A pressing mechanism for silicon wafer immersion cleaning

Abstract

This invention discloses a compression mechanism for immersion cleaning of silicon wafers, belonging to the field of silicon wafer cleaning technology. The mechanism comprises a roller mounted on the lower surface of the silicon wafer, an axle mounted on the upper surface of the silicon wafer, and a plurality of elastic extrusion wheels sleeved on the axles. The elastic extrusion wheels comprise a wheel body and a plurality of positively curved blades arranged around the outer periphery of the wheel body, with a groove formed between each adjacent pair of positively curved blades. The technical solution of the invention fully compresses silicon wafers in a deep sputtering bath, improving production efficiency, preventing wafer crushing, and increasing product quality.

Description

Technical Field

[0001] The invention belongs to the technical field of silicon wafer cleaning, and in particular relates to a pressing mechanism for immersion cleaning of silicon wafers. Background Art

[0002] Considering the efficiency of silicon wafer cleaning and the cleanliness after cleaning, the silicon wafer needs a deep splash bath during the cleaning process. Specifically, the lower roller is immersed in the cleaning liquid, and the silicon wafer is conveyed on the lower roller. To prevent the silicon wafer from floating, the upper roller needs to be used to press the silicon wafer, and the upper roller is sleeved on the transmission shaft. During the transmission process, the transmission shaft has a small diameter and a long length, which is easy to bend and deform, resulting in easy generation of fragments or failure to completely press the silicon wafer during transmission, thereby affecting production efficiency; if the diameter of the transmission shaft is increased, it is not easy to bend and deform, but after the diameter of the transmission shaft is increased, the weight of the transmission shaft increases, and the upper roller has no elasticity, which will crush the silicon wafer, affecting the product qualification rate. Summary of the Invention

[0003] In order to solve the above technical problems, the technical solution of the present invention is: a pressing mechanism for immersion cleaning of silicon wafers, comprising a roller arranged on the lower surface of the silicon wafer, an axle arranged on the upper surface of the silicon wafer, and a plurality of elastic extrusion wheels sleeved on the axle;

[0004] The elastic extrusion wheel includes a wheel body and a plurality of positively curved blades distributed around the outer periphery of the wheel body. The bending direction of the positively curved blades is consistent with their own rotation direction. The positively curved blades are specifically divided into a plurality of arc segments with different radii, and the transition between adjacent arc segments is smooth. A groove is formed between every two adjacent positively curved blades. The groove width gradually increases and then gradually decreases from the bottom of the groove to the groove mouth.

[0005] Specifically, the positively curved blade is formed with a blade root, a blade top and a blade profile part connected between the blade root and the blade top. Along the groove bottom to the groove mouth, the angle β between the mid-arc section of the blade root and the section at the far-axis point of the blade profile part gradually increases, and the angle γ between the mid-arc section of the blade top and the section at the near-axis point of the blade profile part gradually decreases.

[0006] Specifically, from the bottom of the slot to the slot mouth, the angle β between the blade root mid-camber section and the section at the far axis of the blade part gradually decreases, and the angle γ between the blade tip mid-camber section and the section at the near axis of the blade part gradually decreases.

[0007] Specifically, the included angle between the tangent plane at the proximal axis point of the blade profile part and the tangent plane at the distal axis point of the blade profile part is α, α is an obtuse angle, and the included angle β and the included angle γ are within the range of 90° to α.

[0008] Specifically, the blade root has a first end connected to the wheel body and a second end connected to the blade profile portion. The thickness of the blade root gradually decreases from the first end to the second end, while the thickness of the blade profile portion and the blade tip remains unchanged.

[0009] Specifically, the blade tip is pressed against the connection between the blade root and the blade profile part after being subjected to the compressive force.

[0010] Specifically, the positive bending blades of adjacent elastic extrusion wheels sleeved on the same wheel axle are staggered.

[0011] Specifically, the elastic extrusion wheel is connected to the front side of the silicon wafer, and the roller acts on the same position on the back side of the silicon wafer.

[0012] Specifically, it also includes a plurality of rollers tightly matched on the roller shaft and a first power component that drives the rollers to rotate to push the silicon wafer to move between the rollers and the elastic extrusion wheel.

