Printing control methods, devices, printed circuit boards and printing presses

Abstract

This invention provides a printing control method, apparatus, printed circuit board, and printing machine. The printing control method includes: obtaining at least one influencing factor of solder paste thickness; determining a target formula based on the mapping relationship between each influencing factor and the solder paste thickness; wherein the target formula includes at least one influencing factor and a weight for each influencing factor. This invention, through the target formula, can scientifically optimize the settings of the printing machine, thereby accurately and effectively controlling the thickness and quality of the printed solder paste layer, saving unnecessary solder paste waste, eliminating the impact of the printing station on the next placement station, ensuring the reliability and mechanical strength of reflow soldering, and increasing the service life of the product in various application scenarios.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, and more particularly to a printing control method, apparatus, printed circuit board, and printing machine. Background Technology

[0002] With the rapid development of the electronics industry, solder paste printing is a difficult process and step to control in the development of PCBA. As the packaging density of printed circuit boards increases, and the types and shapes of printed components also increase, improving the quality of solder paste stencil printing has become an important research topic.

[0003] Solder paste printing is a crucial part of the SMT (Surface Mount Technology) field. Factors such as solder paste particle diameter, squeegee speed, squeegee pressure, stencil-PCB fit, and screen aperture size and thickness all affect solder paste printing quality. Currently, the industry standard for solder paste printing thickness Y is: (screen thickness - 0.01) mm ≤ Y ≤ (screen thickness + 0.06) mm. Maintaining the solder paste thickness within this range ensures product printing quality, post-reflow soldering stability, and reliability. Insufficient solder paste thickness (too small) results in inadequate solder volume, leading to issues like cold solder joints, component tilting, and misalignment. Excessive solder paste thickness can cause short circuits and tombstoning.

[0004] Therefore, there is an urgent need for a method to precisely control the thickness of solder paste printing. Summary of the Invention

[0005] This invention provides a printing control method, device, printed circuit board, and printing machine to solve the problem of difficulty in controlling the thickness of solder paste printing in the prior art.

[0006] The present invention provides a printing control method, comprising: obtaining at least one influencing factor of solder paste thickness; determining a target formula based on the mapping relationship between each influencing factor and the solder paste thickness; wherein the target formula includes at least one influencing factor and a weight of each influencing factor.

[0007] According to a printing control method provided by the present invention, the step of determining a target formula based on the mapping relationship between each of the influencing factors and the solder paste thickness includes: determining a value range of at least one of the influencing factors; determining multiple target values ​​within the value range based on the value range; obtaining the solder paste thickness corresponding to each of the multiple target values ​​based on the multiple target values; and determining the target formula based on the multiple target values ​​and the solder paste thickness corresponding to each of the multiple target values.

[0008] According to a printing control method provided by the present invention, after determining multiple target values ​​within the value range based on the value range, the method further includes: arranging and combining multiple target values ​​of multiple influencing factors to determine multiple sets of experimental parameters; obtaining the solder paste thickness corresponding to each set of experimental parameters based on the multiple sets of experimental parameters; and determining the target formula based on the multiple sets of experimental parameters and the solder paste thickness corresponding to each set of experimental data in the multiple sets of experimental parameters.

[0009] According to a printing control method provided by the present invention, the step of obtaining the solder paste thickness corresponding to each of the multiple sets of experimental parameters includes: obtaining a target image of the printed circuit board corresponding to each set of experimental parameters; and obtaining the solder paste thickness based on the target image.

[0010] According to a printing control method provided by the present invention, the influencing factors include one or more of the following: squeegee pressure, printing speed, solder paste viscosity, solder paste particle diameter, and printing gap.

[0011] According to a printing control method provided by the present invention, the solder paste thickness is expressed as: Y = ab·X1 - c·X2 + d·X3 - e·X4 + f·X5; where Y is the solder paste thickness, X1 is the squeegee pressure, X2 is the printing speed, X3 is the solder paste viscosity, X4 is the solder paste particle diameter, and X5 is the printing gap.

