A switch

Abstract

The present application provides a switch, which relates to the technical field of switches. The switch includes: a housing formed with a receiving cavity, the receiving cavity including an air duct; a power supply assembly disposed in the receiving cavity; air inlets and outlets are formed on the housing, and both the air inlets and outlets are connected to the air duct so that air can enter the air duct from the air inlet and be discharged from the air outlet. At least part of the power supply assembly is disposed in the air duct so that the air entering the air duct can exchange heat with the power supply assembly to reduce the temperature of the power supply assembly. The present application is applicable to the heat dissipation process of the switch and is used to solve the problems of large fan heat dissipation noise and increased overall power consumption of the switch.

Description

Technical Field

[0001] This application relates to the technical field of switches, and particularly to a switch. Background Art

[0002] A switch is an important component in a network communication system.

[0003] Currently, the heat dissipation problem of most switches on the market is mainly solved by built-in fans.

[0004] However, on the one hand, the built-in fan causes extremely high noise during the operation of the switch, and on the other hand, it increases the overall power consumption of the switch. Summary of the Invention

[0005] Based on the above technical problems, this application provides a switch that can dissipate heat from the components inside the switch by opening an air inlet and an air outlet on the housing of the switch and forming an air duct inside the accommodation cavity of the housing.

[0006] In a first aspect, this application provides a switch, which includes: a housing; the housing forms an accommodation cavity, and the accommodation cavity includes a first air duct and a second air duct; a power supply component; arranged in the accommodation cavity; the housing includes a top wall surface and a side wall surface, a first air inlet is opened on the side wall surface, and a first air outlet is opened on the top wall surface, and both the first air inlet and the first air outlet are communicated with the first air duct, so that air can enter the first air duct from the first air inlet and be discharged from the first air outlet, and at least part of the power supply component is arranged in the first air duct, so that the air entering the first air duct can exchange heat with the power supply component to reduce the temperature of the power supply component.

[0007] It should be understood that the power supply and the motherboard inside the switch will generate heat during operation, especially in a high-power POE switch powered by Ethernet (Power over Ethernet, POE), the generated heat is greater. The air inside the switch expands when heated, the air density becomes smaller, and the weight is light, so it will rise. The switch provided in this application can set an air outlet on the top wall surface of the housing to facilitate the hot air inside the switch to be discharged from the air outlet on the top wall surface. At the same time, the air pressure of the hot air inside the switch is relatively small, and the air flow always flows from high pressure to low pressure. The switch provided in this application can set an air inlet on the side wall surface of the housing to facilitate the cold air with higher external air pressure of the switch to be sucked into the switch, so as to exchange heat with the components inside the switch and dissipate heat from the components inside the switch.

[0008] In addition, the current solution for cooling the switch using a fan may also suck in dust particles, and the corrosion phenomenon caused by the dust particles will also affect the normal operation of the switch. The power of the switch provided in this application for sucking in external air from the air inlet due to the pressure difference between hot and cold air is relatively small compared to that of a fan, and the amount of dust particles sucked in is less, thereby alleviating the corrosion phenomenon caused by the dust particles.

[0009] Optionally, the power supply assembly includes: a power supply connected to the housing; a first heat dissipation component, the first heat dissipation component including a heat conduction plate and a heat dissipation plate connected together; the heat conduction plate is in contact with the power supply; at least part of the heat dissipation plate is disposed in the first air duct; the heat dissipation plate is disposed at an angle with the heat conduction plate, the heat dissipation plate includes a first end and a second end spaced apart in a first direction, the first end of the heat dissipation plate is connected to the heat conduction plate, the first end is close to the first air inlet, the second end is close to the first air outlet, the first end of the heat dissipation plate is located on the side of the second end adjacent to the first air inlet, and the angle between the first direction and the opening direction of the first air inlet is greater than 0° and less than 90°.

