A hard disk backboard assembly method, electronic equipment and medium

Abstract

The application discloses a hard disk backboard assembly method, electronic equipment and medium, and relates to the technical field of servers.The method comprises the following steps: acquiring the number of hard disks required by a current service; formulating a hard disk backboard assembly strategy according to the number of hard disks, a main control module, an expansion module and a hard disk module, wherein the hard disk backboard assembly strategy comprises a first number of the main control modules, a second number of the expansion modules and a third number of the hard disk modules; assembling the first number of the main control modules, the second number of the expansion modules and the third number of the hard disk modules according to the hard disk backboard assembly strategy, so as to form a hard disk backboard suitable for the current service; and connecting the hard disk backboard with a server mainboard through the main control module.The application can form backboards with different hard disk requirements by assembling different module combinations, so as to meet different service requirements.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a hard disk backplane assembly method, electronic equipment, and media. Background Technology

[0002] Currently, due to the high versatility of servers, a single server often needs to be adapted to different business scenarios to meet diverse customer needs. A server that can meet various requirements will offer significantly improved cost-effectiveness; therefore, server development strives to enhance compatibility in all aspects.

[0003] Currently, most servers require backplanes to expand hard drive capacity and improve performance. In traditional backplane designs, the mapping relationship between nodes and hard drives is generally fixed, and the number of hard drives corresponding to one node is also fixed. However, as different business needs change, the number of hard drives that the same node needs to map may vary depending on the business scenario. The basic backplane functional design remains the same, with the only difference being the different hard drive requirements or performance requirements.

[0004] Due to the limitations of traditional backplane designs, they cannot adequately meet the needs of different business scenarios. Each server requires a separately developed backplane for its specific hard drive requirements, necessitating the motherboard to be equipped with numerous backplanes of varying designs to satisfy diverse business needs. This increases R&D costs, manpower, development time, and testing time, significantly reducing the motherboard's cost-effectiveness. Summary of the Invention

[0005] To address at least one of the problems mentioned in the background art, this application provides a hard disk backplane assembly method, electronic device, and medium, which can form backplanes with different hard disk requirements by assembling different module combinations to meet different business needs.

[0006] The specific technical solutions provided in this application are as follows:

[0007] Firstly, a method for assembling a hard drive backplane is provided, including:

[0008] Get the number of hard drives required for the current business;

[0009] A hard drive backplane assembly strategy is formulated based on the number of hard drives, main control modules, expansion modules, and hard drive modules. The hard drive backplane assembly strategy includes a first number of main control modules, a second number of expansion modules, and a third number of hard drive modules.

[0010] According to the hard disk backplane assembly strategy, the first number of main control modules, the second number of expansion modules, and the third number of hard disk modules are assembled into a hard disk backplane adapted to the current service.

[0011] The hard drive backplane is connected to the server motherboard via the main control module.

[0012] Furthermore, the main control module, the hard disk module, and the expansion module are all equipped with multiple inter-board connectors that can be used for mutual insertion.

[0013] The main control module, the hard disk module, and the expansion module can be interlocked in pairs via the inter-board connector;

[0014] The main control module is used to obtain the board information of the hard disk module and the expansion module, and to interact with the server motherboard.

[0015] The expansion module is used to enhance and amplify the signal quantity, and to connect the main control module and the hard disk module to facilitate information transmission between the main control module and the hard disk module;

[0016] The hard disk module is used to connect one or more hard disks and to supply power to the hard disks.

[0017] Furthermore, the hard disk module also includes an upstream connector, a downstream connector, and a hard disk connector. Both the upstream connector and the downstream connector include a high-speed signal connector high-level component and a high-speed signal connector low-level component.

[0018] The method further includes:

[0019] Connect the low-end of the high-speed signal connector of the uplink connector in the hard disk module to the hard disk connector of the hard disk module;

[0020] Connect the high-speed signal connector high position of the uplink connector to the low-speed signal connector low position of the downlink connector in the hard disk module.

[0021] Furthermore, the hard disk module includes a first hard disk module and a second hard disk module, and the method further includes:

[0022] When the first hard disk module and the second hard disk module are connected, the high-speed signal connector high position of the downlink connector of the first hard disk module is connected to the high-speed signal connector high position of the uplink connector of the second hard disk module, and the low position of the downlink connector of the first hard disk module is connected to the low position of the uplink connector of the second hard disk module.