[0012] According to a printing control method provided by the present invention, after determining the target formula, the method further includes: determining the control parameters of the printing press based on the target formula.

[0013] The present invention also provides a printing control device, comprising: an acquisition module for acquiring at least one influencing factor of solder paste thickness; and a determination module for determining a target formula based on the mapping relationship between each influencing factor and the solder paste thickness; wherein the target formula includes at least one influencing factor and a weight for each influencing factor.

[0014] The present invention also provides a printed circuit board, comprising: a circuit board body and a solder paste layer printed based on the printing control method described above; the solder paste layer is disposed on the surface of the circuit board body.

[0015] The present invention also provides a printing press, including a controller, the controller being used to control the printing press to implement the printing control method described in any of the above claims.

[0016] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the printing control method as described above.

[0017] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the printing control method as described above.

[0018] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements the printing control method as described above.

[0019] The printing control method, device, printed circuit board, and printing machine provided by this invention can scientifically optimize the settings of the printing machine through a target formula, thereby accurately and effectively controlling the thickness and quality of the printed solder paste layer, saving unnecessary waste of solder paste material, eliminating the impact of the printing station on the next placement station, ensuring the reliability and mechanical strength of reflow soldering, and increasing the service life of the product in various application scenarios. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is one of the schematic flowcharts of the printing control method provided in some embodiments of the present invention;

[0022] Figure 2 This is a fishbone diagram for obtaining influencing factors provided in some embodiments of the present invention;

[0023] Figure 3 This is one of the schematic diagrams provided in some embodiments of the present invention to verify the relationship between influencing factors and solder paste thickness;

[0024] Figure 4 This is the second schematic diagram illustrating the relationship between influencing factors and solder paste thickness, provided in some embodiments of the present invention.

[0025] Figure 5 This is the third schematic diagram illustrating the relationship between influencing factors and solder paste thickness provided in some embodiments of the present invention;

[0026] Figure 6 This is a schematic diagram of the printing control device provided in some embodiments of the present invention;

[0027] Figure 7 These are schematic diagrams of the structure of an electronic device provided in some embodiments of the present invention. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0029] In the description of the embodiments of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0031] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0033] With the rapid development of the electronics industry, solder paste printing is a difficult process and step to control in the development of PCBA. As the packaging density of printed circuit boards increases, and the types and shapes of printed components also increase, improving the quality of solder paste stencil printing has become an important research topic.

[0034] Solder paste printing is a crucial part of the SMT (Surface Mount Technology) field. Factors such as solder paste particle diameter, squeegee speed, squeegee pressure, stencil-PCB fit, and screen aperture size and thickness all affect solder paste printing quality. Currently, the industry standard for solder paste printing thickness Y is: (screen thickness - 0.01) mm ≤ Y ≤ (screen thickness + 0.06) mm. Maintaining the solder paste thickness within this range ensures product printing quality, post-reflow soldering stability, and reliability. Insufficient solder paste thickness (too small) results in inadequate solder volume, leading to issues like cold solder joints, component tilting, and misalignment. Excessive solder paste thickness can cause short circuits and tombstoning.

[0035] Therefore, there is an urgent need for a method to precisely control the thickness of solder paste printing.

[0036] The following is combined with Figures 1-7 The present invention describes a printing control method, apparatus, printed circuit board, and printing press.

[0037] It should be noted that the printing control method of the present invention can be applied to the field of printed circuit boards in printing presses, for example, to control the thickness of the solder paste layer on the printed circuit board of a printing press. It can also be applied to other fields for thickness control, such as the ink thickness during photo printing and the paint thickness on the surface of an instrument in a spraying process.

[0038] Solder paste is a new type of soldering material that emerged with the development of surface mount technology (SMT). It is a paste-like mixture made by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as resistors, capacitors, and ICs on PCB surfaces in the SMT industry.