[0010] The power supply assembly in the switch provided in this application may include a power supply and a heat dissipation component. The heat dissipation plate in the heat dissipation component that is in contact with the power supply can absorb the heat generated by the power supply and transfer the absorbed heat to the heat dissipation plate. At least part of the heat dissipation plate is disposed in the first air duct, and the heat dissipation plate can exchange heat with the air flowing in the first air duct, thereby realizing the heat dissipation of the power supply. This direct contact heat transfer method has a large heat transfer area, a higher heat transfer rate, and a better heat dissipation effect.

[0011] Optionally, the heat dissipation plate is located on the side of the power supply adjacent to the first air inlet, and the first projection is within the second projection; the first projection is the projection of the power supply on the plane where the first air inlet is located; the second projection is the projection of the heat dissipation plate on the plane where the first air inlet is located.

[0012] It should be understood that the external air sucked in from the air inlet on the housing may be mixed with some debris. The switch provided in this application can be provided with a heat dissipation plate that completely shields the power supply to block the debris that may be mixed in the external air, so as to prevent the power supply from being impacted or penetrated by the debris entering from the first air inlet, thereby ensuring the normal operation of the switch and improving the stability and reliability of the switch.

[0013] Optionally, the first air outlet is disposed within the orthographic projection of the heat dissipation plate on the top wall surface.

[0014] It should be understood that in order to protect the power supply from being impacted or penetrated by the falling debris, the housing above the power supply usually does not have an opening. The switch provided in this application can set the first air outlet within the projection of the heat dissipation plate on the top wall surface, and use the heat dissipation plate as a barrier for the power supply to prevent the debris falling from the first air outlet from impacting or penetrating the power supply, thereby ensuring the normal operation of the switch and improving the stability and reliability of the switch.

[0015] Optionally, the first heat dissipation component further includes a plurality of heat dissipation fins, which are located on the side of the heat dissipation plate adjacent to the first air inlet and are arranged at intervals in the second direction. The second direction is parallel to the plane where the first air inlet is located and the plane where the first air outlet is located.

[0016] It should be understood that the larger the contact area (i.e., the heat exchange area) between the heat dissipation component and the cold air outside the switch, the higher the heat exchange efficiency. The switch provided in this application can increase the heat exchange area and improve the heat exchange efficiency by arranging a plurality of heat dissipation fins on the heat dissipation plate compared with the solution of only arranging the heat dissipation plate.

[0017] Optionally, the heat conduction plate and the heat dissipation plate are integrally formed. There is a connecting portion between the heat conduction plate and the heat dissipation plate. The plane of the heat conduction plate, the plane of the heat dissipation plate, and the connecting portion are connected in a transitional manner. The included angle between the heat dissipation plate and the heat conduction plate is between 0 degrees and 90 degrees. The included angle between the heat dissipation fins and the horizontal plane is the same as the included angle between the heat dissipation plate and the heat conduction plate. The channels formed between adjacent heat dissipation fins are part of the first air duct.

[0018] Optionally, the accommodation cavity further includes a second air duct; the switch further includes a main board assembly disposed in the accommodation cavity; a second air inlet is further provided on the side wall surface; a second air outlet is further provided on the top wall surface; both the second air inlet and the second air outlet are communicated with the second air duct so that air can enter the second air duct from the second air inlet and be discharged from the second air outlet; at least part of the main board assembly is disposed in the second air duct so that the air entering the second air duct can exchange heat with the main board assembly to reduce the temperature of the main board assembly.

[0019] Optionally, the main board assembly includes: a main board connected to the housing; a second heat dissipation component connected to the main board. The second heat dissipation component includes a plurality of heat dissipation fin groups arranged in sequence in the third direction. Each heat dissipation fin group includes a plurality of heat dissipation fins arranged at intervals in the fourth direction; wherein, the third direction is parallel to the plane where the heat dissipation fins are located and the plane where the main board is located, the fourth direction is perpendicular to the plane where the heat dissipation fins are located, and is parallel to the plane where the second air inlet is located and the plane where the second air outlet is located. Optionally, a closed copper tube is further provided inside and / or on the outer surface of the heat conduction plate; the closed copper tube contains a coolant.