[0013] Specifically, it also includes a second power component that drives the wheel shaft to rotate to push the silicon wafer to move, and the rotation direction of the wheel shaft is opposite to the rotation direction of the roller.

[0014] The technical solution provided by the present invention has the following advantages compared with the prior art:

[0015] 1. A plurality of positively curved blades bent in the same direction are arranged around the wheel body to form an elastic extrusion wheel. Hollows are formed between adjacent positively curved blades. Under the premise of reducing or maintaining the gravity of the elastic extrusion wheel itself, the wheel diameter is expanded, and the bending deformation of the wheel shaft is combined to fully compress the silicon wafer, thereby improving production efficiency.

[0016] 2. The hollow structure is deformable and elastic, so that the elastic extrusion wheel itself has elastic function. When the elastic extrusion wheel and the silicon wafer squeeze each other, the extrusion force acts in the opposite direction to deform the positively bent blades, thereby avoiding crushing the silicon wafer and improving the qualified rate of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 1 is a structural diagram of a pressing mechanism for immersion cleaning of silicon wafers according to an embodiment of the present invention;

[0018] Figure 2 1 is a diagram showing the operating state of a pressing mechanism for immersion cleaning of silicon wafers according to an embodiment of the present invention;

[0019] Figure 3 is a structural diagram of an elastic extrusion wheel in an embodiment of the present invention;

[0020] Figure 4 2 is a structural diagram of a positively curved blade in an embodiment of the present invention.

[0021] Shown in the figure: 1. Silicon wafer; 2. Support; 3. Upper roller assembly; 31. Elastic extrusion wheel; 32. Wheel body; 33. Curved blade; 331. Blade root; 332. Blade-shaped part; 333. Blade top; 34. Wheel axle; 4. Lower roller assembly; 41. Roller; 42. Roller; 43. First transmission tooth; 5. Second transmission tooth. DETAILED DESCRIPTION

[0022] For ease of understanding, the pressing mechanism for immersion cleaning of silicon wafers is described below in conjunction with embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0023] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations and positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention.

[0025] like Figures 1 to 2 As shown, a clamping mechanism for immersion cleaning of silicon wafers includes supports 2 provided on both sides of a silicon wafer 1, an upper roller assembly 3 and a lower roller assembly 4 supported by the supports 2, and a first power assembly driving the lower roller assembly 4 to rotate relative to the supports 2. The upper roller assembly 3 and the lower roller assembly 4 are both immersed in the cleaning liquid in the cleaning tank. The silicon wafer 1 located between the upper roller assembly 3 and the lower roller assembly 4 is deeply splashed, thereby improving the cleaning efficiency and optimizing the cleaning effect.

[0026] The lower roller assembly 4 includes rollers 41, a roller shaft 42 for tightly fitting the rollers 41, and a first transmission tooth 43 fixedly connected to the end of the roller shaft 42. The first power assembly drives the first transmission tooth 43 to rotate clockwise, thereby driving the roller shaft 42 and the rollers 41 on the roller shaft 42 to rotate synchronously. The silicon wafer 1 is placed on the roller 41 and translates to the right as the roller 41 rotates.

[0027] The upper roller assembly 3 includes an elastic extrusion wheel 31 and a wheel axle 34 for tightly matching the elastic extrusion wheels 31. The elastic extrusion wheels 31 rotate counterclockwise as the silicon wafer 1 moves to the right. The wheel axle 34 and the elastic extrusion wheels 31 are transitionally matched. The wheel axle 34 is a metal rod. The metal rod is affected by its own gravity and hangs downward, resulting in bending deformation, overcoming buoyancy, and causing the wheel body 32 to press the silicon wafer 1.

[0028] like Figures 3 and 4As shown, the elastic extrusion wheel 31 includes a wheel body 32 and a plurality of positively curved blades 33 distributed around the outer circumference of the wheel body 32. The bending direction of the positively curved blades 33 is consistent with its own rotation direction and is flat. The positively curved blades 33 are formed with a blade root 331, a blade top 333 and a blade-shaped portion 332 connected between the blade root 331 and the blade top 333. Specifically, the distal end of the blade root 331 extends outward to form a portion with a thickness approaching zero. The portion close to the blade root 331 is the blade-shaped portion 332, and the portion away from the blade root 331 is the blade top 333.