[0039] With the rapid development of electronic technology, printed circuit boards (PCBs) are widely used in various fields, and almost all electronic devices contain PCBs. Therefore, controlling the thickness of solder paste is crucial.

[0040] like Figure 1 As shown, the printing control method of the present invention includes steps 110 and 120.

[0041] Step 110: Obtain at least one influencing factor of solder paste thickness.

[0042] like Figure 2 The fishbone diagram shown indicates that there are multiple factors affecting solder paste thickness, including the influence of raw materials, printing press, different operating methods, operators, and the internal environment of the work site. The researchers used an elimination method and, based on experience, screened out at least one factor that has a significant impact on solder paste thickness from multiple influencing factors.

[0043] The number of influence factors can be one or more combinations.

[0044] Step 120: Determine the target formula based on the mapping relationship between each influencing factor and solder paste thickness.

[0045] The target formula includes at least one impact factor and the weight of each impact factor.

[0046] In this step, the target formula is determined based on the mapping relationship between each influencing factor and the solder paste thickness corresponding to each influencing factor. The weight of each influencing factor represents the intensity of its influence on the solder paste thickness.

[0047] According to this target formula, the values ​​of unknown influencing factors can be deduced from a given solder paste thickness and certain values ​​of influencing factors. Based on the values ​​of all influencing factors, the printing press can be set, thereby controlling the printing press to accurately print solder paste layers that meet the thickness requirements.

[0048] The printing control method provided by this invention can scientifically optimize the settings of the printing machine through a target formula, thereby accurately and effectively controlling the thickness and quality of the printed solder paste layer, saving unnecessary waste of solder paste material, eliminating the impact of the printing station on the next placement station, ensuring the reliability and mechanical strength of reflow soldering, and increasing the service life of the product in various application scenarios.

[0049] Reflow soldering is a primary board-level interconnect method used in SMT assembly processes. This soldering method combines the required soldering characteristics very well, including ease of processing, broad compatibility with various SMT designs, high soldering reliability, and low cost.

[0050] In some embodiments, such as Figure 2 As shown, the main factors affecting solder paste thickness include one or more of the following: squeegee pressure, printing speed, solder paste viscosity, solder paste particle diameter, and printing gap.

[0051] It should be noted that the influencing factors obtained can be one of the following: squeegee pressure, printing speed, solder paste viscosity, solder paste particle diameter, and printing gap; or a combination of multiple of these factors. This invention uses squeegee pressure, printing speed, solder paste viscosity, solder paste particle diameter, and printing gap as influencing factors to derive the target formula.

[0052] Researchers can use the process of elimination, where factors such as squeegee pressure, printing speed, solder paste viscosity, solder paste particle diameter, and printing gap have a significant impact on printing quality (solder paste thickness), while other factors can be ignored.

[0053] Further, step 120 includes: determining the value range of at least one influencing factor; determining multiple target values ​​within the value range based on the value range; obtaining the solder paste thickness corresponding to each of the multiple target values ​​based on the multiple target values; and determining a target formula based on the multiple target values ​​and the solder paste thickness corresponding to each of the multiple target values.

[0054] In this step, the range of values ​​for one or more influencing factors is determined, and multiple target values ​​are selected within this range, such as... Figure 3 As shown, multiple influencing factors of the printing press are set as target values ​​for each influencing factor. The printing press is controlled to print solder paste on the circuit board. The solder paste thickness corresponding to the target value can be obtained by image processing, measurement and other methods. Based on multiple target values ​​and the solder paste thickness corresponding to each target value, a target formula for the linear correlation between the influencing factors and the solder paste thickness is determined.

[0055] The range of values ​​for the impact factor can be a range set by staff based on the commonly used parameter ranges of the impact factor, or it can be a specifically selected range of values.

[0056] Within a range of values, multiple target values ​​can be selected at regular intervals or randomly.

[0057] The target value is one or more values ​​at the endpoints or within the range of values.

[0058] Multiple target values ​​can be selected according to a certain pattern or randomly.

