A silicon wafer automatic transmission mechanism and a method for handling abnormal silicon wafer movement

Abstract

The present invention provides an automated silicon wafer conveying mechanism and a method for handling abnormal silicon wafer movement, relating to the field of solar cell technology. The automated silicon wafer conveying mechanism includes: a conveying device for conveying silicon wafers; a wafer support device disposed outside the conveying device and used to lift the silicon wafer from the conveying device; a detection device disposed inside the conveying device and used to detect the position of the silicon wafer on the conveying device; an adjustment device disposed on one side of the conveying device and used to adjust the position of the silicon wafer on the conveying device; and a controller electrically connected to the conveying device, the wafer support device, the detection device, and the adjustment device. The automated silicon wafer conveying mechanism of the present invention can reduce the risk of hidden cracks in silicon wafers during wet chemical and plate coating processes, while improving the quality of the finished product.

Description

Technical Field

[0001] The present invention relates to the technical field of solar cells, and in particular to an automatic silicon wafer transmission mechanism and a method for processing abnormal silicon wafer movement. Background Art

[0002] Solar cells are a key component of solar photovoltaic modules. They are typically manufactured from silicon wafers using processes such as wet chemistry and plate coating. With the rapid development of the new energy industry, reducing silicon wafer costs has become a key goal for photovoltaic companies. Thinning silicon wafers is the primary option for achieving this goal. Extreme wafer thinning not only rapidly reduces silicon wafer costs but also makes thinner silicon wafers increasingly compatible with automated cell manufacturing processes. Consequently, thinner silicon wafers have gained widespread application.

[0003] In wet chemical and plate coating processes, silicon wafers are typically transported using conveyor belts. The friction between the conveyor belt and the wafer drives the wafer forward. After entering the basket or stopping at a certain position, the wafer is first lifted from the conveyor belt by a positioning support block, then sucked up by a placement suction cup and placed into the mold frame. However, due to the thinning of the silicon wafer, the silicon wafer is prone to slipping during transportation, resulting in abnormal wafer movement and even rear-end blockage. When the positioning support block lifts the silicon wafer from the conveyor belt and the placement suction cup sucks the silicon wafer from the positioning support block, not only is there a high risk of hidden cracks in the silicon wafer, but the subsequent silicon wafer cannot be fully placed into the mold frame, resulting in the portion of the silicon wafer on the mold frame not being properly coated, affecting the quality of the finished product. Summary of the Invention

[0004] The technical problem solved by the present invention is how to reduce the risk of hidden cracks in silicon wafers during wet chemical and plate-type coating processes while improving the quality of finished products.

[0005] To solve the above technical problems, an embodiment of the present invention provides an automatic silicon wafer transfer mechanism, comprising:

[0006] A conveying device for conveying silicon wafers;

[0007] a wafer supporting device, disposed outside the transmission device and used to lift the silicon wafer from the transmission device;

[0008] a detection device, disposed inside the transmission device and used to detect the posture of the silicon wafer on the transmission device;

[0009] an adjusting device, disposed on one side of the conveying device and used to adjust the posture of the silicon wafer on the conveying device;

[0010] A controller is electrically connected to the transmission device, the sheet supporting device, the detection device and the adjustment device respectively.

[0011] Optionally, the sheet supporting device includes a plurality of sheet supporting units, and the plurality of sheet supporting units are arranged at intervals along the conveying direction of the transmission device.

[0012] Optionally, each of the support units includes two positioning support blocks, which are arranged opposite to each other, and in a conveying direction perpendicular to the transmission device, one positioning support block is arranged on one side of the transmission device, and the other positioning support block is arranged on the other side opposite to the transmission device.

[0013] Optionally, the detection device includes a plurality of longitudinal detection sensors, and the plurality of longitudinal detection sensors are arranged at intervals along the conveying direction of the transmission device.

[0014] Optionally, one support unit matches N longitudinal detection sensors, and N=(L / d)+1, where L is the distance between adjacent support units, and d is the compatible tolerance accuracy of the support unit.

[0015] Optionally, the adjustment device includes a lifting structure, which is arranged on the outside of the transmission device and is used to adjust the posture of the silicon wafer on the transmission device.

[0016] Optionally, one positioning support block corresponds to at least one lifting structure, and each lifting structure is used to independently complete one or more actions of lifting, longitudinal movement and lateral movement.

[0017] Optionally, the longitudinal detection sensor includes a blockage sensor, which is arranged at a preset distance behind the standard posture of the silicon wafer in the transmission direction of the transmission device and is used to detect whether the silicon wafer is blocked.

[0018] Optionally, the preset distance is equal to the spacing between adjacent support units.