[0023] or,

[0024] Connect the high-speed signal connector high position of the uplink connector of the first hard disk module to the high-speed signal connector high position of the downlink connector of the second hard disk module, and connect the low position of the high-speed signal connector low position of the uplink connector of the first hard disk module to the low position of the high-speed signal connector of the downlink connector of the second hard disk module.

[0025] Furthermore, the hard drive backplane assembly strategy also includes:

[0026] If the main control module, all the expansion modules, and all the hard disk modules are assembled on the same plane, one end of the assembly of the main control module, the expansion module, and the hard disk module is connected by a clamp or a right-angle connector, and the other end is connected by a gold finger.

[0027] or,

[0028] The main control module, the expansion module, and the hard disk module are all connected at both ends by clamps or right-angle connectors, and the two ends are connected by interlocking gold finger cards.

[0029] Furthermore, the hard drive backplane assembly strategy also includes:

[0030] If any two of the main control module, the expansion module and the hard disk module are assembled vertically, one end of the two modules is connected by a vertical connector and the other end is connected by a gold finger.

[0031] or,

[0032] The two modules are assembled at one end via a clamp or right-angle connector, and at the other end via a vertical connector. The two ends are connected by interlocking gold finger cards.

[0033] Furthermore, the main control module includes at least one of a complex programmable logic device chip, a two-wire serial bus logic device, and a power supply chip.

[0034] Furthermore, the expansion module includes at least one of a retimer chip, a high-speed serial computer expansion bus standard expansion chip, and a serial connection small computer system interface expansion chip.

[0035] In a second aspect, an electronic device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement a method for assembling the hard disk backplane.

[0036] Thirdly, a computer-readable storage medium is provided, storing computer-executable instructions for performing the assembly method of the hard disk backplane.

[0037] The embodiments of this application have the following beneficial effects:

[0038] This application provides a hard disk backplane and its assembly method, which can divide the hard disk backplane into main control modules, expansion modules, and hard disk modules according to their functions and design them separately. Each module can be interlocked through board-side connectors, and each module can be fixed into a suitable assembly board shape according to actual business needs. By assembling different modules, hard disk backplanes with different business requirements can be formed, unifying the design of main control modules, hard disk modules, and expansion modules, unifying the functions of each server backplane, and eliminating the need for additional manpower to design the same backplane content. It can also design the expansion modules into three different types to support enhanced high-speed signal quality, provide more PCIe signals, and provide more SAS and SATA signals respectively. Furthermore, it can unify the design of hard disk modules through a unified hard disk connection method to improve the reusability of hard disk modules. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This document shows a general flowchart of the hard disk backplane assembly method provided in an embodiment of this application;

[0041] Figure 2 This illustration shows a structural diagram of the main control module, expansion module, and hard disk module provided in an embodiment of this application;

[0042] Figure 3 This diagram illustrates a main high-speed topology example of a main control module, an expansion module, and a hard disk module according to an embodiment of this application.

[0043] Figure 4 A schematic diagram showing the connection method of an 8-hard drive backplane module according to an embodiment of this application is provided.

[0044] Figure 5 A schematic diagram showing the connection method of a backplane module of 16 hard drives according to an embodiment of this application is provided.

[0045] Figure 6 A schematic diagram showing the connection method of a first hard disk module and a second hard disk module according to an embodiment of this application is provided.

[0046] Figure 7 Exemplary systems that can be used to implement the various embodiments described in this application are shown;

[0047] Reference numerals: 1. Main control module; 2. Expansion module; 3. Hard disk module; 31. First hard disk module; 32. Second hard disk module; 33. Uplink connector; 34. Downlink connector; 35. Hard disk connector; 4. Inter-board connector. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0049] It should be understood that, in the description of this application, unless the context explicitly requires it, the words "comprising," "including," and similar terms throughout the specification and claims should be interpreted as encompassing rather than being exclusive or exhaustive; that is, meaning "including but not limited to."

[0050] It should also be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0051] Example 1

[0052] This application provides a method for assembling a hard disk backplane, referring to... Figure 1 The methods include:

[0053] S1. Obtain the number of hard drives required for the current business;

[0054] S2. Develop a hard drive backplane assembly strategy based on the number of hard drives, main control module, expansion module, and hard drive modules. The hard drive backplane assembly strategy includes the first number of main control modules, the second number of expansion modules, and the third number of hard drive modules.