[0020] It should be understood that the specific heat capacity of a liquid is usually larger than that of a solid, that is, the ability of a liquid to absorb and dissipate heat is stronger than that of a solid. The switch provided in this application can also be provided with a copper tube filled with a coolant inside and / or on the outer surface of the heat conduction plate. The copper tube filled with the coolant can further improve the heat dissipation ability of the heat dissipation component.

[0021] Optionally, the heat dissipation plate further includes a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged in the first air duct.

[0022] Optionally, the material of each of the heat conducting plate and the heat dissipating plate includes one of aluminum, copper, and graphite.

[0023] Optionally, dust-proof nets are provided at the first air inlet, the second air inlet, the first air outlet, and the second air outlet. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is an exploded view of some components of the switch provided by the embodiment of the present application;

[0026] Figure 2 It is a schematic diagram of the top housing 101 provided by the embodiment of the present application;

[0027] Figure 3 It is a schematic diagram of the bottom housing 102 provided by the embodiment of the present application;

[0028] Figure 4 It is a schematic diagram of the composition of the power supply component provided by the embodiment of the present application;

[0029] Figure 5 It is a schematic diagram of the composition of the first heat dissipation component 220 provided by the embodiment of the present application;

[0030] Figure 6 It is another exploded view of the switch provided by the embodiment of the present application;

[0031] Figure 7 It is a schematic diagram of the structure of the second heat dissipation component provided by the embodiment of the present application;

[0032] Figure 8 It is another exploded view of the switch provided by the embodiment of the present application. Detailed Embodiments

[0033] Hereinafter, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", or "third", etc. may explicitly or implicitly include one or more of such features.

[0034] The switch is an important component in the network communication system.

[0035] At present, the heat dissipation problem of most switches on the market is mainly solved by built-in fans.

[0036] However, on the one hand, the built-in fan causes extremely high noise during the operation of the switch, and on the other hand, it increases the overall power consumption of the switch.

[0037] Based on this, the present application provides a switch that can dissipate heat from the components inside the switch by forming an air duct inside the accommodation cavity formed by the housing of the switch by opening an air inlet and an air outlet on the housing, thereby reducing the noise during operation and lowering the overall power consumption of the switch.

[0038] The following is an introduction in conjunction with the accompanying drawings.

[0039] Figure 1 It is an exploded view of some components of the switch provided by the embodiment of the present application. As Figure 1 shown, the switch may include: a housing 100 and a power supply component 200.

[0040] Among them, the housing 100 forms an accommodation cavity 110, and the accommodation cavity includes a first air duct 111.

[0041] The power supply component 200 is disposed in the accommodation cavity 110.

[0042] The specific composition structure of the power supply component 200 can be referred to as described in the following embodiments, and will not be elaborated here.

[0043] The housing 100 is also provided with a first air inlet 120 and a first air outlet 130.

[0044] Both the first air inlet 120 and the first air outlet 130 are connected to the first air duct 111, so that air (outside the switch) can enter the first air duct 111 through the first air inlet 120 and be discharged from the first air outlet 130 ( Figure 1 taking the direction indicated by the dotted arrow in

[0045] as an example of the air flow direction).

[0046] It can be understood that the power supply component 200 can also be completely disposed in the first air duct 111.

[0047] Optionally, dust-proof nets can be provided at both the first air inlet 120 and the first air outlet 130.

[0048] For example, the housing 100 can be made of metal, and the dust-proof net can be made of a magnetic material and can be adsorbed on each of the above air inlets and outlets on the housing 100. In some possible embodiments, the housing 100 can include a top wall surface and a side wall surface. The first air inlet 120 can be disposed on the side wall surface of the housing 100. The first air outlet 130 can be disposed on the top wall surface of the housing 100.