[0019] Optionally, the adjusting device further includes a collecting box, which is arranged on one side of the conveying device and is used to collect the silicon wafers that slide off the conveying device.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] A transmission device electrically connected to the controller is provided for conveying silicon wafers, a detection device electrically connected to the controller is provided on the inner side of the transmission device, and an adjustment device electrically connected to the controller is provided on one side of the transmission device. When the silicon wafer is transmitted on the transmission device, the detection device is used to detect the posture of the silicon wafer on the transmission device and feed back to the controller. If it is detected that the posture of the silicon wafer on the transmission device is abnormal, the controller issues an instruction to the adjustment device to adjust the posture of the silicon wafer, and then the silicon wafer is lifted from the transmission device by a supporting device electrically connected to the controller provided on the outside of the transmission device. Since the adjustment device has completed the adjustment of the posture of the silicon wafer before, after the supporting device lifts the silicon wafer, the position of the silicon wafer on the supporting device is in a normal state. When the suction cup is subsequently placed and the silicon wafer is sucked up from the supporting device, the silicon wafer is in a normal stress state, and the force on various parts of the silicon wafer is balanced, which makes it less likely to cause hidden cracks. At the same time, since the posture of the silicon wafer is normal, it can be completely placed in the mold frame to complete normal coating, thereby improving the quality of the finished product.

[0022] To solve the above technical problems, the present invention further provides a method for handling abnormal silicon wafer movement, which uses the above-mentioned automatic silicon wafer transmission mechanism and comprises:

[0023] The detection device of the silicon wafer automatic transmission mechanism detects the real-time posture information of the silicon wafer on the transmission device of the silicon wafer automatic transmission mechanism and sends it to the controller of the silicon wafer automatic transmission mechanism;

[0024] The controller compares the instant posture information with the standard posture information of the silicon wafer to obtain an adjustment instruction, and sends the adjustment instruction to the adjustment device of the silicon wafer automatic transmission mechanism;

[0025] The adjusting device adjusts the silicon wafer to a standard posture according to the adjustment instruction.

[0026] Optionally, the instant posture information includes the distance L1 of the silicon wafer relative to the standard stop position, and L1 = n×d1, where n is the number of longitudinal detection sensors of the detection device that detects the abnormality of the instant stop position of the silicon wafer, and d1 is the spacing between adjacent longitudinal detection sensors.

[0027] Optionally, the adjustment instruction includes a lifting instruction. When the blockage sensor of the longitudinal detection sensor detects that the silicon wafer is blocked, at least one lifting structure of the adjustment device receives the lifting instruction and lifts the blocked silicon wafer toward one side of the transmission device to an inclined state until it slides into the collection box of the adjustment device.

[0028] The advantages of the method for handling abnormal silicon wafer movement over the prior art are the same as those of the above-mentioned automatic silicon wafer transmission mechanism, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings. These exemplifications do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements. Unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0030] Figure 1 Schematic diagram of the structure of the automatic silicon wafer transmission mechanism in an embodiment of the present invention;

[0031] Figure 2 For the embodiment of the present invention Figure 1 Enlarged view of point A in the middle;

[0032] Figure 3 For the embodiment of the present invention Figure 1 Enlarged view of point B in the middle;

[0033] Figure 4 Schematic diagram of the placement of the positioning support block and the silicon wafer in an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of a partial structure of an adjustment device in an embodiment of the present invention;

[0035] Figure 6 Flowchart of a method for handling abnormal silicon wafer movement according to an embodiment of the present invention;

[0036] Figure 7 Flowchart of step 300 of a method for handling abnormal silicon wafer movement according to an embodiment of the present invention;

[0037] Figure 8 Flowchart of the silicon wafer adjustment process in an embodiment of the present invention.

[0038] Description of reference numerals:

[0039] 1. Conveying device; 2. Wafer supporting device; 21. Positioning support block; 211. Carrying platform; 3. Detection device; 31. Longitudinal detection sensor; 32. Transverse detection sensor; 4. Adjustment device; 41. Lifting structure; 411. Longitudinal movement base; 412. Longitudinal movement cylinder; 413. Transverse movement base; 414. Transverse movement cylinder; 415. Lifting base; 416. Lifting cylinder; 42. Collection box; 43. Adjustment slide rail; 44. Suction cup; 100. Silicon wafer. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0041] In the description of the present invention, it should be understood that terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicating directions or positions are based on the directions or positions shown in the accompanying drawings. These terms are primarily intended to better describe the present invention and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific direction, or to being constructed or operated in a specific direction.

[0042] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to express a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0043] Furthermore, the terms "installed," "set," "provided with," "opened," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0044] Furthermore, the terms "first," "second," etc., are primarily used to distinguish between different devices, elements, or components (which may or may not be of the same type and configuration), and are not intended to indicate or imply the relative importance or quantity of the devices, elements, or components indicated. Unless otherwise specified, "plurality" means two or more.