[0055] S3. According to the hard disk backplane assembly strategy, assemble the first number of main control modules, the second number of expansion modules and the third number of hard disk modules into a hard disk backplane adapted to the current business.

[0056] S4. Connect the hard drive backplane to the server motherboard via the main control module.

[0057] Specifically, refer to Figure 2The main control module 1, hard disk module 3, and expansion module 2 are each equipped with multiple inter-board connectors 4 for mutual insertion. These connectors allow for pairwise insertion. The main control module 1 acquires board information from the hard disk module 3 and expansion module 2, and interacts with the server motherboard. The expansion module 2 amplifies and increases the signal strength, and connects the main control module 1 and hard disk module 3 to facilitate information transmission. The hard disk module 3 connects to one or more hard disks and provides power to them.

[0058] Specifically, refer to Figure 3The hard drive backplane can be divided into three main modules: main control module 1, expansion module 2, and hard drive module 3, each designed separately. Based on actual business needs, each module is fixed with a suitable board type for assembly. Each module board has inter-board connectors 4 for module assembly. By designing the hard drive backplane functionality in modules, different backplanes can be assembled to meet different business requirements. This unifies the design of main control module 1, hard drive module 3, and expansion module 2, standardizing the functionality of each server backplane and eliminating the need for redundant manpower designing identical backplane content. The specific hardware backplane design logic and the board structure of main control module 1, hard drive module 3, and expansion module 2 can refer to conventional designs; their logic and structure are not limited here. The main control module 1 primarily includes a CPLD (Complex Programmable Logic Device) chip, main I2C (Inter-Integrated Circuit) logic devices, and a VR (Voltage Regulator Chip) chip. These components ensure the power-on, LED activation, and operational logic of the hard drive backplane, retrieve information from the interconnected expansion module 2 or hard drive module 3, and interact with the motherboard. Expansion module 2 primarily includes a retimer chip, a PCIe (Peripheral Component Interconnect Express) switch chip, and a SAS (Serial Attached SCSI) expander chip, among other high-speed signal enhancement or expansion modules. These enhance signal stability, increase the number of signals, and facilitate information transmission between the main control module 1 and hard drive module 3. They also support some logic control of lower-level hard drive modules 3. Hard drive module 3 primarily includes a hard drive connector 35 and a power supply efuse, used to connect one or more hard drives and ensure power supply to them. For example, to determine the baseline design, the basic hard disk module 3 can be configured to support two hard disks. After unifying the design of the above three modules (main control module 1, expansion module 2, and hard disk module 3), the modules can be assembled into a complete backplane according to the actual needs of different servers to support different numbers and resource performance of hard disks.

[0059] Specifically, the hard drive backplane is the component that supports the interconnection between the server motherboard and the storage, providing a framework for power and data transmission for the supported storage. PCIe stands for PCI-Express (Peripheral Component Interconnect Express), a high-speed serial computer expansion bus standard. PCIe uses a point-to-point serial transmission method, known as "serial PCI." Because of this serial transmission method, its operating frequency can reach 2.5GHz, greatly increasing the transmission rate. Simultaneously, it uses full-duplex communication, doubling its transmission speed. Each PCIe bus device has four data buses when communicating with external devices: two for transmitting and two for receiving. PCIe switch chips can provide expansion or aggregation capabilities, allowing more devices to connect to a single PCIe port. They act as packet routers, identifying the path a given packet should take based on its address or other routing information; they are PCIe-to-PCIe bridges.

[0060] Specifically, SAS hard drives and SATA (Serial Advanced Technology Attachment) hard drives are two different interface types, both using serial technology. Serial Attachment SCSI (Small Computer System Interface) is a next-generation SCSI technology that uses serial technology to achieve higher transfer speeds and improve internal space by shortening connection cables. SATA hard drives, also called serial port hard drives, use a bus interface to connect the host bus adapter to the hard drive. SAS expander chips provide expansion capabilities, extending the range of SAS and SATA signals; they act as a SAS-to-SAS bridge.

[0061] In some implementations, refer to Figure 6 The hard disk module 3 also includes an upstream connector 33, a downstream connector 34, and a hard disk connector 35. Both the upstream connector 33 and the downstream connector 34 include a high-speed signal connector high bit and a high-speed signal connector low bit. Based on this, the method further includes:

[0062] Connect the low-end of the high-speed signal connector of the uplink connector 33 in the hard disk module 3 to the hard disk connector 35 of the hard disk module 3.