[0049] Exemplarily, Figure 2 is a schematic diagram of the top housing 101 provided by an embodiment of the present application. As Figure 2 shown, taking Figure 1 the shown perspective as an example, the first air inlet 120 is located on the left side wall surface of the housing of the switch, and the first air outlet 130 is located at the left end of the top wall surface of the housing of the switch. Similarly, taking Figure 1 the arrangement position of the power supply assembly 200 in (that is, the power supply assembly 200 is disposed on the left side of the accommodation cavity) as an example, the first air inlet 120 close to the power supply assembly 200 can also be understood as the power supply side air inlet, and the first air outlet 130 close to the power supply assembly 200 can also be understood as the power supply side air outlet. The side wall surface of the top housing may further include a plurality of holes.

[0050] It should be noted that, Figure 2 taking the left and right side wall surfaces as an example shows the side wall surface of the housing, and the four side walls around the housing can all be understood as the side wall surface of the housing. The embodiments of the present application do not limit this.

[0051] Exemplarily, Figure 3 is a schematic diagram of the bottom housing 102 provided by an embodiment of the present application. As Figure 3 shown, after rotating the bottom housing 102 from the perspective shown in Figure 1 , the positional relationship among the front panel 1021, the rear panel 1022, and the bottom sheet metal 1023 of the bottom housing 102 can be as Figure 3 shown. The side wall surface of the bottom housing may further include a plurality of internal threads that respectively cooperate with the plurality of holes on the side wall surface of the top housing, and screws can pass through the positioning holes on the side wall surface of the top housing and be connected to the internal threads on the side wall surface of the bottom housing to connect the top housing and the bottom housing together.

[0052] It should be noted that, Figure 2 and Figure 3 the division of the housing in is only an example, and there can be other division methods. For example, the top housing 101 includes the top wall surface of the above housing 100, and the bottom housing 102 includes the side wall surface of the above housing 100; or, the housing divided left and right; or, the housing divided front and back, etc. The embodiments of the present application do not limit this.

[0053] It should be understood that the power supply inside the switch generates heat during operation, especially in the case of a high-power Power over Ethernet (POE) switch that supplies power over Ethernet, and the heat generated is even greater. The air inside the switch expands when heated, the air density becomes smaller, and the weight is light, so it will rise. The switch provided by the embodiment of the present application can be provided with an air outlet on the top wall surface of the housing to facilitate the hot air inside the switch to be discharged from the air outlet on the top wall surface. At the same time, the air pressure of the hot air inside the switch is relatively small, and the air flow always flows from high pressure to low pressure. The switch provided by the embodiment of the present application can be provided with an air inlet on the side wall surface of the housing to facilitate the cold air with higher external air pressure to be sucked into the switch, so as to exchange heat with the components inside the switch and dissipate heat from the components inside the switch.

[0054] In addition, the current solution for dissipating heat from the switch using a fan may also suck in dust particles, and the corrosion phenomenon caused by the dust particles will also affect the normal operation of the switch. The power of the switch provided by the embodiment of the present application for sucking in external air from the air inlet using the pressure difference between hot and cold air is relatively small compared with that of the fan, and the amount of dust particles sucked in is less, so as to alleviate the corrosion phenomenon caused by the dust particles.

[0055] In some possible embodiments, Figure 4 is a schematic diagram of the composition of the power supply component provided by the embodiment of the present application. As Figure 4 shown, the power supply component 200 may specifically include a power supply 210 and a first heat dissipation component 220.

[0056] Among them, the power supply 210 may include a power supply main body 211 and a power supply bottom case 212. A plurality of fixing holes 213 are also provided on the power supply bottom case 212.

[0057] Optionally, the power supply 210 may be an open-board power supply or a power supply in other packaging forms. The embodiment of the present application does not limit this. The specific structural composition of the power supply 210 may refer to that described in the related art and will not be elaborated here.

[0058] The first heat dissipation component 220 includes a heat conduction plate 221 and a heat dissipation plate 222 connected together. The heat conduction plate 221 is attached to the power supply 210. A plurality of fixing holes 2211 are also provided on the heat conduction plate 221. At least part of the heat dissipation plate 222 is disposed in the first air duct 111.