[0059] Furthermore, after determining multiple target values ​​within the range of values, the process also includes: arranging and combining multiple target values ​​of multiple influencing factors to determine multiple sets of experimental parameters; obtaining the solder paste thickness corresponding to each set of experimental parameters based on the multiple sets of experimental parameters; and determining the target formula based on the multiple sets of experimental parameters and the solder paste thickness corresponding to each set of experimental data in the multiple sets of experimental parameters.

[0060] In some embodiments, the representative target values ​​can be the endpoints of the range of values ​​for each influencing factor.

[0061] An impact factor includes multiple target values. The multiple target values ​​of multiple impact factors can be combined to form multiple sets of experimental parameters.

[0062] Multiple sets of experimental parameters can be controlled in a controlled experiment manner, and the variables of each set of experimental parameters can be controlled to set the printer, control the printer to print the circuit board, and obtain the solder paste thickness on the circuit board.

[0063] According to the experimental parameters for each set, the control parameters of the printing press are set, the printing press is controlled to print, and the solder paste thickness corresponding to each set of experimental parameters is obtained.

[0064] Input multiple sets of experimental parameters and the solder paste thickness corresponding to each set of experimental data into the data processing software to obtain the relationship between multiple influencing factors and solder paste thickness. This relationship is the target formula.

[0065] The data processing software can be commonly used software such as Origin, Excel or SPSS, and this invention does not limit it.

[0066] The printing control method provided by this invention adopts an experimental comparison method, lists the numerical changes of each factor, finds the linear relationship between each influencing factor and solder paste thickness, and summarizes the linear relationship formula, which can provide effective and scientific data support for manufacturing qualified and high-quality PCBs.

[0067] Furthermore, based on multiple sets of experimental parameters, the solder paste thickness corresponding to each set of experimental parameters is obtained, including: obtaining the target image of the printed circuit board corresponding to each set of experimental parameters; and obtaining the solder paste thickness based on the target image.

[0068] The target image is an image of a printed circuit board, which includes the solder paste layer on the surface of the printed circuit board. By processing the target image, the thickness of the solder paste printed on the printed circuit board by the printing press can be obtained.

[0069] In this step, after the printer prints according to each set of control parameters, the image acquisition device acquires a surface image of the printed circuit board, and the image processing device processes the target image to identify the thickness of the solder paste printed on the circuit board.

[0070] In some embodiments, the image acquisition device and the image processing device may be a scanning electron microscope (SEM) or other instruments with image acquisition and image processing functions, and the present invention does not limit them.

[0071] Furthermore, the target formula for solder paste thickness is expressed as:

[0072] Y=ab·X1-c·X2+d·X3-e·X4+f·X5;

[0073] Where Y is the solder paste thickness, X1 is the squeegee pressure, X2 is the printing speed, X3 is the solder paste viscosity, X4 is the solder paste particle diameter, and X5 is the printing gap.

[0074] Where b is the weight of squeegee pressure, c is the weight of printing speed, d is the weight of solder paste viscosity, e is the weight of solder paste particle diameter, f is the weight of printing gap, and a is a relationship constant.

[0075] Substitute multiple sets of experimental parameters and the solder paste thickness corresponding to each set of experimental parameters into the target formula representing solder paste thickness, and calculate the weight parameter and relationship constant corresponding to each influencing factor, thereby obtaining the target formula for influencing factors and solder paste thickness.

[0076] Furthermore, after determining the target formula, the printing control method provided by the present invention also includes: determining the control parameters of the printing press circuit board based on the target formula.

[0077] The control parameters of the printing press are the settings of various parameters before the printing press prints the circuit board. The control parameters mainly include one or more of the following: squeegee pressure, printing speed, solder paste viscosity, solder paste particle diameter, and printing gap.

[0078] After setting parameters such as squeegee pressure, printing speed, solder paste viscosity, solder paste particle diameter, and printing gap, the printing machine prints solder paste onto the printed circuit board.