[0029] A groove is formed between every two adjacent positive bending blades 33; the groove width gradually increases from the bottom of the groove to the groove mouth, and then gradually decreases. When a positive bending blade 33 is under pressure, the groove mouth formed between the positive bending blade 33 and the next positive bending blade 33 in the clockwise direction gradually shrinks to closed. Then, after being pressed, there is always a hollow structure between the adjacent positive bending blades 33, and the positive bending blades 33 will not bend excessively. The blade top 333 abuts against the outer arc surface of the other positive bending blade 33. Preferably, the blade top 333 at this time abuts against the connection between the blade root 331 and the blade profile of the other positive bending blade 33. When the outer periphery of all the positive bending blades 33 of the elastic extrusion wheel 31 are under force, the elastic extrusion wheel 31 forms a circle.

[0030] The blade root 331 has a first end connected to the wheel body 32 and a second end connected to the blade profile portion. Its thickness gradually decreases from the first end to the second end. When the positive curved blade 33 is under pressure, the deformation angle of the blade root 331 is large, and the thickness of the blade root 331 gradually increases from the front end to the rear end, which can prevent the blade root 331 from deformation, breakage and damage.

[0031] From the bottom of the groove to the groove mouth, the angle β between the arc section of the blade root 331 and the section of the distal axis of the blade profile part 332 gradually increases, and the increase gradually decreases. After the blade root 331 protrudes from the wheel body 32, it bends in the clockwise direction to form a structure with a steep rear section and a gentle front section; among them, the angle between the outer wall section of the blade root 331 and the section of the distal axis of the blade profile part 332 gradually increases, and then gradually decreases, and the angle between the inner wall section of the blade root 331 and the section of the distal axis of the blade profile part 332 gradually decreases, thereby reducing the height of the positively curved blade 33. When the elastic extrusion wheel 31 rolls, the surface of the positively curved blade 33 facing away from the wheel center is in contact with the upper surface of the silicon wafer 1. The area where the positively curved blade 33 can squeeze the silicon wafer is smooth, reducing undulations, and the extrusion force on the silicon wafer fluctuates little, and it can smoothly transition from one blade to another.

[0032] The blade-shaped portion 332 is an arc that arches away from the wheel center. The angle between its near-axis section and the far-axis section of the blade-shaped portion 332 is α, and α is an obtuse angle. The larger the obtuse angle, the smoother the arc.

[0033] From the bottom of the groove to the groove mouth, the angle γ between the arc section of the blade top 333 and the section of the proximal axis point of the blade profile part 332 gradually decreases, and the reduction amplitude also gradually decreases, and the curvature gradually becomes gentle. The blade top 333 first contacts the silicon wafer 1, and after rolling, the contact position of the silicon wafer 1 moves from the front section to the rear section of the blade top 333, and then moves to the blade profile part 332; wherein, the angle β and the angle γ are both in the range of 90° to α, and the angle β is 90°. Specifically, the angle between the section of the point where the arc of the blade root 331 contacts the wheel body 32 and the section of the far axis point of the blade profile part 332 is 90°, and the angle γ is 90°. Specifically, the section of the point where the blade top 333 is away from the blade root 331 is perpendicular to the proximal axis point section of the blade profile part 332.

[0034] In a preferred implementation manner of this embodiment, the tangent plane of the point of the blade tip 333 away from the blade root 331 is parallel to the silicon wafer 1 , and the silicon wafer 1 transitions smoothly between adjacent positively curved blades 33 .

[0035] In a preferred implementation manner of this embodiment, the positive bending blades 33 of adjacent elastic extrusion wheels 31 sleeved on the same wheel shaft 34 are staggered. The closer the contact position of the silicon wafer 1 is to the blade root 331, the smaller the elasticity of the positive bending blade 33 is, and the extrusion force is reduced. The positions at which multiple positive bending blades 33 contact the silicon wafer 1 are different, and the extrusion force is equalized, so that the silicon wafer 1 is evenly subjected to the extrusion force.