[0063] Connect the high-speed signal connector high position of the uplink connector 33 to the low-speed signal connector low position of the downlink connector 34 in the hard disk module 3.

[0064] Specifically, the high-speed signal connector of the uplink connector 33 of the hard disk module 3 is connected to the low-speed signal connector of the downlink connector 34, and the low-speed signal connector of the uplink connector 33 is connected to the hard disk connector 35. This unified connection method can unify the design of the hard disk module 3 and improve its reusability.

[0065] In some embodiments, the hard disk module 3 further includes a first hard disk module 31 and a second hard disk module 32. Based on this, the method further includes:

[0066] When the first hard disk module 31 and the second hard disk module 32 are connected, the high-speed signal connector high position of the downlink connector 34 of the first hard disk module 31 is connected to the high-speed signal connector high position of the uplink connector 33 of the second hard disk module 32, and the low position of the high-speed signal connector low position of the downlink connector 34 of the first hard disk module 31 is connected to the low position of the high-speed signal connector low position of the uplink connector 33 of the second hard disk module 32. Alternatively, the high position of the high-speed signal connector high position of the uplink connector 33 of the first hard disk module 31 is connected to the high position of the downlink connector 34 of the second hard disk module 32, and the low position of the high-speed signal connector low position of the uplink connector 33 of the first hard disk module 31 is connected to the low position of the downlink connector 34 of the second hard disk module 32.

[0067] Specifically, when one hard disk module 3 is connected to another hard disk module 3, the high-speed signal connectors of the downlink connector 34 of one hard disk module 3 and the uplink connector 33 of the other hard disk module 3 are connected in a corresponding manner, with their pins connected one-to-one.

[0068] For example, the main control module 1 can be connected to the server motherboard, and one or more first hard disk modules 31 can be interconnected with the main control module 1 via inter-board connectors 4. While ensuring the hard disk resources in the second hard disk modules 32, one or more second hard disk modules 32 can be interconnected with the first hard disk modules 31 via inter-board connectors 4. For example, refer to... Figure 4 If an eight-disk backplane is required, based on the standardized module design where one hard drive module 3 connects to two hard drives, a main control module 1 can be used with four hard drive modules 3 to form a hard drive backplane. The main control module 1 is connected to two first hard drive modules 31, and each first hard drive module 31 is then connected to a second hard drive module 32. Each hard drive requires PCIe x4 resources, and the main control module 1 allocates PCIe x16 resources on each side.

[0069] For example, the main control module 1 can be connected to the server motherboard, one or more expansion modules 2 can be interconnected with the main control module 1 via an inter-board connector 4, one or more first hard disk modules 31 can be interconnected with the expansion modules 2 via an inter-board connector 4, and while ensuring the hard disk resources in the second hard disk module 32, one or more second hard disk modules 32 can be interconnected with the first hard disk module 31 via an inter-board connector 4. For example, refer to Figure 5 If a sixteen-disk backplane is required, based on the standardized module design where one hard drive module 3 connects to two hard drives, a main control module 1 can be used with eight hard drive modules 3 to form a hard drive backplane. One side of the main control module 1 connects to the server motherboard, and the other three sides connect to an expansion module 2. Each expansion module 2 can connect to three first hard drive modules 31. While ensuring the hard drive resources in the second hard drive modules 32, the second hard drive modules 32 can be interconnected with suitable first hard drive modules 31 via inter-board connectors 4. Taking PCIe resources as an example, each hard drive requires PCIe x4 resources. The main control module 1 allocates PCIe x16 resources to each channel, and through the PCIeSwitch expansion chip, expands PCIe x8 resources on each side connected to the hard drive modules 3 to supply PCIe resources for the two hard drives.

[0070] In some implementations, the hard drive backplane assembly strategy also includes:

[0071] If the main control module 1, all expansion modules 2 and all hard disk modules 3 are assembled on the same plane, one end of the assembly of the main control module 1, expansion modules 2 and hard disk modules 3 is connected by a clamp or a right-angle connector, and the other end is connected by a gold finger.

[0072] or,

[0073] The two ends of the main control module 1, expansion module 2 and hard disk module 3 are connected by clamps or right-angle connectors, and the two ends are connected by interlocking gold finger cards.