[0045] Silicon wafers are usually thin slices with a thickness of microns. The existing transmission device can only achieve a certain effect on silicon wafers thicker than 130μm if the solution of replacing the widened belt and the high-friction belt is adopted to deal with the slippage of the thin wafer transmission. It is less effective for silicon wafers with a thickness of less than 130μm. When the silicon wafer slips or gets blocked, the safety door needs to be opened for manual processing, which not only poses a safety hazard and has a serious impact on normal production, but also reduces the transmission speed, directly affecting the output by more than 20%.

[0046] To solve the above problems, an embodiment of the present invention provides an automated silicon wafer transmission mechanism, comprising: a transmission device 1, for conveying silicon wafers 100; a wafer supporting device 2, arranged on the outside of the transmission device 1 and used to lift the silicon wafer 100 from the transmission device 1; a detection device 3, arranged on the inside of the transmission device 1 and used to detect the posture of the silicon wafer 100 on the transmission device 1; an adjustment device 4, arranged on one side of the transmission device 1 and used to adjust the posture of the silicon wafer 100 on the transmission device 1; and a controller (not shown), which is electrically connected to the transmission device 1, the wafer supporting device 2, the detection device 3 and the adjustment device 4, respectively.

[0047] like Figure 1 As shown, in this embodiment, in order to make the transmission of the silicon wafer 100 more stable, the transmission device 1 adopts two sets of transmission belts arranged in parallel with each other. The two sets of transmission belts are spaced a certain distance apart and transmitted synchronously. The silicon wafer 100 is placed on the transmission belts and the parts on both sides extend out of the transmission belts respectively. In some cases, such as when the silicon wafer 100 is small in size, only one set of transmission belts can be set. This not only saves equipment costs, but also reduces transmission errors caused by transmission belt synchronization problems. The specific settings can be made according to needs and are not limited here.

[0048] In order to make the silicon wafer 100 more stable when being lifted from the transmission device 1, the wafer supporting device 2 is usually arranged on the outside of the transmission device 1, that is, on the side where the two sets of transmission belts are away from each other. When the silicon wafer 100 is transported to the stop position, the wafer supporting device 2 can be raised and lowered in a direction perpendicular to the plane where the silicon wafer 100 is located, thereby lifting the silicon wafer 100 from the transmission belt.

[0049] The detection device 3 is a structure for detecting the posture of the silicon wafer 100 on the transmission device 1. In order to improve the success rate and accuracy of the detection, the detection device 3 can usually be set in the gap between the two sets of transmission belts, that is, on the inner side of the transmission device 1. In some cases, such as when the space inside the transmission device 1 is small, the detection device 3 can also be set on the outside of the transmission device 1. The specific setting can be made according to needs and is not limited here.

[0050] The adjusting device 4 refers to a structure that can adjust the posture of the silicon wafer 100 after it is transported to the stop position. It can usually be set on the inside or outside of the transmission device 1 according to the structural form of the transmission device 1 and the wafer supporting device 2. For example, when the distance between the two sets of transmission belts of the transmission device 1 is small, and the distance between the transmission belt and the wafer supporting device 2 is large, the adjusting device 4 can be set between the transmission device 1 and the wafer supporting device 2, that is, on the outside of the transmission device 1. When the distance between the two sets of transmission belts of the transmission device 1 is large, and the distance between the transmission belt and the wafer supporting device 2 is small, the adjusting device 4 can be set between the two sets of transmission belts, that is, on the inside of the transmission device 1; the controller is the control element of the silicon wafer automatic transmission mechanism, and can usually adopt existing equipment such as PLC modules and computers with built-in control programs, which will not be elaborated here.

[0051] It should be noted that the cross-sectional shape of the silicon wafer 100 is usually rectangular. When being transported on the transmission device 1, according to different design methods of the production line, the silicon wafer 100 can be placed in a manner that the long side is consistent with the conveying direction, or it can be transported in a manner that the long side is perpendicular to the conveying direction. Therefore, the spacing between the two sets of transmission belts of the transmission device 1 can be set according to the different placement methods of the silicon wafer 100, thereby setting the positional relationship between the detection device 3 and the adjustment device 4 and the transmission device 1. The specific setting can be made according to needs and is not limited here.