[0036] In a preferred implementation of this embodiment, the elastic extrusion wheel 31 is connected to the front of the silicon wafer 1, and the roller 41 acts on the same position on the back of the silicon wafer 1. The force application points are opposite to each other, thereby preventing the silicon wafer 1 from generating wave-like deformation.

[0037] In a preferred implementation manner of the present embodiment, the clamping mechanism for immersion cleaning of silicon wafers further includes a second power assembly, and a second transmission tooth 5 is fixedly connected to the end of the axle 34. The second power assembly drives the second transmission tooth 5 to rotate counterclockwise to assist in driving the silicon wafer 1 to move to the right, thereby preventing the silicon wafer 1 from getting stuck due to inconsistent driving directions of the upper and lower wheels 32.

[0038] Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art will appreciate that the technical solutions described in the above embodiments may be modified or some or all of the technical features thereof may be replaced with equivalents, and that such modifications or replacements do not deviate from the essence of the corresponding technical solutions within the scope of the various embodiments of the present invention.

Claims

1. A clamping mechanism for immersion cleaning of silicon wafers, characterized in that: It includes a roller arranged on the lower surface of the silicon wafer, an axle arranged on the upper surface of the silicon wafer, and a plurality of elastic extrusion wheels arranged on the axle; The elastic extrusion wheel includes a wheel body and a plurality of positively curved blades distributed around the outer periphery of the wheel body. The bending direction of the positively curved blades is consistent with their own rotation direction. The positively curved blades are specifically divided into a plurality of arc segments with different radii, and the transition between adjacent arc segments is smooth. A groove is formed between every two adjacent positively curved blades. The groove width gradually increases and then gradually decreases from the bottom of the groove to the groove mouth.

2. The pressing mechanism for immersion cleaning of silicon wafers according to claim 1, wherein: The positively curved blade is formed with a blade root, a blade top and a blade profile part connected between the blade root and the blade top. Along the groove bottom to the groove mouth, the angle β between the mid-arc section of the blade root and the section at the far axis point of the blade profile part gradually increases, and the angle γ between the mid-arc section of the blade top and the section at the near axis point of the blade profile part gradually decreases.

3. The pressing mechanism for immersion cleaning of silicon wafers according to claim 2, wherein: From the bottom of the slot to the slot mouth, the angle β between the blade root mid-camber section and the section at the far axis of the blade part gradually decreases, and the angle γ between the blade tip mid-camber section and the section at the near axis of the blade part gradually decreases.

4. The pressing mechanism for immersion cleaning of silicon wafers according to claim 2, wherein: The included angle between the tangent plane at the proximal axis point of the blade profile part and the tangent plane at the distal axis point of the blade profile part is α, α is an obtuse angle, and the included angle β and the included angle γ are within the range of 90° to α.

5. The pressing mechanism for immersion cleaning of silicon wafers according to claim 2, wherein: The blade root has a first end connected to the wheel body and a second end connected to the blade profile portion. The thickness of the blade root gradually decreases from the first end to the second end, while the thickness of the blade profile portion and the blade tip remains unchanged.

6. The pressing mechanism for immersion cleaning of silicon wafers according to claim 2, wherein: The blade tip is pressed against the connection between the blade root and the blade profile of another positively curved blade after being subjected to the pressing force.

7. The pressing mechanism for immersion cleaning of silicon wafers according to claim 1, wherein: The positive bending blades of adjacent elastic extrusion wheels sleeved on the same wheel shaft are staggered.

8. The pressing mechanism for immersion cleaning of silicon wafers according to claim 1, wherein: The elastic extrusion wheel is connected to the front side of the silicon wafer, and the roller acts on the same position on the back side of the silicon wafer.

9. The pressing mechanism for immersion cleaning of silicon wafers according to claim 1, wherein: The invention also comprises a plurality of rollers tightly matched on the roller shaft and a first power component which drives the rollers to rotate so as to push the silicon slice to move between the rollers and the elastic extrusion wheel.

10. The pressing mechanism for immersion cleaning of silicon wafers according to claim 9, wherein: It also includes a second power component that drives the wheel shaft to rotate to push the silicon slice to move, and the rotation direction of the wheel shaft is opposite to that of the roller.

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