[0074] In some implementations, the hard drive backplane assembly strategy also includes:

[0075] If any two of the main control module 1, expansion module 2 and hard disk module 3 are assembled vertically, one end of the two modules is connected by a vertical connector and the other end is connected by gold fingers.

[0076] or,

[0077] The two modules are assembled at one end via a clamp or right-angle connector, and at the other end via a vertical connector. The two ends are connected by interlocking gold finger cards.

[0078] Specifically, the appropriate connection method can be determined based on whether the modules are assembled on the same plane. If all modules are assembled on the same plane, a clamp or right-angle connector can be used at one end of the assembly, and a gold finger connector at the other end. If connectors are used at both ends, a gold finger interlocking clip can be added between the connectors. If there is vertical assembly within the modules, a vertical connector can be used at one end of the vertical assembly, and a gold finger connector at the other end; alternatively, a clamp or right-angle connector can be used at one end, and a vertical connector at the other end, with a gold finger interlocking clip added between the connectors. A clamp connector is a connector whose interface is parallel to the carrier board, on a single plane, and has pins on both the upper and lower surfaces of the carrier board. A vertical connector has an interface perpendicular to the carrier board; a right-angle connector has an interface parallel to the carrier board, but not on the same plane.

[0079] In this embodiment, the hard drive backplane can be functionally divided into a main control module 1, an expansion module 2, and a hard drive module 3, each designed separately. These modules can be interlocked via board-side connectors. Based on actual business needs, each module is fixed to a suitable assembly board shape. By assembling different modules, hard drive backplanes with different business requirements are formed, unifying the design of the main control module 1, hard drive module 3, and expansion module 2, and standardizing the functions of each server backplane, eliminating the need for redundant manpower to design identical backplane content. Furthermore, the expansion module 2 can be designed in three different types to support enhanced high-speed signal quality, provide more PCIe signals, and provide more SAS and SATA signals respectively. The design of the hard drive module 3 can also be unified through a standardized hard drive connection method to improve its reusability. Additionally, the appropriate connection method can be determined based on whether the modules are assembled on the same plane, allowing for flexible interlocking and assembly of modules, thus improving the reusability and scalability of the backplane module design.

[0080] It should be noted that the terms "S1," "S2," etc., are used only for descriptive purposes and do not specifically refer to the order or sequence, nor are they intended to limit this application. They are merely for the convenience of describing the method of this application and should not be construed as indicating the sequential order of the steps. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0081] Example 2

[0082] Corresponding to the above embodiments, this application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the program, it can implement the above-described assembly method for the hard disk backplane.

[0083] like Figure 7 As shown, in some embodiments, the system can serve as any of the above-described electronic devices for assembling a hard disk backplane in each of the embodiments. In some embodiments, the system may include one or more computer-readable media (e.g., system memory or NVM / storage device) having instructions and one or more processors (e.g., processor(s)) coupled to the one or more computer-readable media and configured to execute the instructions to implement the module and thus perform the actions described in this application.

[0084] In one embodiment, the system control module may include any suitable interface controller to provide any suitable interface to at least one of the processors(s) and / or any suitable device or component communicating with the system control module.

[0085] The system control module may include a memory controller module to provide an interface to the system memory. The memory controller module may be a hardware module, a software module, and / or a firmware module.

[0086] System memory can be used, for example, to load and store data and / or instructions for the system. In one embodiment, system memory may include any suitable volatile memory, such as suitable DRAM. In some embodiments, system memory may include Double Data Rate Type Quad Synchronous Dynamic Random Access Memory (DDR4 SDRAM).

[0087] In one embodiment, the system control module may include one or more input / output (I / O) controllers to provide interfaces to the NVM / storage device and (one or more) communication interfaces.

[0088] For example, an NVM / storage device can be used to store data and / or instructions. An NVM / storage device may include any suitable non-volatile memory (e.g., flash memory) and / or may include any suitable (one or more) non-volatile storage devices (e.g., one or more hard disk drives (HDDs), one or more optical disc drives (CDs), and / or one or more digital universal optical disc (DVD) drives).

[0089] NVM / storage devices may include storage resources that are physically part of a device on which the system is mounted, or that can be accessed by the device without necessarily being part of it. For example, an NVM / storage device may be accessed over a network via one or more communication interfaces.