[0052] Thus, a transmission device 1 electrically connected to the controller is provided for conveying the silicon wafer 100, a detection device 3 electrically connected to the controller is provided on the inner side of the transmission device 1, and an adjustment device 4 electrically connected to the controller is provided on one side of the transmission device 1. Figure 8 As shown, when the silicon wafer 100 is transmitted on the transmission device 1, the detection device 3 is used to detect the posture of the silicon wafer 100 on the transmission device 1 and feed back to the controller. If it is detected that the posture of the silicon wafer 100 on the transmission device 1 is abnormal, the controller issues an instruction to the adjustment device 4 to adjust the posture of the silicon wafer 100, and then the silicon wafer 100 is lifted from the transmission device 1 by the support device 2 arranged on the outside of the transmission device 1 and electrically connected to the controller. Since the adjustment device 4 has completed the adjustment of the posture of the silicon wafer 100 before, after the support device 2 lifts the silicon wafer 100, the position of the silicon wafer 100 on the support device 2 is in a normal state. When the suction cup is placed and the silicon wafer 100 is sucked up from the support device 2, the silicon wafer 100 is in a normal stress state, and the force on each part of the silicon wafer 100 is balanced, which makes it less likely to cause hidden cracks. At the same time, since the posture of the silicon wafer 100 is normal, it can be completely placed in the mold frame to complete normal coating, thereby improving the quality of the finished product.

[0053] Optionally, the supporting device includes a plurality of supporting units, which are arranged at intervals along the conveying direction of the transmission device, and each supporting unit includes two positioning supporting blocks, which are arranged opposite to each other, and in the conveying direction perpendicular to the transmission device, one positioning supporting block is arranged on one side of the transmission device, and the other positioning supporting block is arranged on the other side opposite to the transmission device.

[0054] like Figure 1 As shown, the wafer support device 2 corresponds to a plurality of wafer support units, and the plurality of wafer support units are arranged at intervals along the conveying direction of the transmission device 1. Each wafer support unit can be raised and lowered individually and corresponds to a silicon wafer 100. Therefore, each wafer support unit can lift the corresponding silicon wafer 100 conveyed to the position of the wafer support unit.

[0055] In this embodiment, in order to make the silicon wafer 100 more stable when being lifted, each wafer supporting unit is across the outside of the transmission device 1. Specifically, Figure 1 As shown, each support unit is composed of two positioning support blocks 21. In the Y-axis direction, the two positioning support blocks are arranged opposite to each other, and one positioning support block 21 is arranged on the outside of one transmission belt, and the other positioning support block 21 is arranged on the outside of the other transmission belt.

[0056] Exemplarily, the positioning support block 21 may adopt a structure with a U-shaped cross-section, and the openings of the U-shaped structures of the two positioning support blocks 21 of each support unit are arranged relative to each other, and a supporting platform 211 or a step structure is also provided on the inner wall of each U-shaped structure to support the silicon wafer 100. When each support unit rises, the corresponding silicon wafer 100 can be accommodated in the space between the two U-shaped structures and supported.

[0057] In this way, by arranging multiple positioning support blocks 21 at intervals along the conveying direction of the transmission device 1 to form multiple support units, it is convenient to individually support the silicon wafers 100 at multiple different positions. Each support unit can move independently to reduce mutual interference.

[0058] Optionally, the detection device 3 includes a plurality of longitudinal detection sensors 31 , and the plurality of longitudinal detection sensors 31 are arranged at intervals along the conveying direction of the transmission device 1 .

[0059] like Figure 1 As shown, in this embodiment, the detection device 3 uses a plurality of longitudinal detection sensors 31 spaced apart along the conveying direction of the transmission device 1. The longitudinal detection sensor 31 is usually a photoelectric sensor, which can detect the position of the silicon wafer 100 on the transmission device 1. By comprehensively analyzing the position information detected by the plurality of photoelectric sensors, it can be determined whether the posture of the silicon wafer 100 is normal.

[0060] Optionally, one support unit matches N longitudinal detection sensors 31 , and N=(L / d)+1, where L is the distance between adjacent support units, and d is the compatible tolerance accuracy of the support unit.

[0061] like Figure 1 and Figure 4 As shown, in this embodiment, each support unit is provided with a plurality of longitudinal detection sensors 31 along the conveying direction. For the convenience of description, the number of longitudinal detection sensors 31 corresponding to each support unit can be recorded as N, wherein N is a positive integer greater than 1. Normally, the value of N can be calculated by the spacing L between adjacent support units and the compatible tolerance accuracy d of the support units, that is, N = (L / d) + 1, where L / d is a positive integer.

[0062] It should be noted that if Figure 4 As shown, the compatible tolerance accuracy d of the support unit refers to the distance between the front and rear side walls of the silicon wafer 100 and the front and rear inner walls of the receiving groove of the positioning support block 21 after the silicon wafer 100 is placed in the receiving groove of the positioning support block 21. Under normal circumstances, the compatible tolerance accuracy d can be set as needed. Preferably, 0.01mm≤d≤1.5mm.