[0059] Among them, the heat dissipation plate 222 in the first heat dissipation component 220 may include a first end and a second end spaced apart along the first direction ( Figure 4 taking the direction indicated by the arrow in

[0060] For example, the included angle between the first direction and the opening direction of the first air inlet 120 may be 15°, 30°, 45°, 60°, or 75°, etc. The embodiments of the present application do not limit this.

[0061] It can be understood that the heat dissipation plate 222 may also be entirely disposed in the first air duct 111.

[0062] In a possible implementation, the power supply 210, the heat conduction plate 221, and the housing 100 may be commonly connected together by screws. In this case, the heat conduction plate 221 may also be provided with fixing holes 213 that respectively cooperate with the multiple fixing holes 213 on the bottom case 212 of the power supply. The housing 100 (i.e., the bottom case shown above Figure 3 may further include internal threads that respectively cooperate with the multiple fixing holes 213 on the heat conduction plate 221). The screws may pass through the fixing holes 213 on the bottom case 212 of the power supply and the fixing holes 2211 on the heat conduction plate 221, and be connected to the internal threads on the housing 100 to fix the power supply 210 and the heat conduction plate 221 on the housing 100.

[0063] In another possible implementation, the power supply 210 may first be connected to the heat conduction plate 221 to form a power supply assembly 200, and the power supply assembly 200 may be connected to the housing 100. In this case, the heat conduction plate 221 may be provided with internal threads that respectively cooperate with the multiple fixing holes 213 on the bottom case 212 of the power supply. The screws may pass through the fixing holes 213 on the bottom case 212 of the power supply and be connected to the internal threads on the heat conduction plate 221 to fix the power supply 210 and the heat conduction plate 221 together.

[0064] Then, the heat conduction plate 221 may be fixed to the housing 100. For example, the heat conduction plate 221 may be fixed to the housing 100 by a fixing method similar to that of the above-mentioned power supply 210 and the heat conduction plate 221, or the housing 100 may be provided with a card slot that matches the thickness of the heat conduction plate 221, and the heat conduction plate 221 may be fixed to the housing 100 by being stuck in the card slot of the housing 100. The embodiments of the present application do not limit the specific method of fixing the heat conduction plate 221 to the housing 100.

[0065] The power supply assembly in the switch provided by the embodiments of the present application may include a power supply and a heat dissipation component. The heat dissipation plate in the heat dissipation component that is in contact with the power supply may absorb the heat generated by the power supply and transfer the absorbed heat to the heat dissipation plate. At least a part of the heat dissipation plate is disposed in the first air duct, and the heat dissipation plate may exchange heat with the air flowing in the first air duct, thereby realizing the heat dissipation of the power supply. This direct contact heat transfer method has a large heat transfer area, a higher heat transfer rate, and a better heat dissipation effect.

[0066] Optionally, the heat dissipation plate 222 may be located on the side of the power supply 210 adjacent to the first air inlet 120, and the heat dissipation plate 222 may partially shield the power supply 210. In this case, taking the first projection as the projection of the power supply 210 on the plane where the first air inlet 120 is located, and the second projection as the projection of the heat dissipation plate 222 on the plane where the first air inlet 120 is located as an example, the second projection may be within the first projection.

[0067] Optionally, the heat dissipation plate 222 may be located on the side of the power supply 210 adjacent to the first air inlet 120, and the heat dissipation plate 222 may completely shield the power supply 210. In this case, taking the first projection as the projection of the power supply 210 on the plane where the first air inlet 120 is located, and the second projection as the projection of the heat dissipation plate 222 on the plane where the first air inlet 120 is located as an example, the first projection may be within the second projection.

[0068] It should be understood that some debris may be mixed in the external air inhaled from the air inlet on the housing. The switch provided in the embodiment of the present application may be provided with a heat dissipation plate that completely shields the power supply to block the debris that may be mixed in the external air, so as to prevent the power supply from being impacted or penetrated by the debris entering from the first air inlet, thereby ensuring the normal operation of the switch and improving the stability and reliability of the switch.