[0090] One or more communication interfaces may provide the system with an interface to communicate over one or more networks and / or with any other suitable device. The system may wirelessly communicate with one or more components of a wireless network in accordance with any of the standards and / or protocols in one or more wireless network standards and / or protocols.

[0091] In one embodiment, at least one of the processors may be logically packaged with one or more controllers of the system control module (e.g., a memory controller module). In one embodiment, at least one of the processors may be logically packaged with one or more controllers of the system control module to form a system-in-package (SiP). In one embodiment, at least one of the processors may be integrated with the logic of one or more controllers of the system control module on the same die. In one embodiment, at least one of the processors may be integrated with the logic of one or more controllers of the system control module on the same die to form a system-on-a-chip (SoC).

[0092] In various embodiments, the system may be, but is not limited to, a server, workstation, desktop computing device, or mobile computing device (e.g., laptop computing device, handheld computing device, tablet computer, netbook, etc.). In various embodiments, the system may have more or fewer components and / or different architectures. For example, in some embodiments, the system includes one or more cameras, a keyboard, a liquid crystal display (LCD) screen (including a touchscreen display), a non-volatile memory port, multiple antennas, a graphics chip, an application-specific integrated circuit (ASIC), and a speaker.

[0093] It should be noted that this application can be implemented in software and / or a combination of software and hardware, for example, using an application-specific integrated circuit (ASIC), a general-purpose computer, or any other similar hardware device. In one embodiment, the software program of this application can be executed by a processor to implement the steps or functions described above. Similarly, the software program of this application (including related data structures) can be stored in a computer-readable recording medium, such as RAM memory, magnetic or optical drives, floppy disks, and similar devices. Furthermore, some steps or functions of this application can be implemented in hardware, for example, as circuitry that cooperates with a processor to perform the various steps or functions.

[0094] Furthermore, a portion of this application can be applied as a computer program product, such as computer program instructions, which, when executed by a computer, can invoke or provide the methods and / or technical solutions according to this application through the operation of the computer. Those skilled in the art will understand that the forms in which computer program instructions exist in a computer-readable medium include, but are not limited to, source files, executable files, installation package files, etc. Correspondingly, the ways in which computer program instructions are executed by a computer include, but are not limited to: the computer directly executing the instructions, or the computer compiling the instructions and then executing the corresponding compiled program, or the computer reading and executing the instructions, or the computer reading and installing the instructions and then executing the corresponding installed program. Here, the computer-readable medium can be any available computer-readable storage medium or communication medium accessible to a computer.

[0095] Communication media include media through which communication signals containing, for example, computer-readable instructions, data structures, program modules, or other data are transmitted from one system to another. Communication media can include guided transmission media (such as cables and wires (e.g., optical fibers, coaxial cables, etc.)) and wireless (unguided transmission) media capable of propagating energy waves, such as sound, electromagnetic, RF, microwave, and infrared. Computer-readable instructions, data structures, program modules, or other data can be embodied as modulated data signals in, for example, wireless media (such as carrier waves or similar mechanisms embodied as part of spread spectrum technology). The term "modulated data signal" refers to a signal whose one or more characteristics are altered or set in a manner that encodes information in the signal. Modulation can be analog, digital, or a hybrid modulation technique.

[0096] Herein, one embodiment of this application includes an apparatus comprising a memory for storing computer program instructions and a processor for executing the program instructions, wherein when the computer program instructions are executed by the processor, the apparatus is triggered to run a method and / or technical solution based on the foregoing embodiments of this application.

[0097] Example 3

[0098] Corresponding to the above embodiments, this application also provides a computer-readable storage medium storing computer-executable instructions for executing a method for assembling a hard disk backplane.

[0099] In this embodiment, a computer-readable storage medium may include volatile and non-volatile, removable and non-removable media implemented by any method or technology for storing information such as computer-readable instructions, data structures, program modules or other data. For example, a computer-readable storage medium includes, but is not limited to, volatile memories such as random access memory (RAM, DRAM, SRAM); and non-volatile memories such as flash memory, various read-only memories (ROM, PROM, EPROM, EEPROM), magnetic and ferromagnetic / ferroelectric memories (MRAM, FeRAM); and magnetic and optical storage devices (hard disks, magnetic tapes, CDs, DVDs); or other currently known media or those developed hereafter capable of storing computer-readable information / data for use by a computer system.