[0063] Optionally, the detection device further includes a plurality of transverse detection sensors 32 , which are arranged at intervals along the conveying direction of the transmission device 1 and are located outside the sheet supporting device 2 .

[0064] like Figure 1 As shown, when the silicon wafer is transported on the conveyor 1, due to the vibration of the conveyor belt and other reasons, the silicon wafer 100 usually has a certain lateral deviation. In order to facilitate the detection of the distance that the silicon wafer 100 deviates from the standard posture in the lateral direction, in this embodiment, a lateral detection sensor 32 is further provided on the outer side of the wafer supporting device 2, as shown in FIG. Figure 1 and Figure 3 As shown, along the Y-axis direction, the distance between the lateral detection sensor 32 and the outer end surface of the positioning bracket 21 is W, where W≥0.1mm. For example, W preferably takes a value of 2mm.

[0065] It should be noted that the lateral detection sensor 32 is usually a distance measuring sensor, which detects the distance from the edge of the silicon wafer 100 parallel to the transmission belt to the distance measuring sensor, and compares the detection result with the distance between the silicon wafer 100 and the distance measuring sensor when it is in a standard posture, thereby determining the lateral offset distance of the silicon wafer 100 when the transmission is abnormal.

[0066] It should be noted that, in order to improve the detection accuracy of the lateral offset distance of the silicon wafer 100, multiple distance measuring sensors can be set on the same side of the support unit corresponding to each silicon wafer 100, and multiple distance measuring sensors spaced along the conveying direction can be set on the left and right sides of each support unit at the same time. Figure 1 As shown, the left and right sides of the support unit refer to two opposite sides along the Y-axis direction.

[0067] Optionally, the adjustment device 4 includes a lifting structure 41, which is arranged on the outside of the transmission device 1 and is used to adjust the posture of the silicon wafer 100 on the transmission device 1. One positioning support block 21 corresponds to at least one lifting structure 41, and each lifting structure 41 is used to independently complete one or more actions of lifting, longitudinal movement and lateral movement.

[0068] like Figure 1 and Figure 5 As shown, in this embodiment, the adjustment device 4 includes an adjustment rail 43 and a lifting structure 41. The adjustment rail 43 is arranged on the outside of the transmission belt, and the setting direction of the adjustment rail 43 is consistent with the conveying direction of the transmission device 1. There are multiple lifting structures 41, and multiple lifting structures 41 are arranged at intervals on the adjustment rail 43, and one positioning support block 21 corresponds to at least one lifting structure 41. Each lifting structure 41 can not only be lifted and lowered in a direction perpendicular to the plane where the silicon wafer 100 is located, but also can move laterally in a direction perpendicular to the adjustment rail 43 and move longitudinally along the conveying direction on the adjustment rail 43, so that each lifting structure 41 can independently complete one or more actions of lifting, longitudinal movement and lateral movement.

[0069] For example, Figure 5 As shown, the jacking structure 41 includes a longitudinal base 411, a longitudinal cylinder 412, a transverse base 413, a transverse cylinder 414, a lifting base 415 and a lifting cylinder 416. Among them, the longitudinal base 411 is slidably connected to the adjustment slide rail 43, one end of the longitudinal cylinder 412 is connected to the longitudinal base 411, and the other end of the longitudinal cylinder 412 is connected to the adjustment slide rail 43. The longitudinal movement of the jacking structure 41 is achieved by the longitudinal extension and contraction of the longitudinal cylinder 412. The transverse base 413 is set on the longitudinal base 411 and is slidably connected to the longitudinal base 411. One end of the transverse moving cylinder 414 is connected to the transverse moving base 413, and the other end of the transverse moving cylinder 414 is connected to the longitudinal moving base 411. The transverse movement of the lifting structure 41 is realized by the transverse extension and contraction of the transverse moving cylinder 414. The lifting base 415 is set on the transverse moving base 413 and is slidably connected to the transverse moving base 413. One end of the lifting cylinder 416 is connected to the transverse moving base 413, and the other end of the lifting cylinder 416 is connected to the lifting base 415. The lifting and contraction of the lifting cylinder 416 in a direction perpendicular to the plane of the silicon wafer 100 realizes the lifting and lowering of the lifting structure 41.

[0070] It should be noted that the positions of the transverse base 413 and the lifting base 415 in the above-mentioned lifting structure 41 can be interchanged as needed, and there is no restriction here. In addition, the lifting structure 41 is not limited to lifting the silicon wafer 100 from the bottom of the silicon wafer 100, but can also suck up the silicon wafer 100 from above the silicon wafer 100 to adjust the posture of the silicon wafer 100 on the transmission device 1. For example, the adjustment rail 43 of the adjustment device 4 and the lifting structure 41 are both arranged above the transmission device 1, the lifting structure 41 is suspended on the adjustment rail 43 and the part of the lifting structure 41 that contacts the silicon wafer 100 is provided with a suction cup 44, and the lifting structure 41 sucks up the silicon wafer 100 through the suction cup 44 and then adjusts its posture.