[0069] Optionally, the first air outlet 130 may also be provided within the projection of the heat dissipation plate 222 on the top wall surface.

[0070] For example, the first air outlet 130 may be set as a first rectangle, the heat dissipation plate 222 may be set as a second rectangle, the projection of the heat dissipation plate 222 on the top wall surface is a third rectangle, and the length and width of the first rectangle may be set to be smaller than the length and width of the third rectangle, or, smaller than the length and width of the third rectangle.

[0071] It should be understood that in order to protect the power supply from being impacted or penetrated by the falling debris, the housing above the power supply usually does not have an opening. The switch provided in the embodiment of the present application may set the first air outlet within the projection of the heat dissipation plate on the top wall surface, and use the heat dissipation plate as a barrier for the power supply to prevent the debris falling from the first air outlet from impacting or penetrating the power supply, thereby ensuring the normal operation of the switch and improving the stability and reliability of the switch.

[0072] In some possible embodiments, the heat dissipation plate 222 may further include heat dissipation fins 2221. Figure 5 It is a schematic diagram of the composition of the first heat dissipation component provided by the embodiment of the present application. As Figure 5 shown, on the basis of the first heat dissipation component 220 shown above Figure 4 shown, the first heat dissipation component 220 may further include a plurality of heat dissipation fins 2221. The plurality of heat dissipation fins 2221 are located on the side of the heat dissipation plate 222 adjacent to the first air inlet 120, and along the second direction (Figure 5 Taking the direction indicated by the arrow as an example, they are arranged at intervals. The second direction is parallel to the plane where the first air inlet 120 is located and the plane where the first air outlet 130 is located. The plane where each heat dissipation fin 2221 among the plurality of heat dissipation fins 2221 is located is parallel to the flow direction of the air that enters from the first air inlet 120, passes through the first air duct 111, and is discharged from the first air outlet 130 in an ideal state.

[0073] Optionally, the heat dissipation fins 2221 can be welded to the heat dissipation plate 222 through a welding process, or can be clamped to the heat dissipation plate 222 through a card slot provided on the heat dissipation plate 222 (for example, the heat dissipation fin 2221 can be L-shaped, one side of the L-shape can be clamped in the card slot of the heat dissipation plate 222, and the other side of the L-shape can be arranged in the first air duct 111), or can be fixed to the heat dissipation plate 222 through other connection methods. The embodiments of the present application do not limit this.

[0074] Optionally, the material of the heat dissipation fins 2221 can include any one of aluminum, copper, and graphite.

[0075] It should be understood that the larger the contact area (i.e., the heat exchange area) between the heat dissipation component and the cold air outside the switch, the higher the heat exchange efficiency. The switch provided by the embodiments of the present application can increase the heat exchange area and improve the heat exchange efficiency by arranging a plurality of heat dissipation fins 2221 on the heat dissipation plate 222 compared with the solution of only arranging the heat dissipation plate.

[0076] Optionally, the heat conduction plate 221 and the heat dissipation plate 222 can be an integral structure. For example, the heat conduction plate 221 and the heat dissipation plate 222 can be made by processes such as integral casting or integral stamping. There is a connecting portion between the heat conduction plate 221 and the heat dissipation plate 222. The heat conduction plate plane, the heat dissipation plate plane, and the connecting portion are connected in a transitional manner. The included angle between the heat dissipation plate 222 and the heat conduction plate 221 is between 0 degrees and 90 degrees. The included angle between the heat dissipation fins 2221 and the horizontal plane is the same as the included angle between the heat dissipation plate 222 and the heat conduction plate 221. The channel formed between adjacent heat dissipation fins 2221 is a part of the first air duct 111.

[0077] Optionally, the material of each of the heat conduction plate 221 and the heat dissipation plate 222 can include any one of aluminum, copper, and graphite.

