises: determining the conductivity of the measured sample based on the Van der Pauw method to obtain an initial conductivity of the measured sample; determining the target conductivity correction coefficient of the measured sample based on the conductivity correction coefficient determination method provided in the above embodiments; and correcting the initial conductivity based on the target conductivity correction coefficient to obtain a final conductivity of the measured sample.

[0183] The apparatus embodiments described above are merely illustrative, wherein the units shown as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., they can be located in one place, or distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the present embodiment according to actual needs. Those skilled in the art can understand and implement it without creative labor.

[0184] Those skilled in the art can clearly understand the technical solutions of the various embodiments from the above description of the embodiments, and the various embodiments can be implemented by means of software with the necessary general hardware platforms, and of course, can also be implemented by hardware. Based on such understanding, the above technical solutions, essentially or in other words, the part of the prior art that makes a contribution, can be embodied in the form of a software product, which can be stored in a computer readable storage medium, such as a ROM / RAM, a magnetic disk, an optical disk, and the like, and includes a number of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0185] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for some technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method of determining a conductivity correction factor, characterized by, The method comprises the following steps: acquiring thickness distribution data of different point positions on the surface of a measured sample piece; determining a thickness surface of the measured sample piece based on the thickness distribution data; determining a target electrical conductivity correction coefficient of the measured sample piece based on the thickness surface; the step of determining the target electrical conductivity correction coefficient of the measured sample piece based on the thickness surface comprises: determining surface characteristics of the measured sample piece based on the thickness surface; determining the target electrical conductivity correction coefficient based on the surface characteristics and a query table; wherein the query table is used to represent the corresponding relationship between the pre-determined surface characteristics and the electrical conductivity correction coefficient; the surface characteristics include surface peak height characteristics, surface peak width characteristics and position information of surface peak points of the measured sample piece; The expression of the thickness curve is z = z0 + A * exp(B1*((x-x c ) / w1)^C1 + B2*((y-y c ) / w2)^C2)), z0 is an intercept parameter of the thickness curve on the z axis, x c and y c are peak center parameters of the thickness curve on the x axis and the y axis respectively, A is a peak height coefficient parameter of the thickness curve on the xoy plane, B1 and B2 are coefficient parameters of the thickness curve on the x direction and the y direction respectively, w1 and w2 are peak width coefficient parameters of the thickness curve on the x direction and the y direction respectively, and C1 and C2 are exponential parameters of the thickness curve on the x direction and the y direction respectively. the determination of the surface peak height characteristics comprises the following steps: firstly, determining the sum of a peak height coefficient parameter of the thickness surface on the xoy plane and an intercept parameter of the thickness surface on the z axis, and then taking the ratio of the peak height coefficient parameter of the thickness surface on the xoy plane and the sum as the surface peak height characteristics; the determination of the surface peak width characteristics comprises the following steps: taking the ratio of the peak width coefficient parameter w1 and / or w2 of the thickness surface on the x direction and / or the y direction and the length and / or width of the measured sample piece as the surface peak width characteristics.

2. The method of claim 1, wherein The query table is determined based on the following steps: acquiring a sample sample of any material with known surface characteristics; establishing a numerical simulation model sample corresponding to the sample sample based on a numerical simulation tool, and performing simulation analysis on the numerical simulation model sample based on the electrode boundary condition in the numerical simulation model sample to obtain the electrical conductivity correction coefficient of the sample sample; determining the query table based on the surface characteristics and the electrical conductivity correction coefficient of the sample sample.

3. The method of claim 1, wherein The query table is further determined based on the following steps: acquiring a sample sample of any material with known surface characteristics and real electrical conductivity; determining the electrical conductivity correction coefficient of the sample sample based on the determination result and the real electrical conductivity; determining the query table based on the surface characteristics and the electrical conductivity correction coefficient of the sample sample.

4. A method of conductivity measurement, characterized by, The method comprises the following steps: determining the initial electrical conductivity of the measured sample piece based on the Van der Pauw method; determining the target electrical conductivity correction coefficient of the measured sample piece based on the electrical conductivity correction coefficient determination method of any one of claims 1-3; correcting the initial electrical conductivity based on the target electrical conductivity correction coefficient to obtain the final electrical conductivity of the measured sample piece.

5. A conductivity correction factor measuring device characterized by comprising: The method comprises the following steps: a data acquisition module for acquiring thickness distribution data of different point positions on the surface of a measured sample piece; a surface determination module for determining a thickness surface of the measured sample piece based on the thickness distribution data; a coefficient determination module for determining a target electrical conductivity correction coefficient of the measured sample piece based on the thickness surface; the coefficient determination module is specifically used for: determining surface characteristics of the measured sample piece based on the thickness surface; determine the target conductivity correction coefficient based on the surface feature and a query table; wherein the query table is used to represent a correspondence relationship between a pre-determined surface feature and a conductivity correction coefficient; the surface feature includes a surface peak height feature, a surface peak width feature, and position information of a surface peak point of the measured sample piece; the surface feature includes a surface peak height feature, a surface peak width feature, and position information of a surface peak point of the measured sample piece; The expression of the thickness curve is z = z0 + A * exp(B1*((x-x c ) / w1)^C1 + B2*((y-y c ) / w2)^C2)), z0 is an intercept parameter of the thickness curve on the z axis, x c and y c are peak center parameters of the thickness curve on the x axis and the y axis respectively, A is a peak height coefficient parameter of the thickness curve on the xoy plane, B1 and B2 are coefficient parameters of the thickness curve on the x direction and the y direction respectively, w1 and w2 are peak width coefficient parameters of the thickness curve on the x direction and the y direction respectively, and C1 and C2 are exponential parameters of the thickness curve on the x direction and the y direction respectively. the determination of the surface peak height feature includes: determining a sum of a peak height coefficient parameter of the thickness surface on the xoy plane and an intercept parameter of the thickness surface on the z axis, and then taking a ratio of the peak height coefficient parameter of the thickness surface on the xoy plane to the sum as the surface peak height feature; the determination of the surface peak width feature includes: taking a ratio of a peak width coefficient parameter w1 and / or w2 of the thickness surface on the x direction and / or the y direction to a length and / or width of the measured sample piece as the surface peak width feature.

6. An electrical conductivity measuring device, characterized by comprising: a conductivity measurement module configured to measure a conductivity of a measured sample piece based on the Van der Pauw method to obtain an initial conductivity of the measured sample piece; a coefficient determination module configured to determine a target conductivity correction coefficient of the measured sample piece based on the conductivity correction coefficient measurement method of any one of claims 1-3; a conductivity correction module configured to correct the initial conductivity based on the target conductivity correction coefficient to obtain a final conductivity of the measured sample piece.

7. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The processor executes the program to implement the conductivity correction coefficient measurement method of any one of claims 1-3, or the conductivity measurement method of any one of claim 4.

8. A non-transitory computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the conductivity correction coefficient measurement method of any one of claims 1-3, or the conductivity measurement method of any one of claim 4.

Images