[0071] Preferably, after the posture adjustment of the silicon wafer 100 is completed, in order to avoid interference of the adjusting device 4 with the action of placing the suction cup and facilitate the subsequent placement of the suction cup to transfer the silicon wafer 100 into the mold, the adjusting slide rail and the lifting structure 41 of the adjusting device 4 are both arranged below the plane where the transmission belt is located. This not only avoids interfering with the transmission device 1 and the action of placing the suction cup, but also makes full use of the space at the bottom of the transmission device 1, saving the factory space occupied by the silicon wafer automatic transmission mechanism, thereby saving installation costs.

[0072] Optionally, the longitudinal detection sensor 31 includes a blockage sensor. In the transmission direction of the transmission device 1, the blockage sensor is arranged at a preset distance behind the standard posture of the silicon wafer 100 and is used to detect whether the silicon wafer 100 is blocked. The preset distance is equal to the spacing between adjacent support units.

[0073] like Figure 1 As shown, the direction of the X-axis is the transmission direction of the transmission device 1, the positive direction indicates forward, and the reverse direction indicates backward. In this embodiment, among the multiple longitudinal detection sensors 31 corresponding to each support unit, the last longitudinal detection sensor 31 located from front to back along the transmission direction is a blocking sensor, which is used to detect whether the silicon wafer 100 has a blockage. Normally, the blocking sensor is set at a preset distance behind the standard posture of the silicon wafer 100, wherein the preset distance is the distance between two adjacent support units.

[0074] For example, Figure 1 and Figure 2 As shown in the figure, the positive direction of the X-axis is the transmission direction of the transmission device 1. Each support unit corresponds to 3 longitudinal detection sensors. The distance L between two adjacent support units along the X-axis direction is the preset distance. The standard posture of the silicon wafer means that its rear side should be aligned with the vertical direction when the wafer is normally stopped. Figure 2The dotted line α in the figure is aligned and has no lateral offset in the Y-axis direction, that is, the lateral offset distance of the silicon wafer detected by the lateral detection sensor 32 is zero. The blocking sensor refers to one of the three longitudinal detection sensors corresponding to each wafer support unit and is arranged on the dotted line β, wherein the distance between the dotted line β and the dotted line α in the X-axis direction is a preset distance L.

[0075] In this way, when the blocking sensor detects that there is a silicon wafer 100 at its corresponding position, it means that a part of the silicon wafer 100 corresponding to the previous positioning support block 21 has fallen into the adjustment range of the next positioning support block 21, that is, there is a possibility of overlapping of the front and rear silicon wafers 100. At this time, it can be determined that the silicon wafer 100 is blocked. By setting the blocking sensor, a basis can be provided for how the adjustment device 4 performs the adjustment action, avoiding invalid adjustment, thereby saving time and improving efficiency.

[0076] Optionally, the regulating device 4 further includes a collecting box 42 , which is disposed on one side of the conveying device 1 and is used to collect the silicon wafers 100 that slide off the conveying device 1 .

[0077] like Figure 1 As shown, when the blocking sensor detects that a blocking occurs, it will take a long time to adjust the blocking to a normal state. In order to avoid ineffective adjustment and improve efficiency, the adjusting device 4 usually lifts the silicon wafer 100 to one side, tilts it to a certain angle, and then falls from the positioning support block 21.

[0078] In order to facilitate the recovery of the plugging pieces and avoid damage to the plugging pieces, in this embodiment, a collection box 42 is further provided on one side of the transmission device 1. The collection box 42 usually adopts a structure that has the function of preventing the silicon wafer 100 from being bumped and damaged. For example, a metal structure wrapped with PVC (polyvinyl chloride) material or other materials with weak elasticity can be adopted. The specific setting can be made according to needs and is not limited here.

[0079] In order to solve the above technical problems, Figure 6 As shown, the present invention also provides a method for handling abnormal silicon wafer movement, which adopts the above-mentioned silicon wafer automatic transmission mechanism, comprising:

[0080] S100, the detection device 3 of the silicon wafer automatic transmission mechanism detects the real-time posture information of the silicon wafer 100 on the transmission device 1 of the silicon wafer automatic transmission mechanism, and sends it to the controller of the silicon wafer automatic transmission mechanism;

[0081] The instantaneous posture information of the silicon wafer 100 includes a longitudinal displacement distance of the silicon wafer 100 deviating from the standard posture and a lateral displacement distance of the silicon wafer 100 deviating from the standard posture.