[0078] Optionally, a closed copper tube is further provided inside the heat conduction plate 221 and / or on the outer surface of the heat conduction plate 221 (such as the surface where the heat conduction plate 221 is in contact with the power supply 210 or the surface where the heat conduction plate 221 is in contact with the bottom housing), and the closed copper tube also includes a coolant.

[0079] Among them, the coolant can be water or other refrigerants (such as Freon, alkanes, ammonia, or carbon dioxide, etc.). The embodiments of the present application do not limit this.

[0080] It should be understood that the specific heat capacity of a liquid is usually larger than that of a solid, that is, the heat absorption and dissipation ability of a liquid is stronger than that of a solid. The switch provided by the embodiments of the present application can also be provided with a copper tube filled with coolant inside and / or on the outer surface of the heat conducting plate, and the copper tube filled with coolant can further improve the heat dissipation ability of the heat dissipation component.

[0081] In some possible embodiments, the switch may further include a main board assembly and related structures for dissipating heat from the main board assembly. In this case, Figure 6 is another exploded view of the switch provided by the embodiments of the present application. As Figure 6 shown, on the basis of the switch shown above Figure 1 shown, the accommodation cavity in the switch further includes a second air duct, the switch further includes a main board assembly 300 disposed in the accommodation cavity, a second air inlet 140 is further opened on the side wall surface of the housing 100, a second air outlet 150 is further opened on the top wall surface of the housing 100, and both the second air inlet 140 and the second air outlet 150 are communicated with the second air duct, so that air (outside the switch) can enter the second air duct from the second air inlet 140 and be discharged from the second air outlet 150, and at least a part of the main board assembly 300 is disposed in the second air duct, so that the air entering the second air duct can exchange heat with the main board assembly 300 to reduce the temperature of the main board assembly 300. Optionally, the main board assembly 300 may further specifically include a main board and a second heat dissipation component for dissipating heat from the main board. Figure 7 is a schematic structural diagram of the second heat dissipation component provided by the embodiments of the present application. As Figure 7 shown, the main board assembly 300 may further include a main board 310 and a second heat dissipation component 320.

[0082] The main board 310 is connected to the housing 100, and the specific connection method may refer to that described at the power supply 210 above, and will not be elaborated here.

[0083] The second heat dissipation component 320 is connected to the main board 310, and the specific connection method may refer to that described at the power supply 210 and the first heat dissipation component 220 above, and will not be elaborated here.

[0084] The second heat dissipation component 320 includes a plurality of heat sink groups 321 arranged in sequence along the third direction ( Figure 7 taking the direction indicated by the arrow in Figure 7 as an example), and each heat sink group 321 includes a plurality of heat sinks 3211 arranged at intervals along the fourth direction (

[0085] Wherein, the third direction is parallel to the plane where the heat sink 3211 is located and the plane where the main board is located, and the fourth direction is perpendicular to the plane where the heat sink 3211 is located and parallel to the plane where the second air inlet 140 is located and the plane where the second air outlet 150 is located.

[0086] It should be noted that Figure 6 and Figure 7 the layout of the main board assembly 300 and the related structures for dissipating heat from the main board assembly 300 in Figure 6 and Figure 7 are only examples, and there can be other layout forms. For example, taking the perspective shown in Figure 7 as an example, the main board assembly 300 in Figure 6 can also be rotated clockwise or counterclockwise by a certain angle (such as 90° or 270°, etc.) in its plane. The second air inlet 140 in