[0079] The printing control method provided by the present invention will be described below with a specific embodiment.

[0080] 1. Select multiple factors that affect printing quality (solder paste thickness). The value range of each factor is shown in Table 1.

[0081] Table 1: Range of Influence Factor Values

[0082]

[0083] 2. Select multiple representative target values ​​within the range of each influencing factor, and arrange and combine these target values ​​to form the experimental parameter table shown in Table 2.

[0084] Through the above verification design, and by designing and customizing various types of solder paste with different particle diameters and viscosities, the various parameters of the printer corresponding to the design range, such as squeegee pressure, printing speed, and printing gap, were set in various combinations. This experiment used a 0.12mm thick stencil, that is, the printing thickness Y ranged from 110μm≤Y≤180μm. The above data were arranged and combined to obtain 20 combinations as shown in Table 2.

[0085] Table 2: Experimental Parameter Table

[0086]

[0087]

[0088] 3. In each PCB printing process, a single variable was controlled and verified one by one to obtain the solder paste thickness corresponding to each set of experimental parameters. The experimental data of the 20 sets in Table 2 were sorted out to form the experimental results table as shown in Table 3.

[0089] Table 3: Experimental Results

[0090]

[0091]

[0092] 4. After verification and analysis of the 20 sets of experimental data shown in Table 3, the statistical data are as follows: Figure 4 and Figure 5 As shown.

[0093] 5. Based on the analysis of experimental data and graph trends, a linear relationship is found between solder paste thickness and various influencing factors. Therefore, the target formula for solder paste thickness and multiple influencing factors is:

[0094] Y=10.21-0.152·X1-0.003·X2+0.894·X3-1.176·X4+0.0047·X5;

[0095] Where Y is the solder paste thickness, X1 is the squeegee pressure, X2 is the printing speed, X3 is the solder paste viscosity, X4 is the solder paste particle diameter, and X5 is the printing gap.

[0096] Among them, the values ​​of squeegee pressure X1, printing speed X2, solder paste viscosity X3, solder paste particle diameter X4, and printing gap X5 are within the range of Table 1, and the values ​​of solder paste thickness Y are within the range of 110μm≤Y≤180μm.

[0097] When producing a product, given the solder paste viscosity X3 and solder paste particle diameter X4, the squeegee pressure X1, printing speed X2, and printing gap X5 can be set reasonably and scientifically to effectively obtain the best solder paste thickness quality, i.e., 110μm≤printing thickness Y≤180μm.

[0098] 6. Practical application verification of the quality relationship formula for solder paste thickness:

[0099] Product manufactured: Digital information motherboard A of a certain enterprise;

[0100] X3 solder paste viscosity: 190 Pa / s;

[0101] X4 solder paste particle diameter: 25μm;

[0102] Set the relevant parameters:

[0103] X1 scraper pressure: 12kg;

[0104] X2 printing speed: 55mm / s;

[0105] X5 printing gap: 200μm;

[0106] The printing thickness is: Y = 10.21 - 0.152*12 - 0.003*55 + 0.894*190 - 1.176*25 + 0.0047*200 = 149.62;

[0107] Furthermore, 110μm≤149.62μm≤180μm indicates that the solder paste thickness is of acceptable quality, and the relationship holds true.

[0108] The printing control method provided by this invention uses multiple sets of data and data verification methods to list factors that may affect the thickness of the solder paste layer, screen out key influencing factors, redefine the application process of solder paste, understand its impact on the physical properties of the product, and summarize a new target formula through experimental comparison and data analysis. This allows for the scientific and efficient setting of printing machine parameters, thereby accurately and effectively controlling the thickness and quality of the printed solder paste layer, saving unnecessary waste of solder paste material, eliminating the impact of the printing station on the next placement station, enhancing the reliability and mechanical strength of soldering, and increasing the service life of the product in various application scenarios.

[0109] like Figure 6 As shown, the present invention also provides a printing control device, including: an acquisition module 610 and a determination module 620.