[0100] Although preferred embodiments have been described in this application, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of this application.

[0101] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A method for assembling a hard disk backplane, characterized in that, include: Get the number of hard drives required for the current business; A hard drive backplane assembly strategy is formulated based on the number of hard drives, main control modules, expansion modules, and hard drive modules. The hard drive backplane assembly strategy includes a first number of main control modules, a second number of expansion modules, and a third number of hard drive modules. According to the hard disk backplane assembly strategy, the first number of main control modules, the second number of expansion modules, and the third number of hard disk modules are assembled into a hard disk backplane adapted to the current service. The hard drive backplane is connected to the server motherboard via the main control module; The main control module, the hard disk module, and the expansion module are all equipped with multiple inter-board connectors that can be used for mutual insertion. The hard disk module further includes an upstream connector, a downstream connector, a hard disk connector, a first hard disk module, and a second hard disk module. Both the upstream and downstream connectors include a high-speed signal connector high bit and a high-speed signal connector low bit. The low bit of the high-speed signal connector of the upstream connector in the hard disk module is connected to the hard disk connector of the hard disk module, and the high bit of the high-speed signal connector of the upstream connector is connected to the low bit of the high-speed signal connector of the downstream connector in the hard disk module. When the first hard disk module is connected to the second hard disk module, the high bits of the high-speed signal connectors of the downstream connector of the first hard disk module and the low bits of the high-speed signal connectors of the upstream connector of the second hard disk module are connected correspondingly, with their pins connected one-to-one. The main control module includes a complex programmable logic device chip, a two-wire serial bus logic device, and a power supply chip. It is used to support the power-on logic, LED lighting logic, and operation logic of the hard disk backplane, and to capture the board information of the inter-connected expansion modules and hard disk modules, as well as to interact with the server motherboard. The expansion module includes a retimer chip, a high-speed serial computer expansion bus standard expansion chip, and a serial connection small computer system interface expansion chip, which are used to enhance and amplify the signal quantity, and to connect the main control module and the hard disk module for information transmission. The hard disk module includes a hard disk connector and a power supply efuse, used to connect one or more hard disks and supply power to the hard disks; The main control module, expansion module, and hard disk module are designed in a unified manner. They are assembled into a backplane according to the actual needs of different servers. The hard drive backplane assembly strategy also includes: If the main control module, all the expansion modules, and all the hard disk modules are assembled on the same plane, one end of the assembly of the main control module, the expansion module, and the hard disk module is connected by a clamp or a right-angle connector, and the other end is connected by a gold finger. or, The main control module, the expansion module, and the hard disk module are all connected at both ends by clamps or right-angle connectors, and the two ends are connected by interlocking gold finger clips. The clamp connector is a connector whose connector interface is parallel to the carrier board and is on the same plane, with pins on both the upper and lower surfaces of the carrier board.

2. The hard disk backplane assembly method according to claim 1, characterized in that, The hard disk module includes a first hard disk module and a second hard disk module, and the method further includes: When the first hard disk module and the second hard disk module are connected, the high-speed signal connector high position of the downlink connector of the first hard disk module is connected to the high-speed signal connector high position of the uplink connector of the second hard disk module, and the low position of the downlink connector of the first hard disk module is connected to the low position of the uplink connector of the second hard disk module. or, Connect the high-speed signal connector high position of the uplink connector of the first hard disk module to the high-speed signal connector high position of the downlink connector of the second hard disk module, and connect the low position of the high-speed signal connector low position of the uplink connector of the first hard disk module to the low position of the high-speed signal connector of the downlink connector of the second hard disk module.

3. The assembly method of the hard disk backplane according to claim 1, characterized in that, The hard drive backplane assembly strategy also includes: If any two of the main control module, the expansion module and the hard disk module are assembled vertically, one end of the two modules is connected by a vertical connector and the other end is connected by a gold finger. or, The two modules are assembled at one end via a clamp or right-angle connector, and at the other end via a vertical connector. The two ends are connected by interlocking gold finger cards.

4. An electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the assembly method of the hard disk backplane as described in any one of claims 1 to 3.

5. A computer-readable storage medium storing computer-executable instructions, characterized in that, The computer-executable instructions are used to execute the assembly method of the hard disk backplane according to any one of claims 1 to 3.

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