[0087] Some possible embodiments Figure 8 is another exploded view of the switch provided by the embodiment of the present application. As shown in Figure 8 taking the above Figure 2 and Figure 3 where the housing 100 is divided into a top housing 101 and a bottom housing 102 as an example, Figure 8 shows the relative positional relationship among the power supply 210, the first heat dissipation component 220, the housing 100 (top housing 101 and bottom housing 102), the main board 310, and the second heat dissipation component 320 in the switch. As described above, the above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any change or replacement within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A switch, characterized in that, Comprising: A housing; the housing forms a receiving cavity, and the receiving cavity includes a first air duct; A power supply assembly; disposed in the receiving cavity; The housing includes a top wall surface and a side wall surface, a first air inlet is formed on the side wall surface, and a first air outlet is formed on the top wall surface, Both the first air inlet and the first air outlet are communicated with the first air duct, so that air can enter the first air duct from the first air inlet and be discharged from the first air outlet, At least a part of the power supply assembly is disposed in the first air duct, so that the air entering the first air duct can exchange heat with the power supply assembly to reduce the temperature of the power supply assembly; The power supply assembly includes: A power supply, connected to the housing; A first heat dissipation component, the first heat dissipation component includes a heat conduction plate and a heat dissipation plate connected together; the heat conduction plate is attached to the power supply; at least a part of the heat dissipation plate is disposed in the first air duct; the heat dissipation plate is disposed at an angle with the heat conduction plate, the heat dissipation plate includes a first end and a second end spaced along a first direction, the first end of the heat dissipation plate is connected to the heat conduction plate, the first end is close to the first air inlet, the second end is close to the first air outlet, the first end of the heat dissipation plate is located on one side of the second end adjacent to the first air inlet, and the included angle between the first direction and the opening direction of the first air inlet is greater than 0° and less than 90°.

2. The switch according to claim 1, characterized in that, The first air outlet is disposed within the orthographic projection of the heat dissipation plate on the top wall surface.

3. The switch according to claim 1, characterized in that, The first heat dissipation component further includes a plurality of heat dissipation fins, the plurality of heat dissipation fins are located on a side of the heat dissipation plate adjacent to the first air inlet, and are spaced along a second direction, and the second direction is parallel to the plane where the first air inlet is located and the plane where the first air outlet is located.

4. The switch according to claim 3, wherein The heat conduction plate and the heat dissipation plate are integrally formed, there is a connecting portion between the heat conduction plate and the heat dissipation plate, the heat conduction plate plane, the heat dissipation plate plane, and the connecting portion are connected in a transitional manner, the included angle between the heat dissipation plate and the heat conduction plate is between 0 degrees and 90 degrees, the included angle between the heat dissipation fin and the horizontal plane is the same as the included angle between the heat dissipation plate and the heat conduction plate, and the channel formed between adjacent heat dissipation fins is a part of the first air duct.

5. The switch according to claim 1, wherein The receiving cavity further includes a second air duct; The switch further includes a main board assembly disposed in the receiving cavity; A second air inlet is further formed on the side wall surface; a second air outlet is further formed on the top wall surface; Both the second air inlet and the second air outlet are communicated with the second air duct, so that air can enter the second air duct from the second air inlet and be discharged from the second air outlet; At least a part of the main board assembly is disposed in the second air duct, so that the air entering the second air duct can exchange heat with the main board assembly to reduce the temperature of the main board assembly.

6. The switch according to claim 5, wherein The main board assembly includes: A main board, connected to the housing; The second heat dissipation component, which is connected to the main board, and the second heat dissipation component includes a plurality of heat sink groups arranged in sequence along a third direction, and each heat sink group includes a plurality of heat sinks arranged at intervals along a fourth direction; Wherein, the third direction is parallel to the plane where the heat sink is located and the plane where the main board is located, the fourth direction is perpendicular to the plane where the heat sink is located, and is parallel to the plane where the second air inlet is located and the plane where the second air outlet is located.

7. The switch according to claim 1, characterized in that, The heat dissipation plate is located on the side of the power supply adjacent to the first air inlet, and the first projection is within the second projection. The first projection is the projection of the power supply on the plane where the first air inlet is located, and the second projection is the projection of the heat dissipation plate on the plane where the first air inlet is located.

8. The switch according to any one of claims 1-4, characterized in that, A closed copper tube is further provided inside and / or on the outer surface of the heat conduction plate; the closed copper tube contains a coolant.

9. The switch according to claim 8, characterized in that, The material of each of the heat conduction plate and the heat dissipation plate includes one of aluminum, copper, and graphite.

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