[0110] The acquisition module 610 is used to acquire at least one influencing factor of solder paste thickness.

[0111] Module 620 is used to determine the target formula based on the mapping relationship between each influencing factor and solder paste thickness.

[0112] The target formula includes at least one impact factor and the weight of each impact factor.

[0113] The printing control device provided by this invention uses multiple sets of data and data verification methods to list factors that may affect the thickness of the solder paste layer, screen out key influencing factors, redefine the application process of solder paste, understand its impact on the physical properties of the product, and summarize a new target formula through experimental comparison and data analysis. This allows for the scientific and efficient setting of printing machine parameters, thereby accurately and effectively controlling the thickness and quality of the printed solder paste layer, saving unnecessary waste of solder paste material, eliminating the impact of the printing station on the next placement station, enhancing the reliability and mechanical strength of the soldering, and increasing the service life of the product in various application scenarios.

[0114] The present invention also provides a printed circuit board, comprising: a circuit board body and a solder paste layer printed based on the printing control method described above; the solder paste layer is disposed on the surface of the circuit board body.

[0115] The surface of the circuit board body is coated with solder paste using a printing press.

[0116] The thickness of the solder paste layer is the product of the number of solder paste particles in the vertical direction of a single pad (connection point) and the diameter of the solder paste particles.

[0117] The printed circuit board provided by this invention uses multiple sets of data and data verification methods to list the factors that may affect the thickness of the solder paste layer, screen out the key influencing factors, redefine the application process of solder paste, understand its impact on the physical properties of the product, and summarize a new target formula through experimental comparison and data analysis. This allows for the scientific and efficient setting of printing machine parameters, thereby accurately and effectively controlling the thickness and quality of the printed solder paste layer, saving unnecessary waste of solder paste material, eliminating the impact of the printing station on the next placement station, enhancing the reliability and mechanical strength of the soldering, and increasing the service life of the product in various application scenarios.

[0118] The present invention also provides a printing press, including a controller, which is used to control the printing press to implement the printing control method described above.

[0119] The printing machine provided by this invention uses multiple sets of data and data verification methods to list the factors that may affect the thickness of the solder paste layer, screen out the key influencing factors, redefine the application process of solder paste, understand its impact on the physical properties of the product, and summarize a new target formula through experimental comparison and data analysis. This allows for the scientific and efficient setting of printing machine parameters, thereby accurately and effectively controlling the thickness and quality of the printed solder paste layer, saving unnecessary waste of solder paste material, eliminating the impact of the printing station on the next placement station, enhancing the reliability and mechanical strength of the soldering, and increasing the service life of the product in various application scenarios.

[0120] Figure 7 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 7 As shown, the electronic device may include a processor 710, a communications interface 720, a memory 730, and a communication bus 740, wherein the processor 710, communications interface 720, and memory 730 communicate with each other via the communication bus 740. The processor 710 can call logic instructions in the memory 730 to execute a printing control method, which includes: obtaining at least one influencing factor of solder paste thickness; determining a target formula based on the mapping relationship between each influencing factor and solder paste thickness; wherein the target formula includes at least one influencing factor and a weight for each influencing factor.

[0121] Furthermore, the logical instructions in the aforementioned memory 730 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0122] On the other hand, the present invention also provides a computer program product, which includes a computer program that can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer is able to execute the printing control method provided by the above methods. The method includes: obtaining at least one influencing factor of solder paste thickness; determining a target formula based on the mapping relationship between each influencing factor and solder paste thickness; wherein the target formula includes at least one influencing factor and a weight of each influencing factor.

[0123] In another aspect, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the printing control method provided by the methods described above, the method comprising: obtaining at least one influencing factor of solder paste thickness; determining a target formula based on the mapping relationship between each influencing factor and solder paste thickness; wherein the target formula includes at least one influencing factor and a weight of each influencing factor.