[0082] It should be noted that, under normal circumstances, since the transmission belt is for longitudinal transmission, under normal circumstances such as no blockage and no external force, the force between the silicon wafer 100 and the transmission belt is mainly friction along the longitudinal direction. Therefore, the real-time posture information of the silicon wafer 100 is mainly its longitudinal movement distance. However, due to the influence of some external factors such as machine vibration, the silicon wafer 100 will also produce a certain lateral offset when being transported on the transmission belt, thereby forming a certain lateral movement distance.

[0083] S200, the controller compares the instant posture information with the standard posture information of the silicon wafer 100 to obtain an adjustment instruction, and sends the adjustment instruction to the adjustment device 4 of the silicon wafer automatic transmission mechanism;

[0084] The adjustment instructions include longitudinal adjustment instructions and transverse adjustment instructions.

[0085] S300, the adjustment device 4 adjusts the silicon wafer 100 to a standard posture according to the adjustment instruction, such as Figure 7 As shown, specifically including:

[0086] S301, the adjusting device 4 adjusts the instantaneous longitudinal position of the silicon wafer 100 to the standard longitudinal position according to the longitudinal adjustment instruction;

[0087] S302, the adjusting device 4 adjusts the instantaneous lateral position of the silicon wafer 100 to the standard lateral position according to the lateral adjustment instruction;

[0088] It should be noted that the adjustment device 4 can first perform longitudinal adjustment and then perform lateral adjustment, or first perform lateral adjustment and then perform longitudinal adjustment. The specific settings can be made according to needs and are not limited here.

[0089] Optionally, the instantaneous posture information includes the distance L1 of the silicon wafer 100 relative to the standard stop position, and L1 = n×d1, where n is the number of longitudinal detection sensors 31 of the detection device 3 that detects the abnormality of the instantaneous stop position of the silicon wafer 100, and d1 is the spacing between adjacent longitudinal detection sensors 31.

[0090] like Figure 1 As shown, in this embodiment, the longitudinal movement distance in the instant posture information is recorded as L1, and L1 can be obtained based on the number n of longitudinal detection sensors 31 that detect the abnormal instant stop position of the silicon wafer 100 and the spacing d1 between adjacent sensors, that is, L1=n×d1, wherein the spacing d1 between adjacent longitudinal detection sensors 31 can be calculated based on the width D of the support unit along the transmission direction and the number N of longitudinal detection sensors 31 equipped on each support unit, that is, d1=D / N.

[0091] It should be noted that the standard wafer stop position refers to the position where the back side of the wafer should be aligned with the normal wafer stop position. Figure 2The dotted line α in the figure is aligned. What is different from the standard posture is that the standard stop position only limits the position of the silicon wafer in the X-axis direction, while the standard posture limits the position of the silicon wafer in both the X-axis and Y-axis directions. In addition, in the above formula d1=D / N, it should be understood that the calculation is directly based on the number of longitudinal detection sensors 31, that is, the spacing between two adjacent longitudinal detection sensors 31 is a unit error. If one longitudinal detection sensor 31 detects an abnormal stop position, then the silicon wafer 100 is offset by one unit error. If two longitudinal detection sensors 31 detect an abnormal stop position, then the silicon wafer 100 is offset by two unit errors, and so on. It should not be understood that the first longitudinal detection sensor 31 is used as a benchmark, and the subsequent longitudinal detection sensors 31 detect an abnormal stop position only when it is counted as a unit error.

[0092] Optionally, the adjustment instruction includes a lifting instruction. When the blocking sensor of the longitudinal detection sensor 31 detects that the silicon wafer 100 is blocked, at least one lifting structure 41 of the adjustment device 4 receives the lifting instruction and lifts the blocked silicon wafer 100 to one side of the transmission device 1 to an inclined state until it slides into the collection box 42 of the adjustment device 4.

[0093] like Figure 6 As shown, when the detection device 3 detects that the silicon wafer 100 is blocked, in order to save time and improve efficiency, in this embodiment, the method for handling abnormal silicon wafer movement further includes:

[0094] S400: At least one lifting structure 41 of the regulating device 4 receives a lifting instruction and lifts the blocked silicon wafer 100 toward one side of the conveying device 1 to an inclined state until the wafer slides into the collecting box 42 of the regulating device 4.

[0095] It should be noted that since each support unit is distributed with equal lifting structures 41 on both sides along the horizontal direction, in order to push the blocked silicon wafer 100 from the support unit into the collection box 42, a lifting instruction can be issued to the lifting structure 41 located on the opposite side of the collection box 42 to make it rise, thereby raising the corresponding side of the silicon wafer 100 so that it slides into the collection box 42.