[0124] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0125] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods of various embodiments or some parts of embodiments.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A printing control method, characterized in that, include: Obtain at least one factor influencing solder paste thickness; Based on the mapping relationship between each of the influencing factors and the solder paste thickness, the target formula is determined; The target formula includes at least one of the impact factors and the weight of each of the impact factors; The determination of the target formula based on the mapping relationship between each of the influencing factors and the solder paste thickness includes: Determine the value range of at least one of the influencing factors; Based on the value range, multiple target values ​​within the value range are determined; The plurality of target values ​​are selected at intervals or randomly within the range of values; based on the plurality of target values, the solder paste thickness corresponding to each of the plurality of target values ​​is obtained; The target formula is determined based on a plurality of target values ​​and the solder paste thickness corresponding to each of the plurality of target values; After determining multiple target values ​​within the value range based on the value range, the method further includes: Multiple sets of experimental parameters are determined by arranging and combining multiple target values ​​of multiple influencing factors. Based on the multiple sets of experimental parameters, the solder paste thickness corresponding to each set of experimental parameters is obtained. The target formula is determined based on the multiple sets of experimental parameters and the solder paste thickness corresponding to each set of experimental data in the multiple sets of experimental parameters. The step of obtaining the solder paste thickness corresponding to each set of experimental parameters based on multiple sets of experimental parameters includes: Obtain the target image of the printed circuit board corresponding to each set of experimental parameters; The solder paste thickness is obtained based on the target image.

2. The printing control method according to claim 1, characterized in that, The influencing factors include one or more of the following: squeegee pressure, printing speed, solder paste viscosity, solder paste particle diameter, and printing gap.

3. The printing control method according to claim 2, characterized in that, The thickness of the solder paste is expressed as follows: Y=ab·X1-c·X2+d·X3-e·X4+f·X5; Where Y is the solder paste thickness, X1 is the squeegee pressure, X2 is the printing speed, X3 is the solder paste viscosity, X4 is the solder paste particle diameter, and X5 is the printing gap.

4. The printing control method according to claim 1, characterized in that, After determining the target formula, the method further includes: Based on the target formula, the control parameters of the printing press are determined.

5. A printing control device, characterized in that, include: The acquisition module is used to acquire at least one influencing factor of solder paste thickness; The determination module is used to determine the target formula based on the mapping relationship between each of the influencing factors and the solder paste thickness; The target formula includes at least one of the impact factors and the weight of each of the impact factors; The determination of the target formula based on the mapping relationship between each of the influencing factors and the solder paste thickness includes: Determine the value range of at least one of the influencing factors; Based on the value range, multiple target values ​​within the value range are determined; The multiple target values ​​are selected at intervals or randomly within the range of values; Based on the multiple target values, obtain the solder paste thickness corresponding to each target value among the multiple target values; The target formula is determined based on a plurality of target values ​​and the solder paste thickness corresponding to each of the plurality of target values; After determining multiple target values ​​within the value range based on the value range, the method further includes: Multiple sets of experimental parameters are determined by arranging and combining multiple target values ​​of multiple influencing factors. Based on the multiple sets of experimental parameters, the solder paste thickness corresponding to each set of experimental parameters is obtained. The target formula is determined based on the multiple sets of experimental parameters and the solder paste thickness corresponding to each set of experimental data in the multiple sets of experimental parameters. The step of obtaining the solder paste thickness corresponding to each set of experimental parameters based on multiple sets of experimental parameters includes: Obtain the target image of the printed circuit board corresponding to each set of experimental parameters; The solder paste thickness is obtained based on the target image.

6. A printed circuit board, characterized in that, include: The circuit board body and the solder paste layer printed based on the printing control method according to any one of claims 1 to 4; The solder paste layer is disposed on the surface of the circuit board body.

7. A printing press, characterized in that, Includes a controller for controlling the printing press to implement the printing control method as described in any one of claims 1 to 4.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the printing control method as described in any one of claims 1 to 4.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the printing control method as described in any one of claims 1 to 4.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the printing control method as described in any one of claims 1 to 4.

Images