[0096] It should be noted that the above-mentioned at least one lifting structure 41 refers to the lifting structure 41 located on the same side of the conveyor belt. Of course, if necessary, for example, because the width of the lateral edge of the positioning support block 21 is too large, which affects the falling of the silicon wafer 100 that is blocked, multiple lifting structures 41 located on both sides can also be used to simultaneously lift the silicon wafer 100 to a certain height, and then continue to lift it from the lifting structure 41 on the side away from the collection box 42, so that the silicon wafer 100 slides into the collection box 42.

[0097] Although the present disclosure is disclosed as above, the protection scope of the present disclosure is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present disclosure, and these changes and modifications will fall within the protection scope of the present invention.

Claims

1. A silicon wafer automatic transmission mechanism, characterized in that: include: A conveying device for conveying silicon wafers; a wafer supporting device, disposed outside the transmission device and used to lift the silicon wafer from the transmission device; a detection device, disposed inside the transmission device and used to detect the posture of the silicon wafer on the transmission device; an adjusting device, disposed on one side of the conveying device and used to adjust the posture of the silicon wafer on the conveying device; a controller, the controller being electrically connected to the transmission device, the sheet supporting device, the detection device, and the adjustment device respectively; The detection device includes a longitudinal detection sensor, and the longitudinal detection sensor includes a wafer blockage sensor. In the transmission direction of the transmission device, the wafer blockage sensor is arranged at a preset distance behind the standard posture of the silicon wafer and is used to detect whether the silicon wafer is blocked. The adjusting device further includes a collecting box, which is arranged on one side of the conveying device and is used to collect the silicon wafers that slide off the conveying device; When the wafer blocking sensor detects that the silicon wafer is located at the corresponding position, the adjusting device is used to place the silicon wafer in the collecting box.

2. The automatic silicon wafer transport mechanism according to claim 1, characterized in that: The sheet supporting device includes a plurality of sheet supporting units, and the plurality of sheet supporting units are arranged at intervals along the conveying direction of the transmission device.

3. The automatic silicon wafer transport mechanism according to claim 2, characterized in that: Each of the support units includes two positioning support blocks, which are arranged opposite to each other and perpendicular to the conveying direction of the transmission device. One positioning support block is arranged on one side of the transmission device, and the other positioning support block is arranged on the other side opposite to the transmission device.

4. The automatic silicon wafer transport mechanism according to claim 3, characterized in that: The detection device includes a plurality of longitudinal detection sensors, and the plurality of longitudinal detection sensors are arranged at intervals along the conveying direction of the transmission device.

5. The automatic silicon wafer transport mechanism according to claim 4, characterized in that: One support unit matches N longitudinal detection sensors, and N=(L / d)+1, where L is the distance between adjacent support units, and d is the compatible tolerance accuracy of the support unit.

6. The automatic silicon wafer transport mechanism according to claim 5, characterized in that: The adjusting device includes a lifting structure, which is arranged on the outside of the transmission device and is used to adjust the posture of the silicon wafer on the transmission device.

7. The automatic silicon wafer transport mechanism according to claim 6, characterized in that: One positioning support block corresponds to at least one lifting structure, and each lifting structure is used to independently complete one or more actions of lifting, longitudinal movement and lateral movement.

8. The automatic silicon wafer transport mechanism according to claim 2, characterized in that: The preset distance is equal to the spacing between adjacent supporting units.

9. A method for handling abnormal silicon wafer movement, characterized in that: The automatic silicon wafer transport mechanism according to any one of claims 1 to 8 comprises: The detection device of the silicon wafer automatic transmission mechanism detects the real-time posture information of the silicon wafer on the transmission device of the silicon wafer automatic transmission mechanism and sends it to the controller of the silicon wafer automatic transmission mechanism; The controller compares the instant posture information with the standard posture information of the silicon wafer to obtain an adjustment instruction, and sends the adjustment instruction to the adjustment device of the silicon wafer automatic transmission mechanism; The adjusting device adjusts the silicon wafer to a standard posture according to the adjustment instruction; The adjustment instruction includes a lifting instruction. When the blocking sensor of the longitudinal detection sensor detects that the silicon wafer is blocked, at least one lifting structure of the adjustment device receives the lifting instruction and lifts the blocked silicon wafer toward one side of the transmission device to an inclined state until it slides into the collection box of the adjustment device.

10. The method for handling abnormal silicon wafer movement according to claim 9, wherein: The instant posture information includes the distance L1 of the silicon wafer relative to the standard stop position, and L1=n×d1, where n is the number of longitudinal detection sensors of the detection device that detects the abnormality of the instant stop position of the silicon wafer, and d1 is the spacing between adjacent longitudinal detection sensors.

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